CN106910519B - Solid state disk storage module and solid state disk - Google Patents
Solid state disk storage module and solid state disk Download PDFInfo
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- CN106910519B CN106910519B CN201511034559.7A CN201511034559A CN106910519B CN 106910519 B CN106910519 B CN 106910519B CN 201511034559 A CN201511034559 A CN 201511034559A CN 106910519 B CN106910519 B CN 106910519B
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- solid state
- state disk
- circuit board
- storage module
- printed circuit
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- G—PHYSICS
- G11—INFORMATION STORAGE
- G11B—INFORMATION STORAGE BASED ON RELATIVE MOVEMENT BETWEEN RECORD CARRIER AND TRANSDUCER
- G11B33/00—Constructional parts, details or accessories not provided for in the other groups of this subclass
- G11B33/14—Reducing influence of physical parameters, e.g. temperature change, moisture, dust
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- G—PHYSICS
- G11—INFORMATION STORAGE
- G11B—INFORMATION STORAGE BASED ON RELATIVE MOVEMENT BETWEEN RECORD CARRIER AND TRANSDUCER
- G11B33/00—Constructional parts, details or accessories not provided for in the other groups of this subclass
- G11B33/14—Reducing influence of physical parameters, e.g. temperature change, moisture, dust
- G11B33/1446—Reducing contamination, e.g. by dust, debris
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Abstract
The invention is applicable to the field of storage media, and particularly relates to a solid state disk storage module and a solid state disk. In an embodiment of the present invention, the solid state disk storage module includes a printed circuit board, an encapsulant, and an electronic circuit that is welded on an inner surface of the printed circuit board and has a data storage function, the encapsulant is formed on the inner surface of the printed circuit board and encapsulates the electronic circuit without a gap, a plurality of metal contacts are disposed on an outer surface of the printed circuit board, the plurality of metal contacts are electrically connected to the electronic circuit, and the plurality of metal contacts include a plurality of SATA interface contacts. In the embodiment of the invention, the electronic circuit is encapsulated without gaps by the encapsulating colloid, and is isolated from the air, so that the problem that the electronic circuit is directly exposed in the air to influence the performance of components and parts, and the function of the solid state disk is unstable is solved.
Description
Technical Field
The invention belongs to the field of storage media, and particularly relates to a solid state disk storage module and a solid state disk.
Background
The hard disk is one of main storage media of a computer, the hard disk comprises a Solid State Drive (Solid State Drive), the Solid State Drive is a hard disk made of a Solid State electronic storage chip array, the internal structure of the hard disk is very simple, the main body of the hard disk is a circuit board, and the most basic accessories on the circuit board are a control chip, a storage chip and other auxiliary circuits.
The circuit module of the existing solid state disk is characterized in that a control chip, a storage chip and other circuit components are directly welded on a circuit board, and then a shell of the solid state disk is assembled into a finished solid state disk.
Disclosure of Invention
The embodiment of the invention aims to provide a solid state disk storage module, and aims to solve the problem that the functions of a solid state disk are unstable due to the fact that circuit components are easily affected by moisture and dust and the performance of the components is affected by the fact that the circuit components are directly exposed in the air in the traditional solid state disk packaging mode.
The embodiment of the invention is realized in such a way that the solid state disk storage module comprises a printed circuit board, a packaging colloid and an electronic circuit which is welded on the inner surface of the printed circuit board and has a data storage function;
the packaging colloid is formed on the inner surface of the printed circuit board and carries out gapless packaging on the electronic circuit;
the outer surface of the printed circuit board is provided with a plurality of metal contact pieces, the metal contact pieces are electrically connected with the electronic circuit, and the metal contact pieces comprise a plurality of SATA interface contact pieces;
the electronic circuit comprises a control integrated circuit, a storage integrated circuit and an auxiliary circuit; the control integrated circuit is electrically connected with the storage integrated circuit and the auxiliary circuit respectively.
Further, the SATA interface contacts are strip-shaped, the SATA interface contacts are not equal in length completely, and the SATA interface contacts are arranged on one side of the outer surface of the printed circuit board.
