CN106848095A - Organic electroluminescent display panel, preparation method thereof and electronic equipment - Google Patents
Organic electroluminescent display panel, preparation method thereof and electronic equipment Download PDFInfo
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K50/00—Organic light-emitting devices
- H10K50/80—Constructional details
- H10K50/85—Arrangements for extracting light from the devices
- H10K50/856—Arrangements for extracting light from the devices comprising reflective means
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K50/00—Organic light-emitting devices
- H10K50/80—Constructional details
- H10K50/86—Arrangements for improving contrast, e.g. preventing reflection of ambient light
- H10K50/865—Arrangements for improving contrast, e.g. preventing reflection of ambient light comprising light absorbing layers, e.g. light-blocking layers
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
- H10K59/10—OLED displays
- H10K59/12—Active-matrix OLED [AMOLED] displays
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
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- Electroluminescent Light Sources (AREA)
- Devices For Indicating Variable Information By Combining Individual Elements (AREA)
Abstract
The invention discloses an organic electroluminescent display panel, comprising: an array substrate; an anode layer disposed on the array substrate; the pixel definition layer is positioned on one side of the anode layer, which is far away from the substrate, and an opening area of each pixel is arranged on the pixel definition layer; a cathode layer; an organic light emitting function layer disposed between the anode layer and the cathode layer and at least located in the opening region; and a reflecting layer is arranged between the pixel defining layer and the attaching wall of the organic light-emitting functional layer. The invention improves the light extraction rate of the organic light-emitting functional layer of the organic light-emitting display.
Description
Technical field
The present invention relates to the technical field of display panel, more particularly, to a kind of organic EL display panel and
Its preparation method and electronic equipment.
Background technology
Organic elctroluminescent device (Organic Electroluminescence Display, OLED) and tradition
Liquid crystal display device (Liquid Crystal Display, LCD) display mode it is different, without backlight, with spontaneous
The characteristic of light, it is luminous by these organic materials when there is electric current to pass through using very thin coating of organic material.Relative to
Traditional LCD, OLED are obtained using more frivolous material so that OLED display panel can be made lighter and thinner, and reach
Visible angle is bigger, can save significantly on the effect of electric energy；Pursue high-quality visual enjoyment today, OLED gradually into
It is the main flow of display field.
ORGANIC ELECTROLUMINESCENCE DISPLAYS technology is the panel display technologies of great development prospect generally acknowledged at present, and it has raw material to adopt
With organic matter, material selection range is wide, is capable of achieving any color from blue light to feux rouges and shows；Luminosity is high, all solid state
It is actively luminous；Driving voltage is low；Visual angle is wide, can be to 160 degree；Fast response time, is 1000 times of liquid crystal display；Ultra-thin, energy
Consume low many advantages.
When OLED works, the optional position of hole and electronics inside organic light emitting material completes electroluminescent and electricity
There is randomness in photoluminescence angle, and because pixel defining layer and support column are generally transparent material, the transmitance to lateral light is high, therefore
Light is escaped or absorbed phenomenon via pixel defining layer in there is OLED, reduces the light extraction efficiency of organic luminescent device.
Therefore it provides a kind of organic EL display panel of raising machine light emitting functional layer light extraction efficiency be this area urgently
Problem to be solved.
The content of the invention
In view of this, the invention provides a kind of organic EL display panel and preparation method thereof and include this and have
, there is light warp in the organic EL display panel for solving prior art in the electronic equipment of organic electro luminescent display panel
Escaped by pixel defining layer or absorbed phenomenon, reduce the technical problem of the light extraction efficiency of organic luminescent device.
In order to solve the above-mentioned technical problem, the present invention proposes a kind of organic EL display panel, including：
Array base palte；
Anode layer, is arranged on the array base palte；
Pixel defining layer, on the side positioned at the anode layer away from the substrate, and sets in the pixel defining layer
It is equipped with the open region of each pixel；
Cathode layer；
Organic luminescence function layer, is arranged between the anode layer and cathode layer, and be located at least in the open region；
Reflecting layer is provided between the pixel defining layer and the wall of fitting of organic luminescence function layer.
On the other hand, the present invention also provides a kind of preparation method of organic EL display panel, including：Array is provided
Substrate, anode layer is prepared on the array base palte；
Pixel defining layer is prepared away from the side of the substrate in the anode layer, and is formed in the pixel defining layer
The open region of each pixel；
Reflecting layer is formed between the pixel defining layer and the wall of fitting of organic luminescence function layer；
In the anode layer organic luminescence function layer, and organic luminescence function layer are prepared away from the side of the substrate
It is located at least in the open region；
In the pixel defining layer and organic luminescence function layer cathode layer is prepared away from the side of the substrate.
The present invention also provides a kind of electronic equipment, and the electronic equipment includes above-mentioned organic EL display panel.
Compared with prior art, organic EL display panel of the invention and preparation method thereof and electronic equipment, it is real
Following beneficial effect is showed：
(1) organic EL display panel of the present invention and preparation method thereof and electronic equipment, it is fixed in the pixel
Reflecting layer is set between the wall of fitting of adopted layer and organic luminescence function layer, it is to avoid light is escaped via pixel defining layer in OLED
Or absorbed phenomenon, improve the light emission rate of OLED organic luminescence function layer.
(2) organic EL display panel of the present invention and preparation method thereof and electronic equipment, it is fixed in the pixel
Reflecting layer is set between adopted layer and the wall of fitting of organic luminescence function layer, the light of directive pixel defining layer in OLED is reflected back
Come, improve the utilization of light, so as to reduce the power consumption of OLED organic luminescent devices, and then extend OLED organic luminescent devices
Life-span.
(3) organic EL display panel of the present invention and preparation method thereof and electronic equipment, in the pixel of OLED
Definition layer and support column top set light-absorbing layer, and the emergent light and outside for being all absorbed into pixel defining layer enter pixel
The light in definition layer region, improves the color displacement phenomenon in view directions.
