CN106863062B - A kind of hemispherical finishing grinding wheel for Ultra-precision Turning - Google Patents
A kind of hemispherical finishing grinding wheel for Ultra-precision Turning Download PDFInfo
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- CN106863062B CN106863062B CN201710100741.0A CN201710100741A CN106863062B CN 106863062 B CN106863062 B CN 106863062B CN 201710100741 A CN201710100741 A CN 201710100741A CN 106863062 B CN106863062 B CN 106863062B
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- 239000003082 abrasive agent Substances 0.000 claims abstract description 21
- 239000000463 material Substances 0.000 claims description 13
- 239000000853 adhesive Substances 0.000 claims description 8
- 230000001070 adhesive effect Effects 0.000 claims description 8
- 239000007767 bonding agent Substances 0.000 claims description 7
- 239000011230 binding agent Substances 0.000 claims description 4
- KXGFMDJXCMQABM-UHFFFAOYSA-N 2-methoxy-6-methylphenol Chemical class [CH]OC1=CC=CC([CH])=C1O KXGFMDJXCMQABM-UHFFFAOYSA-N 0.000 claims description 2
- 229910000838 Al alloy Inorganic materials 0.000 claims description 2
- 229910000851 Alloy steel Inorganic materials 0.000 claims description 2
- 239000004033 plastic Substances 0.000 claims 2
- 239000004593 Epoxy Substances 0.000 claims 1
- 241000446313 Lamella Species 0.000 claims 1
- 150000002926 oxygen Chemical class 0.000 claims 1
- 238000005498 polishing Methods 0.000 abstract description 6
- 238000004519 manufacturing process Methods 0.000 abstract description 5
- 230000003287 optical effect Effects 0.000 abstract description 5
- 238000007730 finishing process Methods 0.000 abstract description 4
- 230000003746 surface roughness Effects 0.000 abstract description 4
- 230000007547 defect Effects 0.000 abstract description 3
- 238000003754 machining Methods 0.000 description 10
- 238000009499 grossing Methods 0.000 description 7
- 239000011159 matrix material Substances 0.000 description 7
- 230000000694 effects Effects 0.000 description 6
- 239000006061 abrasive grain Substances 0.000 description 4
- 238000000034 method Methods 0.000 description 4
- 229910001651 emery Inorganic materials 0.000 description 2
- 238000001125 extrusion Methods 0.000 description 2
- 238000009776 industrial production Methods 0.000 description 2
- 239000002245 particle Substances 0.000 description 2
- 229920005989 resin Polymers 0.000 description 2
- 239000011347 resin Substances 0.000 description 2
- 239000000758 substrate Substances 0.000 description 2
- ZOXJGFHDIHLPTG-UHFFFAOYSA-N Boron Chemical compound [B] ZOXJGFHDIHLPTG-UHFFFAOYSA-N 0.000 description 1
- 229910052796 boron Inorganic materials 0.000 description 1
- 239000000919 ceramic Substances 0.000 description 1
- 229910052593 corundum Inorganic materials 0.000 description 1
- 239000010431 corundum Substances 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 239000010432 diamond Substances 0.000 description 1
- 229910003460 diamond Inorganic materials 0.000 description 1
- 230000005489 elastic deformation Effects 0.000 description 1
- 229920001971 elastomer Polymers 0.000 description 1
- 229920006332 epoxy adhesive Polymers 0.000 description 1
- 229910052751 metal Inorganic materials 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 150000004767 nitrides Chemical class 0.000 description 1
- 230000005693 optoelectronics Effects 0.000 description 1
- 229920001568 phenolic resin Polymers 0.000 description 1
- 239000005011 phenolic resin Substances 0.000 description 1
- HBMJWWWQQXIZIP-UHFFFAOYSA-N silicon carbide Chemical compound [Si+]#[C-] HBMJWWWQQXIZIP-UHFFFAOYSA-N 0.000 description 1
- 229910010271 silicon carbide Inorganic materials 0.000 description 1
Classifications
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B13/00—Machines or devices designed for grinding or polishing optical surfaces on lenses or surfaces of similar shape on other work; Accessories therefor
- B24B13/01—Specific tools, e.g. bowl-like; Production, dressing or fastening of these tools
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24D—TOOLS FOR GRINDING, BUFFING OR SHARPENING
- B24D7/00—Bonded abrasive wheels, or wheels with inserted abrasive blocks, designed for acting otherwise than only by their periphery, e.g. by the front face; Bushings or mountings therefor
- B24D7/18—Wheels of special form
Landscapes
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Polishing Bodies And Polishing Tools (AREA)
Abstract
Description
技术领域technical field
本发明涉及半球形光整砂轮，特别涉及一种用于超精密加工的半球形光整砂轮。The invention relates to a hemispherical smoothing grinding wheel, in particular to a hemispherical smoothing grinding wheel for ultra-precision machining.
