CN106937187A - A kind of microphone structure of side inlet hole - Google Patents
A kind of microphone structure of side inlet hole Download PDFInfo
- Publication number
- CN106937187A CN106937187A CN201511018088.0A CN201511018088A CN106937187A CN 106937187 A CN106937187 A CN 106937187A CN 201511018088 A CN201511018088 A CN 201511018088A CN 106937187 A CN106937187 A CN 106937187A
- Authority
- CN
- China
- Prior art keywords
- pcb board
- inlet hole
- side inlet
- pcb
- microphone structure
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000000034 method Methods 0.000 claims abstract description 7
- 238000012986 modification Methods 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 230000009286 beneficial effect Effects 0.000 description 1
- 238000006243 chemical reaction Methods 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
- H04R1/00—Details of transducers, loudspeakers or microphones
- H04R1/08—Mouthpieces; Microphones; Attachments therefor
- H04R1/083—Special constructions of mouthpieces
Landscapes
- Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- Acoustics & Sound (AREA)
- Signal Processing (AREA)
- Details Of Audible-Bandwidth Transducers (AREA)
Abstract
The present invention relates to electronic device field, more particularly to a kind of microphone structure of side inlet hole.A kind of microphone structure of side inlet hole, is applied under the technique of PCB stackings, and the microphone structure includes：First pcb board；Second pcb board, is arranged at the top (first direction) of first pcb board, is fixedly connected with first pcb board by column, forms cavity；And bar-shaped trough is provided with second pcb board, the bar-shaped trough is provided with side inlet hole on the side (second direction) of second pcb board, so that sound is entered in second pcb board by the side inlet hole；First direction is vertical with second direction；Sensor, is connected with second pcb board, is arranged in the cavity, and the sound in second pcb board is identified.
Description
Technical field
The present invention relates to electronic device field, more particularly to a kind of microphone structure of side inlet hole.
Background technology
The acoustic aperture of microphone is often located at the top of sensor in the prior art, it is impossible to from side or
Other directions of person set acoustic aperture, cause the collecting direction of sound to be restricted；If sound can only
Collected in the electronic device from the top of sensor, the placement location of microphone and we to all
It is restricted, and then the manufacture of electronic equipment will be that setting for microphone reserves more sky
Between.
The content of the invention
For problems of the prior art, the invention provides a kind of microphone of side inlet hole
Structure, can open up acoustic aperture in the side of microphone, can be in multiple directions radio reception.
The present invention is adopted the following technical scheme that：
A kind of microphone structure of side inlet hole, is applied under the technique of PCB stackings, the Mike
Wind structure includes：
First pcb board；
Second pcb board, is arranged at the top (first direction) of first pcb board, passes through
Column is fixedly connected with first pcb board, forms cavity；And
Bar-shaped trough is provided with second pcb board, the bar-shaped trough is in second pcb board
Side (second direction) be provided with side inlet hole so that sound is entered by the side inlet hole
In second pcb board；First direction is vertical with second direction；
Sensor, is connected with second pcb board, is arranged in the cavity, to described
Sound in two pcb boards is identified.
Preferably, the microphone structure also includes：
IC-components, connect, to institute respectively at the sensor and second pcb board
The sound for stating sensor identification is processed.
Preferably, the microphone structure also includes：
Blind hole, is arranged on first pcb board, after PCB stacking techniques, institute
In stating the blind hole that the part of sensor is placed on first pcb board.
Preferably, the column is pcb board.
The beneficial effects of the invention are as follows：
The present invention opens up acoustic aperture in the side of microphone namely sensor so that sound can be from biography
The side of sensor is transmitted into sensor, increased the direction that microphone collects volume, is improved
Original limitation that sound can only be collected from sensor top.
Brief description of the drawings
Fig. 1 is a kind of structural representation of side inlet hole microphone of the invention.
Specific embodiment
It should be noted that in the case where not conflicting, following technical proposals, technical characteristic it
Between can be mutually combined.
