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CN106777633B - Method and device for calculating temperature of switch contact of solid insulation switch cabinet - Google Patents

Method and device for calculating temperature of switch contact of solid insulation switch cabinet Download PDF

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CN106777633B
CN106777633B CN201611115566.4A CN201611115566A CN106777633B CN 106777633 B CN106777633 B CN 106777633B CN 201611115566 A CN201611115566 A CN 201611115566A CN 106777633 B CN106777633 B CN 106777633B
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temperature
switch contact
switch
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CN106777633A (en
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聂一雄
周文文
徐卫东
刁庆宪
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Guangdong University of Technology
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Abstract

本发明公开了一种固体绝缘开关柜开关触点温度计算方法及装置,通过预先获取多组样本数据,通过偏最小二乘法建立各影响因素间的数学模型,确定测量点的温度与固体绝缘开关柜的开关触点的温度之间的函数关系,样本数据包含多组影响开关触点温度变化的影响因素数据,测量点位于开关触点周围预设范围内;获取测量点监测到的当前温度值;根据当前温度值,通过函数关系计算出固体绝缘开关柜的开关触点的温度值。本申请基于偏最小二乘的数学建模方法动态计算断路器触点温度,无需考虑外裹绝缘层及触头材料的物性参数,方便了触头温度的计算。该方法通用性强、实现简单、成本低,可以为准确实时掌握开关柜的运行状态提供参考。

Figure 201611115566

The invention discloses a method and a device for calculating the temperature of a switch contact of a solid insulation switch cabinet. By acquiring multiple sets of sample data in advance, a mathematical model between various influencing factors is established by the partial least square method to determine the temperature of the measurement point and the solid insulation switch. The functional relationship between the temperature of the switch contacts of the cabinet, the sample data contains multiple sets of data of factors affecting the temperature change of the switch contacts, the measurement point is located in the preset range around the switch contact; the current temperature value monitored by the measurement point is obtained ; According to the current temperature value, the temperature value of the switch contact of the solid insulated switchgear is calculated through the functional relationship. The present application dynamically calculates the contact temperature of the circuit breaker based on the partial least squares mathematical modeling method, without considering the physical parameters of the outer insulating layer and the contact material, which facilitates the calculation of the contact temperature. The method has strong versatility, simple implementation and low cost, and can provide a reference for accurately grasping the operating state of the switchgear in real time.

Figure 201611115566

Description

一种固体绝缘开关柜开关触点温度计算方法及装置Method and device for calculating switch contact temperature of solid insulated switchgear

技术领域technical field

本发明涉及电力系统技术领域,特别是涉及一种固体绝缘开关柜开关触点温度计算方法及装置。The invention relates to the technical field of electric power systems, in particular to a method and device for calculating the temperature of a switch contact of a solid insulated switchgear.

背景技术Background technique

开关柜是电力系统中的一个重要设备,它主要担负着其他电气设备与电网关合电流的责任。然而在开关柜长期运行过程中,由于触头老化、接触不良导致接触电阻增大,接触电阻的增加引起开关柜局部温度升高,触头发热会加快绝缘层的老化,触头过热引发的火灾和停电事故并不少见。所以对开关柜开关触头温度的在线监测就显得更为重要了。当前对开关柜触头温度的研究普遍集中在温度监测设备的开发与改进上,目前主要有三种操作技术对触头温度进行实时监测。一种方法是通过摄像头与示温蜡片设备实现,开关柜内部需要监测的触头较多,而摄像头与示温蜡片之前的监测视野不能被阻挡,在一些结构复杂、空间位置狭小的区域很难实现示温蜡片与摄像头的一对一安装。另外一种是采用红外测温技术实现,它通过接收被测点的红外辐射来获取温度数据,但在安放测温探头的时候需要注意的是要避免光路的交叉影响,一个红外传感器对应一个触头。还有一种通过光纤温度传感器测温技术来实现,是目前运用最多的一种测温技术,其测量范围广、测量精度较高,但是成本高,而且受开关柜结构影响较大,导致监测温度不可靠。Switchgear is an important equipment in the power system, it is mainly responsible for the current combined with other electrical equipment and the power grid. However, during the long-term operation of the switch cabinet, the contact resistance increases due to the aging of the contacts and poor contact. The increase of the contact resistance causes the local temperature of the switch cabinet to rise. The heating of the contacts will accelerate the aging of the insulation layer, and the fire caused by the overheating of the contacts And power outages are not uncommon. Therefore, the online monitoring of the temperature of the switch contacts of the switch cabinet becomes more important. At present, the research on the contact temperature of switch cabinets generally focuses on the development and improvement of temperature monitoring equipment. At present, there are mainly three operating technologies to monitor the contact temperature in real time. One method is to use the camera and the temperature-indicating wax device. There are many contacts to be monitored inside the switch cabinet, and the monitoring field of view before the camera and the temperature-indicating wax cannot be blocked, which is difficult in some areas with complex structures and narrow spaces. Realize the one-to-one installation of the temperature-indicating wax piece and the camera. The other is to use infrared temperature measurement technology. It obtains temperature data by receiving the infrared radiation of the measured point. However, when placing the temperature measurement probe, it is necessary to pay attention to avoid the cross influence of the optical path. One infrared sensor corresponds to one touch. head. There is also a temperature measurement technology through optical fiber temperature sensor, which is currently the most widely used temperature measurement technology. It has a wide measurement range and high measurement accuracy, but its cost is high, and it is greatly affected by the structure of the switch cabinet, resulting in monitoring temperature. Unreliable.

发明内容SUMMARY OF THE INVENTION

本发明的目的是提供一种固体绝缘开关柜开关触点温度计算方法及装置,以解决现有开关柜开关触点温度实时监测技术中不易实现、成本高、监测温度不可靠的问题。The purpose of the present invention is to provide a method and device for calculating the temperature of a switch contact of a solid insulated switchgear, so as to solve the problems of difficult realization, high cost and unreliable temperature monitoring in the existing real-time monitoring technology of switch contact temperature of a switchgear.

为解决上述技术问题,本发明提供一种固体绝缘开关柜开关触点温度计算方法,包括:In order to solve the above technical problems, the present invention provides a method for calculating the temperature of a switch contact of a solid insulated switchgear, including:

预先获取多组样本数据,通过偏最小二乘法建立各影响因素间的数学模型,确定测量点的温度与固体绝缘开关柜的开关触点的温度之间的函数关系,所述样本数据包含多组影响所述开关触点温度变化的影响因素数据,所述测量点位于所述开关触点周围预设范围内;Obtain multiple sets of sample data in advance, establish a mathematical model between the influencing factors through the partial least squares method, and determine the functional relationship between the temperature of the measurement point and the temperature of the switch contacts of the solid insulated switchgear. The sample data contains multiple sets of Influencing factor data affecting the temperature change of the switch contact, the measurement point is located within a preset range around the switch contact;

获取所述测量点监测到的当前温度值;Obtain the current temperature value monitored at the measurement point;

根据所述当前温度值,通过所述函数关系计算出所述固体绝缘开关柜的开关触点的温度值。According to the current temperature value, the temperature value of the switch contact of the solid insulated switchgear is calculated through the functional relationship.