Furthermore, a separation groove is arranged on one side of the printed circuit board, which is provided with the plurality of SATA interface contacts; the separation groove penetrates from the outer surface of the printed circuit board to the inner surface of the printed circuit board and the packaging colloid along the direction perpendicular to the printed circuit board; the plurality of SATA interface contact blades are divided into a first contact blade area and a second contact blade area by the separation groove, the printed circuit board is provided with the separation groove and one side of the plurality of SATA interface contact blades is used as a component of a standard SATA interface plug-in, and the standard SATA interface plug-in further comprises a plastic part.
Further, the first contact zone is provided with 7 metal contacts, and the second contact zone is provided with 15 metal contacts.
Furthermore, the edge of one side of the printed circuit board, which is provided with the separation groove, is also provided with a chamfer.
Further, the plurality of SATA interface contacts are dot-shaped, and the plurality of SATA interface contacts are arranged on one side of the outer surface of the printed circuit board.
Furthermore, another group of SATA interface contacts is disposed on the outer surface of the printed circuit board, which is parallel and symmetrical to the side where the plurality of SATA interface contacts are located, and the number of the another group of SATA interface contacts is the same as that of the plurality of SATA interface contacts.
Further, the control integrated circuit and the storage integrated circuit are both unpackaged integrated circuit dies.
Further, the memory integrated circuit includes 8 memory integrated circuit dies, and the 8 memory integrated circuit dies are stacked on two sides, and each side is stacked on 4 memory integrated circuit dies.
Further, the auxiliary circuit includes a power circuit that is an unpackaged integrated circuit die.
Furthermore, the auxiliary circuit further comprises a protection circuit, the protection circuit is a self-recovery fuse, and the self-recovery fuse is connected in series with the input end of the power supply circuit.
Further, the plurality of metal contacts further include a debug interface contact and a power interface contact.
Another object of an embodiment of the present invention is to provide a solid state disk, where the solid state disk includes the above solid state disk storage module.
In an embodiment of the invention, the solid state disk storage module comprises a printed circuit board, a packaging colloid and an electronic circuit which is welded on the inner surface of the printed circuit board and has a data storage function; the packaging colloid is formed on the inner surface of the printed circuit board and carries out gapless packaging on the electronic circuit; the surface of printed circuit board is provided with a plurality of metal contact pieces, a plurality of metal contact pieces with electronic circuit carries out the electricity and connects, a plurality of metal contact pieces include a plurality of SATA interface contact pieces. In the embodiment of the invention, the electronic circuit welded on the inner surface of the printed circuit board is encapsulated without gaps by the encapsulation colloid, and the electronic circuit is isolated from the air by the encapsulation colloid, so that the problem that the electronic circuit is directly exposed in the air to influence the performance of components and parts, and the function of the solid state disk is unstable is solved.
Drawings
Fig. 1 is a cross-sectional view of a solid state disk storage module provided by an embodiment of the present invention;
fig. 2 is a schematic diagram of a solid state disk storage module according to a first embodiment of the present invention;
fig. 3 is a schematic diagram of a solid state disk storage module according to a second embodiment of the present invention.
Detailed Description
In order to make the objects, technical solutions and advantages of the present invention more apparent, the present invention is described in further detail below with reference to the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are merely illustrative of the invention and do not limit the invention.
First embodiment
Fig. 1 is a cross-sectional view of a solid-state hard disk storage module provided in an embodiment of the present invention, and only a part related to the embodiment of the present invention is shown for convenience of description.
A solid state disk storage module comprises a printed circuit board 1, a packaging colloid 2 and an electronic circuit 3 which is welded on the inner surface of the printed circuit board 1 and has a data storage function.
The encapsulant 2 is formed on the inner surface of the printed circuit board 1, and encapsulates the electronic circuit 3 without a gap.
The outer surface of the printed circuit board 1 is provided with a plurality of metal contacts 11, the plurality of metal contacts 11 are electrically connected with the electronic circuit 3, and the plurality of metal contacts 11 include a plurality of SATA interface contacts 110.
The electronic circuit 3 includes a control integrated circuit 31, a memory integrated circuit 32, and an auxiliary circuit 33; the control integrated circuit 31 is electrically connected to the memory integrated circuit 32 and the auxiliary circuit 33, respectively.
In the embodiment, the SATA (Serial ATA) interface is a computer bus interface for data transmission between the solid state disk and the motherboard.