Certainly, implement any product of the invention must not specific needs reach all the above technique effect simultaneously.
By referring to the drawings to the detailed description of exemplary embodiment of the invention, further feature of the invention and its
Advantage will be made apparent from.
Brief description of the drawings
The accompanying drawing for being combined in the description and constituting a part for specification shows embodiments of the invention, and even
It is used to explain principle of the invention together with its explanation.
Fig. 1 is the structural representation of organic EL display panel in the prior art；
Fig. 2 is simplified structural representation when OLED works in the prior art；
Fig. 3 is a kind of structural representation of organic EL display panel of offer in the embodiment of the present invention；
Fig. 4 is the structural representation of another organic EL display panel of offer in the embodiment of the present invention；
Fig. 5 is the structural representation of another organic EL display panel of offer in the embodiment of the present invention；
Fig. 6 is the structural representation of another organic EL display panel of offer in the embodiment of the present invention；
Fig. 7 is the structural representation of a kind of optional organic EL display panel of offer in the embodiment of the present invention；
Fig. 8 is the structural representation of another optional organic EL display panel of offer in the embodiment of the present invention；
Fig. 9 is the structural representation of another optional organic EL display panel of offer in the embodiment of the present invention；
Figure 10 is that a kind of organic EL display panel of offer in the embodiment of the present invention is applied in electronic equipment
Structural representation；
Figure 11 is the schematic flow sheet of the preparation method of the organic EL display panel of offer in the embodiment of the present invention.
Specific embodiment
Describe various exemplary embodiments of the invention in detail now with reference to accompanying drawing.It should be noted that：Unless had in addition
Body illustrates that the part and the positioned opposite of step, numerical expression and numerical value for otherwise illustrating in these embodiments do not limit this
The scope of invention.
The description only actually at least one exemplary embodiment is illustrative below, never as to the present invention
And its any limitation applied or use.
May be not discussed in detail for technology, method and apparatus known to person of ordinary skill in the relevant, but suitable
In the case of, the technology, method and apparatus should be considered as a part for specification.
In all examples shown here and discussion, any occurrence should be construed as merely exemplary, without
It is as limitation.Therefore, other examples of exemplary embodiment can have different values.
It should be noted that：Similar label and letter represents similar terms in following accompanying drawing, therefore, once a certain Xiang Yi
It is defined in individual accompanying drawing, then it need not be further discussed in subsequent accompanying drawing.
It is as shown in Figure 1 a kind of structural representation of oled panel in the prior art.Oled panel shown in Fig. 1 includes：
Thin film transistor (TFT) film layer (TFT layer) 101, thin film transistor (TFT) film layer 101 is used to set the thin film transistor (TFT) with switching function；If
Put the passivation layer 102 in thin film transistor (TFT) film layer 101；The pixel defining layer 103 on passivation layer 102 is formed at, pixel is fixed
Adopted layer 103 limits the open region 104 of multiple pixels；Organic luminescence function layer 105 in open region 104, wherein, it is organic
Light emitting functional layer 105 includes anode layer 151, cathode layer 152 and the organic hair being formed between anode layer 151 and cathode layer 152
Optical material layer 153, is provided with hole transmission layer 154, in cathode layer 152 between anode layer 151 and organic light emitting material 153
Electron transfer layer 155 is provided between organic light emitting material 153.The anode of the organic luminescent device layer 105 of adjacent pixel
Via 106 is provided between layer 151.
Oled panel operation principle in the prior art is described below below.As shown in Fig. 2 being OLED works in the prior art
Simplified structural representation when making, the side away from anode layer 152 in the pixel defining layer 103 of OLED forms support column
107, the covering of cathode layer 152 organic light emitting material 153, pixel defining layer 103 and support column 107.When OLED works, in anode
Layer 151 and cathode layer 152 apply certain voltage respectively, hole are injected to hole transmission layer 154 from anode layer 151, from negative electrode
Layer 152 injects electrons into electron transfer layer 155, and hole and electronics are migrated to organic light emitting material 153 respectively, and in organic hair
Meet to form exciton in optical material layer 153, exciton excites the light emitting molecule of organic light emitting material 153 to send visible ray.
OLED work when, hole and electronics organic light emitting material 153 inside optional position completion electroluminescent and
There is randomness in electroluminescent angle, and because pixel defining layer 103 and support column 107 are generally transparent material, to the saturating of lateral light
Cross rate high, therefore there is light in OLED and escaped via pixel defining layer 103 or absorbed phenomenon, reduce organic luminescent device
Light extraction efficiency.Based on above technical problem, this application provides solution below.
As shown in figure 3, by the present embodiment provides a kind of structural representation of organic EL display panel, this is organic
Electroluminescence display panel includes：Array base palte 301, pixel defining layer 302, pixel region 303.
Wherein, array base palte 301 includes：The circuit substrate of organic EL display panel, thin film transistor (TFT) film layer and
Passivation layer, thin film transistor (TFT) film layer is used to set the thin film transistor (TFT) with switching function.Picture is provided with array base palte 301
Plain definition layer 302, pixel defining layer 302 limits multiple pixel regions 303, and alternatively, pixel defining layer 302 limits multiple
The open region 304 of groove-like, it is alternatively possible to the pixel region limited in pixel defining layer using etching method or laser irradiation
The open region 304 of groove-like is formed, etching method can be dry etching or wet etching, and laser irradiation can be laser burns
Etc. method.
