CN106935734B - Inspection device, vacuum drying device and control method of vacuum drying device - Google Patents

Abstract

The present invention provides an inspection device, a reduced-pressure drying device, and a control method of the reduced-pressure drying device, capable of early detection of the drying state of a coated area of a substrate coated with an organic material. An inspection device according to one embodiment includes an imaging unit and a dry state detection unit. The imaging unit captures an image of a coated area of the substrate on which the organic material is applied. The dry state detection unit detects the dry state of the applied area based on the color density of the applied area captured by the imaging unit.

Description

Inspection device, vacuum drying device and control method of vacuum drying device

technical field

Embodiments of the present invention relate to an inspection device, a reduced-pressure drying device, and a control method of the reduced-pressure drying device.

Background technique

Conventionally, an organic light emitting diode (OLED: Organic Light Emitting Diode), which is a light emitting diode that utilizes organic EL (Electroluminescence: electroluminescence) to emit light, is known. An organic EL display using an organic light emitting diode is not only thin, lightweight, and low in power consumption, but also has the advantages of being excellent in response speed, viewing angle, and contrast. Therefore, in recent years, it has attracted attention as a next-generation flat panel display (FPD).

An organic light emitting diode has a structure in which an organic EL layer is sandwiched between an anode and a cathode on a substrate. The organic EL layer is formed by stacking, for example, a hole injection layer, a hole transport layer, a light emitting layer, an electron transport layer, and an electron injection layer in this order from the anode side. In such a stacked structure, for example, a hole injection layer, a hole transport layer, and a light emitting layer are formed by spraying an organic material on a substrate and drying the substrate coated with the organic material under a reduced pressure environment. (For example, refer to Patent Document 1).

However, the above-mentioned drying time until the completion of drying varies depending on various factors such as the type and amount of the organic material coated on the substrate, the surface state of the substrate, and the like. Therefore, for example, in the case of mass-producing organic light emitting diodes, it is necessary to set an optimum drying time in advance.

In conventional techniques, for example, a large number of samples are produced while changing the time for performing the drying treatment little by little, and the film thickness and optical properties of each layer of the produced samples are measured. Then, in the case of a sample in which a good measurement result was obtained, it is judged that drying has been reliably completed, and the time of drying treatment for such a sample is set as an optimum drying time.

prior art literature

patent documents

Patent Document 1: Japanese Patent Laid-Open No. 2000-181079

Contents of the invention

The technical problem that the invention wants to solve

However, in the prior art, it takes a lot of time to detect the drying state of the substrate by measuring the film thickness and optical characteristics after the sample is prepared. Therefore, in the prior art, there is still room for improvement in detecting the drying state of the substrate at an early stage.

An object of one embodiment of the present invention is to provide an inspection device, a reduced-pressure drying device, and a control method for a reduced-pressure drying device capable of early detection of a drying state of a coating region of a substrate coated with an organic material.

Technical solutions for technical problems

An inspection device according to one aspect of the embodiment includes an imaging unit and a dry state detection unit. The imaging unit captures an image of a coating area on the substrate where the organic material is coated. The dry state detecting unit detects the dry state of the applied area based on the color density of the applied area captured by the imaging unit.

Invention effect

According to one aspect of the embodiment, it is possible to detect the drying state of the coated region of the substrate where the organic material is coated at an early stage.

Description of drawings

FIG. 1 is a schematic cross-sectional view showing an outline of the structure of an organic light emitting diode.

FIG. 2 is a schematic plan view showing an outline of the structure of a bank of an organic light emitting diode.

FIG. 3 is a flowchart showing main steps in a method of manufacturing an organic light emitting diode.

FIG. 4 is a schematic plan view showing an outline of the configuration of the substrate processing system according to the present embodiment.

5A is a schematic cross-sectional view showing a substrate coated with an organic material for forming a hole injection layer.

5B is a schematic cross-sectional view showing a substrate dried under reduced pressure in a reduced-pressure drying apparatus.

6A is a schematic cross-sectional view showing a substrate coated with an organic material for forming a hole transport layer.

6B is a schematic cross-sectional view showing a substrate dried under reduced pressure in a reduced-pressure drying device.

7A is a schematic cross-sectional view showing a substrate coated with an organic material for forming a light emitting layer.

7B is a schematic cross-sectional view showing a substrate dried under reduced pressure in a reduced-pressure drying device.

Fig. 8 is a schematic plan view showing the configuration of the reduced-pressure drying device of the present embodiment.

FIG. 9 is a schematic cross-sectional view taken along line IX-IX of FIG. 8 .

Fig. 10 is a block diagram showing a control device.

FIG. 11 is a schematic enlarged view showing a part of a captured image captured by the imaging unit in an enlarged manner.

FIG. 12 is a graph showing the color density measured by the color density measuring unit in the reduced-pressure drying process.

13 is a flowchart showing a processing flow of processing for setting a drying time in a reduced-pressure drying device including the inspection device according to the present embodiment.

FIG. 14 is a graph showing the G color density in the application area of the peripheral portion and the application area of the central portion.

15 is a schematic enlarged cross-sectional view showing the vicinity of an imaging unit of an imaging unit according to a second embodiment.

Explanation of reference signs

11. 311 Filming Department

12. 312 Lighting Department

21 Application area

100 substrate handling system

121c, 122c, 123c Vacuum drying device

140 Controls

141 Control Department

141a Lighting Control Division

141b Shooting Control Unit

141c Image Acquisition Department

141d Color density measurement unit

141e Judgment Department

141f Dry state detection part

141g Decompression Control Unit

141h Lift control department

160 Substrate holding mechanism

161 Keeping Department

163 Lifting Department

170 decompression mechanism

200 Inspection device

400 polarizing filter

G substrate.

Detailed ways

Hereinafter, embodiments of the inspection device, the reduced-pressure drying device, and the control method for the reduced-pressure drying device disclosed in the present invention will be described in detail based on the drawings. In addition, this invention is not limited to embodiment shown below.

(first embodiment)

<1. Structure and Manufacturing Method of Organic Light Emitting Diode>

First, the outline of the structure of the organic light emitting diode and its manufacturing method will be described with reference to FIGS. 1 to 3 . FIG. 1 is a schematic cross-sectional view showing an outline of the configuration of an organic light emitting diode 500 . FIG. 2 is a schematic plan view showing a schematic configuration of a bank 540 of the organic light emitting diode 500 . FIG. 3 is a flowchart showing main steps of a method of manufacturing an organic light emitting diode 500 .

As shown in FIG. 1 , the organic light emitting diode 500 has a structure in which an organic EL layer 530 is sandwiched between an anode 510 and a cathode 520 on a glass substrate G (hereinafter referred to as “substrate G”) as a substrate.

The organic EL layer 530 is formed by stacking a hole injection layer 531 , a hole transport layer 532 , a light emitting layer 533 , an electron transport layer 534 , and an electron injection layer 535 sequentially from the anode 510 side.

Specifically, first, the anode 510 is formed on the substrate G in the anode formation process (step S101 in FIG. 3 ). The anode 510 is formed using, for example, a vapor deposition method. In addition, a transparent electrode made of, for example, ITO (Indium Tin Oxide: indium tin oxide) is used as the anode 510 .

Next, in a bank forming process (step S102 in FIG. 3 ), a bank 540 is formed on the anode 510 . The bank 540 is patterned into a predetermined pattern by, for example, photolithography or etching.

As shown in FIG. 2 , a plurality of banks 540 are formed in the row direction and the column direction. In addition, inside the bank 540, as will be described later, the organic EL layer 530 and the cathode 520 are stacked to form a pixel. In the bank 540, for example, a photosensitive polyimide resin is used.

Next, the organic EL layer 530 is formed on the anode 510 of the bank 540 . Specifically, in the hole injection layer forming process (step S103 in FIG. 3 ), the hole injection layer 531 is formed on the anode 510 . Then, in the hole transport layer forming process (step S104 in FIG. 3 ), the hole transport layer 532 is formed on the hole injection layer 531 .