As an embodiment of the present invention, the control integrated circuit 31 and the memory integrated circuit 32 are both unpackaged integrated circuit dies. In this embodiment, the control integrated circuit 31 and the storage integrated circuit 32 directly use unpackaged integrated circuit dies, which eliminates the step of packing the control integrated circuit dies and the storage integrated circuit dies into chips, thereby saving time, shortening production cycle, and reducing production cost.
As an embodiment of the present invention, the memory integrated circuit 31 includes 8 memory integrated circuit dies, and the 8 memory integrated circuit dies are stacked on two sides, and each side is stacked on 4 memory integrated circuit dies.
As an embodiment of the present invention, the auxiliary circuit 33 includes a power circuit that is an unpackaged integrated circuit die.
As an embodiment of the present invention, the auxiliary circuit further includes a protection circuit, the protection circuit is a self-recovery fuse, and the self-recovery fuse is connected in series to the input terminal of the power circuit. In this embodiment, the protection circuit protects the power circuit, and the protection circuit adopts a self-recovery fuse to make the solid state disk storage module thinner.
As an embodiment of the present invention, the plurality of metal contacts 11 further includes a debug interface contact and a power interface contact. Specifically, the total number of the debugging interface contact and the power interface contact is 16. The debugging interface contact piece provides an external debugging interface for the solid state disk storage module, and the power supply interface contact piece is used for connecting an external power supply.
Fig. 2 is a schematic diagram of a solid-state hard disk storage module according to a first embodiment of the present invention, and only the relevant parts related to the embodiment of the present invention are shown for convenience of description.
The SATA interface contacts 110 are strip-shaped, the lengths of the SATA interface contacts 110 are not equal, and the SATA interface contacts 110 are arranged on one side of the outer surface of the printed circuit board 1.
In the present embodiment, the number of the plurality of metal contacts 11 is plural. Specifically, plurality of metal contacts 11 includes 22 SATA interface contacts 110.
As an embodiment of the present invention, a separation groove 12 is further disposed on one side of the printed circuit board 1 where the SATA interface contacts 11 are disposed; the separation grooves 12 penetrate from the outer surface of the printed circuit board 1 to the inner surface of the printed circuit board 1 and the packaging colloid 2 along the direction vertical to the printed circuit board 1; the SATA interface contacts 11 are divided into a first contact area 111 and a second contact area 112 by the separation groove 12, one side of the printed circuit board 1 where the separation groove 12 and the SATA interface contacts 11 are provided is used as a component of a standard SATA interface card, and the standard SATA interface card further includes a plastic part.
As an embodiment of the present invention, the first contact area 111 is provided with 7 SATA interface contacts 11, and the second contact area 112 is provided with 15 SATA interface contacts 11.
As an embodiment of the present invention, the edge of the printed circuit board 1 on the side provided with the separation groove 12 is further provided with a chamfer 13, and the solid state disk storage module can be electrically connected with an external plug-in conveniently through the chamfer 13.
Second embodiment
Fig. 1 is a cross-sectional view of a solid-state hard disk storage module provided in an embodiment of the present invention, and only a part related to the embodiment of the present invention is shown for convenience of description.
A solid state disk storage module comprises a printed circuit board 1, a packaging colloid 2 and an electronic circuit 3 welded on the inner surface of the printed circuit board 1 to realize a storage function.
The encapsulant 2 is formed on the inner surface of the printed circuit board 1, and encapsulates the electronic circuit 3 without a gap.
The outer surface of the printed circuit board 1 is provided with a plurality of metal contacts 11, the plurality of metal contacts 11 are electrically connected with the electronic circuit 3, and the plurality of metal contacts 11 include a plurality of SATA interface contacts 110.
The electronic circuit 3 includes a control integrated circuit 31, a memory integrated circuit 32, and an auxiliary circuit 33; the control integrated circuit 31 is electrically connected to the memory integrated circuit 32 and the auxiliary circuit 33, respectively.
In this embodiment, the SATA (Serial ATA) interface is a computer bus interface for data transmission between the solid state disk and the motherboard.
