CN106934444B

CN106934444B - Modular structure electronic patch

Info

Publication number: CN106934444B
Application number: CN201511025916.3A
Authority: CN
Inventors: 梅俊峰; 李江
Original assignee: Vivalnk Inc
Current assignee: Hangzhou Weiling Medical Technology Co.,Ltd.
Priority date: 2015-12-30
Filing date: 2015-12-30
Publication date: 2020-04-17
Anticipated expiration: 2035-12-30
Also published as: CN106934444A

Abstract

The invention discloses an electronic patch combination, which comprises a first electronic patch, a first adhesive layer, a second adhesive layer and a second window, wherein the first electronic patch comprises an upper surface, a lower surface and a first group of conductive connection points positioned on the upper surface, and the first adhesive layer is positioned on the first electronic patch and comprises a first window. The first window is for exposing a first set of one or more conductive connection points. And the second electronic patch is positioned on the first adhesive layer and comprises a lower surface and one or more second conductive connection points positioned on the lower surface. The first set of conductive connection points on the upper surface of the first electronic patch is configured to contact one or more second conductive connection points on the lower surface of the second electronic patch through a first window in the first adhesive layer. The electronic patch has a modular structure, so that the electronic patch structure has multiple functions, can be flexibly combined and stacked for use in different places according to application requirements, can be repeatedly utilized, and has high economical efficiency.

Description

Modular structure electronic patch

Technical Field

The invention relates to electronic equipment, in particular to an electronic patch which can be attached to the skin of a human body or the surface of an object.

Background

The wearable patch or tag may communicate with smartphones and other devices using WiFi, bluetooth, or NFC technology.

Near Field Communication (NFC) is a wireless communication standard that enables two devices within a short distance to establish a communication channel through radio waves in the frequency range of 13.56MHz in a short time. NFC is a very effective technique for transferring data between two devices within a short distance. This technology is more secure than other wireless technologies such as bluetooth, Wi-Fi, etc., since it requires two devices to be close to each other (within 10 centimeters). NFC can therefore be seen as a simple and secure tool to establish a bidirectional fast connection for data transfer. One of the two NFC devices may be a passive NFC patch, using passive energy harvested from the active electromagnetic coupling of the reader, thereby bringing the further benefit of not requiring the use of batteries in the system, simplifying the product design and making it possible to use it as a disposable product.

Where long-range communication is required, such as over 10 meters, and there is no need to touch the NFC patch reader at close range from time to time, data can be automatically and continuously collected with minimal operator intervention. In this case, bluetooth and WiFi are more preferred and are equipped with 1.5 volt or 3 volt batteries.

A wearable tag (or patch) is an electronic tag that can be worn by a user. The wearable patch is required to be capable of being directly attached to the skin of a user, and the function lasts for several hours to several months. The wearable patch may contain a microelectronic system, accessible using NFC, bluetooth, WiFi, or other wireless technology. For example, an authentication wearable patch may be used to identify a user's smartphone for authentication purposes. It can also be combined with different sensors for other purposes such as vital signal monitoring, heartbeat, motion tracking, blood pressure, temperature measurement and electrocardiogram detection.

Despite the extensive development work done in the early days, conventional wearable devices still face several major drawbacks: may not provide sufficient comfort to the wearer; the time length of the adhesive tape adhered to the body of the user can not reach the specified time; and are generally aesthetically undesirable. Another disadvantage of conventional wearable patches is that the rigid polymer substrate provides poor breathability to the skin. The accumulation of sweat moisture can cause skin discomfort and irritation, especially after a period of wear. In addition, the rigid substrate is difficult to conform closely to the curved surface, and therefore some critical biological information needs to be collected by direct contact with the skin without leaving an air gap. For example, an electrocardiogram (commonly referred to as an ECG) can capture and convert the electrical impulses generated by the polarization and depolarization of cardiac tissue into waveforms. These signals need to be picked up by electrodes attached directly to the skin surface and recorded and displayed by an external device. The air gap between the electrode and the skin surface can lead to measurement inaccuracies. In addition, conventional wearable devices are often not sufficiently tough to sustain repeated stretching of the wearable patch as it moves with the body area to which the patch is attached. The layers inside the wearable patch may crack and delaminate under pressure, rendering the patch unusable.

A wearable tag is a particular type of electronic patch. More generally, the electronic patch can be attached to not only a human body but also other objects, such as computers, mobile phones, clothes, packaging materials, shipping boxes and other goods. The electronic patch may communicate wirelessly with a cell phone or other device via NFC, bluetooth, WiFi, or other means.

