CN106816205A - The preparation method of a kind of low resin mica tape and by its obtained low resin mica tape - Google Patents
The preparation method of a kind of low resin mica tape and by its obtained low resin mica tape Download PDFInfo
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- CN106816205A CN106816205A CN201510866791.0A CN201510866791A CN106816205A CN 106816205 A CN106816205 A CN 106816205A CN 201510866791 A CN201510866791 A CN 201510866791A CN 106816205 A CN106816205 A CN 106816205A
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- adhesive
- paper
- mica
- mica tape
- low resin
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
- H01B17/00—Insulators or insulating bodies characterised by their form
- H01B17/56—Insulating bodies
- H01B17/60—Composite insulating bodies
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
- H01B19/00—Apparatus or processes specially adapted for manufacturing insulators or insulating bodies
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
- H01B3/00—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties
- H01B3/02—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of inorganic substances
- H01B3/04—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of inorganic substances mica
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
- H01B3/00—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties
- H01B3/02—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of inorganic substances
- H01B3/08—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of inorganic substances quartz; glass; glass wool; slag wool; vitreous enamels
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- Chemical & Material Sciences (AREA)
- Inorganic Chemistry (AREA)
- Insulating Bodies (AREA)
Abstract
The present invention relates to a kind of preparation method of low resin mica tape, comprise the following steps：1) one side in mica paper applies accelerator solution；2) in a face adhesive coating of supporting material, the adhesive is more than 40wt% with the gross weight meter of adhesive, solids content；3) mica paper that will scribble accelerator solution and the supporting material for scribbling adhesive carry out extrusion cladding and dry, obtain low resin mica tape, wherein, mica paper is not coated with the one side that the another side of accelerator solution scribbles adhesive towards supporting material and carries out extrusion cladding.The invention further relates to especially obtained low resin mica tape.
Description
Technical field
The present invention relates to a kind of method, more particularly to a kind of preparation method.The invention further relates to obtained few by it
Glue mica tape.
Background technology
Low resin mica tape vacuum pressure impregnation is mainly used for high-voltage motor (rated voltage 6kV-27kV)
(VPI) insulation processing, with the continuous lifting of electric moter voltage grade and capacity, insulation thickness accordingly increases,
Air permeability requirement to the low resin mica tape as major insulation material is also improved constantly, more preferable when being processed so as to VPI
Ground infiltration insulating barrier, obtains the insulation of good integrity.
Existing low resin mica tape production technology, is that the adhesive solvent for using solids content 5%-20% impregnates reinforcement
Combined mica paper after material, then the method manufacture low resin mica tape of heating evaporation removal solvent is carried out, in adhesive
A large amount of solvents (80%-95%) volatilization for containing, not only causes waste of material, while polluting environment.In addition adopt
The low resin mica tape produced with existing process, due to a large amount of infiltrations of adhesive in mica paper, is filled with mica sheet
Between gap, cause the air permeability of low resin mica tape to decline, in VPI processing procedures, influence impregnating resin it is fast
Speed infiltration, is easily caused inside the insulation system of VPI treatment and air gap occurs and send out empty, in motor operation course just
Shelf depreciation can be produced, the reliability and service life of motor is directly affected.
The content of the invention
In order to solve above-mentioned problems of the prior art, the present invention uses highly filled glue, significantly drops
Low organic solvent consumption, air permeability is improved in the case where ensureing that low resin mica tape plyability, flexibility are appropriate,
To meet the high-voltage motor application requirement of different voltage class.
It is an advantage of the invention to provide a kind of preparation method of low resin mica tape, comprise the following steps：
1) one side in mica paper applies accelerator solution；
2) in a face adhesive coating of supporting material, the adhesive is with the gross weight meter of adhesive, solid
Content is more than 40wt%；
3) mica paper that will scribble accelerator solution and the supporting material for scribbling adhesive carry out extrusion cladding and do
It is dry, low resin mica tape is obtained, wherein, the another side that mica paper is not coated with accelerator solution is applied towards supporting material
The one side for having adhesive carries out extrusion cladding.
Step 1 in the above method) -3) can be carried out in any mode feasible in logic, such as step 1)
Can be in step 2) before, carry out afterwards or simultaneously.One of the invention preferred embodiment in,
According to step 1) to step 3) order carry out successively.
In the present invention, described " low resin mica tape " refers to that the content of adhesive in mica tape is below 11wt%
Mica tape.
Using highly filled glue of the invention, (solids content is more than 40wt%, preferably greater than 75wt%, more excellent
Adhesive of the choosing more than 90wt%), the viscosity of adhesive can be improved, reduce adhesive and infiltrate into mica paper,
Retain the air gap between mica flake, be conducive to air permeability to improve, while organic solvent can be greatly reduced.