Organic luminous layer 305 is set in open region 304 and forms pixel region 303.Organic luminous layer 305 includes anode
Layer 351, cathode layer 352 and 352 and the layer of the organic luminescence function between anode layer 351 and cathode layer 352 353.Pixel
The anode layer 351 of organic luminous layer 305 is located on array base palte 301, and via 307 is provided between adjacent anode layer 351, each
The anode layer 351 of pixel region, cathode layer 352 can be electrically connected by the via 307 with the circuit in array base palte 301.It is located at
Pixel region 303 can be red pixel area, blue pixel area or green pixel area, and pixel in open region 304
Region is into array arrangement.
In a specific example, the bottom land of the open region 304 of groove-like may be located in pixel defining layer 302, another
In one specific example, the bottom land of the open region 304 of groove-like may be located at pixel defining layer 302 and connect with array base palte 301
Tactile position.The bottom land of the groove of open region 304 is deeper, and the thickness of organic luminous layer 305 for being arranged on open region 304 is bigger, organic
Resistance in luminescent layer 305 is bigger, can weaken the transfer ability of hole/electronics in organic luminous layer 305, can so weaken
Even suppress generation between the pixel region lighted and the pixel region that should not be lighted in organic EL display panel
Leakage current, such that it is able to make the pixel region that light keep black state, and then can make display panel improve display picture
Quality.
Wherein, in some optional embodiments, the cathode layer 352 set in organic EL display panel has
Translucency, is provided with the reflecting layer for reflection light on array base palte 301, the reflecting layer be arranged at organic luminescence function layer with
Between array base palte, the reflecting layer is used to for the light of organic luminescence function layer production to be reflected back organic EL display panel
Microcavity；In another optional embodiment, organic EL display panel can also be：Anode layer 351 has translucency,
Reflecting layer is set at cathode layer 352 or cathode layer is constituted using reflecting material so that go out with reflection function in cathode layer, use
In the microcavity that the light of organic luminescence function layer production is reflected back organic EL display panel.
In open region 304, organic luminous layer 305 is fitted with pixel defining layer 302, pixel defining layer 302 with it is organic
Reflecting layer 306 is provided between the laminating wall of luminescent layer 305.In some optional embodiments, reflecting layer 306 is arranged on organic
Between light emitting functional layer 353 and the wall of fitting of pixel defining layer 302.In other optional embodiments, reflecting layer 306 is located at
Between organic luminous layer 305 and the wall of fitting of pixel defining layer 302, and the laminating wall of pixel defining layer 302 is completely covered, so
Can guarantee that organic luminous layer 305 is all reflected back toward organic electroluminescent from the emergent light of all directions directive pixel defining layer 302
The microcavity of display panel.
In some optional embodiments, the thickness in reflecting layer 306 is 0.2 micron to 1 micron.Inventor sends out by research
It is existing, if the thickness in reflecting layer 306 is less than 0.2 micron, the difficulty of manufacture craft can be increased, fully reflective organic hair can't be played
Light functional layer 353 sends the effect of light；If the thickness in reflecting layer 306 is more than 1 micron, can not only increase the cost of manufacture, can also
Have influence on the illumination effect of organic luminous layer 305.The thickness to reflecting layer is not limited in the present embodiment, the thickness in reflecting layer
0.2 micron is might be less that or more than 1 micron, in organic EL display panel, as long as can be to directive pixel defining layer
The thickness design that emergent light plays the reflecting layer of reflex all should be in the range of the present embodiment.
And select to set the reflecting layer of suitable thickness between organic luminous layer and pixel defining layer in the present embodiment, not
On the premise of influence organic luminous layer luminous efficiency, the emergent light that will be lost originally in pixel defining layer is effectively utilized, carried
The luminous efficiency of organic EL display panel is risen.
In organic EL display panel, the organic luminescence function layer 353 of each pixel region is clipped in anode layer 351
And between cathode layer 352, by anode layer 351 and the injected holes of cathode layer 352 and electronics, in organic luminescence function layer 353
Inside completes electroluminescent.When organic EL display panel works, the light that organic luminescence function layer 353 sends is random
Directive all directions, and its directive pixel defining layer 302 sends light, being reflected back organic electroluminescent via reflecting layer 306 shows
Show the microcavity of panel so that the part reflected light can also be utilized by organic EL display panel, relative to the part
Emergent light is lost through pixel defining layer, and the setting in reflecting layer of the invention improves organic luminescence function layer and produces light
Utilization rate.
In some optional embodiments, the reflection between fit wall of the pixel defining layer 302 with organic luminous layer 305
306 light reflecting material by insulating of layer is prepared from.In organic luminous layer 305, organic luminescence function layer 353 is clipped in anode layer
Between 351 and cathode layer 352, and reflecting layer 306 can touch anode layer 351, cathode layer 352 and organic luminescence function layer 353,
If reflecting layer 306 is conductive material, may result in connection between anode layer 351 and cathode layer 352 and cause short circuit.
In some optional embodiments, reflecting layer 306 can be in pixel defining layer 302 and the patch of organic luminous layer 305
Coating or depositing reflective material are formed between combining harmoniously.Constitute reflecting layer 306 insulation light reflecting material can be silica,
One kind in silicon nitride, silicon oxynitride；In other optional embodiments, the light reflecting material of the insulation in reflecting layer 306 is constituted
Material can be two kinds of compositions in silica, silicon nitride, silicon oxynitride；In other optional embodiment, reflection is constituted
The light reflecting material of the insulation of layer 306 is made up of silica, silicon nitride, silicon oxynitride.Reflecting layer 406 is located at anode layer
Between 351 and cathode layer 352, the light reflecting material of insulation prepares the reflecting layer 306 with insulating properties can be prevented
The phenomenon of short circuit.Silica, silicon nitride, silicon oxynitride are all common materials, gather convenient, with low cost, manufacture craft
Simply, and light reflective properties are good, thus use silica, silicon nitride, silicon oxynitride or its combination as composition reflecting layer
Light reflecting material, both can guarantee that the good reflectivity in reflecting layer, also reduce cost of manufacture, be conducive to batch production.
