CN106784368A - A kind of display panel package structure, display device and preparation method - Google Patents
A kind of display panel package structure, display device and preparation method Download PDFInfo
- Publication number
- CN106784368A CN106784368A CN201611206395.6A CN201611206395A CN106784368A CN 106784368 A CN106784368 A CN 106784368A CN 201611206395 A CN201611206395 A CN 201611206395A CN 106784368 A CN106784368 A CN 106784368A
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- display panel
- oxygen barrier
- layer
- inorganic water
- water oxygen
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K50/00—Organic light-emitting devices
- H10K50/80—Constructional details
- H10K50/84—Passivation; Containers; Encapsulations
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K50/00—Organic light-emitting devices
- H10K50/80—Constructional details
- H10K50/84—Passivation; Containers; Encapsulations
- H10K50/841—Self-supporting sealing arrangements
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
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- Optics & Photonics (AREA)
- Electroluminescent Light Sources (AREA)
Abstract
The present invention discloses a kind of display panel package structure, display device and preparation method, and the preparation method includes：Display panel is made on a substrate, and making one around display panel has the bank layer of chamfering shape opening；The first inorganic water oxygen barrier layer is deposited on the display panel and bank layer using ALD techniques；Organic buffer layer is deposited on the described first inorganic water oxygen barrier layer using pecvd process；The second inorganic water oxygen barrier layer is deposited on organic buffer layer using ALD techniques, the second inorganic water oxygen barrier layer is connected at chamfering shape opening with the first inorganic water oxygen barrier layer exposed.The present invention has the bank layer of chamfering shape opening by making one, using the good step coverage of ALD techniques and the poor step coverages of PECVD, under conditions of same size mask, be sealed in organic buffer layer in thin-film packing structure inside the inorganic water oxygen barrier layer of two-layer by realization, so as to simplify manufacture craft, cost is reduced.
Description
Technical field
The present invention relates to display technology field, more particularly to a kind of display panel package structure, display device and making side
Method.
Background technology
In the present age of information-intensive society, the importance as the display of visual information transmission medium is further being strengthened, and is
In future leading position will be occupied, display is just towards lighter, thinner, more low energy consumption, more inexpensive and more preferable picture quality
Trend development.
Organic electroluminescent LED（OLED）There is self-luminous due to it, reaction is fast, visual angle is wide, brightness is high, frivolous etc.
Advantage, its market potential prospect is had an optimistic view of by industry.Most probably develop into Display Technique of future generation.
But, OLED water, oxygen are more sensitive, and the infiltration of water oxygen is very big to the aging effects of device, it is therefore desirable to enter
The strict encapsulation of row.More the encapsulation technology in forward position is thin-film package at present, mutual by inorganic encapsulated layer and organic buffer layer
Superposition forms packaging film, and in order to prevent water oxygen from being penetrated into from the side of the organic buffer layer of stacked package film, the nothing on upper strata
Machine encapsulated layer needs to cover the organic buffer layer of lower floor and lower floor's inorganic encapsulated layer, therefore needs difference when making thin-film encapsulation layer
The mask of size（mask）Switch to realize covering of the topmost thin film to lower film, increased process time and cost of manufacture.
Therefore, prior art has yet to be improved and developed.
The content of the invention
In view of above-mentioned the deficiencies in the prior art, it is an object of the invention to provide a kind of display panel package structure, display
Device and preparation method, it is intended to solve to need various sizes of mask switching to realize when making thin-film encapsulation layer in the prior art
Covering of the topmost thin film to lower film, increased the problem of process time and cost of manufacture.
Technical scheme is as follows：
A kind of preparation method of display panel package structure, including step：
A, display panel is made on a substrate, making one around the display panel has the bank layer of chamfering shape opening, its
In, the chamfering shape split ring exposes the substrate of lower end around the display panel at the chamfering shape opening；
B, the first inorganic water oxygen barrier layer is deposited on the display panel and the bank layer using atom layer deposition process,
The first inorganic water oxygen barrier layer keeps chamfering shape at the chamfering shape opening；
C, using plasma enhancing chemical vapor deposition method deposit organic buffer on the described first inorganic water oxygen barrier layer
Layer, exposes the described first inorganic water oxygen barrier layer at the chamfering shape opening；
D, the second inorganic water oxygen barrier layer is deposited on the organic buffer layer using atom layer deposition process, described second is inorganic
Water oxygen barrier layer is connected at chamfering shape opening with the described first inorganic water oxygen barrier layer exposed.
