[go: up one dir, main page]

CN106885935A - Time domain voltage measuring method, measurement calibration method and measurement calibration verification method - Google Patents

Time domain voltage measuring method, measurement calibration method and measurement calibration verification method Download PDF

Info

Publication number
CN106885935A
CN106885935A CN201710257076.6A CN201710257076A CN106885935A CN 106885935 A CN106885935 A CN 106885935A CN 201710257076 A CN201710257076 A CN 201710257076A CN 106885935 A CN106885935 A CN 106885935A
Authority
CN
China
Prior art keywords
voltage
calibration
microstrip line
pcb
probe
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CN201710257076.6A
Other languages
Chinese (zh)
Inventor
方文啸
丘海迷
邵鄂
陈立辉
黄云
恩云飞
刘远
陈义强
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
China Electronic Product Reliability and Environmental Testing Research Institute
Original Assignee
China Electronic Product Reliability and Environmental Testing Research Institute
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by China Electronic Product Reliability and Environmental Testing Research Institute filed Critical China Electronic Product Reliability and Environmental Testing Research Institute
Priority to CN201710257076.6A priority Critical patent/CN106885935A/en
Publication of CN106885935A publication Critical patent/CN106885935A/en
Pending legal-status Critical Current

Links

Classifications

    • GPHYSICS
    • G01MEASURING; TESTING
    • G01RMEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R19/00Arrangements for measuring currents or voltages or for indicating presence or sign thereof
    • G01R19/0084Arrangements for measuring currents or voltages or for indicating presence or sign thereof measuring voltage only
    • GPHYSICS
    • G01MEASURING; TESTING
    • G01RMEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R35/00Testing or calibrating of apparatus covered by the other groups of this subclass
    • G01R35/005Calibrating; Standards or reference devices, e.g. voltage or resistance standards, "golden" references

Landscapes

  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Measurement Of Resistance Or Impedance (AREA)

Abstract

本发明涉及一种时域电压测量方法、测量校准方法及测量校准验证方法,测量方法包括:固定待测PCB板微带线与电压探头的相对位置,在向所述待测PCB板微带线上输入待测板级射频电压时,将所述电压探头放置在所述待测PCB板微带线上方,使所述电压探头底端中心的投影落在所述待测PCB板微带线上,且所述电压探头与所述待测PCB板微带线垂直;通过所述电压探头利用电场耦合感应出由所述待测板级射频电压在所述待测PCB板微带线周围产生的感应电动势;通过与所述电压探头的输出端相连接的示波器采集所述感应电动势;通过计算机根据所述示波器采集到的感应电动势计算所述待测板级射频电压。

The invention relates to a time-domain voltage measurement method, a measurement calibration method and a measurement calibration verification method. The measurement method includes: fixing the relative position of the microstrip line of the PCB board to be tested and the voltage probe, and moving the microstrip line of the PCB board to be tested. When inputting the board-level radio frequency voltage to be tested, the voltage probe is placed above the microstrip line of the PCB board to be tested, so that the projection of the center of the bottom end of the voltage probe falls on the microstrip line of the PCB board to be tested , and the voltage probe is perpendicular to the microstrip line of the PCB board to be tested; through the voltage probe, the electric field coupling is used to induce the RF voltage of the board level to be tested to be generated around the microstrip line of the PCB board to be tested An induced electromotive force; collecting the induced electromotive force through an oscilloscope connected to the output end of the voltage probe; calculating the board-level RF voltage to be tested through a computer according to the induced electromotive force collected by the oscilloscope.

Description

时域电压测量方法、测量校准方法及测量校准验证方法Time Domain Voltage Measurement Method, Measurement Calibration Method and Measurement Calibration Verification Method

技术领域technical field

本发明涉及射频电压频域测量技术领域,特别是涉及一种时域电压测量方法、测量校准方法及测量校准验证方法。The invention relates to the technical field of radio frequency voltage frequency domain measurement, in particular to a time domain voltage measurement method, a measurement calibration method and a measurement calibration verification method.

背景技术Background technique

所谓时域测量,就是测量该变量随时间的变化数据。非接触式的板级射频电压时域测量是当前高精密测试技术日益先进之后延伸出来的一个重要的测试课题。当前大部分的电压测试需要直接接触被测点,但是这种直接接触通常需要保证不干预被测系统。随着被测对象的日益复杂,有相当一部份是希望在测量电压的同时不希望修改系统或者停止系统,这时,非接触式的板级射频电压时域测量非常有必要。The so-called time domain measurement is to measure the change data of the variable with time. Non-contact board-level RF voltage time-domain measurement is an important test topic extended after the current high-precision test technology is becoming more and more advanced. Most current voltage tests require direct contact with the measured point, but such direct contact usually requires non-interference with the system under test. With the increasing complexity of the measured object, quite a few people want to measure the voltage without modifying the system or stopping the system. At this time, non-contact board-level RF voltage time domain measurement is very necessary.

传统的非接触式的板级射频电压时域测量方式适合于大电压的探测,当电压较小时,测量精确度较低。The traditional non-contact board-level RF voltage time-domain measurement method is suitable for the detection of large voltages. When the voltage is small, the measurement accuracy is low.

发明内容Contents of the invention

基于此,有必要针对电压较小时测量精确度较低的问题,提供一种时域电压测量方法、测量校准方法及测量校准验证方法。Based on this, it is necessary to provide a time-domain voltage measurement method, a measurement calibration method, and a measurement calibration verification method for the problem of low measurement accuracy when the voltage is small.

一种时域电压测量方法,包括以下步骤:A time-domain voltage measurement method, comprising the following steps:

固定待测PCB板微带线与电压探头的相对位置,在向所述待测PCB板微带线上输入待测板级射频电压时,将所述电压探头放置在所述待测PCB板微带线上方,使所述电压探头底端中心的投影落在所述待测PCB板微带线上,且所述电压探头与所述待测PCB板微带线垂直;Fix the relative position of the microstrip line of the PCB board to be tested and the voltage probe. Above the strip line, the projection of the bottom center of the voltage probe falls on the microstrip line of the PCB board to be tested, and the voltage probe is perpendicular to the microstrip line of the PCB board to be tested;

通过所述电压探头利用电场耦合感应出由所述待测板级射频电压在所述待测PCB板微带线周围产生的感应电动势;Using the electric field coupling to induce the induced electromotive force generated around the microstrip line of the PCB board to be tested by the board-level radio frequency voltage to be tested by the voltage probe;

通过与所述电压探头的输出端相连接的示波器采集所述感应电动势;collecting the induced electromotive force through an oscilloscope connected to the output end of the voltage probe;

通过计算机根据所述示波器采集到的感应电动势计算所述待测板级射频电压。The computer is used to calculate the board-level RF voltage to be tested according to the induced electromotive force collected by the oscilloscope.

上述时域电压测量方法,通过将电压探头放置在规定位置处,检测并采集待测PCB板微带线周围的感应电动势,根据采集到的感应电动势计算所述待测板级射频电压,能够精确地测量出所述板级射频电压的时域波形,提高了测量精确度。The above time-domain voltage measurement method, by placing the voltage probe at a specified position, detecting and collecting the induced electromotive force around the microstrip line of the PCB board to be tested, and calculating the board-level radio frequency voltage to be tested according to the collected induced electromotive force, can accurately The time-domain waveform of the board-level radio frequency voltage is accurately measured, and the measurement accuracy is improved.

一种时域电压测量校准方法,包括以下步骤:A time-domain voltage measurement calibration method, comprising the following steps:

固定校准PCB板微带线和所述电压探头的相对位置,在向所述校准PCB板微带线上输入校准板级射频电压时,将所述电压探头放置在所述校准PCB板微带线上方,使所述电压探头底端中心的投影落在所述校准PCB板微带线上,且所述电压探头与所述校准PCB板微带线垂直;Fix the relative position of the calibration PCB board microstrip line and the voltage probe, when inputting the calibration board-level RF voltage to the calibration PCB board microstrip line, place the voltage probe on the calibration PCB board microstrip line Above, make the projection of the center of the bottom end of the voltage probe fall on the microstrip line of the calibration PCB board, and the voltage probe is perpendicular to the microstrip line of the calibration PCB board;

通过网络分析仪测试由所述校准PCB板微带线与所述电压探头构成的二端口网络,得到用于对待测PCB板微带线的待测板级射频电压进行测量校准的校准因子;Test the two-port network formed by the calibration PCB board microstrip line and the voltage probe by a network analyzer to obtain a calibration factor for measuring and calibrating the board-level RF voltage of the PCB board microstrip line to be tested;

其中,所述网络分析仪的第一端口与所述校准PCB板微带线的一端连接,所述网络分析仪的第二端口与所述电压探头的输出端连接,所述校准PCB板微带线的另一端与阻抗匹配的负载连接。Wherein, the first port of the network analyzer is connected to one end of the calibration PCB microstrip line, the second port of the network analyzer is connected to the output end of the voltage probe, and the calibration PCB microstrip The other end of the line is connected to an impedance-matched load.