The electronic patch may be used to track an object by performing sound, light, or vibration generating functions. As various applications and human needs become increasingly complex, the number of functional tasks required to be performed by electronic patches is rapidly increasing.

There is therefore a need for a comfortable and economical electronic patch that can measure different signals, or perform different driving functions.

Disclosure of Invention

The present invention seeks to address the above limitations of conventional wearable patches and electronic patches. The electronic patch has a modular structure, so that the electronic patch structure has multiple functions, can be flexibly combined and stacked for use in different places according to standard application and requirements, can be repeatedly used, and has high economical efficiency. The device can be applied to measuring signals such as body temperature, heartbeat, blood pressure, electrocardiogram, electroencephalogram, electromyogram signals, motion signals and the like, or performing functions such as sounding, lighting or vibration generation and the like.

In addition, the electronic patch has high flexibility and flexibility, and can be used for supporting electronic elements such as circuits and chips, so that the electronic patch is suitable for being used as a wearable tag. The electronic patch described herein can change physical shape and size, relieve stress such as repetitive stretch, thereby increasing durability of the electronic patch and providing comfort to a user. The electronic patch described in the present specification can be attached to the skin for a long time, can be attached durably even by subcutaneous muscle exercise, and provides comfort to the user.

In addition, the electronic patch can measure human body electric signals and has the advantages of extensibility, flexibility, air permeability and use comfort.

The invention relates to an electronic patch combination, which comprises: the first electronic patch comprises an upper surface, a lower surface and a first group of one or more conductive connection points positioned on the upper surface, wherein the lower surface structure is used for being attached to the surface of human skin or an object; a first adhesive layer on the first electronic patch comprising a first window, wherein the first window is configured to expose a first set of one or more conductive connection points; and a second electronic patch located on the first adhesive layer, wherein the second electronic patch includes a lower surface and one or more second conductive connection points located on the lower surface, wherein a first set of the one or more conductive connection points located on the upper surface of the first electronic patch is configured to contact the one or more second conductive connection points located on the lower surface of the second electronic patch through a first window located on the first adhesive layer.

Practical applications of the system may include one or more of the following components: at least portions of the first set of one or more conductive connection points and the second set of one or more conductive connection points may be made of an elastic or elastomeric material having a conductive material embedded therein. The conductive connection points may also be made of conductive mechanical parts such as springs or snap-locks. At least one of the first electronic patch and the second electronic patch may include a chip and a conductive circuit. The chip and the conductive circuit may be in wireless communication with an external device based on Near Field Communication (NFC), Wi-Fi, bluetooth, or RFID wireless communication standards. The conductive circuit may include an antenna configured to receive or transmit wireless signals when communicating with an external device. At least one of the first electronic patch and the second electronic patch may include at least one sensor or driver. The sensor may include an electrode configured to contact the user's body and collect electrical signals from the user's body. The first electronic patch and the second electronic patch may include at least one sensor or driver, respectively, wherein the sensor or driver on one of the first electronic patch and the second electronic patch is configured to dynamically change its function in response to a measured signal or a control signal of the sensor or driver on the other of the first electronic patch and the second electronic patch. At least one of the first electronic patch and the second electronic patch may include an elastic layer and a support substrate configured to support at least one sensor or actuator. The support substrate may have a young's modulus greater than 0.5 Gpa. The elastic layer may have a young's modulus of less than 0.3 Gpa. The first electronics layer may also include a second set of one or more conductive connection points located on the upper surface, wherein the first adhesive layer may include a second window, wherein the second electronic patch may include a third window, and the electronic patch assembly may further include: a second adhesive layer on the second electronic patch, the second adhesive layer including a fourth window, wherein the second, third, and fourth windows are configured to expose a second set of one or more conductive connection points; and a third electronic patch located on the second adhesive layer, wherein the second electronic patch includes a lower surface and one or more third conductive connection points located on the lower surface, and wherein a second set of the one or more third conductive connection points located on the upper surface of the first electronic patch is configured to contact the one or more third conductive connection points on the lower surface of the second electronic patch through the second, third, and fourth windows. The electronic patch assembly may further comprise a fourth electronic patch overlying the first electronic patch and disposed adjacent to the second electronic patch, wherein the first electronic patch comprises a third set of one or more conductive connection points disposed on the upper surface, wherein the fourth electronic patch comprises a lower surface and one or more conductive connection points disposed on the lower surface, and wherein the one or more fourth conductive connection points are configured to make electrical contact with the third set of one or more conductive connection points. The electronic patch assembly may further include a third adhesive layer between the first electronic patch layer and the fourth electronic patch layer.

