CN106951043B - Electronic equipment and circulating cooling system - Google Patents
Electronic equipment and circulating cooling system Download PDFInfo
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- CN106951043B CN106951043B CN201710154772.4A CN201710154772A CN106951043B CN 106951043 B CN106951043 B CN 106951043B CN 201710154772 A CN201710154772 A CN 201710154772A CN 106951043 B CN106951043 B CN 106951043B
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- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F1/00—Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
- G06F1/16—Constructional details or arrangements
- G06F1/20—Cooling means
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- General Engineering & Computer Science (AREA)
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- Cooling Or The Like Of Electrical Apparatus (AREA)
Abstract
The application discloses circulative cooling system for dispel the heat to electronic equipment, include: a heat absorbing member for absorbing heat generated from the electronic device; a heat exchange member for exchanging heat with a cooling medium outside the electronic device; a liquid guide pipe which is internally provided with cooling liquid and is circularly communicated with the heat absorption component and the heat exchange component; the pump is arranged on the liquid guide pipeline and used for providing power for the flow of the cooling liquid; and the ventilation valve is arranged on the liquid guide pipeline and is used for guiding out gas existing in the liquid guide pipeline. According to the circulating cooling system provided by the embodiment, the ventilation valve is additionally arranged in the circulating cooling system, and the ventilation valve has the effect of allowing gas to pass but not allowing liquid to pass, so that the gas in the cooling liquid can be thoroughly discharged out of the circulating cooling system, the gas is not existed in the circulating cooling system, meanwhile, the cooling liquid is not leaked, and the problems of cavitation, tube expansion and abnormal sound of the circulating cooling system are fundamentally avoided on the premise of not influencing the cooling effect.
Description
Technical Field
The invention relates to the technical field of electronic equipment, in particular to a circulating cooling system and electronic equipment with the circulating cooling system.
Background
At present, the heat dissipation requirement of users on PC (personal computer) products is higher and higher, so a closed type circulating cooling system with higher heat dissipation efficiency has been more and more commonly applied to PC products. However, this kind of closed circulation cooling system also has certain drawbacks in the course of operation: after a period of working, gas can be generated in the cooling liquid, and the gas can generate cavitation to the pipelines and parts forming the closed type circulating cooling system along with the cooling liquid in the flowing process, so that the service life of the closed type circulating cooling system is influenced, and the gas which cannot be released from the closed type circulating cooling system can also cause the problems of pipe expansion and abnormal sound of the closed type circulating cooling system.
In view of the above problems, it is now common to add a preservative to the coolant to reduce the generation of gas, or to reserve a certain compressible space in the closed-loop cooling system to store the generated gas during the manufacturing process. However, the treatment mode can only delay the occurrence of cavitation, pipe expansion and abnormal sound, but cannot fundamentally solve the problems of cavitation, pipe expansion and abnormal sound.
Therefore, how to fundamentally solve the above problems has become a urgent problem for those skilled in the art.
Disclosure of Invention
In view of the above, the invention provides a circulating cooling system, which fundamentally solves the problems of cavitation, pipe expansion and abnormal sound by improving the structure of the circulating cooling system, and ensures that the service life of the circulating cooling system is longer and the working effect is better. The invention also provides electronic equipment with the circulating cooling system.
In order to achieve the above purpose, the present invention provides the following technical solutions:
a recirculating cooling system for dissipating heat from an electronic device, comprising:
a heat absorbing member for absorbing heat generated by the electronic device;
a heat exchange member for exchanging heat with a cooling medium outside the electronic device;
a liquid guide pipe which is internally provided with cooling liquid and circularly communicated with the heat absorption component and the heat exchange component;
the pump is arranged on the liquid guide pipeline and used for providing power for the flow of the cooling liquid;
and the ventilation valve is arranged on the liquid guide pipeline and is used for guiding out the gas existing in the liquid guide pipeline.
Preferably, in the above-mentioned circulation cooling system, the inlet of the pump is communicated with the heat absorbing member, the outlet of the pump is communicated with the heat exchanging member, and the air-permeable valve is disposed between the pump and the heat exchanging member and is disposed close to the outlet of the pump.
Preferably, in the above-mentioned circulation cooling system, the inlet of the pump is communicated with the heat absorbing member, the outlet of the pump is communicated with the heat exchanging member, and the air-permeable valve is disposed between the pump and the heat absorbing member and is disposed close to the inlet of the pump.