上述时域电压测量校准方法,通过将电压探头放置在规定位置处,并通过网络分析仪测试由校准PCB板微带线与电压探头构成的二端口网络,能够精确计算出用于对待测PCB板微带线的待测板级射频电压进行测量校准的校准因子,从而提高时域电压测量精确度。The above time-domain voltage measurement and calibration method, by placing the voltage probe at the specified position, and testing the two-port network composed of the calibration PCB microstrip line and the voltage probe through the network analyzer, can accurately calculate the The calibration factor for measuring and calibrating the board-level RF voltage of the microstrip line to be tested, thereby improving the accuracy of time-domain voltage measurement.

一种时域电压测量校准验证方法,包括以下步骤:A time-domain voltage measurement calibration verification method, comprising the following steps:

固定校准PCB板微带线和所述电压探头的相对位置,在向所述校准PCB板微带线上输入校准板级射频电压时,将所述电压探头放置在所述校准PCB板微带线的上方,使所述电压探头底端中心的投影落在所述校准PCB板微带线上,且所述电压探头与所述校准PCB板微带线垂直;Fix the relative position of the calibration PCB board microstrip line and the voltage probe, when inputting the calibration board-level RF voltage to the calibration PCB board microstrip line, place the voltage probe on the calibration PCB board microstrip line Above, make the projection of the center of the bottom end of the voltage probe fall on the microstrip line of the calibration PCB board, and the voltage probe is perpendicular to the microstrip line of the calibration PCB board;

通过任意波形发生器向所述校准PCB板微带线的一端输入任意波形的电压信号;Input an arbitrary waveform voltage signal to one end of the calibration PCB board microstrip line through an arbitrary waveform generator;

通过所述电压探头利用电场耦合感应出由所述电压信号在所述校准PCB板微带线周围产生的感应电动势;Using the electric field coupling to induce the induced electromotive force generated by the voltage signal around the microstrip line of the calibration PCB board through the voltage probe;

将示波器的第一通道与所述电压探头的输出端连接,通过所述第一通道采集电压探头输出的感应电动势;Connect the first channel of the oscilloscope to the output end of the voltage probe, and collect the induced electromotive force output by the voltage probe through the first channel;

将所述示波器的第二通道与所述校准PCB板微带线的另一端连接,通过所述第二通道采集所述校准PCB板微带线上的第二校准验证电压;The second channel of the oscilloscope is connected to the other end of the microstrip line of the calibration PCB board, and the second calibration verification voltage on the microstrip line of the calibration PCB board is collected through the second channel;

通过计算机根据所述示波器采集到的感应电动势计算第一校准验证电压,并根据所述第一校准验证电压和第二校准验证电压对校准因子进行校验;其中,所述校准因子用于对待测PCB板微带线的待测板级射频电压进行测量校准。The computer calculates the first calibration verification voltage according to the induced electromotive force collected by the oscilloscope, and verifies the calibration factor according to the first calibration verification voltage and the second calibration verification voltage; wherein, the calibration factor is used for the test The board-level RF voltage of the PCB microstrip line to be tested is measured and calibrated.

上述时域电压测量校准验证方法,通过将电压探头放置在规定位置处,通过任意波形发生器向所述校准PCB板微带线的一端输入任意波形的电压信号,通过示波器采集感应电动势与校准PCB板微带线上的第二校准验证电压,根据采集到的感应电动势计算第一校准验证电压,并根据所述第一校准验证电压和第二校准验证电压对校准因子进行校验,能够提高用于对待测PCB板微带线的待测板级射频电压进行测量校准的校准因子的精确度,从而提高时域电压测量精确度。The above time-domain voltage measurement calibration verification method, by placing the voltage probe at a specified position, inputting an arbitrary waveform voltage signal to one end of the microstrip line of the calibration PCB board through an arbitrary waveform generator, collecting the induced electromotive force and calibrating the PCB through an oscilloscope The second calibration verification voltage on the microstrip line of the board, the first calibration verification voltage is calculated according to the collected induced electromotive force, and the calibration factor is verified according to the first calibration verification voltage and the second calibration verification voltage, which can improve the use of The accuracy of the calibration factor for measuring and calibrating the board-level RF voltage of the microstrip line of the PCB board to be tested is used to improve the accuracy of time-domain voltage measurement.

附图说明Description of drawings

图1为一个实施例的电压探头的示意图;Fig. 1 is the schematic diagram of the voltage probe of an embodiment;

图2为一个实施例的时域电压测量装置的结构示意图;Fig. 2 is a structural schematic diagram of a time-domain voltage measuring device of an embodiment;

图3为一个实施例的时域电压测量方法流程图;Fig. 3 is a flow chart of the time-domain voltage measurement method of an embodiment;

图4为一个实施例的时域电压测量校准装置的结构示意图;Fig. 4 is a structural schematic diagram of a time-domain voltage measurement and calibration device of an embodiment;

图5为一个实施例的校准PCB板微带线的示意图;Fig. 5 is the schematic diagram of the calibration PCB board microstrip line of an embodiment;

图6为一个实施例的时域电压测量校准方法流程图;FIG. 6 is a flowchart of a method for measuring and calibrating time-domain voltage in an embodiment;

图7为一个实施例的时域电压测量校准验证装置的结构示意图;FIG. 7 is a schematic structural diagram of a time-domain voltage measurement calibration verification device of an embodiment;

图8为一个实施例的时域电压测量校准验证方法流程图;FIG. 8 is a flow chart of a time-domain voltage measurement calibration verification method according to an embodiment;

图9为一个实施例的校准因子的示意图;Fig. 9 is a schematic diagram of a calibration factor of an embodiment;

图10(a)为一个实施例的校准验证环节中电压探头的输出电压;Fig. 10 (a) is the output voltage of the voltage probe in the calibration verification link of an embodiment;

图10(b)为一个实施例的校准验证环节中根据电压探头的输出电压计算还原得到的第一校准验证电压;Fig. 10(b) is the first calibration verification voltage calculated and restored according to the output voltage of the voltage probe in the calibration verification link of an embodiment;

图10(c)为一个实施例的实际测得的板级射频电压。Fig. 10(c) is the actual measured board-level RF voltage of an embodiment.

具体实施方式detailed description

下面结合附图对本发明的技术方案进行说明。The technical solution of the present invention will be described below in conjunction with the accompanying drawings.