One of the invention preferred embodiment in, the adhesive is with the gross weight meter of adhesive, solid
Content is more than 75wt%, preferably greater than 90wt%.
One of the invention preferred embodiment in, the adhesive for melting adhesive.
One of the invention preferred embodiment in, it is described melting adhesive be epoxy resin, polyester resin
With one or more in organic siliconresin, preferably epoxy resin.
One of the invention preferred embodiment in, the adhesive is epoxy resin, polyester resin and have
One or more in machine silicones of solution, the preferably solution of epoxy resin.
One of the invention preferred embodiment in, the content of the adhesive accounts for few glue cloud in terms of solid
(8 ± 3) wt% of the gross weight of master tape, preferably (5 ± 3) wt%.
One of the invention preferred embodiment in, step 2) coating is roller coat, and in roller coat
It is preceding that the adhesive is heated to 35-85 DEG C, preferably 60-80 DEG C, in order to roller coat.
One of the invention preferred embodiment in, the mica paper be non-calcinated big scale muscovite paper and
/ or artificial mica synthesis paper, be preferably non-calcinated big scale muscovite paper, the quantification of 70-260 of the mica paper
g/m2, preferably 120-180g/m2。
One of the invention preferred embodiment in, the supporting material be electrician alkali-free glass cloth, electrician
With one or more in non-woven fabrics and aromatic polyamide paper (NOMEX paper), the thickness of the supporting material
It is 0.02mm-0.14mm to spend；Preferably, the thickness of the electrician alkali-free glass cloth is 0.025mm-0.10mm,
The thickness of electrician's non-woven fabrics is 0.03mm-0.06mm, and/or the thickness of the NOMEX paper is
0.035mm-0.06mm。
One of the invention preferred embodiment in, the accelerator solution is selected from zinc Isoocatanoate, second
One or more in acyl acetone zinc, aluminium acetylacetonate, acetylacetone cobalt and chromium acetylacetonate of solute, is dissolved in
Selected from the solution obtained by the solvent of one or more in toluene, ethanol, acetone and butanone；The promotion
The solute of agent solution is preferably one or more in zinc Isoocatanoate, zinc acetylacetonate and acetylacetone cobalt；It is described
The solvent of accelerator solution is preferably toluene and/or butanone.
One of the invention preferred embodiment in, step 3) described in drying be temperature at 40-80 DEG C
Bakeed under degree, preferably at a temperature of 60-80 DEG C.One of the invention preferred embodiment in,
Preferably also wound and/or cut after being dried.One of the invention preferred embodiment in,
Preferably also mica paper is unreeled before mica paper is coated.In one of the invention preferred embodiment party
In formula, preferred pair supporting material is also unreeled before being coated to supporting material.
One of the invention preferred embodiment in, preparation method of the invention comprises the following steps：
1) mica paper is unreeled, primary coat accelerator solution；
2) supporting material is unreeled, adhesive is melted by roller coat in supporting material one side and/or large arch dam is gluing
Agent；
3) by the mica paper of primary coat accelerator and the supporting material of roller coat adhesive through extrusion cladding, low temperature
Bakee, wind, cutting obtains ventilative low resin mica tape high, wherein, mica paper is not coated with the another of accelerator solution
Face toward supporting material and scribble the one side of adhesive carries out extrusion cladding.
One of the invention preferred embodiment in, the low resin mica tape be a class one side fibrous material mend
Strong low resin mica tape, according to different use occasion and requirement, the thickness range of the low resin mica tape is
0.075mm-0.25mm；Preferably, the thickness range of the low resin mica tape is 0.11mm-0.16mm.
In the present invention, unless otherwise indicated, all numbers are mass fraction, and all percentages are weight
Percentage.
It is a further object of the invention to provide one kind by low resin mica tape obtained in the above method, it is special
Levy and be, the low resin mica tape includes mica paper layer (1), the reinforcing material bed of material (3) and mica paper layer (1)
With the gluing oxidant layer (2) between the reinforcing material bed of material (3), the thickness of the low resin mica tape is preferably
0.075-0.25mm, more preferably 0.11-0.16mm.
The beneficial effects of the present invention are：Preparing low resin mica tape using the method for the present invention can be greatly lowered
Consumption of organic solvent, improves air permeability, thoroughly in the case where ensureing that low resin mica tape plyability, flexibility are appropriate
Manner is up to (200-800) s/100cm3, disclosure satisfy that the high-voltage motor application requirement of different voltage class.
