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CN106941769A - Heat dissipation structural part with good comprehensive performance and preparation process thereof - Google Patents

Heat dissipation structural part with good comprehensive performance and preparation process thereof Download PDF

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Publication number
CN106941769A
CN106941769A CN201611009301.6A CN201611009301A CN106941769A CN 106941769 A CN106941769 A CN 106941769A CN 201611009301 A CN201611009301 A CN 201611009301A CN 106941769 A CN106941769 A CN 106941769A
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Prior art keywords
board
plate
plates
welding
heat dissipation
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CN201611009301.6A
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Chinese (zh)
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CN106941769B (en
Inventor
林进东
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Individual
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Priority to CN201611009301.6A priority Critical patent/CN106941769B/en
Publication of CN106941769A publication Critical patent/CN106941769A/en
Priority to TW106129151A priority patent/TW201819839A/en
Priority to KR1020170144424A priority patent/KR102111834B1/en
Priority to US15/803,347 priority patent/US20180135922A1/en
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Publication of CN106941769B publication Critical patent/CN106941769B/en
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    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/2029—Modifications to facilitate cooling, ventilating, or heating using a liquid coolant with phase change in electronic enclosures
    • H05K7/20336—Heat pipes, e.g. wicks or capillary pumps
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
    • F28F3/00—Plate-like or laminated elements; Assemblies of plate-like or laminated elements
    • F28F3/02—Elements or assemblies thereof with means for increasing heat-transfer area, e.g. with fins, with recesses, with corrugations
    • F28F3/04—Elements or assemblies thereof with means for increasing heat-transfer area, e.g. with fins, with recesses, with corrugations the means being integral with the element
    • F28F3/048—Elements or assemblies thereof with means for increasing heat-transfer area, e.g. with fins, with recesses, with corrugations the means being integral with the element in the form of ribs integral with the element or local variations in thickness of the element, e.g. grooves, microchannels
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23P—METAL-WORKING NOT OTHERWISE PROVIDED FOR; COMBINED OPERATIONS; UNIVERSAL MACHINE TOOLS
    • B23P15/00—Making specific metal objects by operations not covered by a single other subclass or a group in this subclass
    • B23P15/26—Making specific metal objects by operations not covered by a single other subclass or a group in this subclass heat exchangers or the like
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
    • F28D15/00—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
    • F28D15/02—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
    • F28D15/0233—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes the conduits having a particular shape, e.g. non-circular cross-section, annular
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
    • F28F13/00—Arrangements for modifying heat-transfer, e.g. increasing, decreasing
    • F28F13/18—Arrangements for modifying heat-transfer, e.g. increasing, decreasing by applying coatings, e.g. radiation-absorbing, radiation-reflecting; by surface treatment, e.g. polishing
    • F28F13/185—Heat-exchange surfaces provided with microstructures or with porous coatings
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
    • F28F19/00—Preventing the formation of deposits or corrosion, e.g. by using filters or scrapers
    • F28F19/02—Preventing the formation of deposits or corrosion, e.g. by using filters or scrapers by using coatings, e.g. vitreous or enamel coatings
    • F28F19/06—Preventing the formation of deposits or corrosion, e.g. by using filters or scrapers by using coatings, e.g. vitreous or enamel coatings of metal
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
    • H01L23/373—Cooling facilitated by selection of materials for the device or materials for thermal expansion adaptation, e.g. carbon
    • H01L23/3735—Laminates or multilayers, e.g. direct bond copper ceramic substrates
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/46—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids
    • H01L23/473—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids by flowing liquids
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
    • H01L23/367—Cooling facilitated by shape of device
    • H01L23/3677—Wire-like or pin-like cooling fins or heat sinks

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Thermal Sciences (AREA)
  • Mechanical Engineering (AREA)
  • General Engineering & Computer Science (AREA)
  • Chemical & Material Sciences (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Sustainable Development (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Materials Engineering (AREA)
  • Ceramic Engineering (AREA)
  • Crystallography & Structural Chemistry (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
  • Pressure Welding/Diffusion-Bonding (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)

Abstract

A heat dissipation structural member with good comprehensive performance is provided with an A plate, a B plate, a capillary functional layer and cooling liquid. Welding a plurality of copper columns which are positioned on the inner surface of the A plate and are abutted with the A plate on the inner surface of the A plate on the outer surface of the A plate in a welding mode; the board B and the board A are assembled in a sealing mode, the board B is provided with a groove matched with the copper column of the board A, a plurality of copper columns of the board A abut against the inner surface of the groove of the board B, and the inner surface of the board B and a plurality of copper columns abutted against the inner surface of the board B are welded through the outer surface of the board B. The preparation process comprises (1) welding copper column on A plate; (2) preparing a capillary functional layer; (3) assembling the board B and the board A; (4) then, the periphery of the plate B and the plate A are hermetically welded to form a cavity structure; (5) and injecting cooling liquid, vacuumizing and sealing the cooling liquid pipeline. The heat dissipation structural part disclosed by the invention is simple to prepare, the processing time is greatly reduced, and the integral heat dissipation part is good in hardness, good in compression resistance and anti-explosion performance, good in surface flatness and good in glossiness.