Specific embodiment of the invention is further described below in conjunction with the accompanying drawings：
Present embodiments provide a kind of microphone structure of side inlet hole, microphone of the prior art
Acoustic aperture be generally located on the top of sensor, cause sound to be merely able to draw from above sensor
Enter, this can cause that the space of microphone occupancy in the electronic device is subject to certain restrictions, together
When microphone multi-direction radio reception in itself development also can be somewhat limited, asked for these
Topic, the microphone of the present embodiment collects sound in the side of microphone, so as to expand the receipts of sound
Collection direction.
As shown in figure 1, the microphone of the present embodiment includes the first pcb board and the second pcb board,
First pcb board is connected with the second pcb board by column, and the first pcb board is arranged at
The top of the second pcb board, by the company of column between the first pcb board and the second pcb board
Connecing can form a cavity, and further, its central post can also be pcb board, this reality
Apply in the technique that example can apply to PCB stackings, blind hole is provided with the first pcb board, the
Integrated circuit (IC) device and sensor are connected with two pcb boards, it is necessary to illustrate,
Integrated circuit and sensor may be contained within the sky formed between the first pcb board and the second pcb board
In chamber, in the technique of PCB stackings, a part for sensor is arranged at the first pcb board
Blind hole in, can so save the thickness of the pcb board of stacking.
Sensor in the present embodiment is connected with the electronic circuit in integrated circuit, second
A bar-shaped trough is provided with pcb board, the opening of bar-shaped trough towards the side of sensor, the bar shaped
Groove is, as acoustic aperture, to be used to collect sound.Opening on bar-shaped trough can be referred to as side inlet hole,
The direction of so-called side inlet hole refers to the side of the second pcb board, illustrates and is：2nd PCB
Located at the top of the first pcb board, this direction can be regarded as first direction, side inlet hole to plate
Direction in the side of the second pcb board, this direction can be regarded as second direction, first
Direction can be vertical relation with second direction.The direction of the side inlet hole in the present embodiment is intended to
Acoustic aperture is emphasized not in the top of the second pcb board, and specifically in which side of the second pcb board
Can be set as the case may be.Above-mentioned statement is as shown in Figure 1.
It should be noted that the side inlet hole (side PORT) in the present embodiment refers to bar-shaped trough
Opening be arranged at the side of sensor, and the other end of bar-shaped trough can be open, it is also possible to no
Opening.
In sum, the present invention opens up acoustic aperture in the side of microphone namely sensor so that sound
Sound can be transmitted into sensor from the side of sensor, increased the side that microphone collects volume
To, improve it is original can only from sensor top collect sound limitation.
By explanation and accompanying drawing, typical case's implementation of the ad hoc structure of specific embodiment is given
Example, based on spirit of the invention, can also make other conversions.Although foregoing invention proposes existing
Preferred embodiment, however, these contents be not intended as limitation.
For a person skilled in the art, after reading described above, various changes and modifications
Undoubtedly it will be evident that.Therefore, appending claims should regard as cover it is of the invention true
Whole variations and modifications of sincere figure and scope.It is any and all etc. in Claims scope
The scope and content of valency, are all considered as still belonging to the intent and scope of the invention.
Claims (4)
1. a kind of microphone structure of side inlet hole, it is characterised in that be applied to PCB stackings
Under technique, the microphone structure includes：
First pcb board；
Second pcb board, is arranged at the top of first pcb board, by column with it is described
First pcb board is fixedly connected, and forms cavity；And
Bar-shaped trough is provided with second pcb board, the bar-shaped trough is in second pcb board
Side be provided with side inlet hole so that sound by the side inlet hole enter the 2nd PCB
In plate；
Sensor, is connected with second pcb board, is arranged in the cavity, to described
Sound in two pcb boards is identified.
2. the microphone structure of side inlet hole according to claim 1, it is characterised in that institute
Stating microphone structure also includes：
IC-components, connect, to institute respectively at the sensor and second pcb board
The sound for stating sensor identification is processed.
3. the microphone structure of side inlet hole according to claim 1, it is characterised in that institute
Stating microphone structure also includes：
Blind hole, is arranged on first pcb board, after PCB stacking techniques, institute
In stating the blind hole that the part of sensor is placed on first pcb board.
