CN106954108A - A kind of microphone and electronic equipment - Google Patents

Abstract

The present invention provides a kind of microphone and electronic equipment, the microphone blocks component including printed circuit board (PCB) and at least one, described at least one, which blocks component, includes retractable member and sliding block, the printed circuit board (PCB) is provided with pickup hole and cavity, the cavity is connected with the pickup hole, the retractable member and the sliding block are respectively positioned on the cavity, and when the temperature of the retractable member is more than first threshold, the retractable member promotes the sliding block to block the pickup hole.The microphone provided by the present invention, the embodiment of the present invention promotes sliding block to block pickup hole, so as to effectively prevent that the foreign matters such as scolding tin, scaling powder from entering microphone in microphone welding process by retractable member.

Description

A kind of microphone and electronic equipment

technical field

The invention relates to the technical field of communication, in particular to a microphone and electronic equipment.

Background technique

Because foreign objects such as dust and liquid enter the microphone, it is easy to cause the microphone to fail, so protection is required during the manufacturing process of the microphone. Specifically, during the welding process of the microphone, some volatile foreign matter such as welding slag and flux generated during welding can easily enter the sound pickup hole of the microphone, thus affecting the performance of the microphone.

In the prior art, no effective solution has been proposed for the problem that foreign matter generated during the welding process of the microphone easily enters the microphone.

Contents of the invention

Embodiments of the present invention provide a microphone and electronic equipment to solve the problem that foreign matter generated during the welding process of the microphone easily enters the microphone.

In a first aspect, an embodiment of the present invention provides a microphone, the microphone includes a printed circuit board and at least one shielding assembly, the at least one shielding assembly includes a retractable component and a slider, and the printed circuit board is provided with a sound pickup hole and a cavity, the cavity communicates with the sound pickup hole, both the telescopic component and the slider are located in the cavity, and when the temperature of the telescopic component is greater than a first threshold, the telescopic component The telescopic component pushes the slider to cover the sound pickup hole.

In a second aspect, an embodiment of the present invention further provides an electronic device, where the electronic device includes the above-mentioned microphone.

In this way, in the embodiment of the present invention, the microphone includes a printed circuit board and at least one shielding assembly, the at least one shielding assembly includes a retractable part and a slider, the printed circuit board is provided with a sound pickup hole and a cavity, and the cavity The cavity communicates with the sound pickup hole, both the telescopic component and the slider are located in the cavity, and when the temperature of the telescopic component is greater than a first threshold, the telescopic component pushes the slider Cover the pickup hole. Due to the high temperature during the microphone welding process, the temperature of the retractable part is correspondingly high, and the retractable part pushes the slider to cover the sound pickup hole, thereby effectively preventing foreign matters such as solder and flux from entering the microphone.

Description of drawings

In order to more clearly illustrate the technical solutions of the embodiments of the present invention, the following will briefly introduce the accompanying drawings that need to be used in the description of the embodiments of the present invention. Obviously, the accompanying drawings in the following description are only some embodiments of the present invention. For those skilled in the art, other drawings can also be obtained based on these drawings without any creative effort.

FIG. 1 is a cross-sectional view of a microphone provided by an embodiment of the present invention;

Fig. 2 is a sectional view of a microphone provided by another embodiment of the present invention;

Fig. 3 is a sectional view of a microphone provided by another embodiment of the present invention;

Fig. 4 is a sectional view of a microphone provided by another embodiment of the present invention;

Fig. 5 is a schematic diagram of a slider provided by an embodiment of the present invention;

Fig. 6 is a schematic diagram of a slider provided by another embodiment of the present invention;

Fig. 7 is a schematic diagram of an electronic device provided by an embodiment of the present invention.

detailed description

The following will clearly and completely describe the technical solutions in the embodiments of the present invention with reference to the accompanying drawings in the embodiments of the present invention. Obviously, the described embodiments are some of the embodiments of the present invention, but not all of them. Based on the embodiments of the present invention, all other embodiments obtained by persons of ordinary skill in the art without creative efforts fall within the protection scope of the present invention.