Then, in the light emitting layer forming process (step S105 in FIG. 3 ), the light emitting layer 533 is formed on the hole transport layer 532 . In addition, the light-emitting layer 533 includes an R-color light-emitting layer (red light-emitting layer), a G-color light-emitting layer (green light-emitting layer), and a B-color light-emitting layer (blue light-emitting layer).

Next, in the electron transport layer forming process (step S106 in FIG. 3 ), the electron transport layer 534 is formed on the light emitting layer 533, and in the electron injection layer forming process (step S107 in FIG. 3 ), an electron transport layer 534 is formed on the electron transport layer 534. Electron injection layer 535 .

In this embodiment, the hole injection layer 531 , the hole transport layer 532 , and the light emitting layer 533 are each formed in the substrate processing system 100 described later. In the substrate processing system 100, the coating process of the organic material based on the spray coating method, the decompression drying process of the organic material, and the firing process of the organic material are sequentially performed to form the hole injection layer 531, the hole transport layer 532 and the light emitting layer. Layer 533. In addition, the formation of the hole injection layer 531, the hole transport layer 532, and the light emitting layer 533 will be described using FIGS. 4 to 7B and the like.

In addition, the electron transport layer 534 and the electron injection layer 535 are each formed using, for example, a vapor deposition method.

Then, in the cathode forming process (step S108 in FIG. 3 ), the cathode 520 is formed on the electron injection layer 535 . The cathode 520 is formed using, for example, a vapor deposition method. In addition, aluminum, for example, can be used for the cathode 520 .

Then, the laminated structure formed through steps S101 to S108 is sealed from moisture in the atmosphere and the like (step S109 in FIG. 3 ).

In the organic light emitting diode 500 manufactured through such a film forming step to a sealing step, by applying a voltage between the anode 510 and the cathode 520, a predetermined number of holes injected into the hole injection layer 531 pass through the hole transport layer. 532 is transported to the light-emitting layer 533 .

In addition, a predetermined number of electrons injected into the electron injection layer 535 are transported to the light emitting layer 533 via the electron transport layer 534 . Then, holes and electrons recombine in the light emitting layer 533 to form molecules in an excited state, and the light emitting layer 533 emits light.

<2. Substrate processing system configuration>

Next, the configuration of a substrate processing system 100 including the inspection device and the reduced-pressure drying device according to the present embodiment will be described with reference to FIG. 4 . FIG. 4 is a schematic plan view showing an outline of the configuration of the substrate processing system 100 according to this embodiment. In addition, in FIG. 4 , in order to show the inspection device 200 easily, the inspection device 200 is schematically shown with a predetermined pattern.

In addition, hereinafter, in order to clarify the positional relationship, mutually orthogonal X-axis directions, Y-axis directions, and Z-axis directions are defined, and the Z-axis positive direction is set to be vertically upward.

As shown in FIG. 4 , a substrate G on which an anode 510 and a bank 540 have been formed in advance through an anode forming process and a bank forming process (refer to steps S101 and S102 in FIG. 3 ) is loaded into the substrate processing system 100 . Then, in the substrate processing system 100, each process corresponding to steps S103 to S105 in FIG. The processing (refer to step S106 in FIG. 3 ) is carried out.

As shown in FIG. 4 , the substrate processing system 100 has a configuration in which a carry-in station 110 , a processing station 120 , and a carry-out station 130 are integrally connected. The carrying-in station 110 carries in a plurality of substrates G in units of a cell C from the outside, and takes out the substrate G from the cell C before processing.

The processing station 120 includes: a hole injection layer forming module 121 for performing a hole injection layer forming process on the substrate G; and a hole input layer forming module for performing a hole input layer forming process on the substrate G after the hole injection layer forming process 122. Furthermore, the processing station 120 has a light emitting layer forming module 123 for performing a light emitting layer forming process on the substrate G after the hole input layer forming process.

The unloading station 130 stores the processed substrates G in the cassette C, and unloads a plurality of substrates G in units of the cassette C to the outside.

The loading station 110 , hole injection layer forming module 121 , hole transport layer forming module 122 , light emitting layer forming module 123 and unloading station 130 are arranged in this order from the X-axis negative direction to the X-axis positive direction.

The carry-in station 110 includes a cassette mounting table 111 , a conveyance path 112 , and a substrate conveyance body 113 . The cell mounting table 111 freely mounts the some cell C in a row in the Y-axis direction.

The conveyance path 112 is provided to extend in the Y-axis direction. The substrate transfer body 113 is provided movable on the transfer path 112 and movable in the Z-axis direction and around the Z-axis, and transfers the substrate G between the cassette C and the processing station 120 . In addition, the substrate transport body 113 transports the substrate G while sucking and holding it, for example.

In the processing station 120, the hole injection layer forming module 121 includes a coating device 121a, a buffer device 121b, a reduced pressure drying device 121c, a heat treatment device 121d, and a temperature adjusting device 121e.

The coating device 121 a is a device for coating an organic material for forming the hole injection layer 531 on the anode 510 formed on the substrate G. 5A is a schematic cross-sectional view showing a substrate G coated with an organic material for forming a hole injection layer 531 .

As shown in FIG. 5A , an organic material is applied to a predetermined position on the substrate G, that is, the inside of the bank 540 , by the application device 121 a by spraying. The organic material is a solution in which a predetermined material for forming the hole injection layer 531 is dissolved in an organic solvent.

The buffer device 121b shown in FIG. 4 is a device for temporarily storing a plurality of substrates G. The reduced-pressure drying device 121c is a device for drying the organic material coated by the coating device 121a under reduced pressure.

FIG. 5B is a schematic cross-sectional view showing the substrate G dried under reduced pressure in the reduced-pressure drying device 121c. As can be seen from a comparison of FIG. 5A and FIG. 5B , the organic material coated inside the bank 540 is dried under reduced pressure to remove the solvent, thereby forming a hole injection layer 531 with a uniform or substantially uniform film thickness stacked on the anode 510. status.

The heat treatment apparatus 121d shown in FIG. 4 is an apparatus for firing the organic material dried by the reduced-pressure drying apparatus 121c as heat treatment. For example, the thermal processing apparatus 121d has a chamber capable of accommodating the substrate G and a hot plate (not shown) arranged in the chamber, and burns the organic material using heat from the hot plate.

The temperature adjustment device 121e is a device for adjusting the substrate G heat-treated by the heat treatment device 121d to a predetermined temperature, for example, normal temperature. In addition, the arrangement and number of the coating device 121a, the buffer device 121b, the reduced pressure drying device 121c, the heat treatment device 121d and the temperature adjustment device 121e in the hole injection layer forming module 121 can be selected arbitrarily.

In addition, the hole injection layer forming module 121 has substrate transfer regions CR1 to CR3 and transfer devices TR1 to TR3. The substrate conveyance regions CR1 to CR3 are, for example, conveyance robots, and convey the substrates G to respective devices adjacent to each other.

Specifically, the substrate conveyance region CR1 conveys the substrate G to the coating device 121 a and the buffer device 121 b adjacent to the substrate conveyance region CR1 . Moreover, the substrate conveyance area CR2 conveys the board|substrate G to the reduced-pressure drying apparatus 121c adjacent to the board|substrate conveyance area CR2.

In addition, the substrate transfer region CR3 transfers the substrate G to the heat treatment apparatus 121d and the temperature adjustment apparatus 121e adjacent to the substrate transfer region CR3. In addition, the substrate conveying devices for conveying the substrates G to the substrate conveying regions CR1 to CR3 are provided so as to freely move in the horizontal direction, the vertical direction, and around the vertical axis.

Delivery devices TR1 to TR3 are sequentially installed between the carry-in station 110 and the substrate transfer area CR1 , between the substrate transfer areas CR1 and CR2 , and between the substrate transfer areas CR2 and CR3 , and transfer the substrate G between them.