Brief description of the drawings
Fig. 1 is a schematic diagram of low resin mica tape of the invention, wherein (1) represents mica paper (layer)；
(2) adhesive (layer) is represented；(3) supporting material (layer) is represented.
Specific embodiment
With reference to non-limiting specific embodiment, the invention will be further described, but protection model of the invention
Enclose and be not limited to following embodiments.
Embodiment 1
A kind of ventilative low resin mica tape high and preparation method thereof, the mica tape preparation method is comprised the following steps：
(1) supporting material is that thickness is 0.03mm electrician alkali-free glass cloths, and mica paper is (160 ± 10) g/m2
Non-calcinated big scale muscovite paper, adhesive is bisphenol A type epoxy resin (softening point is 50-75 DEG C), is promoted
It is the mixture of zinc Isoocatanoate and zinc acetylacetonate as solute to enter agent solution, adds the mixing of toluene and butanone molten
The solution that agent is formed.
(2) by quantification of (160 ± 10) g/m2Non-calcinated big scale muscovite paper is unreeled, and is simultaneously coated at it
State accelerator solution；It is a face roller coat bisphenol type epoxy tree of the electrician alkali-free glass cloth of 0.03mm in thickness
Fat (45-60 DEG C of softening point, its solids content is 55-75wt%), with the foregoing mica for scribbling accelerator solution
Paper extrusion cladding, wherein, the another side that mica paper is not coated with accelerator solution scribbles adhesive towards supporting material
One side carry out extrusion cladding, then through (65 ± 5) DEG C oven for drying, and wind, cutting obtains final product thickness for 0.14mm
Ventilating epoxide low resin mica tape high.
Using GB/T 5402-2003 paper and cardboard --- measure (medium range) Part V Pueraria lobota of air permeability
Er Laifa determines the air permeability of low resin mica tape.It should be noted that the data of the air permeability that the method is measured
Numerical value it is lower, illustrate that the air permeability of low resin mica tape is higher, effect is better.In example below and comparative example
Air permeability is determined using the method.After measured, the air permeability of low resin mica tape as obtained in the present embodiment is
298s/100cm3。
Embodiment 2
A kind of ventilative low resin mica tape high and preparation method thereof, the mica tape preparation method is comprised the following steps：
(1) supporting material is that thickness is 0.04mm electrician alkali-free glass cloths, and mica paper is (180 ± 14) g/m2
Non-calcinated big scale muscovite paper, adhesive is bisphenol A type epoxy resin (65-85 DEG C of softening point), is promoted
Agent solution be the mixture of zinc Isoocatanoate and zinc acetylacetonate as solute, add the mixed solvent of toluene and butanone
The solution for being formed.
(2) by quantification of (180 ± 14) g/m2Non-calcinated big scale muscovite paper is unreeled, and is simultaneously coated at it
State accelerator solution；It is a face roller coat bisphenol type epoxy tree of the electrician alkali-free glass cloth of 0.04mm in thickness
(softening point 70-80, its solids content is 75-100wt% to fat, with the foregoing mica paper for scribbling accelerator solution
Extrusion cladding, wherein, the another side that mica paper is not coated with accelerator solution scribbles adhesive towards supporting material
Extrusion cladding is simultaneously carried out, then is (65 ± 5) DEG C oven for drying through excess temperature, and wound, cutting obtains final product thickness
It is 0.16mm ventilating epoxide low resin mica tapes high.
After measured, the air permeability of low resin mica tape as obtained in the present embodiment is 386s/100cm3。
Embodiment 3
A kind of ventilative low resin mica tape high and preparation method thereof, the mica tape preparation method is comprised the following steps：
(1) supporting material is that thickness is 0.04mm electrician's non-woven fabrics, and mica paper is (120 ± 10) g/m2
Non-calcinated big scale muscovite paper, adhesive is bisphenol A type epoxy resin (45-60 DEG C of softening point), is promoted
Agent solution be the mixture of zinc Isoocatanoate and zinc acetylacetonate as solute, add the mixed solvent of toluene and butanone
The solution for being formed.
(2) by quantification of (120 ± 10) g/m2Non-calcinated big scale muscovite paper is unreeled, and is simultaneously coated at it
State accelerator solution；In thickness for a face roller coat bisphenol A type epoxy resin of the non-woven fabrics of 0.04mm (softens
45-60 DEG C of point, its solids content is 45-60wt%), it is multiple with the foregoing mica paper extruding for scribbling accelerator solution
Close, wherein, the one side that the another side that mica paper is not coated with accelerator solution scribbles adhesive towards supporting material is entered
Row extrusion cladding, then through (65 ± 5) DEG C oven for drying, and wind, cutting obtains final product thickness for 0.12mm is high
Gas low resin mica tape.
