CN106911990A - MEMS sonic transducers and its manufacture method - Google Patents
MEMS sonic transducers and its manufacture method Download PDFInfo
- Publication number
- CN106911990A CN106911990A CN201710138893.XA CN201710138893A CN106911990A CN 106911990 A CN106911990 A CN 106911990A CN 201710138893 A CN201710138893 A CN 201710138893A CN 106911990 A CN106911990 A CN 106911990A
- Authority
- CN
- China
- Prior art keywords
- vibrating diaphragm
- movable comb
- fixed fingers
- comb
- substrate
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000000034 method Methods 0.000 title claims abstract description 9
- 238000004519 manufacturing process Methods 0.000 title claims abstract description 7
- 230000005236 sound signal Effects 0.000 claims abstract description 11
- 239000000758 substrate Substances 0.000 claims description 58
- 239000000463 material Substances 0.000 claims description 23
- 238000006073 displacement reaction Methods 0.000 claims description 19
- 229910021421 monocrystalline silicon Inorganic materials 0.000 claims description 11
- 229910021420 polycrystalline silicon Inorganic materials 0.000 claims description 7
- 229920005591 polysilicon Polymers 0.000 claims description 7
- 239000012528 membrane Substances 0.000 claims description 4
- 230000008021 deposition Effects 0.000 claims description 3
- 229920002521 macromolecule Polymers 0.000 claims description 3
- 239000007788 liquid Substances 0.000 claims 1
- 230000010355 oscillation Effects 0.000 claims 1
- 239000000178 monomer Substances 0.000 abstract description 3
- 230000004888 barrier function Effects 0.000 description 10
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 6
- 238000000151 deposition Methods 0.000 description 5
- 238000005530 etching Methods 0.000 description 5
- 238000009413 insulation Methods 0.000 description 5
- 229910001338 liquidmetal Inorganic materials 0.000 description 5
- 210000001520 comb Anatomy 0.000 description 4
- 239000002210 silicon-based material Substances 0.000 description 4
- 239000000377 silicon dioxide Substances 0.000 description 3
- 238000000992 sputter etching Methods 0.000 description 3
- 238000010586 diagram Methods 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- KRHYYFGTRYWZRS-UHFFFAOYSA-N Fluorane Chemical compound F KRHYYFGTRYWZRS-UHFFFAOYSA-N 0.000 description 1
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 1
- 229910000040 hydrogen fluoride Inorganic materials 0.000 description 1
- 239000007769 metal material Substances 0.000 description 1
- 229910052710 silicon Inorganic materials 0.000 description 1
- 239000010703 silicon Substances 0.000 description 1
- 230000006641 stabilisation Effects 0.000 description 1
- 238000011105 stabilization Methods 0.000 description 1
- 230000002463 transducing effect Effects 0.000 description 1
- 230000026683 transduction Effects 0.000 description 1
- 238000010361 transduction Methods 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
- H04R19/00—Electrostatic transducers
- H04R19/04—Microphones
-
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
- H04R31/00—Apparatus or processes specially adapted for the manufacture of transducers or diaphragms therefor
-
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
- H04R2201/00—Details of transducers, loudspeakers or microphones covered by H04R1/00 but not provided for in any of its subgroups
- H04R2201/003—Mems transducers or their use
-
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
- H04R2231/00—Details of apparatus or processes specially adapted for the manufacture of transducers or diaphragms therefor covered by H04R31/00, not provided for in its subgroups
- H04R2231/003—Manufacturing aspects of the outer suspension of loudspeaker or microphone diaphragms or of their connecting aspects to said diaphragms
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Acoustics & Sound (AREA)
- Signal Processing (AREA)
- Manufacturing & Machinery (AREA)
- Electrostatic, Electromagnetic, Magneto- Strictive, And Variable-Resistance Transducers (AREA)
Abstract
The invention discloses a kind of MEMS sonic transducers and its manufacture method, constituted by first movable comb and the first fixed fingers, and in two groups of comb structures being made up of the second movable comb and the second fixed fingers, the movable comb of one of which comb structure is higher than fixed fingers, and the movable comb in another group of comb structure is less than fixed fingers；MEMS sonic transducers of the invention, vibrating diaphragm component can export the audio signal of high frequency in itself, and comb structure can be as the low frequency configuration of transducer, and the driving interface of the two can be planned independently, and be integrated in a monomer can be while export low-and high-frequency signal, so as to provide accurate sound signal.In addition, sonic transducer of the invention, vibrating diaphragm component can also form microphone structure so as to provide extraneous noise signal parameter for the amendment of sound source while audio signal output sound is received, and improve the anti-noise ability of sonic transducer.
Description
Technical field
The present invention relates to field of sound transducers, more precisely, it is related to a kind of sonic transducer with comb structure, for example
MEMS sound-producing devices or it is integrated etc. with MEMS microphone；The invention further relates to a kind of manufacturer of MEMS sonic transducers
Method.
Background technology
Loudspeaker is important electroacoustic transduction part, loudspeaker is both provided with most of consumer electronics product or is raised one's voice
Device module.With the gradually development of the consumer electronics products such as mobile phone, panel computer, people propose more to the performance of loudspeaker
Requirement high.
With developing rapidly for portable product, the demand of Microspeaker is already the emphasis of next micro electronmechanical product,
But the displacement space of MEMS component is often dependant on the thickness of sacrifice layer, this is the maximum limitation of Microspeaker, articulation ability also because
This is limited.