背景技术Background technique
当前，航空航天、医疗、天文及现代光电子产品等领域对非球面光学元件的需求越来越迫切。从机加工的角度看，非球面光学元件具有材料硬度大、面形复杂、几何精度和光洁度高等特点，这已成为超精密加工领域的技术难题。作为超精密加工中的最后一道工序，光整是决定非球面元件表面粗糙度和光洁度的重要环节。传统的光整工艺是抛光或研磨，实际生产中都存在着光整工艺不可避免的抛光加工效率低，研磨无法实现自由曲面光整的缺陷。At present, the demand for aspheric optical components is becoming more and more urgent in the fields of aerospace, medical, astronomy and modern optoelectronic products. From the perspective of machining, aspheric optical elements have the characteristics of high material hardness, complex surface shape, high geometric precision and high finish, which have become a technical problem in the field of ultra-precision machining. As the last process in ultra-precision machining, finishing is an important link in determining the surface roughness and smoothness of aspheric components. The traditional finishing process is polishing or grinding. In actual production, there are defects that the finishing process inevitably has low polishing efficiency and grinding cannot achieve free-form surface finishing.
现有光整砂轮机械结构复杂，使用时需要其他的配套设备，系统复杂而昂贵，而且工件光整后的表面粗糙度很难达到超精密精度。因此，现有的光整砂轮难以广泛应用于非球面光学元件的超高精密加工。The existing skinning grinding wheel has a complex mechanical structure, and other supporting equipment is required for use. The system is complex and expensive, and the surface roughness of the workpiece after skinning is difficult to achieve ultra-precision precision. Therefore, the existing smooth grinding wheel is difficult to be widely used in ultra-high precision machining of aspheric optical elements.
发明内容Contents of the invention
本发明的目的是为了解决实际生产中都存在着光整工艺不可避免的抛光加工效率低，研磨无法实现自由曲面光整的缺陷，系统复杂而昂贵，工件光整后的表面粗糙度很难达到超精密精度难以广泛应用于非球面光学元件的超高精密加工的问题，而提出的一种用于超精密加工的半球形光整砂轮。The purpose of the present invention is to solve the defects that in the actual production, the unavoidable polishing efficiency of the finishing process is low, the grinding can not realize the free-form surface finishing, the system is complex and expensive, and the surface roughness of the workpiece after finishing is difficult to achieve. Ultra-precision precision is difficult to be widely used in the ultra-high precision machining of aspheric optical elements, and a hemispherical smooth grinding wheel for ultra-precision machining is proposed.
上述的发明目的是通过以下技术方案实现的：Above-mentioned purpose of the invention is achieved through the following technical solutions:
一种用于超精密加工的半球形光整砂轮由磨料层、砂轮基体和砂轮支撑件组成；A hemispherical smooth grinding wheel for ultra-precision machining is composed of an abrasive layer, a grinding wheel base and a grinding wheel support;
所述砂轮基体由半球体、固定板和定位孔组成，半球体设置在固定板上，在固定板中心处设置半径为r深度小于固定板厚度的定位孔；The grinding wheel base body is composed of a hemisphere, a fixed plate and a positioning hole, the hemisphere is arranged on the fixed plate, and a positioning hole whose radius r is less than the thickness of the fixed plate is set at the center of the fixed plate;
所述砂轮支撑件由定位凸台、支撑板和砂轮杆组成；The grinding wheel support is composed of a positioning boss, a support plate and a grinding wheel rod;
定位凸台位于支撑板上端的中心位置，砂轮杆、定位凸台与支撑板共轴心，砂轮杆用于支撑支撑板；The positioning boss is located at the center of the upper end of the support plate, the grinding wheel rod, the positioning boss and the support plate are coaxial, and the grinding wheel rod is used to support the support plate;
所述磨料层粘结在半球体的表面，且磨料层的下端面与固定板的上端面设置第一间隙；定位凸台与定位孔之间为过盈配合，定位孔的半径与定位凸台半径一致为r，且定位凸台的高度小于定位孔的深度；定位孔与定位凸台设置第二间隙；其中，磨料层外侧球面的曲率半径R1，磨料层内侧球面的曲率半径R2等于砂轮基体的半球体的半径R；磨料层的厚度值等于R1-R2的差值；固定板的半径值等于支撑板的半径值；固定板粘结在支撑板上面。The abrasive material layer is bonded on the surface of the hemisphere, and the lower end surface of the abrasive material layer and the upper end surface of the fixed plate are provided with a first gap; the positioning boss and the positioning hole are interference fit, and the radius of the positioning hole and the positioning boss The radius is the same as r, and the height of the positioning boss is smaller than the depth of the positioning hole; the second gap is set between the positioning hole and the positioning boss; wherein, the curvature radius R1 of the outer spherical surface of the abrasive layer, and the curvature radius R2 of the inner spherical surface of the abrasive layer are equal to the grinding wheel base The radius R of the hemisphere; the thickness value of the abrasive layer is equal to the difference of R1-R2; the radius value of the fixed plate is equal to the radius value of the support plate; the fixed plate is bonded on the support plate.