4. the microphone structure of side inlet hole according to claim 1, it is characterised in that institute
Column is stated for pcb board.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201511018088.0A CN106937187A (en) | 2015-12-29 | 2015-12-29 | A kind of microphone structure of side inlet hole |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201511018088.0A CN106937187A (en) | 2015-12-29 | 2015-12-29 | A kind of microphone structure of side inlet hole |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN106937187A true CN106937187A (en) | 2017-07-07 |
Family
ID=59442320
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201511018088.0A Pending CN106937187A (en) | 2015-12-29 | 2015-12-29 | A kind of microphone structure of side inlet hole |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN106937187A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110781804A (en) * | 2019-10-23 | 2020-02-11 | 业成科技（成都）有限公司 | Optical image recognition device and manufacturing method thereof |
Citations (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR20080005801A (en) * | 2006-07-10 | 2008-01-15 | 주식회사 비에스이 | MEMS microphone packaging structure |
| TW200921058A (en) * | 2007-11-05 | 2009-05-16 | Ind Tech Res Inst | Sensor |
| CN102790939A (en) * | 2011-11-30 | 2012-11-21 | 宝星电子株式会社 | Microphone of microelectromechnical system |
| US20140079269A1 (en) * | 2012-09-20 | 2014-03-20 | Iwon CHOI | Mobile terminal |
| US20140193018A1 (en) * | 2013-01-07 | 2014-07-10 | Samsung Electronics Co., Ltd. | Electronic device having sensor for detecting external environment |
| WO2015015646A1 (en) * | 2013-08-02 | 2015-02-05 | 共栄エンジニアリング株式会社 | Microphone cover and sound pickup device |
| TW201515985A (en) * | 2013-05-31 | 2015-05-01 | Heptagon Micro Optics Pte Ltd | MEMS microphone modules and wafer-level techniques for fabricating the same |
| CN205490998U (en) * | 2015-12-29 | 2016-08-17 | 钰太芯微电子科技（上海）有限公司 | Microphone structure of side suction hole |
-
2015
- 2015-12-29 CN CN201511018088.0A patent/CN106937187A/en active Pending
Patent Citations (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR20080005801A (en) * | 2006-07-10 | 2008-01-15 | 주식회사 비에스이 | MEMS microphone packaging structure |
| TW200921058A (en) * | 2007-11-05 | 2009-05-16 | Ind Tech Res Inst | Sensor |
| CN102790939A (en) * | 2011-11-30 | 2012-11-21 | 宝星电子株式会社 | Microphone of microelectromechnical system |
| US20140079269A1 (en) * | 2012-09-20 | 2014-03-20 | Iwon CHOI | Mobile terminal |
| US20140193018A1 (en) * | 2013-01-07 | 2014-07-10 | Samsung Electronics Co., Ltd. | Electronic device having sensor for detecting external environment |
| TW201515985A (en) * | 2013-05-31 | 2015-05-01 | Heptagon Micro Optics Pte Ltd | MEMS microphone modules and wafer-level techniques for fabricating the same |
| WO2015015646A1 (en) * | 2013-08-02 | 2015-02-05 | 共栄エンジニアリング株式会社 | Microphone cover and sound pickup device |
| CN205490998U (en) * | 2015-12-29 | 2016-08-17 | 钰太芯微电子科技（上海）有限公司 | Microphone structure of side suction hole |
Non-Patent Citations (1)
| Title |
|---|
| 门刚: "《精通Protel DXP 模块范例篇》", 中国青年出版社, pages: 280 * |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110781804A (en) * | 2019-10-23 | 2020-02-11 | 业成科技（成都）有限公司 | Optical image recognition device and manufacturing method thereof |
| CN110781804B (en) * | 2019-10-23 | 2023-06-02 | 业泓科技(成都)有限公司 | Manufacturing method of optical image identification device |
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| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| RJ01 | Rejection of invention patent application after publication |
Application publication date: 20170707 |
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| RJ01 | Rejection of invention patent application after publication |