In another aspect, the present invention relates to an electronic patch assembly comprising a first electronic patch comprising an upper surface, a lower surface, and one or more first conductive connection points disposed on the upper surface, wherein the lower surface is configured for attachment to a skin or object surface of a person; the second electronic patch covers the first electronic patch, wherein the second electronic patch comprises a lower surface and one or more second conductive connection points, and is positioned on the lower surface; introducing magnetic material on the upper surface of the first electronic patch and the lower surface of the second electronic patch, wherein the magnetic material is configured to attract each other such that the one or more first conductive connection points are in contact with the one or more second conductive connection points.

Implementations of the system may include one or more of the following components: the magnetic material may include a permanent magnetic material on at least one of the upper surface of the first electronic patch or the lower surface of the second electronic patch. At least portions of the one or more first conductive connection points and the one or more second conductive connection points may be made of an elastic or elastomeric material having a conductive material embedded therein. The conductive connection points may also be made of conductive mechanical parts such as springs or snap-locks. When the first electronic patch is bonded to the main electronic patch, the conductive connection point on the first modular electronic patch makes a secure electrical contact with the conductive connection point on the main electronic patch. The electronic patch assembly may further include a third electronic patch overlying the first electronic patch, wherein the third electronic patch includes a lower surface and one or more third conductive connection points on the lower surface, wherein the third electronic patch is electrically connected to the first electronic patch and is magnetically coupled together.

In another aspect, the present invention relates to an electronic patch assembly comprising a first electronic patch including an upper surface, a lower surface, and one or more first conductive connection points on the upper surface, wherein the lower surface is configured for attachment to a skin or object surface of a person; the second electronic patch is covered on the first electronic patch, wherein the second electronic patch comprises a lower surface and one or more second conductive connection points positioned on the lower surface; and a pair of hook and loop hasps respectively fixed on the upper surface of the first electronic patch and the lower surface of the second electronic patch, wherein the hook and loop hasps are configured to pull up the first electronic patch and the second electronic patch so as to enable the one or more first conductive connection points to be contacted with the one or more second conductive connection points.

Implementations of the system may include one or more of the following components: at least portions of the one or more first conductive connection points and the one or more second conductive connection points may be made of a matrix of resilient or elastomeric material having a conductive material embedded therein. The conductive connection points may also be made of resilient mechanical parts such as springs or snap-locks. When the first electronic patch is bonded to the main electronic patch, the conductive connection point on the first modular electronic patch makes a secure electrical contact with the conductive connection point on the main electronic patch. The electronic patch assembly may further comprise a third electronic patch overlying the first electronic patch, wherein the third electronic patch comprises a lower surface and one or more third conductive connection points on the lower surface, wherein the third electronic patch makes electrical contact with the first electronic patch while being physically bonded together by a hook and loop mechanism.

The above and other aspects, implementations, and other features are specifically set forth in the accompanying drawings, detailed description, and claims.

Drawings

Fig. 1 shows an electronic patch that can be attached to the skin of a user.

Fig. 2A is an exploded perspective view of a combination including a modular electronic patch attached to a main electronic patch in accordance with an example of the invention.

Fig. 2B is an exploded cross-sectional view of the modular electronic patch and the main electronic patch shown in fig. 2A.

Fig. 2C is a combined cross-sectional view including the modular electronic patch and the host electronic patch as shown in fig. 2A and 2B.

Fig. 3A is an assembled exploded perspective view including two modular electronic patches stacked on a main electronic patch in accordance with an example of the present invention.

Fig. 3B is an exploded cross-sectional view of the two modular electronic patches and the main electronic patch shown in fig. 3A.

Fig. 3C is a combined cross-sectional view of the modular electronic patch shown in fig. 3A and 3B including two modular electronic patches and a host electronic patch.

Fig. 4 is an exploded perspective view of a modular electronic patch according to an example of the invention including a plurality of modular electronic patches positioned in parallel on a main electronic patch.

Fig. 5 is an exploded cross-sectional view of two electronic patches magnetically coupled together in accordance with an example of the invention.

Fig. 6 is an exploded cross-sectional view of two electronic patches connected by a hook and loop attachment mechanism in accordance with an embodiment of the present invention.