In addition in addition to assembly volume will reduce, the requirement for sound quality is growing day by day, using number for portable product
The size requirements of MEMS component are already run counter in sound signal design of the mode of group to meet low-and high-frequency.
The content of the invention
It is an object of the present invention to provide a kind of new solution of MEMS sonic transducers.
According to the first aspect of the invention, there is provided a kind of MEMS sonic transducers, including substrate and vibrating diaphragm component, it is described
Vibrating diaphragm component is linked together by spring beam with substrate；Wherein, the relative both sides of the vibrating diaphragm component be respectively arranged with to
Few one group of first movable comb, at least one set of second movable comb is respectively arranged with vibrating diaphragm component both sides relative in addition
Tooth；It is provided with the first fixed fingers for being combined together with the first movable comb on the substrate, and for second
The second fixed fingers that movable comb is combined together；
Wherein, constituted by first movable comb and the first fixed fingers, and by the second movable comb and second
In two groups of comb structures that fixed fingers are constituted, the movable comb of one of which comb structure is higher than fixed fingers, another group of comb
Movable comb in toothing is less than fixed fingers；
The vibrating diaphragm component is configured to supply the vibrational state of sonic transducer；
Two groups of comb structures are configured as：Vibrating diaphragm component is respectively under respective electrostatic force overall at two
Displacement on rightabout provides driving force.
Alternatively, first movable comb is higher than the first fixed fingers, and second movable comb is fixed less than second
Comb.
Alternatively, first movable comb is less than the first fixed fingers, and second movable comb is fixed higher than second
Comb.
Alternatively, the vibrating diaphragm component is integrally rectangular, and first movable comb is arranged on vibrating diaphragm component one pair of which
On relative side wall, it is another on relative side wall that second movable comb is arranged on vibrating diaphragm component.
Alternatively, the spring beam is provided with four, four angles of the vibrating diaphragm component for connecting respectively.
Alternatively, the vibrating diaphragm component is integrally rounded, and first movable comb, the second movable comb are evenly distributed on
On the circumferencial direction of vibrating diaphragm component.
Alternatively, the substrate is provided with cavity volume, and the vibrating diaphragm component is arranged in the cavity volume of substrate, and described first fixes
Comb, the second fixed fingers are arranged on the inwall of substrate cavity volume.
Alternatively, the material selection liquid metal film or macromolecule membrane of the spring beam.
Alternatively, the vibrating diaphragm component includes the framework positioned at outside, and the vibrating diaphragm in framework.
Alternatively, the framework and spring beam are one, using identical material.
Alternatively, the vibrating diaphragm is the sounding vibrating diaphragm of sound-producing device, and the vibrating diaphragm selects piezoceramic material.
Alternatively, the vibrating diaphragm is the sounding vibrating diaphragm of sound-producing device, also including for coordinating so that the vibrating diaphragm with vibrating diaphragm
The auxiliary section of vibration.
Alternatively, the vibrating diaphragm is the sounding vibrating diaphragm of exports audio signal；Also include being used to constitute flat board with the vibrating diaphragm
The back pole plate of capacitance structure；The vibrating diaphragm constitutes the microphone that surrounding noise signals are characterized for being input into back pole plate.
Alternatively, first movable comb, the second movable comb, the first fixed fingers, the second fixed fingers are using single
Crystal silicon or polysilicon.
According to another aspect of the present invention, a kind of method for manufacturing above-mentioned MEMS sonic transducers is additionally provided, including it is following
Step：
A) substrate is provided, different height is etched over the substrate and in the first groove of pectinate texture, second groove；
B) conductive layer is deposited on substrate, the conductive layer is filled in first groove, second groove；
C) conductive layer is etched, the first movable comb, the second movable comb is formed in the first groove, second groove
Tooth, the first fixed fingers, the second fixed fingers；
D) framework and spring beam to form vibrating diaphragm component are deposited and etched in the upper surface of substrate；
E) deposition forms vibrating diaphragm on framework；
F) etched substrate, vibrating diaphragm, framework, the first movable comb, the second movable comb, the first fixed fingers, second are consolidated
Determine comb, spring beam to discharge.
MEMS sonic transducers of the invention, vibrating diaphragm component can export the audio signal of high frequency in itself, and comb structure can be with
Used as the low frequency configuration of transducer, and the driving interface of the two can be planned independently, and be integrated in a monomer can be while export
Low-and high-frequency signal, so as to provide accurate sound signal.In addition, sonic transducer of the invention, vibrating diaphragm component is receiving audio letter
While number output sound, microphone structure can also be formed so as to join for the amendment of sound source provides extraneous noise signal
Number, improves the anti-noise ability of sonic transducer.
It was found by the inventors of the present invention that in the prior art, the amplitude of microphone device is limited；In addition, portable product is removed
Assembly volume will reduce outer, and the requirement for sound quality is growing day by day, the sound of low-and high-frequency is met by the way of array
The size requirements of MEMS component are already run counter in message number design.Therefore, the present invention to be realized technical assignment or to be solved
Technical problem certainly be it is that those skilled in the art never expect or it is not expected that, therefore the present invention is a kind of new technology
Scheme.
By referring to the drawings to the detailed description of exemplary embodiment of the invention, further feature of the invention and its
Advantage will be made apparent from.
Brief description of the drawings
The accompanying drawing for being combined in the description and constituting a part for specification shows embodiments of the invention, and even
It is used to explain principle of the invention together with its explanation.
Fig. 1 is the top view of sonic transducer of the present invention.
Fig. 2 is along the first movable comb, the profile in the first fixed fingers direction in Fig. 1.
