CN106935735B - Production method, display base plate and the display device of display base plate - Google Patents
Production method, display base plate and the display device of display base plate Download PDFInfo
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- CN106935735B CN106935735B CN201710334266.3A CN201710334266A CN106935735B CN 106935735 B CN106935735 B CN 106935735B CN 201710334266 A CN201710334266 A CN 201710334266A CN 106935735 B CN106935735 B CN 106935735B
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- 238000004519 manufacturing process Methods 0.000 title claims abstract description 40
- 239000000758 substrate Substances 0.000 claims abstract description 52
- 238000007641 inkjet printing Methods 0.000 claims abstract description 35
- 238000000034 method Methods 0.000 claims abstract description 20
- 239000000463 material Substances 0.000 claims description 34
- 230000005540 biological transmission Effects 0.000 claims description 14
- 230000015572 biosynthetic process Effects 0.000 claims description 12
- 238000002347 injection Methods 0.000 claims description 12
- 239000007924 injection Substances 0.000 claims description 12
- 229920001296 polysiloxane Polymers 0.000 claims description 8
- 238000007639 printing Methods 0.000 claims description 7
- 239000004642 Polyimide Substances 0.000 claims description 5
- 229920001721 polyimide Polymers 0.000 claims description 5
- 239000004952 Polyamide Substances 0.000 claims description 3
- 238000003682 fluorination reaction Methods 0.000 claims description 3
- 229920002647 polyamide Polymers 0.000 claims description 3
- 150000002466 imines Chemical class 0.000 claims description 2
- 238000005516 engineering process Methods 0.000 abstract description 11
- 229920002120 photoresistant polymer Polymers 0.000 description 4
- 238000000151 deposition Methods 0.000 description 3
- 239000000243 solution Substances 0.000 description 3
- KAKZBPTYRLMSJV-UHFFFAOYSA-N Butadiene Chemical compound C=CC=C KAKZBPTYRLMSJV-UHFFFAOYSA-N 0.000 description 2
- KAESVJOAVNADME-UHFFFAOYSA-N Pyrrole Chemical compound C=1C=CNC=1 KAESVJOAVNADME-UHFFFAOYSA-N 0.000 description 2
- YTPLMLYBLZKORZ-UHFFFAOYSA-N Thiophene Chemical compound C=1C=CSC=1 YTPLMLYBLZKORZ-UHFFFAOYSA-N 0.000 description 2
- 230000008021 deposition Effects 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- 238000005401 electroluminescence Methods 0.000 description 2
- 230000002209 hydrophobic effect Effects 0.000 description 2
- 239000004973 liquid crystal related substance Substances 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 229910000480 nickel oxide Inorganic materials 0.000 description 2
- 238000007738 vacuum evaporation Methods 0.000 description 2
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 description 1
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 1
- 239000004411 aluminium Substances 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- 150000001716 carbazoles Chemical class 0.000 description 1
- 238000006243 chemical reaction Methods 0.000 description 1
- 235000015111 chews Nutrition 0.000 description 1
- 230000009194 climbing Effects 0.000 description 1
- 238000000576 coating method Methods 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- 229910021389 graphene Inorganic materials 0.000 description 1
- 230000005525 hole transport Effects 0.000 description 1
- 150000007857 hydrazones Chemical class 0.000 description 1
- MRNHPUHPBOKKQT-UHFFFAOYSA-N indium;tin;hydrate Chemical compound O.[In].[Sn] MRNHPUHPBOKKQT-UHFFFAOYSA-N 0.000 description 1
- 238000009413 insulation Methods 0.000 description 1
- 239000012528 membrane Substances 0.000 description 1
- GNRSAWUEBMWBQH-UHFFFAOYSA-N oxonickel Chemical compound [Ni]=O GNRSAWUEBMWBQH-UHFFFAOYSA-N 0.000 description 1
- 229920000548 poly(silane) polymer Polymers 0.000 description 1
- 239000002861 polymer material Substances 0.000 description 1
- 150000003219 pyrazolines Chemical class 0.000 description 1
- 229910052709 silver Inorganic materials 0.000 description 1
- 239000004332 silver Substances 0.000 description 1
- 150000003384 small molecules Chemical class 0.000 description 1
- 238000004528 spin coating Methods 0.000 description 1
- 238000005507 spraying Methods 0.000 description 1
- 238000001931 thermography Methods 0.000 description 1
- 239000005439 thermosphere Substances 0.000 description 1
- 229930192474 thiophene Natural products 0.000 description 1
