CN106981429A - A kind of process for suppressing green deformation in ceramic multilayer circuit process - Google Patents
A kind of process for suppressing green deformation in ceramic multilayer circuit process Download PDFInfo
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- CN106981429A CN106981429A CN201710229300.0A CN201710229300A CN106981429A CN 106981429 A CN106981429 A CN 106981429A CN 201710229300 A CN201710229300 A CN 201710229300A CN 106981429 A CN106981429 A CN 106981429A
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- green
- multilayer circuit
- ceramic multilayer
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/48—Manufacture or treatment of parts, e.g. containers, prior to assembly of the devices, using processes not provided for in a single one of the groups H01L21/18 - H01L21/326 or H10D48/04 - H10D48/07
- H01L21/4803—Insulating or insulated parts, e.g. mountings, containers, diamond heatsinks
- H01L21/4807—Ceramic parts
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- Condensed Matter Physics & Semiconductors (AREA)
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Abstract
The invention discloses a kind of process for suppressing green deformation in ceramic multilayer circuit process, including step：Demoulding, aging are carried out to green first, then to the secondary pad pasting of green after aging, is then processed using conventional punching, filling perforation, printing, demoulding, lamination, laminate layer, sintering, burst, the ceramic multilayer circuit technique of test/inspection.This method carries out demoulding, aging to green, eliminate the residual stress of curtain coating, allow green deformation in place, again to carrying out following process after the secondary pad pasting of green after aging, green deformation ratio is reduced to less than 0.03% from traditional more than 0.06%, the problem of ceramic multilayer circuit interlayer stack aligning accuracy is poor is effectively solved, and it is simple to operate compared with art methods, manufacturing cost is low.
Description
Technical field
The invention belongs to ceramic circuit manufacture field, and in particular to one kind suppresses life in ceramic multilayer circuit process
The process of porcelain deformation.
Background technology
The conventional fabrication process of multilayer co-firing ceramic circuit board is：1) according to design configuration, respectively on each layer green
Make conductor fig, conductor through hole, cavity etc., 2) green of conductor fig, conductor through hole and cavity will be made in sequence
Lamination, is then compressed into the green block of densification, 3 by heating the method for pressurization) the green block suppressed is sintered,
Green is realized common burning with conductor, ultimately form multilayer co-firing ceramic circuit board.Because green is made by curtain coating mostly,
Therefore have residual stress between green and film strips (Mylar films) to its supporting role, undergo punching, filling perforation, printing,
Often occur larger deformation after the processes such as demoulding (sloughing Mylar films), and this deformation have region random distribution and
The characteristics of each layer of deflection differs, causes the lamination aligning accuracy of interlayer to be deteriorated, and the radio-frequency performance particularly with element/substrate is produced
Raw adverse effect, properties of product deviate, and yield rate is low.
The method used in the prior art is that each layer green is bonded on a metal hard frame, passes through fixed side
Formula limits the deformation of green, but this method needs to configure a metal edge frame to each green, result in technical process
Region needed for the great burden that semi-finished product are shifted and stored, and stickup frame also reduces the effective rate of utilization of green, causes
Production efficiency reduction, cost rise.
The content of the invention
The problem of existing for prior art, it is an object of the invention to provide one kind in ceramic multilayer circuit process
The middle method for suppressing green deformation, this method, also will not be to other process procedures without extra frock clamp or process equipment
Influence is produced, green deformation rate can be significantly reduced, the interlayer alignment precision of ceramic multilayer circuit substrate, and operation letter is improved
It is single.
The above-mentioned purpose of the present invention is achieved through the following technical solutions：
A kind of process for suppressing green deformation in ceramic multilayer circuit process, comprises the following steps：First
Demoulding, aging are carried out to green, then to the secondary pad pasting of green after aging, then using conventional punching, filling perforation, printing, de-
Film, lamination, laminate layer, sintering, burst, the ceramic multilayer circuit technique of test/inspection are processed.
Green and carry between Mylar films and there is curtain coating residual stress, green in conventional repeatedly ceramic circuit process
Deformed upon after demoulding, and each layer deformation quantity and deformation region differ, and cause interlayer alignment precision during lamination to be deteriorated, significantly
Influence the quality of finished product.The present inventor it has been investigated that, first the film that carries of green is torn, then to the life without film
Porcelain carries out aging, so as to eliminate the residual stress of curtain coating, allows green deformation in place, then following process is carried out after secondary pad pasting can be with
The problem is solved well, effectively can be reduced to green deformation ratio from more than 0.06% using the process of the present invention
Less than 0.03%, effect is suitable with the method for configuring metal hard frame, and operation is extremely simple, more cost-effective.
Aging of the present invention is that 20~40min is dried at a temperature of 40~80 DEG C, or is put naturally in dry environment
Put more than 8h.