本实施例提供一种时域电压测量装置,可包括待测印制电路板(Printed CircuitBoard,PCB)微带线,电压探头,示波器和计算机。各部分功能如下:This embodiment provides a time-domain voltage measuring device, which may include a microstrip line of a printed circuit board (Printed Circuit Board, PCB) to be tested, a voltage probe, an oscilloscope and a computer. The functions of each part are as follows:

电压探头:可用同轴线缆所制,利用电场耦合来探测射频电压产生的电场。在一个实施例中,该探头可由一个阻抗为50Ω的同轴线缆构成。如图1所示,探测部位由内导体外伸构成,在一个实施例中,外伸长度大概在1mm-3mm左右,太短会导致信号耦合太弱,太长会导致引入干扰太大。其原理是通过电场耦合来探测板级射频电压在被测微带线上产生的电场Ev,被测的板级射频电压v(t)在空间中产生交变电场,电压探头利用电场耦合感应出由这交变电场产生的感应电动势,电压探头的内导体与SMA(SubMiniature version A,超小型A型)头连接,所形成的感应电动势vP(t)通过探头的内导体和SMA头往信号采集设备进行传输,通常地,存在即电压探头探测到的感应电动势与被测板级射频电压在空间中产生的电场成正比,被测板级射频电压在空间中产生的电场与被测射频电压成正比。因此通过采集vP(t)的信号可以推知被测的板级射频电压v(t)。Voltage probe: It can be made of coaxial cable, and uses electric field coupling to detect the electric field generated by radio frequency voltage. In one embodiment, the probe can consist of a coaxial cable with an impedance of 50Ω. As shown in Figure 1, the detection part is formed by the extension of the inner conductor. In one embodiment, the extension length is about 1mm-3mm. If it is too short, the signal coupling will be too weak, and if it is too long, it will cause too much interference. The principle is to detect the electric field Ev generated by the board-level RF voltage on the measured microstrip line through electric field coupling. The measured board-level RF voltage v(t) generates an alternating electric field in space, and the voltage probe uses electric field coupling to induce The induced electromotive force generated by this alternating electric field connects the inner conductor of the voltage probe to the SMA (SubMiniature version A, ultra-small A type) head, and the formed induced electromotive force v P (t) passes through the inner conductor of the probe and the SMA head to the signal acquisition equipment for transmission, usually, there are and That is, the induced electromotive force detected by the voltage probe is proportional to the electric field generated by the measured board-level RF voltage in space, and the electric field generated by the measured board-level RF voltage in space is proportional to the measured RF voltage. Therefore, the measured board-level RF voltage v(t) can be deduced by collecting the signal of v P (t).

示波器:电压探头的电压信号采集,示波器的一个通道(例如,通道1)连接电压探头读取探头所采集到的电压波形。在一个实施例中,通道的终端阻抗设为50Ω。为了与示波器形成阻抗匹配,微带线的阻抗可设计为50Ω。Oscilloscope: the voltage signal acquisition of the voltage probe, one channel (for example, channel 1) of the oscilloscope is connected to the voltage probe to read the voltage waveform collected by the probe. In one embodiment, the termination impedance of the channel is set to 50Ω. In order to form impedance matching with the oscilloscope, the impedance of the microstrip line can be designed as 50Ω.

计算机:处理数据。Computers: Process data.

上述时域电压测量装置的连接结构示意图如图2所示,所述电压探头放置在所述待测PCB板微带线的上方,使所述电压探头底端中心的投影落在所述待测PCB板微带线上,且所述电压探头与所述待测PCB板微带线垂直,所述电压探头的输出端与所述示波器的第一通道相连接,所述示波器的输出端与所述计算机相连接;所述电压探头利用电场耦合感应出由待测板级射频电压在所述待测PCB板微带线周围产生的感应电动势,所述示波器采集所述感应电动势并发送到计算机,所述计算机根据所述感应电动势计算所述待测板级射频电压。The schematic diagram of the connection structure of the above-mentioned time-domain voltage measurement device is shown in Figure 2. The voltage probe is placed above the microstrip line of the PCB board to be tested, so that the projection of the center of the bottom end of the voltage probe falls on the surface to be tested. The microstrip line of the PCB board, and the voltage probe is perpendicular to the microstrip line of the PCB board to be tested, the output end of the voltage probe is connected to the first channel of the oscilloscope, and the output end of the oscilloscope is connected to the oscilloscope. The computer is connected; the voltage probe uses electric field coupling to induce the induced electromotive force generated around the microstrip line of the PCB board to be tested by the board-level radio frequency voltage to be tested, and the oscilloscope collects the induced electromotive force and sends it to the computer. The computer calculates the board-level RF voltage to be tested according to the induced electromotive force.

可选地,在一个实施例中,为了便于放置所述电压探头,本实施例的时域电压测量装置还可包括夹具、支架和样品台。各部分功能如下:Optionally, in one embodiment, in order to facilitate the placement of the voltage probe, the time-domain voltage measurement device of this embodiment may further include a fixture, a bracket and a sample stage. The functions of each part are as follows:

夹具:用于固定所述电压探头,由于所述电压探头上需要连接同轴线缆,同轴线缆具有一定的刚性,需要有所述夹具来固定所述电压探头的位置。Clamp: used to fix the voltage probe. Since the voltage probe needs to be connected to a coaxial cable, and the coaxial cable has certain rigidity, the clamp is required to fix the position of the voltage probe.

支架:用来固定所述电压探头夹具,从而固定所述电压探头的空间位置。这是由于整个探测过程中,所述电压探头的空间位置会影响被探测信号的采集;另外,所述电压探头的空间位置影响了所述校准因子的大小以及系统的频率响应。因此可设置支架来固定所述电压探头的空间位置。Bracket: used to fix the voltage probe fixture, thereby fixing the spatial position of the voltage probe. This is because during the entire detection process, the spatial position of the voltage probe will affect the acquisition of the detected signal; in addition, the spatial position of the voltage probe will affect the size of the calibration factor and the frequency response of the system. Therefore, a bracket can be provided to fix the spatial position of the voltage probe.

样品台:放置样品,所谓样品即是输入有待测板级射频电压的待测PCB板微带线。待测PCB板微带线可通过SMA头焊接在PCB板上。Sample stage: place the sample, the so-called sample is the microstrip line of the PCB board to be tested that is input with the RF voltage of the board level to be tested. The microstrip line of the PCB board to be tested can be welded on the PCB board through the SMA head.

可将所述电压探头固定在所述夹具上,并把安装了所述电压探头的夹具固定在所述支架上,使所述电压探头与所述PCB板垂直;将所述待测PCB板微带线固定在所述样品台上;调整所述样品台,使得所述电压探头底端中心的投影落在所述待测PCB板微带线上。进一步地,为了提高测量精确度,可调整所述样品台,使得所述电压探头底端的平面与所述待测PCB板微带线表面平行,所述电压探头底端中心的投影在所述待测PCB板微带线的中心处,并且使所述电压探头底端与所述待测PCB板微带线表面的距离为1毫米(误差可控制在0.1mm)。在一个实施例中,所述夹具固定在所述支架上后,所述支架在水平方向和垂直方向可调。当所述电压探头中心投影在所述待测PCB板微带线的中心时,在固定高度下,探头感应到的电场最强,最适合用于校准探头。The voltage probe can be fixed on the clamp, and the clamp installed with the voltage probe is fixed on the support, so that the voltage probe is perpendicular to the PCB board; the PCB board to be tested is slightly The strip line is fixed on the sample stage; the sample stage is adjusted so that the projection of the center of the bottom end of the voltage probe falls on the microstrip line of the PCB board to be tested. Further, in order to improve the measurement accuracy, the sample stage can be adjusted so that the plane of the bottom end of the voltage probe is parallel to the surface of the microstrip line of the PCB board to be tested, and the projection of the center of the bottom end of the voltage probe is on the surface of the to-be-tested PCB board. Measure the center of the microstrip line of the PCB board, and make the distance between the bottom end of the voltage probe and the surface of the microstrip line of the PCB board to be tested be 1 mm (the error can be controlled at 0.1 mm). In one embodiment, after the clamp is fixed on the support, the support can be adjusted horizontally and vertically. When the center of the voltage probe is projected on the center of the microstrip line of the PCB board to be tested, at a fixed height, the electric field induced by the probe is the strongest, which is most suitable for calibrating the probe.

如图3所示,本实施例提供一种时域电压测量方法,可包括以下步骤:As shown in FIG. 3, the present embodiment provides a time-domain voltage measurement method, which may include the following steps:

S101,固定待测PCB板微带线与电压探头的相对位置,在向所述待测PCB板上输入待测板级射频电压时,将所述电压探头放置在所述待测PCB板微带线上方,使所述电压探头底端中心的投影落在所述待测PCB板微带线上,且所述电压探头与所述待测PCB板微带线垂直;S101, fixing the relative position of the microstrip line of the PCB board to be tested and the voltage probe, and placing the voltage probe on the microstrip line of the PCB board to be tested when inputting the board-level radio frequency voltage to the PCB board to be tested Above the line, the projection of the bottom center of the voltage probe falls on the microstrip line of the PCB board to be tested, and the voltage probe is perpendicular to the microstrip line of the PCB board to be tested;

S102,通过所述电压探头利用电场耦合感应出由所述待测板级射频电压在所述待测PCB微带线周围产生的感应电动势;S102, using the electric field coupling to induce the induced electromotive force generated by the board-level radio frequency voltage to be tested around the microstrip line of the PCB to be tested through the voltage probe;

S103,通过与所述电压探头的输出端相连接的示波器采集所述感应电动势;S103, collecting the induced electromotive force through an oscilloscope connected to the output terminal of the voltage probe;

S104,通过计算机根据所述示波器采集到的感应电动势计算所述待测板级射频电压。S104. Calculate the board-level RF voltage to be tested by using the computer according to the induced electromotive force collected by the oscilloscope.

