CN106847864A - A kind of narrow frame touch-control display panel and display device and preparation method thereof - Google Patents
A kind of narrow frame touch-control display panel and display device and preparation method thereof Download PDFInfo
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- CN106847864A CN106847864A CN201710014163.9A CN201710014163A CN106847864A CN 106847864 A CN106847864 A CN 106847864A CN 201710014163 A CN201710014163 A CN 201710014163A CN 106847864 A CN106847864 A CN 106847864A
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
- H10K59/10—OLED displays
- H10K59/12—Active-matrix OLED [AMOLED] displays
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- G—PHYSICS
- G09—EDUCATION; CRYPTOGRAPHY; DISPLAY; ADVERTISING; SEALS
- G09F—DISPLAYING; ADVERTISING; SIGNS; LABELS OR NAME-PLATES; SEALS
- G09F9/00—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements
- G09F9/30—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements in which the desired character or characters are formed by combining individual elements
- G09F9/33—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements in which the desired character or characters are formed by combining individual elements being semiconductor devices, e.g. diodes
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- G—PHYSICS
- G09—EDUCATION; CRYPTOGRAPHY; DISPLAY; ADVERTISING; SEALS
- G09G—ARRANGEMENTS OR CIRCUITS FOR CONTROL OF INDICATING DEVICES USING STATIC MEANS TO PRESENT VARIABLE INFORMATION
- G09G3/00—Control arrangements or circuits, of interest only in connection with visual indicators other than cathode-ray tubes
- G09G3/20—Control arrangements or circuits, of interest only in connection with visual indicators other than cathode-ray tubes for presentation of an assembly of a number of characters, e.g. a page, by composing the assembly by combination of individual elements arranged in a matrix no fixed position being assigned to or needed to be assigned to the individual characters or partial characters
- G09G3/22—Control arrangements or circuits, of interest only in connection with visual indicators other than cathode-ray tubes for presentation of an assembly of a number of characters, e.g. a page, by composing the assembly by combination of individual elements arranged in a matrix no fixed position being assigned to or needed to be assigned to the individual characters or partial characters using controlled light sources
- G09G3/30—Control arrangements or circuits, of interest only in connection with visual indicators other than cathode-ray tubes for presentation of an assembly of a number of characters, e.g. a page, by composing the assembly by combination of individual elements arranged in a matrix no fixed position being assigned to or needed to be assigned to the individual characters or partial characters using controlled light sources using electroluminescent panels
- G09G3/32—Control arrangements or circuits, of interest only in connection with visual indicators other than cathode-ray tubes for presentation of an assembly of a number of characters, e.g. a page, by composing the assembly by combination of individual elements arranged in a matrix no fixed position being assigned to or needed to be assigned to the individual characters or partial characters using controlled light sources using electroluminescent panels semiconductive, e.g. using light-emitting diodes [LED]
- G09G3/3208—Control arrangements or circuits, of interest only in connection with visual indicators other than cathode-ray tubes for presentation of an assembly of a number of characters, e.g. a page, by composing the assembly by combination of individual elements arranged in a matrix no fixed position being assigned to or needed to be assigned to the individual characters or partial characters using controlled light sources using electroluminescent panels semiconductive, e.g. using light-emitting diodes [LED] organic, e.g. using organic light-emitting diodes [OLED]
- G09G3/3225—Control arrangements or circuits, of interest only in connection with visual indicators other than cathode-ray tubes for presentation of an assembly of a number of characters, e.g. a page, by composing the assembly by combination of individual elements arranged in a matrix no fixed position being assigned to or needed to be assigned to the individual characters or partial characters using controlled light sources using electroluminescent panels semiconductive, e.g. using light-emitting diodes [LED] organic, e.g. using organic light-emitting diodes [OLED] using an active matrix
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- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Theoretical Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Devices For Indicating Variable Information By Combining Individual Elements (AREA)
- Electroluminescent Light Sources (AREA)
Abstract
The present invention provides a kind of narrow frame touch-control display panel and display device and preparation method thereof, the touch-control display panel includes substrate, substrate through holes, TFT circuit layer, the reception of INCELL capacitance touch sensor circuits and radiating circuit layer, OLED layer, back-side circuit layer and polarization piece and cover plate, it is connected with the TFT circuit layer of substrate top surface by substrate through holes VIA by the periphery of display screen effective display area domain Active Area, and the protective layer of the TFT of the substrate top surface of display panel and OLED is packaged by cofferdam filling glue, its width ensures minimum widith, realize narrow frame effect；Also providing one has the preparation method and the display device with the display panel of the display panel.
Description
Technical field
The present invention relates to display panel field, more particularly to a kind of narrow frame touch-control display panel and display device and its system
Make method.
Background technology
The Display Technique of current main flow includes TFT-LCD, IPS-LCD, QD-LCD, OLED, electric ink eINK, Micro
LED etc..
LCD (Liquid Crystal Display) liquid crystal display applications are the display panel skills of current main flow extensively
Art.The construction of LCD is to place liquid crystal cell in the middle of the parallel glass substrate of two panels, and TFT (film crystals are set on lower baseplate glass
Pipe), colored filter is set on upper substrate glass, change to control the rotation of liquid crystal molecule by the signal on TFT and voltage
Direction, so as to reach control each pixel polarised light outgoing whether and reach display purpose.
And IPS display panels it is maximum the characteristics of be exactly its two poles of the earth all on the same face, rather than other liquid crystal modes
Electrode be in upper and lower surface, solid arrangement.
QD (Quantum Dot) LCD is the LCD technology by quantum spot light as backlight.Quantum dot (Quantum
Dot) it is invisible to the naked eye, extremely small inorganic nanocrystal.Stimulated whenever by light, quantum dot will send very
Pure coloured light.The use of the backlight of quanta point material is the most pure backlight of current color.Quantum dot TV is used
The most pure quantum dot light source of color is revolutionary to realize that full gamut shows as backlight, most true reduction image color.