Fig. 3 is along the second movable comb, the profile in the second fixed fingers direction in Fig. 1.
Fig. 4 is the first movable comb, the comparison diagram of the second movable comb position profile in Fig. 1.
Fig. 5 to Figure 10 is the manufacturing process flow diagram of sonic transducer of the present invention.
Specific embodiment
Describe various exemplary embodiments of the invention in detail now with reference to accompanying drawing.It should be noted that：Unless had in addition
Body illustrates that the part and the positioned opposite of step, numerical expression and numerical value for otherwise illustrating in these embodiments do not limit this
The scope of invention.
The description only actually at least one exemplary embodiment is illustrative below, never as to the present invention
And its any limitation applied or use.
May be not discussed in detail for technology, method and apparatus known to person of ordinary skill in the relevant, but suitable
In the case of, the technology, method and apparatus should be considered as a part for specification.
In all examples shown here and discussion, any occurrence should be construed as merely exemplary, without
It is as limitation.Therefore, other examples of exemplary embodiment can have different values.
It should be noted that：Similar label and letter represents similar terms in following accompanying drawing, therefore, once a certain Xiang Yi
It is defined in individual accompanying drawing, then it need not be further discussed in subsequent accompanying drawing.
The present invention is in order to solve problems of the prior art, there is provided a kind of MEMS sonic transducers, the transducer can
Manufactured with using MEMS technology, and the performance of sonic transducer can be increased substantially, and substantially reduced the body of sonic transducer
Product.
With reference to Fig. 1, MEMS sonic transducers of the invention, Microspeaker, including substrate 1 and vibrating diaphragm component, spring beam
4, the vibrating diaphragm component is linked together by spring beam 4 with substrate 1 so that the vibrating diaphragm component can be suspended on substrate 1.
In a specific embodiment of the invention, the vibrating diaphragm component can be arranged on the end face of substrate 1；At this
Invent in another specific embodiment, cavity volume is provided with the substrate 1, the vibrating diaphragm component is located at the appearance of substrate 1
In chamber, spring beam 4 extends on the in-plane of vibrating diaphragm component, and one end is connected on the inwall of the cavity volume of substrate 1, other end connection
In the side wall of vibrating diaphragm component.The quantity of spring beam 4 can be provided with multiple, be uniformly arranged in the circumferential direction of vibrating diaphragm component,
So as to provide the resilient support of stabilization for vibrating diaphragm component.In order to improve the elastic effect of spring beam 4, can be on spring beam 4
Structure around folding, such as broached-tooth design etc. are set, and this belongs to the common knowledge of those skilled in the art, herein no longer specifically
It is bright.
For example when vibrating diaphragm component of the invention is rectangular configuration, the spring beam 4 can be provided with four, four bullets
Property beam 4 is connected to four angles of vibrating diaphragm component；When vibrating diaphragm component selects circular configuration, multiple spring beams 4 are uniformly distributed
On the circumferencial direction of vibrating diaphragm component.
Vibrating diaphragm component of the invention is configured to supply the vibrational state of sonic transducer, that is to say, that the vibrating diaphragm component
The electric signal for being loaded with audio can be received, by the vibration realizing sonic transducer of vibrating diaphragm component, the sounding of Microspeaker.
Vibrating diaphragm component of the invention is sounding vibrating diaphragm, and it can select piezoceramic material so that this sonic transducer can be with
Constitute piezoelectric actuated sound-producing device.
Certainly, for a person skilled in the art, vibrating diaphragm component of the invention can also be the hair known to other
Acoustic device, such as parallel plate type electrostatically actuated, the sound-producing device of voice coil loudspeaker voice coil actuating.For example, sonic transducer of the invention, can include
For coordinating with vibrating diaphragm component so that the auxiliary section of vibrating diaphragm component vibration, the auxiliary section can be voice coil structure, by sound
The vibration sounding of vibrating diaphragm component is realized in the driving of circle.The auxiliary section can also be magnet, the electromagnetic structure of hot-wire coil mode
Deng by the cooperation between magnet and hot-wire coil, realizing the vibration sounding of vibrating diaphragm component；The driving structure of this several vibrating diaphragm and
Its operation principle belongs to the common knowledge of those skilled in the art, therefore, no longer repeated herein.
Referring to figs. 1 to Fig. 4, vibrating diaphragm component of the invention can include outside framework 3, and shaking in framework 3
Film 2.The framework 3 can select metal material or other materials well-known to those skilled in the art, and it is mainly vibrating diaphragm 2
Support is provided.The framework 3 for example can be rectangular frame, and the vibrating diaphragm 2 is connected on the frame 3 by the position at its edge, shaken
The vibration section of the central region of film 2 is suspended at the hollow position of framework 3 so that the vibration of the vibrating diaphragm 2 will not be subject to the shadow of framework 3
Ring.
Above-mentioned spring beam 4 is attached to the marginal position of framework 3, it is achieved thereby that vibrating diaphragm component connects with the elasticity of substrate 1
Connect.In one preferred embodiment of the invention, the spring beam 4 can use identical material with framework 3, and be one
, can be obtained by depositing, etching same sedimentary in MEMS technology.
Sonic transducer of the invention, the also comb structure including being arranged between vibrating diaphragm component and substrate 1 so that in electrostatic
Can drive whole vibrating diaphragm component that the displacement on vibrating diaphragm component planes direction occurs in the presence of power.
