CN106793486A - A kind of IC package assemblies and its assemble method - Google Patents
A kind of IC package assemblies and its assemble method Download PDFInfo
- Publication number
- CN106793486A CN106793486A CN201611198777.9A CN201611198777A CN106793486A CN 106793486 A CN106793486 A CN 106793486A CN 201611198777 A CN201611198777 A CN 201611198777A CN 106793486 A CN106793486 A CN 106793486A
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- CN
- China
- Prior art keywords
- annular pad
- pad
- chip
- annular
- printed circuit
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/11—Printed elements for providing electric connections to or between printed circuits
- H05K1/111—Pads for surface mounting, e.g. lay-out
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09209—Shape and layout details of conductors
- H05K2201/09372—Pads and lands
- H05K2201/0939—Curved pads, e.g. semi-circular or elliptical pads or lands
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Shielding Devices Or Components To Electric Or Magnetic Fields (AREA)
Abstract
The present invention discloses a kind of IC package assemblies, the IC package assemblies include printed circuit board (PCB) and the chip being installed on the printed circuit board (PCB), it is formed with all chip pins at the bottom surface of the chip around first annular pad in the inner, the printed circuit board (PCB) is formed with the second annular pad for being matched with the first annular pad, the first annular pad and the second annular pad are welded and form sealing ring, so, the setting of the sealing ring, the anti-drop ability of the IC package assemblies can be made to be strengthened, waterproof and dampproof ability enhancing, pin can be also avoided to be attacked by electrostatic, simultaneously, the step of simplifying IC packaging technologies.Invention additionally discloses a kind of assemble method of IC package assemblies, using a kind of steel mesh mould with steel mesh bridge point, above-mentioned IC package assemblies can be made.
Description
Technical field
The present invention relates to integrated circuit package technique field, and in particular to a kind of IC package assemblies and its assemble method.
Background technology
Integrated circuit (integrated circuit) also known as IC, with the development of electronic market, answered by IC package techniques
For electronics fields such as computer, mobile phone, Fingerprint Locks.BGA (BGA) and LGA (grid array) encapsulation is all that comparing is normal
The encapsulation seen, it instead of conventional needle-like pins type assembling and assembles skill in semiconductor integrated circuit with the mode that scolding tin is connected
Art is widely used in field.
It is as depicted in figs. 1 and 2 the IC package assemblies of prior art, it includes printed circuit board (PCB) 10 and is installed on printing electricity
Chip 20 on the plate of road, after chip 20 is installed on printed circuit board (PCB) 10 through surface mounting technology, then adopts around chip 20
Glue is filled with gluing process dot encapsulation glue 40 or again in the bottom surface of chip 20 to reach fixing seal, waterproof and dampproof, raising reliability
Property test when yields effect.Shortcoming of the IC package assemblies using gluing process is in the prior art：First, due to dispensing work
The limitation of skill can bring many defective products, such as the phenomenon such as glue amount excessive, excessive glue, stomata to assembly；2nd, fluid sealant resistance
Electrostatic it is limited in one's ability, pin is easily attacked by electrostatic；3rd, gluing process is in chip 20 and the assembling of printed circuit board (PCB) 10
After carry out, the technique for causing IC chip to assemble becomes numerous and diverse, and reprocesses difficulty using the IC package assemblies after gluing process.
In consideration of it, providing a kind of IC package assemblies for eliminating gluing process to solve above-mentioned technical problem.
The content of the invention
The technical problems to be solved by the invention are to provide a kind of waterproof moistureproof, simplified assembling procedure, static electricity resistance
Can good, the IC package assemblies that anti-drop ability is strong and its assemble method.
In order to solve the above technical problems, the present invention uses technical scheme as described below：
A kind of IC package assemblies, include printed circuit board (PCB) and the chip being installed on the printed circuit board (PCB), the core
It is formed with all chip pins at the bottom surface of piece around first annular pad in the inner, the printed circuit board (PCB) is formed with
The second annular pad assigned in the first annular pad, the first annular pad is welded with the second annular pad and forms close
Seal.
Preferably, the first annular pad and the second annular pad are welded using scolding tin and are formed the sealing
Circle.
Preferably, the first annular pad is rectangle, circle, ellipse or polygon.