EINK electronic ink display panels have many advantages, including legibility, flexible, easily cheap to manufacture and low-power consumption.With
Other Display Techniques are compared, and the reflectivity and contrast of electric ink are preferable.
MicroLED technologies refer to the LED permutations of high density microsize integrated on a single die, as LED shows
Screen, each pixel can addressing, be operated alone and light, the scaled down version of outdoor LED display screen can be regarded as, by pixel distance
Micron order is reduced to from grade, scanned compared to existing micro display technology such as DLP, LCoS, MEMS etc., due to
MicroLED self-luminous, optical system is simple, it is possible to reduce the volume of total system, weight, cost, at the same take into account low-power consumption,
The characteristics such as fast reaction.
OLED Organic Light Emitting Diodes (0rganic Light Emitting Diode, OLED) display panel is used very thin
Coating of organic material and glass substrate, when an electric current passes through it, organic material will light, and organic light-emitting diode display
Screen visible angle is big, and can save significantly on electric energy, fast response time, and without backlight, colour gamut is wide, and contrast is high, whole
Body structure is frivolous, therefore the application of present Organic Light Emitting Diode is more and more extensive.Organic LED display panel divides again
It is AMOLED and two kinds of PMOLED.
Traditional Display Technique, frame needs to lay：Raster data model GOA circuits or grid drive chip, test pixel list
First circuit (Cell Test Unit), ELVSS power supplys and ELVDD ground wires are a plurality of, (RGB is red green for DEMUX data wires to image element circuit
The different pixels such as green four color of Lan Sanse, RGBG RGB arrange mechanism) demultplexer, INCELL touch induction circuits connect
Circuit, the ESD circuit (holding wire ESD, bonding angle ESD etc.) of circuit (RX) and radiating circuit are received, then in the week of display panel
While being sealed (Glass Frit Encapsulation) with sealant；And it is general in DEMUX circuit sides, will also be by COG
Or COF modes, with ACF each side opposite sex glue bonding display driver chip, and bonding display panel soft arranging wire FPC.These do
Method, all increases the width on display panel periphery, especially the border width of display driver chip and FPC bondings side.
Traditional narrow display panel production technology in both sides or three sides, does small by by GOA circuits as practical, or by GOA
Circuit is distributed in basic pixel circuit, and the frame on both sides or three sides is narrowed；This distributed gate drive circuit does
Method, there is Railway Project, and one is that gate driving circuit is distributed in basic pixel circuit, have impact on the aperture opening ratio of image element circuit and bright
Degree, two is limited driving force, and to high-resolution and the driving effect on driving birds is not good of large size panel, three is that requirement modification display drives
Chip and circuit, support distributed raster data model, cause circuit structure complicated.Meanwhile, because placing DEMUX circuits and display
The frame on one side of IC is driven, because to do display drives the bonding of IC and the bonding of FPC, its frame cannot accomplish extremely narrow, make
Display device cannot be designed to the effect of four sides or periphery pole narrow frame.
With the development of technology, consumer pursues the screen accounting of display device, it is desirable to be able in as far as possible small size, have
Big effective display area (Active Area, AA) as far as possible, but traditional Wide frame display panel, it is impossible to solve to pursue big
Contradiction between the viewing area of size and small size portability.
The patent CN201380069259.5 of Apple Inc.：The narrow frame display of electronic equipment：Electricity will be driven with via
Road chip (Driver IC) is connected on the flexible PCB of substrate back in COF modes, only address only front drive circuit cloth
Rhetoric question is inscribed, and system does not solve the problems, such as the periphery border width of the display panel of other influences full screen display effectively.And this is specially
Profit using via except all moving all circuits that front takes frame area to substrate back, including drive circuit, it is also possible to
Directly made in substrate back, or by drive circuit IC chip, in COG modes, be directly anchored to substrate back.
The number of patent application of magnificent starlight electricity：201510239874.7：Narrow frame flexible display apparatus and preparation method thereof, with
Apple patent CN201380069259.5 is similar to, and arranges driving IC on the FPC of substrate back with via.
The U.S. Patent number US20140042406A1 of Apple Inc.：FlexibleDisplays(Apple)：Flexible base board
Display, by extending the substrate of rectangular display panel, will drive IC etc. to be folded into the module back side, be not take up positive viewing area
Domain.But the border width on other three sides for how reducing rectangular panel is not expanded on further.Fillet is not expanded on further yet
The frame processing method in the round-corner transition region of rectangular display screen
The content of the invention
Based on this, it is necessary to provide a kind of display panel, using the present invention program, in the electric property for maintaining like and aobvious
On the premise of showing effect, the surrounding periphery frame of display panel can be made narrower, and not exclusively both sides or three sides are narrow frame.
1. a kind of narrow frame touch-control display panel, it is characterised in that：Including substrate, substrate through holes, TFT circuit layer,
The receiving circuit and radiating circuit of INCELL capacitance touch sensor circuits, OLED layer, back-side circuit layer and polarization piece and
Cover-plate glass；The back-side circuit layer is located at the bottom surface of the substrate, and the back-side circuit layer is by substrate through holes and substrate top
The TFT circuit layer in face is connected；The OLED layer is on TFT circuit layer；The INCELL capacitance touch sensing
The radiating circuit of circuit is located in TFT circuit layer, and the receiving circuit of the INCELL capacitance touch sensor circuit is located at TFT circuit
In layer or in back-side circuit layer.
2. narrow frame touch-control display panel according to claim 1, it is characterised in that：The substrate material is glass
Substrate or PI substrates.
3. narrow frame touch-control display panel according to claim 2, it is characterised in that：The substrate through holes are used
CO2 laser-beam drilling machines are got, and aperture is less than or equal to 25 microns, and empty inwall plates conductive coating.