Preferably, in the above-mentioned circulation cooling system, the ventilation valve is provided between the heat absorbing member and the heat exchanging member.
Preferably, in the above-mentioned circulation cooling system, the ventilation valve is a plastic ventilation valve or a metal ventilation valve.
Preferably, in the above-mentioned circulating cooling system, the heat absorbing member includes:
a heat exchange tube in which the coolant flows;
and the heat exchange plates are connected with the heat exchange tubes, and the surface area of the heat exchange plates is larger than that of the heat exchange tubes.
In the above-described circulating cooling system, the heat absorbing member may be a heat conductive sheet that can be bonded to the cpu of the electronic device.
An electronic device comprising a central processing unit and a recirculating cooling system, the recirculating cooling system being any one of the above.
Preferably, the electronic device is a computer.
The invention provides a circulating cooling system for radiating electronic equipment, which mainly comprises a heat absorbing component, a heat exchanging component, a liquid guide pipeline, a pump and a ventilation valve, wherein the heat absorbing component is used for absorbing heat generated by the electronic equipment, the heat exchanging component can transfer the heat absorbed by the heat absorbing component to an external cooling medium (such as air), so that heat exchange between the inside and the outside of the electronic equipment is realized, the liquid guide pipeline is used for circularly communicating the heat absorbing component, the heat exchanging component and the pump, cooling liquid is filled in the liquid guide pipeline, heat is transferred between the heat absorbing component and the heat exchanging component through the flow of the cooling liquid in the liquid guide pipeline, the flowing power of the cooling liquid in the liquid guide pipeline is provided by the pump, and the ventilation valve is arranged on the liquid guide pipeline.
Drawings
In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings that are required to be used in the embodiments or the description of the prior art will be briefly described below, and it is obvious that the drawings in the following description are only embodiments of the present invention, and that other drawings can be obtained according to the provided drawings without inventive effort for a person skilled in the art.
Fig. 1 is a schematic structural diagram of a circulation cooling system according to an embodiment of the present invention.
In fig. 1:
1-heat absorption part, 2-heat exchange part, 3-catheter tube, 4-pump, 5-ventilation valve.
Detailed Description
The invention provides a circulating cooling system, which fundamentally solves the problems of cavitation, pipe expansion and abnormal sound by improving the structure of the circulating cooling system, so that the service life of the circulating cooling system is longer and the working effect is better.
The following description of the embodiments of the present invention will be made clearly and completely with reference to the accompanying drawings, in which it is apparent that the embodiments described are only some embodiments of the present invention, but not all embodiments. All other embodiments, which can be made by those skilled in the art based on the embodiments of the invention without making any inventive effort, are intended to be within the scope of the invention.
As shown in fig. 1, an embodiment of the present invention provides a circulation cooling system for being mounted on an electronic device to dissipate heat of the electronic device, including: the heat absorption component 1 is used for absorbing heat emitted by the electronic equipment, the heat exchange component 2 is used for exchanging heat with a cooling medium outside the electronic equipment, the heat absorption component 1 is circularly communicated with the heat exchange component 2, the liquid guide pipeline 3 is internally provided with cooling liquid, the liquid guide pipeline 3 is also provided with a pump 4 and a ventilation valve 5, the pump 4 supplies power for the flow of the cooling liquid in the liquid guide pipeline 3, the ventilation valve 5 is also arranged on the liquid guide pipeline 3, and the gas in the cooling liquid can overflow from the liquid guide pipeline 3, but the cooling liquid cannot leak through the ventilation valve 5.
According to the circulating cooling system provided by the embodiment, the ventilation valve 5 is additionally arranged in the circulating cooling system, so that gas in the cooling liquid can be thoroughly discharged out of the circulating cooling system, the circulating cooling system is free from gas, meanwhile, the cooling liquid is free from leakage, and the problems of cavitation, pipe expansion and abnormal sound of the circulating cooling system are fundamentally avoided on the premise that the cooling effect is not affected.