计算机可根据所述感应电动势和预先计算的校准因子计算所述待测板级射频电压。在一个实施例中,可根据如下公式计算所述待测板级射频电压:The computer can calculate the board-level RF voltage to be tested according to the induced electromotive force and a pre-calculated calibration factor. In one embodiment, the board-level RF voltage to be tested can be calculated according to the following formula:

v(t)=IFFT[FPK(ω)] (1)v(t)=IFFT[F PK (ω)] (1)

其中,in,

FP(ω)=FFT[vP(t)] (3)F P (ω) = FFT[v P (t)] (3)

式中,v(t)为所述待测板级射频电压,vP(t)为所述感应电动势,K(ω)为所述校准因子,FFT表示傅里叶变换,IFFT表示反傅里叶变换。In the formula, v(t) is the radio frequency voltage of the board to be tested, vP(t) is the induced electromotive force, K (ω) is the calibration factor, FFT means Fourier transform, IFFT means inverse Fourier leaf transformation.

本实施例的时域电压测量方法可基于上述实施例提供的时域电压测量装置实现。The time-domain voltage measurement method of this embodiment can be implemented based on the time-domain voltage measurement device provided in the above-mentioned embodiments.

如图4所示,本实施例提供一种时域电压测量校准测量,可包括:校准PCB板微带线,电压探头,网络分析仪和负载;所述校准PCB板微带线的一端连接所述网络分析仪的第一端口(即图中的端口1),所述校准PCB板微带线的另一端连接所述负载,所述电压探头放置在所述校准PCB板微带线的上方,使所述电压探头底端中心的投影落在所述校准PCB板微带线上,且所述电压探头与所述校准PCB板微带线垂直,所述电压探头的输出端与所述网络分析仪的第二端口(即图中的端口2)相连接;所述网络分析仪通过所述第一端口和第二端口测试由所述校准PCB板微带线与所述电压探头构成的二端口网络,得到用于对待测PCB板微带线的待测板级射频电压进行测量校准的校准因子。As shown in Figure 4, the present embodiment provides a kind of time-domain voltage measurement calibration measurement, which may include: calibration PCB board microstrip line, voltage probe, network analyzer and load; one end of the calibration PCB board microstrip line is connected to the The first port (i.e. port 1 in the figure) of the network analyzer, the other end of the calibration PCB board microstrip line is connected to the load, and the voltage probe is placed above the calibration PCB board microstrip line, Make the projection of the center of the bottom end of the voltage probe fall on the microstrip line of the calibration PCB board, and the voltage probe is perpendicular to the microstrip line of the calibration PCB board, and the output terminal of the voltage probe is connected to the network analysis The second port (i.e. port 2 in the figure) of the instrument is connected; the network analyzer tests the two ports formed by the calibration PCB board microstrip line and the voltage probe through the first port and the second port network to obtain a calibration factor for measuring and calibrating the board-level RF voltage of the microstrip line of the PCB board to be tested.

上述时域电压测量校准装置,通过将电压探头放置在规定位置处,并通过网络分析仪测试由校准PCB板微带线与电压探头构成的二端口网络,能够精确计算出用于对待测PCB板微带线的待测板级射频电压进行测量校准的校准因子,从而提高时域电压测量精确度。The above-mentioned time-domain voltage measurement and calibration device can accurately calculate the voltage for the PCB board to be tested by placing the voltage probe at a specified position and testing the two-port network composed of the calibration PCB microstrip line and the voltage probe through a network analyzer. The calibration factor for measuring and calibrating the board-level RF voltage of the microstrip line to be tested, thereby improving the accuracy of time-domain voltage measurement.

如图5所示,所述校准PCB板微带线作为校准件,用来获得和确定探头的校准因子。其中,所述校准PCB板微带线阻抗50欧姆,适用频率越高越好,通常至少在2GHz以上。所述校准PCB板微带线的阻抗可设计为与信号采集设备和信号输出设备形成阻抗匹配,保证信号在传输过程中没有受到反射,从而保证校准的准确性。As shown in FIG. 5 , the calibration PCB board microstrip line is used as a calibration item to obtain and determine the calibration factor of the probe. Wherein, the impedance of the microstrip line of the calibration PCB board is 50 ohms, and the higher the applicable frequency, the better, usually at least above 2 GHz. The impedance of the calibration PCB board microstrip line can be designed to form an impedance match with the signal acquisition device and the signal output device, so as to ensure that the signal is not reflected during the transmission process, thereby ensuring the accuracy of the calibration.

所述网络分析仪的作用是测量由所述电压探头与所述校准PCB板微带线所组成的二端口网络系统的传输特性,从而得到所述校准因子。所述网络系统中,通常以所述校准PCB板微带线为端口1,而所述电压探头为端口2,利用所述网络分析仪测量信号传输的幅值衰减情况以及相位变化情况,测量的模式是频率扫描。在使用所述网络分析仪之前,可进行所述网络分析仪自校,并设置所述网络分析仪的扫描频率范围、输出功率以及带宽。校准因子算法如下:K(ω)=S21。S21是网络分析仪所测得的传输系数。The function of the network analyzer is to measure the transmission characteristics of the two-port network system composed of the voltage probe and the microstrip line of the calibration PCB board, so as to obtain the calibration factor. In the network system, the calibration PCB board microstrip line is usually used as port 1, and the voltage probe is used as port 2, and the network analyzer is used to measure the amplitude attenuation and phase change of signal transmission, and the measured The mode is frequency sweep. Before using the network analyzer, self-calibration of the network analyzer can be performed, and the scanning frequency range, output power and bandwidth of the network analyzer can be set. The calibration factor algorithm is as follows: K(ω)=S 21 . S 21 is the transmission coefficient measured by the network analyzer.

可选地,本实施例的时域电压测量校准测量还可包括夹具、支架和样品台。在一个实施例中,在使用所述网络分析仪校准前,可将所述电压探头固定在所述夹具上,并把安装了所述电压探头的夹具固定在所述支架上,使所述电压探头与所述校准PCB板微带线垂直;将所述校准PCB板微带线固定在所述样品台上;调整所述样品台,使得所述电压探头底端中心的投影落在所述校准PCB微带线上。进一步地,为了提高测量精确度,可调整所述样品台,使得所述电压探头底端的平面与所述校准PCB板微带线平面平行,所述电压探头底端中心的投影在所述校准PCB板微带线的中心处,并且使所述电压探头底端与所述校准PCB板微带线表面的距离为1毫米(误差可控制在0.1mm)。在一个实施例中,所述夹具固定在所述支架上后,支架在水平方向和垂直方向上可调。当所述电压探头中心投影在所述校准PCB板微带线的中心时,在固定高度下,探头感应到的电场最强,最适合用于校准探头。上述电压探头、夹具、支架和样品台等器件的实施例可与时域电压测量装置的实施例中对应的器件的实施例相同,此处不再赘述。Optionally, the time-domain voltage measurement calibration measurement in this embodiment may also include a fixture, a support, and a sample stage. In one embodiment, before using the network analyzer for calibration, the voltage probe can be fixed on the fixture, and the fixture installed with the voltage probe can be fixed on the bracket, so that the voltage The probe is perpendicular to the microstrip line of the calibration PCB board; the microstrip line of the calibration PCB board is fixed on the sample stage; the sample stage is adjusted so that the projection of the center of the bottom end of the voltage probe falls on the calibration PCB microstrip line. Further, in order to improve the measurement accuracy, the sample stage can be adjusted so that the plane of the bottom end of the voltage probe is parallel to the microstrip line plane of the calibration PCB board, and the projection of the center of the bottom end of the voltage probe is on the calibration PCB The center of the microstrip line of the board, and the distance between the bottom end of the voltage probe and the surface of the microstrip line of the calibration PCB board is 1 mm (the error can be controlled within 0.1 mm). In one embodiment, after the clamp is fixed on the support, the support can be adjusted horizontally and vertically. When the center of the voltage probe is projected on the center of the microstrip line of the calibration PCB board, at a fixed height, the electric field induced by the probe is the strongest, which is most suitable for calibrating the probe. Embodiments of the components such as the above-mentioned voltage probes, fixtures, brackets, and sample stages may be the same as those of the corresponding components in the embodiments of the time-domain voltage measurement device, and will not be repeated here.