After measured, the air permeability of low resin mica tape as obtained in the present embodiment is 602s/100cm3。
Comparative example 1
Other conditions are same as Example 1, the difference is that only, use low solid content (solids content for
Epoxy resin 5-20wt%) is made come the epoxy resin for replacing highly filled (solids content is 55-75wt%)
It is adhesive.But, adhesive can be quickly penetrated into mica paper during production, cause supporting material and mica
Paper cannot be combined, it is impossible to be made low resin mica tape product.
Comparative example 2
1) supporting material is that thickness is 0.03mm electrician alkali-free glass cloths, and mica paper is (160 ± 10) g/m2
Non-calcinated big scale muscovite paper, adhesive is bisphenol A type epoxy resin, high molecular weight polyester resins and rush
Enter the mixture of agent (accelerator is zinc Isoocatanoate and zinc acetylacetonate) as solute, add toluene and butanone
The solution that is formed of mixed solvent (prepare a adhesive, solids content is 15wt%；Configure another glue
Stick, solids content is 6wt%).
2) by thickness for 0.03mm electrician alkali-free glass cloth impregnation steps 1) described in adhesive solvent (its
Solids content is 15wt%), by quantification of (160 ± 10) g/m2Non-calcinated big scale muscovite paper unreel,
With the foregoing glass cloth extrusion cladding for scribbling adhesive, the another side of mica paper roll-coating steps 1 again) described in glue
Stick solution (its solids content is (6wt%), then through 90-130 DEG C of oven for drying, and wind, cutting is
It is the common epoxy little-glue mica tapes of 0.14mm to obtain thickness.
After measured, as common low resin mica tape obtained in this comparative example air permeability in 1422s/100cm3。
It should be noted that embodiment described above is only used for explaining the present invention, do not constitute to of the invention
Any limitation.By referring to exemplary embodiments, invention has been described, it should be appreciated that wherein used
Word is descriptive and explanatory vocabulary, rather than limited vocabulary.Can be by regulation in the claims in the present invention
In the range of the present invention is modified, and the present invention is carried out in without departing substantially from scope and spirit of the present invention
Revision.Although the present invention described in it is related to specific method, material and embodiment, it is not intended that
The present invention is limited to wherein disclosed particular case, conversely, the present invention to can be extended to other all with identical function
Methods and applications.
Claims (10)
1. a kind of preparation method of low resin mica tape, comprises the following steps：
1) one side in mica paper applies accelerator solution；
2) in a face adhesive coating of supporting material, the adhesive is with the gross weight meter of adhesive, solid
Content is more than 40wt%；
3) mica paper that will scribble accelerator solution and the supporting material for scribbling adhesive carry out extrusion cladding and do
It is dry, low resin mica tape is obtained, wherein, the another side that mica paper is not coated with accelerator solution is applied towards supporting material
The one side for having adhesive carries out extrusion cladding.
2. method according to claim 1, it is characterised in that the adhesive is with the gross weight of adhesive
Meter, solids content is more than 75wt%, preferably greater than 90wt%.
3. method according to claim 1 and 2, it is characterised in that the adhesive is melting adhesive,
One or more preferably in epoxy resin, polyester resin and organic siliconresin, more preferably epoxy resin.
4. method according to claim 1 and 2, it is characterised in that the adhesive be epoxy resin,
One or more in polyester resin and organic siliconresin of solution, the preferably solution of epoxy resin.
5. the method according to any one of claim 1-4, it is characterised in that the content of the adhesive
In terms of solid, (8 ± 3) wt% of the gross weight of low resin mica tape, preferably (5 ± 3) wt% are accounted for.
6. the method according to any one of claim 1-5, it is characterised in that step 2) coating
It is roller coat, and the adhesive is heated to 35-85 DEG C, preferably 60-80 DEG C before roller coat, in order to roller coat.
7. the method according to any one of claim 1-5, it is characterised in that the mica paper is forged for non-
Burn big scale muscovite paper and/or artificial mica synthesis paper, be preferably non-calcinated big scale muscovite paper, the cloud
The quantification of 70-260g/m of female paper2, preferably 120-180g/m2；And
The supporting material is the one kind in electrician alkali-free glass cloth, electrician's non-woven fabrics and aromatic polyamide paper
Or it is various, the thickness of the supporting material is 0.02mm-0.14mm；Preferably, the electrician alkali-free glass cloth
Thickness be 0.025mm-0.10mm, the thickness of electrician's non-woven fabrics is 0.03mm-0.06mm, and/
Or the thickness of the aromatic polyamide paper is 0.035mm-0.06mm.
