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CN106871632B - Real-time control device for microwave heating and drying of industrial powder materials - Google Patents

Real-time control device for microwave heating and drying of industrial powder materials Download PDF

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Publication number
CN106871632B
CN106871632B CN201710153170.7A CN201710153170A CN106871632B CN 106871632 B CN106871632 B CN 106871632B CN 201710153170 A CN201710153170 A CN 201710153170A CN 106871632 B CN106871632 B CN 106871632B
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resistor
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relay
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CN106871632A (en
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张晶
陈垚
孙俊
郭立
范洪博
容会
吴晟
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Kunming University of Science and Technology
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    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F26DRYING
    • F26BDRYING SOLID MATERIALS OR OBJECTS BY REMOVING LIQUID THEREFROM
    • F26B25/00Details of general application not covered by group F26B21/00 or F26B23/00
    • F26B25/22Controlling the drying process in dependence on liquid content of solid materials or objects

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  • Drying Of Solid Materials (AREA)

Abstract

The invention relates to a real-time control device for microwave heating and drying of industrial powder materials, and belongs to the technical field of real-time embedded control. The invention mainly comprises a control computer, a ZigBee communication unit, a microwave generator unit, a charging barrel, a dehumidifying device, a rotating base, an antenna cap, a helical antenna, an insulating medium shell, a heating cavity and other components. The heating device heats materials in the cavity uniformly, and the whole device has the advantages of simple structure, low production cost, reasonable design, safety and effectiveness.

Description

一种工业粉体物料微波加热干燥实时控制装置A real-time control device for microwave heating and drying of industrial powder materials

技术领域technical field

本发明涉及一种工业粉体物料微波加热干燥实时控制装置,特别是一种基于CPS的工业粉体物料微波加热干燥实时控制装置,属于实时嵌入式控制技术领域。The invention relates to a real-time control device for microwave heating and drying of industrial powder materials, in particular to a real-time control device for microwave heating and drying of industrial powder materials based on CPS, which belongs to the technical field of real-time embedded control.

背景技术Background technique

工业微波能应用技术在发达国家被誉为“二十一世纪新一代技术”并纳入国家新能源战略,微波加热具有优质、高效、节能、环保等显著特征。对工业粉体物料进行加热干燥作业,需要人员现场操作,可以降低了事故容错率。但在大尺寸谐振腔内加热粉末状物料时,传统的微波加热器的抽湿口或入料筒没有微波漏能抑制器,容易造成加热器中的微波外泄而危机人身安全。Industrial microwave energy application technology is hailed as "new generation technology in the 21st century" in developed countries and has been included in the national new energy strategy. Microwave heating has remarkable characteristics such as high quality, high efficiency, energy saving, and environmental protection. The heating and drying operation of industrial powder materials requires on-site operation by personnel, which can reduce the fault tolerance rate of accidents. However, when heating powdery materials in a large-sized resonant cavity, the dehumidification port or feeding cylinder of the traditional microwave heater does not have a microwave energy leakage suppressor, which may easily cause the microwave in the heater to leak out and endanger personal safety.

发明内容Contents of the invention

本发明提供了一种基于CPS的工业粉体物料微波加热干燥实时控制装置,以用于有效地提高工业粉体物料加热干燥作业效率及实时控制与监控现场情况等。The invention provides a CPS-based real-time control device for microwave heating and drying of industrial powder materials, which is used to effectively improve the efficiency of heating and drying industrial powder materials and real-time control and monitor site conditions.

本发明的技术方案是:一种工业粉体物料微波加热干燥实时控制装置,包括控制计算机1、ZigBee通信单元2、微波发生器单元22、入料筒8、抽湿装置、旋转底座14、天线帽15、螺旋天线16、绝缘介质外壳17、加热腔体20、风扇系统21、可开合式料筒口23、出料筒24、空气压缩机25、料筒连接管26、入料筒阀门31;The technical solution of the present invention is: a real-time control device for microwave heating and drying of industrial powder materials, including a control computer 1, a ZigBee communication unit 2, a microwave generator unit 22, a feeding cylinder 8, a dehumidifier, a rotating base 14, and an antenna Cap 15, helical antenna 16, insulating medium shell 17, heating cavity 20, fan system 21, openable barrel opening 23, discharging barrel 24, air compressor 25, barrel connecting pipe 26, and barrel valve 31;

所述的控制计算机1通过网络连接ZigBee通信单元2,ZigBee通信单元2嵌入微波发生器单元22,入料筒8、抽湿装置的上端分别连接微波发生器单元22,下端分别连接加热腔体20,入料筒阀门31位于入料筒8内部,入料筒阀门31通过入料筒阀门控制电路与微波发生器单元22连接,旋转底座14连接天线帽15,天线帽15连接螺旋天线16,绝缘介质外壳17一端连接微波发生器单元22,另一端连接加热腔体20,绝缘介质外壳17包裹着螺旋天线16,加热腔体20的底部有风扇系统21、可开合式料筒口23,可开合式料筒口23位于风扇系统21的内圈,可开合式料筒口23连接出料筒24,出料筒24内有空气压缩机25,出料筒24连接料筒连接管26;The control computer 1 is connected to the ZigBee communication unit 2 through the network, and the ZigBee communication unit 2 is embedded in the microwave generator unit 22. The upper ends of the feeding cylinder 8 and the dehumidification device are respectively connected to the microwave generator unit 22, and the lower ends are respectively connected to the heating chamber 20. , the feed cylinder valve 31 is located inside the feed cylinder 8, the feed cylinder valve 31 is connected to the microwave generator unit 22 through the feed cylinder valve control circuit, the rotating base 14 is connected to the antenna cap 15, and the antenna cap 15 is connected to the helical antenna 16, insulated One end of the dielectric housing 17 is connected to the microwave generator unit 22, and the other end is connected to the heating chamber 20. The insulating dielectric housing 17 wraps the helical antenna 16. The bottom of the heating chamber 20 has a fan system 21 and an openable barrel mouth 23, which can be opened and closed. The barrel opening 23 is located on the inner ring of the fan system 21, the openable barrel opening 23 is connected to the discharge barrel 24, and there is an air compressor 25 inside the discharge barrel 24, and the discharge barrel 24 is connected to the barrel connecting pipe 26;

所述的微波发生器单元22包括控制单元3、供电单元4、功率调节单元5、磁控管过载保护单元6、磁控管7,控制单元3连接供电单元4、功率调节单元5,功率调节单元5连接磁控管过载保护单元6,磁控管过载保护单元6连接磁控管7,磁控管过载保护单元6、磁控管7均与供电单元4相连;控制单元3还与入料筒8的入料筒阀门31、旋转底座14、抽湿装置、风扇系统21、可开合式料筒口23、空气压缩机25相连。Described microwave generator unit 22 comprises control unit 3, power supply unit 4, power adjustment unit 5, magnetron overload protection unit 6, magnetron 7, control unit 3 is connected power supply unit 4, power adjustment unit 5, power adjustment The unit 5 is connected to the magnetron overload protection unit 6, the magnetron overload protection unit 6 is connected to the magnetron 7, and the magnetron overload protection unit 6 and the magnetron 7 are all connected to the power supply unit 4; the control unit 3 is also connected to the feeding The feeding cylinder valve 31 of the cylinder 8, the rotating base 14, the dehumidifying device, the fan system 21, the opening and closing type cylinder mouth 23, and the air compressor 25 are connected.

优选地,所述的入料筒8下端连接微波漏能抑制器Ⅱ12,微波漏能抑制器Ⅱ12连接加热腔体20。Preferably, the lower end of the feeding cylinder 8 is connected to the microwave energy leakage suppressor II12, and the microwave energy leakage suppressor II12 is connected to the heating cavity 20.

具体地,所述ZigBee通信单元2包括ARM控制器27、UART转换芯片28、RS接口29、ZigBee模块30、电容C1、电容C2、电容C3、电阻R1、电阻R2、电阻R3、电阻R4、电阻R5、晶体振荡器X1;UART转换芯片28采用MAX232A ,ARM控制器27的PIO2_0脚连接UART转换芯片28的

Figure DEST_PATH_IMAGE001
脚,其中ARM控制器27的PIO2_1脚连接UART转换芯片28的SI脚, ARM控制器27的PIO2_3脚连接UART转换芯片28的SCLK脚, ARM控制器27的PIO2_2脚连接UART转换芯片28的SO脚及电阻R1的一端,电阻R1的另一端接地;UART转换芯片28的/>
Figure 887992DEST_PATH_IMAGE002
脚接地,UART转换芯片28的VSS脚接地且与电容C1的一端连接,UART转换芯片28的VDD脚连接Vcc与电容C1的另一端;UART转换芯片28的XTAL1脚连接电容C2的一端与晶体振荡器X1的一端,电容C2的另一端接地,晶体振荡器X1的另一端连接UART转换芯片28的XTAL2脚及电容C3的一端,电容C3的另一端接地;UART转换芯片28的T1IN脚连接RS接口29的TXD脚,UART转换芯片28的R1OUT脚连接RS接口29的RXD脚;UART转换芯片28的T2IN脚连接电阻R3的一端,电阻R3的另一端连接电阻R2的一端及ZigBee模块30的TXD脚,电阻R2的另一端接地,UART转换芯片28的R2OUT脚连接电阻R4的一端,电阻R4另一端连接电阻R5的一端及ZigBee模块30的RXD脚,电阻R5的另一端接地。Specifically, the ZigBee communication unit 2 includes an ARM controller 27, a UART conversion chip 28, an RS interface 29, a ZigBee module 30, a capacitor C1, a capacitor C2, a capacitor C3, a resistor R1, a resistor R2, a resistor R3, a resistor R4, a resistor R5, crystal oscillator X1; UART conversion chip 28 adopts MAX232A, and PIO2_0 pin of ARM controller 27 is connected to UART conversion chip 28
Figure DEST_PATH_IMAGE001
pin, wherein the PIO2_1 pin of the ARM controller 27 is connected to the SI pin of the UART conversion chip 28, the PIO2_3 pin of the ARM controller 27 is connected to the SCLK pin of the UART conversion chip 28, and the PIO2_2 pin of the ARM controller 27 is connected to the SO pin of the UART conversion chip 28 and one end of the resistor R1, the other end of the resistor R1 is grounded; the UART conversion chip 28
Figure 887992DEST_PATH_IMAGE002
The pin is grounded, the VSS pin of the UART conversion chip 28 is grounded and connected to one end of the capacitor C1, the VDD pin of the UART conversion chip 28 is connected to Vcc and the other end of the capacitor C1; the XTAL1 pin of the UART conversion chip 28 is connected to one end of the capacitor C2 and the crystal oscillator One end of the oscillator X1, the other end of the capacitor C2 is grounded, the other end of the crystal oscillator X1 is connected to the XTAL2 pin of the UART conversion chip 28 and one end of the capacitor C3, and the other end of the capacitor C3 is grounded; the T1IN pin of the UART conversion chip 28 is connected to the RS interface The TXD pin of 29, the R1OUT pin of the UART conversion chip 28 is connected to the RXD pin of the RS interface 29; the T2IN pin of the UART conversion chip 28 is connected to one end of the resistor R3, and the other end of the resistor R3 is connected to one end of the resistor R2 and the TXD pin of the ZigBee module 30 , the other end of the resistor R2 is grounded, the R2OUT pin of the UART conversion chip 28 is connected to one end of the resistor R4, the other end of the resistor R4 is connected to one end of the resistor R5 and the RXD pin of the ZigBee module 30, and the other end of the resistor R5 is grounded.