在实际应用中,可先通过本实施例的时域电压测量校准装置获取校准因子,再将校准因子用于时域电压测量装置中进行时域电压测量。这样,能够获得更高的测量精确度。In practical applications, the calibration factor can be obtained first through the time-domain voltage measurement calibration device of this embodiment, and then the calibration factor can be used in the time-domain voltage measurement device for time-domain voltage measurement. In this way, higher measurement accuracy can be obtained.

如图6所示,本实施例提供一种时域电压测量校准方法,可包括以下步骤:As shown in FIG. 6, this embodiment provides a time-domain voltage measurement and calibration method, which may include the following steps:

S201,固定校准PCB板微带线和所述电压探头的相对位置,在向所述校准PCB板微带线上输入校准板级射频电压时,将所述电压探头放置在所述校准PCB板微带线上方,使所述电压探头底端中心的投影落在所述校准PCB板微带线上,且所述电压探头与所述校准PCB板微带线垂直;S201, fixing the relative position of the microstrip line of the calibration PCB board and the voltage probe, and placing the voltage probe on the microstrip line of the calibration PCB board when inputting the calibration board level radio frequency voltage to the microstrip line of the calibration PCB board Above the strip line, the projection of the bottom center of the voltage probe falls on the microstrip line of the calibration PCB board, and the voltage probe is perpendicular to the microstrip line of the calibration PCB board;

S202,通过网络分析仪测试由所述校准PCB板微带线与所述电压探头构成的二端口网络,得到用于对待测PCB板微带线的待测板级射频电压进行测量校准的校准因子;S202, testing the two-port network composed of the calibration PCB board microstrip line and the voltage probe by a network analyzer, and obtaining a calibration factor for measuring and calibrating the board-level radio frequency voltage of the PCB board microstrip line to be tested ;

其中,所述网络分析仪的第一端口(即图中的端口1)与所述校准PCB板微带线的一端连接,所述网络分析仪的第二端口(即图中的端口2)与所述电压探头的输出端连接,所述校准PCB板微带线的另一端与阻抗匹配的负载连接。Wherein, the first port (i.e. port 1 in the figure) of the network analyzer is connected to one end of the calibration PCB board microstrip line, and the second port (i.e. the port 2 in the figure) of the network analyzer is connected to The output end of the voltage probe is connected, and the other end of the calibration PCB board microstrip line is connected to an impedance-matched load.

上述时域电压测量校准方法,通过将电压探头放置在规定位置处,并通过网络分析仪测试由校准PCB板微带线与电压探头构成的二端口网络,能够精确计算出用于对待测PCB板微带线的待测板级射频电压进行测量校准的校准因子,从而提高时域电压测量精确度。The above time-domain voltage measurement and calibration method, by placing the voltage probe at the specified position, and testing the two-port network composed of the calibration PCB microstrip line and the voltage probe through the network analyzer, can accurately calculate the The calibration factor for measuring and calibrating the board-level RF voltage of the microstrip line to be tested, thereby improving the accuracy of time-domain voltage measurement.

本实施例的时域电压测量校准方法可基于上述时域电压测量校准装置实现。在实际应用中,可先通过本实施例的时域电压测量校准方法获取校准因子,再将校准因子用于时域电压测量方法中进行时域电压测量。这样,能够进一步获得更高的测量精确度。具体地,在得到校准因子之后,可以将校准因子代入公式(2),从而根据所述校准因子和所述感应电动势计算所述待测板级射频电压。The time-domain voltage measurement and calibration method of this embodiment can be implemented based on the above-mentioned time-domain voltage measurement and calibration device. In practical applications, the calibration factor may be first obtained through the time-domain voltage measurement calibration method of this embodiment, and then the calibration factor is used in the time-domain voltage measurement method to perform time-domain voltage measurement. In this way, further higher measurement accuracy can be obtained. Specifically, after the calibration factor is obtained, the calibration factor can be substituted into formula (2), so as to calculate the board-level RF voltage to be tested according to the calibration factor and the induced electromotive force.

如图7所示,本发明实施例提供一种时域电压测量校准验证装置,可包括:校准PCB板微带线,电压探头,任意波形发生器,示波器和计算机所述电压探头放置在所述校准PCB板微带线的上方,使所述电压探头底端中心的投影落在所述校准PCB板微带线上,且所述电压探头与所述校准PCB板微带线垂直,所述电压探头的输出端与所述示波器的第一通道相连接;所述任意波形发生器的输出通道通过所述校准PCB板微带线连接至所述示波器的第二通道;所述任意波形发生器向所述校准PCB板微带线输入电压信号,所述电压探头利用电场耦合感应出由所述电压信号在所述校准PCB板微带线周围产生的感应电动势,所述示波器通过所述第一通道采集电压探头输出的感应电动势,并通过所述第二通道采集所述校准PCB板微带线上的第二校准验证电压,所述计算机根据所述示波器采集到的感应电动势计算第一校准验证电压,并根据所述第一校准验证电压和第二校准验证电压对校准因子进行校验;其中,所述校准因子用于对待测PCB板微带线的待测板级射频电压进行测量校准。As shown in Figure 7, an embodiment of the present invention provides a time-domain voltage measurement calibration verification device, which may include: calibration PCB board microstrip line, voltage probe, arbitrary waveform generator, oscilloscope and computer. The voltage probe is placed on the Calibrate above the microstrip line of the PCB board, so that the projection of the center of the bottom end of the voltage probe falls on the microstrip line of the calibration PCB board, and the voltage probe is perpendicular to the microstrip line of the calibration PCB board, and the voltage The output end of probe is connected with the first channel of described oscilloscope; The output channel of described arbitrary waveform generator is connected to the second channel of described oscilloscope by the microstrip line of described calibration PCB board; Described arbitrary waveform generator is to The calibration PCB board microstrip line input voltage signal, the voltage probe utilizes electric field coupling to induce the induced electromotive force generated around the calibration PCB board microstrip line by the voltage signal, and the oscilloscope passes through the first channel Collect the induced electromotive force output by the voltage probe, and collect the second calibration verification voltage on the microstrip line of the calibration PCB board through the second channel, and the computer calculates the first calibration verification voltage according to the induced electromotive force collected by the oscilloscope , and verify the calibration factor according to the first calibration verification voltage and the second calibration verification voltage; wherein, the calibration factor is used to measure and calibrate the board-level RF voltage of the microstrip line of the PCB board to be tested.

上述时域电压测量校准验证装置,通过将电压探头放置在规定位置处,通过任意波形发生器向所述校准PCB板微带线的一端输入任意波形的电压信号,通过示波器采集感应电动势与校准PCB板微带线上的第二校准验证电压,根据采集到的感应电动势计算第一校准验证电压,并根据所述第一校准验证电压和第二校准验证电压对校准因子进行校验,能够提高用于对待测PCB板微带线的待测板级射频电压进行测量校准的校准因子的精确度,从而提高时域电压测量精确度。The above-mentioned time-domain voltage measurement calibration verification device, by placing the voltage probe at a specified position, inputting an arbitrary waveform voltage signal to one end of the microstrip line of the calibration PCB board through an arbitrary waveform generator, collecting the induced electromotive force and calibrating the PCB through an oscilloscope The second calibration verification voltage on the microstrip line of the board, the first calibration verification voltage is calculated according to the collected induced electromotive force, and the calibration factor is verified according to the first calibration verification voltage and the second calibration verification voltage, which can improve the use of The accuracy of the calibration factor for measuring and calibrating the board-level RF voltage of the microstrip line of the PCB board to be tested is used to improve the accuracy of time-domain voltage measurement.