Specifically, at least one set of first movable comb 5 is respectively arranged with the relative both sides of the vibrating diaphragm component, with reference to figure
1, first movable comb 5 can use polysilicon or single crystal silicon material, and it may be provided on the framework 3 of vibrating diaphragm component,
And the first movable comb 5 is arranged on the relative both sides of vibrating diaphragm component.The position of the first movable comb 5 of correspondence on the substrate 1
Install and be equipped with the first fixed fingers 6, first fixed fingers 6 can use with the identical material of the first movable comb 5, it can set
Put on the inwall of the cavity volume of substrate 1, and intersect and be combined together with the first movable comb 5 on vibrating diaphragm component, form comb knot
Structure, is designated as the first comb structure.
At least one set of second movable comb 7 is respectively arranged with the relative both sides of the vibrating diaphragm component, it is described with reference to Fig. 1
Second movable comb 7 can use polysilicon or single crystal silicon material, and it may be provided on the framework 3 of vibrating diaphragm component, and the
Two movable combs 7 are arranged on the relative both sides of vibrating diaphragm component.The position of the second movable comb 7 of correspondence is set on the substrate 1
Have the second fixed fingers 8, second fixed fingers 8 can use with the identical material of the second movable comb 7, it may be provided at lining
On the inwall of the cavity volume of bottom 1, and intersect and be combined together with the second movable comb 7 on vibrating diaphragm component, form comb structure, be designated as
Second comb structure.
Wherein, in the first comb structure being made up of the fixed fingers 6 of first movable comb 5 and first, and by
In the second comb structure that two movable combs 7 and the second fixed fingers 8 are constituted, the movable comb of one of which comb structure is higher than
Fixed fingers, the movable comb in another group of comb structure is less than fixed fingers.Such as described first movable comb 5 is higher than first
Fixed fingers 6, second movable comb 7 is less than the second fixed fingers 8.It is of course also possible to be that first movable comb 5 is low
In the first fixed fingers 6, second movable comb 7 is higher than the second fixed fingers 8.So that two groups of comb structures can be matched somebody with somebody
It is set to：The overall displacement in two opposite directions of vibrating diaphragm component is respectively under respective electrostatic force driving force is provided.
The first fixed fingers 6 are now less than with the first movable comb 5, the second movable comb 7 is higher than the second fixed fingers 8
Example, is described in detail to sonic transducer of the invention.
Fig. 2 is two group of first movable comb 5, profile in the direction of the first fixed fingers 6, the first fixed fingers 6 along Fig. 1
It is connected on the inwall of the cavity volume of substrate 1, when substrate 1 uses monocrystalline silicon, the first fixed fingers 6 use monocrystalline silicon or polysilicon material
During material, in order to ensure the insulation between the fixed fingers 6 of substrate 1 and first, set between the fixed fingers 6 of the substrate 1 and first
Insulating barrier 10 is equipped with, the insulating barrier 10 can be using silica material known in MEMS technology etc., and the insulating barrier 10
Can be used as follow-up etching stopping layer, this belongs to the common knowledge of those skilled in the art, herein no longer specifically
It is bright.
First movable comb 5 is connected on the framework 3 of vibrating diaphragm component, the fixed fingers 6 of first movable comb 5 and first
Intersection is combined together, and the two partly overlaps together, with reference to the overlapping region 50 shown in Fig. 2.Described first movable comb
Less than the lower end of first fixed fingers 6, the upper end of first movable comb 5 is fixed less than described first for the lower end of tooth 5
The upper end of comb 6 so that the first movable comb 5 and the first fixed fingers 6 are not together with completely overlapped.
This is allowed for when to voltage difference is formed between the first movable comb 5, the first fixed fingers 6, for example can to first
Dynamic comb 5 is passed through the direct current of 0V, when being passed through the direct current of 5V to the first fixed fingers 6, in the presence of electrostatic force, can make the
There is upward displacement relative to the first fixed fingers 6 in one movable comb 5.Movably combed by the first of vibrating diaphragm component opposite sides
Tooth 5, so that drive whole vibrating diaphragm component to be subjected to displacement upwards, until the first movable comb 5, the orthographic projection of the first fixed fingers 6
Overlap, the displacement is designated as S1.The maximum of displacement S1 depend on the first movable comb 5 and the first fixed fingers 6 it
Between difference in height.
Fig. 3 is two group of second movable comb 7, profile in the direction of the second fixed fingers 8, the second fixed fingers 8 along Fig. 1
It is connected on the inwall of the cavity volume of substrate 1, when substrate 1 uses monocrystalline silicon, the second fixed fingers 8 use monocrystalline silicon or polysilicon material
During material, in order to ensure the insulation between the fixed fingers 8 of substrate 1 and second, set between the fixed fingers 8 of the substrate 1 and second
Insulating barrier 10 is equipped with, the insulating barrier 10 can be using silica material known in MEMS technology etc., and the insulating barrier 10
Can be used as etching stopping layer, this belongs to the common knowledge of those skilled in the art, no longer illustrates herein.
Second movable comb 7 is connected on the framework 3 of vibrating diaphragm component, the fixed fingers 8 of second movable comb 7 and second
Intersection is combined together, and the two partly overlaps together, with reference to the overlapping region 70 shown in Fig. 3.Described second movable comb
Higher than the lower end of second fixed fingers 8, the upper end of second movable comb 7 is fixed higher than described second for the lower end of tooth 7
The upper end of comb 8 so that the second movable comb 7 and the second fixed fingers 8 are not together with completely overlapped.