发明效果Invention effect
本发明提供了一种机械结构简单且实用，可实现大曲率的非球面元件超精密加工的光整砂轮。本发明的突出特点是主体部分柔性基体与传统砂轮磨料层相结合，在工作过程中磨料对待加工表面会产生类似于抛光和研磨的不确定性微量去除，具有光整的作用；通过合理规划运动轨迹可实现恒力下的光整，进而获得较好的光整效果；磨料层为固着磨粒，磨粒的粒径为1微米到40微米能有效提高材料的去除率，进而提高光整效率；磨料层为半球形结构，能够对大曲率的非球面元件进行光整，尤其适用于凹面的光整加工；磨料层中的磨料和结合剂类型以及砂轮基体的材料都有多种选择，可以根据待加工表面的材料性能或要求的光整精度选用合适的磨料、结合剂和基体材料；通过设置磨料层的下端面与固定板的上端面的间隙，以及定位孔与定位凸台的间隙防止砂轮基体产生弹性变形后磨料层、砂轮基体和支撑件之间发生相互挤压；本发明的机械结构简单，易于生产制造，不需要其他的配套设备，使用成本低，可广泛应用于实际工业生产中。The invention provides a smooth grinding wheel which has a simple and practical mechanical structure and can realize ultra-precision processing of large curvature aspheric elements. The outstanding feature of the present invention is that the flexible matrix of the main body is combined with the abrasive layer of the traditional grinding wheel. During the working process, the abrasive material will produce a small amount of uncertain removal similar to polishing and grinding on the surface to be processed, and has the effect of smoothing; through reasonable planning of movement The track can realize the smoothing under constant force, and then obtain a better skinning effect; the abrasive layer is fixed abrasive grains, and the particle size of the abrasive grains is 1 micron to 40 microns, which can effectively improve the material removal rate, and then improve the skinning efficiency ; The abrasive layer has a hemispherical structure, which can smooth the aspheric elements with large curvature, especially suitable for the finishing of concave surfaces; the types of abrasives and bonding agents in the abrasive layer and the materials of the grinding wheel base have many options, which can be According to the material properties of the surface to be processed or the required finishing accuracy, select the appropriate abrasive, bonding agent and matrix material; by setting the gap between the lower end surface of the abrasive layer and the upper end surface of the fixed plate, and the gap between the positioning hole and the positioning boss. After the grinding wheel base is elastically deformed, mutual extrusion occurs between the abrasive layer, the grinding wheel base and the supporting member; the mechanical structure of the present invention is simple, easy to manufacture, does not require other supporting equipment, and has low cost of use, and can be widely used in actual industrial production middle.
附图说明Description of drawings
图1为具体实施方式一提出的超精密加工的半球形光整砂轮结构示意图；Fig. 1 is the schematic diagram of the structure of the hemispherical smooth grinding wheel proposed by the specific embodiment 1;
图2为具体实施方式一提出的磨料层部分的剖面图；Fig. 2 is a sectional view of the abrasive layer part proposed in Embodiment 1;
图3(a)为具体实施方式一提出的砂轮基体部分的轴测图；Fig. 3 (a) is the axonometric view of the grinding wheel base part proposed by Embodiment 1;
图3(b)为具体实施方式一提出的砂轮基体部分的剖面图；Fig. 3 (b) is the cross-sectional view of the emery wheel base body part that specific embodiment one proposes;
图4为具体实施方式一提出的砂轮支撑件部分的轴测图。Fig. 4 is an axonometric view of the grinding wheel support part proposed in Embodiment 1.