任意波形发生器应用于校准验证部分,给所述校准PCB板微带线的其中一端输入任意的波形。可设置所述任意波形发生器内部阻抗与采集装置(即所述示波器)的内部阻抗相匹配,例如,当示波器采集通道的内部阻抗为50Ω时,任意波形发生器的内部阻抗也为50Ω。给所述校准PCB板微带线输入的波形可以是方波、三角波或者锯齿波等波形。The arbitrary waveform generator is applied to the calibration verification part, and an arbitrary waveform is input to one end of the microstrip line of the calibration PCB board. The internal impedance of the arbitrary waveform generator can be set to match the internal impedance of the acquisition device (that is, the oscilloscope). For example, when the internal impedance of the acquisition channel of the oscilloscope is 50Ω, the internal impedance of the arbitrary waveform generator is also 50Ω. The waveform input to the microstrip line of the calibration PCB board may be a square wave, a triangle wave or a sawtooth wave or the like.

示波器在系统验证部分作为信号的采集。所述示波器的其中一个通道与所述电压探头连接来读取所述电压探头所采集到的电压波形,所述通道的内部阻抗设为50Ω,该电压波形用于还原被测电压,该还原的被测电压作为第一校准验证电压;与此同时,所述示波器的另一个通道同样设定内部阻抗为50Ω,并连接所述校准PCB板微带线的另一端,监测校准PCB板微带线上的电压,该电压波形作为第二校准验证电压,与第一校准验证电压对比后来验证所述校准因子的正确性。The oscilloscope is used as signal acquisition in the system verification part. One of the channels of the oscilloscope is connected to the voltage probe to read the voltage waveform collected by the voltage probe, the internal impedance of the channel is set to 50Ω, the voltage waveform is used to restore the measured voltage, the restored The measured voltage is used as the first calibration verification voltage; at the same time, another channel of the oscilloscope also sets the internal impedance to 50Ω, and connects the other end of the calibration PCB microstrip line to monitor the calibration PCB microstrip line The voltage on the above, the voltage waveform is used as the second calibration verification voltage, compared with the first calibration verification voltage to verify the correctness of the calibration factor.

可选地,还可包括夹具、支架和样品台。在一个实施例中,在使用所述任意波形发生器输入电压信号前,可将所述电压探头固定在所述夹具上,并把安装了所述电压探头的夹具固定在所述支架上,使所述电压探头与所述校准PCB板微带线垂直;将所述校准PCB板微带线固定在所述样品台上;调整所述样品台,使得所述电压探头底端中心的投影落在所述校准PCB板微带线上。进一步地,为了提高测量精确度,可调整所述样品台,使得所述电压探头底端的平面与校准PCB微带线平面平行,所述电压探头底端中心的投影在校准PCB板微带线的中心处,并且使所述电压探头底端与所述校准PCB板微带线表面的距离为1毫米(误差可控制在0.1mm)。在一个实施例中,所述夹具固定在支架上后,所述支架在水平方向和垂直方向上可调。当所述电压探头中心投影在所述校准PCB板微带线的中心时,在固定高度下,探头感应到的电场最强,最适合用于校准探头。上述电压探头、夹具、支架和样品台等器件的实施例可与时域电压测量装置的实施例中对应的器件的实施例相同,此处不再赘述。Optionally, clamps, holders and sample stages can also be included. In one embodiment, before using the arbitrary waveform generator to input a voltage signal, the voltage probe can be fixed on the fixture, and the fixture installed with the voltage probe can be fixed on the bracket, so that The voltage probe is perpendicular to the microstrip line of the calibration PCB board; the microstrip line of the calibration PCB board is fixed on the sample stage; the sample stage is adjusted so that the projection of the center of the bottom end of the voltage probe falls on The calibration PCB board microstrip line. Further, in order to improve the measurement accuracy, the sample stage can be adjusted so that the plane of the bottom end of the voltage probe is parallel to the plane of the microstrip line of the calibration PCB, and the projection of the center of the bottom end of the voltage probe is on the plane of the microstrip line of the calibration PCB board. center, and the distance between the bottom end of the voltage probe and the surface of the microstrip line of the calibration PCB board is 1 mm (the error can be controlled within 0.1 mm). In one embodiment, after the clamp is fixed on the support, the support can be adjusted horizontally and vertically. When the center of the voltage probe is projected on the center of the microstrip line of the calibration PCB board, at a fixed height, the electric field induced by the probe is the strongest, which is most suitable for calibrating the probe. Embodiments of the components such as the above-mentioned voltage probes, fixtures, brackets, and sample stages may be the same as those of the corresponding components in the embodiments of the time-domain voltage measurement device, and will not be repeated here.

在实际应用中,可先通过上述时域电压测量校准装置获取校准因子,再通过本实施例的时域电压测量校准验证装置对获取的校准因子进行校准验证,若验证成功,表示校准因子符合实际条件,可将校准因子用于时域电压测量装置中进行时域电压测量;若验证失败,表示校准因子不符合实际条件,可通过上述时域电压测量校准装置重新获取校准因子。这样,能够获得更高的测量精确度。In practical applications, the calibration factor can be first obtained by the above-mentioned time-domain voltage measurement calibration device, and then the obtained calibration factor can be calibrated and verified by the time-domain voltage measurement calibration verification device of this embodiment. If the verification is successful, it means that the calibration factor conforms to the actual Conditions, the calibration factor can be used in the time-domain voltage measurement device for time-domain voltage measurement; if the verification fails, it means that the calibration factor does not meet the actual conditions, and the calibration factor can be obtained again through the above-mentioned time-domain voltage measurement calibration device. In this way, higher measurement accuracy can be obtained.

如图8所示,本实施例提供一种时域电压测量校准验证方法,可包括以下步骤:As shown in FIG. 8, this embodiment provides a time-domain voltage measurement calibration verification method, which may include the following steps:

S301,固定所述校准PCB板微带线和所述电压探头的相对位置,在向所述校准PCB板微带线上输入校准板级射频电压时,将所述电压探头放置在所述校准PCB板微带线的上方,使所述电压探头底端中心的投影落在所述校准PCB板微带线上,且所述电压探头与所述校准PCB板微带线垂直;S301, fixing the relative position of the microstrip line of the calibration PCB board and the voltage probe, and placing the voltage probe on the calibration PCB when inputting the calibration board-level RF voltage to the microstrip line of the calibration PCB board Above the microstrip line of the board, the projection of the bottom center of the voltage probe falls on the microstrip line of the calibration PCB board, and the voltage probe is perpendicular to the microstrip line of the calibration PCB board;

S302,通过任意波形发生器向所述校准PCB板微带线的一端输入任意波形的电压信号;S302, inputting a voltage signal of an arbitrary waveform to one end of the microstrip line of the calibration PCB board through an arbitrary waveform generator;

S303,通过所述电压探头利用电场耦合感应出由所述电压信号在所述校准PCB板微带线周围产生的感应电动势;S303, using the electric field coupling to induce the induced electromotive force generated by the voltage signal around the microstrip line of the calibration PCB board through the voltage probe;

S304,将示波器的第一通道与所述电压探头的输出端连接,通过所述第一通道采集电压探头输出的感应电动势;S304. Connect the first channel of the oscilloscope to the output end of the voltage probe, and collect the induced electromotive force output by the voltage probe through the first channel;

S305,将所述示波器的第二通道与所述校准PCB板微带线的另一端连接,通过所述第二通道采集所述校准PCB板微带线上的第二校准验证电压;S305. Connect the second channel of the oscilloscope to the other end of the microstrip line of the calibration PCB board, and collect the second calibration verification voltage on the microstrip line of the calibration PCB board through the second channel;

S306,通过计算机根据所述示波器采集到的感应电动势计算第一校准验证电压,并根据所述第一校准验证电压和第二校准验证电压对校准因子进行校验;其中,所述校准因子用于对待测PCB板微带线的待测板级射频电压进行测量校准。S306, using the computer to calculate the first calibration verification voltage according to the induced electromotive force collected by the oscilloscope, and verify the calibration factor according to the first calibration verification voltage and the second calibration verification voltage; wherein the calibration factor is used for Measure and calibrate the board-level RF voltage of the microstrip line of the PCB board to be tested.