- 125000005259 triarylamine group Chemical class 0.000 description 1
- AAAQKTZKLRYKHR-UHFFFAOYSA-N triphenylmethane Chemical class C1=CC=CC=C1C(C=1C=CC=CC=1)C1=CC=CC=C1 AAAQKTZKLRYKHR-UHFFFAOYSA-N 0.000 description 1
- 230000000007 visual effect Effects 0.000 description 1
Classifications
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
- H10K59/10—OLED displays
- H10K59/12—Active-matrix OLED [AMOLED] displays
- H10K59/122—Pixel-defining structures or layers, e.g. banks
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
- H10K71/10—Deposition of organic active material
- H10K71/12—Deposition of organic active material using liquid deposition, e.g. spin coating
- H10K71/13—Deposition of organic active material using liquid deposition, e.g. spin coating using printing techniques, e.g. ink-jet printing or screen printing
- H10K71/135—Deposition of organic active material using liquid deposition, e.g. spin coating using printing techniques, e.g. ink-jet printing or screen printing using ink-jet printing
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- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Electroluminescent Light Sources (AREA)
Abstract
The invention discloses a kind of production method of display base plate, display base plate and display devices, belong to field of display technology.Method includes providing underlay substrate；The first pixel defining layer is formed, underlay substrate is divided into multiple pixel units by pixel defining layer；Form the first light emitting element layer；Sequentially form the second light emitting element layer of multilayer, further include forming the first light emitting element layer and forming at least step carried out between the second light emitting element layer of the last layer: forming the second pixel defining layer, second pixel defining layer is fallen in the first pixel defining layer in the orthographic projection of the first pixel defining layer, and the surfacial pattern of the separate underlay substrate of the second pixel defining layer is consistent with the surfacial pattern of separate underlay substrate of the first pixel defining layer；In the same pixel unit, the first light emitting element layer and multiple second light emitting element layers are formed as a part of the same Organic Light Emitting Diode.The production method of display base plate of the invention can be effectively reduced the risk of ink-jet printing media overflow.
Description
Technical field
The present invention relates to field of display technology, and in particular to a kind of production method of display base plate, a kind of display base plate with
And a kind of display device including the display base plate.
Background technique
In general, organic electroluminescence device (OrganicLightEmittingDiode, OLED) is relative to liquid crystal display
Device (Liquid Crystal Display, LCD) has that self-luminous, reaction is fast, visual angle is wide, brightness is high, color is gorgeous, frivolous etc. excellent
Point, it is considered to be next-generation display technology.
Organic electroluminescence device (OLED) membrane deposition method mainly has vacuum evaporation and two kinds of solution process.Wherein,
Vacuum evaporation is suitable for small organic molecule, forms a film uniformly good, technology relative maturity but equipment investment is big, stock utilization
It is low, large size product exposure mask aligning accuracy is low.Solution process mainly includes spin coating, inkjet printing, nozzle coating method etc., is suitable for
Polymer material and soluble small molecule, feature equipment cost is low, and it is prominent to produce upper advantage in extensive, large scale.Especially
Inkjet printing technology, can by solution accurately ink-jet into pixel region, formed organic film.
But in traditional inkjet printing technology, there can be ink droplet when carrying out inkjet printing and not fall vertically, print to
Above pixel defining layer, the pixel defining layer of lyophoby is polluted, its lyophoby ability is reduced.Secondly, ink can be climbed in pixel
It onto pixel defining layer, can also increase the risk of ink overflow, ink is caused to overflow in adjacent pixel region.
Therefore, it is urgently to be resolved as this field how to design a kind of production method that can effectively prevent ink overflow
Technical problem.