4. narrow frame touch-control display panel according to claim 3, it is characterised in that：The conductive coating is Huang
Gold.
5. narrow frame touch-control display panel according to claim 4, it is characterised in that：The back-side circuit layer includes
GOA circuits, power circuit ELVDD, earthed circuit ELVSS, test circuit, ESD circuit, DEMUX circuits, VCOM circuits, touch
Driving chip or equivalent touch control drive circuit, display driver chip or equivalent display driver circuit, or touch-control show one
Body driving chip TDDI, power supply chip component, FPC bindings bits and FPC, the substrate include relative top surface and bottom surface,
There is via, the TFT circuit layer is located at the top surface of the substrate, and the GOA circuits pass through substrate through holes and substrate on substrate
Corresponding grid is connected in the TFT circuit layer of top surface, the GOA peak widths of substrate front side is reduced, so as to reduce border width.
6. narrow frame touch-control display panel according to claim 5, it is characterised in that：The DEMUX of back-side circuit layer
Circuit, test circuit, ESD circuit, power circuit ELVDD and earthed circuit ELVSS, VCOM circuit by substrate through holes respectively with
The corresponding source electrode of the circuit of substrate top surface, correspondence test point, corresponding circuits point, the ground wire point ELVSS of substrate top surface, TFT circuit
The VCOM of layer is connected.
7. narrow frame touch-control display panel according to claim 1, it is characterised in that：Also there is power supply chip, its
It is bound in substrate bottom surface or base plate bottom surface FPC by COF modes, and the power supply chip passes through substrate through holes and back-side circuit
The power circuit ELVDD of layer is connected with earthed circuit ELVSS, there is provided corresponding to drive and source voltage.
8. narrow frame touch-control display panel according to claim 1, it is characterised in that：When described touch drives
Chip or equivalent touch control drive circuit are bound to back-side circuit layer or are bundled on the FPC of back-side circuit layer, by base
The radiating circuit of plate via and the INCELL capacitance touch sensor circuits of substrate top surface, receiving circuit be connected or directly be located at
The radiating circuit of the INCELL capacitance touch sensor circuits in back-side circuit layer, receiving circuit are connected.
9. narrow frame touch-control display panel according to claim 1, it is characterised in that：The display driver chip or
Equivalent display driver circuit, or touch-control shows the DEMUX circuits of integrated driving chip TDDI connecting substrates bottom surface, and passes through
Substrate through holes are connected with the base pixel data circuit of substrate top surface.
10. narrow frame touch-control display panel according to claim 5, it is characterised in that：The upper each device of back-side circuit layer
Part is bound by each side opposite sex glue ACF.
11. narrow frame touch-control display panels according to claim 1, it is characterised in that：Described TFT, OLED device
Part and the encapsulation of back-side circuit layer film are packaged by cofferdam filling glue.
12. narrow frame touch-control display panels according to claim 1, it is characterised in that：The display panel can be with
For thin film transistor (TFT) TFT-LCD, IPS-LCD non-crystalline silicon a-Si-LCD, quantum dot QD-LCD, electric ink eINK, miniature LED,
OLED, nanotube Nanotube display screens.
13. narrow frame touch-control display panels according to claim 6, it is characterised in that：The display panel shape
Can be square, rectangle, circle, sector, round rectangle.
14. narrow frame touch-control display panels according to claim 13, it is characterised in that：When display panel is fillet
During rectangle, source electrode via is arranged along fillet outer.
15. narrow frame touch-control display panels according to claim 14, it is characterised in that：The display panel is firm
Property or flexible display panels.
A kind of 16. display devices, it is characterised in that：Show with the narrow frame touch-control as described in claim any one of 1-15
Show panel.
A kind of 17. preparation methods of narrow frame touch-control display panel, it is characterised in that：Comprising panel substrate back side system
Make technological process, top surface fabrication processing, foreboard segment process flow and module set section technological process；
Described substrate back fabrication processing comprises the following steps：
1) the two-sided clean dirt of substrate；
2) laser drilling device is used, it is punched in the correspondence position of substrate；
3) substrate back plated film, substrate back is deposited to filming equipment with by way of physically or chemically by required material
On, while the inwall of via is coated into conductive material, form conductive via；
4) high precision optical alignment equipment is used, the photoresist position of related circuit and the corresponding mistake on substrate will be made
Hole alignment connection, then overleaf coats photoresist；
5) by the way of optical illumination, by the pattern on light shield by the substrate after photoresistance is transferred to plated film；
6) developing process is carried out；
7) etch process：By the way of chemistry or physics, the film below figure that will not covered by photoresistance on substrate
Etch away；
8) stripping technology：Photoresistance on cover layer is washed off, the film layer of the figure with needed for is left；
Above-mentioned steps 3) -8) it is repeated a number of times, all of back-side circuit layer circuit in the back side is made, finally, do not destroying
On the premise of each circuit bindings bit bump contact, thin-film package is carried out to the back side；
After substrate back fabrication processing is completed, substrate is overturn, enter into substrate top surface technological process, specifically included
Following steps：
9) substrate top surface coating process：Using filming equipment, required material is deposited into base with mode physically or chemically
On plate top surface；
10) high precision optical alignment equipment is used, the photoresist position for making related circuit is corresponding on substrate
Via alignment connection, then coats photoresist in top surface；
11) by the way of optical illumination, by the pattern on light shield by the substrate after photoresistance is transferred to plated film；
12) developing process is carried out；
13) etch process：By the way of chemistry or physics, the film below figure that will not covered by photoresistance on substrate
Etch away；
14) stripping technology：Photoresistance on cover layer is washed off, the film layer of the figure with needed for is left；
Above-mentioned steps 9) -14) it is repeated a number of times, make all of TFT circuit layer circuit of top surface；
Foreboard segment process flow is subsequently entered, following steps are specifically included：
15) TFT substrate cleaning, the dirt impurity remained in removal substrate back, top surface fabrication processing；
16) metal mask is thrown the net：High-precision metal mask plate is made using the material with extremely low thermal deformation coefficient, is made
After the completion of be located on metal framework by screen-tensioning machine and deliver to evaporation；
17) it is deposited with：Organic material is arrived LTPS bases by evaporator under ultrahigh vacuum through high-precision metal mask plate evaporation
In plate limited area；
18) thin-film package protection：By thin-film package, the TFT circuit layer and organic pixel layer of protective substrate top surface；
19) cover plate cleaning gluing：After cover plate cleaning, glass cement is coated in relevant position；
20) substrate is encapsulated with cover plate：Under vacuum conditions, it is carried out into encapsulation of fitting with protection board with glass cement；
After the completion of encapsulation, module set section technological process is entered into, specifically include following steps：
21) cutting technique：Packaged substrate cut is panel；
22) panel test：Carry out panel and light inspection and senile experiment；
23) panel is attached into upper Polarizer；
24) roll-over panels, carry out back side of panel circuit binding；
25) back side of panel FPC bindings：The flexible printed circuit board FPC of pre-production is tied to substrate back phase with ACF
Answer contact region；
26) module test：Carry out the burn-in test of module and light inspection, pack shipment.