In order to further optimize the technical solution, in the circulation cooling system provided in this embodiment, it is preferable that the inlet of the pump 4 is communicated with the heat absorbing component 1, the outlet of the pump 4 is communicated with the heat exchanging component 2, and the ventilation valve 5 is disposed between the pump 4 and the heat exchanging component 2 and is disposed near the outlet of the pump 4, that is, the ventilation valve 5 is preferably disposed at the outlet of the pump 4, as shown in fig. 1. Since the inlet of the pump 4 is communicated with the heat absorbing component 1 and the outlet of the pump 4 is communicated with the heat exchanging component 2, the working mode of the cooling liquid is as follows: the heat absorbing component 1 absorbs heat, the cooling liquid with higher temperature flows to the pump 4, enters the pump 4 through the inlet, flows out of the outlet of the pump 4 through the pressurization of the pump 4, then enters the heat exchanging component 2 for heat exchange, and the cooling liquid with lower temperature flows out of the heat exchanging component 2 after heat exchange and flows to the heat absorbing component 1 again to absorb heat, as shown by an arrow in fig. 1. In this flowing process, because the turbulence of the pump 4 causes the cooling liquid to flow out from the outlet of the pump 4, the amount of the gas existing in the cooling liquid reaches the highest value, so compared with other parts, the ventilation valve 5 is arranged at the outlet of the pump 4, so that the gas in the cooling liquid can be discharged to the greatest extent, a more efficient exhaust effect is achieved, and the probability of cavitation, pipe expansion and abnormal sound of the circulating cooling system is minimized.
In addition to the above arrangement, the ventilation valve 5 may be disposed between the pump 4 and the heat absorbing member 1, that is, the ventilation valve 5 may be disposed at an inlet portion of the pump 4, or the ventilation valve 5 may be disposed between the heat exchanging member 2 and the heat absorbing member 1, so that the purpose of exhausting the gas in the cooling liquid may be achieved.
Specifically, the material of the ventilation valve 5 may be selected from various materials such as plastics and metals on the premise of removing the liquid in the coolant and ensuring that the cooling effect is not reduced, but in view of the service life and other factors, the ventilation valve 5 is preferably a metal ventilation valve 5.
In the present embodiment, the heat exchange member 2 preferably includes: a heat exchange tube in which a coolant flows; and the heat exchange plates are connected with the heat exchange tubes, and the surface area of the heat exchange plates is larger than that of the heat exchange tubes. The heat exchange component 2 not only comprises a heat exchange tube for guiding cooling liquid, but also comprises a heat exchange sheet which is in contact with the heat exchange tube and can perform heat transfer, so that the heat exchange tube and the heat exchange sheet can perform heat exchange with external air at the same time, the surface area of the heat exchange component 2 is further increased, the heat exchange component 2 can perform heat exchange with the external air of the electronic equipment more efficiently, and the heat dissipation effect and the heat dissipation efficiency of the circulating cooling system are further improved.
Specifically, the heat sink 1 is preferably a heat conductive sheet that can be directly bonded to the cpu of the electronic device. The structure of the heat absorbing component 1 and the matching mode with the heat dissipating component in the electronic device can have various choices, and since the central processing unit is the main heat dissipating component in the electronic device, the heat absorbing component 1 is preferably arranged around the central processing unit, so that the heat emitted by the electronic device can be more fully absorbed, and the heat absorbing component 1 is more preferably attached to the central processing unit, so that the heat can be directly and fully transferred into the heat absorbing component 1, and the cooling effect can be optimized. In the present embodiment, the heat sink 1 is preferably a heat conductive sheet because the sheet structure is small in size, easy to install, more suitable for the installation environment of the electronic device, and also more suitable for the structure of the cpu, so that it is a preferable structure.
Based on the circulation cooling system provided in the above embodiment, the embodiment of the invention also provides an electronic device having the circulation cooling system provided in the above embodiment.
Because the electronic device adopts the circulation cooling system provided by the above embodiment, the beneficial effects of the electronic device brought by the circulation cooling system refer to the corresponding parts in the above embodiment, and are not described herein.
In particular, in this embodiment, the electronic device is preferably a desktop computer.
In the present description, the structures of the parts are described in a progressive manner, and the structure of each part is mainly described as a difference from the existing structure, and the whole and part structures of the electronic device and the circulation cooling system can be obtained by combining the structures of the parts.
The previous description of the disclosed embodiments is provided to enable any person skilled in the art to make or use the present invention. Various modifications to these embodiments will be readily apparent to those skilled in the art, and the generic principles defined herein may be applied to other embodiments without departing from the spirit or scope of the invention. Thus, the present invention is not intended to be limited to the embodiments shown herein but is to be accorded the widest scope consistent with the principles and novel features disclosed herein.