Summary of the invention
The present invention is directed at least solve one of the technical problems existing in the prior art, a kind of system of display base plate is proposed
Make method, a kind of display base plate and a kind of display device including the display base plate.
To achieve the goals above, the first aspect of the present invention provides a kind of production method of display base plate, the side
Method includes:
Underlay substrate is provided；
The first pixel defining layer is formed, the underlay substrate is divided into multiple pixel units by the pixel defining layer；
Form the first light emitting element layer；
Sequentially form the second light emitting element layer of multilayer, wherein the method also includes forming first light-emitting component
At least step carried out between second light emitting element layer described in layer and formation the last layer:
The second pixel defining layer is formed, second pixel defining layer is fallen in the orthographic projection of first pixel defining layer
In first pixel defining layer, and the surfacial pattern and described the far from the underlay substrate of second pixel defining layer
The surfacial pattern far from the underlay substrate of one pixel defining layer is consistent；
Wherein, in the same pixel unit, first light emitting element layer and multiple second light emitting element layers
Be formed as a part of the same Organic Light Emitting Diode.
Preferably, first light emitting element layer is hole injection layer, and the second light emitting element layer described in multilayer respectively includes
Hole transmission layer and luminescent layer, described the step of sequentially forming the second light emitting element layer of multilayer include:
The second pixel defining layer is formed on the surface away from the underlay substrate of first pixel defining layer；
Using hole mobile material as ink-jet printing media, printing forms hole transmission layer；
Third pixel defining layer is formed on the surface away from first pixel defining layer of second pixel defining layer；
Using luminescent material as ink-jet printing media, printing forms luminescent layer.
Preferably, second pixel defining layer and/or the third pixel defining layer with a thickness of 5-100nm.
Preferably, second pixel defining layer and/or the third pixel defining layer with a thickness of 10-50nm.
Preferably, the surface away from the underlay substrate in first pixel defining layer forms the second pixel circle
Given layer, and third pixel defining layer is formed on the surface away from first pixel defining layer of second pixel defining layer
The step of include:
Second pixel defining layer is transferred to the surface of the first pixel defining layer using heat-transferring method；
Third pixel defining layer is transferred to the surface of the second pixel defining layer using heat-transferring method.
Preferably, the material of second pixel defining layer and/or the third pixel defining layer includes that fluorination polyamides is sub-
Amine or silicone materials.
The second aspect of the present invention provides a kind of display base plate, and the display base plate includes underlay substrate, is formed in institute
The first pixel defining layer on underlay substrate is stated, the underlay substrate is divided into multiple pixel units by the pixel defining layer；
The first light emitting element layer being formed on the underlay substrate；
The second light emitting element layer of multilayer being sequentially formed above first light emitting element layer；
Wherein, second is also formed between the second light emitting element layer described in first light emitting element layer and the last layer
Pixel defining layer, second pixel defining layer fall in first pixel in the orthographic projection of first pixel defining layer and define
In layer, and the surfacial pattern far from the underlay substrate of second pixel defining layer is remote with first pixel defining layer
Surfacial pattern from the underlay substrate is consistent；
Wherein, in the same pixel unit, first light emitting element layer and multiple second light emitting element layers
Be formed as a part of the same Organic Light Emitting Diode.
Preferably, first light emitting element layer is hole injection layer, and the second light emitting element layer described in multilayer respectively includes
Hole transmission layer and luminescent layer, wherein the hole transmission layer is between the hole injection layer and the luminescent layer.
Preferably, second pixel defining layer is made of fluorinated polyimide or silicone materials.
The third aspect of the present invention provides a kind of display device, and the display device includes display base plate, the display
Substrate includes previously described display base plate
The production method of display base plate of the invention is included in form the in the step of forming the second light emitting element layer of multilayer
At least step carried out between one light emitting element layer and formation the second light emitting element layer of the last layer forms the second pixel and defines
Layer, which falls in first pixel defining layer in the orthographic projection of first pixel defining layer, and institute
State the surfacial pattern far from the underlay substrate of the second pixel defining layer and the separate lining of first pixel defining layer
The surfacial pattern of substrate is consistent.Therefore, the production method of display base plate of the invention forms multilayer second using inkjet printing
It when light emitting element layer, even if there are ink droplets not to fall vertically, prints to above the first pixel defining layer, by the first picture of the lyophoby
Element defines layer pollution, the lyophoby ability of first pixel defining layer is reduced, alternatively, ink-jet printing media is climbed in pixel unit
To the first pixel defining layer surface, ink-jet printing media is caused to overflow in adjacent pixel unit, also due to the production method
It is formed with the second pixel defining layer, therefore, the function of the first pixel defining layer can be served as by being formed by the second pixel defining layer,
It can be effectively reduced the risk of ink-jet printing media overflow.