可选地,所述通过偏最小二乘法建立各影响因素间的数学模型,确定测量点的温度与固体绝缘开关柜的开关触点的温度之间的函数关系包括:Optionally, the mathematical model between the influencing factors is established by the partial least squares method, and the functional relationship between the temperature of the measurement point and the temperature of the switch contacts of the solid insulated switchgear is determined, including:

将所述测量点的温度作为因变量y,各影响因素分别作为自变量x1、x2、x3、x4、x5、x6、x7,获取n组样本数据,形成因变量矩阵Y=[y]n×1以及自变量矩阵X=[x1x2x3x4x5x6x7]n×7,对Y与X进行标准化处理,得到标准化的因变量矩阵

Figure BDA0001173242080000021
和自变量矩阵
Figure BDA0001173242080000022
Take the temperature of the measurement point as the dependent variable y, and each influencing factor as the independent variable x 1 , x 2 , x 3 , x 4 , x 5 , x 6 , x 7 , obtain n groups of sample data, and form a dependent variable matrix Y=[y] n×1 and independent variable matrix X=[x 1 x 2 x 3 x 4 x 5 x 6 x 7 ] n×7 , standardize Y and X to obtain a standardized dependent variable matrix
Figure BDA0001173242080000021
and the independent variable matrix
Figure BDA0001173242080000022

其中,xij为矩阵X中第i个样本第j个变量的值,yi表示矩阵Y中第i个样本值;Among them, x ij is the value of the j-th variable of the i-th sample in the matrix X, and y i represents the i-th sample value in the matrix Y;

从E0中依次提取主成分,并实施因变量对自变量的回归分析,转换为Y对X的回归方程,并确定Extract the principal components from E 0 in turn, and implement the regression analysis of the dependent variable to the independent variable, convert it into the regression equation of Y to X, and determine

Figure BDA0001173242080000023
中的回归系数β1~β7
Figure BDA0001173242080000023
The regression coefficients β 1 to β 7 in .

可选地,所述影响因素具体包括:x1对应环氧树脂绝缘层厚度d;x2对应热电偶温度传感器安装位置距离开关触头的水平距离r;x3对应开关触头的实际温度δ0;x4对应开关柜柜体温度δ1;x5对应开关柜所处环境温度δ2;x6对应联接开关触头母线的工作电流i;x7对应开关柜柜体体积v;y对应测量点的温度Q。Optionally, the influencing factors specifically include: x 1 corresponds to the thickness d of the epoxy resin insulating layer; x 2 corresponds to the horizontal distance r between the installation position of the thermocouple temperature sensor and the switch contact; x 3 corresponds to the actual temperature δ of the switch contact 0 ; x 4 corresponds to the temperature δ 1 of the switchgear cabinet; x 5 corresponds to the ambient temperature δ 2 where the switch cabinet is located; x 6 corresponds to the working current i of the busbar connecting the switch contacts; x 7 corresponds to the volume v of the switch cabinet; y corresponds to The temperature Q of the measuring point.

可选地,所述对Y与X进行标准化处理包括:Optionally, the standardizing processing on Y and X includes:

采用

Figure BDA0001173242080000031
进行标准化处理,use
Figure BDA0001173242080000031
standardized,

其中,

Figure BDA0001173242080000032
表示变量xj的平均值,sj表示xj的标准差,
Figure BDA0001173242080000033
表示y的平均值,sy表示y的标准差。in,
Figure BDA0001173242080000032
represents the mean of the variable x j , s j represents the standard deviation of x j ,
Figure BDA0001173242080000033
represents the mean of y, and s y represents the standard deviation of y.

可选地,在所述从E0中依次提取主成分之后还包括:Optionally, after the sequential extraction of the principal components from E 0 , the method further includes:

计算提取出的成分的贡献度,当所述贡献度大于预设阈值时,判断提取出的成分的贡献度是显著的。The contribution degree of the extracted component is calculated, and when the contribution degree is greater than a preset threshold, it is determined that the contribution degree of the extracted component is significant.

可选地,所述获取所述测量点监测到的当前温度值包括:Optionally, the obtaining the current temperature value monitored by the measurement point includes:

通过设置在所述测量点的温度传感器实时监测所述当前温度值,所述测量点位于所述开关触点的绝缘层外壁。The current temperature value is monitored in real time by a temperature sensor arranged at the measuring point, which is located on the outer wall of the insulating layer of the switch contact.

可选地,在所述通过所述函数关系计算出所述固体绝缘开关柜的开关触点的温度值之后还包括:Optionally, after calculating the temperature value of the switch contact of the solid insulated switchgear through the functional relationship, the method further includes:

向用户显示计算得到的所述温度值。The calculated temperature value is displayed to the user.

本发明还提供了一种固体绝缘开关柜开关触点温度计算装置,包括:The present invention also provides a device for calculating the temperature of a switch contact of a solid insulated switchgear, comprising:

模型建立模块,用于预先获取多组样本数据,通过偏最小二乘法建立各影响因素间的数学模型,确定测量点的温度与固体绝缘开关柜的开关触点的温度之间的函数关系,所述样本数据包含多组影响所述开关触点温度变化的影响因素数据,所述测量点位于所述开关触点周围预设范围内;The model building module is used to obtain multiple sets of sample data in advance, establish a mathematical model between the influencing factors through the partial least squares method, and determine the functional relationship between the temperature of the measurement point and the temperature of the switch contacts of the solid insulated switchgear. The sample data includes a plurality of groups of influencing factor data affecting the temperature change of the switch contact, and the measurement point is located within a preset range around the switch contact;

当前温度获取模块,用于获取所述测量点监测到的当前温度值;The current temperature acquisition module is used to acquire the current temperature value monitored at the measurement point;

计算模块,用于根据所述当前温度值,通过所述函数关系计算出所述固体绝缘开关柜的开关触点的温度值。The calculation module is configured to calculate the temperature value of the switch contact of the solid insulated switchgear through the functional relationship according to the current temperature value.

