CN106850900A - A kind of electronic equipment - Google Patents
A kind of electronic equipment Download PDFInfo
- Publication number
- CN106850900A CN106850900A CN201710208669.3A CN201710208669A CN106850900A CN 106850900 A CN106850900 A CN 106850900A CN 201710208669 A CN201710208669 A CN 201710208669A CN 106850900 A CN106850900 A CN 106850900A
- Authority
- CN
- China
- Prior art keywords
- electronic equipment
- fingerprint chip
- protection component
- metal
- electrostatic protection
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000002184 metal Substances 0.000 claims description 50
- 229910052751 metal Inorganic materials 0.000 claims description 50
- 241000676840 Elater Species 0.000 claims description 21
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical group [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 5
- 229910052802 copper Inorganic materials 0.000 claims description 5
- 239000010949 copper Substances 0.000 claims description 5
- 239000000463 material Substances 0.000 claims description 5
- 230000005611 electricity Effects 0.000 claims description 3
- 238000010586 diagram Methods 0.000 description 7
- 229910000831 Steel Inorganic materials 0.000 description 6
- 239000004744 fabric Substances 0.000 description 6
- 239000010959 steel Substances 0.000 description 6
- 239000012634 fragment Substances 0.000 description 5
- 238000000034 method Methods 0.000 description 5
- 238000005516 engineering process Methods 0.000 description 4
- 239000006260 foam Substances 0.000 description 4
- 230000004048 modification Effects 0.000 description 4
- 238000012986 modification Methods 0.000 description 4
- 230000009286 beneficial effect Effects 0.000 description 2
- 239000003292 glue Substances 0.000 description 2
- 230000008569 process Effects 0.000 description 2
- 230000009471 action Effects 0.000 description 1
- 230000001413 cellular effect Effects 0.000 description 1
- 230000008859 change Effects 0.000 description 1
- 238000006243 chemical reaction Methods 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 229910052755 nonmetal Inorganic materials 0.000 description 1
- 230000009467 reduction Effects 0.000 description 1
- 239000012779 reinforcing material Substances 0.000 description 1
- 230000003068 static effect Effects 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04M—TELEPHONIC COMMUNICATION
- H04M1/00—Substation equipment, e.g. for use by subscribers
- H04M1/02—Constructional features of telephone sets
- H04M1/0202—Portable telephone sets, e.g. cordless phones, mobile phones or bar type handsets
- H04M1/026—Details of the structure or mounting of specific components
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06V—IMAGE OR VIDEO RECOGNITION OR UNDERSTANDING
- G06V40/00—Recognition of biometric, human-related or animal-related patterns in image or video data
- G06V40/10—Human or animal bodies, e.g. vehicle occupants or pedestrians; Body parts, e.g. hands
- G06V40/12—Fingerprints or palmprints
- G06V40/13—Sensors therefor
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05F—STATIC ELECTRICITY; NATURALLY-OCCURRING ELECTRICITY
- H05F3/00—Carrying-off electrostatic charges
- H05F3/02—Carrying-off electrostatic charges by means of earthing connections
Landscapes
- Engineering & Computer Science (AREA)
- Signal Processing (AREA)
- Human Computer Interaction (AREA)
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Multimedia (AREA)
- Theoretical Computer Science (AREA)
- Telephone Set Structure (AREA)
- Elimination Of Static Electricity (AREA)
Abstract
The present invention discloses a kind of electronic equipment, including：Fingerprint chip, electrostatic protection component, circuit main board；The fingerprint chip is embedded in the first end of the electrostatic protection component, and the periphery of the fingerprint chip contacts firmly with the first end of the electrostatic protection component；Second end of the electrostatic protection component is connected with the circuit main board, for the electrostatic of the fingerprint chip to be discharged by the ground terminal ground set on the circuit main board when the fingerprint chip is electrically connected with the first end of the electrostatic protection component, above-mentioned electronic equipment is used to provide a kind of scheme of new fingerprint module ground connection.
Description
Technical field
The present embodiments relate to electronic device field, more particularly to a kind of electronic equipment.