Description

A kind of good radiator structure part of combination property and its preparation technology
Technical field
The present invention relates to electronic product radiating technical field, the good radiator structure part of more particularly to a kind of combination property And its preparation technology.
Background technology
Good heat dispersion be to ensure that in the important leverage that electronic product effectively works, electronic product generally using aluminium or The multilayer chip radiator of the materials such as person's copper is radiated, and the larger product of partial volume also has by liquid such as water or other Coolant carries out cooling radiating etc..But, as electronic product is gradually minimized, it is desirable to which the volume of heat abstractor is also increasingly It is small.
In the prior art, a kind of structure of the good heat abstractor of small volume, heat dispersion constitutes chamber by two pieces of substrates Body, the capillary function layer being made up of the metal dust with rough surface structure is respectively arranged with two pieces of substrate inwalls, simultaneously Sealing is filled with coolant between two pieces of substrates, and capillary function layer is usually copper powder.Pass through capillary function layer, at normal temperatures copper powder In interstitial site absorb and have coolant, when heat generating member produces heat, copper powder in cavity can be discharged because of capillarity, Promote coolant to be moved, so as to form the propulsion power that coolant is moved in cavity, promote coolant flow so as to timely Heat is shifted.Generally support to coordinate simultaneously by copper post in order to ensure the validity of cavity, between two pieces of substrates and set substrate It is set to certain groove structure.
Copper post of the prior art is typically the structure that is connected as a single entity in the way of sintering with substrate, and sintering is needed at 900 DEG C Lower sintering 1 hour or so, and to carry out the processing such as being tempered.The hardness that result in copper post is inadequate, is found in practice, this structure Heat abstractor anti-knock properties are poor, and crushing resistance is poor, flatness, and glossiness is not good.Simultaneously because being handled through oversintering, tempering etc., consumption When, consumptive material, the consumption energy and pollution is big.
Therefore, in view of the shortcomings of the prior art, provide a kind of good radiator structure part of combination property and its preparation technology with Overcome prior art not enough very necessary.
The content of the invention
There is provided combination property good radiator structure part it is an object of the invention to avoid the deficiencies in the prior art part, The radiator structure part, which has, to be prepared simple, process time and greatly reduces, is not required to sintering tempering etc., integral heat sink part hardness is good, Resistance to compression anti-knock properties are good, surface smoothness is good, glossiness is good.
The object of the present invention is achieved by the following technical measures.
A kind of good radiator structure part of combination property, is provided with
A plates, are welded many copper posts abutted positioned at A plates inner surface and with A plates by welding manner in the outer surface of A plates In the inner surface of A plates；
B plates, seal with A plates and assemble, and the groove matched with the copper post with A plates, many copper posts of A plates are connected to B plates Groove inner surface, the inner surface of B plates is welded with many copper posts abutted by the outer surfaces of B plates；
Capillary function layer, is arranged at A plates, the inner surface of B plates；
Coolant, is filled in the cavity being made up of A plates, B plates, and is in vacuum state in cavity.
