CN106887787B - A large channel semiconductor laser liquid cooling sheet and laser thereof - Google Patents

Abstract

The present invention proposes a large-channel semiconductor laser liquid cooling plate and a semiconductor laser stack using the liquid cooling plate. The large-channel semiconductor laser liquid cooling plate includes a cooling plate body provided with a liquid inlet hole and a liquid outlet hole, and a tubular liquid cooling channel is provided in the cooling plate body for connecting the liquid inlet hole and the liquid outlet hole. The liquid cooling channel in the large-channel semiconductor laser liquid cooling plate of the present invention is not easy to be blocked, which improves the reliability and life of the device, and the heat dissipation effect is equivalent to that of the microchannel cooling plate under the condition of the same flow rate; compared with the traditional macro-channel liquid cooling plate, the liquid cooling plate of the present invention increases the cooling area, shortens the heat conduction path, and improves the heat dissipation efficiency.

Description

A large channel semiconductor laser liquid cooling sheet and laser thereof

Technical Field

The invention belongs to the technical field of semiconductor lasers, and in particular relates to a large-channel semiconductor laser liquid cooling plate and a semiconductor laser stack using the liquid cooling plate.

Background technique

Semiconductor lasers have the advantages of small size, light weight, high reliability, long service life and low cost. They have been widely used in various fields of the national economy, such as laser pumping, medical treatment and industrial processing.

In the prior art, the packaging forms of power electronic devices include conduction cooling, microchannel liquid cooling and macrochannel liquid cooling (200910023753.3). For high-power semiconductor lasers, the conduction cooling method has low heat dissipation efficiency, which will lead to a decrease in device life and reliability, and generally only achieve an output power of tens of watts; if the microchannel liquid cooling method is used, the cooling liquid needs to be high-quality deionized water, which is expensive, and long-term use will cause corrosion or blockage of the microchannel tube wall, seriously affecting the reliability of the semiconductor laser.

Chinese patent 200910023753.3 proposes a liquid cooling sheet structure, which solves the tube wall blockage problem of microchannel liquid cooling, but the heat dissipation effect needs to be improved, which restricts the further improvement of the power and application field of semiconductor lasers.

Summary of the invention

In order to overcome the shortcomings of the prior art, the present invention proposes a large-channel semiconductor laser liquid cooling sheet and a semiconductor laser stack using the liquid cooling sheet, which avoids the problem of microchannel blockage and improves the heat dissipation effect compared with the macro-channel liquid cooling sheet. The specific technical solution is as follows:

A large-channel semiconductor laser liquid cooling plate comprises a sheet-shaped cooling plate body. A liquid inlet and a liquid outlet are arranged on the cooling plate body, and the liquid inlet and the liquid outlet both penetrate the upper surface and the lower surface of the cooling plate body; a chip mounting area is arranged at one end of the cooling plate body close to the liquid inlet, for mounting a laser chip; a water inlet is arranged on the inner wall of the liquid inlet, and a water outlet is arranged on the inner wall of the liquid outlet; a tubular liquid cooling channel is arranged in the cooling plate body, for connecting the water inlet and the water outlet, and the liquid cooling channel starts from the water inlet, passes through the area between the chip mounting area and the liquid inlet, and ends at the water outlet.

The large channel semiconductor laser liquid cooling plate of the present invention also has such a structure: it includes a sheet cooling plate body, a liquid through hole is arranged on the cooling plate body, the liquid through hole passes through the upper surface and the lower surface of the cooling plate body, a chip mounting area is arranged at one end of the cooling plate body, a water inlet is arranged on the side of the cooling plate body, a water outlet is arranged on the inner wall of the liquid through hole, a tubular liquid cooling channel is arranged in the cooling plate body, which is used to connect the water inlet and the water outlet, and the water flow path of the tubular liquid cooling channel passes through the area between the chip mounting area and the liquid through hole to achieve the best heat dissipation effect. This structure can also set the water inlet on the inner wall of the liquid through hole, and the water outlet on the side wall of the cooling plate body.

The diameter of the liquid refrigeration channel in the refrigeration plate body is 0.5mm-3mm.

The cooling plate body is made of metal, such as copper or a copper-diamond mixed material.

The semiconductor laser stack array using the above-mentioned large-channel semiconductor laser liquid cooling plate includes, from bottom to top, a water block, a positive electrode plate, at least one semiconductor laser unit, and a negative electrode plate. The semiconductor laser unit includes the large-channel semiconductor laser liquid cooling plate of the present invention, a laser chip, and a negative electrode connecting plate; the positive electrode of the laser chip is bonded to the chip mounting area of the liquid cooling plate, the negative electrode of the laser chip is directly connected to the negative electrode connecting plate, or the negative electrode of the laser chip is connected to the negative electrode connecting plate through a gold wire, and an insulating layer is provided between the negative electrode connecting plate and the liquid cooling plate to insulate the liquid cooling plate from the negative electrode connecting plate. The water block is provided with a water inlet pipe and a water outlet pipe, which are connected to the liquid cooling channel in the above-mentioned liquid cooling plate to form a cooling water circuit.