Produce emergent light warp in organic EL display panel in organic luminescence function layer in the prior art as shown in Figure 2
Lost by pixel defining layer, in fig. 2 the scattered spherical luminous side for embodying luminous point in organic luminescence function layer 105
To it is the light direction of propagation that arrow is signified.When organic luminescent device works, organic luminescence function layer both sides are injected separately into electronics
And hole, and portion optional position completes electroluminescent in the inner.There is randomness, and pixel defining layer and branch in electroluminescent angle
Dagger is generally transparent material, therefore there is light and escape or absorbed via pixel defining layer, so as to reduce organic luminescent device
Light extraction efficiency.
In the present embodiment organic EL display panel, as shown in figure 3, in the pixel defining layer 302 and organic hair
Reflecting layer 306 between the laminating wall of light functional layer 305, can reflect by the light of organic luminescence function layer directive pixel defining layer
Line, it is to avoid the light is through pixel defining layer and light occurs via pixel defining layer and escapes or absorbed phenomenon.
As shown in figure 4, the structural representation of another organic EL display panel provided for the present embodiment, this has
Organic electro luminescent display panel includes：Array base palte 401, pixel defining layer 402, organic luminous layer 403 and support column 404.
In some optional embodiments, array base palte 401 includes circuit substrate, thin film transistor (TFT) film layer and passivation
Layer, pixel defining layer 402 is located on array base palte 401, and pixel defining layer 402 limits multiple open regions, and open region is pixel
The groove that definition layer 402 is limited.Organic luminous layer 403 is located in open region, and organic luminous layer 403 includes：Anode layer
431st, cathode layer 432 and organic luminescence function layer 433, organic luminescence function layer 433 be located at anode layer 431 and cathode layer 432 it
Between.Anode layer 431 is located on array base palte 401, and via 406, the sun of each pixel region are provided between adjacent anode layer 431
Pole layer 351, cathode layer 352 can be electrically connected by the via 406 with the circuit in array base palte 401.
Reflecting layer 405 is set between wall of fitting of the pixel defining layer 402 with organic luminous layer 403, it is optional at some
In embodiment, reflecting layer 405 is arranged between organic luminescence function layer 433 and the wall of fitting of pixel defining layer 402.At other
In optional embodiment, reflecting layer 405 is located between organic luminous layer 403 and the wall of fitting of pixel defining layer 402, and is covered completely
The laminating wall of lid pixel defining layer 402, so can guarantee that organic luminous layer 403 from all directions directive pixel defining layer 402
Emergent light is all reflected back toward the microcavity of organic EL display panel.
Support column 404 is located in pixel defining layer 402, plays carrying between two-layer substrate, and support column 404 four
Week is pixel region.The section contacted with pixel defining layer 402 on support column 404 can be more than in pixel defining layer 402 and support
The section that post 404 is in contact, the section contacted with pixel defining layer 402 on support column 404 might be less that or fixed equal to pixel
The section being in contact with support column 404 on adopted layer 402.Usually, support column 404 and pixel defining layer 402 are adopted by printing opacity material
Material is constituted, to prevent from having influence on the light extraction of organic EL display panel.
First absorbed layer 407, pixel defining layer 402 are set between the binding face of pixel defining layer 402 and support column 404
With the exiting surface that the binding face of support column 404 is pixel defining layer.Absorbed layer 407 covers the exiting surface of pixel defining layer 402,
The emergent light and the outside light for entering the region of pixel defining layer 402 of pixel defining layer 402 are absorbed into by the first absorbed layer 407
Line, prevents the emergent light of the different colours sent in organic luminous layer from being projected via the region of pixel defining layer 402, and then can drop
The problem of the light color skew in low view directions.
In some optional embodiments, the thickness of the first absorbed layer 407 is 0.2 micron to 1 micron.Inventor is by grinding
Study carefully discovery, if the thickness of the first absorbed layer 407 is less than 0.2 micron, cannot play and fully absorb light in pixel defining layer 402
Effect；If the thickness of the first absorbed layer 407 is more than 1 micron, can not only increase the cost of manufacture, also affect pixel definition
Stability between layer 402 and support column 404.And select to be set between organic luminous layer and pixel defining layer in the present embodiment
The absorbed layer of suitable thickness, is ensureing not influenceing between pixel defining layer and support column on the premise of stability, additionally it is possible to completely
Light in pixel defining layer 402 is absorbed, the problem for avoiding the light color in view directions from offseting is played.
In some optional embodiments, the first absorbed layer 407 can be applied on the exiting surface of pixel defining layer 402
The modes such as cloth, deposition light absorbing material are formed, and the light absorbing material for being used can be black light-absorbing resin material, resin material
With preferable absorptivity, such as epoxy resin etc. can greatly absorb light, prevent the light in pixel defining layer from throwing
It is shot out, and can be further ensured to light in pixel defining layer using the absorbed layer that the extinction resin material of black is constituted
Fully absorb.The extinction resin material of the black described in the present embodiment also include light-absorbing resin material and other materials or
The composition material of the composition of particle, such as light-absorbing resin and light absorbs particulate, by extinction resin and extinction particulate
Coordinate the light absorbed from all directions directive absorbed layer, it is ensured that fully absorb the light in pixel defining layer, lift Organic Electricity
The luminescent quality of photoluminescence display panel.
As shown in figure 5, in some optional embodiments, between the binding face of pixel defining layer 402 and support column 404
First absorbed layer 407 is set, and pixel defining layer 402 is the exiting surface of pixel defining layer with the binding face of support column 404, if nothing
The setting of absorbed layer, the light in pixel defining layer can be projected away by the exiting surface of the pixel defining layer.Also, this implementation
The second absorbed layer 408 is provided with the exiting surface of support column 404 in example, wherein, support column 404 does not connect with pixel defining layer 402
Each surface of other tactile is exiting surface.Usually, support column 404 is made up of transparent material, not only the light of pixel defining layer
Support column can be projected into, the emergent light of light emitting pixel can be also entered into support column, if be not acted upon to these light,
Influence whether the luminous mass of luminescent panel.