上述时域电压测量校准验证方法,通过将电压探头放置在规定位置处,通过任意波形发生器向所述校准PCB板微带线的一端输入任意波形的电压信号,通过示波器采集感应电动势与校准PCB板微带线上的第二校准验证电压,根据采集到的感应电动势计算第一校准验证电压,并根据所述第一校准验证电压和第二校准验证电压对校准因子进行校验,能够提高用于对待测PCB板微带线的待测板级射频电压进行测量校准的校准因子的精确度,从而提高时域电压测量精确度。The above time-domain voltage measurement calibration verification method, by placing the voltage probe at a specified position, inputting an arbitrary waveform voltage signal to one end of the microstrip line of the calibration PCB board through an arbitrary waveform generator, collecting the induced electromotive force and calibrating the PCB through an oscilloscope The second calibration verification voltage on the microstrip line of the board, the first calibration verification voltage is calculated according to the collected induced electromotive force, and the calibration factor is verified according to the first calibration verification voltage and the second calibration verification voltage, which can improve the use of The accuracy of the calibration factor for measuring and calibrating the board-level RF voltage of the microstrip line of the PCB board to be tested is used to improve the accuracy of time-domain voltage measurement.

本实施例的时域电压测量校准验证方法可基于上述时域电压测量校准验证装置实现。在实际应用中,可先通过上述时域电压测量校准方法获取校准因子,再通过本实施例的时域电压测量校准验证方法对获取的校准因子进行校准验证,若验证成功,表示校准因子符合实际条件,可将校准因子用于时域电压测量方法中进行时域电压测量;若验证失败,表示校准因子不符合实际条件,可通过上述时域电压测量校准方法重新获取校准因子。这样,能够进一步获得更高的测量精确度。The time-domain voltage measurement calibration verification method of this embodiment can be implemented based on the above-mentioned time-domain voltage measurement calibration verification device. In practical applications, the calibration factor can be first obtained through the above-mentioned time-domain voltage measurement calibration method, and then the obtained calibration factor can be calibrated and verified through the time-domain voltage measurement calibration verification method of this embodiment. If the verification is successful, it means that the calibration factor conforms to the actual Conditions, the calibration factor can be used in the time-domain voltage measurement method for time-domain voltage measurement; if the verification fails, it means that the calibration factor does not meet the actual conditions, and the calibration factor can be obtained again through the above-mentioned time-domain voltage measurement calibration method. In this way, further higher measurement accuracy can be obtained.

在一个实施例中,可根据如下公式计算第一校准验证电压:In one embodiment, the first calibration verification voltage can be calculated according to the following formula:

vMK(t)=IFFT[FMK(ω)] (5)v MK (t) = IFFT[F MK (ω)] (5)

其中,in,

FMK(ω)=FM(ω)·K(ω) (6)F MK (ω) = F M (ω)·K(ω) (6)

FM(ω)=FFT[vM(t)] (7)F M (ω) = FFT[v M (t)] (7)

式中,vM(t)为所述感应电动势,vMK(t)为所述第一校准验证电压,K(ω)为校准因子。In the formula, v M (t) is the induced electromotive force, v MK (t) is the first calibration verification voltage, and K(ω) is a calibration factor.

若所述第一校准验证电压与所述第二校准验证电压的差值小于预设的阈值,判定校验成功,可将所述校准因子代入公式(2)中进行计算,得到所述待测板级射频电压的时域波形;反之,判定校验失败,则重新计算所述校准因子。If the difference between the first calibration verification voltage and the second calibration verification voltage is less than the preset threshold, it is determined that the verification is successful, and the calibration factor can be substituted into formula (2) for calculation to obtain the The time-domain waveform of the board-level RF voltage; otherwise, if it is determined that the verification fails, the calibration factor is recalculated.

值得一提的是,校准部分、校准验证部分及测量部分中所述电压探头与PCB板微带线(包括所述校准PCB板微带线和所述待测PCB板微带线)的位置应尽量保持一致。一致性越好,测量准确度越高。It is worth mentioning that the positions of the voltage probe and the microstrip line of the PCB board (including the microstrip line of the calibration PCB board and the microstrip line of the PCB board to be tested) in the calibration part, the calibration verification part and the measurement part should be Try to be as consistent as possible. The better the agreement, the higher the measurement accuracy.

图9为一个典型测量所得S21的参数,即所述校准因子K(ω)。图10(a)和图10(b)分别为校准验证环节中所述电压探头的输出电压和根据该输出电压计算还原得到的第一校准验证电压。图10(c)为实际测得的板级射频电压,即第二校准验证电压。FIG. 9 shows a typical measured parameter of S 21 , that is, the calibration factor K(ω). Fig. 10(a) and Fig. 10(b) respectively show the output voltage of the voltage probe in the calibration verification link and the first calibration verification voltage calculated and restored according to the output voltage. FIG. 10( c ) is the actually measured board-level RF voltage, that is, the second calibration verification voltage.

以上所述实施例的各技术特征可以进行任意的组合,为使描述简洁,未对上述实施例中的各个技术特征所有可能的组合都进行描述,然而,只要这些技术特征的组合不存在矛盾,都应当认为是本说明书记载的范围。The technical features of the above-mentioned embodiments can be combined arbitrarily. To make the description concise, all possible combinations of the technical features in the above-mentioned embodiments are not described. However, as long as there is no contradiction in the combination of these technical features, should be considered as within the scope of this specification.

以上所述实施例仅表达了本发明的几种实施方式,其描述较为具体和详细,但并不能因此而理解为对发明专利范围的限制。应当指出的是,对于本领域的普通技术人员来说,在不脱离本发明构思的前提下,还可以做出若干变形和改进,这些都属于本发明的保护范围。因此,本发明专利的保护范围应以所附权利要求为准。The above-mentioned embodiments only express several implementation modes of the present invention, and the descriptions thereof are relatively specific and detailed, but should not be construed as limiting the patent scope of the invention. It should be pointed out that those skilled in the art can make several modifications and improvements without departing from the concept of the present invention, and these all belong to the protection scope of the present invention. Therefore, the protection scope of the patent for the present invention should be based on the appended claims.

Claims (10)