Secondary pad pasting of the present invention, which refers to the green after aging pasting last layer again to have for one side, low-viscosity to be had
Machine diaphragm, so that green obtains the support of subsequent technique process.It is described secondary according to the specific embodiment of the present invention
Organic diaphragm thickness of pad pasting is 30 μm~100 μm, and one side applied thickness is 0.5 μm~3 μm of low viscous coating.
According to the specific embodiment of the present invention, the low viscous coating Main Ingredients and Appearance includes 60%~79% bonding
Agent, 20%~39% plasticizer, 1%~5% mould release.
The bonding agent is in polyvinyl alcohol, polyvinyl butyral resin, hydroxymethyl cellulose, sodium hydroxyethyl cellulose
One or more, one kind in dibutyl phthalate, dioctyl phthalate, polyethylene glycol of the plasticizer or
Several, the mould release is silicone oil or its derived product.
Secondary pad pasting has good dimensional stability, and the green of aging can be prevented to be again deformed in process.Institute
Stickup needs can be met by stating low viscous coating, and is not reacted with organic additive intrinsic in green and (prevented from changing green
Laminating properties), sticky overlay noresidue (sintering characteristic for preventing from changing green) on green after demoulding again.
Using conventional punching, filling perforation, printing, demoulding, lamination, laminate layer, sintering, burst, test/inspection after secondary pad pasting
Ceramic multilayer circuit technique be processed, the flow be conventional method well known to those skilled in the art.
Beneficial effect：The present invention suppress green deformation process, only by increase demoulding, aging, secondary pad pasting this
A little operating procedures simple and easy to apply, without changing other link techniques, it becomes possible to which green deformation ratio is reduced into less than 0.03%,
And green directly processes caused deformation ratio at least more than 0.06%, so that interlayer alignment essence higher when ensure that lamination
Degree.Through comparing, method phase of the effect that method of the invention is realized substantially with configuring a metal edge frame to each green
When, still, reduce the latter's semi-finished product transfer and storage workload, it is to avoid paste frame region cause reduce green it is effective
Utilization rate, and whole-course automation production is more beneficial for, production efficiency is improved, cost is reduced.
Brief description of the drawings
Fig. 1 is the step of the inventive method carries out demoulding to green；
Fig. 2 is the step of the inventive method carries out aging to green；
Fig. 3 is that the inventive method carries out secondary step of membrane sticking to the green of aging；
Fig. 4 is that the inventive method carries out the design sketch after secondary pad pasting to the green of aging；
1- green bodies, 2- greens carry film, the green of 3- agings, bis- pad pastings of 4-.
Embodiment
It is only the present invention preferably embodiment below, the scope that this should not be interpreted as to above-mentioned theme of the invention is only limited
In following example.All technologies realized based on the above of the present invention belong to the scope of protection of the invention.
Embodiment 1
Below to suppress the method and step that green is deformed in ceramic multilayer circuit process, reference can be made to Fig. 1-4：
1) green is cut into after standard technology size, and green is carried into Mylar films 2 tears from green 1, as shown in Figure 1.
2) green 1 without film is dried at a temperature of 60 DEG C, drying time is 30min, obtains deformation in place
Green 3, as shown in Figure 2.
3) organic diaphragm 4 that one side is scribbled into 1 μm of low viscous coating is attached on the green 3 of deformation in place, as shown in Figure 3.
The thickness of organic diaphragm 4 is 50 μm.
4) green after secondary pad pasting is as shown in figure 4, green 3 and organic film 4 are preferably fitted, in multilayer co-firing ceramic electrical
In the technique processing on road green can be made to keep low deflection.
5) made pottery using the multilayer of conventional punching, filling perforation, printing, demoulding, lamination, laminate layer, sintering, burst, test/inspection
Porcelain circuit technology completes processing.
The low viscous coating of above-mentioned organic diaphragm, its composition includes 76% polyvinyl butyral resin, 23% phthalic acid
Dioctyl ester, 1% silicone oil.
Embodiment 2
Below to suppress the method and step that green is deformed in ceramic multilayer circuit process, reference can be made to Fig. 1-4：
1) green is cut into after standard technology size, and green is carried into Mylar films 2 tears from green 1, as shown in Figure 1.
2) place 8h naturally in 100,000 grades of environment purifications to the green 1 without film, obtain the green 3 of deformation in place, such as
Shown in Fig. 2.
3) organic diaphragm 4 that one side is scribbled into 2.5 μm of low viscous coatings is attached on the green 3 of deformation in place, such as Fig. 3 institutes
Show.The thickness of organic diaphragm 4 is 75 μm.
4) green after secondary pad pasting is as shown in figure 4, green 3 and organic film 4 are preferably fitted, in multilayer co-firing ceramic electrical
In the technique processing on road green can be made to keep low deflection.