本发明所提供的固体绝缘开关柜开关触点温度计算方法及装置,通过预先获取多组样本数据,通过偏最小二乘法建立各影响因素间的数学模型,确定测量点的温度与固体绝缘开关柜的开关触点的温度之间的函数关系,样本数据包含多组影响开关触点温度变化的影响因素数据,测量点位于开关触点周围预设范围内;获取测量点监测到的当前温度值;根据当前温度值,通过函数关系计算出固体绝缘开关柜的开关触点的温度值。本申请基于偏最小二乘的数学建模方法动态计算断路器触点温度,无需考虑外裹绝缘层及触头材料的物性参数,方便了触头温度的计算。该方法通用性强、实现简单、成本低,可以为准确实时掌握开关柜的运行状态提供参考。The method and device for calculating the temperature of the switch contacts of the solid insulated switchgear provided by the present invention obtains multiple groups of sample data in advance, and establishes a mathematical model between various influencing factors through the partial least squares method, so as to determine the temperature of the measurement point and the solid insulation switchgear. The functional relationship between the temperature of the switch contacts, the sample data contains multiple sets of data of influencing factors that affect the temperature change of the switch contacts, the measurement point is located within the preset range around the switch contact; the current temperature value monitored by the measurement point is obtained; According to the current temperature value, the temperature value of the switch contact of the solid insulated switchgear is calculated through a functional relationship. The present application dynamically calculates the contact temperature of the circuit breaker based on the partial least squares mathematical modeling method, without considering the physical parameters of the outer insulating layer and the contact material, which facilitates the calculation of the contact temperature. The method has strong versatility, simple implementation and low cost, and can provide a reference for accurately grasping the operating state of the switchgear in real time.

附图说明Description of drawings

为了更清楚的说明本发明实施例或现有技术的技术方案,下面将对实施例或现有技术描述中所需要使用的附图作简单的介绍,显而易见地,下面描述中的附图仅仅是本发明的一些实施例,对于本领域普通技术人员来讲,在不付出创造性劳动的前提下,还可以根据这些附图获得其他的附图。In order to more clearly illustrate the embodiments of the present invention or the technical solutions of the prior art, the following will briefly introduce the accompanying drawings used in the description of the embodiments or the prior art. Obviously, the drawings in the following description are only For some embodiments of the present invention, for those of ordinary skill in the art, other drawings can also be obtained according to these drawings without creative efforts.

图1为本发明所提供的固体绝缘开关柜开关触点温度计算方法的一种具体实施方式的流程图;1 is a flowchart of a specific embodiment of a method for calculating the temperature of a switch contact of a solid insulated switchgear provided by the present invention;

图2为本发明所提供的固体绝缘开关柜开关触点温度计算方法的另一种具体实施方式的流程图;Fig. 2 is a flow chart of another specific embodiment of the method for calculating the temperature of switch contacts of a solid insulated switchgear provided by the present invention;

图3为通过偏最小二乘建立测量点与开关触头的函数关系式算法流程图;Figure 3 is a flowchart of an algorithm for establishing a functional relationship between a measurement point and a switch contact by partial least squares;

图4为各温度传感器的安装位置示意图;Figure 4 is a schematic diagram of the installation position of each temperature sensor;

图5为本发明实施例提供的固体绝缘开关柜开关触点温度计算装置的结构框图。FIG. 5 is a structural block diagram of a device for calculating the temperature of a switch contact of a solid insulated switchgear provided by an embodiment of the present invention.

具体实施方式Detailed ways

为了使本技术领域的人员更好地理解本发明方案,下面结合附图和具体实施方式对本发明作进一步的详细说明。显然,所描述的实施例仅仅是本发明一部分实施例,而不是全部的实施例。基于本发明中的实施例,本领域普通技术人员在没有做出创造性劳动前提下所获得的所有其他实施例,都属于本发明保护的范围。In order to make those skilled in the art better understand the solution of the present invention, the present invention will be further described in detail below with reference to the accompanying drawings and specific embodiments. Obviously, the described embodiments are only some, but not all, embodiments of the present invention. Based on the embodiments of the present invention, all other embodiments obtained by those of ordinary skill in the art without creative efforts shall fall within the protection scope of the present invention.

本发明所提供的固体绝缘开关柜开关触点温度计算方法的一种具体实施方式的流程图如图1所示,该方法包括:A flow chart of a specific embodiment of the method for calculating the temperature of a switch contact of a solid insulated switchgear provided by the present invention is shown in FIG. 1 , and the method includes:

步骤S101:预先获取多组样本数据,通过偏最小二乘法建立各影响因素间的数学模型,确定测量点的温度与固体绝缘开关柜的开关触点的温度之间的函数关系,所述样本数据包含多组影响所述开关触点温度变化的影响因素数据,所述测量点位于所述开关触点周围预设范围内;Step S101: Acquire multiple sets of sample data in advance, establish a mathematical model between the influencing factors through the partial least squares method, and determine the functional relationship between the temperature of the measurement point and the temperature of the switch contacts of the solid insulated switchgear, the sample data Contains multiple groups of data of influencing factors affecting the temperature change of the switch contact, and the measurement point is located within a preset range around the switch contact;

步骤S102:获取所述测量点监测到的当前温度值;Step S102: obtaining the current temperature value monitored by the measuring point;

步骤S103:根据所述当前温度值,通过所述函数关系计算出所述固体绝缘开关柜的开关触点的温度值。Step S103: According to the current temperature value, calculate the temperature value of the switch contact of the solid insulated switchgear through the functional relationship.

本发明所提供的固体绝缘开关柜开关触点温度计算方法,通过预先获取多组样本数据,通过偏最小二乘法建立各影响因素间的数学模型,确定测量点的温度与固体绝缘开关柜的开关触点的温度之间的函数关系,样本数据包含多组影响开关触点温度变化的影响因素数据,测量点位于开关触点周围预设范围内;获取测量点监测到的当前温度值;根据当前温度值,通过函数关系计算出固体绝缘开关柜的开关触点的温度值。本申请基于偏最小二乘的数学建模方法动态计算断路器触点温度,无需考虑外裹绝缘层及触头材料的物性参数,方便了触头温度的计算。该方法通用性强、实现简单、成本低,可以为准确实时掌握开关柜的运行状态提供参考。The method for calculating the temperature of the switch contacts of the solid insulated switchgear provided by the present invention obtains multiple groups of sample data in advance, and establishes a mathematical model among various influencing factors through the partial least squares method, so as to determine the temperature of the measurement point and the switch of the solid insulated switchgear. The functional relationship between the temperatures of the contacts, the sample data contains multiple sets of data of factors affecting the temperature change of the switch contacts, the measurement point is located within the preset range around the switch contact; the current temperature value monitored by the measurement point is obtained; Temperature value, the temperature value of the switch contact of the solid insulated switchgear is calculated through the functional relationship. The present application dynamically calculates the contact temperature of the circuit breaker based on the partial least squares mathematical modeling method, without considering the physical parameters of the outer insulating layer and the contact material, which facilitates the calculation of the contact temperature. The method has strong versatility, simple implementation and low cost, and can provide a reference for accurately grasping the operating state of the switchgear in real time.