A side plate is provided on each side of the semiconductor laser stack, and a fixing block is provided on the negative electrode sheet of the semiconductor laser stack. The two side plates and the fixing block are used to fix the semiconductor laser stack; an insulating block is installed on the back of the semiconductor laser stack, and the insulating block is covered with the lead-out electrode of the positive electrode sheet and the lead-out electrode of the negative electrode sheet.

A stress relief layer is provided between the laser chip and the chip mounting area of the semiconductor laser unit, the positive electrode of the laser chip is welded or metal-bonded to the stress relief layer, and the stress relief layer is welded or metal-bonded to the chip mounting area; the material of the stress relief layer is copper tungsten.

The present invention has the following advantages:

The liquid cooling channel in the large-channel semiconductor laser liquid cooling sheet of the present invention is not easy to be blocked, which improves the reliability and life of the device, and the heat dissipation effect is equivalent to that of the microchannel cooling sheet under the condition of the same flow rate. Compared with the traditional macro-channel liquid cooling sheet, the large-channel semiconductor laser liquid cooling sheet of the present invention increases the cooling area, shortens the heat conduction path, and improves the heat dissipation efficiency.

BRIEF DESCRIPTION OF THE DRAWINGS

FIG. 1 is a liquid cooling plate of a large channel semiconductor laser of the present invention.

FIG. 2 is a perspective view of the internal structure of the liquid cooling plate of the large channel semiconductor laser of the present invention.

FIG. 3 is a second embodiment of the liquid cooling plate of the large channel semiconductor laser of the present invention.

FIG. 4 is a semiconductor laser stack using the large-channel liquid cooling plate of the present invention.

FIG. 5 shows a semiconductor laser unit in a semiconductor laser stack.

FIG. 6 is a schematic diagram of the cooling water circuit of the semiconductor laser stack.

Explanation of the accompanying numbers: 1 is the liquid inlet, 2 is the liquid outlet, 3 is the water inlet, 4 is the water outlet, 5 is the chip mounting area, 6 is the tubular liquid cooling channel, 7 is the liquid through hole, 8 is the fixing block, 9 is the water through block, 10 is the semiconductor laser unit, 11 is the cooling plate body, 12 is the laser chip, 13 is the negative electrode connecting plate of the semiconductor laser unit, 14 is the stress relief layer, 15 is the water inlet pipe, and 16 is the water outlet pipe.

Detailed ways

As shown in Figure 1, the liquid cooling plate of the large channel semiconductor laser of the present invention includes a sheet-like cooling plate body 11; a liquid inlet hole 1 and a liquid outlet hole 2 are arranged on the cooling plate body 11, and the liquid inlet hole 1 and the liquid outlet hole 2 both pass through the upper surface and the lower surface of the cooling plate body 11; a chip mounting area 5 is arranged at one end of the cooling plate body 11 close to the liquid inlet hole 1, for mounting a laser chip; a water inlet 3 is arranged on the inner wall of the liquid inlet hole 1, and a water outlet 4 is arranged on the inner wall of the liquid outlet hole 2; a tubular liquid cooling channel 6 is arranged in the cooling plate body 11, for connecting the water inlet 3 and the water outlet 4, and the liquid cooling channel 6 takes the water inlet 3 as the starting point, passes through the area between the chip mounting area 5 and the liquid inlet, and ends at the water outlet 4. For the specific structure, please refer to the internal structure perspective view of Figure 2.

FIG3 is a second embodiment of the liquid cooling plate of the large-channel semiconductor laser of the present invention: a liquid through hole 7 is arranged on the cooling plate body 11, and the liquid through hole 7 passes through the upper surface and the lower surface of the cooling plate body 11; a chip mounting area 5 is arranged at one end of the cooling plate body 11; a water inlet 3 is arranged on the side of the cooling plate body 11; a water outlet 4 is arranged on the inner wall of the liquid through hole 7; a tubular liquid cooling channel 6 is arranged in the cooling plate body for connecting the water inlet 3 and the water outlet 4; the water flow path of the tubular liquid cooling channel 6 passes through the area between the chip mounting area 5 and the liquid through hole to achieve the best heat dissipation effect.

The diameter of the liquid cooling channel 6 in the cooling fin body 11 is 0.5 mm to 3 mm.

The cooling plate body 11 is made of metal or a mixed material of copper and diamond.

FIG4 is a semiconductor laser stack using the large-channel liquid cooling sheet of the present invention, which includes, from bottom to top, a water block 9, a positive electrode sheet, at least one semiconductor laser unit 10, and a negative electrode sheet. FIG5 is a structure of a semiconductor laser unit in the semiconductor laser stack, wherein the semiconductor laser unit 10 includes the large-channel semiconductor laser liquid cooling sheet of the present invention, a laser chip 12, and a negative electrode connecting sheet 13; the positive electrode of the laser chip 12 is bonded to the chip mounting area 5 of the liquid cooling sheet, the negative electrode of the laser chip 12 is directly connected to the negative electrode connecting sheet 13, or the negative electrode of the laser chip is connected to the negative electrode connecting sheet through a gold wire, and an insulating layer is provided between the negative electrode connecting sheet and the liquid cooling sheet to insulate the liquid cooling sheet and the negative electrode connecting sheet.