The beneficial effects of the present invention are：The four sides border width of display panel and display device can be effectively reduced, especially
Its panel for being the reduction of traditional approach making needs to lay the top frame or the width of underframe of DEMUX circuits and display driver chip
Degree；Source electrode drive circuit is made in substrate back, the GOA peak widths of front GOA modes about 0.5-1MM or so are reduced,
And then reduce border width.Meanwhile, because substrate back area is abundant, there are the spatial arrangement source electrode drive circuit of abundance, lifting
Driving force, improves display effect.Realize that real periphery pole narrow frame shows.
Brief description of the drawings
The present invention is described in further detail with reference to accompanying drawing：
Fig. 1 is the schematic top plan view of the INCELL AMOLED display panels in an embodiment；
Fig. 2 is the elevational schematic view of the INCELL AMOLED display panels in an embodiment；
Fig. 3 is the side sectional view of the INCELL AMOLED display panels in an embodiment；
Fig. 4 is INCELL AMOLED substrate bottom surface (back side) fabrication processing figure in an embodiment；
Fig. 5 is INCELL AMOLED substrate top surface (front) fabrication processing figure in an embodiment；
Fig. 6 is the INCELL AMOLED foreboard process charts in an embodiment；
Fig. 7 is the INCELL AMOLED module process charts in an embodiment；
Fig. 8 is the schematic diagram of the round rectangle display screen in an embodiment；
Specific embodiment
In order that the purpose of the present invention, technical scheme, technological process and advantage become more apparent, below in conjunction with accompanying drawing and
Embodiment, the present invention will be described in further detail.It should be appreciated that specific implementation example described herein is only used to solve
Patent of the present invention is released, restriction is not used to and is unable to patent of invention.Those skilled in the art can be as disclosed by this specification content
Other advantages of the invention and effect are understood easily.The present invention can also by way of a different and different embodiment be subject to reality
Apply or apply, the various details in this specification can also be based on different viewpoints and application, without departing from spirit of the invention
Under carry out various modifications or alterations.
It should be noted that the diagram provided in the present embodiment only illustrates basic conception of the invention in a schematic way,
Then component count, shape and size when only display is with relevant component in the present invention rather than according to actual implementation in schema are painted
System, it is actual when the implementing kenel of each component, quantity and ratio can be a kind of random change, and its assembly layout form also may be used
Can be increasingly complex.
Refering to Fig. 1, it is the schematic top plan view of narrow frame INCELL touch-controls AMOLED display panels of the present invention；It is aobvious to simplify
Show that the basic pixel circuit of TFT circuit layer only shows the image element circuit matrix (RGB) of 3X3, the transmitting electricity of INCELL is not shown
Road (TX) and receiving circuit (RX)；Shown to simplify, schematic top plan view does not show cover plate and polaroid.
As shown in figure 1, the layout of top surface (front) 100 of narrow frame INCELL touch-controls AMOLED display panels of the present invention is：
Substrate front side 100, sealing frame/frame 101, TFT circuit layer 160, power vias ELVDD VIA (111,112,113), ground wire mistake
Hole ELVSS VIA (121,122,123), VCOM vias 124, pixel cell test circuit (Cell Test Unit) via VIA
(131,132,133), gate driving circuit via Gate VIA (141,142,143), RGB pixel data circuit vias RGB
The radiating circuit (TX) of VIA (151,152,153), INCELL capacitance touch sensor circuit and the via VIA of receiving circuit (RX)
(161,162,163).
The reception of INCELL capacitance touch sensor circuits, radiating circuit via VIA (161,162,163).
As shown in Fig. 2 the layout of bottom surface (back side) 200 of narrow frame INCELL touch-controls AMOLED display panels of the present invention is：
Substrate bottom surface 200, gate driving circuit GOA 201 and 202 (left and right), ESD circuit 204 (ESD at holding wire and bonding angle), number
According to the DEMUX circuits 204 for being driven into rgb pixel circuit, pixel cell test circuit (Cell Test Unit) 205, soft arranging wire
FPC 210, the connector 211 on soft arranging wire, the component 212 on soft arranging wire, touch drive circuit, display driver circuit or
Touch-control display integration drive circuit chip TDDI IC 220.Power supply chip Power IC 221.