The hole transport layer forming module 122 includes a coating device 122a, a buffer device 122b, a decompression drying device 122c, a heat treatment device 122d, and a temperature adjustment device 122e. The coating device 122a coats the organic material for forming the hole transport layer 532 on the hole injection layer 531 formed on the substrate G. 6A is a schematic cross-sectional view showing a substrate G coated with an organic material for forming a hole transport layer 532 .

As shown in FIG. 6A , an organic material is applied to a predetermined position on the substrate G, ie, inside the bank 540 , by the application device 122 a by spraying. The organic material is a solution obtained by dissolving a predetermined material for forming the hole transport layer 532 in an organic solvent.

The buffer device 122b and the reduced-pressure drying device 122c shown in FIG. 4 have substantially the same configuration as the buffer device 121b and the reduced-pressure drying device 121c, so detailed description thereof will be omitted.

FIG. 6B is a schematic cross-sectional view showing the substrate G dried under reduced pressure in the reduced-pressure drying device 122c. As can be seen from a comparison of FIG. 6A and FIG. 6B , the organic material coated inside the bank 540 is dried under reduced pressure to remove the solvent, thereby forming holes with a uniform or substantially uniform film thickness stacked on the hole injection layer 531 . The state of the transport layer 532 .

In addition, since the heat processing apparatus 122d and the temperature adjustment apparatus 122e also have substantially the same structure as the heat processing apparatus 121d and the temperature adjustment apparatus 121e, detailed description is abbreviate|omitted. However, in the hole transport layer forming module 122, the interior of the heat treatment device 122d and the temperature adjustment device 122e is maintained in a low oxygen and low dew point atmosphere.

Here, the low-oxygen atmosphere refers to an atmosphere having a lower oxygen concentration than the air, for example, an atmosphere having an oxygen concentration of 10 ppm or less. In addition, the term "low dew point atmosphere" refers to an atmosphere having a dew point temperature lower than that of the air, for example, an atmosphere having a dew point temperature of -10°C or lower. In addition, such a low-oxygen and low-dew-point atmosphere is maintained using an inert gas such as nitrogen.

In the hole transport layer forming module 122, the number and arrangement of these coating devices 122a, buffer devices 122b, reduced-pressure drying devices 122c, heat treatment devices 122d, and temperature adjustment devices 122e can be selected arbitrarily.

In addition, the hole transport layer forming module 122 includes substrate transfer regions CR4 to CR6 and delivery devices TR5 and TR6 . In addition, the hole injection layer forming module 121 and the hole transport layer forming module 122 are connected via a transfer device TR4.

Here, since the substrate transfer regions CR4 to CR6 and the transfer devices TR5 and TR6 have substantially the same configuration as the substrate transfer regions CR1 to CR3 and transfer devices TR1 to TR3 described above, detailed description thereof will be omitted.

However, as described above, the interior of the heat treatment device 122d and the temperature adjustment device 122e is maintained in a low-oxygen and low-dew-point atmosphere, so the interior of the substrate transfer region CR6 is also maintained in a low-oxygen and low-dew-point atmosphere.

In addition, the transfer device TR6 connecting the substrate transfer area CR6 and the substrate transfer area CR5 described above is configured as a lock device designed to temporarily accommodate the substrate G and switch the internal atmosphere, that is, a low-oxygen low dew point atmosphere and an atmospheric atmosphere.

The luminescent layer forming module 123 includes a coating device 123a, a buffer device 123b, a decompression drying device 123c, a heat treatment device 123d, and a temperature adjustment device 123e.

The coating device 123a is a device for coating the organic material for forming the light emitting layer 533 on the hole transport layer 532 formed on the substrate G. 7A is a schematic cross-sectional view showing a substrate G coated with an organic material for forming a light emitting layer 533 .

As shown in FIG. 7 , in the coating device 123 a , an organic material is coated on a predetermined position on the substrate G, that is, inside the bank 540 , by spraying. Such an organic material is a solution obtained by dissolving a predetermined material for forming the light emitting layer 533 in an organic solvent. In addition, in FIG. 7A , the R color light emitting layer of the light emitting layer 533 is assigned a reference numeral 533R, the G color light emitting layer is assigned a reference numeral 533G, and the B color light emitting layer is assigned a reference numeral 533B.

The buffer device 123b and the reduced-pressure drying device 123c shown in FIG. 4 have substantially the same configuration as the buffer device 122b and the reduced-pressure drying device 122c described above, so detailed description thereof will be omitted.

Fig. 7B is a schematic cross-sectional view showing the substrate G dried under reduced pressure in the reduced-pressure drying device 123c. As can be seen from a comparison between FIG. 7A and FIG. 7B , the organic material coated inside the bank 540 is dried under reduced pressure to remove the solvent, thereby forming a light-emitting layer 533 with a uniform or substantially uniform film thickness stacked on the hole transport layer 532 . status.

The inspection apparatus 200 for detecting the dry state of the board|substrate G is provided in each of the above-mentioned reduced-pressure drying apparatuses 121c, 122c, and 123c. The detailed configuration of these reduced-pressure drying devices 121c, 122c, and 123c and the inspection device 200 will be described later with reference to FIGS. 8 and 9 .

Following the description of FIG. 4, the buffer device 123b and the reduced-pressure drying device 123c have substantially the same configuration as the buffer device 122b and the reduced-pressure drying device 122c, so detailed descriptions are omitted.

In the light-emitting layer forming module 123, the number and arrangement of these coating devices 123a, buffer devices 123b, reduced-pressure drying devices 123c, heat treatment devices 123b, and temperature adjustment devices 123e can be selected arbitrarily.

The light emitting layer forming module 123 includes substrate transfer regions CR7 to CR9 and transfer devices TR8 to TR10. In addition, the hole transport layer forming module 122 and the light emitting layer forming module 123 are connected via the transfer device TR7.

Here, since the substrate transfer regions CR7 to CR9 and the transfer devices TR7 to TR9 have substantially the same configuration as the substrate transfer regions CR4 to CR6 and transfer devices TR4 to TR6 described above, detailed description thereof will be omitted.

The transfer device TR10 is installed between the substrate transfer region CR9 and the carry-out station 130, and transfers the substrate G between them. In addition, the transfer device TR10 is preferably configured as a lock device capable of temporarily storing the substrate G and switching the internal atmosphere, that is, a low-oxygen and low dew point atmosphere and an atmospheric atmosphere.

The carry-out station 130 includes a cassette mounting table 131 , a conveyance path 132 , and a substrate conveyance body 133 . The cell mounting stand 131 freely mounts a plurality of cell C in a row in the Y-axis direction.

The conveyance path 132 is provided to extend in the Y-axis direction. The substrate transport body 133 is provided movable on the transport path 132 and freely movable in the Z-axis direction and around the Z-axis, and transports the substrate G between the processing station 120 and the cassette C. In addition, the substrate transport body 133 transports the substrate G while suction-holding, for example. In addition, the inside of the transfer station 130 is preferably maintained in a low-oxygen and low-dew-point atmosphere.

In addition, the substrate processing system 100 has a control device 140 . The control device 140 is, for example, a computer, and includes a control unit 141 and a storage unit 142 . Programs for controlling various processes executed in the substrate processing system 100 are stored in the storage unit 142 . The control unit 141 is, for example, a CPU (Central Processing Unit: central processing unit), and controls the substrate processing system 100 by reading and executing a program stored in the storage unit 142 .

In addition, this program is a program recorded in a computer-readable storage medium, or may be a program stored in the storage unit 142 of the control device 140 from the storage medium. Examples of storage media that can be read by a computer include a hard disk (HD), a flexible disk (FD), an optical disk (CD), a magnetic disk (MO), and a memory card. In addition, the control unit 141 may be constituted only by a hard disk without using a program. In addition, the specific configuration of the control device 140 will be described later with reference to FIG. 10 .