This is allowed for when to voltage difference is formed between the second movable comb 7, the second fixed fingers 8, for example can to second
Dynamic comb 7 is passed through the direct current of 0V, when being passed through the direct current of 5V to the second fixed fingers 8, in the presence of electrostatic force, can make the
There is downward displacement relative to the second fixed fingers 8 in two movable combs 7.Movably combed by the second of vibrating diaphragm component opposite sides
Tooth 7, so that drive whole vibrating diaphragm component to be subjected to displacement downwards, until the second movable comb 7, the orthographic projection of the second fixed fingers 8
Overlap, the displacement is designated as S2.The maximum of displacement S2 depend on the second movable comb 7 and the second fixed fingers 8 it
Between difference in height.
The profile along the second movable comb, the second fixed fingers part is illustrated that on the left of Fig. 4, right side illustrates that
Along the first movable comb, the profile of the first fixed fingers part.Vibrating diaphragm component of the invention is in the first movable comb 5, first
Upward displacement S1 can occur under the driving of fixed fingers 6, can under the second movable comb 7, the driving of the second fixed fingers 8
There is downward displacement S2, this two groups of comb structures are by respective control, it is possible to achieve vibrating diaphragm component integrally occurs total amount
It is the displacement of S1+S2.Under conditions of sonic transducer is size-constrained, the displacement for substantially increasing vibrating diaphragm component is interval, can be big for this
The big voice effect for improving vibrating diaphragm component in low frequency；And vibrating diaphragm component can export the audio signal of high frequency in itself, the drive of the two
Mobile interface can plan independently, and be integrated in a monomer can be while export low-and high-frequency signal, such that it is able to provide accurate sound
Message number.
Preferably, when the vibrating diaphragm component is integrally rectangular, first movable comb 5 is arranged on vibrating diaphragm component wherein
On a pair relative side walls, it is wherein another on relative side wall that second movable comb 7 is arranged on vibrating diaphragm component.When described
When vibrating diaphragm component is integrally rounded, first movable comb 5, the second movable comb 7 are evenly distributed on the circumference of vibrating diaphragm component
On direction.Such that it is able to pass through the first movable comb 5, the second movable comb 7 independent control realization vibrating diaphragm component upwards or
Downward easy motion.
Preferably, because vibrating diaphragm component can occur always under the first movable comb 5, the control of the second movable comb 7
Measure as the displacement of S1+S2 is interval, therefore, the material of spring beam of the present invention 4 is preferably thin using liquid metal film or macromolecule
Film, it is interval such that it is able to meet the larger displacement of vibrating diaphragm component.
Sonic transducer of the invention can be used as loudspeaker, that is to say, that vibrating diaphragm component is in itself and comb structure divides
High frequency, low frequency configuration not as loudspeaker.In another specific embodiment of the invention, sonic transducer of the invention is also
Can be used as noise reduction sound-producing device.
Specifically, the vibrating diaphragm component is still as receiving audio signal and export the sounding vibrating diaphragm of sound, itself and comb
Respective outer side edges together, realize the sounding of loudspeaker.Sonic transducer of the invention, also including flat for being constituted with the vibrating diaphragm 2
The back pole plate (view is not given) of plate capacitance structure；The vibrating diaphragm 2 is constituted for characterizing surrounding noise signals with back pole plate
Microphone structure.Vibrating diaphragm 2 belongs to the known normal of those skilled in the art with the microphone structure of this plate condenser type of back pole plate
Know.Microphone structure and loadspeaker structure independent control, that is to say, that vibrating diaphragm component can export sound simultaneously, it is also possible to connect
By and feed back the external world noise signal, such that it is able to the audio signals for sound source provide correct basis, realize sound transducing
The anti-noise feature of device.
Present invention also offers a kind of manufacture method of MEMS sonic transducers, it is comprised the following steps：
A) substrate 1 is provided, different height is etched on the substrate 1 and in first groove 1a, second of pectinate texture
Groove 1b, with reference to Fig. 5；
Substrate of the invention 1 can select single crystal silicon material, and deep ion etching machine bench can be used, and etch on substrate 1
First groove 1a, the second groove 1b of different height difference；For the ease of operation, the depth of all first groove 1a on substrate can
With identical, the depth of all second groove 1b can be with identical；
B) conductive layer 14 is deposited on substrate 1, the conductive layer 14 is filled in first groove 1a, second groove 1b, join
Examine Fig. 6；
Conductive layer of the invention 14 can use monocrystalline silicon or polysilicon, the conductive layer 14 to be filled in different height
In first groove 1a and second groove 1b；Herein it should be noted that because substrate 1 employs single crystal silicon material, in order to protect
, it is necessary to produce a layer insulating on substrate 1 and in first groove 1a, second groove 1b first, (Fig. 5 to Figure 10 is not for card insulation
Show), the insulating barrier can use silica material, and this not only realizes the insulation between substrate 1 and conductive layer 14, the insulation
Layer is also used as follow-up etching stopping layer；
C) conductive layer 14 is etched, the first movable comb 5, the is formed in the first groove 1a, second groove 1b
Two movable combs 7, the first fixed fingers 6, the second fixed fingers 8, with reference to Fig. 7；
In the structure shown in Fig. 7, due to the depth of the depth more than first groove 1a of second groove 1b, therefore, can be right
Conductive layer in second groove 1b is performed etching, so as to form the comb with height fall；Herein it should be noted that needing
Formed positioned at the first movable comb 5 of opposite sides and the first fixed fingers 6, Yi Jiwei coordinated with the first movable comb 5
In the second movable comb 7 of opposite sides and the second fixed fingers 8 coordinated with the second movable comb 7；And make first movable
Comb 5, the first fixed fingers 6, the second movable comb 7, the second fixed fingers 8 meet the fit structure of foregoing description；
D) framework 3 and spring beam to form vibrating diaphragm component are deposited and etched in the upper surface of substrate 1, with reference to Fig. 8；
Framework of the invention 3 and spring beam preferably use identical material, for example can on substrate depositing liquid metal,
So as to form above-mentioned framework 3, and it is connected to the spring beam between framework 3 and substrate 1；Herein it should be noted that heavy
, it is necessary to set mask on substrate 1 when product liquid metal, so as to prevent liquid metals from depositing to unwanted region；
E) deposition forms vibrating diaphragm 2 on the frame 3, with reference to Fig. 9；
The material of vibrating diaphragm of the invention 2 can select PZT piezoceramic materials, and the region to that need not deposit sets mask knot
Structure, so as to vibrating diaphragm 2 is only deposited on framework 3；
F) etched substrate 1, by vibrating diaphragm 2, framework 3, the first movable comb 5, the second movable comb 7, the first fixed fingers 6,
Second fixed fingers 8, spring beam are discharged, with reference to Figure 10.