By the second absorbed layer 408 being arranged on support column 404 each exiting surface, can not only absorb inside support column
Light, the light outside from support column can also be absorbed, it is to avoid these light via after support column to each luminous picture
The emergent light of element is impacted.
In some optional embodiments, the thickness of the second absorbed layer 408 is 0.2 micron to 1 micron.Inventor is by grinding
Study carefully discovery, if the thickness of the second absorbed layer 408 is less than 0.2 micron, the difficulty of preparation technology can be increased, it is impossible to play and fully absorb
The effect of light in support column 404；If the second absorbed layer 408 is more than 1 micron, can not only increase the cost of manufacture, can also influence
Stability between support column 404 and its upper substrate.And select to set suitable on the exiting surface of support column in the present embodiment
The absorbed layer of thickness, is ensureing not influenceing between substrate and support column on the premise of stability, additionally it is possible to fully absorb support column
Light in 404, plays the problem for avoiding the light color in view directions from offseting.
In some optional embodiments, the second absorbed layer 408 can be coated with the exiting surface of support column 404, sunk
The modes such as product light absorbing material are formed, and the light absorbing material for being used can be black light-absorbing resin material, and resin material has
Preferable absorptivity, such as epoxy resin etc., can greatly absorb light, prevent the light in pixel defining layer from projecting
Go, and using black extinction resin material constitute absorbed layer can further ensure in pixel defining layer light it is complete
Hypersorption.The extinction resin material of the black described in the present embodiment also includes light-absorbing resin material and other materials or particle
Composition, the composition material of such as light-absorbing resin and light absorbs particulate, by the cooperation of extinction resin and extinction particulate
Absorb the light from all directions directive absorbed layer, it is ensured that fully absorb the light in pixel defining layer, lifting organic electroluminescence hair
The luminescent quality of light display panel.
Wherein, the second absorbed layer 408 can use with the identical material structure of the first absorbed layer 407, use identical thick
Degree, it is also possible to which material structure and thickness that the second absorbed layer 408 and the first absorbed layer 407 are differed are set according to actual conditions,
As long as can guarantee that the first absorbed layer 407 and second of the interference light fully absorbed in pixel defining layer 402 and support column 404 is inhaled
Receiving the scheme of layer 408 should all belong to the scope of the present embodiment.By the setting of the first absorbed layer 407 and the second absorbed layer 408,
The light that ensure that each open region institute outgoing is all in this open region produced by pixel, will not be because of via pixel definition
A part of light of outgoing causes the skew in view directions after layer or support column, and the light color of different colored pixels outgoing is not
It is identical, in this way, it also avoid the color displacement phenomenon in view directions.
As shown in fig. 6, being the structural representation of the another optional organic EL display panel of offer in the present embodiment
Figure, pixel defining layer 402 fits with support column 404, is not set between the binding face of pixel defining layer 402 and support column 404
Absorbed layer is put, and is removed near the surface of substrate on the exiting surface and pixel defining layer 402 of support column 404 and is provided with reflection
Absorbed layer 601 is set on the surface outside layer, to ensure to fully absorb the projection light in support column and pixel defining layer.
Because absorbed layer is set between the binding face in pixel defining layer 402 and support column 404 not only to be needed to expend material, also
Increase manufacture craft, greatly improve manufacturing cost, also, for some pixel defining layers 402 and the light of the entirety of support column 404
The little scheme of projection distance, it is not required that set two-layer absorbed layer, in view of this, only support column 404 exiting surface and
Except the side that absorbed layer 601 is set on the surface near the surface of substrate and in addition to being provided with reflecting layer in pixel defining layer 402
Case can ensure to absorb in pixel defining layer 402 and support column 404 on the premise of projection light, save manufacturing cost.
As shown in fig. 7, being the structural representation of the another optional organic EL display panel of offer in the present embodiment
Figure, the organic EL display panel includes：Array base palte 401, pixel defining layer 402, organic luminous layer 403 and support column
404。
In some optional embodiments, array base palte 401 includes circuit substrate, thin film transistor (TFT) film layer and passivation
Layer, pixel defining layer 402 is located on array base palte 401, and pixel defining layer 402 limits multiple open regions, and open region is pixel
The groove that definition layer 402 is limited.Organic luminous layer 403 is located in open region, and organic luminous layer 403 includes：Anode layer
431st, cathode layer 432 and organic luminescence function layer 433, organic luminescence function layer 433 be located at anode layer 431 and cathode layer 432 it
Between.Anode layer 431 is located on array base palte 401, and via 406, the sun of each pixel region are provided between adjacent anode layer 431
Pole layer 351, cathode layer 352 can be electrically connected by the via 406 with the circuit in array base palte 401.
Reflecting layer 405 is set between wall of fitting of the pixel defining layer 402 with organic luminous layer 403, it is optional at some
In embodiment, reflecting layer 405 is arranged between organic luminescence function layer 433 and the wall of fitting of pixel defining layer 402.At other
In optional embodiment, reflecting layer 405 is located between organic luminous layer 403 and the wall of fitting of pixel defining layer 402, and is covered completely
The laminating wall of lid pixel defining layer 402, so can guarantee that organic luminous layer 403 from all directions directive pixel defining layer 402
Emergent light is all reflected back toward the microcavity of organic EL display panel.