1. A time domain voltage measurement method is characterized by comprising the following steps:
fixing the relative position of a micro-strip line of a PCB to be detected and a voltage probe, and placing the voltage probe above the micro-strip line of the PCB to be detected when inputting board-level radio frequency voltage to the micro-strip line of the PCB to be detected, so that the projection of the center of the bottom end of the voltage probe falls on the micro-strip line of the PCB to be detected, and the voltage probe is vertical to the micro-strip line of the PCB to be detected;
inducing induced electromotive force generated around the microstrip line of the PCB to be tested by the board-level radio-frequency voltage to be tested by the voltage probe through electric field coupling;
acquiring the induced electromotive force through an oscilloscope connected with the output end of the voltage probe;
and calculating the board-level radio-frequency voltage to be measured by the computer according to the induced electromotive force acquired by the oscilloscope.
2. The time domain voltage measuring method of claim 1, wherein the step of placing the voltage probe above the microstrip line of the PCB board to be tested comprises:
fixing the voltage probe on a clamp, and fixing the clamp provided with the voltage probe on a bracket to ensure that the voltage probe is vertical to the microstrip line of the PCB to be tested;
fixing the micro-strip line of the PCB to be tested on a sample stage;
and adjusting the sample stage to enable the projection of the center of the bottom end of the voltage probe to fall on the micro-strip line of the PCB to be detected.
3. The time-domain voltage measuring method according to claim 2, wherein the step of adjusting the sample stage so that the projection of the center of the bottom end of the voltage probe falls on the microstrip line of the PCB board to be measured comprises:
and adjusting the sample stage to enable the plane of the bottom end of the voltage probe to be parallel to the surface of the micro-strip line of the PCB to be detected, enabling the projection of the center of the bottom end of the voltage probe to be at the center of the micro-strip line of the PCB to be detected, and enabling the distance between the bottom end of the voltage probe and the surface of the micro-strip line of the PCB to be detected to be 1 mm.
4. The time domain voltage measuring method of claim 3, wherein the holder is adjustable in a horizontal direction and a vertical direction after the holder is fixed to the holder.
5. The time-domain voltage measuring method according to any one of claims 1 to 4, wherein the step of calculating the board-level radio-frequency voltage to be measured by the computer according to the induced electromotive force collected by the oscilloscope comprises:
calculating the radio frequency voltage of the board level to be measured according to the following modes:
v(t)=IFFT[FPK(ω)];
wherein, FPK(ω)=FP(ω)·K(ω);
FP(ω)=FFT[vP(t)];
Where v (t) is the RF voltage of the board to be tested, vP(t) is the induced electromotive force, and K (ω) is a calibration factor.
6. A time domain voltage measurement calibration method, comprising the steps of:
fixing the relative positions of a calibration PCB microstrip line and the voltage probe, and placing the voltage probe above the calibration PCB microstrip line when a calibration board-level radio frequency voltage is input to the calibration PCB microstrip line, so that the projection of the center of the bottom end of the voltage probe falls on the calibration PCB microstrip line, and the voltage probe is perpendicular to the calibration PCB microstrip line;
testing a two-port network formed by the calibration PCB microstrip line and the voltage probe through a network analyzer to obtain a calibration factor for measuring and calibrating the to-be-measured board-level radio frequency voltage of the to-be-measured PCB microstrip line;
the first port of the network analyzer is connected with one end of the calibration PCB microstrip line, the second port of the network analyzer is connected with the output end of the voltage probe, and the other end of the calibration PCB microstrip line is connected with a load matched with impedance.
7. The time domain voltage measurement calibration method of claim 6, wherein the network analyzer further calculates a calibration factor according to the following formula:
K(ω)=S21
in the formula, K (omega) is a calibration factor, S21The transmission coefficient measured by the network analyzer.
8. A time domain voltage measurement calibration verification method is characterized by comprising the following steps:
fixing the relative positions of a calibration PCB microstrip line and the voltage probe, and placing the voltage probe above the calibration PCB microstrip line when a calibration board-level radio frequency voltage is input to the calibration PCB microstrip line, so that the projection of the center of the bottom end of the voltage probe falls on the calibration PCB microstrip line, and the voltage probe is perpendicular to the calibration PCB microstrip line;
inputting a voltage signal with an arbitrary waveform to one end of the calibration PCB microstrip line through an arbitrary waveform generator;
inducing induced electromotive force generated around the calibration PCB microstrip line by the voltage signal by the voltage probe through electric field coupling;
connecting a first channel of an oscilloscope with the output end of the voltage probe, and acquiring induced electromotive force output by the voltage probe through the first channel;
connecting a second channel of the oscilloscope with the other end of the calibration PCB microstrip line, and collecting a second calibration verification voltage on the calibration PCB microstrip line through the second channel;
calculating a first calibration verification voltage according to the induced electromotive force acquired by the oscilloscope through a computer, and verifying a calibration factor according to the first calibration verification voltage and a second calibration verification voltage; the calibration factor is used for measuring and calibrating the board-level radio frequency voltage to be measured of the PCB microstrip line to be measured.
9. The time-domain voltage measurement calibration verification method according to claim 8, wherein the step of calculating, by a computer, a first calibration verification voltage from the induced electromotive force collected by the oscilloscope comprises:
the first calibration verification voltage is calculated according to the following formula:
vMK(t)=IFFT[FMK(ω)];
wherein, FMK(ω)=FM(ω)·K(ω);
FM(ω)=FFT[vM(t)];
In the formula, vM(t) is the induced electromotive force, vMK(t) is the first calibration verify voltage, and K (ω) is a calibration factor.
10. The time-domain voltage measurement calibration verification method of claim 8, wherein the step of verifying a calibration factor based on the first calibration verification voltage and the second calibration verification voltage comprises:
if the difference value of the first calibration verification voltage and the second calibration verification voltage is smaller than a preset threshold value, judging that the verification is successful;
otherwise, the verification is judged to fail.
CN201710257076.6A 2017-04-19 2017-04-19 Time domain voltage measuring method, measurement calibration method and measurement calibration verification method Pending CN106885935A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN201710257076.6A CN106885935A (en) 2017-04-19 2017-04-19 Time domain voltage measuring method, measurement calibration method and measurement calibration verification method

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN201710257076.6A CN106885935A (en) 2017-04-19 2017-04-19 Time domain voltage measuring method, measurement calibration method and measurement calibration verification method

Publications (1)

Publication Number Publication Date
CN106885935A true CN106885935A (en) 2017-06-23

Family

ID=59183551

Family Applications (1)

Application Number Title Priority Date Filing Date
CN201710257076.6A Pending CN106885935A (en) 2017-04-19 2017-04-19 Time domain voltage measuring method, measurement calibration method and measurement calibration verification method

Country Status (1)

Country Link
CN (1) CN106885935A (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN108169701A (en) * 2017-12-30 2018-06-15 中国电子产品可靠性与环境试验研究所 Radio-frequency power ime-domain measuring method and calibration method

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0613016A1 (en) * 1993-01-27 1994-08-31 Hamamatsu Photonics K.K. Voltage detection apparatus
CN104569888A (en) * 2014-12-24 2015-04-29 北京无线电计量测试研究所 System and method for correcting correction factors of near field probe by utilizing microstrip line method
CN105372475A (en) * 2015-11-30 2016-03-02 工业和信息化部电子第五研究所 Time domain measurement method, time domain measurement calibration method and time domain measurement calibration validation method of board-level radio-frequency current
CN105891611A (en) * 2016-04-08 2016-08-24 北京航空航天大学 Broadband miniature near-field electric field test probe

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0613016A1 (en) * 1993-01-27 1994-08-31 Hamamatsu Photonics K.K. Voltage detection apparatus
CN104569888A (en) * 2014-12-24 2015-04-29 北京无线电计量测试研究所 System and method for correcting correction factors of near field probe by utilizing microstrip line method
CN105372475A (en) * 2015-11-30 2016-03-02 工业和信息化部电子第五研究所 Time domain measurement method, time domain measurement calibration method and time domain measurement calibration validation method of board-level radio-frequency current
CN105891611A (en) * 2016-04-08 2016-08-24 北京航空航天大学 Broadband miniature near-field electric field test probe

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN108169701A (en) * 2017-12-30 2018-06-15 中国电子产品可靠性与环境试验研究所 Radio-frequency power ime-domain measuring method and calibration method

Similar Documents

Publication Publication Date Title
CN108152575B (en) RF power time domain measurement system, measurement calibration system and calibration verification system
US9244145B2 (en) System and method for measuring near field information of device under test
Jia et al. Predicting the radiated emissions of automotive systems according to CISPR 25 using current scan methods
CN108169701B (en) RF power time domain measurement method and calibration method
US8803538B2 (en) Contactless measuring system for near field measurement of a signal waveguide
CN106771897B (en) GIS ultrahigh frequency partial discharge signal attenuation test system and method
CN106990277A (en) Time domain voltage measurement apparatus, measurement calibrating installation and measurement calibration verification device
CN107345986B (en) Impedance testing method in de-embedding mode
CN116165411B (en) Electric field probe calibration method, device and system
Schneider et al. Pre-compliance test method for radiated emissions of automotive components using scattering parameter transfer functions
US9432064B2 (en) System and method for automated loss testing
US10509064B2 (en) Impedance measurement through waveform monitoring
CN107656226B (en) HFCT electrical parameter test device and test method based on transmission coefficient
Jia et al. An alternative method for measurement of radiated emissions according to CISPR 25
CN105425014A (en) Time domain measurement system, time domain measurement calibration system and time domain measurement calibration verification system for board-level radio frequency current
Schneider et al. Pre-compliance test method for radiated emissions with multiple segment transfer functions
CN103983933B (en) Board-level RF current probe frequency calibration method, system and device
US20100036632A1 (en) System and method for evaluating high frequency time domain in embedded device probing
US20050075076A1 (en) Method and apparatus for measuring impedance of electrical component under high interference conditions
CN106885935A (en) Time domain voltage measuring method, measurement calibration method and measurement calibration verification method
Roseberry et al. A parallel-strip line for testing RF susceptibility
KR101680473B1 (en) The method of high-frequency S-parameter measurement for planar components
CN114441862A (en) A system and method for performance verification of UHF sensor
CN103954854A (en) Testing method and device for pogo pin electrical performance
Cakir et al. FFT-based time domain solution to power frequency issue of CS101 testing for military and aerospace equipment

Legal Events

Date Code Title Description
PB01 Publication
PB01 Publication
SE01 Entry into force of request for substantive examination
SE01 Entry into force of request for substantive examination
RJ01 Rejection of invention patent application after publication

Application publication date: 20170623

RJ01 Rejection of invention patent application after publication