It is preferred that, above-mentioned A plates are planar structure.
It is preferred that, above-mentioned B plates are provided with the coolant injection channel being connected with groove, and coolant injection channel is in coolant Inject and to being crushed and being tightly connected with A plates after being vacuumized in cavity.
It is preferred that, many copper post is uniform or non-uniform Distribution is in the corresponding region of A plate inner surfaces.
It is preferred that, the outer surface of above-mentioned B plates is additionally provided with welding route, and the welding route is appearance of the groove in B plates The raised circle edge line in face.
It is a further object of the present invention to provide a kind of preparation technology of the good radiator structure part of above-mentioned combination property, bag Include following steps,
(1) copper post is placed in mould, A plates are placed in above copper post, entered by welding equipment from the one side of the remote copper post of A plates Row welding so that copper post is fixedly connected with the inner surface of the plate abutted；
(2) carry out capillary function layer to A plates, B plates respectively to prepare so that capillary function layer is deposited on A plates, B plates Correspondence position；
(3) B plates and A plates are assembled, the groove inner surface of B plates is abutted with being welded in the copper post of A plates, in the outer surface of B plates B plates and copper post are welded；
(4) B plates and A plates surrounding are subjected to sealing welding formation cavity structure again；
(5) to the A plates after sealing welding and B plate shapes into cavity in inject coolant, and will be vacuumized in cavity, then will Coolant duct is closed.
It is preferred that, above-mentioned welding manner is laser welding or electron beam welding.
It is preferred that, A plates, B plates are copper coin, and capillary function layer is copper powder.
It is preferred that, the welding road that B plates are set with the sealing welding of A plates particularly along B plates outer surface in above-mentioned steps (4) Wire bonding one is enclosed；
Cooling pipe closing is specifically that will be arranged at the coolant injection channel of B plates and cavity is taken out by the step (5) Flatten and be tightly connected with A plate riveteds after vacuum.
It is preferred that, the preparation technology of the good radiator structure part of above-mentioned combination property, also including step (6), by A plates, B Polish respectively the outer surface of plate.
The good radiator structure part of combination property that the present invention is provided and its preparation technology, pass through the appearance in A plates respectively The many copper posts abutted positioned at A plates inner surface and with A plates are welded in the inner surface of A plates, by B plates by face by welding manner The inner surface of B plates is welded outer surface with many copper posts abutted.Therefore whole preparation process does not need burning of the prior art Knot, temper, can keep the hardness of A plates, B plates and its internal copper post so that integral heat sink part hardness is good, resistance to compression resists Quick-fried property is good.Due to that the operation such as need not sinter, be tempered, preparation technology is simple, process time greatly reduces.Integral heat sink part surface Flatness is good, glossiness is good.
Brief description of the drawings
Using accompanying drawing, the present invention is further illustrated, but the content in accompanying drawing does not constitute any limit to the present invention System.
Fig. 1 is a kind of cross-sectional view of the good radiator structure part of combination property of the invention.
Fig. 2 is a kind of structural representation of the inner surface portion of the A plates of the good radiator structure part of combination property of the invention.
Fig. 3 is a kind of structural representation of the inner surface portion of the B plates of the good radiator structure part of combination property of the invention.
Fig. 4 is a kind of structural representation of the outer surface part of the B plates of the good radiator structure part of combination property of the invention.
In Fig. 1 into Fig. 4, including：
A plates 100, copper post 110,
B plates 200, groove 210, coolant injection channel 220, welding route 230,
Capillary function layer 300,
Cavity 400.
Embodiment
The invention will be further described with the following Examples.
Embodiment 1.
The present embodiment provides a kind of combination property good radiator structure part, as shown in Figure 1 and Figure 2, is provided with A plates 100, B Plate 200, capillary function layer 300 and coolant.
A plates 100, will be abutted positioned at the inner surface of A plates 100 and with A plates 100 in the outer surface of A plates 100 by welding manner Many copper posts 110 are welded in the inner surface of A plates 100.