Display base plate of the invention is made to be formed of the production method of above-mentioned display base plate, due to the display base plate packet
Include the second light emitting element layer of multilayer being sequentially formed above the first light emitting element layer, and the first light emitting element layer and last
It is also formed with the second pixel defining layer between the second light emitting element layer of layer, therefore, is making the structure using inkjet printing technology
Display base plate when, can effectively avoid ink-jet media to pollution caused by pixel defining layer, the overflow of caused ink-jet media
Problem improves the production yield of the display base plate.
The display base plate of display device of the invention, the display base plate with above structure, the structure can be by above
The production method of the display base plate of record makes to be formed, since above-mentioned display base plate includes being sequentially formed at the first light emitting element layer
The second light emitting element layer of multilayer of top, and also formed between the second light emitting element layer of the first light emitting element layer and the last layer
There is the second pixel defining layer, therefore, when making the display base plate of the structure using inkjet printing technology, can effectively avoid spraying
Black medium is polluted to caused by pixel defining layer, the flooding problems of caused ink-jet media, and the production for improving the display device is good
Rate.
Detailed description of the invention
The drawings are intended to provide a further understanding of the invention, and constitutes part of specification, with following tool
Body embodiment is used to explain the present invention together, but is not construed as limiting the invention.In the accompanying drawings:
Fig. 1 is the process flow chart of display base plate in first embodiment of the invention；
Fig. 2 a to Fig. 2 f is the structural schematic diagram that display base plate is made in second embodiment of the invention；
Fig. 3 is the structural schematic diagram of the first pixel defining layer and pixel unit in third embodiment of the invention.
Description of symbols
100: display base plate；
110: underlay substrate；
120: the first pixel defining layers；
130: the first light emitting element layers；
140: the second light emitting element layers；
141: hole transmission layer；
142: luminescent layer；
150: the second pixel defining layers；
160: third pixel defining layer；
170: anode layer；
180: pixel unit.
Specific embodiment
Below in conjunction with attached drawing, detailed description of the preferred embodiments.It should be understood that this place is retouched
The specific embodiment stated is merely to illustrate and explain the present invention, and is not intended to restrict the invention.
With reference to Fig. 1, Fig. 2 a to Fig. 2 f and Fig. 3.The first aspect of the present invention is related to a kind of production of display base plate 100
Method S100.Wherein, this method S100 includes:
S110, underlay substrate 110 is provided.
Specifically, as shown in Figure 2 a, which can be transparent glass substrate, and the underlay substrate 110 is in shape
When at the first following pixel defining layers 120, anode layer 170 is formd, the material of the anode layer 170 usually can choose
The transparent or semitransparent conduction material that the high function such as tin indium oxide (ITO), silver (Ag), nickel oxide (NiO), aluminium (Al) or graphene are contained
Material, for how to form the anode layer 170 on underlay substrate 110, same as the prior art, therefore not to repeat here.
S120, the first pixel defining layer 120 is formed, underlay substrate 110 is divided into multiple pixel lists by pixel defining layer 120
Member 180.
Specifically, as shown in Figure 2 a, first pixel defining layer 120 is formed after foring anode layer, first pixel
It defines layer 120 and underlay substrate 110 is divided into multiple pixel units 180.
More specifically, form the manufacture craft of first pixel defining layer 120, for example, can by way of deposition system
Formed, deposit the first pixel defining layer film and photoresist on the surface of anode layer, be exposure mask using photoresist, etch this
One pixel defining layer film, to form the first required pixel defining layer 120.