具体地,所述的入料筒阀门控制电路包括继电器KA1、二极管D1、NPN型三极管Q1、电阻R6、电阻R7、电阻R8、变阻器R9;入料筒阀门31的上端连接电阻R6的一端及变阻器R9的下端,入料筒阀门31的下端接地,电阻R6的另一端接地;继电器KA1的一端连接二极管D1的阴极与变阻器R9,在变阻器R9上,继电器KA1可连接变阻器R9的上端至下端间的任意部位;继电器KA1的另一端连接二极管D1的阳极及NPN型三极管Q1的极电极,NPN型三极管Q1的发射极接地,NPN型三极管Q1的基极连接电阻R7的一端及电阻R8的一端,电阻R7的另一端连接控制单元3,电阻R8的另一端接地。Specifically, the valve control circuit of the feeding barrel includes a relay KA1, a diode D1, an NPN transistor Q1, a resistor R6, a resistor R7, a resistor R8, and a rheostat R9; the upper end of the feeding barrel valve 31 is connected to one end of the resistor R6 and the rheostat The lower end of R9, the lower end of the valve 31 of the feeding cylinder is grounded, and the other end of the resistor R6 is grounded; one end of the relay KA1 is connected to the cathode of the diode D1 and the rheostat R9. On the rheostat R9, the relay KA1 can be connected to the upper end of the rheostat R9. Any part; the other end of the relay KA1 is connected to the anode of the diode D1 and the pole electrode of the NPN transistor Q1, the emitter of the NPN transistor Q1 is grounded, the base of the NPN transistor Q1 is connected to one end of the resistor R7 and one end of the resistor R8, and the resistor The other end of R7 is connected to the control unit 3, and the other end of the resistor R8 is grounded.

具体地,所述抽湿装置包括抽湿系统Ⅰ9、抽湿系统Ⅱ10、微波漏能抑制器Ⅰ11、微波漏能抑制器Ⅲ13、抽湿转轮Ⅰ32、抽湿转轮Ⅱ33、转轮控制芯片Ⅰ56、转轮控制芯片Ⅱ57、总线CAN1、总线CAN2、总线CAN3、开关K1、开关K2、开关K3、开关K4、开关K5、开关K6、开关K7、开关K8、开关K9、继电器KA2、继电器KA3、继电器KA4、继电器KA5、继电器KA6、继电器KA7;其中转轮控制芯片Ⅰ56、转轮控制芯片Ⅱ57均采用8XC196MC芯片,抽湿系统Ⅰ9、抽湿系统Ⅱ10分别与控制单元3连接,抽湿转轮Ⅰ32位于抽湿系统Ⅰ9内部,抽湿系统Ⅰ9底部连接微波漏能抑制器Ⅰ11,抽湿转轮Ⅱ33位于抽湿系统Ⅱ10内部,抽湿系统Ⅱ10底部连接微波漏能抑制器Ⅲ13,微波漏能抑制器Ⅰ11、微波漏能抑制器Ⅲ13分别连接加热腔体20;开关K1位于总线CAN1上,总线CAN1连接开关K6的一端,开关K6的另一端连接继电器KA4的一端,继电器KA4的另一端连接转轮控制芯片Ⅰ56的P3脚;开关K2位于总线CAN2上,总线CAN2连接开关K5的一端,开关K5的另一端连接继电器KA3的一端,继电器KA3的另一端连接转轮控制芯片Ⅰ56的P2脚;开关K3位于总线CAN3上,总线CAN3连接开关K4的一端,开关K4的另一端连接继电器KA2的一端,继电器KA2的另一端连接转轮控制芯片Ⅰ56的P1脚;转轮控制芯片Ⅰ56的O1脚连接抽湿转轮Ⅰ32;同时,开关K7的一端连接总线CAN3,开关K7的另一端连接继电器KA5的一端,继电器KA5的另一端连接转轮控制芯片Ⅱ57的P1脚;开关K8的一端连接总线CAN2,开关K8的另一端连接继电器KA6的一端,继电器KA6的另一端连接转轮控制芯片Ⅱ57的P2脚;开关K9的一端连接总线CAN1,开关K9的另一端连接继电器KA7的一端,继电器KA7的另一端连接转轮控制芯片Ⅱ57的P3脚;转轮控制芯片Ⅱ57的O1脚连接抽湿转轮Ⅱ33。Specifically, the dehumidification device includes dehumidification system I9, dehumidification system II10, microwave energy leakage suppressor I11, microwave energy leakage suppressor III13, dehumidification runner I32, dehumidification runner II33, runner control chip I56 , Wheel control chip Ⅱ57, bus CAN1, bus CAN2, bus CAN3, switch K1, switch K2, switch K3, switch K4, switch K5, switch K6, switch K7, switch K8, switch K9, relay KA2, relay KA3, relay KA4, relay KA5, relay KA6, and relay KA7; the runner control chip Ⅰ56 and runner control chip Ⅱ57 both use 8XC196MC chip, the dehumidification system Ⅰ9 and dehumidification system Ⅱ10 are respectively connected to the control unit 3, and the dehumidification runner Ⅰ32 is located at Inside the dehumidification system I9, the bottom of the dehumidification system I9 is connected to the microwave energy leakage suppressor I11, the dehumidification rotor II33 is located inside the dehumidification system II10, the bottom of the dehumidification system II10 is connected to the microwave energy leakage suppressor III13, and the microwave energy leakage suppressor I11 The microwave energy leakage suppressor III13 is respectively connected to the heating cavity 20; the switch K1 is located on the bus CAN1, the bus CAN1 is connected to one end of the switch K6, the other end of the switch K6 is connected to one end of the relay KA4, and the other end of the relay KA4 is connected to the wheel control chip The P3 pin of Ⅰ56; the switch K2 is located on the bus CAN2, the bus CAN2 is connected to one end of the switch K5, the other end of the switch K5 is connected to one end of the relay KA3, and the other end of the relay KA3 is connected to the P2 pin of the runner control chip Ⅰ56; the switch K3 is located on the bus On CAN3, bus CAN3 is connected to one end of switch K4, the other end of switch K4 is connected to one end of relay KA2, and the other end of relay KA2 is connected to pin P1 of runner control chip I56; pin O1 of runner control chip I56 is connected to the dehumidifier wheel Ⅰ32; at the same time, one end of the switch K7 is connected to the bus CAN3, the other end of the switch K7 is connected to one end of the relay KA5, and the other end of the relay KA5 is connected to the P1 pin of the runner control chip II57; one end of the switch K8 is connected to the bus CAN2, and the other end of the switch K8 One end is connected to one end of relay KA6, the other end of relay KA6 is connected to pin P2 of the runner control chip Ⅱ57; one end of switch K9 is connected to bus CAN1, the other end of switch K9 is connected to one end of relay KA7, and the other end of relay KA7 is connected to the runner control Pin P3 of the chip II57; pin O1 of the runner control chip II57 is connected to the dehumidification runner II33.