Support column 404 is located in pixel defining layer 402, plays carrying between two-layer substrate, and support column 404 four
Week is pixel region.The section contacted with pixel defining layer 402 on support column 404 can be more than in pixel defining layer 402 and support
The section that post 404 is in contact, the section contacted with pixel defining layer 402 on support column 404 might be less that or fixed equal to pixel
The section being in contact with support column 404 on adopted layer 402.Usually, support column 404 and pixel defining layer 402 are adopted by printing opacity material
Material is constituted, to prevent from having influence on the light extraction of organic EL display panel.
In the present embodiment, support column 404 and pixel defining layer 402 are formed in one structure, and reflecting layer 405 is arranged on branch
Between wall of fitting of the dagger 404 with the entirety of pixel defining layer 402 with organic luminous layer 403.Again in support column 404 and pixel definition
Absorbed layer 701 is set on the exiting surface of 402 entirety of layer, it is whole with pixel defining layer 402 to absorb support column 404 by absorbed layer 406
The projection light in internal portion.If according under normal circumstances, manufacture support column 404 and pixel defining layer 402 are, it is necessary to using at least respectively
The technique of two steps, and the waste of manufacture material can be also caused in two step manufacturing processes.In the present embodiment using support column 404 with
Pixel defining layer 402 is integrally formed, can be supported the whole of post 404 and pixel defining layer 402 by the manufacturing process of a step
Body structure, it is ensured that while stability between support column 404 and pixel defining layer 402, also save manufacturing process, it is to avoid
The waste of manufacture material.The projection light of support column 404 and the whole interior of pixel defining layer 402 absorbs by absorbed layer 701 again,
Avoid the color displacement phenomenon in view directions.
Absorbed layer 701 can be coated with the exiting surface of support column 404 and the entirety of pixel defining layer 402, deposit light suction
Receive the modes such as material to be formed, the light absorbing material for being used can be black light-absorbing resin material, resin material has preferable
Absorptivity, such as epoxy resin etc., can greatly absorb light, prevent the light in pixel defining layer from projecting away, and
The absorbed layer constituted using the extinction resin material of black can further be ensured to light in pixel defining layer and support column
Fully absorb.
As shown in figure 8, being the structural representation of the another optional organic EL display panel of offer in the present embodiment
Figure, in the present embodiment, from unlike embodiment in Fig. 7, support column 404 and pixel defining layer 402 are by light absorbing material
Constitute, absorbed layer is or else separately provided in the exiting surface of support column 404 and pixel defining layer 402, by support column 404 and pixel
Definition layer 402 absorption effects of itself can just absorb the throw light inside support column 404 and pixel defining layer 402.In support
Setting absorbed layer again on post 404 and pixel defining layer 402 can undoubtedly increase organic EL display panel manufacturing technology steps,
No matter from material, or from the lifting of manufacturing equipment, the cost of manufacture can be all greatly increased.And directly using absorption material
Material constitutes support column 404 and pixel defining layer 402, saves the technique for setting absorbed layer, moreover it is possible to which the ability that is absorbed is uniform
Support column 404 and pixel defining layer 402, it also avoid absorbed layer and support column 404 or pixel defining layer 402 to a certain extent
Laminating problem between binding face, such as laminating gap, the problems such as be mixed into impurity, can guarantee that be evenly absorbed in support column 404 and
Projection light in the inside all directions of pixel defining layer 402, it is to avoid organic EL display panel occurs in view directions
Color displacement phenomenon.
As shown in figure 9, being the structural representation of the another optional organic EL display panel of offer in the present embodiment
Figure, and the various embodiments described above unlike, in the present embodiment support column 404 and pixel defining layer 402 by light absorbing material integrally
Shaping is obtained.
By the integrally formed support column 404 of light absorbing material and pixel defining layer 402, relative to the support column of substep shaping
404 and pixel defining layer 402, not only save the processing step of organic EL display panel, it is ensured that support column 404
With the homogeneity and stability of the internal structure of pixel defining layer 402, and then the hair of the organic EL display panel is improved
Light quality.To support column and pixel defining layer is manufactured separately, then prepare light-absorption layer on support column and pixel defining layer, it is necessary to
At least three manufacturing steps, and the integrally formed entirety that obtains of support column and pixel defining layer is had into extinction function, it is only necessary to one
Individual manufacturing step, so enormously simplify the manufacturing process of organic EL display panel, meanwhile, it is integrally formed and whole
Support column and pixel defining layer of the body all with extinction function are more beneficial for the absorption of light.
Organic EL display panel described in the present embodiment can be reflected by organic luminescence function layer by reflecting layer
The light of directive pixel defining layer, while being also possible to be absorbed into the emergent light of pixel defining layer and outside entrance by absorbed layer
The light in pixel defining layer region.
As shown in Figure 10, the organic EL display panel 1001 in above-mentioned alternative embodiment can apply to electronics and set
In standby 1000, these electronic equipments include：Display screen, mobile phone, computer, TV etc..
As shown in figure 11, be organic EL display panel described in the present embodiment a kind of optional preparation method flow
Schematic diagram.Method described in the present embodiment is used to prepare the organic EL display panel described in above-described embodiment.The party
Method comprises the following steps：
Step 1101, offer array base palte, prepare anode layer on array base palte.
The array base palte of the application can be obtained, or plastic base by inorganic material such as glass, quartz, the application
This is not limited.
Step 1102, prepare pixel defining layer, and the shape in pixel defining layer away from the side of the substrate in anode layer
Into the open region of each pixel.Luminous organic luminescence function layer can be provided in open region, it is preferable that pixel definition
Multiple spacers are provided with layer, the open region of multiple array arrangements is formed between spacer.
Step 1103, pixel defining layer and organic luminescence function layer wall of fitting between form reflecting layer.
In some optional implementations of the present embodiment, can be by pixel defining layer and organic luminescence function layer
Laminating wall between the mode such as coating, depositing reflective material form thickness and be 0.2 micron to 1 micron of reflecting layer, then etch institute
The reflecting layer of formation is patterned.In other optional embodiments, can also by mask pixel defining layer with have
Evaporation forms the reflecting layer that thickness is 0.2 micron to 1 micron between the laminating wall of machine light emitting functional layer.