具体实施方式Detailed ways
具体实施方式一：本实施方式的一种用于超精密加工的半球形光整砂轮，具体由磨料层1、砂轮基体2和砂轮支撑件3组成如图1所示；Embodiment 1: A hemispherical smooth grinding wheel for ultra-precision machining in this embodiment is specifically composed of an abrasive layer 1, a grinding wheel base 2 and a grinding wheel support 3, as shown in Figure 1;
所述砂轮基体2由半球体2-1、固定板2-2和定位孔2-3组成由图3a和b所示，半球体2-1设置在固定板2-2上，在固定板2-2中心处设置半径为r深度小于固定板厚度的定位孔2-3；Described emery wheel matrix 2 is made up of hemisphere 2-1, fixed plate 2-2 and positioning hole 2-3. As shown in Fig. 3 a and b, hemisphere 2-1 is arranged on the fixed plate 2-2, on the fixed plate 2 -2 The positioning hole 2-3 whose radius is r and whose depth is smaller than the thickness of the fixing plate is set at the center;
所述砂轮支撑件3由定位凸台3-1、支撑板3-2和砂轮杆3-3组成；The grinding wheel support 3 is composed of a positioning boss 3-1, a support plate 3-2 and a grinding wheel rod 3-3;
定位凸台3-1位于支撑板3-2上端的中心位置，砂轮杆3-3、定位凸台3-1与支撑板3-2共轴心，砂轮杆3-3用于支撑支撑板3-2如图4；The positioning boss 3-1 is located at the center of the upper end of the support plate 3-2, the grinding wheel rod 3-3, the positioning boss 3-1 and the support plate 3-2 are coaxial, and the grinding wheel rod 3-3 is used to support the support plate 3 -2 as shown in Figure 4;
所述磨料层1粘结在半球体2-1的表面，且磨料层1的下端面与固定板2-2的上端面设置第一间隙4；定位凸台3-1与定位孔2-3之间为过盈配合，定位孔2-3的半径与定位凸台3-1半径一致为r，且定位凸台3-1的高度小于定位孔2-3的深度；定位孔2-3与定位凸台3-1的设置第二间隙5；可根据光整的具体要求或待加工件的材料性能选择适用的磨料层1中磨料和结合剂的类型及砂轮基体2的材料类型和弹性值；其中，磨料层1为具有一定厚度的球冠形结构，外侧球面与内侧球面的圆心在同一点；磨料层1外侧球面的曲率半径R1小于待加工表面上任一点的曲率半径，磨料层1内侧球面的曲率半径R2等于砂轮基体的半球体2-1的半径R；磨料层1的厚度值等于R1-R2的差值如图2；固定板2-2的半径值等于支撑板3-2的半径值；砂轮基体2的材料为橡胶或弹性树脂；固定板2-2粘结在支撑板3-2上面；所述支撑板起到固定所述砂轮基体的作用，砂轮杆是砂轮与电动主轴的连接部分。The abrasive layer 1 is bonded to the surface of the hemisphere 2-1, and the lower end surface of the abrasive layer 1 and the upper end surface of the fixed plate 2-2 are provided with a first gap 4; the positioning boss 3-1 and the positioning hole 2-3 It is an interference fit between them, the radius of the positioning hole 2-3 is consistent with the radius of the positioning boss 3-1 as r, and the height of the positioning boss 3-1 is less than the depth of the positioning hole 2-3; the positioning hole 2-3 and the The positioning boss 3-1 is provided with a second gap 5; the type of abrasive and bonding agent in the abrasive layer 1 and the material type and elastic value of the grinding wheel base 2 can be selected according to the specific requirements of the finishing or the material properties of the workpiece to be processed ; wherein the abrasive layer 1 is a spherical structure with a certain thickness, and the center of the outer spherical surface and the inner spherical surface are at the same point; the radius of curvature R1 of the outer spherical surface of the abrasive layer 1 is less than the radius of curvature of any point on the surface to be processed, and the inner side of the abrasive layer 1 The radius of curvature R2 of the spherical surface is equal to the radius R of the hemisphere 2-1 of the grinding wheel substrate; the thickness value of the abrasive layer 1 is equal to the difference between R1-R2 as shown in Figure 2; the radius value of the fixed plate 2-2 is equal to that of the support plate 3-2 Radius value; the material of the grinding wheel matrix 2 is rubber or elastic resin; the fixed plate 2-2 is bonded on the support plate 3-2; the support plate plays the role of fixing the grinding wheel matrix, and the grinding wheel rod is the connection part.