Background technology
With the manufacturing fast development of mobile phone, the thickness of the whole machine of mobile phone also in more and more thinner, also increasingly enrich by function,
For example on current mobile phone there is fingerprint recognition key, it is possible to achieve fingerprint identification technology, fingerprint identification technology is generally applied to individual
And the security control of cyber-defence, data protection, computer or mobile device organized etc..Due to the fingerprint recognition in mobile phone
The reason that button is often touched by user, the fingerprint module in mobile phone is easily punctured by static electricity on human body.Current fingerprint module
Antistatic protection, is that, from housing front fingerprint module underlying wound to back side of shell, front passes through conducting foam by conductive fabric
With fingerprint steel disc ground connection, the back side is leaked copper region and is contacted by conducting foam and mainboard, as shown in figure 1, so as to reach fingerprint module
The purpose being grounded with mainboard.Although electrostatic can so be guided when human contact is to fingerprint recognition key, it is done so that
Have the disadvantage conductive fabric in an assembling process easy fold, warp, off normal etc., cause contact unreliable.
The content of the invention
The embodiment of the present invention provides a kind of electronic equipment, is used to provide a kind of method of new fingerprint module ground connection.
The embodiment of the present invention provides a kind of electronic equipment, including：Fingerprint chip, electrostatic protection component, circuit main board；
The fingerprint chip is embedded in the first end of the electrostatic protection component, and the periphery of the fingerprint chip with it is described
The first end of electrostatic protection component is contacted firmly；
Second end of the electrostatic protection component is connected with the circuit main board, for quiet with described in the fingerprint chip
By the electrostatic of the fingerprint chip by the ground terminal that is set on the circuit main board when first end of electric guard assembly is electrically connected
Ground connection electric discharge.
Further, the first end of the electrostatic protection component be metal elater, the shape of the metal elater with it is described
Fingerprint chip matches, and the metal elater is surrounded or fingerprint chip described in semi-surrounding entirely.
Further, the second end of the electrostatic protection component is metal clips；The first end of the metal clips and institute
State metal elater to contact firmly, the second end of the metal clips contacts firmly with the leakage copper region on the circuit main board.
Further, the second end of the metal clips is fixed on the circuit main board by fastener.
Further, the second end of the electrostatic protection component is wire；The first end of the wire and the metal elastic
Silk electrical contact, the second end and the circuit main board of the wire make electrical contact with.
Further, the electronic equipment also includes：Side housing；The fingerprint chip is embedded in the side of the electronic equipment
On housing.
Further, the material of the side housing is plastic material.
The embodiment of the present invention can utilize electrostatic protection component by fingerprint by providing a kind of new electronic equipment, the equipment
Electrostatic on chip is transferred on circuit main board, because circuit main board is ground connection, it is possible to which electrostatic is eliminated in time, due to
One end of electrostatic protection component is to contact firmly with fingerprint chip, it is possible to substitute the fingerprint module steel of original fingerprint module
Piece, in addition, the other end of electrostatic protection component is connected on circuit main board, therefore can realize eliminating electrostatic, therefore substitute existing
Conducting foam and conductive fabric, simpler convenience is realized in technique, be beneficial to cost-effective.
Brief description of the drawings
Technical scheme in order to illustrate more clearly the embodiments of the present invention, below will be to that will make needed for embodiment description
Accompanying drawing is briefly introduced, it should be apparent that, drawings in the following description are only some embodiments of the present invention, for this
For the those of ordinary skill in field, on the premise of not paying creative work, other can also be obtained according to these accompanying drawings
Accompanying drawing.
A kind of assembling schematic diagram of fingerprint module grounding scheme that Fig. 1 is provided for prior art；
Fig. 2 is a kind of assembling schematic diagram one of fingerprint module grounding scheme provided in an embodiment of the present invention；
Fig. 3 is a kind of assembling schematic diagram two of fingerprint module grounding scheme provided in an embodiment of the present invention；
Fig. 4 is deployed in the assembling schematic diagram of mobile phone side for a kind of fingerprint module that prior art is provided；
Fig. 5 is the tangent plane schematic diagram that a kind of fingerprint module provided in an embodiment of the present invention is deployed in mobile phone side；
Fig. 6 is the front schematic view that kind fingerprint module provided in an embodiment of the present invention is deployed in mobile phone side.
Specific embodiment
In order that the object, technical solutions and advantages of the present invention are clearer, below in conjunction with accompanying drawing the present invention is made into
One step ground is described in detail, it is clear that described embodiment is only some embodiments of the invention, rather than whole implementation
Example.Based on the embodiment in the present invention, what those of ordinary skill in the art were obtained under the premise of creative work is not made
All other embodiment, belongs to the scope of protection of the invention.
It should be noted that electronic equipment is a kind of equipment with fingerprint identification function in the embodiment of the present invention, it is common
Electronic equipment for example include：Mobile phone, panel computer, notebook computer, palm PC, mobile internet device (mobile
Internet device, MID), wearable device, such as intelligent watch, Intelligent bracelet, pedometer etc..