5) made pottery using the multilayer of conventional punching, filling perforation, printing, demoulding, lamination, laminate layer, sintering, burst, test/inspection
Porcelain circuit technology completes processing.
The low viscous coating of above-mentioned organic diaphragm, its composition includes 62% polyvinyl butyral resin, 37% phthalic acid
Dioctyl ester, 1% silicone oil.
Conventional method is will to be covered with the green for carrying Mylar films directly using conventional punching, filling perforation, printing, demoulding, folded
Layer, laminate layer, sintering, burst, the ceramic multilayer circuit technique of test/inspection complete processing.
Researcher of the present invention, can be by green deformation ratio by traditional using the method for the present invention through a large amount of statistics discoveries
More than 0.06% is reduced to less than 0.03%, and effect is notable, and simple to operate.
Claims (7)
1. a kind of process for suppressing green deformation in ceramic multilayer circuit process, it is characterised in that including following
Step：Demoulding, aging are carried out to green first, then to the secondary pad pasting of green after aging, then uses conventional punching, fill out
Hole, printing, demoulding, lamination, laminate layer, sintering, burst, the ceramic multilayer circuit technique of test/inspection are processed.
2. the process according to claim 1 for suppressing green deformation in ceramic multilayer circuit process, it is special
Levy and be, the aging is that 20~40min is dried at 40~80 DEG C, or places in dry environment more than 8h naturally.
3. the process according to claim 1 for suppressing green deformation in ceramic multilayer circuit process, it is special
Levy and be, the secondary pad pasting is that one side has low-viscosity organic diaphragm.
4. the process according to claim 3 for suppressing green deformation in ceramic multilayer circuit process, it is special
Levy and be, organic diaphragm thickness of the secondary pad pasting is 30 μm~100 μm, one side applied thickness is the low viscous of 0.5um~3um
Property coating.
5. the process according to claim 4 for suppressing green deformation in ceramic multilayer circuit process, it is special
Levy and be, the low viscous coating Main Ingredients and Appearance include 60%~79% bonding agent, 20%~39% plasticizer, 1%~5% from
Type agent.
6. the process according to claim 5 for suppressing green deformation in ceramic multilayer circuit process, it is special
Levy and be, the bonding agent is in polyvinyl alcohol, polyvinyl butyral resin, hydroxymethyl cellulose, sodium hydroxyethyl cellulose
One or more, one kind in dibutyl phthalate, dioctyl phthalate, polyethylene glycol of the plasticizer or
Several, the mould release is silicone oil or its derived product.
7. the process according to claim 6 for suppressing green deformation in ceramic multilayer circuit process, it is special
Levy and be, the secondary pad pasting carries out the stickup of green and organic diaphragm after aging by low viscous coating, viscous coating not with
Intrinsic organic additive reacts in green, and low viscous coating noresidue on green after demoulding again.
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| CN201710229300.0A CN106981429B (en) | 2017-04-10 | 2017-04-10 | A kind of process inhibiting green deformation in ceramic multilayer circuit process |
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Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109005608A (en) * | 2018-06-28 | 2018-12-14 | 珠海华宇宏瑞科技有限公司 | A kind of processing method of hollow out ceramic heating element |
| CN111116234A (en) * | 2019-12-31 | 2020-05-08 | 中电国基南方集团有限公司 | Side printing method of high-temperature co-fired ceramic green ceramic frame |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101483417A (en) * | 2009-01-16 | 2009-07-15 | 华中科技大学 | Preparation of black alumina substrate for multilayered wiring |
| CN104135830A (en) * | 2014-08-08 | 2014-11-05 | 中国电子科技集团公司第二十九研究所 | Method and device for filling raw ceramic through holes with metal paste |
-
2017
- 2017-04-10 CN CN201710229300.0A patent/CN106981429B/en active Active
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101483417A (en) * | 2009-01-16 | 2009-07-15 | 华中科技大学 | Preparation of black alumina substrate for multilayered wiring |
| CN104135830A (en) * | 2014-08-08 | 2014-11-05 | 中国电子科技集团公司第二十九研究所 | Method and device for filling raw ceramic through holes with metal paste |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109005608A (en) * | 2018-06-28 | 2018-12-14 | 珠海华宇宏瑞科技有限公司 | A kind of processing method of hollow out ceramic heating element |
| CN111116234A (en) * | 2019-12-31 | 2020-05-08 | 中电国基南方集团有限公司 | Side printing method of high-temperature co-fired ceramic green ceramic frame |
| CN111116234B (en) * | 2019-12-31 | 2021-10-26 | 中电国基南方集团有限公司 | Side printing method of high-temperature co-fired ceramic green ceramic frame |
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