An embodiment of the present invention provides a microphone. Fig. 1 is a cross-sectional view of a microphone provided by an embodiment of the present invention. As shown in Fig. 1, the microphone includes a printed circuit board 1 and at least one shielding assembly 2, and the at least one shielding assembly 2 includes a retractable part 21 and a slider 22, The printed circuit board 1 is provided with a sound pickup hole 3 and a cavity 4, the cavity 4 communicates with the sound pickup hole 3, and the telescopic component 21 and the slider 22 are located in the cavity 4 , when the temperature of the stretchable component is greater than a first threshold, the stretchable component 21 pushes the slider 22 to block the sound pickup hole 3 .

In this embodiment, the stretchable component 21 can be any one that can push the slider 22 to block the sound pickup hole 3 when the temperature of the stretchable component is greater than the first threshold, and pull the slider when the temperature of the stretchable component is lower than the second threshold 22 Parts away from pickup hole 3. Specifically, one end of the telescopic component 21 may be fixedly connected to the inner wall of the cavity 4 , and the other end may be fixedly connected to the slider 22 .

Specifically, referring to Fig. 2, due to the high temperature in the microphone welding process, the temperature of the telescopic part 21 can be greater than the first threshold, and the telescopic part 21 stretches and pushes the slider 22 to move along the direction of the sound pickup hole 3 until Covering the sound pickup hole 3 can effectively prevent foreign matters such as solder and flux from entering the sound pickup hole 3 during the welding process. After the microphone is welded, the temperature decreases, and the temperature of the telescopic part 21 also decreases accordingly, so that the telescopic part 21 shrinks and pulls the slider 22 to move in a direction away from the sound pickup hole 3, and returns to the cavity 4, so that the external sound waves The microphone can be accessed through the pickup hole 3.

Optionally, the telescopic part 21 is a two-way memory alloy, one end of the two-way memory alloy is fixedly connected to the inner wall of the cavity 4, and the other end of the two-way memory alloy is connected to the slider 22 Fixed connection.

Specifically, the two-way memory alloy can restore the high-temperature phase shape when heated, and can restore the low-temperature phase shape when cooled. For example, the initial shape of the two-way memory alloy is a linear semi-arc, which becomes a semi-arc after low-temperature deformation. Once the two-way memory alloy is heated, the two-way memory alloy returns to the linear shape, and the two-way memory alloy is cold Then it returns to a semi-curved shape.

In this embodiment, the length of the two-way memory alloy in the low-temperature phase shape is shorter than that in the high-temperature phase shape, and the specific shape of the two-way memory alloy is not limited. Specifically, in this embodiment, one end of the two-way memory alloy is fixedly connected to the inner wall of the cavity 4, and the other end of the two-way memory alloy is fixedly connected to the slider 22, so that during the heating process of the microphone, the temperature rises, and the two-way The memory alloy restores the shape of the high-temperature phase, and pushes the slider 22 to move along the direction of the sound pickup hole 3 until it covers the sound pickup hole 3, thereby effectively preventing foreign matters such as solder and flux from entering the sound pickup hole 3 during the welding process. After the microphone is welded, the temperature drops, and the two-way memory alloy returns to the low-temperature phase shape, and the slider 22 is pulled to move away from the sound pickup hole 3 and returns to the cavity 4, so that external sound waves can enter the microphone through the sound pickup hole 3 .

It should be noted that in this embodiment, an appropriate material of the two-way memory alloy can be selected according to the actual situation, and the length of the two-way memory alloy in the low-temperature phase shape, the length in the high-temperature phase shape, and the length of the slider can be reasonably set. , so that the two-way memory alloy can push the slider to cover the sound pickup hole during the microphone welding process.

Optionally, the printed circuit board 1 includes at least three layers, and the cavity 4 is disposed in a middle layer of the printed circuit board 1 .

In this embodiment, the middle layer of the printed circuit board can be any circuit layer except the bottom layer and the top layer. For example, referring to FIG. 1 , the printed circuit board 1 includes three layers, and the cavity 4 is arranged in the middle layer. When the printed circuit board 1 includes more than three layers, the cavity 4 can be provided in any layer or adjacent layers except the bottom layer and the top layer. Since the multi-layer printed circuit board is made of laminated multi-layer circuit boards, it is relatively simple to implement by directly setting the cavity 4 in the middle layer.

Optionally, the length of the slider 22 is greater than the diameter of the sound pickup hole 3 .