However, in the above-mentioned reduced-pressure drying devices 121c, 122c, and 123c, the drying time until the drying is completed depends on, for example, the type and amount of the organic material applied to the substrate G, the surface state of the substrate G, the type of the formed layer, etc. Hence the change. Therefore, for example, in the case of mass-producing the organic light emitting diode 500 , it is necessary to implement an operation of setting an optimum drying time.

In the prior art, an optimum drying time is set by making a large number of samples, measuring the film thickness and optical characteristics of each layer of the prepared samples, and therefore time is required for setting operations.

However, the reduced-pressure drying devices 121c, 122c, and 123c of the present embodiment are configured to include an inspection device 200 that detects the drying state of the coated region of the substrate G coated with an organic material. Furthermore, in such an inspection apparatus 200 , the color density of the imaged coated area is measured while imaging the coated area of the substrate G, and the dry state of the coated area is detected based on the measured color density.

In this way, the pressure drying apparatuses 121c, 122c, and 123c have an inspection device for detecting the dry state based on the color density of the applied area, thereby enabling early detection of the dried state of the applied area. In addition, it is also possible to improve the efficiency of the operation of setting the optimum drying time by this.

<3. Configuration of inspection device and decompression drying device>

The configuration of the reduced-pressure drying apparatuses 121c, 122c, and 123c having the inspection apparatus 200 according to the present embodiment will be described below with reference to FIGS. 8 and 9 . FIG. 8 is a schematic plan view showing the configuration of a reduced-pressure drying device 123c according to this embodiment, and FIG. 9 is a schematic cross-sectional view showing line IX-IX in FIG. 8 .

In addition, here, the reduced-pressure drying device 123c is described as an example, but since the reduced-pressure drying devices 121c, 122c, and 123c have substantially the same configuration, the following description is also applicable to the reduced-pressure drying devices 121c and 122c.

As shown in FIGS. 8 and 9 , the decompression drying device 123 c includes a chamber 150 , a substrate holding mechanism 160 (see FIG. 9 ), a decompression mechanism 170 (see FIG. 9 ), and an inspection device 200 .

The chamber 150 is a substantially rectangular parallelepiped processing container whose interior can be hermetically sealed. As shown in FIG. 9 , the substrate G and the like held by the substrate holding mechanism 160 are accommodated in the chamber 150 . In addition, in the chamber 150, an opening 151 and a window 152 are provided. Specifically, a plurality of openings 151 are provided on the ceiling 150 a of the chamber 150 , and windows 152 are respectively provided in these openings 151 .

The window portion 152 is glass having translucency to such an extent that the substrate G inside the chamber 150 can be imaged by the imaging units 11 a to 11 c (described later) from the outside of the chamber 150 . In addition, the window portion 152 is formed of, for example, quartz glass, but is not limited thereto. In addition, the number and arrangement of openings 151 and windows 152 can be selected arbitrarily.

The substrate holding mechanism 160 includes a holding portion 161 , a pillar portion 162 , and a lifting portion 163 . The holding unit 161 is a mounting table. Specifically, the holding unit 161 has a plurality of flat members, and places and holds the substrate G. As shown in FIG. In addition, in the example shown in FIG. 9, five flat members are shown, but it is not limited to this. In addition, there may be one flat member constituting the holding portion 161 .

The pillar part 162 is a member extending in the vertical direction, the base end part is connected to the lift part 163, and the holding|maintenance part 161 is horizontally supported by the front-end|tip part. The raising and lowering unit 163 is, for example, a driving source of the electromotive electrode, and moves the pillar unit 162 and the holding unit 161 up and down in the vertical direction. Accordingly, the substrate G held by the holding portion 161 can be raised and lowered. In addition, the elevating unit 163 is the same number as the holding unit 161 , and is connected to a plurality of holding units 161 , but in FIG. 9 , the elevating unit 163 is schematically shown as one module for simplification of illustration.

In addition, although the raising and lowering of the holding part 161 by the raising and lowering part 163 is performed at the time of depressurization drying as mentioned later, it may also be performed at the time of loading and unloading of the board|substrate G. That is, for example, when the substrate G is carried into the reduced-pressure drying device 123c from the substrate transfer region CR8 (see FIG. The holding parts 161) on both sides of the part 161 are lowered.

Then, the fork portion (not shown) of the substrate transfer device on which the substrate G is placed is inserted into the space above the lowered holding portion 161, and then the fork portion is lowered, and the substrate G is placed on the non-lowered holding portion. 161. Next, the fork is pulled out, and the lifting unit 163 raises the lowered holding unit 161 to its original position, and as shown in FIG. 9 , the board G is held by the holding unit 161 .

The decompression mechanism 170 is connected to the chamber 150, and depressurizes the internal atmosphere of the chamber 150 to 1 Pa or less, for example. In addition, as the decompression mechanism 170, for example, a vacuum pump such as a dry pump, a mechanical booster pump, or a turbomolecular pump can be used.

The inspection device 200 includes a first photographing unit 210a, a second photographing unit 210b, and a third photographing unit 210c. In addition, the number of imaging units is not limited to illustration, and may be 2 or less or 4 or more.

The first to third imaging units 210 a to 210 b are arranged near the window portion 152 and outside the chamber 150 . Specifically, the first and third imaging units 210a and 210c are disposed near the window portion 152 located above the peripheral portion of the substrate G, and the second imaging unit 210b is disposed near the window portion 152 located above the central portion of the substrate G. near.

Hereinafter, the first imaging unit 210a will be described as an example, but the first to third imaging units 210a to 210c have substantially the same configuration, so the following description is also applicable to the second and third imaging units 210b and 210c. In addition, in FIG. 8 and FIG. 9, regarding the constituent elements of the second and third photographing units 210b and 210c, for the same constituent elements of the first photographing unit 210a, the same serial numbers are marked but only the letters at the end are changed. Detailed description is omitted.

The first photographing unit 210a includes a photographing unit 11a, an illumination unit 12a, and a focus adjustment unit 13a. The imaging unit 11 a is positioned above the window portion 152 , and images the substrate G, specifically, the coating region (described later) on which the organic material is applied in the substrate G through the window portion 152 . Thus, by providing the imaging window 152 in the chamber 150 , the substrate G in the chamber 150 can be imaged from the outside of the chamber 150 , although it is a simple configuration.

In addition, the imaging unit 11 a is arranged such that the optical axis of the imaging unit 11 a is perpendicular to the main surface of the substrate G. As shown in FIG. In addition, as the imaging unit 11a, for example, a CCD (Charge Coupled Device: Charge Coupled Device) image sensor camera having a telephoto lens can be used, but the present invention is not limited thereto.

The illuminating unit 12a has a light source not shown, and is attached to the side of the imaging unit 11a. The illuminating part 12a irradiates the board|substrate G with the light for imaging from this light source. Specifically, the imaging unit 11a has a half mirror (not shown) that reflects light downward from the illuminating unit 12a attached to the side. In addition, the light from the illuminating unit 12a reflected by the half mirror is incident in a direction perpendicular to the main surface of the substrate G, in other words, in a direction coaxial with the optical axis of the imaging unit 11a, and is irradiated to the surface of the object to be photographed. apply area. In this way, the illuminating unit 12a is configured as so-called coaxial illuminating, but it is not limited thereto. For example, light may be irradiated from an oblique direction with respect to the application area of the substrate G.

The focus adjustment part 13a includes a main body part 14a and a slide part 15a. The main body portion 14a is secured to the top 150a of the chamber 150 . Moreover, the drive source (not shown) which drives the slide part 15a is accommodated in the inside of the main-body part 14a. As the drive source, for example, an electric motor can be used.

The sliding part 15a is attached to the main body part 14a so that the base end part can slide in the direction (Z-axis direction) perpendicular to the main surface of the board|substrate G. As shown in FIG. In addition, the imaging unit is fixed to the front end of the sliding unit 15a.