Detailed Description

The present invention is intended to provide an electronic patch having a wide range of sensing and/or driving functions. The electronic patch 100 shown in fig. 1 can be placed on the skin surface 110 of a human body and attached to the skin, such as the forehead, hands, wrists, arms, shoulders, chest, waist, legs, and feet. Flexible electronic patch 100 may be used to measure signals such as body temperature, heart beat, blood pressure, electrocardiogram signals, motion signals, or perform sound, light, or vibration generating functions. Electronic patch 100 may also be used for attachment to an object surface for tracking, measuring, or generating signals.

Referring to fig. 2A-2C, the electronic patch assembly 200 includes a main electronic patch 210 including a plurality of conductive connection points 215,216, 217 on an upper surface of the main electronic patch 210. The conductive connection points 215, 216, 217 may be arranged in groups, as shown below, configured for connection with different electronic patches. The conductive connection points 215, 216, 217 may be formed from a matrix of resilient or elastomeric material, such as silicone or polyurethane, embedded with a conductive material, such as silver particles or silver flakes. The connection points may also be made of conductive mechanical parts as described above.

The main electronic patch 210 may include a circuit 211, electronic components 212, and a semiconductor chip (or chips) 213 to provide one or more functions. The lower surface of the main electronic patch 210 may be applied with an adhesive so that it can be attached to the skin of a human or the surface of an object.

The electronic patch assembly 200 may also include a modular electronic patch 230 on the adhesive layer 220 stacked on the main electronic patch 210. The modular electronic patch 230 may include a circuit 231, a semiconductor chip 233, and other electronic components. The adhesive layer 220 includes a plurality of

windows

225, 226, 227 for exposing the connection points 215, 216, 217, respectively. The adhesive layer 220 may be a pressure sensitive adhesive or a repositionable adhesive that can be easily removed without damaging the primary electronic patch. The modular electronic patch 230 has conductive connection points 235 on its lower surface. The connection point 235 is adapted to contact the connection point 215 on the main electronic patch 210 through the window 225 on the adhesive layer 220. The modular electronic patch 230 may include

windows

236, 237 that, in combination with the

windows

226, 227 in the adhesive layer 220, expose the connection points 216, 217, respectively, on the primary electronic patch 210.

The electronic communication between the modular electronic patch 230 and the main electronic patch 210 enables them to share communication and control functions in the electronic patch combination 200. For example, if the master electronic patch 210 includes functionality to wirelessly communicate with an external device, control and measurement information related to the modular electronic patch 230 may be communicated to the external device through the master electronic patch 210. The functionality of the main electronic patch 210 may be flexibly expanded by electrical connection to one or more modular electronic patches. The primary electronic patch 210 serves as a system frame to which a set of modular component patches, such as 230, are attached. The functionality of the entire electronic patch 200 may be specifically tailored by integrating a single or multiple modular electronic patches 230.

In some examples, the electronic patch assembly 200 may include some sort of "local intelligence" that enables the modular electronic patch 230 and the master electronic patch 210 to dynamically alter how each function is performed. In other words, the sensor and/or driver on one of the

electronic patches

210, 230 may dynamically change its function in response to the measured or control signal of the sensor and/or driver on the other of the

electronic patches

210, 230. For example, the main electronic patch 210 may measure the electrical activity of the body's organs such as electrocardiogram, electroencephalogram, electromyogram, while the modular electronic patch 230 may measure the heartbeat or/and produce light or sound signals. The master electronic patch 210 may have such logic and intelligence pre-stored or programmed to send control signals to the modular electronic patch 230 in response to electrical signals measured from the human body. One application of this approach is that an electrocardiogram and heart beat can be measured simultaneously, providing confirmation for analysis. For example, in one application, when an abnormal electrocardiogram signal is detected, the main electronic patch 210 may send a control signal to the modular electronic patch 230 causing it to send an optical or acoustic alarm signal.

In another example, the modular electronic patch 230 may include a temperature sensor that outputs an electrical signal indicative of the measured ambient temperature, while the bottom primary electronic patch 210 measures the body surface temperature by directly contacting the skin surface. The ambient temperature electrical signal read by the modular electronic patch 230 is transmitted to the host electronic patch 210 through the connection points 236 and 215 that are in contact with each other. The ambient temperature reading taken by the modular electronic patch 230 can be used as an important indicator of the body surface temperature reading taken from the bottom main electronic patch 210. This can be used in situations where accurate measurement of body temperature is required, such as measuring the temperature cycle of a female to predict the best time to prepare for pregnancy.