本实施方式效果：The effect of this implementation mode:
本实施方式提供了一种机械结构简单且实用，可实现大曲率的非球面元件超精密加工的光整砂轮。本实施方式的突出特点是主体部分柔性基体与传统砂轮磨料层相结合，在工作过程中磨料对待加工表面会产生类似于抛光和研磨的不确定性微量去除，具有光整的作用；通过合理规划运动轨迹可实现恒力下的光整，进而获得较好的光整效果；磨料层为固着磨粒，磨粒的粒径为1微米到40微米能有效提高材料的去除率，能有效提高材料的去除率，进而提高光整效率；磨料层为半球形结构，能够对大曲率的非球面元件进行光整，尤其适用于凹面的光整加工；磨料层中的磨料和结合剂类型以及砂轮基体的材料都有多种选择，可以根据待加工表面的材料性能或要求的光整精度选用合适的磨料、结合剂和基体材料；通过设置磨料层的下端面与固定板的上端面的间隙，以及定位孔与定位凸台的间隙防止砂轮基体产生弹性变形后磨料层、砂轮基体和支撑件之间发生相互挤压；本实施方式的机械结构简单，易于生产制造，不需要其他的配套设备，使用成本低，可广泛应用于实际工业生产中。This embodiment provides a smooth grinding wheel with a simple and practical mechanical structure, which can realize ultra-precision machining of large curvature aspheric elements. The outstanding feature of this embodiment is that the flexible substrate of the main part is combined with the traditional grinding wheel abrasive layer. During the working process, the abrasive material will produce a small amount of uncertainty similar to polishing and grinding on the surface to be processed, and has the effect of smoothing; through reasonable planning The movement trajectory can realize the smoothing under constant force, and then obtain a better smoothing effect; the abrasive layer is fixed abrasive grains, and the particle size of the abrasive grains is 1 micron to 40 microns, which can effectively improve the material removal rate and improve the material removal rate. The removal rate is high, thereby improving the finishing efficiency; the abrasive layer has a hemispherical structure, which can be used for finishing the aspheric elements with large curvature, especially suitable for the finishing of concave surfaces; the type of abrasive and bonding agent in the abrasive layer and the grinding wheel matrix There are many choices of materials, and suitable abrasives, bonding agents and matrix materials can be selected according to the material properties of the surface to be processed or the required finishing accuracy; by setting the gap between the lower end surface of the abrasive layer and the upper end surface of the fixed plate, and The gap between the positioning hole and the positioning boss prevents mutual extrusion between the abrasive layer, the grinding wheel base and the support after the elastic deformation of the grinding wheel base; the mechanical structure of this embodiment is simple, easy to manufacture, and does not require other supporting equipment. The cost is low and can be widely used in actual industrial production.
具体实施方式二：本实施方式与具体实施方式一不同的是：所述磨料层1的厚度值的范围为5～10mm；磨料层1由磨料及结合剂构成，其中磨料为金刚石、立方氮化硼、碳化硅或刚玉中的一种，结合剂类型为金属、陶瓷或树脂中的一种。其它步骤及参数与具体实施方式一相同。Embodiment 2: The difference between this embodiment and Embodiment 1 is that the thickness of the abrasive layer 1 ranges from 5 to 10 mm; the abrasive layer 1 is made of abrasive and bonding agent, wherein the abrasive is diamond, cubic nitride One of boron, silicon carbide or corundum, the binder type is one of metal, ceramic or resin. Other steps and parameters are the same as those in Embodiment 1.
具体实施方式三：本实施方式与具体实施方式一或二不同的是：粘结所述磨料层1与半球体2-1所用的粘结剂、固定板2-2粘结在支撑板3-2所用的粘结剂及粘结固定板2-2和支撑板3-2所用的粘结剂为耐高温胶，其中耐高温胶为耐高温环氧类胶粘剂或耐高温酚醛树脂类胶粘剂。其它步骤及参数与具体实施方式一或二相同。Specific embodiment three: the difference between this embodiment and specific embodiment one or two is that: the adhesive used to bond the abrasive layer 1 and the hemisphere 2-1, the fixed plate 2-2 is bonded to the support plate 3- 2 The adhesive used and the adhesive used for bonding the fixing plate 2-2 and the support plate 3-2 are high-temperature-resistant adhesives, wherein the high-temperature-resistant adhesive is a high-temperature-resistant epoxy adhesive or a high-temperature-resistant phenolic resin adhesive. Other steps and parameters are the same as those in Embodiment 1 or Embodiment 2.