Claims (9)
1. A circulation cooling system for radiating heat of a closed circulation cooling system of an electronic device, comprising:
a heat absorbing member for absorbing heat generated by the electronic device;
a heat exchange member for exchanging heat with a cooling medium outside the electronic device;
a liquid guide pipe which is internally provided with cooling liquid and circularly communicated with the heat absorption component and the heat exchange component;
the pump is arranged on the liquid guide pipeline and used for providing power for the flow of the cooling liquid;
and the ventilation valve is arranged on the liquid guide pipeline and is used for guiding out the gas existing in the liquid guide pipeline, and the cooling liquid cannot leak through the ventilation valve.
2. The hydronic cooling system of claim 1, wherein the pump inlet is in communication with the heat sink, the pump outlet is in communication with the heat exchange member, and the breather valve is disposed between the pump and the heat exchange member and adjacent to the pump outlet.
3. The hydronic cooling system of claim 1, wherein the pump inlet is in communication with the heat sink, the pump outlet is in communication with the heat exchange member, and the breather valve is disposed between the pump and the heat sink and adjacent to the pump inlet.
4. The hydronic cooling system of claim 1, wherein the breather valve is disposed between the heat sink and the heat exchange member.
5. The cooling circulation system of any one of claims 1-4, wherein the ventilation valve is a plastic ventilation valve or a metal ventilation valve.
6. The circulation cooling system according to any one of claims 1 to 4, wherein the heat exchanging member includes:
a heat exchange tube in which the coolant flows;
and the heat exchange plates are connected with the heat exchange tubes, and the surface area of the heat exchange plates is larger than that of the heat exchange tubes.
7. The circulation cooling system according to any one of claims 1 to 4, wherein the heat absorbing member is a heat conductive sheet that can be attached to a central processor of the electronic device.
8. An electronic device comprising a central processing unit and a recirculating cooling system, wherein the recirculating cooling system is the recirculating cooling system of any one of claims 1-7.
9. The electronic device of claim 8, wherein the electronic device is a computer.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201710154772.4A CN106951043B (en) | 2017-03-15 | 2017-03-15 | Electronic equipment and circulating cooling system |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201710154772.4A CN106951043B (en) | 2017-03-15 | 2017-03-15 | Electronic equipment and circulating cooling system |
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| Publication Number | Publication Date |
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| CN106951043A CN106951043A (en) | 2017-07-14 |
| CN106951043B true CN106951043B (en) | 2023-12-26 |
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| Application Number | Title | Priority Date | Filing Date |
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| CN201710154772.4A Active CN106951043B (en) | 2017-03-15 | 2017-03-15 | Electronic equipment and circulating cooling system |
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Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
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| CN107505805A (en) * | 2017-09-19 | 2017-12-22 | 青岛海信电器股份有限公司 | A kind of water tank, water-cooling heat radiating system and projector |
| CN114126319A (en) * | 2020-08-26 | 2022-03-01 | 海信视像科技股份有限公司 | Heat dissipation device for split flat-panel television and assembly method |
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| CN202111979U (en) * | 2011-05-17 | 2012-01-11 | 倍亿淂科技股份有限公司 | cooling system |
| CN102705055A (en) * | 2012-06-18 | 2012-10-03 | 安徽江淮汽车股份有限公司 | Gasoline engine cooling system |
| CN103354891A (en) * | 2011-02-07 | 2013-10-16 | 三菱电机株式会社 | Air-conditioning device |
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| US7209355B2 (en) * | 2002-05-15 | 2007-04-24 | Matsushita Electric Industrial Co., Ltd. | Cooling device and an electronic apparatus including the same |
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2017
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| CN1581366A (en) * | 2003-08-11 | 2005-02-16 | 株式会社日立制作所 | Electronic equipment provided with cooling system |
| US9187684B2 (en) * | 2009-03-20 | 2015-11-17 | University Of South Carolina | Nanofluids for thermal management systems |
| CN103354891A (en) * | 2011-02-07 | 2013-10-16 | 三菱电机株式会社 | Air-conditioning device |
| CN202111979U (en) * | 2011-05-17 | 2012-01-11 | 倍亿淂科技股份有限公司 | cooling system |
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