The primary electronic patch 210 and the modular electronic patch 230 may each include one or more layers. For example, one or more elastomeric layers and a support substrate may be included. The elastic layer may be comprised of a viscoelastic polymer having a low young's modulus and a high strain-to-failure. In some examples, the elastic layer may have a young's modulus of less than 0.3 Gpa. In some cases, the elastic layer may have a Young's modulus of less than 0.1GPa to enhance flexibility and adhesion. Suitable materials for elastic layer 210 include elastomers and viscoelastic polymers such as silicone and medical polyurethane, which is a transparent medical dressing for covering and protecting wounds, is breathable, and is conformable to the skin. On the other hand, the support substrate has sufficient rigidity to support the circuit 211, such as an antenna circuit, and the electronic components 212, such as resistors, capacitors, sensors, drivers, chemical delivery devices, and the like, and the semiconductor chip 213. Other electronic components may include capacitors, transformers, resistors, metal pads, diodes, transistors, and amplifiers. In some examples, the support substrate may have a Young's modulus greater than 0.5GPa, such as between 1.0 and 10 GPa. Suitable materials for the substrate are, for example, polyimides, polyesters, aramids, composites, glass epoxy resins and polyethylene naphthalate. Importantly, the support substrate structure is designed to provide extensibility to the primary and modular electronic patches. The support substrate may include one or more openings that allow the electronic patch to shear and stretch when stretched or elongated. By selectively forming openings in the support substrate, the effective flexibility of the support substrate can be made substantially higher than the inherent elasticity of the support substrate material (lowering the effective elastic constant).

Multilayer wearable labels or patch sheets having stretch and shear properties as details of a particular illustration of the electronic patch of the present invention are set forth in co-assigned pending U.S. patent application 14/454, 457 entitled "extensible multilayer wearable label capable of wireless communication," filed on 8/7/2014; it is stated in U.S. patent application 14/491, 665 entitled "highly flexible wearable wireless patch with stress relief", filed 9/19/2014; also set forth in U.S. patent application 14/520, 674, entitled "Flexible wearable Patch sheet capable of measuring electronic signals", filed 10/2014. The contents of the patent application specifications for these applications are incorporated herein by reference.

In some examples, three electronic patches may be stacked on top of each other to achieve a wider range of functionality. According to fig. 3A-3C, the electronic patch assembly 300 includes a main electronic patch 210 and two modular

electronic patches

230, 250 stacked in sequence. Similar to the electronic patch assembly 200 described above, the main electronic patch 210 and the modular electronic patch 230 are stacked on top of each other with the adhesive layer 220 therebetween.

The main electronic patch 210 may include an adhesive layer on the lower surface. The adhesive layer may be a pressure sensitive material such that the main electronic patch 210 is tightly attached to the skin under pressure, for example, by pressing with a thumb. For example, the adhesive layer may be made of a medical pressure sensitive adhesive. An example of a material that can be used for such an adhesive is a medical grade pre-set hypoallergenic pressure sensitive adhesive.

The main electronic patch 210 may include a circuit, such as an antenna circuit, electronic components, and a semiconductor chip (or chips) to perform one or more functions, but are not shown for clarity. The main electronic patch 210 may have an adhesive applied to its lower surface to allow it to be attached to the skin or object of a person. The primary electronic patch 210 and the modular electronic patch 230 may be in electronic communication with each other through a conductive connection 215 and a conductive connection 235, which are in contact with each other through a window 225 in the adhesive layer.

As described above, the

windows

226, 227 in the adhesive layer 220 and the

windows

236, 237 in the modular electronic patch 230 connect the conductive connection points 216, 217 to the second modular electronic patch 250. The electronic patch assembly 200 further includes an adhesive layer 240 disposed on the lower surface of the modular electronic patch 250. The adhesive layer 240 includes a plurality of

windows

245, 246, 247 aligned with the connection points 215/235, 216, 217, respectively.

Modular electronic patch 250 is disposed on adhesive layer 240. The modular electronic patch 250 includes conductive connection points 256 on its lower surface for contacting the conductive connection points 216 on the main electronic patch 210 through the windows 226,236, 246 in the adhesive layer and modular electronic patch 230. The modular electronic patch 250 may include

windows

255, 257 for additional electronic patches to be stacked on and in communication with

connection points

235, 217 located on the modular electronic patch 230 and the main electronic patch 210.

Similar to the description above regarding the electronic patch assembly 200, the main electronic patch 210 and the modular

electronic patches

230 and 250 may each include one or more layers, such as one or more elastomeric layers and a supporting substrate, for supporting electronic components.