The preparation method of described display panel package structure, wherein, the material bag on the first inorganic water oxygen barrier layer
Include Al2O3、SiO2。
The preparation method of described display panel package structure, wherein, the material of the organic buffer layer includes organosilicon.
The preparation method of described display panel package structure, wherein, the material bag on the second inorganic water oxygen barrier layer
Include Al2O3、SiO2。
The preparation method of described display panel package structure, wherein, the display panel be OLED display panel or
QLED display panels.
The preparation method of described display panel package structure, wherein, the thickness on the first inorganic water oxygen barrier layer is
100~500nm。
The preparation method of described display panel package structure, wherein, the thickness of the organic buffer layer for 500 ~
3000nm。
The preparation method of described display panel package structure, wherein, the thickness on the second inorganic water oxygen barrier layer is
100~500nm。
A kind of display panel package structure, using the preparation method of the display panel package structure as described in any of the above
Making is obtained.
A kind of display device, including display panel package structure as described above.
Beneficial effect：The present invention has the bank layer of chamfering shape opening by making one around the display panel, utilizes
The good step coverage of ALD techniques and the poor step coverages of PECVD, under conditions of same size mask, realize
Organic buffer layer in thin-film packing structure is sealed in inside the inorganic water oxygen barrier layer of two-layer, so as to simplify the making of correlation
Technique, reduces cost.
Brief description of the drawings
Fig. 1 is the flow chart of the preparation method of display panel package structure of the present invention.
Fig. 2 is the overall schematic of display panel package structure of the present invention.
Fig. 3 is the partial structural diagram at A in Fig. 2.
Fig. 4 is the structural representation of the bank layer with chamfering shape opening of the present invention.
Fig. 5 is the structural representation on the of the present invention first inorganic water oxygen barrier layer.
Fig. 6 is the structural representation of organic buffer layer of the present invention.
Specific embodiment
The present invention provides a kind of display panel package structure, display device and preparation method, to make the purpose of the present invention, skill
Art scheme and effect are clearer, clear and definite, and the present invention is described in more detail below.It should be appreciated that tool described herein
Body embodiment is only used to explain the present invention, is not intended to limit the present invention.
The invention provides a kind of preparation method of display panel package structure, as shown in figure 1, it includes step：
S1, display panel is made on a substrate, making one around the display panel has the bank layer of chamfering shape opening, its
In, the chamfering shape split ring exposes the substrate of lower end around the display panel at the chamfering shape opening；
S2, using ald（ALD）Technique deposits the first inorganic water oxygen on the display panel and the bank layer
Barrier layer, the first inorganic water oxygen barrier layer keeps chamfering shape at the chamfering shape opening；
S3, using plasma enhancing chemical vapor deposition（PECVD）Technique is deposited on the described first inorganic water oxygen barrier layer
Organic buffer layer, exposes the described first inorganic water oxygen barrier layer at the chamfering shape opening；
S4, using ald（ALD）Technique deposits the second inorganic water oxygen barrier layer, described on the organic buffer layer
Two inorganic water oxygen barrier layers are connected at chamfering shape opening with the described first inorganic water oxygen barrier layer exposed.
The present invention has the bank layer of chamfering shape opening by making one around the display panel, good using ALD techniques
The poor step coverage of good step coverage and PECVD, in same size mask（mask）Under conditions of, realization will be thin
Organic buffer layer in film encapsulating structure is sealed in inside the inorganic water oxygen barrier layer of two-layer, so as to simplify the making work of correlation
Skill, reduces cost.
Further, in the present embodiment, the material on the described first inorganic water oxygen barrier layer includes but is not limited to Al2O3、
SiO2.Using the described in ALD process deposits first inorganic water oxygen barrier layer, due to the good step coverages of ALD, the first inorganic water
Oxygen barrier layers can be completely covered the dykes and dams of chamfering shape（Dam）Layer is open and keeps original chamfering shape.
Further, in the present embodiment, the material of the organic buffer layer includes but is not limited to organosilicon.Using
Pecvd process deposits the organic buffer layer, and due to the step coverage that PECVD is poor, organic buffer layer cannot be completely covered
The chamfering shape opening of bank layer, exposes the first inorganic water oxygen barrier layer.