As shown in figure 3,
Soft arranging wire FPC 210 is bonded on the relevant position of back-side circuit layer by each side's opposite sex glue 290 (see Fig. 3)；Touch
Control driving chip, display driver chip or touch-control display integration drive circuit chip TDDI IC 220 are by each side's opposite sex
Glue 290 (see Fig. 3), is bonded on the relevant position of back-side circuit layer；Power supply chip Power IC 221 are by each side's opposite sex glue
290 (see Fig. 3), are bonded on the relevant position of back-side circuit layer；Preferably, in some embodiments, due to entering for technology
Step, touch-control driving chip and power supply chip 221, in unified integration to single touch-control display driver chip TDDI IC 220.The back side
Power vias ELVDD VIA (111,112,113) and ground wire via ELVSS VIA (121,122,123) by back-side circuit
It is electrically connected in power supply chip 221 or one chip 220, for the basic circuit of substrate front side provides power supply；The VCOM at the back side
Circuit, by VCOM circuit vias VCOM VIA 124, the VCOM circuits with substrate top surface TFT circuit layer are connected；Pixel cell
Test circuit (Cell Test Unit) via VIA (131,132,133) is electrically connected to back-side circuit layer by back-side circuit
In pixel cell test circuit (Cell Test Unit)；Gate driving circuit via Gate VIA (141,142,143) passes through
Back-side circuit is electrically connected on the gate driving circuit 201 or 202 of back-side circuit layer.RGB pixel data circuit vias RGB VIA
(151,152,153) are electrically connected on the DEMUX circuits 204 of back-side circuit layer by back-side circuit.
It is further reduces cost, improves reliability, it is preferred that touch-control driving chip can be by being directly produced on substrate base
Equivalent touch drive circuit in the circuit layer of face is substituted；
It is further reduces cost, improves reliability, reduces the chip rupture problem that flexible base board bending brings, preferably
, the display driver chip that conventionally employed nude film is bonded on substrate can by be directly produced in substrate bottom surface circuit layer etc.
Effect display driver circuit is substituted；
Touch-control driving chip or equivalent touch drive circuit, display driver chip or equivalent display driver circuit or
Touch-control shows integration drive circuit chip TDDI IC 220, power supply chip Power IC 221, and other need output to arrive
Other circuits connection of the main circuit board of display device, by the circuit of back-side circuit layer, is connected on soft arranging wire FPC210, enters
And pass through connector 211 and be connected on main circuit board.
Preferably, GOA circuits, ESD circuit, Cell Test Unit, VCOM circuit, ELVSS, ELVDD and DEMUX it is complete
Portion or part, in a conventional manner, can be laid in the TFT circuit of substrate top surface layer according to technique and process requirements.
Preferably, AMOLED display panels of the invention, support the capacitance touching control circuit of Full Incell modes.For
Manufacture difficulty is reduced, AMOLED display panels of the invention also support the capacitance touching control circuit of Oncell modes
The making of capacitance touching control circuit, supports the technology and technique at present with future, including is not limited to be based on from electricity
The modes such as appearance, mutual capacitance, the operation of VCOM time-sharing circuits, hybrid INCELL, complete INCELL, wire netting Metal Mesh, touch
The specific implementation of circuit is controlled, not in coverage of the invention.In some touch-control circuit implementations, receive (RX,
Sensing) circuit can partly or entirely be arranged at substrate top surface for circuit or transmitting (TX, driving), and need not be arranged at substrate base
Face.Its specific implementation, for the purpose of supporting that this patent realizes ultra-narrow frame, not in the range of the elaboration of this patent.
Preferably, AMOLED display panels of the invention, support that touch-control drives and display drives integrated TDDI chips.
As shown in figure 3, the side sectional view of the INCELL AMOLED display panels in an embodiment of the invention, base
Each functional circuit of the TFT circuit layer of plate top surface, by corresponding via VIA：Power vias ELVDD VIA (111,112,
113), ground wire via ELVSS VIA (121,122,123), VCOM circuit vias VCOM VIA124, pixel cell test circuit
(Cell Test Unit) via VIA (131,132,133), gate driving circuit via Gate VIA (141,142,143),
RGB pixel data circuit vias RGB VIA (151,152,153), the radiating circuit (TX) of INCELL and receiving circuit (RX)
Via VIA (161,162,163), is connected on each functional circuit and component of the back-side circuit of substrate bottom surface layer 200.
Preferably, soft arranging wire FPC210 is bonded to the relevant position of back-side circuit layer 200 by the different in nature glue ACF 290 of each side
On；
Preferably, touch-control driving chip, display driver chip or touch-control display integration drive circuit chip TDDI IC
220, it is bonded on the relevant position of back-side circuit layer 200 by the different in nature glue ACF 290 of each side；
Preferably, power supply chip Power IC 221, back-side circuit layer 200 is bonded to by the different in nature glue ACF 290 of each side
Relevant position on；
Below in conjunction with schematic diagram, the fabrication processing of AMOLED panel and module is expanded on further.
With reference to Fig. 4 INCELL AMOLED substrate bottom surface (back side) fabrication processing：
1) the two-sided clean dirt of substrate, in this embodiment, the substrate can include glass substrate, polyimides tree
Fat (polyimide abbreviation PI), PEN (PEN), polyethylene terephthalate (polyester resin
PET), at least one of various kinds of resin lamination, dielectric metallic film, glass resin lamination etc..
2) substrate is punched, using laser drilling device, in the punched VIA of the correspondence position of substrate.In this embodiment
In, via can be made before the back-side circuit of substrate top surface TFT circuit and bottom surface is made and (carry out laser in plant substrate to beat
Hole), it is also possible to made after the back-side circuit of substrate top surface TFT circuit and bottom surface is made.Using which kind of mode, according to face
The specific technique adjustment of plate factory is required and carried out.
In this embodiment, the resolution ratio with technological progress and display panel rises, base pixel element circuit
Up and down and between left and right every can be less and less, the punching size of punch device be caused, exceeded what the interval between pixel was allowed
Scope, now should arrange the modes such as via by biserial or multiple row via, or sawtooth pattern, corresponding via be made, to support
The via technique of high-resolution display panel.