In some examples, the configuration of at least one of the main electronic patch 210 and the modular

electronic patches

230, 250 is for wireless communication with external devices based on NFC standards, RFID, Wi-Fi, or bluetooth or like wireless communication standards. The host electronic patch 210 and/or the two modular

electronic patches

230, 250 may include a supporting substrate, one or more semiconductor chips, a circuit, an antenna circuit formed on or within the supporting substrate. Examples of external devices are smart phones, computers, mobile payment devices, scanners and readers (e.g., RFID readers), medical devices, security systems, personal identification systems, etc. The antenna circuit is compatible with NFC communications, with a frequency range of approximately 13.56MHz, as described above, and is also compatible with UHF RFID, with a frequency range of approximately 915 MHz; compatible with Bluetooth, and the frequency range is 2.4GHz or 5 GHz; or compatible with other kinds of wireless communication.

Details of wireless communication between a multi-layer wearable tag or patch having extensibility and cuttability and an external device are set forth in co-assigned pending U.S. patent application 14/454, 457 entitled "extensible multi-layer wearable tag capable of wireless communication," filed on 8/7/2014; stated in U.S. patent application No. 14/491, 665 entitled "highly flexible wearable wireless patch with stress relief", filed 9/19/2014; also set forth in U.S. patent application 14/520, 674, entitled "Flexible wearable Patch sheet capable of measuring electronic signals", filed 10/2014. The patent application specifications for these applications are compatible with the electronic patches described in this patent application, the contents of which are incorporated herein by reference.

For example, the main electronic patch 210 may include necessary semiconductor chips, circuitry, and optionally an antenna circuit for wireless communication. In one application, the main electronic patch 210 may also include an electrode layer configured to contact the skin of a user to measure electrical activity of a body organ, such as electrocardiogram, electroencephalogram, electromyogram, and the like. The main electronic patch 210 may transmit such electrical signals to an external device. Details regarding multilayer wearable tags or patches capable of measuring electrical signals from the human body and compatible with the electronic patches described herein are set forth in commonly assigned pending U.S. patent application 14/520, 674, entitled "Flexible wearable patch capable of measuring electrical signals", filed on month 10, 22, 2014. The contents of which are incorporated herein by reference.

In another example, the modular electronic patch 250 may include a device, such as a sensor, configured to measure a user's heartbeat. The electrical signal output of the sensor is transmitted to the main electronic patch 210 via the connection points 256 and 216, which are in contact with each other, and in turn transmitted to an external device via wireless. Similarly, additional modular electronic patches may also be added to the electronic patch combination to achieve additional functionality.

In some examples, the modular electronic patch may be a disposable component, while the main electronic patch may be used for a long period of time. The main electronic patch may include more complex and expensive components to perform functions such as wireless communication and some actuation functions. When different applications need to be realized, the modular electronic patch can be replaced.

In some examples, a modular electronic patch may be a battery module that supplies power to the main electronic patch and other modular electronic patches. After the power in the battery is exhausted, the module electronic patch can be removed and independently charged through the charging equipment; it can be replaced with a new battery module.

In some examples, the primary electronic patch may perform primarily a bonding function. The main electronic patch can have an adhesive function on both sides, so that the patch can be attached to the skin of a user and other module electronic patches. After a period of use, if the function is temporarily not needed, the electronic patch assembly can be removed from the user's skin; the master patch may be discarded. The other modular electronic patches stacked on top can be stored for later reuse. If the master patch becomes dirty or loses its adhesive ability, it can be replaced with a new master patch for continued wearing and measurement for a period of time. Thus, the modular electronic patch can be used for days and weeks without losing the adhesive capacity to the skin and without consuming more patches. Sometimes, the top module tile may be a decorative layer with a graphic pattern placed on top of the other tiles of the bottom layer. The patterns can be customized to meet different aesthetic preferences.

The electronic patch combination can comprise a plurality of module electronic patches which are arranged on a main electronic patch side by side. Referring to fig. 4, the electronic patch assembly 400 includes a main electronic patch 410, and three module

electronic patches

450 and 452 stacked side by side on the main electronic patch 410. Similar to the electronic patch assemblies 200, 300 (fig. 2A-3C), the module electronic patches 450-452 are stacked on the main electronic patch 410, and the bonding layers 420-422 are respectively sandwiched therebetween. The main electronic patch 410 and the module electronic patches 450-452 may include circuitry, such as an antenna circuit, electronic components, and a semiconductor chip (or chips) to perform one or more functions, but are not shown for clarity.

The main electronic patch 410 may include a layer of adhesive on its lower surface. The adhesive layer may be a pressure sensitive material such that the main electronic patch 410 is tightly attached to the skin under pressure, for example, by pressing the skin against a thumb. For example, the adhesive layer may be made of a medical pressure sensitive adhesive. An example of a material that can be used for such an adhesive is a medical grade hypoallergenic pressure sensitive adhesive.