优选地,还包括安装在加热腔体20的内壁上且与控制单元3连接的红外测温单元,所述的红外测温单元包括红外测温传感头Ⅰ18,红外测温传感头Ⅱ19,光学系统Ⅰ34、红外探测器Ⅰ35、调制盘Ⅰ36、温度传感器Ⅰ37、前置放大电路Ⅰ38、预放大电路Ⅰ39、推动级放大器Ⅰ40、末级放大器Ⅰ41、程调增益调整放大器Ⅰ42、波形调整电路Ⅰ43、A/D转换电路Ⅰ44、光学系统Ⅱ45、红外探测器Ⅱ46、调制盘Ⅱ47、温度传感器Ⅱ48、前置放大电路Ⅱ49、预放大电路Ⅱ50、推动级放大器Ⅱ51、末级放大器Ⅱ52、程调增益调整放大器Ⅱ53、波形调整电路Ⅱ54、A/D转换电路Ⅱ55;其中红外测温传感头Ⅰ18连接光学系统Ⅰ34,光学系统Ⅰ34连接红外探测器Ⅰ35及调制盘Ⅰ36,调制盘Ⅰ36连接温度传感器Ⅰ37,红外探测器Ⅰ35连接前置放大电路Ⅰ38,前置放大电路Ⅰ38连接预放大电路Ⅰ39,预放大电路Ⅰ39连接推动级放大器Ⅰ40,推动级放大器Ⅰ40末级放大器Ⅰ41,末级放大器Ⅰ41连接程调增益调整放大器Ⅰ42,程调增益调整放大器Ⅰ42连接波形调整电路Ⅰ43及A/D转换电路Ⅰ44,温度传感器Ⅰ37、波形调整电路Ⅰ43与A/D转换电路Ⅰ44分别连接微波发生器单元22的控制单元3,同时控制单元3连接程调增益调整放大器Ⅰ42;红外测温传感头Ⅱ19连接光学系统Ⅱ45,光学系统Ⅱ45连接红外探测器Ⅱ46与调制盘Ⅱ47,调制盘Ⅱ47连接温度传感器Ⅱ48,红外探测器Ⅱ46连接前置放大电路Ⅱ49,前置放大电路Ⅱ49连接预放大电路Ⅱ50,预放大电路Ⅱ50连接推动级放大器Ⅱ51,推动级放大器Ⅱ51末级放大器Ⅱ52,末级放大器Ⅱ52连接程调增益调整放大器Ⅱ53,程调增益调整放大器Ⅱ53连接波形调整电路Ⅱ54与A/D转换电路Ⅱ55,温度传感器Ⅱ48、波形调整电路Ⅱ54与A/D转换电路Ⅱ55分别连接微波发生器单元22的控制单元3,同时控制单元3连接程调增益调整放大器Ⅱ53。Preferably, it also includes an infrared temperature measurement unit installed on the inner wall of the heating cavity 20 and connected to the control unit 3. The infrared temperature measurement unit includes an infrared temperature measurement sensor head I18, an infrared temperature measurement sensor head II19, Optical system I34, infrared detector I35, modulation disc I36, temperature sensor I37, preamplifier circuit I38, preamplifier circuit I39, push stage amplifier I40, final stage amplifier I41, programmable gain adjustment amplifier I42, waveform adjustment circuit I43, A/D conversion circuit Ⅰ44, optical system Ⅱ45, infrared detector Ⅱ46, modulation disc Ⅱ47, temperature sensor Ⅱ48, preamplifier circuit Ⅱ49, preamplifier circuit Ⅱ50, driving stage amplifier Ⅱ51, final stage amplifier Ⅱ52, program gain adjustment amplifier Ⅱ53, waveform adjustment circuit Ⅱ54, A/D conversion circuit Ⅱ55; where the infrared temperature sensor head Ⅰ18 is connected to the optical system Ⅰ34, the optical system Ⅰ34 is connected to the infrared detector Ⅰ35 and the modulation disc Ⅰ36, and the modulation disc Ⅰ36 is connected to the temperature sensor Ⅰ37, and the infrared detection The device I35 is connected to the preamplifier circuit I38, the preamplifier circuit I38 is connected to the preamplifier circuit I39, the preamplifier circuit I39 is connected to the push stage amplifier I40, the push stage amplifier I40 is the final stage amplifier I41, and the final stage amplifier I41 is connected to the programmable gain adjustment amplifier I42 , the programmable gain adjustment amplifier I42 is connected to the waveform adjustment circuit I43 and the A/D conversion circuit I44, the temperature sensor I37, the waveform adjustment circuit I43 and the A/D conversion circuit I44 are respectively connected to the control unit 3 of the microwave generator unit 22, and the control unit 3 Connect to the programmable gain adjustment amplifier Ⅰ42; the infrared temperature sensor head Ⅱ19 is connected to the optical system Ⅱ45, the optical system Ⅱ45 is connected to the infrared detector Ⅱ46 and the modulation disc Ⅱ47, the modulation disc Ⅱ47 is connected to the temperature sensor Ⅱ48, and the infrared detector Ⅱ46 is connected to the preamplifier Circuit Ⅱ49, the preamplifier circuit Ⅱ49 is connected to the pre-amplification circuit Ⅱ50, the pre-amplification circuit Ⅱ50 is connected to the push stage amplifier Ⅱ51, the push stage amplifier Ⅱ51 is the final stage amplifier Ⅱ52, the final stage amplifier Ⅱ52 is connected to the program gain adjustment amplifier Ⅱ53, the program gain adjustment amplifier II53 is connected to the waveform adjustment circuit II54 and the A/D conversion circuit II55, the temperature sensor II48, the waveform adjustment circuit II54 and the A/D conversion circuit II55 are respectively connected to the control unit 3 of the microwave generator unit 22, and the control unit 3 is connected to the program gain adjustment Amplifier II 53.

本发明的工作原理是:The working principle of the present invention is:

工作人员通过控制计算机1对装置进行远程监控、控制,信号通过局域网络连接ZigBee通信单元2,ZigBee通信单元2嵌入微波发生器单元22并与控制单元3相连接。当工业粉体物料准备进入加热腔体20时,工作人员由控制计算机1通过ZigBee通信单元2与控制单元3控制入料筒8的入料筒阀门31打开,使物料进入加热腔体20。当准备干燥作业时,工作人员由控制计算机1启动,通过供电单元4将交流市电通过变压、整流、稳压滤波后转变为为磁控管7提供工作所需的直流高压及装置其他设备所需的交流电压。通过功率调节单元5调节磁控管7所需功率大小,为磁控管7提供集中调控完成的电源,磁控管过载保护单元6用以保护磁控管7由于直流高压过高导致设备损坏。此时,旋转底座14开始启动,磁控管7产生的微波能通过天线帽15向螺旋天线16输送热辐射,旋转底座14使螺旋天线16以径向360度高速旋转,绝缘介质外壳17保证螺旋天线16在微波发生器单元22与加热腔体20间不会有能量泄漏。加热腔体20底部的风扇系统21启动,吹起粉体物料,使物料粉尘悬浮于加热腔体20内,保证以最大面积接受热辐射,随着物料分子表面水分不断蒸发,通过抽湿系统Ⅰ9与抽湿系统Ⅱ10定向抽走加热腔体20内的水分,使加热腔体20内的蒸汽压力迁移方向与热量迁移方向一致,从而深度地干燥物料。在抽湿系统Ⅰ9、抽湿系统Ⅱ10、入料筒8分别与加热腔体20的连接处有微波漏能抑制器Ⅰ11、微波漏能抑制器Ⅲ13和微波漏能抑制器Ⅱ12,防止微波在这些端口处外泄。红外测温传感头Ⅰ18与红外测温传感头Ⅱ19实时监测加热腔体20内的温度变化,当温度偏离预定值时,控制单元3可调控旋转底座14、磁控管7等设备调节辐射量或功率大小,使温度变化回到预定轨道。红外测温单元中,光学系统Ⅰ34、光学系统Ⅱ45分别用于将红外测温传感头Ⅰ18与红外测温传感头Ⅱ19检测到的红外线通过折射等光学作用进行增强处理,并将处理后的光线送入红外探测器和调制盘。当干燥作业结束时抽湿系统Ⅰ9、抽湿系统Ⅱ10、磁控管7、旋转底座14、风扇系统21停止工作,等待一定时间后,控制单元3控制可开合式料筒口23打开,并且启动空气压缩机25,将物料从加热腔体20吸入出料筒24并从料筒连接管26进入下一作业环节。The staff monitors and controls the device remotely through the control computer 1, and the signal is connected to the ZigBee communication unit 2 through the local area network. The ZigBee communication unit 2 is embedded in the microwave generator unit 22 and connected to the control unit 3. When the industrial powder material is ready to enter the heating chamber 20, the staff will control the opening of the valve 31 of the feeding cylinder 8 through the control computer 1 through the ZigBee communication unit 2 and the control unit 3, so that the material enters the heating chamber 20. When preparing for the drying operation, the staff is started by the control computer 1, through the power supply unit 4, the AC mains is transformed, rectified, stabilized and filtered to provide the DC high voltage required for the work of the magnetron 7 and install other equipment required AC voltage. The power required by the magnetron 7 is adjusted by the power adjustment unit 5 to provide the magnetron 7 with a centralized and regulated power supply. The magnetron overload protection unit 6 is used to protect the magnetron 7 from being damaged due to high DC high voltage. At this time, the rotating base 14 starts to start, and the microwave energy generated by the magnetron 7 transmits heat radiation to the helical antenna 16 through the antenna cap 15. The rotating base 14 makes the helical antenna 16 rotate at a high speed of 360 degrees in the radial direction, and the insulating medium shell 17 ensures the helical antenna 16. The antenna 16 has no energy leakage between the microwave generator unit 22 and the heating cavity 20 . The fan system 21 at the bottom of the heating chamber 20 starts to blow up the powder material, so that the material dust is suspended in the heating chamber 20 to ensure that the maximum area receives heat radiation. As the moisture on the surface of the material molecules evaporates continuously, it passes through the dehumidification system Ⅰ9 With the dehumidification system II10, the moisture in the heating chamber 20 is directionally drawn away, so that the steam pressure migration direction in the heating chamber 20 is consistent with the heat migration direction, thereby deeply drying the material. There are microwave energy leakage suppressors I11, microwave energy leakage suppressors III13 and microwave energy leakage suppressors II12 at the joints of dehumidifying system I9, dehumidifying system II10, and feeding cylinder 8 and heating chamber 20 respectively, to prevent microwaves from entering these Leakage at the port. The infrared temperature sensor head I18 and the infrared temperature sensor head II19 monitor the temperature change in the heating chamber 20 in real time. When the temperature deviates from the predetermined value, the control unit 3 can control the rotating base 14, the magnetron 7 and other equipment to adjust the radiation. Quantity or power size, so that the temperature changes back to the predetermined track. In the infrared temperature measurement unit, the optical system I34 and the optical system II45 are respectively used to enhance the infrared rays detected by the infrared temperature sensor head I18 and the infrared temperature sensor head II19 through refraction and other optical effects, and the processed Light is sent to an infrared detector and reticle. When the drying operation is over, the dehumidification system I9, dehumidification system II10, magnetron 7, rotating base 14, and fan system 21 stop working. After waiting for a certain period of time, the control unit 3 controls the openable barrel mouth 23 to open, and starts the air The compressor 25 sucks the material from the heating cavity 20 out of the barrel 24 and enters the next working link from the barrel connecting pipe 26 .