Deep ion etching machine can be used, vibrating diaphragm 2, framework 3, the first movable comb 5, the second movable comb 7, first is removed
Monocrystalline substrate material below fixed fingers 6, the second fixed fingers 8, spring beam, so as to said structure be discharged.
This should be noted that due in above-mentioned steps be provided with insulating barrier, the insulating barrier can as deep ion etching stop-layer,
So as to prevent when deep ion etches silicon substrate, each functional structure layer of sonic transducer being etched away；Subsequently need to use
For example hydrogen fluoride removes insulating barrier, and this belongs to the common knowledge of those skilled in the art, no longer illustrates herein.
Although being described in detail to some specific embodiments of the invention by example, the skill of this area
Art personnel it should be understood that example above is merely to illustrate, rather than in order to limit the scope of the present invention.The skill of this area
Art personnel to above example it should be understood that can modify without departing from the scope and spirit of the present invention.This hair
Bright scope is defined by the following claims.
Claims (15)
1. a kind of MEMS sonic transducers, it is characterised in that：Including substrate (1) and vibrating diaphragm component, the vibrating diaphragm component passes through bullet
Property beam (4) links together with substrate (1)；Wherein, it is respectively arranged with least one set of the in the relative both sides of the vibrating diaphragm component
One movable comb (5), at least one set of second movable comb (7) is respectively arranged with vibrating diaphragm component both sides relative in addition；
The first fixed fingers (6) for being combined together with the first movable comb (5) are provided with the substrate (1), and are used for
The second fixed fingers (8) being combined together with the second movable comb (7)；
Wherein, constituted by first movable comb (5) and the first fixed fingers (6), and by the second movable comb (7) with
In two groups of comb structures that second fixed fingers (8) are constituted, the movable comb of one of which comb structure is higher than fixed fingers, separately
Movable comb in one group of comb structure is less than fixed fingers；
The vibrating diaphragm component is configured to supply the vibrational state of sonic transducer；
Two groups of comb structures are configured as：Vibrating diaphragm component is respectively under respective electrostatic force overall opposite at two
Displacement on direction provides driving force.
2. MEMS sonic transducers according to claim 1, it is characterised in that：First movable comb (5) is higher than first
Fixed fingers (6), second movable comb (7) is less than the second fixed fingers (8).
3. MEMS sonic transducers according to claim 1, it is characterised in that：First movable comb (5) is less than first
Fixed fingers (6), second movable comb (7) is higher than the second fixed fingers (8).
4. MEMS sonic transducers according to claim 1, it is characterised in that：The vibrating diaphragm component is integrally rectangular, described
First movable comb (5) is arranged on the relative side wall of vibrating diaphragm component one pair of which, and second movable comb (7) is arranged on to be shaken
Membrane module is another on relative side wall.
5. MEMS sonic transducers according to claim 4, it is characterised in that：The spring beam (4) is provided with four, respectively
Four angles of the vibrating diaphragm component of connection.
6. MEMS sonic transducers according to claim 1, it is characterised in that：The vibrating diaphragm component is integrally rounded, described
First movable comb (5), the second movable comb (7) are evenly distributed on the circumferencial direction of vibrating diaphragm component.
7. MEMS sonic transducers according to claim 1, it is characterised in that：The substrate (1) is provided with cavity volume, described to shake
Membrane module is arranged in the cavity volume of substrate (1), and first fixed fingers (6), the second fixed fingers (8) are arranged on substrate (1)
On the inwall of cavity volume.
8. MEMS sonic transducers according to claim 1, it is characterised in that：The material selection liquid of the spring beam (4)
Metallic film or macromolecule membrane.
9. MEMS sonic transducers according to claim 1, it is characterised in that：The vibrating diaphragm component includes the frame positioned at outside
Frame (3), and the vibrating diaphragm (2) in framework (3).
10. MEMS sonic transducers according to claim 9, it is characterised in that：The framework (3) and spring beam (4) are one
Body, using identical material.
11. MEMS sonic transducers according to claim 9, it is characterised in that：The vibrating diaphragm (2) is the sounding of sound-producing device
Vibrating diaphragm, the vibrating diaphragm (2) selects piezoceramic material.
12. MEMS sonic transducers according to claim 9, it is characterised in that：The vibrating diaphragm (2) is the sounding of sound-producing device
Vibrating diaphragm, also including for coordinating so that the auxiliary section of the diaphragm oscillations with vibrating diaphragm (2).