The main electronic patch 410 may include a circuit, such as an antenna circuit, electronic components, and a semiconductor chip (or chips) (not shown for clarity) to perform one or more functions. The primary electronic patch 410 and the modular electronic patches 450-452 can be in electronic communication with each other through the windows in the adhesive layer 420-422 via the conductive connection points 415-417 and 435-437, respectively.

In some examples, the host electronic patch and the module electronic patch may be bonded to each other using a different mechanism than the bonding layer. In some examples, as shown in fig. 5, the electronic patch assembly 500 includes a main electronic patch 510 and a module electronic patch 530, which include conductive connection points 515 and 535, respectively. The main electronic patch 510 and the module electronic patch 530 may include a circuit such as an antenna circuit, electronic components and a semiconductor chip (or chips) to perform one or more functions, but are not shown for clarity. The conductive connection points 515 and 535 may be formed from a matrix of an elastomeric or elastomeric material, such as silicone or polyurethane, with conductive material, such as silver particles or silver flakes, embedded therein. The connection points may also be made of conductive mechanical parts such as springs or snap packs. In addition, the main electronic patch 510 and the modular electronic patch 530 may also include

magnets

517 and 537, respectively, which attract each other and may bond the main electronic patch 510 and the modular electronic patch 530 together. The magnetic force pulls the resilient connection points 513, 535 together to increase the contact area and form a closed conductive circuit. The

magnets

517, 537 may also have repelling electrodes that attract each other across the electronic patch 510/530. In another example, one permanent magnetic material may be placed on one electronic die, while another permanent magnetic material is placed in an opposite position on the other electronic die. By inducing opposing magnetic fields in the paramagnetic material, the permanent magnet is attracted to the paramagnetic material. Multiple modular tiles may be stacked together in a manner similar to the stack of magnetic buttons.

In some examples, as shown in fig. 6, the electronic patch assembly 600 includes a main electronic patch 610 and a modular electronic patch 630, each of which includes conductive connection points 615, 635. The main electronic patch 610 and the module electronic patch 630 may include a circuit such as an antenna circuit, electronic components, and a semiconductor chip (or chips) to perform one or more functions, but are not shown for clarity. The main electronic patch 610 and the module electronic patch 630 also include a strap 617 and a hook 637, respectively, fixed to the upper surface of the main electronic patch 610 and the lower surface of the module electronic patch 630, respectively. The snap ring 617 and the hook 637 may be hooked together to bond the main electronic patch 610 to the module electronic patch 630. The elastic connection points 613, 635 are pulled together to form a closed conductive circuit. The tabs 617 and hooks 637 are arranged in pairs in any sequence between the main electronic patch 610 and the module electronic patch 630.

Magnetic and hook and loop-on-loop mechanisms may be incorporated into the

electronic patch assemblies

200 and 300 described in fig. 2A-3C to bond the electronic patches together in place of the adhesive layer between the electronic patches.

In some examples, multiple modular electronic patches may be placed side-by-side on a master electronic patch and connected to the master electronic patch using a magnetic and hook and loop mechanism. In the electronic patch assembly 500 (shown in fig. 5), a second modular electronic patch may be placed on the main electronic patch 510, next to the modular electronic patch 530. The second modular electronic patch is in physical contact with the main electronic patch 510 while making an electrical connection, using a similar mechanism as between the modular electronic patch 530 and the main electronic patch 510.

Similarly, in the electronic patch assembly 600 (shown in fig. 6), a second modular electronic patch may be placed on the main electronic patch 610, next to the modular electronic patch 630. The second modular electronic patch is in physical contact with main electronic patch 610 while making an electrical connection, using a similar mechanism as between modular electronic patch 630 and main electronic patch 610.

The electronic patch has the advantages that the electronic patches with different sensing and driving functions can be flexibly combined, and wider functions can be realized. Furthermore, each modular electronic patch can be made of a simpler construction, since they are not required to carry too much functionality. The modularized electronic patch can be repeatedly used, waste is reduced, and cost is reduced.

Although this document contains many specifics, these should not be construed as limitations on the scope of an invention which may be claimed or which may be claimed in the future, but rather as descriptions of features specific to particular embodiments of the invention. Some features which are described in the context of separate embodiments may also be implemented in combination in a single embodiment. Conversely, various features that are described in the context of a single embodiment can also be implemented in multiple embodiments separately or in any suitable subcombination. Moreover, although features may be described above as acting in certain combinations and even initially claimed as such, one or more features from a claimed combination can in some cases be excised from the combination, and the claimed combination may be directed to a subcombination or variation of a subcombination.