B plates 200, with A plates 100 seal assemble, the groove 210 matched with the copper post 110 with A plates 100, A plates it is many Root copper post 110 is connected to the inner surface of the groove 210 of B plates, by the outer surfaces of B plates by the inner surface of B plates and abut many Copper post 110 is welded.A plates 100 and B plates 200 are assembled, and the two ends of copper post 110 are connected with A plates 100, B plates 200 respectively, A plates 100 and B Cavity 400 is formed between plate 200.
Capillary function layer 300, is arranged at A plates, the inner surface of B plates.
Coolant, is filled in the cavity 400 being made up of A plates, B plates, and is in vacuum state in cavity 400.In cavity 400 In vacuum state and filled with coolant, the interstitial site in capillary function layer 300, which absorbs, at normal temperatures coolant, when radiating knot When component is heated, metal powder in cavity 400 can be discharged because of capillarity, promote coolant to be moved, so as to be formed The propulsion power that coolant is moved in cavity, promotes coolant flow in time to shift heat.
In the present embodiment, A plates 100 are flat board, and many copper posts 110 are uniformly distributed in the corresponding region of the inner surface of A plates 100, Corresponding, the B plates 200 assembled with A plates 100 also have the groove 210 of planar structure.Formed using copper post 110 to A plates 100, B Support between plate 200, to ensure effective presence of cavity 400.A plates 100, B plates 200 are preferably copper coin, with preferable Heat dissipating.
It should be noted that A plates 100 can also be the flat board of other structures, many copper posts 110 can also be not limited to It is even to be distributed in the inner surface of A plates 100, or non-uniform Distribution.
Due to many by what is abutted positioned at the inner surface of A plates 100 and with A plates 100 by welding manner in the outer surface of A plates 100 Root copper post 110 is welded in the inner surface of A plates 100.By the outer surfaces of B plates by the inner surface of B plates and many copper posts 110 abutting Welding.Avoid and copper post 110 and A plates 100, the sintering of B plates 200 are integrated, therefore be not required to existing with sintering processing in the prior art The influence that the processing such as the sintering under higher temperature, tempering in technology is caused to A plates 100, the hardness of B plates 200.Integral heat sink structure Part hardness is high, and resistance to compression explosion-proof performance is good.Due to that the operation such as need not sinter, be tempered, preparation technology is simple, process time significantly Reduce, energy-conserving and environment-protective.Integral heat sink part surface smoothness is good, glossiness is good.
B plates are provided with the coolant injection channel 220 being connected with groove 210, and coolant injection channel 220 is noted in coolant It is crushed and is tightly connected with A plates after entering and after being vacuumized in cavity 400.The structure is abandoned individually to be set in the prior art One-step cooling liquid connecting pipe is put, coolant connecting pipe is closed after coolant, gas are vacuumized.Practice is found, existing Coolant connecting pipe, the gas connection pipe road set in technology causes heat abstractor because a variety of causes is easily leaked Failure.Therefore, the radiator structure part of the application is not provided with coolant connecting pipe, gas connection pipe road, in coolant, vacuumizes The coolant of B plates 200 is directly injected and then vacuumized by shell afterwards, and pressing and the riveted of A plates 100 form sealing structure, Neng Gou great The leakage phenomenon occurred in big reduction use, it is ensured that the service life of the radiator structure part.
The outer surface of B plates 200 is additionally provided with welding route 230, and welding route 230 is appearance of the groove 210 in B plates 200 The raised circle edge line in face.After B plates 200 and copper post 110 are welded, the surrounding of cavity 400 of A plates 100 and B plates 200 is sealed Welding, can along welding circuit be welded, with it is easy to operate the characteristics of.
The radiator structure part of the structure, is welded copper post 110 respectively at A plates 100, B plates 200 using welding manner, then will Overall A plates 100, the sealing welding of B plates 200, this operating process are completed about in 5-20 seconds, compared with prior art in 1,2 hours Preparation process be greatly improved production efficiency.