13. MEMS sonic transducers according to claim 9, it is characterised in that：The vibrating diaphragm (2) is exports audio signal
Sounding vibrating diaphragm；Also include the back pole plate for constituting capacity plate antenna structure with the vibrating diaphragm (2)；The vibrating diaphragm (2) and back pole plate
Constitute the microphone that surrounding noise signals are characterized for being input into.
14. MEMS sonic transducers according to claim 1, it is characterised in that：First movable comb (5), second can
Dynamic comb (7), the first fixed fingers (6), the second fixed fingers (8) use monocrystalline silicon or polysilicon.
15. it is a kind of manufacture as described in any one of claim 1 to 13 MEMS sonic transducers methods, it is characterised in that including with
Lower step：
Substrate (1) a) is provided, different height is etched on the substrate (1) and in the first groove (1a) of pectinate texture, the
Two grooves (1b)；
B) conductive layer (14) is deposited on substrate (1), the conductive layer (14) is filled in first groove (1a), second groove (1b)
It is interior；
C) conductive layer (14) is etched, the first movable comb is formed in the first groove (1a), second groove (1b)
(5), the second movable comb (7), the first fixed fingers (6), the second fixed fingers (8)；
D) framework (3) and spring beam (4) to form vibrating diaphragm component are deposited and etched in the upper surface of substrate (1)；
E) deposition forms vibrating diaphragm (2) on framework (3)；
F) etched substrate (1), vibrating diaphragm (2), framework (3), the first movable comb (5), the second movable comb (7), first are fixed
Comb (6), the second fixed fingers (8), spring beam (4) are discharged.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201710138893.XA CN106911990A (en) | 2017-03-09 | 2017-03-09 | MEMS sonic transducers and its manufacture method |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201710138893.XA CN106911990A (en) | 2017-03-09 | 2017-03-09 | MEMS sonic transducers and its manufacture method |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN106911990A true CN106911990A (en) | 2017-06-30 |
Family
ID=59187679
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201710138893.XA Pending CN106911990A (en) | 2017-03-09 | 2017-03-09 | MEMS sonic transducers and its manufacture method |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN106911990A (en) |
Cited By (10)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN111147991A (en) * | 2019-12-30 | 2020-05-12 | 瑞声声学科技(深圳)有限公司 | condenser microphone |
| CN111372179A (en) * | 2019-12-31 | 2020-07-03 | 瑞声科技(新加坡)有限公司 | Capacitance system and capacitance microphone |
| CN111757224A (en) * | 2020-06-19 | 2020-10-09 | 歌尔微电子有限公司 | Microphone and audio equipment |
| CN111918188A (en) * | 2020-07-10 | 2020-11-10 | 瑞声科技（南京）有限公司 | MEMS loudspeaker and manufacturing process thereof |
| CN112019985A (en) * | 2020-10-15 | 2020-12-01 | 潍坊歌尔微电子有限公司 | Microphone structure and electronic equipment |
| CN112261526A (en) * | 2020-07-21 | 2021-01-22 | 瑞声声学科技(深圳)有限公司 | MEMS Acoustic Sensors |
| CN112399317A (en) * | 2020-10-08 | 2021-02-23 | 瑞声声学科技(深圳)有限公司 | Sound transducers and electronic equipment |
| WO2021134672A1 (en) * | 2019-12-31 | 2021-07-08 | 瑞声声学科技(深圳)有限公司 | Piezoelectric mems microphone |
| CN114157972A (en) * | 2021-03-16 | 2022-03-08 | 瑞声声学科技(深圳)有限公司 | Comb type microphone |
| WO2023116395A1 (en) * | 2021-12-23 | 2023-06-29 | 歌尔微电子股份有限公司 | Transmitting and receiving integrated acoustic circuit, acoustic chip and control method therefor, and wearable device |
Citations (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1677853A (en) * | 2004-03-30 | 2005-10-05 | 中国科学院声学研究所 | Surface Acoustic Wave Oscillator System for Gas Sensors |
| CN1769913A (en) * | 2004-11-05 | 2006-05-10 | 中国科学院电子学研究所 | Circular comb miniature electric field sensor |
| JP2006311783A (en) * | 2005-03-23 | 2006-11-09 | Seiko Epson Corp | Actuator, optical device having actuator, and method of manufacturing the actuator |
| CN201438738U (en) * | 2009-05-08 | 2010-04-14 | 瑞声声学科技(常州)有限公司 | Active Noise Cancellation System |
| CN101955151A (en) * | 2010-09-26 | 2011-01-26 | 中国科学院上海微系统与信息技术研究所 | Two-dimensional comb-tooth electrostatic driver based on the principle of silicon plastic deformation and its manufacturing method |
| CN105050022A (en) * | 2011-11-14 | 2015-11-11 | 英飞凌科技股份有限公司 | sound reproduction system and mehtod for operating and producing sound transducer |
| US20170006386A1 (en) * | 2014-02-08 | 2017-01-05 | Empire Technology Development Llc | Mems dual comb drive |
| CN206620295U (en) * | 2017-03-09 | 2017-11-07 | 歌尔股份有限公司 | MEMS sonic transducers |
-
2017
- 2017-03-09 CN CN201710138893.XA patent/CN106911990A/en active Pending
Patent Citations (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1677853A (en) * | 2004-03-30 | 2005-10-05 | 中国科学院声学研究所 | Surface Acoustic Wave Oscillator System for Gas Sensors |