Step 1104, anode layer away from the side of substrate prepare organic luminescence function layer, and organic luminescence function layer extremely
The open region is located at less.
Organic luminescence function layer can again be patterned using evaporation, inkjet printing, deposition, coating, deposition or after being coated with
Method is obtained.Alternatively, the upper surface of the upper surface less than or equal to pixel defining layer of organic luminescence function layer.
Step 1105, prepare cathode layer away from the side of the substrate in pixel defining layer and organic luminescence function layer.It is cloudy
Pole layer is covered on pixel defining layer and organic luminescence function layer.
In some optional embodiments, also include between step 1104 and step 1105：In the light extraction of pixel defining layer
Absorbed layer is formed on face.In the present embodiment, the preparation order to absorbed layer and organic luminescence function layer is not limited, Ke Yixian
Organic luminescence function layer is prepared, then prepares absorbed layer；Absorbed layer can also be first prepared, then prepares organic luminescence function layer.As long as
Can reach organic luminescence function layer be located at open region, absorbed layer be located at pixel defining layer exiting surface on preparation method all should
In the range of the present embodiment.
In some optional implementations of the present embodiment, the preparation of absorbed layer comprises the following steps：In pixel definition
Coating or deposition light absorbing material form a layer thickness and are 0.2 micron to 1 micron of absorbed layer on the exiting surface of layer, then etch institute
The absorbed layer of formation is patterned.In another optional implementation, by mask in the exiting surface in pixel defining layer
Upper evaporation forms the absorbed layer that thickness is 0.2 micron to 1 micron.
In another optional embodiment, also include between step 1103 and step 1104：In pixel defining layer away from sun
The side of pole layer prepares support column；And absorbed layer is formed on the exiting surface of pixel defining layer and support column, in the present embodiment,
Preparation order to reflecting layer and support column is not limited, and can first prepare reflecting layer, then prepare support column；Can also first prepare
Support column, then prepare reflecting layer.
In some optional implementations of the present embodiment, the preparation of absorbed layer comprises the following steps：In pixel definition
The modes such as the side (i.e. the exiting surface of pixel defining layer) being in contact with support column on layer is to be coated with, deposition light absorbing material are formed
A layer thickness is 0.2 micron to 1 micron of absorbed layer, then etches formed absorbed layer and be patterned；Support column away from
The modes such as each side of other of pixel defining layer (i.e. the exiting surface of support column) coating, deposition light absorbing material form a layer thickness and are
0.2 micron to 1 micron of absorbed layer, then etch formed absorbed layer and be patterned.In other optional implementations
In, by mask in pixel defining layer and the exiting surface of support column is deposited with the absorption to form that thickness is 0.2 micron to 1 micron
Layer.
Herein, support column can be obtained with pixel defining layer using identical material, it would however also be possible to employ the material of different materials
Material is obtained.In another optional embodiment, support column can be obtained with pixel defining layer using identical material is integrally formed,
Such as, using intermediate tone mask version by the integrally formed support column of light absorbent and pixel defining layer.Using intermediate tone mask version
The operation that technique in twice is completed can be merged into an operation by (Halftone Mask), and section eliminates one step from the process.In this way, contracting
The short production cycle, production efficiency is improve, reduce production cost.
In some optional implementations of the present embodiment, black light-absorbing is used when preparing pixel defining layer and support column
Resin material is integrally formed preparation, obtains support column and pixel defining layer integrative-structure with extinction function, is so just not required to
Individually light-absorption layer is prepared on support column and pixel defining layer.
The organic EL display panel of above example is illustrated with the situation of top emitting, in top emitting
In organic EL display panel, the exiting surface of pixel defining layer and support column is all the side away from array base palte, but
The organic EL display panel that the present invention is provided is not limited to the situation of top emitting, it is also possible to suitable for the feelings of bottom emitting
Condition, in the organic EL display panel of bottom emitting, the exiting surface of pixel defining layer and support column is all towards array base
The side of plate, accordingly, the light-absorption layer of the OLED display panel of bottom emitting structure is arranged on pixel defining layer and support column direction
The side of array base palte.Those skilled in that art are it should be understood that no matter the organic electroluminescent of top emitting or bottom emitting shows
Show panel, as long as the organic EL display panel for meeting reflecting layer and absorbed layer set-up mode in the present invention all should be in this hair
In bright scope.
By above-described embodiment, organic EL display panel of the invention and preparation method thereof and electronics set
It is standby, reach following beneficial effect：
(1) organic EL display panel of the present invention and preparation method thereof and electronic equipment, it is fixed in the pixel
Reflecting layer is set between the wall of fitting of adopted layer and organic luminescence function layer, it is to avoid light is escaped via pixel defining layer in OLED
Or absorbed phenomenon, improve the light emission rate of OLED organic luminescence function layer.
(2) organic EL display panel of the present invention and preparation method thereof and electronic equipment, it is fixed in the pixel
Reflecting layer is set between adopted layer and the wall of fitting of organic luminescence function layer, the light of directive pixel defining layer in OLED is reflected back
Come, improve the utilization of light, so as to reduce the power consumption of OLED organic luminescent devices, and then extend OLED organic luminescent devices
Life-span.
(3) organic EL display panel of the present invention and preparation method thereof and electronic equipment, in the pixel of OLED
Definition layer and support column top set light-absorbing layer, and the emergent light and outside for being all absorbed into pixel defining layer enter pixel
The light in definition layer region, improves the color displacement phenomenon in view directions.
It should be understood by those skilled in the art that, embodiments of the invention can be provided as method, device or computer program
Product.Therefore, the present invention can be using the reality in terms of complete hardware embodiment, complete software embodiment or combination software and hardware
Apply the form of example.