8. the method according to any one of claim 1-7, it is characterised in that the accelerator solution is
Selected from the one kind in zinc Isoocatanoate, zinc acetylacetonate, aluminium acetylacetonate, acetylacetone cobalt and chromium acetylacetonate
Or various solutes, it is dissolved in the solvent gained selected from one or more in toluene, ethanol, acetone and butanone
The solution for arriving；The solute of the accelerator solution is preferably in zinc Isoocatanoate, zinc acetylacetonate and acetylacetone cobalt
One or more；The solvent of the accelerator solution is preferably toluene and/or butanone.
9. the method according to any one of claim 1-8, it is characterised in that step 3) described in
Drying is at a temperature of 40-80 DEG C, is preferably bakeed at a temperature of 60-80 DEG C, excellent after being dried
Choosing is also wound and/or is cut, and preferably also mica paper was unreeled before being coated to mica paper, right
Preferred pair supporting material is also unreeled before supporting material is coated.
10. a kind of low resin mica tape obtained in method by any one of claim 1-9, its feature exists
In the low resin mica tape includes mica paper layer (1), the reinforcing material bed of material (3) and mica paper layer (1)
With the gluing oxidant layer (2) between the reinforcing material bed of material (3), the thickness of the low resin mica tape is preferably
0.075-0.25mm, more preferably 0.11-0.16mm.
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201510866791.0A CN106816205A (en) | 2015-12-01 | 2015-12-01 | The preparation method of a kind of low resin mica tape and by its obtained low resin mica tape |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201510866791.0A CN106816205A (en) | 2015-12-01 | 2015-12-01 | The preparation method of a kind of low resin mica tape and by its obtained low resin mica tape |
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| CN106816205A true CN106816205A (en) | 2017-06-09 |
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| CN201510866791.0A Pending CN106816205A (en) | 2015-12-01 | 2015-12-01 | The preparation method of a kind of low resin mica tape and by its obtained low resin mica tape |
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Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110970184A (en) * | 2019-12-18 | 2020-04-07 | 湖北平安电工材料有限公司 | Mica tape preparation method |
| CN114621699A (en) * | 2022-03-24 | 2022-06-14 | 中广核新奇特(扬州)电气有限公司 | Production process of polyimide film dry mica tape |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102254650A (en) * | 2011-03-30 | 2011-11-23 | 株洲时代电气绝缘有限责任公司 | Less-resin mica tape and preparation method thereof |
| CN102412041A (en) * | 2011-10-27 | 2012-04-11 | 苏州巨峰电气绝缘系统股份有限公司 | Preparation method of high-air-permeability less-glue mica tape |
| CN103440902A (en) * | 2013-08-29 | 2013-12-11 | 苏州巨峰电气绝缘系统股份有限公司 | Mica tape, high in ventilation performance and with little glue, suitable for pure epoxy VPI insulating resin and preparation method thereof |
| CN105047256A (en) * | 2015-06-30 | 2015-11-11 | 株洲时代新材料科技股份有限公司 | Mica tape containing microcapsule curing accelerator and preparation method thereof |
-
2015
- 2015-12-01 CN CN201510866791.0A patent/CN106816205A/en active Pending
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102254650A (en) * | 2011-03-30 | 2011-11-23 | 株洲时代电气绝缘有限责任公司 | Less-resin mica tape and preparation method thereof |
| CN102412041A (en) * | 2011-10-27 | 2012-04-11 | 苏州巨峰电气绝缘系统股份有限公司 | Preparation method of high-air-permeability less-glue mica tape |
| CN103440902A (en) * | 2013-08-29 | 2013-12-11 | 苏州巨峰电气绝缘系统股份有限公司 | Mica tape, high in ventilation performance and with little glue, suitable for pure epoxy VPI insulating resin and preparation method thereof |
| CN105047256A (en) * | 2015-06-30 | 2015-11-11 | 株洲时代新材料科技股份有限公司 | Mica tape containing microcapsule curing accelerator and preparation method thereof |
Non-Patent Citations (2)
| Title |
|---|
| 机械工业部: "《机械产品目录 第23册 电工绝缘材料、电碳制品、电工合金》", 30 June 1986 * |
| 陈仲 等: "《中国电气工程大典 第3卷 电气工程材料及器件》", 31 March 2009 * |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110970184A (en) * | 2019-12-18 | 2020-04-07 | 湖北平安电工材料有限公司 | Mica tape preparation method |
| CN114621699A (en) * | 2022-03-24 | 2022-06-14 | 中广核新奇特(扬州)电气有限公司 | Production process of polyimide film dry mica tape |
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