Preferably, the first annular pad is identical with the shape of the second annular pad and position is corresponding.
Preferably, the first annular pad is grounded with the second annular pad.
The assemble method of above-mentioned IC package assemblies, comprises the steps：
A, at the bottom surface of chip one is formed by all chip pins around first annular pad in the inner, in printing electricity
Second annular pad for being matched with the first annular pad is formed on the plate of road；
B, by first annular pad and the second annular pad welding and form sealing ring.
Preferably, in stepb, the first annular pad and the second annular pad are welded by scolding tin.
Preferably, in step a, the step of also including one and be grounded first annular pad and the second annular pad.
Preferably, in stepb, entered using a steel mesh mould for being provided with the endless belt matched with first annular pad
The printing of row scolding tin, is provided with steel mesh bridge point in the endless belt.
Preferably, the width of the steel mesh bridge point is 0.2mm.
Advantageous Effects of the invention are：It is formed with all chip pins at the bottom surface of chip around in the inner
First annular pad, the second annular pad for being matched with the first annular pad, described are formed with printed circuit board (PCB)
One annular pad and the second annular pad are welded and form sealing ring, in this way, by the setting of the sealing ring, increased chip and
The bonding area of printed circuit board (PCB), lifts the anti-drop ability of IC package assemblies, and strengthens the waterproof and dampproof energy of IC package assemblies
Power, can also avoid pin from being attacked by electrostatic, meanwhile, weld first annular pad and the second annular pad and form sealing ring
Step can simultaneously be carried out the step of welding chip and printed circuit board (PCB), the step of simplify IC packaging technologies.
Brief description of the drawings
Fig. 1 is the chip of prior art IC package assemblies and the structural representation of printed circuit board (PCB).
Fig. 2 is front and the cross section structure schematic diagram of prior art IC package assemblies.
Fig. 3 is the chip of the embodiment of the present invention one and the structural representation of printed circuit board (PCB).
Fig. 4 is front and the cross section structure schematic diagram of the embodiment of the present invention one.
Fig. 5 is the mplifying structure schematic diagram in the section of the embodiment of the present invention one.
Fig. 6 is the structural representation of the chip of the embodiment of the present invention two.
Fig. 7 is the cross section structure schematic diagram of the embodiment of the present invention three.
Fig. 8 is the structural representation of the embodiment of the steel mesh mould used in the assembling process of the embodiment of the present invention two.
Specific embodiment
To make one of ordinary skill in the art be more clearly understood from the object, technical solutions and advantages of the present invention, with
Under the present invention is further elaborated in conjunction with the accompanying drawings and embodiments.
Reference picture 3 and Fig. 4, are the schematic diagrames of the embodiment of the present invention one, and it includes printed circuit board (PCB) 10 and is installed on printing
Chip 20 on circuit board.Chip 20 includes bottom surface 21 and top surface 22, and the pin 210 of rectangle, the pin are provided with bottom surface 21
210 are arranged at the bottom surface of chip 20 in array shape, and first annular pad 211, first annular pad are provided with around pin 210
211 are all enclosed in inside first annular pad 211 chip pin 210；Printed circuit board (PCB) 10 includes upper surface 11 and lower surface
12, upper surface 11 fits with the bottom surface 21 of chip, is provided with that identical with the quantity of pin 210 and position is corresponding on upper surface 11
Pad 110 and and shape identical second annular pad 111 corresponding with the position of first annular pad 211.
The width of first annular pad 211 is influenceed by the die size of assembly, also by production technology in process
Influence.In the present embodiment, the size of chip is 9mm × 9mm, and the width of first annular pad 211 is 0.3mm, at other
In embodiment, however it is not limited to this, can be in the range of 0.4mm~0.6mm.When die size than it is larger when, first annular pad
211 width also increases therewith.
The bottom surface 21 of chip 20 will be fitted with the upper surface 11 of printed circuit board (PCB) using surface mounting technology during assembling, drawn
Pin 210 is in electrical contact with pad 110, and first annular pad 211 is connected with the second annular pad 111 by scolding tin, forms one
Individual sealing ring 30, reference picture 5, the thickness of sealing ring 30 is pin 210 after chip 20 can be made to fit on the printed circuit board 10
It is in electrical contact with pad 110.The effect of sealing ring 30 has：First, with being fixedly connected chip 20 and printed circuit board (PCB) 10；
2nd, pin 210 is protected, waterproof, it is moistureproof；3rd, the annular pad 111 of first annular pad 211 and second is all grounded, and can have
The protection pin 210 of effect is not attacked by strong electrostatic produced in the embodiment course of work.