As an embodiment of the present invention, the control integrated circuit 31 and the memory integrated circuit 32 are both unpackaged integrated circuit dies. In this embodiment, the control integrated circuit 31 and the storage integrated circuit 32 directly use unpackaged integrated circuit dies, which eliminates the step of packing the control integrated circuit dies and the storage integrated circuit dies into chips, thereby saving time, shortening production cycle, and reducing production cost.
As an embodiment of the present invention, the memory integrated circuit 31 includes 8 memory integrated circuit dies, and the 8 memory integrated circuit dies are stacked on two sides, and each side is stacked on 4 memory integrated circuit dies.
As an embodiment of the present invention, the auxiliary circuit 33 includes a power circuit that is an unpackaged integrated circuit die.
As an embodiment of the present invention, the auxiliary circuit further includes a protection circuit, the protection circuit is a self-recovery fuse, and the self-recovery fuse is connected in series to the input terminal of the power circuit. In this embodiment, the protection circuit protects the power circuit, and the protection circuit adopts a self-recovery fuse to make the solid state disk storage module thinner.
As an embodiment of the present invention, the plurality of metal pads 11 further includes a debug interface pad and a power interface pad. Specifically, the total number of the debugging interface contact and the power interface contact is 16. The debugging interface contact piece provides an external debugging interface for the solid state disk storage module, and the power supply interface contact piece is used for connecting an external power supply.
Fig. 3 shows a schematic diagram of a solid-state hard disk storage module according to a second embodiment of the present invention, and for convenience of description, only the parts related to the embodiment of the present invention are shown.
In an embodiment of the present invention, the SATA interface contacts 110 are dot-shaped, and the SATA interface contacts 110 are arranged on one side of the outer surface of the printed circuit board.
As an embodiment of the present invention, another set of SATA interface contacts is disposed on the other side of the external surface of the printed circuit board 1, which is parallel and symmetrical to the side where the plurality of SATA interface contacts 110 are located, and the number of the another set of SATA interface contacts is the same as that of the plurality of SATA interface contacts.
Third embodiment
A third embodiment of the present invention provides a solid state disk, where the solid state disk includes the solid state disk storage module according to the first embodiment or the second embodiment.
In an embodiment of the present invention, the solid state disk storage module includes a printed circuit board, an encapsulant, and an electronic circuit soldered to an inner surface of the printed circuit board and having a data storage function, the encapsulant is formed on the inner surface of the printed circuit board and encapsulates the electronic circuit without a gap, the outer surface of the printed circuit board is provided with a plurality of metal contacts, the metal contacts are electrically connected to the electronic circuit, and the metal contacts include a plurality of SATA interface contacts. In the embodiment of the invention, the electronic circuit welded on the inner surface of the printed circuit board is encapsulated without gaps by the encapsulation colloid, and the electronic circuit is isolated from the air by the encapsulation colloid, so that the problem that the electronic circuit is directly exposed in the air to influence the performance of components and parts, so that the function of the solid state disk is unstable is solved.
The above description is only for the purpose of illustrating the preferred embodiments of the present invention and is not to be construed as limiting the invention, and any modifications, equivalents and improvements made within the spirit and principle of the present invention are intended to be included within the scope of the present invention.
Claims (13)
1. A solid state disk storage module is characterized by comprising a printed circuit board, a packaging colloid and an electronic circuit which is welded on the inner surface of the printed circuit board and has a data storage function;
the packaging colloid is formed on the inner surface of the printed circuit board and carries out gapless packaging on the electronic circuit;
the outer surface of the printed circuit board is provided with a plurality of metal contact pieces, and the number of the metal contact pieces is a plurality; the plurality of metal contacts are electrically connected with the electronic circuit, and the plurality of metal contacts comprise a plurality of SATA interface contacts; the SATA interface contact pieces are arranged on one side of the outer surface of the printed circuit board, and one side of the printed circuit board, which is provided with the SATA interface contact pieces, is also provided with a separation groove; the separation groove penetrates from the outer surface of the printed circuit board to the inner surface of the printed circuit board and the packaging colloid along the direction perpendicular to the printed circuit board;
the electronic circuit comprises a control integrated circuit, a storage integrated circuit and an auxiliary circuit; the control integrated circuit is electrically connected with the storage integrated circuit and the auxiliary circuit respectively.