本发明的有益效果是:本发明使用的微波加热技术具有优质、高效、节能、环保等显著特征。本发明通过螺旋天线16连接天线帽15,天线帽15连接旋转底座14,旋转底座14连接磁控管7,使磁控管7产生的热辐射通过螺旋天线16均匀地对工业粉体物料进行加热干燥,通过物料吸收微波能量,形成由内向外的温度梯度整体加热模式,利用抽湿系统Ⅰ9、抽湿系统Ⅱ10与风扇系统21形成的功能体系,有效地加快加热速度,使物料受到均匀加热,随着物料分子表面水分不断蒸发,使加热腔体20内的蒸汽压力迁移方向与热量迁移方向一致,从而深度地干燥物料;工业粉体物料通过入料筒8进入加热腔体20,加热干燥后,经过可开合式料筒口23离开加热腔体20,入料筒8的入料筒阀门31、可开合式料筒口23以及微波发生器单元22均由控制单元3通过ZigBee通信单元2与控制计算机1网络连接进行控制,可减少人员现场操作。本发明可有效加快加热速度,且可以实时控制与监控物料进出、微波能的输出功率及加热腔体工作情况,加热腔体20内的物料受热均匀,整个装置结构简单,生产成本低,设计合理,安全有效。The beneficial effects of the present invention are: the microwave heating technology used in the present invention has remarkable features such as high quality, high efficiency, energy saving and environmental protection. The present invention connects the antenna cap 15 through the helical antenna 16, the antenna cap 15 is connected to the rotating base 14, and the rotating base 14 is connected to the magnetron 7, so that the heat radiation generated by the magnetron 7 can evenly heat the industrial powder material through the helical antenna 16 Drying, through the absorption of microwave energy by the material, an overall heating mode with a temperature gradient from the inside to the outside is formed, and the functional system formed by the dehumidification system I9, the dehumidification system II10 and the fan system 21 is used to effectively accelerate the heating speed and make the material evenly heated. As the moisture on the molecular surface of the material evaporates continuously, the steam pressure migration direction in the heating chamber 20 is consistent with the heat migration direction, thereby drying the material deeply; the industrial powder material enters the heating chamber 20 through the feeding cylinder 8, and after heating and drying , leave the heating cavity 20 through the openable and closable barrel mouth 23, and the feeding barrel valve 31, the openable and closable barrel mouth 23 and the microwave generator unit 22 of the feeding barrel 8 are all controlled by the control unit 3 through the ZigBee communication unit 2 and the control computer 1 Network connection for control, which can reduce personnel on-site operations. The present invention can effectively speed up the heating speed, and can control and monitor the material in and out, the output power of microwave energy and the working condition of the heating chamber in real time, the materials in the heating chamber 20 are heated evenly, the whole device has simple structure, low production cost and reasonable design ,Safe and effective.

附图说明Description of drawings

图1为本发明的整体结构示意图;Fig. 1 is the overall structure schematic diagram of the present invention;

图2为本发明的ZigBee通信单元2的电路原理图;Fig. 2 is the schematic circuit diagram of ZigBee communication unit 2 of the present invention;

图3为本发明的入料筒阀门控制电路的电路原理图;Fig. 3 is the circuit schematic diagram of the valve control circuit of the feeding cylinder of the present invention;

图4为本发明的抽湿装置结构原理图;Fig. 4 is a structural principle diagram of the dehumidifying device of the present invention;

图5为本发明的红外测温单元结构连接框图。Fig. 5 is a structural connection block diagram of the infrared temperature measuring unit of the present invention.

图中各标号:1-控制计算机;2-ZigBee通信单元;3-控制单元;4-供电单元;5-功率调节单元;6-磁控管过载保护单元;7-磁控管;8-入料筒;9-抽湿系统Ⅰ;10-抽湿系统Ⅱ;11-微波漏能抑制器Ⅰ;12-微波漏能抑制器Ⅱ;13-微波漏能抑制器Ⅲ;14-旋转底座;15-天线帽;16-螺旋天线;17-绝缘介质外壳;18-红外测温传感头Ⅰ;19-红外测温传感头Ⅱ;20-加热腔体;21-风扇系统;22-微波发生器单元;23-可开合式料筒口;24-出料筒;25-空气压缩机;26-料筒连接管;27-ARM控制器;28-UART转换芯片;29-RS接口;30-ZigBee模块;31-入料筒阀门;32-抽湿转轮Ⅰ;33-抽湿转轮Ⅱ;34-光学系统Ⅰ;35-红外探测器Ⅰ;36-调制盘Ⅰ;37-温度传感器Ⅰ;38-前置放大电路Ⅰ;39-预放大电路Ⅰ;40-推动级放大器Ⅰ;41-末级放大器Ⅰ;42-程调增益调整放大器Ⅰ;43-波形调整电路Ⅰ;44-A/D转换电路Ⅰ;45-光学系统Ⅱ;46-红外探测器Ⅱ;47-调制盘Ⅱ;48-温度传感器Ⅱ;49-前置放大电路Ⅱ;50-预放大电路Ⅱ;51-推动级放大器Ⅱ;52-末级放大器Ⅱ;53-程调增益调整放大器Ⅱ;54-波形调整电路Ⅱ;55-A/D转换电路Ⅱ;56-转轮控制芯片Ⅰ;57-转轮控制芯片Ⅱ。The labels in the figure: 1-control computer; 2-ZigBee communication unit; 3-control unit; 4-power supply unit; 5-power adjustment unit; 6-magnetron overload protection unit; 7-magnetron; 8-input Barrel; 9-dehumidification system Ⅰ; 10-dehumidification system Ⅱ; 11-microwave leakage energy suppressor Ⅰ; 12-microwave leakage energy suppressor Ⅱ; 13-microwave leakage energy suppressor Ⅲ; 14-rotating base; 15 -antenna cap; 16-helical antenna; 17-insulating dielectric shell; 18-infrared temperature sensor head Ⅰ; 19-infrared temperature sensor head Ⅱ; 20-heating cavity; 21-fan system; 22-microwave generation 23-openable barrel mouth; 24-outlet barrel; 25-air compressor; 26-barrel connecting pipe; 27-ARM controller; 28-UART conversion chip; 29-RS interface; 30-ZigBee Module; 31-inlet cylinder valve; 32-dehumidification rotor Ⅰ; 33-dehumidification rotor Ⅱ; 34-optical system Ⅰ; 35-infrared detector Ⅰ; 36-modulating disc Ⅰ; 37-temperature sensor Ⅰ; 38-pre-amplification circuit Ⅰ; 39-pre-amplification circuit Ⅰ; 40-push stage amplifier Ⅰ; 41-final amplifier Ⅰ; 42-program gain adjustment amplifier Ⅰ; 43-waveform adjustment circuit Ⅰ; 44-A/D Conversion circuit Ⅰ; 45-optical system Ⅱ; 46-infrared detector Ⅱ; 47-modulator Ⅱ; 48-temperature sensor Ⅱ; 49-preamplification circuit Ⅱ; 50-preamplification circuit Ⅱ; ; 52-final amplifier II; 53-program gain adjustment amplifier II; 54-waveform adjustment circuit II; 55-A/D conversion circuit II; 56-wheel control chip I; 57-wheel control chip II.

具体实施方式Detailed ways

下面结合附图和具体实施方式对本发明进行进一步的说明。The present invention will be further described below in conjunction with the accompanying drawings and specific embodiments.

实施例1:如图1-5所示,一种工业粉体物料微波加热干燥实时控制装置,包括控制计算机1、ZigBee通信单元2、微波发生器单元22、入料筒8、抽湿装置、旋转底座14、天线帽15、螺旋天线16、绝缘介质外壳17、加热腔体20、风扇系统21、可开合式料筒口23、出料筒24、空气压缩机25、料筒连接管26、入料筒阀门31;Embodiment 1: As shown in Figures 1-5, a real-time control device for microwave heating and drying of industrial powder materials includes a control computer 1, a ZigBee communication unit 2, a microwave generator unit 22, a feeding cylinder 8, a dehumidification device, Rotating base 14, antenna cap 15, helical antenna 16, insulating medium shell 17, heating cavity 20, fan system 21, openable barrel opening 23, discharging barrel 24, air compressor 25, barrel connecting pipe 26, inlet Barrel valve 31;

所述的控制计算机1通过网络连接ZigBee通信单元2,ZigBee通信单元2嵌入微波发生器单元22,入料筒8、抽湿装置的上端分别连接微波发生器单元22,下端分别连接加热腔体20,入料筒阀门31位于入料筒8内部,入料筒阀门31通过入料筒阀门控制电路与微波发生器单元22连接,旋转底座14连接天线帽15,天线帽15连接螺旋天线16,绝缘介质外壳17一端连接微波发生器单元22,另一端连接加热腔体20,绝缘介质外壳17包裹着螺旋天线16,加热腔体20的底部有风扇系统21、可开合式料筒口23,可开合式料筒口23位于风扇系统21的内圈,可开合式料筒口23连接出料筒24,出料筒24内有空气压缩机25,出料筒24连接料筒连接管26;The control computer 1 is connected to the ZigBee communication unit 2 through the network, and the ZigBee communication unit 2 is embedded in the microwave generator unit 22. The upper ends of the feeding cylinder 8 and the dehumidification device are respectively connected to the microwave generator unit 22, and the lower ends are respectively connected to the heating chamber 20. , the feed cylinder valve 31 is located inside the feed cylinder 8, the feed cylinder valve 31 is connected to the microwave generator unit 22 through the feed cylinder valve control circuit, the rotating base 14 is connected to the antenna cap 15, and the antenna cap 15 is connected to the helical antenna 16, insulated One end of the dielectric housing 17 is connected to the microwave generator unit 22, and the other end is connected to the heating chamber 20. The insulating dielectric housing 17 wraps the helical antenna 16. The bottom of the heating chamber 20 has a fan system 21 and an openable barrel mouth 23, which can be opened and closed. The barrel opening 23 is located on the inner ring of the fan system 21, the openable barrel opening 23 is connected to the discharge barrel 24, and there is an air compressor 25 inside the discharge barrel 24, and the discharge barrel 24 is connected to the barrel connecting pipe 26;

所述的微波发生器单元22包括控制单元3、供电单元4、功率调节单元5、磁控管过载保护单元6、磁控管7,控制单元3连接供电单元4、功率调节单元5,功率调节单元5连接磁控管过载保护单元6,磁控管过载保护单元6连接磁控管7,磁控管过载保护单元6、磁控管7均与供电单元4相连;控制单元3还与入料筒8的入料筒阀门31、旋转底座14、抽湿装置、风扇系统21、可开合式料筒口23、空气压缩机25相连。Described microwave generator unit 22 comprises control unit 3, power supply unit 4, power adjustment unit 5, magnetron overload protection unit 6, magnetron 7, control unit 3 is connected power supply unit 4, power adjustment unit 5, power adjustment The unit 5 is connected to the magnetron overload protection unit 6, the magnetron overload protection unit 6 is connected to the magnetron 7, and the magnetron overload protection unit 6 and the magnetron 7 are all connected to the power supply unit 4; the control unit 3 is also connected to the feeding The feeding cylinder valve 31 of the cylinder 8, the rotating base 14, the dehumidifying device, the fan system 21, the opening and closing type cylinder mouth 23, and the air compressor 25 are connected.