It should be noted that the material of the first pixel defining layer 120 is should be with hydrophobic material, in inkjet printing
In the process, there is hydrophobic material can limit ink-jet printing media to overflow in adjacent pixel unit 180.
S130, the first light emitting element layer 130 is formed.
Specifically, as shown in Figure 2 b, which can be hole injection layer, i.e., with hole injection layer
For ink-jet printing media, printing forms first light emitting element layer 130.
Sequentially form the second light emitting element layer of multilayer 140.
Wherein, above-mentioned production method S100 further include:
In step S130 and form at least step carried out between the second light emitting element layer of the last layer 140:
The second pixel defining layer 150 is formed, orthographic projection of second pixel defining layer 150 in the first pixel defining layer 120
It falls in the first pixel defining layer 120, and the surfacial pattern of the separate underlay substrate 110 of second pixel defining layer 150 and
The surfacial pattern of the separate underlay substrate 110 of one pixel defining layer 120 is consistent.
Specifically, the manufacture craft for forming second pixel defining layer 150 can be with the first pixel defining layer 120 of formation
Manufacture craft is identical, i.e., is exposure mask using photoresist by deposition the second pixel defining layer film and photoresist, etch this second
Pixel defining layer film, to form the second required pixel defining layer 150.It should it is, of course, also possible to be formed in other way
Second pixel defining layer 150.
It should be understood that the step of above-mentioned the second pixel defining layer of formation 150, can be every next layer second of formation and send out
One layer of second pixel defining layer 150 is respectively formed before element layer 140.It is also possible to forming the second light-emitting component of the last layer
Layer 140 before formed one layer of second pixel defining layer 150, it is, of course, also possible to be formed first layer light emitting element layer 140 it
Before, namely form one layer of second pixel defining layer 150 of formation after the first light emitting element layer 130.It is, of course, also possible to be other
Performance.
Wherein, in the same pixel unit 180, the first light emitting element layer 130 and the formation of multiple second light emitting element layers 140
For a part of the same Organic Light Emitting Diode.
It is included in the step of production method of the display base plate of the present embodiment, formation the second light emitting element layer of multilayer 140
It forms the first light emitting element layer 130 and forms at least step carried out between the second light emitting element layer of the last layer 140, formed
Second pixel defining layer 150.Therefore, the production method of the display base plate of this implementation forms multilayer second using inkjet printing and sends out
It when element layer 140, even if there are ink droplets not to fall vertically, prints to above the first pixel defining layer 120, by the of the lyophoby
The pollution of one pixel defining layer 120, reduces the lyophoby ability of first pixel defining layer 120, alternatively, ink-jet printing media is in pixel
Climbing causes ink-jet printing media to overflow in adjacent pixel unit 180 to the first pixel defining layer surface in unit, due to
The production method is also formed with the second pixel defining layer 150, and therefore, can be served as by being formed by the second pixel defining layer 150
The function of one pixel defining layer 120, can be effectively reduced the risk of ink-jet printing media overflow.
Preferably, above-mentioned first light emitting element layer 130 is hole injection layer, and the second light emitting element layer of multilayer 140 wraps respectively
Include hole transmission layer 141 and luminescent layer 142.Above-mentioned the step of sequentially forming the second light emitting element layer of multilayer 140 includes:
S140, the second pixel defining layer 150 is formed on the surface away from underlay substrate 110 of the first pixel defining layer 120.
That is, as shown in Figure 2 c, forming second pixel defining layer 150 at the top of the first pixel defining layer 120.
The production method for being specifically form second pixel defining layer 150 can be with reference to above for the note of the first pixel defining layer 120
It carries, therefore not to repeat here.
S150, using hole mobile material as ink-jet printing media, printing form hole transmission layer 141.
Specifically, as shown in Figure 2 d, hole mobile material, for example, it may be poly-phenylene vinylene (ppv) (PPv) class, poly- thiophene
Pheno class, triphenylmethane, tri-arylamine group, hydrazone class, pyrazolines, chews azole, carbazoles, butadiene type etc. at polysilanes.When
So, it is also possible to other kinds of hole mobile material, is not limited thereto.