In order to solve in existing fingerprint module grounding scheme conductive fabric in an assembling process easy fold, warp, off normal etc.
Problem, existing conductive fabric is substituted in the embodiment of the present invention with electrostatic protection component.Electronic equipment provided in an embodiment of the present invention
As shown in Fig. 2 including：Fingerprint chip 11, electrostatic protection component 12, circuit main board 13, wherein, electrostatic protection component 12 is in figure
Dotted portion, the dash area that fingerprint chip is surrounded by the one end of electrostatic protection component 12.Fingerprint chip 11 is embedded in electrostatic protection
The first end of component 12, and the periphery of fingerprint chip contacts firmly with the first end of electrostatic protection component 12；Electrostatic protection component
12 the second end is connected with circuit main board 13, for being incited somebody to action when fingerprint chip 11 is electrically connected with the first end of electrostatic protection component 12
The electrostatic of fingerprint chip is discharged by the ground terminal ground set on circuit main board 13.So, electrostatic protection component can be realized
The electrostatic on fingerprint chip is eliminated, therefore existing conducting foam and conductive fabric can be substituted, the embodiment of the present invention is real in technique
Existing simpler convenience, is beneficial to cost-effective.
Wherein, electrostatic protection component 12 can be made up of metal elater and metal clips, or by metal elastic
What silk and wire were constituted, in addition, the integral component that electrostatic protection component can also be made up of metal elater and metal clips, or
Person is the integral component being made up of metal elater and wire.In addition, metal elater can be enclosed in around fingerprint chip entirely,
Can also semi-surrounding around fingerprint chip.In view of in order to preferably by the electrostatic walking guide on fingerprint chip, metal elater
At least to surround more than half of fingerprint chip surrounding.Certainly, it is contemplated that in order that design is more attractive in appearance, preferably metal elater
It is enclosed in around fingerprint chip entirely.
Specifically, electronic equipment provided in an embodiment of the present invention can be with as shown in figure 3, the electronic equipment includes：Fingerprint
Chip 101, electrostatic protection component 102, circuit main board 103.Wherein, electrostatic protection component 102 is made up of two parts, respectively
Metal elater 102a and metal clips 102b.Wherein, metal elater 102a is enclosed in around fingerprint chip 101, mainly will
Electrostatic on fingerprint chip is guided, and electrostatic protection is played a part of to fingerprint chip.Metal clips 102b is connection circuit main board
103 and the switching shell fragment of metal elater 102a, wherein, one end of metal clips 102b is pressed onto metal elater 102a in shell foot form
Afterbody (both contact positions have craft of gilding, reinforcing material conduction), other end conducting resinl is fixed adhered to circuit
On mainboard 103.The Main Function of metal clips 102b is when user touches fingerprint chip, because metal elater 102a is deployed in
Around fingerprint chip, so the electrostatic on fingerprint chip can be guided, and metal clips 102b and metal elater 102a connects
Connect, so the electrostatic on metal elater 102a is directed at into circuit main board 103.Generally, ground terminal is provided with circuit main board,
So circuit main board can guide electrostatic.
Furthermore, it is understood that the metal clips 102b in Fig. 3 can also be designed to a wire, one end of wire and metal elastic
Silk 102a connections, the other end of wire is connected on circuit main board 103, it is also possible to play a part of to guide electrostatic.
Furthermore, it is contemplated that current fingerprint chip is typically deployed at the front or the back side of electronic equipment, meeting is so disposed
The attractive in appearance of mobile phone global design is influenceed, therefore, prior art designs in the side of electronic equipment fingerprint chip.For example, Fig. 4 is
Prior art fingerprint chip is deployed in the grounding scheme assembling schematic diagram of the side of mobile phone, wherein, [01] is the side shell of mobile phone
Body, has electrostatic protection when fingerprint module is placed in side to ensure fingerprint module, therefore side housing must be metal structure；[02]
It is the front housing of mobile phone；[03] be mobile phone SIM/TF card devices；[04] be mobile phone fingerprint module；[05] it is mobile phone electricity
Source key；[06] it is mobile phone volume key.
It can be seen that, in the prior art, the side housing of mobile phone is necessarily designed to metal shell so that the design cost of mobile phone increases
Plus, for the pressure of cost, during by electronic device design into non-metal shell, resulting in fingerprint module ground connection turns into problem.For
Solve this problem, the embodiment of the present invention changing the deployed position of current fingerprint chip, will its be deployed in electronic equipment
Side, also change the structure of current fingerprint module, that is, remove the metal steel disc in fingerprint module.It is primarily due to electronic equipment
Side it is narrower and space is limited, the metal steel disc in fingerprint module is relatively thick, can influence the overall package of electronic equipment.Together
When, the embodiment of the present invention uses the grounding scheme shown in Fig. 3, i.e., by replacing metal steel disc with an electrostatic protection component,
Discharged so as to the electrostatic on fingerprint chip is directed on circuit main board.