Although being described in detail to some specific embodiments of the invention by example, the skill of this area
Art personnel it should be understood that example above is merely to illustrate, rather than in order to limit the scope of the present invention.The skill of this area
Art personnel to above example it should be understood that can modify without departing from the scope and spirit of the present invention.This hair
Bright scope is defined by the following claims.
Claims (12)
1. a kind of organic EL display panel, it is characterised in that including：
Array base palte；
Anode layer, is arranged on the array base palte；
Pixel defining layer, on the side positioned at the anode layer away from the substrate, and is provided with the pixel defining layer
The open region of each pixel；
Cathode layer；
Organic luminescence function layer, is arranged between the anode layer and cathode layer, and be located at least in the open region；
Reflecting layer is provided between the pixel defining layer and the wall of fitting of organic luminescence function layer.
2. organic EL display panel according to claim 1, it is characterised in that in going out for the pixel defining layer
Absorbed layer is provided with smooth surface.
3. organic EL display panel according to claim 2, it is characterised in that also include：Support column, the branch
Dagger is located at the one side away from the anode layer in the pixel defining layer；
Absorbed layer is provided with the exiting surface of the support column.
4. organic EL display panel according to claim 3, it is characterised in that the support column and the pixel
Definition layer is prepared from by black light-absorbing resin material is integrally formed.
5. the organic EL display panel according to Claims 2 or 3, it is characterised in that the absorbed layer is by black
Extinction resin material is prepared from.
6. the organic EL display panel according to Claims 2 or 3, it is characterised in that the absorber thickness is
0.2 micron to 1 micron.
7. organic EL display panel according to claim 1, it is characterised in that the reflecting layer is by the light that insulate
Reflecting material is prepared from,
The light reflecting material of the insulation includes：One or more in silica, silicon nitride, silicon oxynitride.
8. organic EL display panel according to claim 1, it is characterised in that the reflector thickness is 0.2
Micron is to 1 micron.
9. a kind of preparation method of organic EL display panel, it is characterised in that including：Array base palte is provided, described
Anode layer is prepared on array base palte；
Pixel defining layer is prepared away from the side of the substrate in the anode layer, and each is formed in the pixel defining layer
The open region of pixel；
Reflecting layer is formed between the pixel defining layer and the wall of fitting of organic luminescence function layer；
Organic luminescence function layer is prepared away from the side of the substrate in the anode layer, and organic luminescence function layer is at least
Positioned at the open region；
In the pixel defining layer and organic luminescence function layer cathode layer is prepared away from the side of the substrate.
10. the preparation method of organic EL display panel according to claim 9, it is characterised in that described described
Before anode layer prepares organic luminescence function layer away from the side of the substrate, also include：
In the pixel defining layer support column is prepared away from the side of the anode layer；
Absorbed layer is formed on the exiting surface of the pixel defining layer and support column.
11. preparation methods according to claim 10, it is characterised in that described in the pixel defining layer and support column
Absorbed layer is formed on exiting surface to be included：Using black light-absorbing resin material, integrally formed to prepare the support column and the pixel fixed
Adopted layer.
12. a kind of electronic equipment, it is characterised in that the electronic equipment includes organic any one of claim 1 to 8
Electroluminescence display panel.
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| CN108493219A (en) * | 2018-03-30 | 2018-09-04 | 武汉华星光电技术有限公司 | Oled display panel and display device |
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| CN116437742A (en) * | 2023-05-12 | 2023-07-14 | 南京国兆光电科技有限公司 | Pixel definition layer structure of OLED display device and preparation method thereof |
| WO2024031670A1 (en) * | 2022-08-12 | 2024-02-15 | Intel Corporation | Power efficient micro-led architectures |
| US12150348B2 (en) | 2020-12-23 | 2024-11-19 | Boe Technology Group Co., Ltd. | Display substrate and preparation method thereof, and display apparatus |
Citations (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR20020049812A (en) * | 2000-12-20 | 2002-06-26 | 주식회사 현대 디스플레이 테크놀로지 | Double-sided electro-luminescent display and method for fabricating the same |
| US20040183436A1 (en) * | 2003-03-20 | 2004-09-23 | Masato Ito | Organic EL display device |
| KR20090065104A (en) * | 2007-12-17 | 2009-06-22 | 엘지디스플레이 주식회사 | Organic light emitting display device |
| CN104037357A (en) * | 2014-06-05 | 2014-09-10 | 京东方科技集团股份有限公司 | Organic light emitting display device and manufacturing method thereof |
| CN104078489A (en) * | 2014-06-11 | 2014-10-01 | 京东方科技集团股份有限公司 | Organic light emitting diode display panel and device |
| CN104681592A (en) * | 2014-12-23 | 2015-06-03 | 上海天马有机发光显示技术有限公司 | Display panel and manufacturing method thereof as well as display device |
| CN104979375A (en) * | 2015-05-28 | 2015-10-14 | 京东方科技集团股份有限公司 | Display substrate and manufacturing method therefor and display device |
| CN105118928A (en) * | 2015-07-29 | 2015-12-02 | 京东方科技集团股份有限公司 | Color film substrate, manufacturing method thereof, OLED display panel and display apparatus |
| CN105552249A (en) * | 2016-03-16 | 2016-05-04 | 京东方科技集团股份有限公司 | OLED display substrate, manufacturing method thereof and display device |
-
2017
- 2017-01-24 CN CN201710059694.XA patent/CN106848095A/en active Pending
Patent Citations (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR20020049812A (en) * | 2000-12-20 | 2002-06-26 | 주식회사 현대 디스플레이 테크놀로지 | Double-sided electro-luminescent display and method for fabricating the same |
| US20040183436A1 (en) * | 2003-03-20 | 2004-09-23 | Masato Ito | Organic EL display device |
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