2. The solid state disk storage module of claim 1, wherein the plurality of SATA interface contacts are elongated and are not all substantially equal in length.
3. The solid state disk storage module of claim 2, wherein the plurality of SATA interface contacts are divided into a first contact area and a second contact area by the bay, the printed circuit board having the bay and a side of the plurality of SATA interface contacts as part of a standard SATA interface package, and the standard SATA interface package further comprising a plastic component.
4. The solid state disk storage module of claim 3, wherein the first contact region is provided with 7 metal contacts and the second contact region is provided with 15 metal contacts.
5. The solid state disk storage module of claim 4 wherein the edge of the side of the printed circuit board where the spacer grooves are provided is further provided with a chamfer.
6. The solid state disk storage module of claim 1, wherein the plurality of SATA interface contacts are dot-shaped and are arranged on one side of an outer surface of the printed circuit board.
7. The solid state disk storage module of claim 6, wherein another set of SATA interface contacts are disposed on the outer surface of the printed circuit board on the side that is parallel and symmetrical to the side on which the SATA interface contacts are located, the other set of SATA interface contacts being the same number as the plurality of SATA interface contacts.
8. The solid state disk storage module of claim 1, wherein the control integrated circuit and the storage integrated circuit are both unpackaged integrated circuit dies.
9. The solid state disk storage module of claim 8, wherein the memory integrated circuits comprise 8 memory integrated circuit dies, the 8 memory integrated circuit dies stacked on two sides, 4 on each side.
10. The solid state disk storage module of claim 1, wherein the auxiliary circuit comprises a power circuit that is an unpackaged integrated circuit die.
11. The solid state disk storage module of claim 10 wherein the auxiliary circuit further comprises a protection circuit, the protection circuit is a self-healing fuse, and the self-healing fuse is connected in series to an input of the power circuit.
12. The solid state disk storage module of claim 1, wherein the plurality of metal contacts further comprises debug interface contacts and power interface contacts.
13. A solid state disk comprising a solid state disk storage module as claimed in any one of claims 1 to 12.
Priority Applications (8)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201511034559.7A CN106910519B (en) | 2015-12-31 | 2015-12-31 | Solid state disk storage module and solid state disk |
| US15/120,707 US10388329B2 (en) | 2015-12-30 | 2016-07-18 | SSD storage module, SSD component, and SSD |
| JP2016555739A JP6374977B2 (en) | 2015-12-30 | 2016-07-18 | SSD parts and SSD |
| KR1020167028416A KR101827198B1 (en) | 2015-12-30 | 2016-07-18 | Ssd storage module, ssd component, and ssd |
| PCT/CN2016/090290 WO2017113756A1 (en) | 2015-12-30 | 2016-07-18 | Solid-state disk storage module, solid-state disk assembly, and solid-state disk |
| TW105211444U TWM533765U (en) | 2015-12-31 | 2016-07-28 | Solid state disk storage module, solid state disk component and solid state disk |
| TW105125797A TWI595411B (en) | 2015-12-30 | 2016-08-12 | Ssd storage module, ssd component and ssd |
| US16/513,370 US10714148B2 (en) | 2015-12-30 | 2019-07-16 | SSD storage module, SSD component, and SSD |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201511034559.7A CN106910519B (en) | 2015-12-31 | 2015-12-31 | Solid state disk storage module and solid state disk |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN106910519A CN106910519A (en) | 2017-06-30 |
| CN106910519B true CN106910519B (en) | 2022-12-16 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201511034559.7A Active CN106910519B (en) | 2015-12-30 | 2015-12-31 | Solid state disk storage module and solid state disk |
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| Country | Link |