The preparation technology of the good radiator structure part of the combination property, comprises the following steps,
(1) copper post 110 is placed in mould, A plates 100 are placed in the top of copper post 110, by welding equipment away from A plates 100 The one side of copper post 110 is welded so that copper post 110 is fixedly connected with the inner surface of the plate abutted；
(2) carry out capillary function layer 300 to A plates 100, B plates 200 respectively to prepare so that capillary function layer 300 is deposited respectively In A plates 100, the correspondence position of B plates 200；
(3) B plates 200 and A plates 100 are assembled, the inner surface of groove 210 of B plates 200 and the copper post 110 for being welded in A plates 100 Abut, weld B plates 200 with copper post 110 in the outer surface of B plates 200；
(4) B plates 200 and the surrounding of A plates 100 are subjected to the sealing welding formation structure of cavity 400 again；Particularly along B plates 200 The welding of welding route 230 one that outer surface is set is enclosed；
(5) coolant is injected into the A plates 100 after sealing welding and the cavity 400 of the formation of B plates 200, and by cavity 400 Inside vacuumize, then coolant duct is closed.It is specifically to flatten coolant injection channel 220 and and A by cooling pipe closing The riveted of plate 100 is tightly connected.
Also include step (6), the outer surface of A plates 100, B plates 200 is polished respectively, to prevent pair part released with it Cause to scratch damage.
Specifically, welding manner involved in above-mentioned preparation technology is laser welding or electron beam welding, preferably swash Flush weld.
It is preferred that, A plates 100, B plates 200 are copper coin, and capillary function layer 300 is copper powder.
The radiator structure part of the structure, is welded copper post 110 respectively at A plates 100, B plates 200 using welding manner, then will Overall A plates 100, the sealing welding of B plates 200, this operating process are completed about in 5-20 seconds, compared with prior art in 1,2 hours Preparation process be greatly improved production efficiency.
In summary, radiator structure part hardness of the invention is good, resistance to compression anti-knock properties are good, preparation technology is simple, processing when Between greatly reduce, integral heat sink part surface smoothness is good, glossiness is good, and overall performance is excellent.
Finally it should be noted that the above embodiments are merely illustrative of the technical solutions of the present invention rather than the present invention is protected The limitation of scope, although being explained in detail with reference to preferred embodiment to the present invention, one of ordinary skill in the art should manage Solution, technical scheme can be modified or equivalent, without departing from technical solution of the present invention essence and Scope.

Claims (10)

1.一种综合性能良好的散热结构件，其特征在于：设置有1. A heat dissipation structure with good comprehensive performance, characterized in that: it is provided with A板，在A板的外表面通过焊接方式将位于A板内表面并与A板抵接的多根铜柱焊接于A板的内表面；A plate, on the outer surface of the A plate, a plurality of copper pillars located on the inner surface of the A plate and in contact with the A plate are welded to the inner surface of the A plate by welding; B板，与A板密封装配，具有与A板的铜柱相匹配的凹槽，A板的多根铜柱抵接于B板的凹槽的内表面，通过B板的外表面将B板的内表面与抵接的多根铜柱焊接；Board B is sealed and assembled with board A, and has grooves matching the copper pillars of board A. The multiple copper pillars of board A abut against the inner surface of the grooves of board B, and board B is connected by the outer surface of board B. The inner surface of the inner surface is welded with a plurality of abutting copper pillars; 毛细功能层，设置于A板、B板的内表面；The capillary functional layer is arranged on the inner surfaces of the A board and the B board; 冷却液，填充于由A板、B板构成的空腔内，且空腔内呈真空状态。The coolant is filled in the cavity formed by the A plate and the B plate, and the cavity is in a vacuum state. 2.根据权利要求1所述的综合性能良好的散热结构件，其特征在于：所述A板为平面结构。