In this embodiment, since the length of the slider 22 is greater than the diameter of the sound pickup hole 3, the slider 22 can completely cover the sound pickup hole 3 during the microphone welding process, thereby improving the sealing effect on the sound pickup hole.

Optionally, the cavity 4 includes a first cavity 41 and a second cavity 42, the telescopic component 21 and the slider 22 are located in the first cavity 41, and the telescopic component 21 When the temperature is greater than the first threshold, the stretchable member 21 pushes the slider 22, so that a part of the slider 22 is located in the first cavity 41, and a part of the slider 22 is located in the second cavity. In the cavity 42 , a part of the slider 22 is located in the sound pickup hole 3 .

In this embodiment, when the temperature of the stretchable component 21 is greater than the first threshold, a part of the slider 22 is located in the first cavity 41, a part of the slider 22 is located in the second cavity 42, and a part of the slider 22 is located in the second cavity 42. In the sound pickup hole 3 , the inner walls of the first cavity 41 and the second cavity 42 jointly support the slider 22 , which can improve the stability of the slider 22 . In addition, since the slider 22 straddles the sound pickup hole 3 , it can completely cover the sound pickup hole 3 , improving the sealing effect on the sound pickup hole 3 .

Optionally, referring to FIG. 1, the microphone further includes a cover body 5 and an audio processing chip 6, the cover body 5 and the audio processing chip 6 are fixed on the printed circuit board 1, and the audio processing chip 6 Located in the cover body 5.

In this embodiment, the cover 5 may be a metal cover, which is electrically connected to the printed circuit board 1 . The audio processing chip 6 may be a MEMS (Micro-Electro-Mechanical System, Micro-Electro-Mechanical System) chip, and is disposed in the housing 5 . In this embodiment, the cover body 5 can protect and shield the interior of the microphone.

Referring to FIG. 3 , FIG. 3 is a cross-sectional view of a microphone provided according to another embodiment of the present invention.

As shown in Fig. 3, the microphone includes a printed circuit board 1 and at least one shielding assembly 2, the printed circuit board 1 is provided with a sound pickup hole 3 and a cavity 4, and the cavity 4 includes a first cavity 41 and a second cavity 42. The at least one shade assembly 2 includes a first shade assembly 2a and a second shade assembly 2b, the first shade assembly 2a includes a first retractable component 21a and a first slider 22a, and the second shade assembly 2b Including the second telescopic part 21b and the second slider 22b, the first telescopic part 21a and the first slider 22a are located in the first cavity 41, the second telescopic part 21b and the The second slider 22b is located in the second cavity 42, and when the temperature of the first telescopic part 21a and the second telescopic part 22a is greater than a first threshold, the first telescopic part 21a pushes the The first slider 22a is located in the sound pickup hole 3, the second telescopic member 21b pushes the second slider 22b to be located in the sound pickup hole 3, and the first slider 22a is connected to the sound pickup hole 3. The second slider 22b cooperates to cover the sound pickup hole 3 .

Optionally, both the telescopic part 21a and the telescopic part 21b may be two-way memory alloys.

In this embodiment, referring to Fig. 4, the temperature during the microphone welding process is relatively high, and the temperature of the telescopic part 21a and the telescopic part 21b is correspondingly high, and the telescopic part 21a stretches and pushes the slider 22a along the sound pickup hole 3. direction, the telescopic part 21b stretches and pushes the slider 22b to move along the direction of the sound pickup hole 3, and the slider 22a and the slider 22b cooperate to block the sound pickup hole 3, thereby effectively preventing solder and flux in the welding process Wait for foreign matter to enter the sound pickup hole 3. After the microphone is welded, the temperature drops, the telescopic part 21a shrinks and pulls the slider 22a to move away from the sound pickup hole 3, returns to the first cavity 41, and the telescopic part 21b shrinks and pulls the slider 22b to move away from the sound pickup hole 3. The direction of the sound pickup hole 3 moves and returns to the second cavity 42 , so that external sound waves can enter the microphone through the sound pickup hole 3 .

Optionally, referring to Fig. 5 and Fig. 6, the opposite surfaces of the first slider 22a and the second slider 22b are in contact with each other, so that during the microphone welding process, the first slider 22a and the second slider 22a The blocks 22b can be tightly fitted together to further improve the shielding effect on the sound pickup hole 3 and prevent foreign matters such as solder and flux from entering the sound pickup hole 3 .