在上述实施例的基础上,通过偏最小二乘法建立各影响因素间的数学模型,确定测量点的温度与固体绝缘开关柜的开关触点的温度之间的函数关系的过程可以具体为:On the basis of the above embodiment, the mathematical model between the influencing factors is established by the partial least squares method, and the process of determining the functional relationship between the temperature of the measurement point and the temperature of the switch contact of the solid insulated switchgear can be specifically as follows:

将所述测量点的温度作为因变量y,各影响因素分别作为自变量x1、x2、x3、x4、x5、x6、x7,获取n组样本数据,形成因变量矩阵Y=[y]n×1以及自变量矩阵X=[x1x2x3x4x5x6x7]n×7,对Y与X进行标准化处理,得到标准化的因变量矩阵

Figure BDA0001173242080000051
和自变量矩阵
Figure BDA0001173242080000052
Take the temperature of the measurement point as the dependent variable y, and each influencing factor as the independent variable x 1 , x 2 , x 3 , x 4 , x 5 , x 6 , x 7 , obtain n groups of sample data, and form a dependent variable matrix Y=[y] n×1 and independent variable matrix X=[x 1 x 2 x 3 x 4 x 5 x 6 x 7 ] n×7 , standardize Y and X to obtain a standardized dependent variable matrix
Figure BDA0001173242080000051
and the independent variable matrix
Figure BDA0001173242080000052

其中,xij为矩阵X中第i个样本第j个变量的值,yi表示矩阵Y中第i个样本值;Among them, x ij is the value of the j-th variable of the i-th sample in the matrix X, and y i represents the i-th sample value in the matrix Y;

从E0中依次提取主成分,并实施因变量对自变量的回归分析,转换为Y对X的回归方程,并确定Extract the principal components from E 0 in turn, and implement the regression analysis of the dependent variable to the independent variable, convert it into the regression equation of Y to X, and determine

Figure BDA0001173242080000061
中的回归系数β1~β7
Figure BDA0001173242080000061
The regression coefficients β 1 to β 7 in .

本实施例通过偏最小二乘算法对开关柜开关触头温度进行实时计算,开关触头发热后,热量将通过绝缘层以内空气的对流和绝缘层壁的传导传递到绝缘层外壁,并使其温度升高。根据绝缘层外壁的温升与开关触头之间存在的函数关系,就可以根据前者计算得到后者。开关柜内部导体外裹的绝缘材料为环氧树脂,选用装配方便、价格优廉的热电偶传感器测量开关触点附近绝缘层外表皮的温度,进而利用通过实验数据取得的函数关系式:In this embodiment, the partial least squares algorithm is used to calculate the temperature of the switch contacts of the switch cabinet in real time. After the switch contacts are heated, the heat will be transferred to the outer wall of the insulating layer through the convection of the air inside the insulating layer and the conduction of the wall of the insulating layer, and make it temperature rises. According to the functional relationship between the temperature rise of the outer wall of the insulating layer and the switch contacts, the latter can be calculated according to the former. The insulating material wrapped around the inner conductor of the switch cabinet is epoxy resin, and a thermocouple sensor that is easy to assemble and inexpensive to measure is used to measure the temperature of the outer skin of the insulating layer near the switch contact, and then use the functional relationship obtained from the experimental data:

Figure BDA0001173242080000062
Figure BDA0001173242080000062

本实施例中影响因素具体包括:x1对应环氧树脂绝缘层厚度d;x2对应热电偶温度传感器安装位置距离开关触头的水平距离r;x3对应开关触头的实际温度δ0;x4对应开关柜柜体温度δ1;x5对应开关柜所处环境温度δ2;x6对应联接开关触头母线的工作电流i;x7对应开关柜具体柜体体积v;y对应测量点的温度Q。In this embodiment, the influencing factors specifically include: x 1 corresponds to the thickness d of the epoxy resin insulating layer; x 2 corresponds to the horizontal distance r between the installation position of the thermocouple temperature sensor and the switch contact; x 3 corresponds to the actual temperature δ 0 of the switch contact; x 4 corresponds to the temperature δ 1 of the switchgear cabinet; x 5 corresponds to the ambient temperature δ 2 of the switch cabinet; x 6 corresponds to the working current i of the connecting switch contact busbar; x 7 corresponds to the specific cabinet volume v of the switch cabinet; y corresponds to the measurement point temperature Q.

下面以上述影响因素为例,参照图2,对固体绝缘开关柜开关触点温度计算方法的另一种具体实施方式进行进一步详细阐述。Taking the above influencing factors as an example, and referring to FIG. 2 , another specific implementation of the method for calculating the temperature of the switch contacts of the solid insulated switchgear will be further elaborated.

步骤S201:获取实验数据;Step S201: acquiring experimental data;

将温度传感器固定在开关触头附近位置,温度传感器测量点的温度Q与环氧树脂绝缘层厚度d,热电偶安装位置距离开关触头的水平距离r,开关触头的实际温度δ0,开关柜柜体温度δ1,开关柜所处环境温度δ2,联接开关触头母线的工作电流i,开关柜具体柜体体积v等因素密切相关。将开关柜置于不同的外界环境下并记下环境温度,在实验室对开关柜开关触头进行模拟实验,使用功率1000w的加热器加热触头,模拟引起触头过热的热源,加热器与计算机联网,采用智能控制模式,精确控制加热温度,若干次控温实验并记录加热触点的温度,同时在每次控温实验时,不断改变柜体内其他温度传感器的位置,以获取各因素的若干组实验数据。操作方式和数据的一种具体实施方式如表1所示。Fix the temperature sensor near the switch contact, the temperature Q at the measurement point of the temperature sensor and the thickness d of the epoxy resin insulating layer, the horizontal distance r between the installation position of the thermocouple and the switch contact, the actual temperature of the switch contact δ 0 , the switch The cabinet body temperature δ 1 , the ambient temperature δ 2 of the switch cabinet, the working current i of the switch contact busbar, and the specific cabinet volume v of the switch cabinet are closely related. Place the switchgear in different external environments and record the ambient temperature, conduct a simulation experiment on the switchgear contacts in the laboratory, and use a heater with a power of 1000w to heat the contacts to simulate the heat source that causes the contacts to overheat. The computer is connected to the Internet, and the intelligent control mode is adopted to accurately control the heating temperature. Several temperature control experiments are performed and the temperature of the heating contact is recorded. At the same time, during each temperature control experiment, the positions of other temperature sensors in the cabinet are constantly changed to obtain the temperature of each factor. Several sets of experimental data. A specific embodiment of the operation mode and data is shown in Table 1.