Only a few examples and embodiments thereof have been described herein. Other implementations, variations, modifications and improvements of the examples and embodiments described may be made without departing from the spirit of the invention. For example, the electronic patch of the present invention is not limited to the above examples, and can be applied to various other fields. The materials suitable for the layers of the electronic patch are also not limited to the examples given above. The layout and form of the elastomeric layer, flexible tape layer, vent openings, decorative patterns, semiconductor chip, antenna, metal pads and connecting leads may take other configurations without departing from the spirit of the present invention.

Claims

1. An electronic patch assembly, comprising:

a first electronic patch comprising an upper surface, a lower surface, and a first set of one or more conductive connection points on the upper surface, wherein the lower surface is configured for attachment to human skin or an object surface;

a first adhesive layer on the first electronic patch comprising a first window, wherein the first window is configured to expose a first set of one or more conductive connection points; and

and a second electronic patch located on the first adhesive layer, wherein the second electronic patch includes a lower surface and one or more second conductive connection points located on the lower surface, wherein a first set of the one or more conductive connection points located on the upper surface of the first electronic patch is configured to contact the one or more second conductive connection points located on the lower surface of the second electronic patch through a first window located on the first adhesive layer.

2. An electronic patch combination as claimed in claim 1, wherein at least some of the first set of one or more conductive connection points and the one or more second conductive connection points are made of a conductive material or an elastic or elastomeric material in which a conductive material is embedded.

3. The electronic patch assembly of claim 1, wherein at least one of the first electronic patch and the second electronic patch includes a chip and a conductive circuit.

4. The electronic patch combination of claim 3, wherein the chip and conductive circuit are configured to wirelessly communicate with an external device based on a near field communication, Wi-Fi, bluetooth, or RFID wireless communication standard.

5. An electronic patch combination as claimed in claim 4, wherein the conductive circuit comprises an antenna configured to receive or transmit wireless signals when communicating with an external device.

6. The electronic patch combination of claim 1, wherein at least one of the first electronic patch and the second electronic patch includes at least one sensor or actuator.

7. An electronic patch assembly as claimed in claim 6, wherein the sensor comprises an electrode configured to contact the body of the user and to collect electronic signals from the body of the user.

8. The electronic patch combination of claim 1, wherein the first electronic patch and the second electronic patch each comprise at least one sensor or driver, wherein the sensor or driver on one of the first electronic patch and the second electronic patch is configured to dynamically change the function of the sensor or driver in response to a measured signal or a control signal of the sensor or driver on the other of the first electronic patch and the second electronic patch.

9. The electronic patch assembly of claim 1, wherein at least one of the first electronic patch and the second electronic patch comprises an elastic layer and a support substrate, wherein the support substrate is configured to support at least one sensor or actuator.

10. An electronic patch assembly as claimed in claim 9, wherein the support substrate has a young's modulus greater than 0.5 Gpa.

11. An electronic patch assembly as claimed in claim 9, wherein the elastic layer has a young's modulus of less than 0.3 Gpa.

12. An electronic patch assembly as claimed in claim 1, wherein the first electronic patch comprises a second set of one or more conductive connection points on the top surface, wherein the first adhesive layer comprises a second window, wherein the second electronic patch comprises a third window, and the electronic patch assembly further comprises:

a second adhesive layer on the second electronic patch, the second adhesive layer including a fourth window, wherein the second, third and fourth windows are configured to expose a second set of one or more conductive connection points; and

and a third electronic patch located on the second adhesive layer, wherein the second electronic patch includes a lower surface and one or more third conductive connection points located on the lower surface, and wherein a second set of the one or more third conductive connection points located on the upper surface of the first electronic patch is configured to contact the one or more third conductive connection points on the lower surface of the second electronic patch through the second, third, and fourth windows.

13. The electronic patch combination of claim 1, further comprising:

and a fourth electronic patch covering the first electronic patch and located beside the second electronic patch, wherein the first electronic patch includes a third set of one or more conductive connection points located on the upper surface, wherein the fourth electronic patch includes a lower surface and one or more fourth conductive connection points located on the lower surface, and wherein the one or more fourth conductive connection points are configured to form a point connection with the third set of one or more conductive connection points.

14. An electronic patch combination as claimed in claim 13, further comprising:

and the third bonding layer is positioned between the first electronic patch layer and the fourth electronic patch layer.