Further, in the present embodiment, the material on the described second inorganic water oxygen barrier layer includes but is not limited to Al2O3、
SiO2.Using the described in ALD process deposits second inorganic water oxygen barrier layer, due to the good step coverages of ALD, the second inorganic water
Oxygen barrier layers can be completely covered the chamfering shape opening of bank layer, and with the first inorganic water for not there is the machine cushion to cover
Oxygen barrier layers are connected, so as to organic buffer layer is entirely sealed in inorganic water oxygen barrier layer.
Further, in the present embodiment, the described first inorganic water oxygen barrier layer and the second inorganic water oxygen barrier layer
Thickness be 100 ~ 500nm, and the thickness of the organic buffer layer be 500 ~ 3000nm.
Further, in the present embodiment, the display panel is OLED display panel or QLED（Quantum dot light emitting two
Pole pipe）Display panel.
Further, in the present embodiment, the material of the bank layer can be prepared using photoresist, because photoresistance material
Material is easy to graphical, and preferred bank layer is prepared using negativity photoresist.
Based on the preparation method of above-described display panel package structure, the embodiment of the present invention additionally provides a kind of display
Panel encapsulating structure, it uses the preparation method of above-described display panel package structure to make and obtains.
Specifically, the display panel for obtaining is made using the preparation method of the above display panel package structure encapsulates knot
Structure, as shown in Fig. 2 it includes substrate 1, display panel（Display unit）2 and thin-film packing structure（Encapsulation unit）3；Wherein, institute
Stating substrate includes viewing area and non-display area；The display panel 2 is arranged on the viewing area.
Further, as shown in Figures 3 to 6, film of the present invention（TFE）Encapsulating structure includes trilamellar membrane layer：First
Inorganic water oxygen barrier layer 31, the inorganic water oxygen barrier layer 33 of organic buffer layer 32 and second.Ring is provided with the non-display area
Around display panel 2（Viewing area）Bank layer 4；It is provided with the bank layer 4 around the chamfering shape opening of display panel 2
41, and expose the substrate of lower end at chamfering shape opening 41；The first inorganic covering of water oxygen barrier layer 31 is arranged on described
On bank layer 4 and shown panel 2, and chamfering shape is kept at the chamfering shape opening 41；The organic buffer layer 32 covers
Lid is arranged on the described first inorganic water oxygen barrier layer 31, and exposes the first inorganic water oxygen stop at chamfering shape opening 41
Layer 31；The second inorganic covering of water oxygen barrier layer 33 is arranged on the organic buffer layer 32, and in chamfering shape opening
It is connected with the first inorganic water oxygen barrier layer 31 exposed at 41.
The present invention is then adopted by making the chamfering shape bank layer around viewing area positioned at the encapsulation region of non-display area
With the inorganic water oxygen barrier layer of ALD process deposits, pecvd process deposits organic buffer layer, due to the good step coverages of ALD,
PECVD poor step coverage, after three layers of packaging film have been deposited, the inorganic water oxygen barrier layer of two-layer is connected with each other, by
Between organic buffer layer be entirely sealed in inorganic water oxygen barrier layer, prevent edge water oxygen from penetrating into film from organic buffer layer
Inside encapsulated layer, so as to realize being made of same size mask organic buffer layer is sealed in inside inorganic water oxygen barrier layer
Thin-film packing structure.
The present invention also provides a kind of display device, and it includes above-described display panel package structure.
In sum, the present invention is by making the dykes and dams of chamfering shape positioned at the encapsulation region of display panel non-display area
Layer, using the good step coverage of ALD techniques and the poor step coverages of PECVD, in the condition of same size mask
Be sealed in organic buffer layer in thin-film packing structure inside the inorganic water oxygen barrier layer of two-layer by lower realization, so as to simplify correlation
Manufacture craft.
It should be appreciated that application of the invention is not limited to above-mentioned citing, and for those of ordinary skills, can
To be improved according to the above description or converted, all these modifications and variations should all belong to the guarantor of appended claims of the present invention
Shield scope.
