CN106793562B - A kind of large area steel mesh windowing method of encapsulation technology - Google Patents
A kind of large area steel mesh windowing method of encapsulation technology Download PDFInfo
- Publication number
- CN106793562B CN106793562B CN201611146126.5A CN201611146126A CN106793562B CN 106793562 B CN106793562 B CN 106793562B CN 201611146126 A CN201611146126 A CN 201611146126A CN 106793562 B CN106793562 B CN 106793562B
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- CN
- China
- Prior art keywords
- steel mesh
- windowing
- area
- window size
- large area
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- 229910000831 Steel Inorganic materials 0.000 title claims abstract description 56
- 239000010959 steel Substances 0.000 title claims abstract description 56
- 238000000034 method Methods 0.000 title claims abstract description 15
- 238000005538 encapsulation Methods 0.000 title claims abstract description 11
- 238000005516 engineering process Methods 0.000 title claims abstract description 8
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 claims abstract description 13
- 239000006071 cream Substances 0.000 claims abstract description 11
- 229910000679 solder Inorganic materials 0.000 claims abstract description 10
- 238000000926 separation method Methods 0.000 claims description 7
- 238000003466 welding Methods 0.000 abstract description 11
- 238000004519 manufacturing process Methods 0.000 abstract description 4
- 238000005259 measurement Methods 0.000 abstract description 2
- 230000009286 beneficial effect Effects 0.000 description 1
- 239000006227 byproduct Substances 0.000 description 1
- 238000004364 calculation method Methods 0.000 description 1
- 230000008021 deposition Effects 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 238000004806 packaging method and process Methods 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
- H05K3/341—Surface mounted components
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/04—Soldering or other types of metallurgic bonding
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Electric Connection Of Electric Components To Printed Circuits (AREA)
Abstract
The invention discloses a kind of large area steel mesh windowing methods of encapsulation technology, and according to pcb board solder area, solder area is divided into multiple homogenous cells；Steel mesh window size and windowing interval are determined according to homogenous cell size；According to steel mesh window size and windowing interval processing steel mesh.The area that the present invention is welded by the needs of measurement pcb board calculates window size and the windowing interval of steel mesh.The steel mesh processed by the method can effectively reduce the usage amount of tin cream, reduce production cost；Meanwhile, it is capable to guarantee that welding is good, stablize, good mechanical property.
Description
Technical field
The present invention relates to encapsulation technology field more particularly to a kind of large area steel mesh windowing methods of encapsulation technology.
Background technique
Steel mesh (stencils) namely SMT template (SMT Stencil) is a kind of SMT particular manufacturing craft, major function
It is to aid in the deposition of welding material tin cream, it is therefore an objective to which the tin cream of accurate quantity is transferred to the accurate location on sky pcb board.
Under normal conditions, the side PCB large area needs not welding resistance, when designing steel mesh, is opened a window using large area, this design
Technique easily causes following problem:
1, the problems such as solder(ing) paste usage amount is excessive, and in welding process, tin cream overflows pcb board edge, causes short circuit；
2, when solder(ing) paste usage amount is very few, in welding process, tin cream can not be paved with pcb board, cause failure welding, be welded
The problems such as power is insufficient, and mechanical strength is insufficient.
Summary of the invention
The purpose of the present invention is a kind of large area steel mesh windowing methods of device packaging technique, can effectively reduce tin cream
Usage amount, reduce production cost.Meanwhile, it is capable to guarantee that welding is good, stablize, good mechanical property.
For achieving the above object, the technical scheme is that a kind of large area steel mesh windowing side of encapsulation technology
Solder area is divided into multiple homogenous cells according to pcb board solder area by method；
Determine that steel mesh opens a window according to homogenous cell size:
Steel mesh windowing area: L1*W1=L*W*H1/H；
Steel mesh window size:
Steel mesh windowing lateral separation: KL=L-L1；
Steel mesh windowing longitudinal gap: KW=W-W1；
Wherein, L: the length of homogenous cell；W: the width of homogenous cell；L1: the length of windowing；W1: the width of windowing；H:
The thickness or tin cream height of steel mesh；H1: scolding tin height after the completion of encapsulation；KL: steel mesh windowing lateral separation；KW: steel mesh windowing is longitudinal
Interval；
According to steel mesh window size and windowing interval processing steel mesh.
The beneficial effects of the present invention are:
1, go out the window size of steel mesh by the areal calculation that measurement PCB welding plate needs weld, and according to the windowing of steel mesh
Dimensioned steel mesh.
2, the steel mesh processed by the method can effectively reduce the usage amount of tin cream, reduce production cost；Meanwhile
It can guarantee that welding is good, stablize, good mechanical property.
Detailed description of the invention
Fig. 1 is steel mesh windowing schematic diagram of the invention.