The control device 140 (see FIG. 4 ) is connected to the focus adjustment unit 13 a configured as described above through a cable not shown. Furthermore, the control device 140 can appropriately adjust the focus of the imaging unit 11a by controlling the driving source of the main body unit 14a to slide the sliding unit 15a and the imaging unit 11a in a direction perpendicular to the main surface of the substrate G.

As described above, the first to third imaging units 210a to 210c have substantially the same configuration. Therefore, below, the imaging unit 11 a and the lighting unit 12 a may be described as “the imaging unit 11 ” and “the lighting unit 12 ” without distinguishing the first to third imaging units.

The aforementioned imaging unit 11, illuminating unit 12, lifting unit 163, and decompression board 170 are also connected to the control device 140 (see FIG. 4 ) via cables not shown, and their respective operations are controlled.

<4. Configuration of the control device>

The configuration of the control device 140 described above will be described in detail with reference to FIG. 10 . FIG. 10 is a block diagram of the control device 140 . In addition, in FIG. 10 , components necessary for describing the features of the inspection device 200 and the reduced-pressure drying device 123c according to the present embodiment are represented by functional blocks, and the description of general components is omitted.

In other words, each component shown in FIG. 10 shows a functional concept and does not necessarily have to be physically configured as shown in the figure. For example, the specific forms of dispersing and integrating each functional module are not limited to those shown in the figure, and all or a part of them can be distributed, functionally or physically in any unit according to various loads and usage conditions, etc. integrated to form.

In addition, all or any part of the processing functions performed by each functional block can be realized by a processor such as a CPU and a program analyzed and executed by the processor, or it can also be implemented as hardware based on wired logic. realized function.

First, as described above, the control device 140 includes the control unit 141 and the storage unit 142 . The control unit 141 reads and executes the program stored in the storage unit 142 , thereby functioning as, for example, each of the process modules 141 a to 141 h shown in FIG. 10 . Next, these functional blocks 141a to 141h will be described.

As shown in FIG. 10, the control unit 141 includes an illumination control unit 141a, an imaging control unit 141b, an image acquisition unit 141c, a color density measurement unit 141d, a judgment unit 141e, a dry state detection unit 141f, a decompression control unit 141g, and a lift control unit. 141h. In addition, the storage unit 142 stores, for example, captured image information 142a, pattern/position information 142b, predetermined range information 142c, and dry state information 142d.

The lighting control unit 141 a controls the lighting unit 12 to irradiate the substrate G with light from the lighting unit 12 . The imaging control unit 141b controls the imaging unit 11 so that the imaging unit 11 images the substrate G being subjected to the reduced-pressure drying process.

The image acquisition unit 141c acquires a captured image captured by the imaging unit 11 and stores it in the storage unit 142 as captured image information 142a. FIG. 11 is an example of a captured image 20 captured by the imaging unit 11 , and is a schematic enlarged view showing a part of the captured image 20 enlarged.

As shown in FIG. 11 , the imaging unit 11 images the bank 540 of the substrate G and the surrounding area of the bank 540 . In addition, in FIG. 11 , only one bank 540 is shown, but the imaging unit 11 may image a plurality of banks 540 .

In addition, in the example shown in FIG. 11 , the captured image 20 obtained by imaging the G-color light-emitting layer 533G (see FIGS. 7A and 7B ) in the light-emitting layer 533 formed on the substrate G is shown. That is, FIG. 11 shows a captured image 20 captured by the imaging unit 11 of the reduced-pressure drying device 123 c provided in the light emitting layer forming module 123 . In addition, in the following, the application region 21 formed by the G-color light emitting layer 533g will be described as an example, but the following description is also applicable to the application region 21 formed by the R-color light-emitting layer 533R or the B-color light-emitting layer 533B.

Inside the bank 540 , as described above, the organic solvent for forming the G-color light emitting layer 533G is coated, and the region coated with the organic material is represented by a dotted closed curve as "coated region 21" in FIG. 11 . In this way, the imaging unit 11 images the application region 21 of the substrate G. As shown in FIG.

Returning to the description of FIG. 10 , the color density measuring unit 141 d reads the captured image information 142 a from the storage unit 142 , and measures the color density of the application area 21 captured by the imaging unit 11 . Here, the so-called color density is a numerical value representing the three primary colors of red, green, and blue, which are the three primary colors of red, green, and blue, in the imaged application area 21 , respectively, in gradations of 0 to 225.

In addition, in this embodiment, each of the three primary colors of red, green, and blue is numerically expressed as a color density in 0 to 225 grayscales (8 bits), but the respective grayscales of the three primary colors can also be determined according to the image sensor. The performance of the camera is digitized at 65536 gradations (16 bits) or higher, and used as the color density.

In addition, the imaging unit 11 images a plurality of banks 540, and when there are a plurality of application regions 21 on which the G-color light emitting layer 533G is formed, the color density measurement unit 141d may measure the color density of the plurality of application regions 21, for example. average value. Various average values, such as a simple average and a weighted average, can be used for the average value mentioned above. In addition, when there are a plurality of application regions 21 in which the G-color light emitting layer 533G is formed, it is not limited to the example of measuring the above-mentioned average value. One representative coating area 21 is selected, and the color density of the coating area 21 is measured.

In addition, the color density measurement unit 141d also performs pattern search processing and position information acquisition processing in addition to the measurement of color density. The pattern search processing search is a process in which the shape of the pattern of the bank 540 having the imaged application area 21 matches the shape of the pattern formed on the substrate G. FIG. In addition, the position information acquisition process acquires the position information of the substrate G of the pattern judged to match by the search process.

Specifically, in the storage unit 142, the pattern shape of the bank 540 on the substrate G subjected to the reduced-pressure drying process (hereinafter referred to as "stored pattern shape"), the pattern shape of the bank 540 formed in the bank 540, and the shape of the bank 540 are stored in advance as the pattern/position information 142b. The type of the organic EL layer 530, the positional information of the bank 540, and the like.

In addition, the information on the type of the organic EL layer 530 stored above is, for example, information on the hole injection layer 531 , the hole transport layer 532 , and the light emitting layer 533 . In addition, the information on the type of organic EL layer 530 includes, in the case of light emitting layer 533 , information on whether it is any one of R color light emitting layer 533R, G color light emitting layer 533G, and B color light emitting layer 533B. In addition, the position information of the bank 540 is, for example, XY coordinates indicating the relative position of the bank 540 with respect to a reference point (origin) set on the substrate G, but is not limited thereto.

In the pattern search process, the color density measuring unit 141d compares the pattern shape of the bank 540 having the imaged application region 21 with the stored pattern shape, and searches for a matched stored pattern shape. And, the color density measurement unit 141d correlates the information indicating the above-mentioned measured color density with the information on the type and position of the organic EL layer 530 having the bank 540 having the same stored pattern shape by searching, and sends the information to the judgment. Section 141e outputs.

The determination unit 141e calculates a value indicating a change in the color density of the application area 21, specifically, a change rate of the color density, based on the information output from the color density measurement unit 141d. In addition, in the determination unit 141e described above, the rate of change is calculated as a value indicating a change in color density, but is not limited thereto, and may be other values such as the amount of change in color density, for example.

Here, the relationship between the change in color density in the reduced-pressure drying process and the drying state of the coated region 21 of the substrate G will be described with reference to FIG. 12 . FIG. 12 is a graph showing the color density measured by the color density measuring unit 141d in the reduced-pressure drying process.

In addition, in FIG. 12 , in order from the top, the dotted line graph indicates "red density 30R", the dotted line graph indicates "green density 30G", and the double dotted line graph indicates "blue density 30B". Furthermore, in FIG. 12 , the diagram realized is the pressure value 31 inside the chamber 150 . In addition, in the example shown in FIG. 12, the measurement of the color density is started after time T0 elapsed from the start of the reduced-pressure drying process.