2. The heat dissipation structure with good comprehensive performance according to claim 1, characterized in that: the A-plate is a planar structure. 3.根据权利要求2所述的综合性能良好的散热结构件，其特征在于：所述B板设置有与凹槽连接的冷却液注入通道，冷却液注入通道在冷却液注入、并对空腔内抽真空后被压扁且与A板密封连接。3. The heat dissipation structure with good comprehensive performance according to claim 2, characterized in that: the B plate is provided with a cooling liquid injection channel connected to the groove, and the cooling liquid injection channel is injected into the cooling liquid and is connected to the cavity. After being vacuumed, it is flattened and sealed with A-plate. 4.根据权利要求3所述的综合性能良好的散热结构件，其特征在于：多根铜柱均匀或非均匀分布于A板内表面的对应区域。4. The heat dissipation structure with good comprehensive performance according to claim 3, characterized in that: a plurality of copper pillars are uniformly or non-uniformly distributed on the corresponding area of the inner surface of the A board. 5.根据权利4所述的综合性能良好的散热结构件，其特征在于：所述B板的外表面还设置有焊接路线，所述焊接路线为凹槽在B板的外表面凸起的一圈边沿线。5. The heat dissipation structure with good comprehensive performance according to claim 4, characterized in that: the outer surface of the B board is also provided with a welding route, and the welding route is a groove protruding from the outer surface of the B board. circle along the line. 6.一种如权利要求1至5任意一项所述的综合性能良好的散热结构件的制备工艺，其特征在于：包括如下步骤，6. A preparation process for a heat dissipation structure with good comprehensive performance as claimed in any one of claims 1 to 5, characterized in that it comprises the following steps, (1)将铜柱置于模具，A板置于铜柱上方，通过焊接设备从A板的远离铜柱的一面进行焊接，使得铜柱与抵接的板的内表面固定连接；(1) Place the copper column in the mould, place the A plate above the copper column, and weld from the side of the A plate away from the copper column by welding equipment, so that the copper column is fixedly connected to the inner surface of the abutting plate; (2)分别对A板、B板进行毛细功能层制备，使得毛细功能层分别沉积于A板、B板的对应位置；(2) Prepare capillary functional layers on plate A and plate B respectively, so that the capillary functional layers are deposited on the corresponding positions of plate A and plate B respectively; (3)将B板与A板装配，B板的凹槽内表面与焊接于A板的铜柱抵接，在B板的外表面将B板与铜柱焊接；(3) Assembling board B and board A, the inner surface of the groove of board B is in contact with the copper pillar welded on board A, and welding board B and the copper pillar on the outer surface of board B; (4)再将B板与A板四周进行密封焊接形成空腔结构；(4) Then seal and weld the B plate and the A plate around to form a cavity structure; (5)向密封焊接后的A板与B板形成的空腔内注入冷却液，并将空腔内抽真空，再将冷却液管道封闭。(5) Inject coolant into the cavity formed by A-plate and B-plate after seal welding, vacuumize the cavity, and then seal the coolant pipeline. 7.根据权利6所述的综合性能良好的散热结构件的制备工艺，其特征在于：焊接方式为激光焊接或者电子束焊接。7. The preparation process of a heat dissipation structure with good comprehensive performance according to claim 6, wherein the welding method is laser welding or electron beam welding. 8.根据权利要求7所述的综合性能良好的散热结构件的制备工艺，其特征在于：A板、B板均为铜板，毛细功能层为铜粉。8 . The preparation process of a heat dissipation structural member with good comprehensive performance according to claim 7 , wherein the plate A and the plate B are both copper plates, and the capillary functional layer is copper powder. 9.根据权利要求8所述的综合性能良好的散热结构件的制备工艺，其特征在于：所述步骤(4)中B板与A板的密封焊接具体是沿着B板外表面设置的焊接路线焊接一圈；9. The preparation process of a heat-dissipating structural member with good comprehensive performance according to claim 8, characterized in that: in the step (4), the sealing welding between the B board and the A board is specifically the welding arranged along the outer surface of the B board The route is welded in a circle; 所述步骤(5)将冷却管道封闭具体是将设置于B板的冷却液注入通道、并对空腔内抽真空后压扁并与A板铆合密封连接。The step (5) of closing the cooling pipeline is specifically to inject the cooling liquid into the passage provided on the B plate, and after vacuuming the cavity, flatten it and rivet and seal it with the A plate. 10.根据权利要求9所述的综合性能良好的散热结构件的制备工艺，其特征在于：还包括步骤(6)，将A板、B板的外表面分别打磨。10 . The process for preparing a heat dissipation structure with good comprehensive performance according to claim 9 , further comprising the step (6) of grinding the outer surfaces of the A board and the B board respectively. 11 .
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