Specifically, by taking mobile phone as an example, the tangent plane schematic diagram of electronic equipment provided in an embodiment of the present invention, as shown in figure 5,
In Fig. 5, [201] are the side housings of mobile phone, and due to using new earthing mode, to side housing material, whether metal will not
Ask.[202] be mobile phone front housing；[203] be mobile phone SIM/TF card devices.[204] be mobile phone fingerprint module, refer to
The becket that line module body whether there is antistatic is not required.[05] it is cellular phone power supplies key.[206] it is mobile phone volume key.[207]
It is mobile fingerprint module earthing metal ring；[208] be mobile phone LCM；[209] be mobile phone TP.[210] be mobile phone mainboard,
Mainboard leaks copper conveniently and shell fragment earth-continuity in fingerprint module ground connection conversion shell fragment sticking area.[211] it is mobile fingerprint module
Ground connection switching shell fragment, shell fragment one end is pressed onto on [207] mobile fingerprint module earthing metal ring, and another side is pasted by conducting resinl
[210] (mainboard leaks copper in this region) on mainboard, it is fixed on whole machine finally by [214] mobile phone screw.[212] it is glue,
It is mainly used to fix [204] and [207], prevents two pieces from releasing.[214] it is mobile phone gum, is mainly used to fix mobile phone shielding, this
Place can also be fixed with glue dispensing.
Wherein, [213] are mobile phone screws, are mainly used to be locked [211] onto [210] cell phone mainboard.Mobile phone spiral shell
The fixed position front schematic view as shown in Figure 6 of silk.
From Fig. 5 and Fig. 6, fingerprint chip is deployed in the side of electronic equipment, side can using it is nonmetallic can be with, from
And whole machine cost reduction is a lot.In addition, can efficiently solve fingerprint and connect by increasing an electrostatic protection component in whole machine
Ground problem, while fingerprint module body does not need unnecessary metal steel disc, can effectively reduce the overall dimensions of fingerprint module.
Obviously, those skilled in the art can carry out various changes and modification without deviating from this hair to the embodiment of the present invention
The spirit and scope of bright embodiment.So, if these modifications of the embodiment of the present invention and modification belong to embodiment of the present invention power
Within the scope of profit requirement and its equivalent technologies, then the embodiment of the present invention is also intended to comprising these changes and modification.
Claims (7)
1. a kind of electronic equipment, it is characterised in that including：Fingerprint chip, electrostatic protection component, circuit main board；
The fingerprint chip is embedded in the first end of the electrostatic protection component, and the fingerprint chip periphery and the electrostatic
The first end of guard assembly is contacted firmly；
Second end of the electrostatic protection component is connected with the circuit main board, for anti-with the electrostatic in the fingerprint chip
By the electrostatic of the fingerprint chip by the ground terminal ground that is set on the circuit main board when first end of protecting assembly is electrically connected
Electric discharge.
2. the electronic equipment as shown in claim 1, it is characterised in that the first end of the electrostatic protection component is metal elastic
Silk, the shape of the metal elater matches with the fingerprint chip, and the metal elater is surrounded or semi-surrounding institute entirely
State fingerprint chip.
3. the electronic equipment as shown in claim 2, it is characterised in that the second end of the electrostatic protection component is metal elastic
Piece；
The first end of the metal clips is contacted firmly with the metal elater, the second end of the metal clips and the circuit master
Leakage copper region on plate contacts firmly.
4. electronic equipment as stated in claim 3, it is characterised in that the second end of the metal clips is fixed by fastener
On the circuit main board.
5. the electronic equipment as shown in claim 2, it is characterised in that the second end of the electrostatic protection component is wire；
The first end of the wire makes electrical contact with the metal elater, and the second end of the wire connects with the circuit main board electricity
Touch.
6. the electronic equipment as shown in claim 2, it is characterised in that also include：Side housing；
The fingerprint chip is embedded on the side housing of the electronic equipment.