It should be noted that the microphone in this embodiment of the present invention may be an under-board microphone. Specifically, the sound pickup hole of the under-board microphone is arranged on the printed circuit board under the microphone cover.

In addition, an embodiment of the present invention further provides an electronic device, including the microphone of any one of the foregoing embodiments.

Referring to FIG. 7, FIG. 7 is a structural diagram of an electronic device provided by the implementation of the present invention.

As shown in FIG. 7 , the electronic device 700 includes a radio frequency (Radio Frequency, RF) circuit 710, a memory 720, an input unit 730, a display unit 740, a processor 750, an audio circuit 760, a communication module 770, a power supply 780 and a microphone 790.

Optionally, the microphone 790 includes a printed circuit board and at least one shielding assembly, the at least one shielding assembly includes a retractable component and a slider, the printed circuit board is provided with a sound pickup hole and a cavity, and the cavity is connected to the The sound pickup hole is connected, the telescopic part and the slider are located in the cavity, and when the temperature of the telescopic part is greater than the first threshold, the telescopic part pushes the slider to cover the Pickup hole.

Optionally, the stretchable component is a two-way memory alloy, one end of the two-way memory alloy is fixedly connected to the inner wall of the cavity, and the other end of the two-way memory alloy is fixedly connected to the slider.

Optionally, the printed circuit board includes at least three layers, and the cavity is provided in a middle layer of the printed circuit board.

Optionally, the length of the slider is greater than the diameter of the sound pickup hole.

Optionally, the cavity includes a first cavity and a second cavity, both the expandable component and the slider are located in the first cavity, and when the temperature of the expandable component is greater than a first threshold , a part of the slider is located in the first cavity, a part of the slider is located in the second cavity, and a part of the slider is located in the sound pickup hole.

Optionally, the cavity includes a first cavity and a second cavity, the at least one shielding assembly includes a first shielding assembly and a second shielding assembly, and the first shielding assembly includes a first retractable component and a second A slider, the second shielding assembly includes a second telescopic part and a second slider, the first telescopic part and the first slider are located in the first cavity, and the second telescopic components and the second slider are located in the second cavity, and when the temperatures of the first and second retractable components are greater than a first threshold, the first retractable component pushes the The first slider is located in the sound pickup hole, the second retractable component pushes the second slider to be located in the sound pickup hole, and the first slider cooperates with the second slider to block The pickup hole.

Optionally, the opposite surfaces of the first slider and the second slider are attached.

Optionally, the microphone 790 further includes a cover and an audio processing chip, the cover and the audio processing chip are fixed on the printed circuit board, and the audio processing chip is located in the cover.

Wherein, the input unit 730 can be used to receive digital or character information input by the user, and generate signal input related to user setting and function control of the electronic device 700 . Specifically, in the embodiment of the present invention, the input unit 730 may include a touch panel 731 . The touch panel 731, also referred to as a touch screen, can collect user's touch operations on or near it (such as the user's operation on the touch panel 731 using any suitable object or accessory such as a finger, a stylus), and The specified program drives the corresponding connected device. Optionally, the touch panel 731 may include two parts, a touch detection device and a touch controller. Among them, the touch detection device detects the user's touch orientation, detects the signal brought by the touch operation, and transmits the signal to the touch controller; the touch controller receives the touch information from the touch detection device, converts it into contact coordinates, and sends it to to the processor 750, and can receive and execute commands sent by the processor 750. In addition, the touch panel 731 can be implemented in various types such as resistive, capacitive, infrared, and surface acoustic wave. In addition to the touch panel 731, the input unit 730 may also include other input devices 732, which may include but not limited to physical keyboards, function keys (such as volume control buttons, switch buttons, etc.), trackballs, mice, joysticks, etc. one or more of.

Wherein, the display unit 740 can be used to display information input by the user or information provided to the user and various menu interfaces of the electronic device 700 . The display unit 740 may include a display panel 741. Optionally, the display panel 741 may be configured in the form of an LCD or an organic light-emitting diode (Organic Light-Emitting Diode, OLED).