进一步地,所述的入料筒8下端连接微波漏能抑制器Ⅱ12,微波漏能抑制器Ⅱ12连接加热腔体20,通过连接微波漏能抑制器Ⅱ12可以防止微波在入料筒8下端与加热腔体20的连接端口处外泄。Further, the lower end of the feeding barrel 8 is connected to the microwave leakage energy suppressor II12, and the microwave energy leakage suppressor II12 is connected to the heating chamber 20, and the microwave leakage energy suppressor II12 can be connected to prevent the microwave from entering the lower end of the feeding barrel 8. The connection port of the cavity 20 is leaked.

进一步地,如图2所示,所述ZigBee通信单元2包括ARM控制器27、UART转换芯片28、RS接口29、ZigBee模块30、电容C1、电容C2、电容C3、电阻R1、电阻R2、电阻R3、电阻R4、电阻R5、晶体振荡器X1;UART转换芯片28采用MAX232A ,ARM控制器27的PIO2_0脚连接UART转换芯片28的

Figure 241613DEST_PATH_IMAGE001
脚,其中ARM控制器27的PIO2_1脚连接UART转换芯片28的SI脚, ARM控制器27的PIO2_3脚连接UART转换芯片28的SCLK脚, ARM控制器27的PIO2_2脚连接UART转换芯片28的SO脚及电阻R1的一端,电阻R1的另一端接地;UART转换芯片28的/>
Figure 774226DEST_PATH_IMAGE002
脚接地,UART转换芯片28的VSS脚接地且与电容C1的一端连接,UART转换芯片28的VDD脚连接Vcc与电容C1的另一端;UART转换芯片28的XTAL1脚连接电容C2的一端与晶体振荡器X1的一端,电容C2的另一端接地,晶体振荡器X1的另一端连接UART转换芯片28的XTAL2脚及电容C3的一端,电容C3的另一端接地;UART转换芯片28的T1IN脚连接RS接口29的TXD脚,UART转换芯片28的R1OUT脚连接RS接口29的RXD脚;UART转换芯片28的T2IN脚连接电阻R3的一端,电阻R3的另一端连接电阻R2的一端及ZigBee模块30的TXD脚,电阻R2的另一端接地,UART转换芯片28的R2OUT脚连接电阻R4的一端,电阻R4另一端连接电阻R5的一端及ZigBee模块30的RXD脚,电阻R5的另一端接地。ARM控制器27根据使用的ARM芯片不同,有很多种配置,但是结构都一样,因此本发明并未给出具体型号。Further, as shown in Figure 2, the ZigBee communication unit 2 includes an ARM controller 27, a UART conversion chip 28, an RS interface 29, a ZigBee module 30, a capacitor C1, a capacitor C2, a capacitor C3, a resistor R1, a resistor R2, a resistor R3, resistance R4, resistance R5, crystal oscillator X1; UART conversion chip 28 adopts MAX232A, and PIO2_0 pin of ARM controller 27 is connected to UART conversion chip 28
Figure 241613DEST_PATH_IMAGE001
pin, wherein the PIO2_1 pin of the ARM controller 27 is connected to the SI pin of the UART conversion chip 28, the PIO2_3 pin of the ARM controller 27 is connected to the SCLK pin of the UART conversion chip 28, and the PIO2_2 pin of the ARM controller 27 is connected to the SO pin of the UART conversion chip 28 and one end of the resistor R1, the other end of the resistor R1 is grounded; the UART conversion chip 28
Figure 774226DEST_PATH_IMAGE002
The pin is grounded, the VSS pin of the UART conversion chip 28 is grounded and connected to one end of the capacitor C1, the VDD pin of the UART conversion chip 28 is connected to Vcc and the other end of the capacitor C1; the XTAL1 pin of the UART conversion chip 28 is connected to one end of the capacitor C2 and the crystal oscillator One end of the oscillator X1, the other end of the capacitor C2 is grounded, the other end of the crystal oscillator X1 is connected to the XTAL2 pin of the UART conversion chip 28 and one end of the capacitor C3, and the other end of the capacitor C3 is grounded; the T1IN pin of the UART conversion chip 28 is connected to the RS interface The TXD pin of 29, the R1OUT pin of the UART conversion chip 28 is connected to the RXD pin of the RS interface 29; the T2IN pin of the UART conversion chip 28 is connected to one end of the resistor R3, and the other end of the resistor R3 is connected to one end of the resistor R2 and the TXD pin of the ZigBee module 30 , the other end of the resistor R2 is grounded, the R2OUT pin of the UART conversion chip 28 is connected to one end of the resistor R4, the other end of the resistor R4 is connected to one end of the resistor R5 and the RXD pin of the ZigBee module 30, and the other end of the resistor R5 is grounded. The ARM controller 27 has many configurations according to the different ARM chips used, but the structure is the same, so the present invention does not provide a specific model.

进一步地,如图3所示,所述的入料筒阀门控制电路包括继电器KA1、二极管D1、NPN型三极管Q1、电阻R6、电阻R7、电阻R8、变阻器R9;入料筒阀门31的上端(即图3中的a端)连接电阻R6的一端中的及变阻器R9的下端(即图3中的②端),入料筒阀门31的下端(即图3中的b端)接地,电阻R6的另一端接地;继电器KA1的一端连接二极管D1的阴极与变阻器R9,在变阻器R9上,继电器KA1可连接变阻器R9的上端至下端(即图3中的①端至②端)间的任意部位;继电器KA1的另一端连接二极管D1的阳极及NPN型三极管Q1的极电极,NPN型三极管Q1的发射极接地,NPN型三极管Q1的基极连接电阻R7的一端及电阻R8的一端,电阻R7的另一端连接控制单元3,电阻R8的另一端接地。Further, as shown in FIG. 3 , the valve control circuit of the feeding cylinder includes a relay KA1, a diode D1, an NPN transistor Q1, a resistor R6, a resistor R7, a resistor R8, and a rheostat R9; the upper end of the feeding cylinder valve 31 ( That is, end a in Fig. 3) is connected to one end of resistor R6 and the lower end of rheostat R9 (i.e. end ② in Fig. 3), the lower end of valve 31 into the barrel (i.e. end b in Fig. 3) is grounded, and resistor R6 The other end of the relay KA1 is connected to the cathode of the diode D1 and the varistor R9. On the varistor R9, the relay KA1 can be connected to any part between the upper end and the lower end of the varistor R9 (that is, the ① end to the ② end in Figure 3); The other end of the relay KA1 is connected to the anode of the diode D1 and the pole electrode of the NPN transistor Q1, the emitter of the NPN transistor Q1 is grounded, the base of the NPN transistor Q1 is connected to one end of the resistor R7 and one end of the resistor R8, and the other end of the resistor R7 One end is connected to the control unit 3, and the other end of the resistor R8 is grounded.

进一步地,如图4所示,所述抽湿装置包括抽湿系统Ⅰ9、抽湿系统Ⅱ10、微波漏能抑制器Ⅰ11、微波漏能抑制器Ⅲ13、抽湿转轮Ⅰ32、抽湿转轮Ⅱ33、转轮控制芯片Ⅰ56、转轮控制芯片Ⅱ57、总线CAN1、总线CAN2、总线CAN3、开关K1、开关K2、开关K3、开关K4、开关K5、开关K6、开关K7、开关K8、开关K9、继电器KA2、继电器KA3、继电器KA4、继电器KA5、继电器KA6、继电器KA7;其中转轮控制芯片Ⅰ56、转轮控制芯片Ⅱ57均采用8XC196MC芯片,抽湿系统Ⅰ9、抽湿系统Ⅱ10分别与控制单元3连接,抽湿系统Ⅰ9、抽湿系统Ⅱ10分别为抽湿管,抽湿转轮Ⅰ32位于抽湿系统Ⅰ9内部,抽湿系统Ⅰ9底部连接微波漏能抑制器Ⅰ11,抽湿转轮Ⅱ33位于抽湿系统Ⅱ10内部,抽湿系统Ⅱ10底部连接微波漏能抑制器Ⅲ13,微波漏能抑制器Ⅰ11、微波漏能抑制器Ⅲ13分别连接加热腔体20;开关K1位于总线CAN1上,总线CAN1连接开关K6的一端,开关K6的另一端连接继电器KA4的一端,继电器KA4的另一端连接转轮控制芯片Ⅰ56的P3脚;开关K2位于总线CAN2上,总线CAN2连接开关K5的一端,开关K5的另一端连接继电器KA3的一端,继电器KA3的另一端连接转轮控制芯片Ⅰ56的P2脚;开关K3位于总线CAN3上,总线CAN3连接开关K4的一端,开关K4的另一端连接继电器KA2的一端,继电器KA2的另一端连接转轮控制芯片Ⅰ56的P1脚;转轮控制芯片Ⅰ56的O1引脚代表的是输出信号引脚,转轮控制芯片Ⅰ56的O1脚连接抽湿转轮Ⅰ32,;同时,开关K7的一端连接总线CAN3,开关K7的另一端连接继电器KA5的一端,继电器KA5的另一端连接转轮控制芯片Ⅱ57的P1脚;开关K8的一端连接总线CAN2,开关K8的另一端连接继电器KA6的一端,继电器KA6的另一端连接转轮控制芯片Ⅱ57的P2脚;开关K9的一端连接总线CAN1,开关K9的另一端连接继电器KA7的一端,继电器KA7的另一端连接转轮控制芯片Ⅱ57的P3脚;转轮控制芯片Ⅱ57的O1引脚代表的是输出信号引脚,转轮控制芯片Ⅱ57的O1脚连接抽湿转轮Ⅱ33。转轮控制芯片Ⅰ56、转轮控制芯片Ⅱ57的作用是通过总线CAN1-CAN3控制抽湿转轮Ⅰ32抽湿转轮Ⅱ33旋转。Further, as shown in Figure 4, the dehumidification device includes dehumidification system I9, dehumidification system II10, microwave energy leakage suppressor I11, microwave energy leakage suppressor III13, dehumidification runner I32, dehumidification runner II33 , Wheel control chip Ⅰ56, wheel control chip Ⅱ57, bus CAN1, bus CAN2, bus CAN3, switch K1, switch K2, switch K3, switch K4, switch K5, switch K6, switch K7, switch K8, switch K9, relay KA2, Relay KA3, Relay KA4, Relay KA5, Relay KA6, Relay KA7; Among them, the runner control chip Ⅰ56 and the runner control chip Ⅱ57 adopt 8XC196MC chip, and the dehumidification system Ⅰ9 and dehumidification system Ⅱ10 are respectively connected with the control unit 3, Dehumidification system I9 and dehumidification system II10 are respectively dehumidification pipes, dehumidification rotor I32 is located inside dehumidification system I9, the bottom of dehumidification system I9 is connected to microwave energy leakage suppressor I11, and dehumidification rotor II33 is located in dehumidification system II10 Inside, the bottom of the dehumidification system II10 is connected to the microwave energy leakage suppressor III13, the microwave energy leakage suppressor I11, and the microwave energy leakage suppressor III13 are respectively connected to the heating chamber 20; the switch K1 is located on the bus CAN1, and the bus CAN1 is connected to one end of the switch K6. The other end of the switch K6 is connected to one end of the relay KA4, and the other end of the relay KA4 is connected to the P3 pin of the wheel control chip Ⅰ56; the switch K2 is located on the bus CAN2, and the bus CAN2 is connected to one end of the switch K5, and the other end of the switch K5 is connected to the relay KA3. One end, the other end of the relay KA3 is connected to the P2 pin of the runner control chip Ⅰ56; the switch K3 is located on the bus CAN3, the bus CAN3 is connected to one end of the switch K4, the other end of the switch K4 is connected to one end of the relay KA2, and the other end of the relay KA2 is connected to the turntable The pin P1 of the wheel control chip I56; the O1 pin of the wheel control chip I56 represents the output signal pin, and the O1 pin of the wheel control chip I56 is connected to the dehumidifier wheel I32; at the same time, one end of the switch K7 is connected to the bus CAN3 , the other end of the switch K7 is connected to one end of the relay KA5, the other end of the relay KA5 is connected to the P1 pin of the runner control chip Ⅱ57; one end of the switch K8 is connected to the bus CAN2, the other end of the switch K8 is connected to one end of the relay KA6, and the other end of the relay KA6 One end is connected to the pin P2 of the runner control chip Ⅱ57; one end of the switch K9 is connected to the bus CAN1, the other end of the switch K9 is connected to one end of the relay KA7, and the other end of the relay KA7 is connected to the P3 pin of the runner control chip Ⅱ57; the runner control chip Ⅱ57 The O1 pin of the pin represents the output signal pin, and the O1 pin of the runner control chip II57 is connected to the dehumidifier runner II33. The function of the runner control chip I56 and the runner control chip II57 is to control the rotation of the dehumidifier runner I32 and the dehumidifier runner II33 through the bus CAN1-CAN3.