S160, defining away from the surface of the first pixel defining layer 120 formation third pixel in the second pixel defining layer 150
Layer 160.
That is, as shown in Figure 2 e, forming the third pixel defining layer 160 at the top of the second pixel defining layer 150.
The production method for being specifically form the third pixel defining layer 160 can be with reference to above for the note of the first pixel defining layer 120
It carries, therefore not to repeat here.
S170, using luminescent material as ink-jet printing media, printing form luminescent layer 142, as shown in figure 2f.
In the production method of the display base plate of the present embodiment, before one layer of second light emitting element layer 140 of every formation, for example,
Hole transmission layer 141 or luminescent layer 142 are initially formed one layer of second pixel defining layer 150 or third pixel defining layer 160, because
This, the generation for phenomena such as capable of further preventing ink-jet printing media overflow from polluting caused by adjacent pixel unit.
Preferably, above-mentioned second pixel defining layer 150 and/or third pixel defining layer 160 with a thickness of 5-100nm.
The production method of the display base plate of the present embodiment, to the second pixel defining layer 150 and/or third pixel defining layer
160 thickness range is defined, the pixel defining layer in the thickness range, and ink-jet printing media can be effectively prevent to overflow
Stream, is effectively ensured the lyophoby ability of pixel defining layer.
Preferably, above-mentioned second pixel defining layer 150 and/or third pixel defining layer 160 with a thickness of 10-50nm.
The production method of the display base plate of the present embodiment, to the second pixel defining layer 150 and third pixel defining layer 160
Thickness range is further limited, and the pixel defining layer in the thickness range can effectively prevent inkjet printing to be situated between
The lyophoby ability of pixel defining layer is effectively ensured in matter overflow.
Preferably, the step of forming the second pixel defining layer 150 in above-mentioned steps S140 and is formed in step S160
The step of three pixel defining layer 160 includes:
Second pixel defining layer 150 is transferred to the surface of the first pixel defining layer 120 using heat-transferring method.
Third pixel defining layer 160 is transferred to the surface of the second pixel defining layer 150 using heat-transferring method.
Specifically, it can use laser thermal transfer (Laser Induced Thermal Imaging, LITI) and form second
Pixel defining layer 150 and third pixel defining layer 160.Specifically, the structure of the laser thermal transfer may include substrate, be located at
Heat insulation layer and heat-sink shell on substrate, wherein the material for needing to transfer (forms 150 He of the second pixel defining layer in the present invention
The material of third pixel defining layer 160) in the surface of heat-sink shell formation organic film, it is heated by the orientation of laser, so that inhaling
Organic film removing above thermosphere is transferred to presumptive area (namely top and the second pixel circle of the first pixel defining layer 120
The top of given layer 150).
The production method of the display base plate of the present embodiment, the second pixel defining layer required for being formed using heat-transferring method
150 and third pixel defining layer 160 structure, can further improve inkjet printing precision, reduce ink-jet printing media
Overflow.
Preferably, the material of above-mentioned second pixel defining layer 150 and/or third pixel defining layer 160 includes fluorination polyamides
Imines or silicone materials.
The production method of the display base plate of the present embodiment is to above-mentioned second pixel defining layer 150 and/or third pixel circle
The restriction that the specific making material of given layer 160 carries out.Wherein, shape made by fluorinated polyimide or the silicone materials materials
At pixel defining layer, have preferable lyophoby performance, can further effectively prevent ink-jet printing media overflow.
The second aspect of the present invention is related to a kind of display base plate 100, as shown in Fig. 2 a to Fig. 2 f and Fig. 3.Wherein, should
Display base plate 100 includes underlay substrate 110, the first pixel defining layer 120 being formed on underlay substrate 110, pixel defining layer
Underlay substrate 110 is divided into multiple pixel units 180 by 120.
Above-mentioned display base plate 100 further includes the first light emitting element layer 130 being formed on underlay substrate 110.