表1Table 1

Figure BDA0001173242080000071
Figure BDA0001173242080000071

其中,操作方式1,取一开关柜实验,测量绝缘层厚度,记为x11;将温度传感器1安装在触头外裹绝缘层任意位置,并测量该传感器距离触点的水平距离,记为x21;待所有传感器安装完毕后,加热器对触头加热,通过计算机设置加热初始温度,记为触点温度x31;将柜内温度传感器2安装在开关柜通风口处,测量柜体温度,记为x41;将开关柜置于温度可调节的室内环境中,室内环境温度从低温逐步调至高温,以获取不同的环境温度,记下初始设置的环境温度x51;实验测量母线工作电流,记为x61;测量柜体体积,记为x71;温度传感器1测量绝缘层外表皮温度,记为Y1。以上各实验测量数据作为第一组数据。Wherein, operation mode 1, take a switch cabinet experiment, measure the thickness of the insulating layer, denoted as x 11 ; install the temperature sensor 1 at any position of the insulating layer outside the contact, and measure the horizontal distance of the sensor from the contact, denoted as x 21 ; after all the sensors are installed, the heater will heat the contacts, set the initial heating temperature through the computer, which is recorded as the contact temperature x 31 ; install the temperature sensor 2 in the cabinet at the ventilation opening of the switch cabinet, and measure the temperature of the cabinet , denoted as x 41 ; put the switchgear in an indoor environment with adjustable temperature, and the indoor ambient temperature is gradually adjusted from low temperature to high temperature to obtain different ambient temperatures, and the initial setting ambient temperature x 51 is recorded; the experiment measures the busbar work Current, denoted as x 61 ; measuring cabinet volume, denoted as x 71 ; temperature sensor 1 measuring the outer skin temperature of the insulating layer, denoted as Y 1 . The above experimental measurement data are used as the first group of data.

操作方式2,取另一开关柜实验,测量绝缘层厚度x12;改变温度传感器1在触头外裹绝缘层位置,并测量该传感器距离触点的水平距离x22;通过计算机调节加热器温度,待加热触头处于稳态后,记为触点温度x32;温度传感器2安装在开关柜通风口处,测量柜体温度x42;改变开关柜所处环境温度x52;实验测量母线工作电流x62;测量柜体体积x72;温度传感器1测量绝缘层外表皮温度Y2。以上各实验测量数据作为第二组数据。Operation mode 2, take another switch cabinet experiment, measure the thickness of the insulating layer x 12 ; change the position of the temperature sensor 1 to wrap the insulating layer on the contact, and measure the horizontal distance x 22 of the sensor from the contact point; adjust the heater temperature by computer After the heating contact is in a steady state, it is recorded as the contact temperature x 32 ; the temperature sensor 2 is installed at the ventilation opening of the switch cabinet, and the temperature of the cabinet is measured x 42 ; the ambient temperature of the switch cabinet is changed x 52 ; Current x 62 ; measuring cabinet volume x 72 ; temperature sensor 1 measuring the outer skin temperature Y 2 of the insulating layer. The above experimental measurement data are used as the second group of data.

操作方式n,以此类推,重复以上步骤,呈线性调节加热器温度,以获取若干组触头热源温升实验数据。Operation mode n, and so on, repeat the above steps to linearly adjust the heater temperature to obtain several groups of contact heat source temperature rise experimental data.

步骤S202:提取n组样本数据,采用偏最小二乘法建模,确定函数关系式中的系数;Step S202: extracting n groups of sample data, adopting partial least squares modeling, and determining the coefficients in the functional relationship;

如图3通过偏最小二乘建立测量点与开关触头的函数关系式算法流程图所示,将所述测量点的温度作为因变量y,各影响因素分别作为自变量x1、x2、x3、x4、x5、x6、x7,从上述实验数据中获取n组样本数据,形成因变量矩阵Y=[y]n×1以及自变量矩阵X=[x1x2x3x4x5x6x7]n×7,对Y与X标准化处理,得到标准化的因变量矩阵

Figure BDA0001173242080000081
和自变量矩阵
Figure BDA0001173242080000082
标准化处理方法为:As shown in the algorithm flow chart of establishing the functional relationship between the measuring point and the switch contact by partial least squares in Fig. 3, the temperature of the measuring point is taken as the dependent variable y, and each influencing factor is taken as the independent variable x 1 , x 2 , x 3 , x 4 , x 5 , x 6 , x 7 , obtain n groups of sample data from the above experimental data, and form a dependent variable matrix Y=[y] n×1 and an independent variable matrix X=[x 1 x 2 x 3 x 4 x 5 x 6 x 7 ] n×7 , normalize Y and X to get a standardized dependent variable matrix
Figure BDA0001173242080000081
and the independent variable matrix
Figure BDA0001173242080000082
The standardized processing method is:

Figure BDA0001173242080000083
Figure BDA0001173242080000083

其中,xij表示矩阵X中第i个样本第j个变量的值,

Figure BDA0001173242080000084
表示变量xj的平均值,sj表示xj的标准差,yi表示矩阵Y中第i个样本值,
Figure BDA0001173242080000085
表示y的平均值,sy表示y的标准差;Among them, x ij represents the value of the j-th variable of the i-th sample in the matrix X,
Figure BDA0001173242080000084
represents the mean value of variable x j , s j represents the standard deviation of x j , y i represents the ith sample value in matrix Y,
Figure BDA0001173242080000085
represents the mean of y, and s y represents the standard deviation of y;

从E0中提取第一个主成分t1=E0w1,w1为t1的权重向量,其中Extract the first principal component from E 0 t 1 =E 0 w 1 , where w 1 is the weight vector of t 1 , where

Figure BDA0001173242080000086
Figure BDA0001173242080000086

Figure BDA0001173242080000087
Figure BDA0001173242080000087

式中E01~E07表示E0的列向量,r(x1,y)~r(x7,y)表示自变量与因变量的相关系数;In the formula, E 01 ~E 07 represent the column vector of E 0 , and r(x 1 , y)~r(x 7 , y) represent the correlation coefficient between the independent variable and the dependent variable;

接着计算E0对t1的回归系数矩阵P1 Then calculate the regression coefficient matrix P 1 of E 0 to t 1

Figure BDA0001173242080000088
Figure BDA0001173242080000088

计算回归方程的残差矩阵E1 Calculate the residual matrix E 1 of the regression equation

E1=E0-t1P1 T E 1 =E 0 -t 1 P 1 T

计算提取成分的贡献度,设yi是原始数据,yi'是使用全部样本点并对t1回归建模后第i个样本点的拟合值,yi″是在建模时删去样本点i,并对t1回归建模后,再用此模型计算的yi拟合值Calculate the contribution of the extracted components, let y i be the original data, yi ' is the fitted value of the i-th sample point after using all the sample points and t 1 regression modeling, and y i ″ is deleted during modeling Sample point i, and after modeling t 1 regression, use the fitted value of y i calculated by this model

Figure BDA0001173242080000091
Figure BDA0001173242080000091

Figure BDA0001173242080000092
Figure BDA0001173242080000092

Figure BDA0001173242080000093
Figure BDA0001173242080000093

Figure BDA0001173242080000094
时,提取成分t1的贡献度是显著的,接下来进行第二成分的提取;否则停止计算。when
Figure BDA0001173242080000094
, the contribution of the extracted component t 1 is significant, and the second component is extracted next; otherwise, the calculation is stopped.