具体实施方式四：本实施方式与具体实施方式一至三之一不同的是：所述磨料层1的下端面与固定板2-2的上端面设置第一间隙4为0.02R～0.1R。其它步骤及参数与具体实施方式一至三之一相同。Embodiment 4: This embodiment differs from Embodiments 1 to 3 in that: the lower end surface of the abrasive layer 1 and the upper end surface of the fixing plate 2-2 are provided with a first gap 4 of 0.02R-0.1R. Other steps and parameters are the same as those in Embodiments 1 to 3.
具体实施方式五：本实施方式与具体实施方式一至四之一不同的是：所述固定板2-2的结构为圆柱形薄板。其它步骤及参数与具体实施方式一至四之一相同。Embodiment 5: This embodiment is different from Embodiment 1 to Embodiment 4 in that: the structure of the fixing plate 2-2 is a thin cylindrical plate. Other steps and parameters are the same as in one of the specific embodiments 1 to 4.
具体实施方式六：本实施方式与具体实施方式一至五之一不同的是：所述固定板2-2的厚度为0.1R～0.2R。其它步骤及参数与具体实施方式一至五之一相同。Embodiment 6: This embodiment is different from Embodiment 1 to Embodiment 5 in that: the thickness of the fixing plate 2 - 2 is 0.1R˜0.2R. Other steps and parameters are the same as one of the specific embodiments 1 to 5.
具体实施方式七：本实施方式与具体实施方式一至六之一不同的是：所述定位孔2-3为圆柱形盲孔，定位孔2-3形状也可以是其他多边形的柱形盲孔，其他多边形可以为四边形，五边形，六边形等。其它步骤及参数与具体实施方式一至六之一相同。Embodiment 7: The difference between this embodiment and Embodiments 1 to 6 is that the positioning hole 2-3 is a cylindrical blind hole, and the shape of the positioning hole 2-3 can also be other polygonal cylindrical blind holes. Other polygons can be quadrilaterals, pentagons, hexagons, etc. Other steps and parameters are the same as one of the specific embodiments 1 to 6.
具体实施方式八：本实施方式与具体实施方式一至七之一不同的是：所述定位孔2-3与定位凸台3-1设置第二间隙5为1～3mm。其它步骤及参数与具体实施方式一至七之一相同。Embodiment 8: This embodiment differs from Embodiments 1 to 7 in that: the positioning hole 2-3 and the positioning boss 3-1 are provided with a second gap 5 of 1-3 mm. Other steps and parameters are the same as one of the specific embodiments 1 to 7.
具体实施方式九：本实施方式与具体实施方式一至八之一不同的是：所述砂轮支撑件3的材料为铝合金或合金钢，起到定位并固定所述砂轮基体的作用，也是连接砂轮与电动主轴的部分；支撑板3-2的结构为圆柱形薄板，圆柱形薄板厚度为0.15R～0.3R，砂轮杆3-3的半径为0.1R～R。其它步骤及参数与具体实施方式一至八之一相同。Embodiment 9: The difference between this embodiment and one of Embodiments 1 to 8 is that the material of the grinding wheel support 3 is aluminum alloy or alloy steel, which plays the role of positioning and fixing the base of the grinding wheel, and also connects the grinding wheel The part with the electric spindle; the structure of the support plate 3-2 is a cylindrical thin plate, the thickness of the cylindrical thin plate is 0.15R-0.3R, and the radius of the grinding wheel rod 3-3 is 0.1R-R. Other steps and parameters are the same as those in Embodiments 1 to 8.
具体实施方式十：本实施方式与具体实施方式一至九之一不同的是：：所述半径r为0.05R～0.2R。其它步骤及参数与具体实施方式一至九之一相同。Embodiment 10: This embodiment is different from Embodiments 1 to 9 in that: the radius r is 0.05R˜0.2R. Other steps and parameters are the same as one of the specific embodiments 1 to 9.
Claims (10)
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