7. electronic equipment as stated in claim 5, it is characterised in that the material of the side housing is plastic material.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201710208669.3A CN106850900A (en) | 2017-03-31 | 2017-03-31 | A kind of electronic equipment |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201710208669.3A CN106850900A (en) | 2017-03-31 | 2017-03-31 | A kind of electronic equipment |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN106850900A true CN106850900A (en) | 2017-06-13 |
Family
ID=59141761
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201710208669.3A Pending CN106850900A (en) | 2017-03-31 | 2017-03-31 | A kind of electronic equipment |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN106850900A (en) |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107221765A (en) * | 2017-06-23 | 2017-09-29 | 上海传英信息技术有限公司 | Electronic component ground structure |
| CN107506757A (en) * | 2017-09-30 | 2017-12-22 | 努比亚技术有限公司 | A kind of lateral fingerprint module and the mobile terminal with lateral fingerprint module |
| WO2020113510A1 (en) * | 2018-12-06 | 2020-06-11 | 深圳市彩源光电有限公司 | Driving recorder |
| CN111988055A (en) * | 2019-05-21 | 2020-11-24 | Oppo广东移动通信有限公司 | Card tray assembly and mobile terminal |
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|---|---|---|---|---|
| US20070001249A1 (en) * | 2005-06-29 | 2007-01-04 | Lighttuning Tech. Inc. | Structure of sweep-type fingerprint sensing chip capable of resisting electrostatic discharge (ESD) and method of fabricating the same |
| US20090039449A1 (en) * | 2007-08-10 | 2009-02-12 | Egis Technology Inc. | Fingerprint sensing device having flexible printed circuit board serving as signal transmission structure and the method of manufacturing the same |
| CN203930882U (en) * | 2014-07-02 | 2014-11-05 | 南昌欧菲生物识别技术有限公司 | Fingerprint recognition detection components and electronic installation thereof |
| CN105428339A (en) * | 2015-12-01 | 2016-03-23 | 华天科技（西安）有限公司 | Antistatic fingerprint sensor chip packaging structure and manufacturing method |
| CN205621016U (en) * | 2016-01-29 | 2016-10-05 | 上海与德通讯技术有限公司 | Electronic equipment and fingerprint module thereof |
| CN106455386A (en) * | 2016-10-17 | 2017-02-22 | 青岛海信移动通信技术股份有限公司 | Mobile terminal device |
| CN106445218A (en) * | 2015-08-06 | 2017-02-22 | 义隆电子股份有限公司 | Touch control panel and circuit board thereof |
-
2017
- 2017-03-31 CN CN201710208669.3A patent/CN106850900A/en active Pending
Patent Citations (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20070001249A1 (en) * | 2005-06-29 | 2007-01-04 | Lighttuning Tech. Inc. | Structure of sweep-type fingerprint sensing chip capable of resisting electrostatic discharge (ESD) and method of fabricating the same |
| US20090039449A1 (en) * | 2007-08-10 | 2009-02-12 | Egis Technology Inc. | Fingerprint sensing device having flexible printed circuit board serving as signal transmission structure and the method of manufacturing the same |
| CN203930882U (en) * | 2014-07-02 | 2014-11-05 | 南昌欧菲生物识别技术有限公司 | Fingerprint recognition detection components and electronic installation thereof |
| CN106445218A (en) * | 2015-08-06 | 2017-02-22 | 义隆电子股份有限公司 | Touch control panel and circuit board thereof |
| CN105428339A (en) * | 2015-12-01 | 2016-03-23 | 华天科技（西安）有限公司 | Antistatic fingerprint sensor chip packaging structure and manufacturing method |
| CN205621016U (en) * | 2016-01-29 | 2016-10-05 | 上海与德通讯技术有限公司 | Electronic equipment and fingerprint module thereof |
| CN106455386A (en) * | 2016-10-17 | 2017-02-22 | 青岛海信移动通信技术股份有限公司 | Mobile terminal device |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107221765A (en) * | 2017-06-23 | 2017-09-29 | 上海传英信息技术有限公司 | Electronic component ground structure |
| CN107506757A (en) * | 2017-09-30 | 2017-12-22 | 努比亚技术有限公司 | A kind of lateral fingerprint module and the mobile terminal with lateral fingerprint module |
| WO2020113510A1 (en) * | 2018-12-06 | 2020-06-11 | 深圳市彩源光电有限公司 | Driving recorder |
| CN111988055A (en) * | 2019-05-21 | 2020-11-24 | Oppo广东移动通信有限公司 | Card tray assembly and mobile terminal |
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| Date | Code | Title | Description |
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| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| RJ01 | Rejection of invention patent application after publication | ||
| RJ01 | Rejection of invention patent application after publication |
Application publication date: 20170613 |