Above-mentioned display base plate 100 further includes the luminous member of multilayer second for being sequentially formed at 130 top of the first light emitting element layer
Part layer 140.Wherein, the second picture is also formed between the first light emitting element layer 130 and the second light emitting element layer of the last layer 140
Element defines layer 150, which falls in the first pixel defining layer in the orthographic projection of the first pixel defining layer 120
In 120, and the surfacial pattern of the separate underlay substrate 110 of second pixel defining layer 150 is remote with the first pixel defining layer 120
Surfacial pattern from underlay substrate 110 is consistent.Wherein, in the same pixel unit, the first light emitting element layer 130 and multiple second
Light emitting element layer 140 is formed as a part of the same Organic Light Emitting Diode.
It should be understood that the content as documented by first technical theme of the invention, on the underlay substrate 110
It should include also anode layer 170, remaining light emitting element layer and pixel defining layer are formed on the surface of the anode layer 170.
The display base plate 100 of the present embodiment structure, can be using the production method production shape for the display base plate recorded above
At.Since the display base plate 100 of the present embodiment structure includes the multilayer second for being sequentially formed at 130 top of the first light emitting element layer
Light emitting element layer 140, and is also formed between the first light emitting element layer 130 and the second light emitting element layer of the last layer 140
Therefore two pixel defining layers 150 when being made the display base plate 100 of the structure using inkjet printing technology, can be avoided effectively
Ink-jet media is polluted to caused by pixel defining layer, and the flooding problems of caused ink-jet media improve the system of the display base plate 100
Make yield.
Preferably, above-mentioned first light emitting element layer 130 is hole injection layer, and the second light emitting element layer of multilayer 140 wraps respectively
Include hole transmission layer 141 and luminescent layer 142, wherein hole transmission layer 141 is between hole injection layer and luminescent layer 142.
The display base plate 100 of the present embodiment structure is oled display substrate, is making the structure using inkjet printing technology
When the oled display substrate of form, hole injection layer material, hole transport layer material and emitting layer material can be effectively prevent to lead
Addressed pixel defines the pollution of layer, therefore, can effectively avoid ink-jet printing media overflow from polluting adjacent pixel unit 180
Phenomena such as generation, improve the production yield of the display base plate 100.
Preferably, above-mentioned second pixel defining layer 150 is made of fluorinated polyimide or silicone materials.
The display base plate of the present embodiment is the restriction carried out to the specific making material of above-mentioned second pixel defining layer 150.
Wherein, fluorinated polyimide or the made pixel defining layer formed of the silicone materials material, have preferable lyophobicity
Can, it can further effectively prevent ink-jet printing media overflow.
The third aspect of the present invention is related to a kind of display device (not showing that in figure), and display device includes display base plate,
Display base plate includes the display base plate 100 recorded above.
The display device of this implementation structure, the display base plate 100 with above structure, the display base plate 100 of the structure can
It makes to be formed with the production method by the display base plate 100 recorded above, since above-mentioned display base plate 100 includes sequentially forming
The second light emitting element layer of multilayer 140 above the first light emitting element layer 130, and the first light emitting element layer 130 and last
It is also formed with the second pixel defining layer 150 between the second light emitting element layer 140 of layer, therefore, is made using inkjet printing technology
When the display base plate 100 of the structure, it can effectively avoid ink-jet media to pollution caused by pixel defining layer, caused ink-jet is situated between
The flooding problems of matter improve the production yield of the display device.
It is understood that the principle that embodiment of above is intended to be merely illustrative of the present and the exemplary implementation that uses
Mode, however the present invention is not limited thereto.For those skilled in the art, essence of the invention is not being departed from
In the case where mind and essence, various changes and modifications can be made therein, these variations and modifications are also considered as protection scope of the present invention.
Claims (10)
1. a kind of production method of display base plate, which is characterized in that the described method includes:
Underlay substrate is provided；
The first pixel defining layer is formed, the underlay substrate is divided into multiple pixel units by the pixel defining layer；
Form the first light emitting element layer；
Sequentially form the second light emitting element layer of multilayer, wherein the method also includes:
One layer of second pixel defining layer, second pixel defining layer are respectively formed before every next the second light emitting element layer of layer of formation
It is fallen in first pixel defining layer in the orthographic projection of first pixel defining layer, and second pixel defining layer is remote
Surfacial pattern from the underlay substrate is consistent far from the surfacial pattern of the underlay substrate with first pixel defining layer；
Wherein, in the same pixel unit, first light emitting element layer and multiple second light emitting element layers are formed
For a part of the same Organic Light Emitting Diode.