从E1中提取第二成分t2,用E1替换E0,用上述方法计算t2的权重

Figure BDA0001173242080000095
因为E1不是标准化矩阵,按如下方法计算w2 Extract the second component t 2 from E 1 , replace E 0 with E 1 , calculate the weight of t 2 with the above method
Figure BDA0001173242080000095
Since E1 is not a normalized matrix, calculate w2 as follows

Figure BDA0001173242080000096
Figure BDA0001173242080000096

t2=E1w2 t 2 =E 1 w 2

Figure BDA0001173242080000097
Figure BDA0001173242080000097

Figure BDA0001173242080000098
Figure BDA0001173242080000098

式中P2是E1对t2的回归系数矩阵,E2是回归方程的残差矩阵,cov(E11,y)~cov(E17,y)表示E11~E17分别与y的协方差。In the formula, P 2 is the regression coefficient matrix of E 1 to t 2 , E 2 is the residual matrix of the regression equation, and cov(E 11 ,y)~cov(E 17 ,y) represents the relationship between E 11 ~E 17 and y respectively. Covariance.

并计算提取成分的贡献度

Figure BDA0001173242080000099
时,说明提取成分t2的贡献度是显著的,接下来进行第三成分的提取;否则停止计算。and calculate the contribution of the extracted components
Figure BDA0001173242080000099
when , it indicates that the contribution of the extracted component t 2 is significant, and the third component is extracted next; otherwise, the calculation is stopped.

以此类推,继续以上步骤,提取残差矩阵中的主成分,并计算提取成分的贡献度;设最终得到m个成分(m<7),则实施F0关于m个提取成分的回归:By analogy, continue the above steps, extract the principal components in the residual matrix, and calculate the contribution of the extracted components; if m components are finally obtained (m<7), then implement the regression of F 0 on the m extracted components:

F0=r1t1+r2t2+...+rmtm F 0 =r 1 t 1 +r 2 t 2 +...+r m t m

由于每个提取成分都是E0的线性组合,因此Since each extracted component is a linear combination of E0 , so

Figure BDA0001173242080000101
Figure BDA0001173242080000101

Figure BDA0001173242080000102
Figure BDA0001173242080000102

实施因变量对自变量的回归分析,记Carry out regression analysis of the dependent variable on the independent variable, record

Figure BDA0001173242080000103
则标准化变量y*关于
Figure BDA0001173242080000104
的回归方程为:
Figure BDA0001173242080000103
then the standardized variable y * about
Figure BDA0001173242080000104
The regression equation of is:

Figure BDA0001173242080000105
Figure BDA0001173242080000105

再通过标准化的逆过程,得到y关于x1~x5的回归方程Then through the inverse process of standardization, the regression equation of y about x 1 ~ x 5 is obtained

y=β1x12x23x34x45x56x67x7 y=β 1 x 12 x 23 x 34 x 45 x 56 x 67 x 7

则开关触点温度的自变量:Then the independent variable of the switch contact temperature:

Figure BDA0001173242080000106
Figure BDA0001173242080000106

其中,x1为环氧树脂绝缘层厚度d;x2热电偶温度传感器安装位置距离开关触头的水平距离r;x3为开关触头的实际温度δ0;x4为开关柜柜体温度δ1;x5为开关柜所处环境温度δ2;x6为联接开关触头母线的工作电流i;x7为开关柜具体柜体体积v;y为测量点的温度Q;β1~β7为函数关系式中已确定的相关系数。Among them, x 1 is the thickness d of the epoxy resin insulating layer; x 2 is the horizontal distance r between the installation position of the thermocouple temperature sensor and the switch contact; x 3 is the actual temperature of the switch contact δ 0 ; x 4 is the temperature of the switch cabinet δ 1 ; x 5 is the ambient temperature δ 2 where the switch cabinet is located; x 6 is the working current i of the connecting switch contact busbar; x 7 is the specific cabinet volume v of the switch cabinet; y is the temperature Q of the measuring point; β 1 ~ β 7 is the determined correlation coefficient in the functional relationship.

步骤S203:对各温度传感器进行定位,确定各测量参数x1、x2、x3、x4、x5、x6、x7Step S203: Position each temperature sensor, and determine each measurement parameter x 1 , x 2 , x 3 , x 4 , x 5 , x 6 , and x 7 ;

步骤S204:温度传感器监测实时温度,获取各测量点监测到的当前温度值;Step S204: the temperature sensor monitors the real-time temperature, and obtains the current temperature value monitored by each measurement point;

步骤S205:根据函数关系式计算出固体绝缘开关柜的开关触点的温度值;Step S205: Calculate the temperature value of the switch contact of the solid insulated switchgear according to the functional relationship;

步骤S206:向用户显示计算得到的温度值。Step S206: Display the calculated temperature value to the user.

在实测过程中,具体实施方式只需要确定好各温度传感器的安装位置,将温度传感器1固定在绝缘层外壁接地点附近,保证安全的电气绝缘强度,将确定的开关触头温度与绝缘层外壁测量点温度对应函数关系式写入到程序中,温度传感器1将监测的数据传送到云端计算模块,处理器就可以将对应触点温度输出并传送到低压仪表显示端,即可实现触点温度的在线监测。各温度传感器的安装位置示意图如图4所示。In the actual measurement process, the specific embodiment only needs to determine the installation position of each temperature sensor, fix the temperature sensor 1 near the grounding point of the outer wall of the insulating layer, ensure safe electrical insulation strength, and connect the determined temperature of the switch contact with the outer wall of the insulating layer. The function relationship corresponding to the temperature of the measuring point is written into the program, and the temperature sensor 1 transmits the monitored data to the cloud computing module, and the processor can output the corresponding contact temperature and transmit it to the display terminal of the low-voltage instrument, so that the contact temperature can be realized. online monitoring. The schematic diagram of the installation position of each temperature sensor is shown in Figure 4.

本发明实施例以测量点间隔触头的距离和绝缘层实时表面温度为基本参量,考虑绝缘层外部环境等因素,并利用实验测得相关数据,该数学模型可以实时地直接计算开关触头温度,且不受绝缘层本身材料的物性参数影响。本发明实施例计算方法通用性强,适用各种外界环境下任意固体绝缘材料开关柜开关触头温度的计算;并且实现简单,在线测量时,只需在开关触头绝缘层外壁安装一个温度传感器就能通过已经训练好的函数关系式计算触头温度,并通过仪表端实时显示。此外,基于偏最小二乘的数学建模方法在动态计算断路器触头温度时,无需考虑外裹绝缘层及触头材料的物性参数,方便了触头温度的计算。因此,该方法可以为准确实时掌握开关柜的运行状态提供参考。In the embodiment of the present invention, the distance between the measuring point and the contact and the real-time surface temperature of the insulating layer are used as basic parameters, the external environment of the insulating layer and other factors are considered, and relevant data are measured by experiments. The mathematical model can directly calculate the temperature of the switch contacts in real time. , and is not affected by the physical parameters of the material of the insulating layer itself. The calculation method of the embodiment of the present invention has strong versatility, and is suitable for the calculation of the switch contact temperature of any solid insulating material switch cabinet in various external environments; and the implementation is simple, and only needs to install a temperature sensor on the outer wall of the insulation layer of the switch contact during online measurement. The contact temperature can be calculated through the trained functional relationship and displayed in real time through the instrument terminal. In addition, the mathematical modeling method based on partial least squares does not need to consider the physical parameters of the outer insulating layer and the contact material when dynamically calculating the contact temperature of the circuit breaker, which facilitates the calculation of the contact temperature. Therefore, this method can provide a reference for accurately grasping the operating status of the switchgear in real time.