The inventors found that there is a correlation between the color density of the coated area 21 and the dry state of the coated area 21 when measuring the color density of the coated area 21 in the reduced-pressure drying process. Specifically, as shown in FIG. 12 , for example, when the depressurized drying process starts and the time Ta passes, the change in the pressure value 21 disappears, and the inside of the chamber 150 remains depressurized to a predetermined pressure.

In the application region 21, the color density changes relatively greatly just before depressurization to a predetermined pressure and just when drying starts, but after the time Ta passes, as time passes, in other words, as the drying is approached, , the color density gradually stabilizes. And, for example, in the green density 30G, the value stabilizes at time Tb, and the drying of the application area 21 is completed.

This is because, in the application region 21 , the amount of solvent removed by drying under reduced pressure gradually decreases with time, and the change in color density also disappears. Thus, it can be seen that there is a correlation between the color density of the application area 21 and the dry state of the application area 21 .

Therefore, in the reduced-pressure drying device 123c provided with the inspection device 200 of this embodiment, the change rate of the color density of the application area 21 is calculated, and the drying state of the application area 21 is detected based on the calculated change rate.

Specifically, the judging unit 141e shown in FIG. 10 calculates the rate of change of the color density, and judges whether the calculated rate of change of the color density is within a predetermined range. . In addition, the above-mentioned predetermined range is set in advance as a value at which it can be judged that the change in color density accompanying the progress of drying becomes relatively small and stable, and is stored in the storage unit 142 as the predetermined range information 142c. The determination unit 141e outputs the determination result to the dry state detection unit 141f.

The dry state detection unit 141 f detects the dry state of the applied area 21 based on the determination result, specifically, detects the dry state of the applied area 21 based on the color density of the applied area 21 captured by the imaging unit 11 . More specifically, when it is determined that the rate of change calculated by the determination unit 141e is within a predetermined range, the dry state detection unit 141f detects that the application region 21 is in a dry state.

The dry state detection unit 141f sets the time (here, time Tb, for example) from the start of the reduced-pressure drying process to the detection of the dry state as the "dry time", and stores the dry time in the memory as the dry state information 142d. Section 142.

In addition, the dry state detecting unit 141f stores the type and position information of the organic EL layer 530 in the bank 540 of the applied region 21 in a dried state, as dry state information 142d, in addition to the above-mentioned drying time. storage unit 142 .

In this way, in the case where there is the dry state detection unit 141f, by using the color density of the applied area 21, the dry state of the applied area 21 can be detected earlier than the technique of producing a large number of samples.

In addition, as described above, the inspection device 200 for detecting the dry state of the coated area 21 is provided in the reduced-pressure drying device 123c, and the drying time is set based on the detected dry state of the coated area 21 . Thus, for example, when setting an optimum drying time before mass-producing the organic light emitting diode 500 , it is not necessary to prepare a large number of samples, and the efficiency of the setting operation can be improved.

In addition, in the case where the above-mentioned dry state detection unit 141f is present, it is not necessary to detect the dry state of the application area 21 for all the color densities measured by the color density measuring unit 141d. That is, the dry state detection unit 141f may select at least one color density from red density, green density, and blue density, for example, according to the type of the application area 21 .

Explained in detail, the color density includes red density, green density, and blue density as described above. The manner in which these three kinds of color densities change over time differs depending on the type of the application area 21 , and these changes in the color densities also correspond to changes accompanying the progress of the drying state.

Therefore, the color density that significantly expresses the change accompanying the progress of the dry state is obtained through experiments in advance, and the dry state detection unit 141f selects at least one color from red density, green density, and blue density according to the type of the application area 21. concentration.

In addition, the dry state detection unit 141f may detect the dry state based on the selected color density. In this way, the dry state detection unit 141f can accurately detect the dry state of the application area 21 by using a color density that is likely to express a change accompanying the progress of the dry state. In addition, the number of color densities selected by the dry state detection unit 141f can be set to an arbitrary value.

Next, the description of FIG. 10 will be carried out. The decompression control unit 141g controls the decompression mechanism 170 to perform a decompression drying process. Specifically, the decompression control unit 141g performs the decompression drying process for the set drying time or a predetermined time added to the set drying time after the drying time setting operation is completed.

The lift control unit 141h controls the lift unit 163 to lift the holding unit 161 up and down. In addition, the lift control unit 141h controls the drying process according to the drying state of the application area 21 in the reduced-pressure drying process performed after the drying time setting operation is completed, in other words, in the reduced-pressure drying process performed when the organic light emitting diode 500 is mass-produced. The lifting unit 163 will be described later with reference to FIG. 14 .

<5. Specific actions of the inspection device and the decompression drying device>

Next, the content of processing performed by the reduced-pressure drying device 123c provided with the inspection device 200 of this embodiment will be described with reference to FIG. 13 .

FIG. 13 is a flowchart showing the processing procedure of the processing for setting the drying time in the reduced-pressure drying device 123c provided with the inspection device 200 according to the present embodiment. In addition, FIG. 13 shows, for example, a processing sequence for setting an optimum drying time before mass-producing the organic light emitting diode 500 . Therefore, in the example shown in FIG. 13 , the detection is continued during the detection processing time for which the dry state of the application area 21 is set in advance, and the drying time is set after the detection processing time elapses. The detection processing time described above is set to be sufficiently longer than the time when the application region 21 is expected to be in a dry state.

In addition, each processing procedure shown in FIG. 13 is executed under the control of the control unit 141 of the control device 140 .

As described below in detail, as shown in FIG. 13 , the imaging control unit 141b of the control unit 141 images the application region 21 on which the organic material is applied on the substrate G (step S10 ). In addition, before this imaging process, the light from the illumination part 12 is made into the light irradiated to the board|substrate G. As shown in FIG.

Next, the color density measuring unit 141d compares the pattern shape of the bank 540 having the application region 21 in the captured image with the stored pattern shape, and searches for a matched stored pattern shape (step S11). Next, the color density measurement unit 141d acquires the type and position information of the organic EL layer 530 having the banks 540 having the same stored pattern shape by search processing (step S12 ).

Next, the color density measurement unit 141d measures the color density of the application area 21 in the captured image (step S13). Next, the determination unit 141e calculates the rate of change of the color density of the application area 21 (step S14), and determines whether the calculated rate of change of the color density is within a predetermined range (step S15).

When the judging unit 141e judges that the rate of change of the color density is within the predetermined range (step S15, Yes), it calculates the time from the start of the reduced-pressure drying process until it is judged that the rate of change of the color density is within the predetermined range as "drying time". " (step S16).

Also, when the judging unit 141e judges that the rate of change of the color density is not within the predetermined range (step S15, No), that is, when it judges that the color density has relatively large change, the process of step S16 is skipped.

Next, the dry state detection unit 141f detects that the application region 21 is in a dry state when it is judged by the judgment portion 141e that the rate of change is within a predetermined range, and outputs an output indicating that it has become a dry state. The information is stored in the storage unit 142 (step S17). In addition, the dry state detection unit 141f uses the acquired type and position information of the organic EL layer 530 of the bank 540, the measured color density of the application area 21, etc. as indicators indicating the dry state regardless of the determination result of the determination unit 141e. The information is output and stored in the storage unit 142 .

Next, dry state detection part 141f judges whether the above-mentioned detection processing time has elapsed (step S18). When the dry state detection part 141f judges that the detection processing time has not elapsed (step S18, NO), it repeats the process of steps S10-S17.

On the other hand, when the dry state detection part 141f judges that the detection processing time has elapsed (step S18, YES), it sets a dry time (step S19). The drying time set here is the same value as the drying time calculated in step S16.