2. manufacturing method according to claim 1, which is characterized in that first light emitting element layer is hole injection layer,
Second light emitting element layer described in multilayer respectively includes hole transmission layer and luminescent layer, described to sequentially form the second light-emitting component of multilayer
Layer the step of include:
The second pixel defining layer is formed on the surface away from the underlay substrate of first pixel defining layer；
Using hole mobile material as ink-jet printing media, printing forms hole transmission layer；
Third pixel defining layer is formed on the surface away from first pixel defining layer of second pixel defining layer；
Using luminescent material as ink-jet printing media, printing forms luminescent layer.
3. production method according to claim 2, which is characterized in that second pixel defining layer and/or the third
Pixel defining layer with a thickness of 5-100nm.
4. production method according to claim 3, which is characterized in that second pixel defining layer and/or the third
Pixel defining layer with a thickness of 10-50nm.
5. production method according to claim 2, which is characterized in that described to deviate from institute in first pixel defining layer
The surface for stating underlay substrate forms the second pixel defining layer, and deviates from first pixel in second pixel defining layer
Define layer surface formed third pixel defining layer the step of include:
Second pixel defining layer is transferred to the surface of the first pixel defining layer using heat-transferring method；
Third pixel defining layer is transferred to the surface of the second pixel defining layer using heat-transferring method.
6. production method according to claim 5, which is characterized in that second pixel defining layer and/or the third
The material of pixel defining layer includes fluorinated polyimide or silicone materials.
7. a kind of display base plate, which is characterized in that the display base plate includes underlay substrate, is formed on the underlay substrate
The underlay substrate is divided into multiple pixel units by the first pixel defining layer, the pixel defining layer；
The first light emitting element layer being formed on the underlay substrate；
The second light emitting element layer of multilayer being sequentially formed above first light emitting element layer；And
Every the second pixel defining layer for forming next layer second light emitting element layer and being respectively formed one layer before, second pixel
It defines layer to fall in first pixel defining layer in the orthographic projection of first pixel defining layer, and second pixel defines
The surfacial pattern far from the underlay substrate of layer and the exterior view far from the underlay substrate of first pixel defining layer
Shape is consistent；
Wherein, in the same pixel unit, first light emitting element layer and multiple second light emitting element layers are formed
For a part of the same Organic Light Emitting Diode.
8. display base plate according to claim 7, which is characterized in that first light emitting element layer is hole injection layer,
Second light emitting element layer described in multilayer respectively includes hole transmission layer and luminescent layer, wherein the hole transmission layer is located at described
Between hole injection layer and the luminescent layer.
9. display base plate according to claim 7 or 8, which is characterized in that second pixel defining layer is by fluorination polyamides
Imines or silicone materials are made.
10. a kind of display device, the display device includes display base plate, which is characterized in that the display base plate includes right
It is required that display base plate described in 7 to 9 any one.
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| CN107221291B (en) * | 2017-07-31 | 2019-04-23 | 上海天马微电子有限公司 | Display substrate, display panel, driving method of display panel and display device |
| CN107644951A (en) * | 2017-10-20 | 2018-01-30 | 东莞理工学院 | A kind of preparation method of printed OLED display screen |
| CN109273509B (en) * | 2018-10-15 | 2021-03-16 | 深圳市华星光电半导体显示技术有限公司 | flexible display device |
| CN112635692B (en) * | 2021-01-05 | 2022-07-12 | Tcl华星光电技术有限公司 | Display panel and preparation method thereof |
| CN113437119A (en) * | 2021-06-10 | 2021-09-24 | 深圳市华星光电半导体显示技术有限公司 | Display panel, manufacturing method thereof and display device |
| CN113363406A (en) * | 2021-06-25 | 2021-09-07 | 安徽熙泰智能科技有限公司 | Spin coating method suitable for Micro OLED and Micro OLED structure |
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