3) substrate bottom surface coating process is to use filming equipment, and required material is deposited into base with mode physically or chemically
On plate bottom surface, while the inwall of via is coated into conductive material, conductive via is formed.Substrate wall thickness and via diameter ratio, should
More than certain proportion, to ensure that via inwall can continuously coat conductive material, prevent from causing broken string.If (via makes
Carried out in plant substrate, then the technique of via coated inner wall conductive material, should also be carried out in plant substrate)
4) bottom surface photoresist coating, photoresist is coated in bottom surface.In this step, using high precision optical alignment equipment,
The photoresist position via VIA corresponding with substrate for making related circuit is directed at connection.
5) bottom surface exposure technology is by the way of optical illumination, by the pattern on light shield after photoresistance is transferred to plated film
Substrate on；
6) developing process；
7) etch process：Etch process is the mode using chemistry or physics, the figure that will not covered by photoresistance on substrate
Film below shape is etched away.
8) stripping technology：Finally the photoresistance on cover layer is washed off, the film layer of the figure with needed for is left；
Above-mentioned steps 3) -8) it is repeated a number of times, (usual 12 times), all of back-side circuit layer in making bottom surface (including
VCOM circuits, EVLDD power circuits, ELVSS earthed circuits, GOA gate driving circuits, unit testing circuit Cell Test
Unit, ESD circuit, DEMUX circuits, equivalent touch drive circuit, equivalent display driver circuit, INCELL touch-controls receive and or
Radiating circuit, touch chip bonding position, display driver chip bonding position, TDDI IC bondings position, power supply chip Power IC bondings
Position, soft arranging wire FPC bondings position etc.), finally on the premise of each bonding position bump contact is protected, overleaf carry out thin-film package
(Thin Film Encapsulation), protection back-side circuit layer.Will be by packaging technology, it is ensured that the flatness of thin-film package,
Substrate back out-of-flatness is prevented, the bad display of the display panel for causing.
It is cost-effective in order to reduce substrate bottom surface making technology complexity, only can carry out electrical connecting wire in substrate bottom surface
Road and the making of touch-control circuit, TFT circuit making (Gate Driver, DEMUX, ESD, Test unit etc.) are not carried out, so
Only need one to P100 technological processes twice.The circuits such as Gate Driver, DEMUX, ESD, Test unit, are still in base
Plate top surface technological process makes.
The making of touch-control circuit, supports the technology and technique at present with future, including is not limited to be based on self-capacitance, mutually electricity
The modes such as appearance, the operation of VCOM time-sharing circuits, hybrid INCELL, complete INCELL, wire netting Metal Mesh, touch-control circuit
Specific implementation, not in coverage of the invention.In some touch-control circuit implementations, (RX, sensing) electricity is received
Circuit can partly or entirely be arranged at substrate top surface for road or transmitting (TX, driving), and need not be arranged at substrate bottom surface.
After back-side circuit layer completes, substrate is overturn, enter into substrate top surface technological process.
Fig. 5 is INCELL AMOLED substrate top surface (front) fabrication processing figure in an embodiment；The base
Plate top surface fabrication processing is comprised the following steps：
9) substrate top surface coating process：Using filming equipment, required material is deposited into base with mode physically or chemically
On plate top surface；
10) high precision optical alignment equipment is used, the photoresist position for making related circuit is corresponding on substrate
Via alignment connection, then coats photoresist in top surface；
11) by the way of optical illumination, by the pattern on light shield by the substrate after photoresistance is transferred to plated film；
12) developing process is carried out；
13) etch process：By the way of chemistry or physics, the film below figure that will not covered by photoresistance on substrate
Etch away；
14) stripping technology：Photoresistance on cover layer is washed off, the film layer of the figure with needed for is left；
Above-mentioned steps 9) -14) it is repeated a number of times, make all of TFT circuit layer circuit of top surface；
Flow process requirement according to panel factory, backboard top surface technique and backboard back process can be exchanged, you can with elder generation
Backboard back-side circuit is made, then inverts making back side top surface circuit.
After completing, foreboard segment process flow is entered into：, as shown in fig. 6, foreboard section flow includes following step
Suddenly：
In this embodiment, foreboard segment process by high-precision metal mask plate (FMM) by luminous organic material and
The materials such as negative electrode are deposited with backboard, and luminescent device is combined to form with drive circuit, then are packaged to rise in oxygen-free environment
To protective effect.The aligning accuracy of evaporation and the air-tightness of encapsulation are all the challenge places of foreboard segment process.Other techniques are also wrapped
Include and organic light emissive pixels are formed by modes such as printing, inkjet printings
15) TFT substrate cleaning, the dirt impurity remained in removal substrate back, top surface fabrication processing；
16) metal mask is thrown the net：High-precision metal mask plate is made using the material with extremely low thermal deformation coefficient, is made
After the completion of be located on metal framework by screen-tensioning machine and deliver to evaporation；
17) it is deposited with：Organic material is arrived LTPS bases by evaporator under ultrahigh vacuum through high-precision metal mask plate evaporation
In plate limited area；
18) thin-film package protection：By thin-film package, the TFT circuit layer and organic pixel layer of protective substrate top surface；
19) cover plate cleaning gluing：After cover plate cleaning, glass cement is coated in relevant position；
20) substrate is encapsulated with cover plate：Under vacuum conditions, it is carried out into encapsulation of fitting with protection board with glass cement；
After the completion of encapsulation, module set section fabrication processing is entered into.As shown in fig. 7, the module set section fabrication processing
Comprise the following steps：
21) cutting technique：Packaged substrate cut is panel；
22) panel test：Carry out panel and light inspection and senile experiment；
23) panel is attached into upper Polarizer；
24) roll-over panels, carry out back side of panel circuit binding；
Preferably, in this embodiment, using TDDI technologies, touch chip TPIC and display driver chip IC is closed two
It is one；
Preferably, it is further reduces cost, improves reliability, touch-control driving chip can be by be directly produced on substrate base
Equivalent touch drive circuit in the circuit layer of face is substituted；
It is further reduces cost, improves reliability, reduces the chip rupture problem that flexible base board bending brings, preferably
, the display driver chip that conventionally employed nude film is bonded on substrate can by be directly produced in substrate bottom surface circuit layer etc.