下面对本发明实施例提供的固体绝缘开关柜开关触点温度计算装置进行介绍,下文描述的固体绝缘开关柜开关触点温度计算装置与上文描述的固体绝缘开关柜开关触点温度计算方法可相互对应参照。The following describes the device for calculating the temperature of the switch contacts of the solid insulated switchgear provided by the embodiments of the present invention. The device for calculating the temperature of the switch contacts of the solid insulated switchgear described below and the method for calculating the temperature of the switch contacts of the solid insulated switchgear described above are mutually compatible. corresponding reference.

图5为本发明实施例提供的固体绝缘开关柜开关触点温度计算装置的结构框图,参照图5固体绝缘开关柜开关触点温度计算装置可以包括:5 is a structural block diagram of a device for calculating the temperature of a switch contact of a solid insulated switchgear provided by an embodiment of the present invention. Referring to FIG. 5, the device for calculating the temperature of a switch contact of a solid insulated switchgear may include:

模型建立模块100,用于预先获取多组样本数据,通过偏最小二乘法建立各影响因素间的数学模型,确定测量点的温度与固体绝缘开关柜的开关触点的温度之间的函数关系,所述样本数据包含多组影响所述开关触点温度变化的影响因素数据,所述测量点位于所述开关触点周围预设范围内;The model building module 100 is used to obtain multiple sets of sample data in advance, establish a mathematical model between various influencing factors through the partial least square method, and determine the functional relationship between the temperature of the measurement point and the temperature of the switch contacts of the solid insulated switchgear, The sample data includes a plurality of groups of influencing factor data affecting the temperature change of the switch contact, and the measurement point is located within a preset range around the switch contact;

当前温度获取模块200,用于获取所述测量点监测到的当前温度值;A current temperature acquisition module 200, configured to acquire the current temperature value monitored at the measurement point;

计算模块300,用于根据所述当前温度值,通过所述函数关系计算出所述固体绝缘开关柜的开关触点的温度值。The calculation module 300 is configured to calculate the temperature value of the switch contact of the solid insulated switchgear through the functional relationship according to the current temperature value.

本实施例的固体绝缘开关柜开关触点温度计算装置用于实现前述的固体绝缘开关柜开关触点温度计算方法,因此固体绝缘开关柜开关触点温度计算装置中的具体实施方式可见前文中的固体绝缘开关柜开关触点温度计算方法的实施例部分,例如,模型建立模块100,当前温度获取模块200,计算模块300,分别用于实现上述固体绝缘开关柜开关触点温度计算方法中步骤S101,S102,S103,所以,其具体实施方式可以参照相应的各个部分实施例的描述,在此不再赘述。The device for calculating the temperature of a switch contact of a solid insulated switchgear in this embodiment is used to implement the aforementioned method for calculating the temperature of a switch contact of a solid insulated switchgear. Therefore, the specific implementation of the device for calculating the temperature of a switch contact of a solid insulated switchgear can be found in the previous section. The embodiment part of the method for calculating the temperature of the switch contacts of the solid insulated switchgear, for example, the model establishment module 100, the current temperature acquisition module 200, and the calculation module 300 are respectively used to realize step S101 in the above method for calculating the temperature of the switch contacts of the solid insulated switchgear , S102 , and S103 . Therefore, for the specific implementation, reference may be made to the descriptions of the corresponding partial embodiments, and details are not repeated here.

本发明所提供的固体绝缘开关柜开关触点温度计算装置,通过预先获取多组样本数据,通过偏最小二乘法建立各影响因素间的数学模型,确定测量点的温度与固体绝缘开关柜的开关触点的温度之间的函数关系,样本数据包含多组影响开关触点温度变化的影响因素数据,测量点位于开关触点周围预设范围内;获取测量点监测到的当前温度值;根据当前温度值,通过函数关系计算出固体绝缘开关柜的开关触点的温度值。本申请基于偏最小二乘的数学建模方法动态计算断路器触点温度,无需考虑外裹绝缘层及触头材料的物性参数,方便了触头温度的计算。该方法通用性强、实现简单、成本低,可以为准确实时掌握开关柜的运行状态提供参考。The device for calculating the switch contact temperature of the solid insulated switchgear provided by the present invention obtains multiple groups of sample data in advance, and establishes a mathematical model between various influencing factors through the partial least squares method, so as to determine the temperature of the measurement point and the switch of the solid insulated switchgear. The functional relationship between the temperatures of the contacts, the sample data contains multiple sets of data of factors affecting the temperature change of the switch contacts, the measurement point is located within the preset range around the switch contact; the current temperature value monitored by the measurement point is obtained; Temperature value, the temperature value of the switch contact of the solid insulated switchgear is calculated through the functional relationship. The present application dynamically calculates the contact temperature of the circuit breaker based on the partial least squares mathematical modeling method, without considering the physical parameters of the outer insulating layer and the contact material, which facilitates the calculation of the contact temperature. The method has strong versatility, simple implementation and low cost, and can provide a reference for accurately grasping the operating state of the switchgear in real time.

本说明书中各个实施例采用递进的方式描述,每个实施例重点说明的都是与其它实施例的不同之处,各个实施例之间相同或相似部分互相参见即可。对于实施例公开的装置而言,由于其与实施例公开的方法相对应,所以描述的比较简单,相关之处参见方法部分说明即可。The various embodiments in this specification are described in a progressive manner, and each embodiment focuses on the differences from other embodiments, and the same or similar parts between the various embodiments may be referred to each other. As for the device disclosed in the embodiment, since it corresponds to the method disclosed in the embodiment, the description is relatively simple, and the relevant part can be referred to the description of the method.

专业人员还可以进一步意识到,结合本文中所公开的实施例描述的各示例的单元及算法步骤,能够以电子硬件、计算机软件或者二者的结合来实现,为了清楚地说明硬件和软件的可互换性,在上述说明中已经按照功能一般性地描述了各示例的组成及步骤。这些功能究竟以硬件还是软件方式来执行,取决于技术方案的特定应用和设计约束条件。专业技术人员可以对每个特定的应用来使用不同方法来实现所描述的功能,但是这种实现不应认为超出本发明的范围。Professionals may further realize that the units and algorithm steps of each example described in conjunction with the embodiments disclosed herein can be implemented in electronic hardware, computer software, or a combination of the two, in order to clearly illustrate the possibilities of hardware and software. Interchangeability, the above description has generally described the components and steps of each example in terms of functionality. Whether these functions are performed in hardware or software depends on the specific application and design constraints of the technical solution. Skilled artisans may implement the described functionality using different methods for each particular application, but such implementations should not be considered beyond the scope of the present invention.