Specific embodiment
Below in conjunction with attached drawing, technical scheme in the embodiment of the invention is clearly and completely described.
As shown in Figure 1, a kind of large area steel mesh windowing method of encapsulation technology, which is characterized in that according to pcb board solder side
Product, is divided into multiple homogenous cells for solder area；
Determine that steel mesh opens a window according to homogenous cell size:
Steel mesh windowing area: L1*W1=L*W*H1/H；
Steel mesh window size:
Steel mesh windowing lateral separation: KL=L-L1；
Steel mesh windowing longitudinal gap: KW=W-W1；
Wherein, L: the length of homogenous cell；W: the width of homogenous cell；L1: the length of windowing；W1: the width of windowing；H:
The thickness or tin cream height of steel mesh；H1: scolding tin height after the completion of encapsulation；KL: steel mesh windowing lateral separation；KW: steel mesh windowing is longitudinal
Interval；
According to steel mesh window size and windowing interval processing steel mesh.
Specific embodiment
Not welding resistance now is carried out to the pcb board that an area is 15mm × 9mm, pcb board is divided into uniform nine pieces, each block size
For 5mm × 3mm；Tin cream welding after the completion of thickness be about 0.05mm, if select steel mesh with a thickness of 0.25mm, pass through above-mentioned side
Fa Ke get, the size of steel mesh windowing are 2.236mm × 1.342mm, and the longitudinal gap of steel mesh windowing is 1.658mm, steel mesh windowing
Lateral separation be 2.764mm.According to the size of obtained steel mesh windowing and interval processing steel mesh.
Described embodiments are only a part of the embodiments of the present invention, instead of all the embodiments.Based on the present invention
In embodiment, every other implementation obtained by those of ordinary skill in the art without making creative efforts
Example, belongs to the scope of the present invention.
Claims (1)
1. a kind of large area steel mesh windowing method of encapsulation technology, which comprises the following steps:
Step 1) is divided into multiple homogenous cells according to pcb board solder area, by solder area；
Step 2) determines that steel mesh opens a window according to homogenous cell size, wherein
Steel mesh windowing area:
L1*W1=L*W*H1/H；
Steel mesh window size:
Steel mesh windowing lateral separation:
KL=L-L1；
Steel mesh windowing longitudinal gap:
KW=W-W1；
In formula, L is the length of homogenous cell, and W is the width of homogenous cell, and L1 is the length of windowing, and W1 is the width of windowing, H
For the thickness or tin cream height of steel mesh, H1 is scolding tin height after the completion of encapsulation, KLFor steel mesh windowing lateral separation, KWIt is opened for steel mesh
Window longitudinal gap；
Step 3) is according to steel mesh window size in step 2) and windowing interval processing steel mesh.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201611146126.5A CN106793562B (en) | 2016-12-13 | 2016-12-13 | A kind of large area steel mesh windowing method of encapsulation technology |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201611146126.5A CN106793562B (en) | 2016-12-13 | 2016-12-13 | A kind of large area steel mesh windowing method of encapsulation technology |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN106793562A CN106793562A (en) | 2017-05-31 |
| CN106793562B true CN106793562B (en) | 2019-02-26 |
Family
ID=58880667
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201611146126.5A Active CN106793562B (en) | 2016-12-13 | 2016-12-13 | A kind of large area steel mesh windowing method of encapsulation technology |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN106793562B (en) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN113905539B (en) * | 2021-09-27 | 2023-11-24 | 淮安澳洋顺昌光电技术有限公司 | LED chip printing steel mesh |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN2845399Y (en) * | 2005-11-21 | 2006-12-06 | 比亚迪股份有限公司 | Flexible printed circuit board |
| WO2010138824A2 (en) * | 2009-05-28 | 2010-12-02 | Microblade, Llc | Microtca device |
| CN102026497A (en) * | 2009-09-16 | 2011-04-20 | 沈阳晨讯希姆通科技有限公司 | Power amplifier screens and methods for disposing holes thereon |
Family Cites Families (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN205179525U (en) * | 2015-11-27 | 2016-04-20 | 广州广电运通金融电子股份有限公司 | PCB packaging structure who contains big pad |
-
2016
- 2016-12-13 CN CN201611146126.5A patent/CN106793562B/en active Active
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN2845399Y (en) * | 2005-11-21 | 2006-12-06 | 比亚迪股份有限公司 | Flexible printed circuit board |
| WO2010138824A2 (en) * | 2009-05-28 | 2010-12-02 | Microblade, Llc | Microtca device |
| CN102026497A (en) * | 2009-09-16 | 2011-04-20 | 沈阳晨讯希姆通科技有限公司 | Power amplifier screens and methods for disposing holes thereon |
Also Published As
| Publication number | Publication date |
|---|---|
| CN106793562A (en) | 2017-05-31 |
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