Reference picture 6, is the schematic diagram of the embodiment of the present invention two, in the present embodiment, the structure of printed circuit board (PCB) and chip
It is identical with embodiment one, circular pin 510 is provided with the bottom surface 51 of chip 50, the pin 510 is arranged in array shape
At the bottom surface of chip 50, first annular pad 511 is around provided with, all be enclosed in chip pin 510 by first annular pad 511
Inside first annular pad 511；The upper surface of printed circuit board (PCB) fits with the bottom surface 51 of chip, is provided with upper surface and drawn
The quantity of pin 510 is identical and the corresponding pad in position and with the second annular pad of shape identical of first annular pad 511.
Reference picture 7, is the schematic diagram of the embodiment of the present invention three, in the present embodiment, printed circuit board (PCB), chip, pin,
One annular pad, pad, the second annular pad structure it is all identical with embodiment two, be provided with tin on the bottom surface of chip 60
Quite, pin leads to after chip 60 can be made to be fitted on printed circuit board (PCB) 70 for ball 610, the thickness of sealing ring 80 and the diameter of tin ball
Cross tin ball in electrical contact with pad.
The assembling process of IC package assemblies embodiment two of the present invention is as follows：
A, making printed circuit board (PCB) and chip：Chip pin and first annular pad are printed off on chip, in printed circuit
The corresponding pad in and position identical with chip pin quantity and and shape identical corresponding with first annular pad are printed off on plate
Second ring pad, and first annular pad and the second annular pad are grounded；
Steel mesh mould used in the process of b, making scolding tin：On steel mesh according to pin and first annular pad shape and
Position is perforated, and the first annular pad corresponding position on steel mesh is an endless belt, and endless belt is not fully connected, in ring
Some steel mesh bridge points are remained with shape band, steel mesh bridge point can make the state that steel mesh mould is a monoblock；
C, print solder paste：Print solder paste after the steel mesh laminating corresponding with printed substrate that said process is made, because of steel mesh
On endless belt on be provided with steel mesh bridge point, in the first annular pad the second annular pad corresponding with printed circuit board (PCB)
On the tin cream that prints off be to disconnect in steel mesh bridge point position；
D, IC paster：Said chip laminating corresponding with the printed circuit board (PCB), chip pin are corresponded with pad, the
One annular pad is corresponding with the second annular pad；
E, welding IC：Reflow ovens are crossed after chip and printed circuit board (PCB) paster, tin cream receives high temperature melt, has stream after tin cream thawing
Move property and climb tin effect, the second annular pad is during print solder paste because the place deposited and disconnecting of steel mesh bridge point can be in tin cream
Closure is got up after thawing, forms sealing ring, while completing the welding of IC.
Reference picture 8, is the embodiment of the steel mesh mould that the production method for coordinating above-mentioned IC assemblies is used, the steel mesh mould
Tool include a steel plate 90, be provided with steel plate 90 with IC assemblies pad and pin shapes identical hole 91, set around hole 91
First annular pad size shape identical endless belt 92 is equipped with, some steel mesh bridge points 920, steel mesh are provided with endless belt 92
Bridge point 920 can make steel mesh mould be connected in the inside 93 of endless belt 92 and outside 94.In the present embodiment, steel mesh bridge point
920 width is 0.2mm, and this is not limited in other embodiments, and the width of steel mesh bridge point 920 receives thickness, the size of steel mesh
Deng the influence of factor, can also be influenceed by the width of endless belt 92.
The preferred embodiments of the present invention are the foregoing is only, rather than any formal limitation is done to the present invention.This area
Technical staff various equivalent changes and improvement, all institutes within the scope of the claims can be imposed on the basis of above-described embodiment
The equivalent variations done or modification, all should fall under the scope of the present invention.
Claims (10)
1. a kind of IC package assemblies, include printed circuit board (PCB) and the chip being installed on the printed circuit board (PCB), and its feature exists
In：It is formed with all chip pins at the bottom surface of the chip around first annular pad in the inner, the printed circuit
Plate is formed with the second annular pad for being matched with the first annular pad, and the first annular pad and the second annular pad are welded
Connect and form sealing ring.