In this way, for example, before mass-producing the OLED 500 , a series of processes for setting an optimum drying time are completed. Moreover, although illustration is omitted, for example, in the case of mass-producing the organic light emitting diode 500, in the reduced-pressure drying device 123c, the drying time set in step S19 or the set drying time Drying under reduced pressure was performed for a predetermined time plus time. In addition, in the above, the purpose of adding a predetermined time to the drying time is that, for example, even if the drying of the coated area 21 is delayed due to environmental conditions, the delayed time is absorbed by the specified time, so that the coated area 21 drying is reliably accomplished.

In addition, in the above-mentioned reduced-pressure drying device 123c, the detection of the drying state of the application area 21 is performed at the time of setting the drying time. However, in the reduced-pressure drying device 123c, the detection of the dry state of the application area 21 is not limited to the above.

That is, for example, the dry state of the application area 21 may also be detected in the reduced-pressure drying device 123 c after setting the drying time. For example, as will be described later, in the coating region 21 of the substrate G, the drying speed is different between the peripheral portion and the central portion of the substrate G. Therefore, in the present embodiment, the drying states of the peripheral coating area 21 and the central coating area 21 are detected, and the substrate G is raised and lowered based on the detection results to promote drying.

This will be described with reference to FIG. 14 . FIG. 14 is a graph showing the concentration of G color in the application area 21 in the peripheral portion and the application area 21 in the central portion. In addition, in FIG. 14, the code|symbol 41 is attached|subjected to the G color density of the application|coating area|region 21 image|photographed by the imaging part 11a of the 1st imaging means 210a. In addition, in FIG. 14 , the reference numeral 42 is attached to the G color density of the application area 21 captured by the imaging unit 11b of the second imaging unit 210b, and the color density of the coating area 21 captured by the imaging unit 11c of the third imaging unit 210c is marked with 42 . The G color density of the application area 21 is assigned the reference numeral 43 . That is, the G color densities 41 and 43 are the G color densities of the peripheral application area 21 , and the G color density 42 is the G color density of the central application area 21 .

As shown in FIG. 14 , the G color densities 41 to 43 all sharply increase after the time T0 elapses after the start of the reduced-pressure drying process, and then turn to decrease. Furthermore, among the three G color densities 41 to 43, the G color densities 41 and 43 are reversed and increased at time T1, and the G color density 42 is decreased at time T2 later than time T1. The value of is reversed and increased.

Such inversion is observed when, as shown in FIG. 7A , the luminescent layer 533 raised upward from the upper surface of the bank 540 is lowered due to drying and is lower than the upper surface of the bank 540 (see FIG. 7B ). Phenomenon. In addition, the applied region 21 immediately after becoming the state shown in FIG. 7B is not completely dried.

As described above, with regard to the timing of inversion of the G color densities 41 to 43, the timing of inversion of the G color density 42 in the central application area 21 is higher than that of the G color densities 41 and 43 in the peripheral application area 21. The time of inversion is late. That is, it can be seen that the coating area 21 in the central part dries slower than the coating area 21 in the peripheral part, and it is difficult to dry.

In addition, in the chamber 150 , an air flow is generated by the decompression mechanism 170 , and depending on the direction of the air flow, etc., there may be a site in the chamber 150 where the coating region 21 is easy to dry.

Therefore, in the reduced-pressure drying device 123c of the present embodiment, for example, the height of the substrate G may be adjusted by controlling the raising and lowering unit 163 to raise and lower the holding unit 161 according to the dry state of the coating area 21 .

Specifically, the elevation control unit 141h controls the elevation unit 163 to raise and lower the holding portion 161 so that the central application region 21 The height of the substrate G is adjusted so as to be located in a place that is easy to dry in the chamber 150 . Thereby, it is possible to accelerate the drying of the application region 21 in the center.

In addition, with the above-mentioned configuration, the drying speed of the coated region 21 in the center can be made close to the drying speed of the coated region 21 in the peripheral part, thereby suppressing the occurrence of uneven drying in different parts of the substrate G. Happening.

As configured above, the inspection device 200 of the first embodiment includes the imaging unit 11 and the dry state detection unit 141f. The imaging unit 11 images the coated region 21 of the substrate G where the organic material is coated. The dry state detection unit 141 f detects the dry state of the applied area 21 based on the color density of the applied area 21 captured by the imaging unit 11 . Accordingly, in the substrate G, the drying state of the application region 21 coated with the organic material can be detected early.

In addition, in the above description, the dry state detection unit 141f detects the dry state of the applied area 21 based on the color density of one part of the applied area 21 , but the present invention is not limited thereto. That is, the dry state detection unit 141f may detect the dry state based on the color densities of the dots 22 at a plurality of locations in the application area 21, for example, as indicated by phantom lines in FIG. 11 .

Thereby, the dry state detection unit 141 f can compare the color densities of the dots 22 at a plurality of locations in the application area 21 , for example, and can confirm whether the application area 21 has been dried uniformly.

In addition, since the difference in color density of dots 22 at multiple locations in the coating area 21 can also be calculated, the film thickness distribution in the coating area 21 can be estimated from the difference, and as a result, the relative coating area can be analyzed. 21 changes in film thickness in the dry state.

(second embodiment)

Next, the reduced-pressure drying device 123c provided with the inspection device 200 of the second embodiment will be described. In addition, in the following description, the same code|symbol as a part already demonstrated is attached|subjected to the part similar to what was already demonstrated, and redundant description is abbreviate|omitted.

In the embodiment of FIG. 2, the arrangement of the imaging unit is changed. 15 is a schematic enlarged cross-sectional view showing the vicinity of the imaging unit 311 of the imaging unit 310 of the second embodiment.

As shown in FIG. 15 , in the second embodiment, the imaging unit 311 is arranged such that the optical axis of the imaging unit 311 is inclined with respect to the main surface of the substrate G. As shown in FIG. In addition, as the illuminating part 312 of the imaging unit 310, the illuminating part of coaxial illumination can be used similarly to 1st Embodiment.

In addition, the imaging unit 310 may further include an auxiliary lighting unit 320 . The auxiliary lighting unit 320 is arranged, for example, above the coating area 21 which is an object to be photographed, and illuminates the substrate G with light for photographing. In addition, in FIG. 15 , the application region 21 is schematically shown by a dotted closed curve for easy understanding.

In the second embodiment, by arranging the imaging unit 311 as described above, it is possible to detect the drying state of the application area 21 at an early stage similarly to the first embodiment. In addition, in the second embodiment, by arranging the imaging unit 311 as described above, the application area 21 is imaged from obliquely above. The color density of the application area 21 photographed from obliquely above may show a relatively large change as drying progresses. Therefore, in the second embodiment, the drying state of the application area 21 can be detected more accurately.

In addition, in the second embodiment, the volume of the application area 21 photographed obliquely from above may be obtained, and the change in volume with respect to the dry state of the application area 21 may be analyzed.

(third embodiment)

Next, the reduced-pressure drying device 123c provided with the inspection device 200 of the third embodiment will be described. In the third embodiment, a polarizing filter 400 is provided as shown by phantom lines in FIG. 9 . Thereby, the color density of the application|coated area 21 can be measured more accurately, As a result, an accurate dry state can be detected.

As described below in detail, the polarizing filter 400 is disposed between the imaging unit 11 and the application region 21 of the substrate G (see FIG. 11 ). In addition, in FIG. 9, in order to simplify the illustration, only the polarizing filter 400 arranged between the imaging part 11a and the application area 21 is shown, and the polarizing filter 400 arranged between the imaging parts 11b and 11c and the application area 21 is omitted. An illustration of the polarizing filter 400 in between.

However, the light of the illuminating part 12 is irradiated to the application|coating area|region 21, and is reflected in the application|coating area|region 21. The reflected light from the coating area 21 includes "internal reflection light" that reaches the inside of the coating area 21 and is reflected on the upper surface of the substrate G, and light that does not reach the inside of the coating area 21 and is diffusely reflected on the surface of the coating area 21. "Surface Reflects Light". The diffusely reflected surface reflected light becomes a main factor of noise (noise) for the imaging unit 11, so it is not lighted as much as possible.