| CN1769913A (en) * | 2004-11-05 | 2006-05-10 | 中国科学院电子学研究所 | Circular comb miniature electric field sensor |
| JP2006311783A (en) * | 2005-03-23 | 2006-11-09 | Seiko Epson Corp | Actuator, optical device having actuator, and method of manufacturing the actuator |
| CN201438738U (en) * | 2009-05-08 | 2010-04-14 | 瑞声声学科技(常州)有限公司 | Active Noise Cancellation System |
| CN101955151A (en) * | 2010-09-26 | 2011-01-26 | 中国科学院上海微系统与信息技术研究所 | Two-dimensional comb-tooth electrostatic driver based on the principle of silicon plastic deformation and its manufacturing method |
| CN105050022A (en) * | 2011-11-14 | 2015-11-11 | 英飞凌科技股份有限公司 | sound reproduction system and mehtod for operating and producing sound transducer |
| US20170006386A1 (en) * | 2014-02-08 | 2017-01-05 | Empire Technology Development Llc | Mems dual comb drive |
| CN206620295U (en) * | 2017-03-09 | 2017-11-07 | 歌尔股份有限公司 | MEMS sonic transducers |
Cited By (12)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN111147991A (en) * | 2019-12-30 | 2020-05-12 | 瑞声声学科技(深圳)有限公司 | condenser microphone |
| CN111372179A (en) * | 2019-12-31 | 2020-07-03 | 瑞声科技(新加坡)有限公司 | Capacitance system and capacitance microphone |
| WO2021134672A1 (en) * | 2019-12-31 | 2021-07-08 | 瑞声声学科技(深圳)有限公司 | Piezoelectric mems microphone |
| CN111757224A (en) * | 2020-06-19 | 2020-10-09 | 歌尔微电子有限公司 | Microphone and audio equipment |
| CN111918188A (en) * | 2020-07-10 | 2020-11-10 | 瑞声科技（南京）有限公司 | MEMS loudspeaker and manufacturing process thereof |
| CN112261526A (en) * | 2020-07-21 | 2021-01-22 | 瑞声声学科技(深圳)有限公司 | MEMS Acoustic Sensors |
| CN112399317A (en) * | 2020-10-08 | 2021-02-23 | 瑞声声学科技(深圳)有限公司 | Sound transducers and electronic equipment |
| CN112399317B (en) * | 2020-10-08 | 2022-07-26 | 瑞声声学科技(深圳)有限公司 | Sound transducers and electronic equipment |
| CN112019985A (en) * | 2020-10-15 | 2020-12-01 | 潍坊歌尔微电子有限公司 | Microphone structure and electronic equipment |
| CN112019985B (en) * | 2020-10-15 | 2021-01-22 | 潍坊歌尔微电子有限公司 | Microphone structure and electronic equipment |
| CN114157972A (en) * | 2021-03-16 | 2022-03-08 | 瑞声声学科技(深圳)有限公司 | Comb type microphone |
| WO2023116395A1 (en) * | 2021-12-23 | 2023-06-29 | 歌尔微电子股份有限公司 | Transmitting and receiving integrated acoustic circuit, acoustic chip and control method therefor, and wearable device |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN106911990A (en) | MEMS sonic transducers and its manufacture method | |
| US11039248B2 (en) | System and method for a pumping speaker | |
| CN110545511B (en) | Piezoelectric MEMS Microphone | |
| CN105050022B (en) | Sound reproduction system and method for operating and manufacturing a sound transducer | |
| EP2475189A2 (en) | Acoustic transducer and method of driving the same | |
| JP2004524574A (en) | Display substrate with integrated acoustic transducer | |
| CN108419189A (en) | Piezoelectric sensor | |
| CN103828393B (en) | Sound producer, flexible piezoelectric sound-generating devices and electronic equipment | |
| CN101611636A (en) | Miniature non-directional microphone | |
| US20100150381A1 (en) | Micro-speaker and manufacturing method thereof | |
| KR20080098624A (en) | Surface Micromachined Differential Microphone | |
| WO2022007050A1 (en) | Sound production apparatus and electronic device having same | |
| US12192702B2 (en) | MEMS speaker | |
| US2270167A (en) | Sound device with piezoelectric double plates | |
| CN206620295U (en) | MEMS sonic transducers | |
| KR101495090B1 (en) | Piezoelectric Speaker | |
| JP2021016094A (en) | Sound pressure-electric signal converter and conversion method thereof | |
| CN112689227B (en) | Piezoelectric MEMS loudspeaker imitating cochlea spiral vibrating membrane and preparation method | |
| CN114222231A (en) | Bimorph piezoelectric type MEMS microphone based on clamped beam structure | |
| TW201830982A (en) | Electro-acoustic transducer | |
| US20170238100A1 (en) | Electro-acoustic transducer | |
| CN106454660A (en) | Electret sound production device and electronic equipment | |
| Joshi et al. | Low-cost piezo-MEMS speaker technology | |
| CN107105376B (en) | Electroacoustic transducer | |
| CN222215956U (en) | MEMS piezoelectric transducer and electronic equipment |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| TA01 | Transfer of patent application right | ||
| TA01 | Transfer of patent application right |
Effective date of registration: 20200610 Address after: 261061 building 10, Geer phase II Industrial Park, No. 102, Ronghua Road, Ronghua community, Xincheng street, high tech Zone, Weifang City, Shandong Province Applicant after: Weifang goer Microelectronics Co.,Ltd. Address before: 261031 Dongfang Road, Weifang high tech Development Zone, Shandong, China, No. 268 Applicant before: GOERTEK Inc. |
|
| RJ01 | Rejection of invention patent application after publication | ||
| RJ01 | Rejection of invention patent application after publication |
Application publication date: 20170630 |