2. IC package assemblies as claimed in claim 1, it is characterised in that：The first annular pad makes with the second annular pad
Welded with scolding tin and formed the sealing ring.
3. IC package assemblies as claimed in claim 1, it is characterised in that：The first annular pad is rectangle, circle, ellipse
Shape or polygon.
4. IC package assemblies as claimed in claim 1, it is characterised in that：The first annular pad and the second annular pad
Shape is identical and position is corresponding.
5. IC package assemblies as claimed in claim 1, it is characterised in that：The first annular pad is equal with the second annular pad
Ground connection.
6. a kind of IC assemble methods, it includes having the following steps：
A, at the bottom surface of chip one is formed by all chip pins around first annular pad in the inner, in printed circuit board (PCB)
It is upper to form second annular pad for being matched with the first annular pad；
B, by first annular pad and the second annular pad welding and form sealing ring.
7. IC assemble methods as claimed in claim 6, it is characterised in that in stepb, first ring is welded by scolding tin
Shape pad and the second annular pad.
8. IC assemble methods as claimed in claim 6, it is characterised in that in step a, also include by first annular weldering
The step of disk and the second annular pad are grounded.
9. IC assemble methods as claimed in claim 6, it is characterised in that in stepb, using one be provided with it is first annular
The steel mesh mould of the endless belt that pad matches carries out the printing of scolding tin, and steel mesh bridge point is provided with the endless belt.
10. IC assemble methods as claimed in claim 6, it is characterised in that the width of the steel mesh bridge point is 0.2mm.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201611198777.9A CN106793486A (en) | 2016-12-22 | 2016-12-22 | A kind of IC package assemblies and its assemble method |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201611198777.9A CN106793486A (en) | 2016-12-22 | 2016-12-22 | A kind of IC package assemblies and its assemble method |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN106793486A true CN106793486A (en) | 2017-05-31 |
Family
ID=58897852
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201611198777.9A Pending CN106793486A (en) | 2016-12-22 | 2016-12-22 | A kind of IC package assemblies and its assemble method |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN106793486A (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108925039A (en) * | 2018-06-25 | 2018-11-30 | 维沃移动通信有限公司 | Mobile terminal, circuit board assembly and method for preparing circuit board assembly |
| CN110707052A (en) * | 2019-11-13 | 2020-01-17 | 东莞市新懿电子材料技术有限公司 | A chip packaging structure |
| CN111511124A (en) * | 2020-03-08 | 2020-08-07 | 苏州浪潮智能科技有限公司 | A kind of soldering method of chip and PCB board |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20030201528A1 (en) * | 2002-04-29 | 2003-10-30 | Chi-Hsing Hsu | Flip-chip die and flip-chip package substrate |
| US6770963B1 (en) * | 2001-01-04 | 2004-08-03 | Broadcom Corporation | Multi-power ring chip scale package for system level integration |
| CN206498587U (en) * | 2016-12-22 | 2017-09-15 | 深圳图正科技有限公司 | A kind of IC package assemblies |
-
2016
- 2016-12-22 CN CN201611198777.9A patent/CN106793486A/en active Pending
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6770963B1 (en) * | 2001-01-04 | 2004-08-03 | Broadcom Corporation | Multi-power ring chip scale package for system level integration |
| US20030201528A1 (en) * | 2002-04-29 | 2003-10-30 | Chi-Hsing Hsu | Flip-chip die and flip-chip package substrate |
| CN206498587U (en) * | 2016-12-22 | 2017-09-15 | 深圳图正科技有限公司 | A kind of IC package assemblies |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108925039A (en) * | 2018-06-25 | 2018-11-30 | 维沃移动通信有限公司 | Mobile terminal, circuit board assembly and method for preparing circuit board assembly |
| CN110707052A (en) * | 2019-11-13 | 2020-01-17 | 东莞市新懿电子材料技术有限公司 | A chip packaging structure |
| CN111511124A (en) * | 2020-03-08 | 2020-08-07 | 苏州浪潮智能科技有限公司 | A kind of soldering method of chip and PCB board |
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Application publication date: 20170531 |