Effect display driver circuit is substituted；
Preferably, in this embodiment, because substrate back regional space is well-to-do, the aobvious of elongated ultra-narrow can not be used
Show driving TDDI IC models, after reducing with ACF laminating chips, the warpage effects caused after thermal contraction are also reduced because of external force
The display driver chip fracture defect for causing, improves the reliability of display panel；
25) back side of panel FPC bindings：The flexible printed circuit board FPC of pre-production is tied to substrate back phase with ACF
Answer contact region；
26) module test：Carry out the burn-in test of module and light inspection, pack shipment.
As shown in figure 8, in order to reach display effect attractive in appearance, the shape of effective display area domain 810 of the panel 800 is fillet
Rectangle, in the round-corner transition part 830 of round rectangle, grid circuit is connected to back gate drive circuit, subtracts by via VIA
The width of few frame 820, and source circuit extends a segment distance by normal wiring typesetting on substrate, in bending region 840
Bent, drive circuit IC850 by COG modes with ACF bondings on the substrate of extension, also prolonging by ACF by bonding for FPC
On substrate long.By on the premise of the ultra-narrow frame round rectangle viewing area for not influenceing integral panels, cutting into a sideband
There is rectangle to extend the round rectangle display screen of substrate, then fitted drive circuit chip using COG modes on the substrate of extension
And FPC, it is applied in combination via mode and is connected to the innovative approach set forth in the present invention such as the gate driving circuit at the back side, reach circle
The ultra-narrow frame display effect of angle rectangular display screen.
Above embodiment is the manufacture craft of the AMOLED display panels of narrow frame INCELL touch control manners of the invention
Flow.Concrete technology flow process therein, can as the case may be carry out order adjustment, or increase subtracts corresponding technique stream
Journey.
Similar, Super AMOLED, non-crystalline silicon a-Si LCD, LTPS LCD, IPS LCD, quantum dot QD-LCD are micro- aobvious
Show MicroLED, electric ink eINK display panels and following other new display panel technologies for occurring, can be using this
The described technical scheme of invention and technological process, realize narrow frame display panel.
To sum up, by above measure, the positive effect of narrow frame touch-control display panel of the invention is：The present invention
The space layout of substrate back is taken full advantage of, on the premise of electric property and display effect is ensured, display surface can be accomplished
Plate periphery (four sides) pole narrow frame, is advantageously implemented periphery (four sides) narrow frame display device of innovation, and lifting screen accounting meets
Mobility requirement of the consumer to big screen display device.
Above specific embodiment is merely illustrative of the technical solution of the present invention and unrestricted, although with reference to example to this hair
It is bright to be described in detail, it will be understood by those within the art that, technical scheme can be modified
Or equivalent, without deviating from the spirit and scope of technical solution of the present invention, it all should cover in claim of the invention
In the middle of scope.
Claims (17)
1. a kind of narrow frame touch-control display panel, it is characterised in that：Including substrate, substrate through holes, TFT circuit layer, INCELL electricity
Hold receiving circuit and radiating circuit, OLED layer, back-side circuit layer and polarization piece and the cover-plate glass of touch induction circuit；
The back-side circuit layer is located at the bottom surface of the substrate, the TFT electricity that the back-side circuit layer passes through substrate through holes and substrate top surface
Road floor is connected；The OLED layer is on TFT circuit layer；The transmitting of the INCELL capacitance touch sensor circuit
Circuit is located in TFT circuit layer, and the receiving circuit of the INCELL capacitance touch sensor circuit is located in TFT circuit layer or the back of the body
In the circuit layer of face.
2. narrow frame touch-control display panel according to claim 1, it is characterised in that：The substrate material is glass substrate
Or PI substrates.
3. narrow frame touch-control display panel according to claim 2, it is characterised in that：The substrate through holes are swashed using C02
Light puncher is got, and aperture is less than or equal to 25 microns, and empty inwall plates conductive coating.
4. narrow frame touch-control display panel according to claim 3, it is characterised in that：The conductive coating is gold.
5. narrow frame touch-control display panel according to claim 4, it is characterised in that：The back-side circuit layer includes GOA
Circuit, power circuit ELVDD, earthed circuit ELVSS, test circuit, ESD circuit, DEMUX circuits, VCOM circuits, touch drive
Chip or equivalent touch control drive circuit, display driver chip or equivalent display driver circuit, or touch-control display integration
Driving chip TDDI, power supply chip component, FPC bindings bits and FPC, the substrate include relative top surface and bottom surface, substrate
Upper to have via, the TFT circuit layer is located at the top surface of the substrate, and the GOA circuits pass through substrate through holes and substrate top surface
TFT circuit layer in corresponding grid be connected, the GOA peak widths of substrate front side are reduced, so as to reduce border width.
6. narrow frame touch-control display panel according to claim 5, it is characterised in that：The DEMUX circuits of back-side circuit layer,
Test circuit, ESD circuit, power circuit ELVDD and earthed circuit ELVSS, VCOM circuit by substrate through holes respectively with substrate
The corresponding source electrode of the circuit of top surface, correspondence test point, corresponding circuits point, the ground wire point ELVSS of substrate top surface, TFT circuit layer
VCOM is connected.