A side plate is provided on each side of the semiconductor laser stack, and a fixing block 8 is provided on the negative electrode sheet of the semiconductor laser stack. The two side plates and the fixing block 8 are used to fix the semiconductor laser stack; an insulating block is installed on the back of the semiconductor laser stack, and the insulating block is covered with the lead-out electrode of the positive electrode sheet and the lead-out electrode of the negative electrode sheet.

A stress relief layer 14 is provided between the laser chip 12 of the semiconductor laser unit and the chip mounting area 5, the positive electrode of the laser chip 12 is welded or metal-bonded to the stress relief layer 14, and the stress relief layer 14 is welded or metal-bonded to the chip mounting area 5; the material of the stress relief layer is copper tungsten.

The water block is provided with a water inlet pipe 15 and a water outlet pipe 16, which are connected to the liquid cooling channel 6 in the liquid cooling plate to form a cooling water circuit. Figure 6 is a schematic diagram of the cooling water circuit of the semiconductor laser stack, and the arrow direction in the figure is the flow direction of the cooling liquid.

Claims (9)

1. A large-channel semiconductor laser liquid refrigerating sheet is characterized in that: comprises a flaky refrigeration piece main body;

The refrigerating sheet main body is provided with a liquid inlet hole and a liquid outlet hole, and the liquid inlet hole and the liquid outlet hole are communicated with the upper surface and the lower surface of the refrigerating sheet main body; a chip mounting area is arranged at one end of the refrigerating sheet main body, which is close to the liquid inlet hole, and is used for mounting a laser chip; the inner wall of the liquid inlet hole is provided with a water inlet, the inner wall of the liquid outlet hole is provided with a water outlet, and the refrigerating sheet main body is internally provided with a tubular liquid refrigerating channel which is communicated with the water inlet and the water outlet.

2. The large channel semiconductor laser liquid chilling plate as defined in claim 1, wherein: the liquid refrigerating channel takes a water inlet as a starting point, and a path passes through the area between the chip mounting area and the liquid inlet and takes a water outlet as an ending point.

3. A large-channel semiconductor laser liquid refrigerating sheet is characterized in that: comprises a flaky refrigeration piece main body;

The refrigerating sheet main body is provided with a liquid through hole, the liquid through hole penetrates through the upper surface and the lower surface of the refrigerating sheet main body, and one end of the refrigerating sheet main body is provided with a chip mounting area; the side of the refrigerating sheet main body is provided with a water inlet, the inner wall of the liquid through hole is provided with a water outlet, and a tubular liquid refrigerating channel is arranged in the refrigerating sheet main body and used for communicating the water inlet with the water outlet.

4. A large channel semiconductor laser liquid chiller as set forth in claim 3 wherein: the tubular liquid refrigeration passage water flow path passes through the area between the chip mounting area and the liquid through hole.

5. A large channel semiconductor laser liquid chiller as claimed in claim 1 or 3 wherein: the diameter of the liquid refrigerating channel in the refrigerating sheet main body is 0.5mm-3mm.

6. A large channel semiconductor laser liquid chiller as claimed in claim 1 or 3 wherein: the main body of the refrigerating sheet is copper-diamond or copper.

7. A semiconductor laser stack employing a large channel semiconductor laser liquid chiller as set forth in claim 1 or 3 wherein: the device comprises a lower water block, a positive electrode plate, at least one semiconductor laser unit and a negative electrode plate from bottom to top in sequence; the semiconductor laser unit comprises the large-channel semiconductor laser liquid refrigerating sheet, a laser chip and a negative electrode connecting sheet; the laser chip positive electrode bond in the chip mounting area of liquid refrigeration piece, the negative pole of laser chip is connected with negative pole connection piece lug connection, perhaps the negative pole of laser chip passes through gold thread and is connected with the negative pole connection piece, is equipped with the insulating layer between negative pole connection piece and the liquid refrigeration piece for make insulating between liquid refrigeration piece and the negative pole connection piece.

8. The semiconductor laser stack of claim 7, wherein: two sides of the semiconductor laser stacked array are respectively provided with a side plate, a fixed block is arranged on a negative electrode plate of the semiconductor laser stacked array, and the two side plates and the fixed block are used for fixing the semiconductor laser stacked array; the back of the semiconductor laser stacked array is provided with an insulating block, and the insulating block is covered with an extraction electrode of the positive electrode plate and an extraction electrode of the negative electrode plate.

9. The semiconductor laser stack of claim 7, wherein: a stress slow-release layer is arranged between the laser chip and the chip mounting area of the semiconductor laser unit, the positive electrode of the laser chip is welded or bonded on the stress slow-release layer, and the stress slow-release layer is welded or bonded on the chip mounting area; the stress slow-release layer is made of copper tungsten.