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| CN (1) | CN106910519B (en) |
Citations (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1203545A (en) * | 1995-12-07 | 1998-12-30 | 松下电器产业株式会社 | Method for manufacturing resin-encapsulated electronic products |
| TW200514220A (en) * | 2003-10-15 | 2005-04-16 | Benq Corp | Thermal enhanced package structure and its formation method |
| CN101013688A (en) * | 2006-01-31 | 2007-08-08 | 夏普株式会社 | Electronic circuit module and method for fabrication thereof |
| CN101740528A (en) * | 2008-11-12 | 2010-06-16 | 力成科技股份有限公司 | Heat radiation enhanced semiconductor package structure without external pin and its combination |
| CN102044447A (en) * | 2009-10-20 | 2011-05-04 | 日月光半导体制造股份有限公司 | Packaging process and packaging structure |
| CN102306641A (en) * | 2011-05-25 | 2012-01-04 | 深圳市江波龙电子有限公司 | Storage module and packaging method |
| CN102543904A (en) * | 2010-12-16 | 2012-07-04 | 海华科技股份有限公司 | module integrated circuit packaging structure and manufacturing method thereof |
| CN203118477U (en) * | 2012-12-19 | 2013-08-07 | 深圳市江波龙电子有限公司 | Solid-state hard disk |
| CN103826386A (en) * | 2012-11-19 | 2014-05-28 | 三菱电机株式会社 | Electronic circuit, production method thereof, and electronic component |
Family Cites Families (12)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6072239A (en) * | 1995-11-08 | 2000-06-06 | Fujitsu Limited | Device having resin package with projections |
| US5834084A (en) * | 1996-06-25 | 1998-11-10 | Seagate Technology, Inc. | Disc drive flex assembly having a low particulating circuit board |
| TW408453B (en) * | 1997-12-08 | 2000-10-11 | Toshiba Kk | Package for semiconductor power device and method for assembling the same |
| US7517231B2 (en) * | 2004-11-16 | 2009-04-14 | Super Talent Electronics, Inc. | Solid state drive (SSD) with open top and bottom covers |
| CN2528112Y (en) * | 2002-01-04 | 2002-12-25 | 华新先进电子股份有限公司 | Multi-Board Planar Ball Grid Array Package |
| US7141874B2 (en) * | 2003-05-14 | 2006-11-28 | Matsushita Electric Industrial Co., Ltd. | Electronic component packaging structure and method for producing the same |
| CN101075565A (en) * | 2006-05-18 | 2007-11-21 | 矽品精密股份有限公司 | Semiconductor package and its manufacturing method |
| CN201256150Y (en) * | 2008-10-10 | 2009-06-10 | 余宝珊 | Non-adhesive encapsulation module for LED |
| KR101637481B1 (en) * | 2009-04-10 | 2016-07-07 | 삼성전자주식회사 | Solid state drive, device for mounting solid state drives and computing system |
| TWI424642B (en) * | 2011-04-06 | 2014-01-21 | Walton Advanced Eng Inc | Tandem data storage device |
| CN203773945U (en) * | 2014-03-28 | 2014-08-13 | 东莞栢能电子科技有限公司 | Mobile hard disk |
| CN205318847U (en) * | 2015-12-31 | 2016-06-15 | 中山市江波龙电子有限公司 | A kind of solid-state hard disk storage module and solid-state hard disk |
-
2015
- 2015-12-31 CN CN201511034559.7A patent/CN106910519B/en active Active
Patent Citations (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1203545A (en) * | 1995-12-07 | 1998-12-30 | 松下电器产业株式会社 | Method for manufacturing resin-encapsulated electronic products |
| TW200514220A (en) * | 2003-10-15 | 2005-04-16 | Benq Corp | Thermal enhanced package structure and its formation method |
| CN101013688A (en) * | 2006-01-31 | 2007-08-08 | 夏普株式会社 | Electronic circuit module and method for fabrication thereof |
| CN101740528A (en) * | 2008-11-12 | 2010-06-16 | 力成科技股份有限公司 | Heat radiation enhanced semiconductor package structure without external pin and its combination |
| CN102044447A (en) * | 2009-10-20 | 2011-05-04 | 日月光半导体制造股份有限公司 | Packaging process and packaging structure |
| CN102543904A (en) * | 2010-12-16 | 2012-07-04 | 海华科技股份有限公司 | module integrated circuit packaging structure and manufacturing method thereof |
| CN102306641A (en) * | 2011-05-25 | 2012-01-04 | 深圳市江波龙电子有限公司 | Storage module and packaging method |
| CN103826386A (en) * | 2012-11-19 | 2014-05-28 | 三菱电机株式会社 | Electronic circuit, production method thereof, and electronic component |
| CN203118477U (en) * | 2012-12-19 | 2013-08-07 | 深圳市江波龙电子有限公司 | Solid-state hard disk |
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