进一步地,如图1、图5所示,还包括安装在加热腔体20的内壁上且与控制单元3连接的红外测温单元,所述的红外测温单元包括红外测温传感头Ⅰ18,红外测温传感头Ⅱ19,光学系统Ⅰ34、红外探测器Ⅰ35、调制盘Ⅰ36、温度传感器Ⅰ37、前置放大电路Ⅰ38、预放大电路Ⅰ39、推动级放大器Ⅰ40、末级放大器Ⅰ41、程调增益调整放大器Ⅰ42、波形调整电路Ⅰ43、A/D转换电路Ⅰ44、光学系统Ⅱ45、红外探测器Ⅱ46、调制盘Ⅱ47、温度传感器Ⅱ48、前置放大电路Ⅱ49、预放大电路Ⅱ50、推动级放大器Ⅱ51、末级放大器Ⅱ52、程调增益调整放大器Ⅱ53、波形调整电路Ⅱ54、A/D转换电路Ⅱ55;其中红外测温传感头Ⅰ18连接光学系统Ⅰ34,光学系统Ⅰ34连接红外探测器Ⅰ35及调制盘Ⅰ36,调制盘Ⅰ36连接温度传感器Ⅰ37,红外探测器Ⅰ35连接前置放大电路Ⅰ38,前置放大电路Ⅰ38连接预放大电路Ⅰ39,预放大电路Ⅰ39连接推动级放大器Ⅰ40,推动级放大器Ⅰ40末级放大器Ⅰ41,末级放大器Ⅰ41连接程调增益调整放大器Ⅰ42,程调增益调整放大器Ⅰ42连接波形调整电路Ⅰ43及A/D转换电路Ⅰ44,温度传感器Ⅰ37、波形调整电路Ⅰ43与A/D转换电路Ⅰ44分别连接微波发生器单元22的控制单元3,同时控制单元3连接程调增益调整放大器Ⅰ42;红外测温传感头Ⅱ19连接光学系统Ⅱ45,光学系统Ⅱ45连接红外探测器Ⅱ46与调制盘Ⅱ47,调制盘Ⅱ47连接温度传感器Ⅱ48,红外探测器Ⅱ46连接前置放大电路Ⅱ49,前置放大电路Ⅱ49连接预放大电路Ⅱ50,预放大电路Ⅱ50连接推动级放大器Ⅱ51,推动级放大器Ⅱ51末级放大器Ⅱ52,末级放大器Ⅱ52连接程调增益调整放大器Ⅱ53,程调增益调整放大器Ⅱ53连接波形调整电路Ⅱ54与A/D转换电路Ⅱ55,温度传感器Ⅱ48、波形调整电路Ⅱ54与A/D转换电路Ⅱ55分别连接微波发生器单元22的控制单元3,同时控制单元3连接程调增益调整放大器Ⅱ53。Further, as shown in Figure 1 and Figure 5, it also includes an infrared temperature measurement unit installed on the inner wall of the heating cavity 20 and connected to the control unit 3, the infrared temperature measurement unit includes an infrared temperature measurement sensor head I18 , infrared temperature sensor head II19, optical system I34, infrared detector I35, modulation disc I36, temperature sensor I37, preamplifier circuit I38, preamplifier circuit I39, booster amplifier I40, final amplifier I41, programmable gain Adjustment amplifier Ⅰ42, waveform adjustment circuit Ⅰ43, A/D conversion circuit Ⅰ44, optical system Ⅱ45, infrared detector Ⅱ46, modulation disc Ⅱ47, temperature sensor Ⅱ48, pre-amplification circuit Ⅱ49, pre-amplification circuit Ⅱ50, driving stage amplifier Ⅱ51, final Stage amplifier Ⅱ52, program gain adjustment amplifier Ⅱ53, waveform adjustment circuit Ⅱ54, A/D conversion circuit Ⅱ55; the infrared temperature sensor head Ⅰ18 is connected to the optical system Ⅰ34, and the optical system Ⅰ34 is connected to the infrared detector Ⅰ35 and the modulation disc Ⅰ36, and the modulation Disk I36 is connected to temperature sensor I37, infrared detector I35 is connected to preamplifier circuit I38, preamplifier circuit I38 is connected to preamplifier circuit I39, preamplifier circuit I39 is connected to push stage amplifier I40, push stage amplifier I40 final stage amplifier I41, final stage Amplifier I41 is connected to programmable gain adjustment amplifier I42, programmable gain adjustment amplifier I42 is connected to waveform adjustment circuit I43 and A/D conversion circuit I44, temperature sensor I37, waveform adjustment circuit I43 and A/D conversion circuit I44 are respectively connected to microwave generator unit 22 of the control unit 3, and the control unit 3 is connected to the programmable gain adjustment amplifier I42; the infrared temperature sensor head II19 is connected to the optical system II45, and the optical system II45 is connected to the infrared detector II46 and the modulation disc II47, and the modulation disc II47 is connected to the temperature sensor II48 , the infrared detector Ⅱ46 is connected to the preamplifier circuit Ⅱ49, the preamplifier circuit Ⅱ49 is connected to the preamplifier circuit Ⅱ50, the preamplifier circuit Ⅱ50 is connected to the push stage amplifier Ⅱ51, the push stage amplifier Ⅱ51 is connected to the final stage amplifier Ⅱ52, and the final stage amplifier Ⅱ52 is connected to the programmable gain The adjustment amplifier II53, the programmable gain adjustment amplifier II53 are connected to the waveform adjustment circuit II54 and the A/D conversion circuit II55, the temperature sensor II48, the waveform adjustment circuit II54 and the A/D conversion circuit II55 are respectively connected to the control unit 3 of the microwave generator unit 22, At the same time, the control unit 3 is connected to the programmable gain adjustment amplifier II53.

通过红外测温单元,可以实时监测加热腔体20内的温度变化,当温度偏离预定值时,控制单元3可以调节其他设备,进而使加热腔体20内的温度值保持在预定值附近,使得加热干燥的效果达到最佳。Through the infrared temperature measurement unit, the temperature change in the heating cavity 20 can be monitored in real time. When the temperature deviates from the predetermined value, the control unit 3 can adjust other equipment, and then keep the temperature value in the heating cavity 20 near the predetermined value, so that The effect of heating and drying is the best.

上面结合附图对本发明的具体实施例作了详细说明,但是本发明并不限于上述实施例,在本领域普通技术人员所具备的知识范围内,还可以在不脱离本发明宗旨的前提下作出各种变化。The specific embodiments of the present invention have been described in detail above in conjunction with the accompanying drawings, but the present invention is not limited to the above-mentioned embodiments, and can also be made without departing from the gist of the present invention within the scope of knowledge possessed by those of ordinary skill in the art. Variations.