Therefore, in the polarizing filter 400, the light having the phase of the above-mentioned internally reflected light passes through the central part through which the optical axis of the imaging unit 11 passes, and the direction of polarization is made to be perpendicular to the light having the phase of the surface reflected light after diffuse reflection. The peripheral portion surrounding the central portion is not passed.

Accordingly, in the imaging unit 11 , the reception of diffusely reflected surface reflected light can be reduced by the polarizing filter 400 , and the influence of the surface reflected light can be suppressed. Therefore, in the third embodiment, the color density of the application area 21 can be measured more accurately, and as a result, an accurate dry state can be detected.

(first modified example)

Next, the reduced-pressure drying device 123c provided with the inspection device 200 of the first modified example will be described.

In the reduced pressure drying device 123c of the first modified example, a notification unit 410 is provided as shown by phantom lines in FIG. 10 . In addition, in the reduced pressure drying device 123c, if the dry state detection unit 141f, for example, deviates from the predetermined range after the rate of change of the color density falls within the predetermined range, it is estimated that the dryness may have occurred in the reduced pressure drying device 123c. Any abnormalities are notified to the user through the notification unit 410 .

A display, a buzzer, etc. can be used as the notification unit 410, and when it is estimated that something abnormal has occurred in the vacuum drying apparatus 123c, for example, a display indicating the occurrence of the abnormality is displayed or the buzzer sounds. Thereby, the user can recognize abnormality of the reduced-pressure drying apparatus 123c at an early stage.

In addition, in the reduced-pressure drying apparatus 123c of a 1st modification, as shown by the imaginary line in FIG. 10, the photodetector 420 may be provided. The light measuring device 420 is provided in the lighting unit 12 and measures the light quantity of the lighting unit 12 .

Information indicating the amount of light measured by the light measuring device 420 is output to the lighting control unit 141a. The lighting control unit 141 a notifies the user through the notification unit 410 when, for example, the light intensity of the lighting unit 12 decreases and the deterioration of the lighting unit 12 is detected.

Thereby, for example, the user can be urged to perform maintenance on the lighting unit 12 before the color density of the application area 21 cannot be accurately measured due to aging deterioration of the lighting unit 12 . That is, it is possible to avoid a situation where the color density of the application area 21 cannot be accurately measured due to aging deterioration of the illumination unit 12 and the detection accuracy of the dry state of the application area 21 decreases.

(second modified example)

Next, a second modified example will be described. In the reduced-pressure drying device 123c of the second modified example, the wavelength of the light irradiated from the illumination unit 12 to the application area 21 is changed according to the type of color density to be measured.

Specifically, the value of the color density of the application area 21 measured by the density measurement unit 141 d may vary depending on the wavelength of light irradiated from the illumination unit 12 . Therefore, in the second modified example, the illumination control unit 141 a selects a wavelength that is likely to show a change in color density as the dry state progresses according to the type of color density of the application area 21 to be measured, and irradiates the application area 21 . light of the selected wavelength. In addition, the wavelength selected by the illumination control part 141a can be the value which derived the suitable value in advance by experiment etc., and memorize|stored in the storage part 142 etc., for example.

Thereby, the dry state detection part 141f can accurately grasp the change of color density accompanying progress of a dry state, As a result, the dry state of the application|coated area|region 21 can be detected accurately. In addition, by changing the wavelength of light as described above, damage to the applied ink can be reduced, and a captured image that is easier to observe can also be obtained.

(third modified example)

Next, a third modified example will be described. In the decompression drying device 123c of the third modified example, the imaging unit 11 is configured as an infrared image sensor camera having a telephoto lens made of a material having a relatively high infrared transmittance. Also in this case, a material having a relatively high transmittance of infrared rays is used for the window portion 152 .

In the third modified example, it is possible to measure the intensity of infrared rays released from the coating area 21 of the substrate G as the measurement target by using an infrared image sensing camera (such as an infrared thermal camera), and observe the temperature distribution and temperature image of the coating area 21. . In addition, by using an infrared image sensing camera (such as an infrared thermal camera), high-speed and non-contact temperature measurement can be performed.

Furthermore, if the measured temperature of the application area 21 is stored in the storage unit 142 as the dry state information 142d, the change in temperature of the application area 21 with respect to the dry state of the application area 21 can be analyzed.

In addition, the respective configurations described in the first to third embodiments and the first to third modification examples described above can also be appropriately combined. That is, for example, the notification unit 410 of the first modification example and the illumination control unit 141 a that changes the wavelength of light of the illumination unit 12 of the second modification example may be combined in the configuration of the first embodiment.

In addition, in the above, the top 150a of the chamber 150 is rectangular in plan view, and the window portion 152 and the first to third imaging units 210a to 210c are arranged along the diagonal of the top 150a, but the present invention is not limited thereto. . That is, for example, the window portion 152 and the first to third imaging units 210 a to 210 c may be arranged along the X-axis direction or the Y-axis direction with respect to the top 150 a.

In addition, in the above-mentioned configuration, continuous captured images showing the progress of drying of the application area 21 are included in the captured image information 142a. Thereby, for example, when setting the drying schedule of the reduced-pressure drying process of the reduced-pressure drying devices 121c, 122c, and 123c, optimization can be efficiently realized by analyzing consecutive captured images.

More effects and modifications can be easily obtained by practitioners. Therefore, further aspects of the present invention are not limited to the specific details and representative embodiments shown and described above. Therefore, various modifications can be made without departing from the general inventive concept and scope defined by the appended claims and their equivalents.

Claims (9)

1. a kind of check device characterized by comprising

The shoot part that the area of application that organic material is coated in substrate is shot；

Drying regime test section detects the coating based on the colour saturation of the described the area of application shot by the shoot part The drying regime in region；With

Judging part calculates the value for indicating the variation of colour saturation of described the area of application, and judges that the calculated value is It is no in preset prescribed limit,

In the case where being judged as that the calculated value is in the prescribed limit by the judging part, the drying regime inspection Survey portion detects that described the area of application has become the state dried.

2. check device as described in claim 1, it is characterised in that:

The colour saturation includes red-color concentration, green concentration and blue intensity,

The drying regime test section selects the red-color concentration, the green concentration and institute according to the type of described the area of application At least one of blue intensity colour saturation is stated, the drying regime is detected based on the selected colour saturation.

3. check device as claimed in claim 1 or 2, it is characterised in that:

The drying regime test section detects the drying regime based on the colour saturation at multiple positions in described the area of application.

4. check device as claimed in claim 1 or 2, it is characterised in that:

The shoot part is configured to its optical axis and tilts relative to described the area of application.

5. check device as claimed in claim 1 or 2, it is characterised in that:

Including the polarizing filter being configured between the shoot part and described the area of application of the substrate.

6. a kind of decompression dry device characterized by comprising

Check device according to any one of claims 1 to 5；

For storing the chamber of the substrate；With

To the mechanism of decompressor depressurized in the chamber.

7. decompression dry device as claimed in claim 6, it is characterised in that:

Window portion including the chamber is arranged in,

The shoot part shoots described the area of application across the window portion.

8. decompression dry device as claimed in claim 6 characterized by comprising

Keep the maintaining part of the substrate；

Make the lifting unit of the maintaining part lifting；With

The lifting unit is controlled according to the drying regime detected to make the elevating control portion of the maintaining part lifting.

9. a kind of control method of decompression dry device characterized by comprising

The shooting step that the area of application that organic material is coated in substrate is shot；

The drying of described the area of application is detected based on the colour saturation of captured described the area of application in the shooting step The drying regime detecting step of state；With

Drying time setting procedure, based on the detected drying regime in the drying regime detecting step, setting The drying time that the chamber indoor pressure-reducing for storing the substrate is dried.