结合本文中所公开的实施例描述的方法或算法的步骤可以直接用硬件、处理器执行的软件模块,或者二者的结合来实施。软件模块可以置于随机存储器(RAM)、内存、只读存储器(ROM)、电可编程ROM、电可擦除可编程ROM、寄存器、硬盘、可移动磁盘、CD-ROM、或技术领域内所公知的任意其它形式的存储介质中。The steps of a method or algorithm described in conjunction with the embodiments disclosed herein may be directly implemented in hardware, a software module executed by a processor, or a combination of the two. A software module can be placed in random access memory (RAM), internal memory, read only memory (ROM), electrically programmable ROM, electrically erasable programmable ROM, registers, hard disk, removable disk, CD-ROM, or any other in the technical field. in any other known form of storage medium.

以上对本发明所提供的固体绝缘开关柜开关触点温度计算方法以及装置进行了详细介绍。本文中应用了具体个例对本发明的原理及实施方式进行了阐述,以上实施例的说明只是用于帮助理解本发明的方法及其核心思想。应当指出,对于本技术领域的普通技术人员来说,在不脱离本发明原理的前提下,还可以对本发明进行若干改进和修饰,这些改进和修饰也落入本发明权利要求的保护范围内。The method and device for calculating the temperature of the switch contacts of the solid insulated switchgear provided by the present invention are described above in detail. The principles and implementations of the present invention are described herein by using specific examples, and the descriptions of the above embodiments are only used to help understand the method and the core idea of the present invention. It should be pointed out that for those skilled in the art, without departing from the principle of the present invention, several improvements and modifications can also be made to the present invention, and these improvements and modifications also fall within the protection scope of the claims of the present invention.

Claims (8)

1. A method for calculating the temperature of a switch contact of a solid insulation switch cabinet is characterized by comprising the following steps:
obtaining multiple groups of sample data in advance, establishing a mathematical model among all influence factors through a partial least square method, and determining a functional relation between the temperature of a measuring point and the temperature of a switch contact of a solid insulation switch cabinet, wherein the sample data comprises multiple groups of influence factor data influencing the temperature change of the switch contact, and the measuring point is located in a preset range around the switch contact; the function relation is
Figure FDA0002231263950000011
Wherein x is3Corresponding to the actual temperature, x, of the switch contact1、x2、x4、x5、x6、x7Corresponding to the influencing factor, y corresponds to the temperature of the measuring point, β1To β7Is a regression coefficient;
acquiring a current temperature value monitored by the measuring point;
and calculating the temperature value of the switch contact of the solid insulation switch cabinet according to the current temperature value and the functional relation.
2. The method of claim 1, wherein the mathematical model is established between the influencing factors by a partial least squares method, and the determining of the functional relationship between the temperature of the measurement point and the temperature of the switch contact of the solid insulated switchgear comprises:
taking the temperature of the measuring point as a dependent variable y and taking each influencing factor as an independent variable x1、x2、x3、x4、x5、x6、x7Acquiring n groups of sample data, and forming a dependent variable matrix Y ═ Y]n×1And the argument matrix X ═ X1x2x3x4x5x6x7]n×7Normalizing Y and X to obtain normalized dependent variable matrix
Figure FDA0002231263950000012
And independent variable matrix
Figure FDA0002231263950000013
Wherein x isijIs the value of the jth variable, y, for the ith sample in the matrix XiRepresenting the ith sample value in matrix Y;
from E0Sequentially extracting principal components, performing regression analysis of dependent variable to independent variable, converting into regression equation of Y to X, and determining
Figure FDA0002231263950000014
The regression coefficient β in1~β7
3. The method for calculating the switch contact temperature of the solid insulated switchgear according to claim 2, wherein the influencing factors specifically include: x is the number of1Corresponding to the thickness d of the epoxy resin insulating layer; x is the number of2Distance switch contact corresponding to installation position of thermocouple temperature sensorR; x is the number of3Corresponding to the actual temperature delta of the switch contacts0;x4Corresponding to the temperature delta of the switch cabinet1;x5Corresponding to the environment temperature delta of the switch cabinet2;x6Working current i corresponding to the bus of the connecting switch contact; x is the number of7Corresponding to the cabinet volume v of the switch cabinet; y corresponds to the temperature Q of the measurement point.
4. The method for calculating the switch contact temperature of the solid insulated switchgear according to claim 2, wherein the normalizing Y and X comprises:
by using
Figure FDA0002231263950000021
The standardized treatment is carried out, and the standard treatment is carried out,
wherein,
Figure FDA0002231263950000022
represents the variable xjAverage value of (1), sjDenotes xjThe standard deviation of (a) is determined,
Figure FDA0002231263950000023
denotes the average value of y, syThe standard deviation of y is indicated.
5. The method for calculating the temperature of the switch contact of the solid insulated switchgear cabinet according to claim 4, wherein the slave E is0After the main components are sequentially extracted, the method also comprises the following steps:
calculating the contribution degree of the extracted components, and judging that the contribution degree of the extracted components is significant when the contribution degree is greater than a preset threshold value.
6. The method for calculating the switch contact temperature of the solid insulated switchgear cabinet according to any one of claims 1 to 5, wherein the obtaining the current temperature value monitored by the measurement point comprises:
and monitoring the current temperature value in real time through a temperature sensor arranged at the measuring point, wherein the measuring point is positioned on the outer wall of the insulating layer of the switch contact.
7. The method for calculating the temperature of the switch contact of the solid insulated switchgear according to claim 6, wherein after calculating the temperature value of the switch contact of the solid insulated switchgear through the functional relationship, the method further comprises:
and displaying the calculated temperature value to a user.
8. A solid insulated switchgear switch contact temperature calculation device, comprising:
the model establishing module is used for acquiring a plurality of groups of sample data in advance, establishing a mathematical model among all influence factors through a partial least square method, and determining a functional relation between the temperature of a measuring point and the temperature of a switch contact of a solid insulation switch cabinet, wherein the sample data comprises a plurality of groups of influence factor data influencing the temperature change of the switch contact, and the measuring point is positioned in a preset range around the switch contact; the function relation is
Figure FDA0002231263950000024
Wherein x is3Corresponding to the actual temperature, x, of the switch contact1、x2、x4、x5、x6、x7Corresponding to the influencing factor, y corresponds to the temperature of the measuring point, β1To β7Is a regression coefficient;
the current temperature acquisition module is used for acquiring a current temperature value monitored by the measurement point;
and the calculation module is used for calculating the temperature value of the switch contact of the solid insulation switch cabinet according to the current temperature value and the functional relation.
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