It should be noted that the touch panel 731 can cover the display panel 741 to form a touch display screen. When the touch display screen detects a touch operation on or near it, it is sent to the processor 750 to determine the type of the touch event, and then the processor The 750 provides corresponding visual output on the touch display screen according to the type of touch event.

The touch display screen includes an application program interface display area and a common control display area. The arrangement of the display area of the application program interface and the display area of the commonly used controls is not limited, and may be an arrangement in which the two display areas can be distinguished, such as vertical arrangement, left-right arrangement, and the like. The application program interface display area can be used to display the interface of the application program. Each interface may include at least one interface element such as an icon of an application program and/or a widget desktop control. The application program interface display area can also be an empty interface without any content. The commonly used control display area is used to display controls with a high usage rate, for example, application icons such as setting buttons, interface numbers, scroll bars, and phonebook icons.

Wherein the processor 750 is the control center of the electronic device 700, utilizes various interfaces and lines to connect various parts of the whole mobile phone, and runs or executes the software programs and/or modules stored in the first memory 721, and calls the software programs and/or modules stored in the second memory 721. The data in the memory 722 executes various functions of the electronic device 700 and processes data, so as to monitor the electronic device 700 as a whole. Optionally, the processor 750 may include one or more processing units.

Optionally, the electronic device may include at least one of a mobile phone, a tablet computer, a laptop computer, a vehicle computer, a desktop computer, a smart TV, and a wearable device.

The above is only a specific embodiment of the present invention, but the scope of protection of the present invention is not limited thereto. Anyone familiar with the technical field can easily think of changes or replacements within the technical scope disclosed in the present invention, and should cover all Within the protection scope of the present invention. Therefore, the protection scope of the present invention should be based on the protection scope of the claims.

Claims (10)

1. A microphone, characterized in that it comprises a printed circuit board and at least one shielding assembly, said at least one shielding assembly includes a retractable part and a slider, said printed circuit board is provided with a sound pickup hole and a cavity, said The cavity communicates with the sound pickup hole, the telescopic component and the slider are located in the cavity, and when the temperature of the telescopic component is greater than a first threshold, the telescopic component pushes the slider block blocks the pickup hole. 2. The microphone according to claim 1, wherein the retractable part is a two-way memory alloy, one end of the two-way memory alloy is fixedly connected to the inner wall of the cavity, and the two-way memory alloy The other end is fixedly connected with the slider. 3 . The microphone according to claim 1 , wherein the printed circuit board comprises at least three layers, and the cavity is provided in a middle layer of the printed circuit board. 4 . 4. The microphone according to any one of claims 1-3, wherein the length of the slider is greater than the diameter of the sound pickup hole. 5. The microphone according to claim 4, wherein the cavity comprises a first cavity and a second cavity, the retractable member and the slider are located in the first cavity, and When the temperature of the stretchable component is greater than a first threshold, the stretchable component pushes the slider so that a part of the slider is located in the first cavity, and a part of the slider is located in the second cavity. In the cavity, a part of the slider is located in the sound pickup hole. 6. The microphone according to any one of claims 1-3, wherein the cavity comprises a first cavity and a second cavity, and the at least one shielding component comprises a first shielding component and a second shielding Assemblies, the first shielding assembly includes a first retractable component and a first slider, the second shielding assembly includes a second retractable member and a second slider, the first retractable member and the first The slider is located in the first cavity, the second telescopic part and the second slider are located in the second cavity, and the temperature of the first telescopic part and the second telescopic part is When it is greater than the first threshold, the first retractable part pushes the first slider to be located in the sound pickup hole, and the second retractable part pushes the second slider to be located in the sound pickup hole, And the first slider cooperates with the second slider to cover the sound pickup hole. 7. The microphone according to claim 6, wherein the opposite surfaces of the first sliding block and the second sliding block are in contact with each other. 8. The microphone according to any one of claims 1-3, wherein the microphone further comprises a cover and an audio processing chip, and the cover and the audio processing chip are fixed on the printed circuit board , the audio processing chip is located in the housing. 9. An electronic device, comprising the microphone according to any one of claims 1-8. 10. The electronic device according to claim 9, wherein the electronic device comprises at least one of a mobile phone, a tablet computer, a laptop computer, a vehicle computer, a desktop computer, a smart TV, and a wearable device .