Claims (10)
1. a kind of preparation method of display panel package structure, it is characterised in that including step：
A, display panel is made on a substrate, making one around the display panel has the bank layer of chamfering shape opening, its
In, the chamfering shape split ring exposes the substrate of lower end around the display panel at the chamfering shape opening；
B, the first inorganic water oxygen barrier layer is deposited on the display panel and the bank layer using atom layer deposition process,
The first inorganic water oxygen barrier layer keeps chamfering shape at the chamfering shape opening；
C, using plasma enhancing chemical vapor deposition method deposit organic buffer on the described first inorganic water oxygen barrier layer
Layer, exposes the described first inorganic water oxygen barrier layer at the chamfering shape opening；
D, the second inorganic water oxygen barrier layer is deposited on the organic buffer layer using atom layer deposition process, described second is inorganic
Water oxygen barrier layer is connected at chamfering shape opening with the described first inorganic water oxygen barrier layer exposed.
2. the preparation method of display panel package structure according to claim 1, it is characterised in that the first inorganic water
The material of oxygen barrier layers includes Al2O3、SiO2。
3. the preparation method of display panel package structure according to claim 1, it is characterised in that the organic buffer layer
Material include organosilicon.
4. the preparation method of display panel package structure according to claim 1, it is characterised in that the second inorganic water
The material of oxygen barrier layers includes Al2O3、SiO2。
5. the preparation method of display panel package structure according to claim 1, it is characterised in that the display panel is
OLED display panel or QLED display panels.
6. the preparation method of display panel package structure according to claim 1, it is characterised in that the first inorganic water
The thickness of oxygen barrier layers is 100 ~ 500nm.
7. the preparation method of display panel package structure according to claim 1, it is characterised in that the organic buffer layer
Thickness be 500 ~ 3000nm.
8. the preparation method of display panel package structure according to claim 1, it is characterised in that the second inorganic water
The thickness of oxygen barrier layers is 100 ~ 500nm.
9. a kind of display panel package structure, it is characterised in that sealed using the display panel as described in any one of claim 1 ~ 8
The preparation method of assembling structure makes and obtains.
10. a kind of display device, it is characterised in that including display panel package structure as claimed in claim 9.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201611206395.6A CN106784368B (en) | 2016-12-23 | 2016-12-23 | A kind of display panel package structure, display device and production method |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201611206395.6A CN106784368B (en) | 2016-12-23 | 2016-12-23 | A kind of display panel package structure, display device and production method |
Publications (2)
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| CN106784368A true CN106784368A (en) | 2017-05-31 |
| CN106784368B CN106784368B (en) | 2019-07-09 |
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Cited By (7)
| Publication number | Priority date | Publication date | Assignee | Title |
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| CN109065749A (en) * | 2018-07-23 | 2018-12-21 | 武汉华星光电半导体显示技术有限公司 | OLED display |
| WO2019033559A1 (en) * | 2017-08-16 | 2019-02-21 | 武汉华星光电半导体显示技术有限公司 | Mask for film packaging of oled |
| CN109560112A (en) * | 2018-11-30 | 2019-04-02 | 云谷（固安）科技有限公司 | Display panel, display device and display panel preparation method |
| CN109755406A (en) * | 2017-11-06 | 2019-05-14 | 乐金显示有限公司 | display screen |
| CN110085133A (en) * | 2018-01-26 | 2019-08-02 | 京东方科技集团股份有限公司 | Display base plate and preparation method thereof, display panel and display device |
| WO2021077258A1 (en) * | 2019-10-21 | 2021-04-29 | 京东方科技集团股份有限公司 | Display panel and manufacturing method therefor, and display device |
| CN113964167A (en) * | 2021-11-18 | 2022-01-21 | 合肥维信诺科技有限公司 | Display panel manufacturing method, display panel and display device |
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| WO2019033559A1 (en) * | 2017-08-16 | 2019-02-21 | 武汉华星光电半导体显示技术有限公司 | Mask for film packaging of oled |
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| US12016198B2 (en) | 2019-10-21 | 2024-06-18 | Boe Technology Group Co., Ltd. | Display panel and manufacture method thereof, and display apparatus |
| CN113964167A (en) * | 2021-11-18 | 2022-01-21 | 合肥维信诺科技有限公司 | Display panel manufacturing method, display panel and display device |
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| CN106784368B (en) | 2019-07-09 |
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