7. narrow frame touch-control display panel according to claim 1, it is characterised in that：Also there is power supply chip, it passes through
COF modes are bound on substrate bottom surface or base plate bottom surface FPC, and the power supply chip is by substrate through holes and back-side circuit layer
Power circuit ELVDD is connected with earthed circuit ELVSS, there is provided corresponding to drive and source voltage.
8. narrow frame touch-control display panel according to claim 1, it is characterised in that：When the touch or is waited driving chip
Effect touch control drive circuit be bound to back-side circuit layer or be bundled in back-side circuit layer FPC on, by substrate through holes with
The radiating circuit of the INCELL capacitance touch sensor circuits of substrate top surface, receiving circuit be connected or directly with positioned at back-side circuit
The radiating circuit of the INCELL capacitance touch sensor circuits in layer, receiving circuit are connected.
9. narrow frame touch-control display panel according to claim 1, it is characterised in that：The display driver chip is equivalent
Display driver circuit, or touch-control shows the DEMUX circuits of integrated driving chip TDDI connecting substrates bottom surface, and by substrate
Via is connected with the base pixel data circuit of substrate top surface.
10. narrow frame touch-control display panel according to claim 5, it is characterised in that：The upper each device of back-side circuit layer leads to
Each side opposite sex glue ACF is crossed to be bound.
11. narrow frame touch-control display panels according to claim 1, it is characterised in that：Described TFT, OLED and
Back-side circuit layer film is encapsulated or fills glue by cofferdam and is packaged.
12. narrow frame touch-control display panels according to claim 1, it is characterised in that：The display panel can be thin
Film transistor TFT-LCD, IPS-LCD non-crystalline silicon a-Si-LCD, quantum dot QD-LCD, electric ink eINK, miniature LED, OLED,
Nanotube Nanotube display screens.
13. narrow frame touch-control display panels according to claim 6, it is characterised in that：The display panel shape can be with
It is square, rectangle, circle, sector, round rectangle.
14. narrow frame touch-control display panels according to claim 13, it is characterised in that：When display panel is round rectangle
When, source electrode via is arranged along fillet outer.
15. narrow frame touch-control display panels according to claim 14, it is characterised in that：The display panel for rigidity or
Flexible display panels.
A kind of 16. display devices, it is characterised in that：With the narrow frame touch-control display surface as described in claim any one of 1-15
Plate.
A kind of 17. preparation methods of narrow frame touch-control display panel, it is characterised in that：Work is made comprising the panel substrate back side
Skill flow, top surface fabrication processing, foreboard segment process flow and module set section technological process；
Described substrate back fabrication processing comprises the following steps：
1) the two-sided clean dirt of substrate；
2) laser drilling device is used, it is punched in the correspondence position of substrate；
3) substrate back plated film, is deposited on substrate back required material with by way of physically or chemically filming equipment,
The inwall of via is coated into conductive material simultaneously, conductive via is formed；
4) high precision optical alignment equipment is used, the photoresist position of related circuit and the corresponding via pair on substrate will be made
Quasi- connection, then overleaf coats photoresist；
5) by the way of optical illumination, by the pattern on light shield by the substrate after photoresistance is transferred to plated film；
6) developing process is carried out；
7) etch process：By the way of chemistry or physics, the film etching below the figure that will not covered by photoresistance on substrate
Fall；
8) stripping technology：Photoresistance on cover layer is washed off, the film layer of the figure with needed for is left；
Above-mentioned steps 3) -8) it is repeated a number of times, all of back-side circuit layer circuit in the back side is made, finally, do not destroying each electricity
On the premise of the bindings bit bump contact of road, thin-film package is carried out to the back side；
After substrate back fabrication processing is completed, substrate is overturn, enter into substrate top surface technological process, specifically included as follows
Step：
9) substrate top surface coating process：Using filming equipment, required material is deposited into substrate top with mode physically or chemically
On face；
10) high precision optical alignment equipment is used, the photoresist position of related circuit and the corresponding via on substrate will be made
Alignment connection, then coats photoresist in top surface；
11) by the way of optical illumination, by the pattern on light shield by the substrate after photoresistance is transferred to plated film；
12) developing process is carried out；
13) etch process：By the way of chemistry or physics, the film etching below the figure that will not covered by photoresistance on substrate
Fall；
14) stripping technology：Photoresistance on cover layer is washed off, the film layer of the figure with needed for is left；
Above-mentioned steps 9) -14) it is repeated a number of times, make all of TFT circuit layer circuit of top surface；
Foreboard segment process flow is subsequently entered, following steps are specifically included：
15) TFT substrate cleaning, the dirt impurity remained in removal substrate back, top surface fabrication processing：
16) metal mask is thrown the net：High-precision metal mask plate is made using the material with extremely low thermal deformation coefficient, is completed
Evaporation is located on metal framework and delivers to by screen-tensioning machine afterwards；
17) it is deposited with：Through high-precision metal mask plate be deposited with to LTPS substrates limit organic material under ultrahigh vacuum by evaporator
Determine on region；
18) thin-film package protection：By thin-film package, the TFT circuit layer and organic pixel layer of protective substrate top surface；
19) cover plate cleaning gluing：After cover plate cleaning, glass cement is coated in relevant position；
20) substrate is encapsulated with cover plate：Under vacuum conditions, it is carried out into encapsulation of fitting with protection board with glass cement；
After the completion of encapsulation, module set section technological process is entered into, specifically include following steps：
21) cutting technique：Packaged substrate cut is panel；
22) panel test：Carry out panel and light inspection and senile experiment；
23) panel is attached into upper Polarizer；
24) roll-over panels, carry out back side of panel circuit binding；
25) back side of panel FPC bindings：The flexible printed circuit board FPC of pre-production is tied into substrate back with ACF accordingly to touch
Point region；
26) module test：Carry out the burn-in test of module and light inspection, pack shipment.
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