Claims (1)

1.一种工业粉体物料微波加热干燥实时控制装置,其特征在于:包括控制计算机(1)、ZigBee通信单元(2)、微波发生器单元(22)、入料筒(8)、抽湿装置、旋转底座(14)、天线帽(15)、螺旋天线(16)、绝缘介质外壳(17)、加热腔体(20)、风扇系统(21)、可开合式料筒口(23)、出料筒(24)、空气压缩机(25)、料筒连接管(26)、入料筒阀门(31);1. A real-time control device for microwave heating and drying of industrial powder materials, characterized in that it includes a control computer (1), a ZigBee communication unit (2), a microwave generator unit (22), a feeding cylinder (8), a dehumidifier device, rotating base (14), antenna cap (15), helical antenna (16), insulating medium shell (17), heating cavity (20), fan system (21), openable barrel mouth (23), outlet Material cylinder (24), air compressor (25), material cylinder connecting pipe (26), material inlet valve (31); 所述的控制计算机(1)通过网络连接ZigBee通信单元(2),ZigBee通信单元(2)嵌入微波发生器单元(22),入料筒(8)、抽湿装置的上端分别连接微波发生器单元(22),下端分别连接加热腔体(20),入料筒阀门(31)位于入料筒(8)内部,入料筒阀门(31)通过入料筒阀门控制电路与微波发生器单元(22)连接,旋转底座(14)连接天线帽(15),天线帽(15)连接螺旋天线(16),绝缘介质外壳(17)一端连接微波发生器单元(22),另一端连接加热腔体(20),绝缘介质外壳(17)包裹着螺旋天线(16),加热腔体(20)的底部有风扇系统(21)、可开合式料筒口(23),可开合式料筒口(23)位于风扇系统(21)的内圈,可开合式料筒口(23)连接出料筒(24),出料筒(24)内有空气压缩机(25),出料筒(24)连接料筒连接管(26);The control computer (1) is connected to the ZigBee communication unit (2) through the network, the ZigBee communication unit (2) is embedded in the microwave generator unit (22), and the upper end of the feeding cylinder (8) and the dehumidification device are respectively connected to the microwave generator The unit (22), the lower end is respectively connected to the heating chamber (20), the feeding cylinder valve (31) is located inside the feeding cylinder (8), and the feeding cylinder valve (31) is connected to the microwave generator unit through the feeding cylinder valve control circuit (22) connection, the rotating base (14) is connected to the antenna cap (15), the antenna cap (15) is connected to the helical antenna (16), one end of the insulating dielectric shell (17) is connected to the microwave generator unit (22), and the other end is connected to the heating chamber The body (20), the insulating medium casing (17) wraps the helical antenna (16), the bottom of the heating chamber (20) has a fan system (21), an openable barrel mouth (23), and an openable barrel mouth (23 ) is located in the inner ring of the fan system (21), the openable barrel mouth (23) is connected to the discharge barrel (24), and there is an air compressor (25) in the discharge barrel (24), and the discharge barrel (24) is connected to the material Barrel connecting pipe (26); 所述的微波发生器单元(22)包括控制单元(3)、供电单元(4)、功率调节单元(5)、磁控管过载保护单元(6)、磁控管(7),控制单元(3)连接供电单元(4)、功率调节单元(5),功率调节单元(5)连接磁控管过载保护单元(6),磁控管过载保护单元(6)连接磁控管(7),磁控管过载保护单元(6)、磁控管(7)均与供电单元(4)相连;控制单元(3)还与入料筒(8)的入料筒阀门(31)、旋转底座(14)、抽湿装置、风扇系统(21)、可开合式料筒口(23)、空气压缩机(25)相连;The microwave generator unit (22) includes a control unit (3), a power supply unit (4), a power adjustment unit (5), a magnetron overload protection unit (6), a magnetron (7), a control unit ( 3) Connect the power supply unit (4), the power adjustment unit (5), the power adjustment unit (5) is connected to the magnetron overload protection unit (6), the magnetron overload protection unit (6) is connected to the magnetron (7), The magnetron overload protection unit (6) and the magnetron (7) are all connected to the power supply unit (4); the control unit (3) is also connected to the feed cylinder valve (31) of the feed cylinder (8), the rotating base ( 14), the dehumidification device, the fan system (21), the openable barrel mouth (23), and the air compressor (25) are connected; 所述的入料筒(8)下端连接微波漏能抑制器Ⅱ(12),微波漏能抑制器Ⅱ(12)连接加热腔体(20);The lower end of the feeding barrel (8) is connected to the microwave leakage energy suppressor II (12), and the microwave leakage energy suppressor II (12) is connected to the heating cavity (20); 所述ZigBee通信单元(2)包括ARM控制器(27)、UART转换芯片(28)、RS接口(29)、ZigBee模块(30)、电容C1、电容C2、电容C3、电阻R1、电阻R2、电阻R3、电阻R4、电阻R5、晶体振荡器X1;UART转换芯片(28)采用MAX232A ,ARM控制器(27)的PIO2_0脚连接UART转换芯片(28)的脚,其中ARM控制器(27)的PIO2_1脚连接UART转换芯片(28)的SI脚, ARM控制器(27)的PIO2_3脚连接UART转换芯片(28)的SCLK脚, ARM控制器(27)的PIO2_2脚连接UART转换芯片(28)的SO脚及电阻R1的一端,电阻R1的另一端接地;UART转换芯片(28)的脚接地,UART转换芯片(28)的VSS脚接地且与电容C1的一端连接,UART转换芯片(28)的VDD脚连接Vcc与电容C1的另一端;UART转换芯片(28)的XTAL1脚连接电容C2的一端与晶体振荡器X1的一端,电容C2的另一端接地,晶体振荡器X1的另一端连接UART转换芯片(28)的XTAL2脚及电容C3的一端,电容C3的另一端接地;UART转换芯片(28)的T1IN脚连接RS接口(29)的TXD脚,UART转换芯片(28)的R1OUT脚连接RS接口(29)的RXD脚;UART转换芯片(28)的T2IN脚连接电阻R3的一端,电阻R3的另一端连接电阻R2的一端及ZigBee模块(30)的TXD脚,电阻R2的另一端接地,UART转换芯片(28)的R2OUT脚连接电阻R4的一端,电阻R4另一端连接电阻R5的一端及ZigBee模块(30)的RXD脚,电阻R5的另一端接地;The ZigBee communication unit (2) includes an ARM controller (27), a UART conversion chip (28), an RS interface (29), a ZigBee module (30), a capacitor C1, a capacitor C2, a capacitor C3, a resistor R1, a resistor R2, Resistor R3, resistor R4, resistor R5, crystal oscillator X1; the UART conversion chip (28) adopts MAX232A, and the PIO2_0 pin of the ARM controller (27) is connected to the pin of the UART conversion chip (28), wherein the ARM controller (27) PIO2_1 pin is connected to SI pin of UART conversion chip (28), PIO2_3 pin of ARM controller (27) is connected to SCLK pin of UART conversion chip (28), PIO2_2 pin of ARM controller (27) is connected to UART conversion chip (28) SO pin and one end of resistor R1, the other end of resistor R1 is grounded; the pin of UART conversion chip (28) is grounded, the VSS pin of UART conversion chip (28) is grounded and connected with one end of capacitor C1, the UART conversion chip (28) The VDD pin is connected to Vcc and the other end of the capacitor C1; the XTAL1 pin of the UART conversion chip (28) is connected to one end of the capacitor C2 and one end of the crystal oscillator X1, the other end of the capacitor C2 is grounded, and the other end of the crystal oscillator X1 is connected to the UART converter The XTAL2 pin of the chip (28) and one end of the capacitor C3, the other end of the capacitor C3 is grounded; the T1IN pin of the UART conversion chip (28) is connected to the TXD pin of the RS interface (29), and the R1OUT pin of the UART conversion chip (28) is connected to the RS The RXD pin of the interface (29); the T2IN pin of the UART conversion chip (28) is connected to one end of the resistor R3, the other end of the resistor R3 is connected to one end of the resistor R2 and the TXD pin of the ZigBee module (30), and the other end of the resistor R2 is grounded. The R2OUT pin of the UART conversion chip (28) is connected to one end of the resistor R4, the other end of the resistor R4 is connected to one end of the resistor R5 and the RXD pin of the ZigBee module (30), and the other end of the resistor R5 is grounded; 所述的入料筒阀门控制电路包括继电器KA1、二极管D1、NPN型三极管Q1、电阻R6、电阻R7、电阻R8、变阻器R9;入料筒阀门(31)的上端连接电阻R6的一端及变阻器R9的下端,入料筒阀门(31)的下端接地,电阻R6的另一端接地;继电器KA1的一端连接二极管D1的阴极与变阻器R9,在变阻器R9上,继电器KA1可连接变阻器R9的上端至下端间的任意部位;继电器KA1的另一端连接二极管D1的阳极及NPN型三极管Q1的极电极,NPN型三极管Q1的发射极接地,NPN型三极管Q1的基极连接电阻R7的一端及电阻R8的一端,电阻R7的另一端连接控制单元(3),电阻R8的另一端接地;The valve control circuit of the feeding barrel includes a relay KA1, a diode D1, an NPN transistor Q1, a resistor R6, a resistor R7, a resistor R8, and a rheostat R9; the upper end of the feeding barrel valve (31) is connected to one end of the resistor R6 and the rheostat R9 The lower end of the inlet barrel valve (31) is grounded, and the other end of the resistor R6 is grounded; one end of the relay KA1 is connected to the cathode of the diode D1 and the rheostat R9, and on the rheostat R9, the relay KA1 can be connected between the upper end and the lower end of the rheostat R9 Any part of the relay KA1; the other end of the relay KA1 is connected to the anode of the diode D1 and the pole electrode of the NPN transistor Q1, the emitter of the NPN transistor Q1 is grounded, the base of the NPN transistor Q1 is connected to one end of the resistor R7 and one end of the resistor R8, The other end of the resistor R7 is connected to the control unit (3), and the other end of the resistor R8 is grounded; 所述抽湿装置包括抽湿系统Ⅰ(9)、抽湿系统Ⅱ(10)、微波漏能抑制器Ⅰ(11)、微波漏能抑制器Ⅲ(13)、抽湿转轮Ⅰ(32)、抽湿转轮Ⅱ(33)、转轮控制芯片Ⅰ(56)、转轮控制芯片Ⅱ(57)、总线CAN1、总线CAN2、总线CAN3、开关K1、开关K2、开关K3、开关K4、开关K5、开关K6、开关K7、开关K8、开关K9、继电器KA2、继电器KA3、继电器KA4、继电器KA5、继电器KA6、继电器KA7;其中转轮控制芯片Ⅰ(56)、转轮控制芯片Ⅱ(57)均采用8XC196MC芯片,抽湿系统Ⅰ(9)、抽湿系统Ⅱ(10)分别与控制单元(3)连接,抽湿转轮Ⅰ(32)位于抽湿系统Ⅰ(9)内部,抽湿系统Ⅰ(9)底部连接微波漏能抑制器Ⅰ(11),抽湿转轮Ⅱ(33)位于抽湿系统Ⅱ(10)内部,抽湿系统Ⅱ(10)底部连接微波漏能抑制器Ⅲ(13),微波漏能抑制器Ⅰ(11)、微波漏能抑制器Ⅲ(13)分别连接加热腔体(20);开关K1位于总线CAN1上,总线CAN1连接开关K6的一端,开关K6的另一端连接继电器KA4的一端,继电器KA4的另一端连接转轮控制芯片Ⅰ(56)的P3脚;开关K2位于总线CAN2上,总线CAN2连接开关K5的一端,开关K5的另一端连接继电器KA3的一端,继电器KA3的另一端连接转轮控制芯片Ⅰ(56)的P2脚;开关K3位于总线CAN3上,总线CAN3连接开关K4的一端,开关K4的另一端连接继电器KA2的一端,继电器KA2的另一端连接转轮控制芯片Ⅰ(56)的P1脚;转轮控制芯片Ⅰ(56)的O1脚连接抽湿转轮Ⅰ(32);同时,开关K7的一端连接总线CAN3,开关K7的另一端连接继电器KA5的一端,继电器KA5的另一端连接转轮控制芯片Ⅱ(57)的P1脚;开关K8的一端连接总线CAN2,开关K8的另一端连接继电器KA6的一端,继电器KA6的另一端连接转轮控制芯片Ⅱ(57)的P2脚;开关K9的一端连接总线CAN1,开关K9的另一端连接继电器KA7的一端,继电器KA7的另一端连接转轮控制芯片Ⅱ(57)的P3脚;转轮控制芯片Ⅱ(57)的O1脚连接抽湿转轮Ⅱ(33);The dehumidification device includes a dehumidification system I (9), a dehumidification system II (10), a microwave energy leakage suppressor I (11), a microwave energy leakage suppressor III (13), and a dehumidifying wheel I (32). , Dehumidification runner II (33), runner control chip I (56), runner control chip II (57), bus CAN1, bus CAN2, bus CAN3, switch K1, switch K2, switch K3, switch K4, switch K5, switch K6, switch K7, switch K8, switch K9, relay KA2, relay KA3, relay KA4, relay KA5, relay KA6, relay KA7; wherein the runner control chip Ⅰ (56), the runner control chip Ⅱ (57) Both adopt 8XC196MC chip, the dehumidification system I (9) and the dehumidification system II (10) are respectively connected with the control unit (3), the dehumidification runner I (32) is located inside the dehumidification system I (9), and the dehumidification system The bottom of I (9) is connected to the microwave energy leakage suppressor I (11), the dehumidification rotor II (33) is located inside the dehumidification system II (10), and the bottom of the dehumidification system II (10) is connected to the microwave energy leakage suppressor III ( 13), the microwave leakage energy suppressor I (11) and the microwave leakage energy suppressor III (13) are respectively connected to the heating cavity (20); the switch K1 is located on the bus CAN1, and the bus CAN1 is connected to one end of the switch K6, and the other end of the switch K6 One end is connected to one end of the relay KA4, and the other end of the relay KA4 is connected to the P3 pin of the runner control chip I (56); the switch K2 is located on the bus CAN2, the bus CAN2 is connected to one end of the switch K5, and the other end of the switch K5 is connected to one end of the relay KA3 , the other end of the relay KA3 is connected to the P2 pin of the runner control chip Ⅰ (56); the switch K3 is located on the bus CAN3, the bus CAN3 is connected to one end of the switch K4, the other end of the switch K4 is connected to one end of the relay KA2, and the other end of the relay KA2 Connect pin P1 of the wheel control chip I (56); pin O1 of the wheel control chip I (56) is connected to the dehumidifier wheel I (32); at the same time, one end of the switch K7 is connected to the bus CAN3, and the other end of the switch K7 is connected to One end of the relay KA5, the other end of the relay KA5 is connected to the P1 pin of the runner control chip II (57); one end of the switch K8 is connected to the bus CAN2, the other end of the switch K8 is connected to one end of the relay KA6, and the other end of the relay KA6 is connected to the runner P2 pin of the control chip II (57); one end of the switch K9 is connected to the bus CAN1, the other end of the switch K9 is connected to one end of the relay KA7, and the other end of the relay KA7 is connected to the P3 pin of the wheel control chip II (57); the wheel control The O1 pin of the chip II (57) is connected to the dehumidification runner II (33); 还包括安装在加热腔体(20)的内壁上且与控制单元(3)连接的红外测温单元,所述的红外测温单元包括红外测温传感头Ⅰ(18),红外测温传感头Ⅱ(19),光学系统Ⅰ(34)、红外探测器Ⅰ(35)、调制盘Ⅰ(36)、温度传感器Ⅰ(37)、前置放大电路Ⅰ(38)、预放大电路Ⅰ(39)、推动级放大器Ⅰ(40)、末级放大器Ⅰ(41)、程调增益调整放大器Ⅰ(42)、波形调整电路Ⅰ(43)、A/D转换电路Ⅰ(44)、光学系统Ⅱ(45)、红外探测器Ⅱ(46)、调制盘Ⅱ(47)、温度传感器Ⅱ(48)、前置放大电路Ⅱ(49)、预放大电路Ⅱ(50)、推动级放大器Ⅱ(51)、末级放大器Ⅱ(52)、程调增益调整放大器Ⅱ(53)、波形调整电路Ⅱ(54)、A/D转换电路Ⅱ(55);其中红外测温传感头Ⅰ(18)连接光学系统Ⅰ(34),光学系统Ⅰ(34)连接红外探测器Ⅰ(35)及调制盘Ⅰ(36),调制盘Ⅰ(36)连接温度传感器Ⅰ(37),红外探测器Ⅰ(35)连接前置放大电路Ⅰ(38),前置放大电路Ⅰ(38)连接预放大电路Ⅰ(39),预放大电路Ⅰ(39)连接推动级放大器Ⅰ(40),推动级放大器Ⅰ(40)末级放大器Ⅰ(41),末级放大器Ⅰ(41)连接程调增益调整放大器Ⅰ(42),程调增益调整放大器Ⅰ(42)连接波形调整电路Ⅰ(43)及A/D转换电路Ⅰ(44),温度传感器Ⅰ(37)、波形调整电路Ⅰ(43)与A/D转换电路Ⅰ(44)分别连接微波发生器单元(22)的控制单元(3),同时控制单元(3)连接程调增益调整放大器Ⅰ(42);红外测温传感头Ⅱ(19)连接光学系统Ⅱ(45),光学系统Ⅱ(45)连接红外探测器Ⅱ(46)与调制盘Ⅱ(47),调制盘Ⅱ(47)连接温度传感器Ⅱ(48),红外探测器Ⅱ(46)连接前置放大电路Ⅱ(49),前置放大电路Ⅱ(49)连接预放大电路Ⅱ(50),预放大电路Ⅱ(50)连接推动级放大器Ⅱ(51),推动级放大器Ⅱ(51)末级放大器Ⅱ(52),末级放大器Ⅱ(52)连接程调增益调整放大器Ⅱ(53),程调增益调整放大器Ⅱ(53)连接波形调整电路Ⅱ(54)与A/D转换电路Ⅱ(55),温度传感器Ⅱ(48)、波形调整电路Ⅱ(54)与A/D转换电路Ⅱ(55)分别连接微波发生器单元(22)的控制单元(3),同时控制单元(3)连接程调增益调整放大器Ⅱ(53)。It also includes an infrared temperature measurement unit installed on the inner wall of the heating cavity (20) and connected to the control unit (3). The infrared temperature measurement unit includes an infrared temperature measurement sensor head I (18), an infrared temperature measurement sensor Sensing head II (19), optical system I (34), infrared detector I (35), modulation disc I (36), temperature sensor I (37), preamplifier circuit I (38), preamplifier circuit I ( 39), driving amplifier I (40), final amplifier I (41), programmable gain adjustment amplifier I (42), waveform adjustment circuit I (43), A/D conversion circuit I (44), optical system II (45), infrared detector II (46), modulation disc II (47), temperature sensor II (48), preamplifier circuit II (49), preamplifier circuit II (50), booster amplifier II (51) , final stage amplifier II (52), programmable gain adjustment amplifier II (53), waveform adjustment circuit II (54), A/D conversion circuit II (55); wherein the infrared temperature sensor head I (18) is connected to the optical System I (34), optical system I (34) is connected to infrared detector I (35) and reticle I (36), reticle I (36) is connected to temperature sensor I (37), and infrared detector I (35) is connected to Pre-amplification circuit I (38), pre-amplification circuit I (38) is connected to pre-amplification circuit I (39), pre-amplification circuit I (39) is connected to push stage amplifier I (40), and the end of push stage amplifier I (40) stage amplifier Ⅰ (41), the final stage amplifier Ⅰ (41) is connected to the programmable gain adjustment amplifier Ⅰ (42), and the programmable gain adjustment amplifier Ⅰ (42) is connected to the waveform adjustment circuit Ⅰ (43) and the A/D conversion circuit Ⅰ ( 44), the temperature sensor I (37), the waveform adjustment circuit I (43) and the A/D conversion circuit I (44) are respectively connected to the control unit (3) of the microwave generator unit (22), and the control unit (3) is connected to Programmable gain adjustment amplifier I (42); infrared temperature sensing head II (19) is connected to optical system II (45), and optical system II (45) is connected to infrared detector II (46) and modulation disc II (47), The modulation disc II (47) is connected to the temperature sensor II (48), the infrared detector II (46) is connected to the preamplifier circuit II (49), the preamplifier circuit II (49) is connected to the preamplifier circuit II (50), and the preamplifier The circuit II (50) is connected with the driving stage amplifier II (51), the driving stage amplifier II (51) and the final stage amplifier II (52), and the final stage amplifier II (52) is connected with the programmable gain adjustment amplifier II (53), and the programmable gain The adjustment amplifier II (53) is connected to the waveform adjustment circuit II (54) and the A/D conversion circuit II (55), the temperature sensor II (48), the waveform adjustment circuit II (54) and the A/D conversion circuit II (55) respectively The control unit (3) of the microwave generator unit (22) is connected, and the control unit (3) is connected with the programmable gain adjustment amplifier II (53).
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