CN106775065A - A kind of contact panel - Google Patents
A kind of contact panel Download PDFInfo
- Publication number
- CN106775065A CN106775065A CN201611062977.1A CN201611062977A CN106775065A CN 106775065 A CN106775065 A CN 106775065A CN 201611062977 A CN201611062977 A CN 201611062977A CN 106775065 A CN106775065 A CN 106775065A
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- CN
- China
- Prior art keywords
- metal level
- layer
- contact panel
- transparency conducting
- encapsulated layer
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Classifications
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- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F3/00—Input arrangements for transferring data to be processed into a form capable of being handled by the computer; Output arrangements for transferring data from processing unit to output unit, e.g. interface arrangements
- G06F3/01—Input arrangements or combined input and output arrangements for interaction between user and computer
- G06F3/03—Arrangements for converting the position or the displacement of a member into a coded form
- G06F3/041—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F2203/00—Indexing scheme relating to G06F3/00 - G06F3/048
- G06F2203/041—Indexing scheme relating to G06F3/041 - G06F3/045
- G06F2203/04103—Manufacturing, i.e. details related to manufacturing processes specially suited for touch sensitive devices
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- Engineering & Computer Science (AREA)
- General Engineering & Computer Science (AREA)
- Theoretical Computer Science (AREA)
- Human Computer Interaction (AREA)
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing Of Electric Cables (AREA)
Abstract
This application discloses a kind of contact panel, it is used to solve existing metal level that large area can be carried out to the solder of encapsulated layer to block, when causing that plate carries out laser package over there, encapsulated layer can have more gap so that the poor problem of panel packaging effect.The control panel includes encapsulated layer, the metal level above the encapsulated layer, the insulating barrier positioned at the metal layer and the transparency conducting layer above the insulating barrier, it is characterised in that：Described metal level is connected with transparency conducting layer；Area of the area of the metal level less than the transparency conducting layer.
Description
Technical field
The application is related to technical field of semiconductors, more particularly to a kind of contact panel.
Background technology
With the development of Display Technique, display panel has come into the every aspect of people's life.At present, shown
Show in the production process of panel, it is necessary to the different types of panel of two panels is fitted.For example, being touched to On-cell structures
Touch when screen is fitted, it is necessary to contact panel (touch panel, TP) and display panel are fitted.
As shown in figure 1, display panel and contact panel are pasted using laser package technology (Laser Sealing)
During conjunction, laser is begun with, the solder (Frit) in the middle of two panels panel is melted, then after solder is cooled down, just can be by two
Piece panel fits together, and the location of solder is referred to as encapsulated layer.As shown in Fig. 2 encapsulated layer is located at the outer peripheral areas of panel,
In order to prevent air, steam etc. from entering inside encapsulated layer, corrode internal components structure, encapsulated layer can play envelope in loop-like
The effect of dress.
But, partial encapsulation layer top, the upper surface of contact panel often have metal level, as depicted in figs. 1 and 2.Should
Metal level is used to set up contact panel and external circuit and is electrically connected with, in the art, for by contact panel and external electrical
Road sets up the unit being electrically connected with and is referred to as binding terminal (Bonding Pad).Be will be unable to by laser by the solder that metal level is blocked
Irradiation, then when panel attachment is carried out using laser package technology, the solder being blocked and the solder meeting of being heated not being blocked
Difference, when plate carries out laser package over there, can there is more gap in encapsulated layer so that the impurity in air easily corrodes inside
Chip, cause the packaging effect of panel poor.
The content of the invention
The embodiment of the present application provides a kind of contact panel, is used to solve existing metal level to carry out the solder of encapsulated layer
Large area is blocked, and when causing that plate carries out laser package over there, encapsulated layer can have more gap, so that panel packaging effect
Poor problem.
The embodiment of the present application uses following technical proposals：
A kind of contact panel, including encapsulated layer, the metal level above the encapsulated layer, positioned at the metal layer
Insulating barrier and the transparency conducting layer above the insulating barrier：
Described metal level is connected with transparency conducting layer；
Area of the area of the metal level less than the transparency conducting layer.
Preferably, the metal level is arranged in line strip, and the figure of the lines composition of the metal level is non-closed figure.
Preferably, non-closed visuals is located at encapsulated layer top, and described non-closed figure is curvilinear or fold-line-shaped
Arrangement.
Preferably, described non-closed figure is presented bow font arrangement.
Preferably, the metal level is arranged in line strip, and the figure of the lines composition of the metal level is closed figures.
Preferably, the closed figures part is located at encapsulated layer top, and encapsulated layer top is located in described closed figures
Lines be in be parallel to each other bar shaped arrangement.
Preferably, the width of the lines of described metal level is 3 μm.
Preferably, described insulating barrier is silica, there is one or more holes on described silica；Described gold
Category layer is connected by the hole on silica with transparency conducting layer.
Preferably, the material for constituting described transparency conducting layer is tin indium oxide.
Preferably, the material for constituting described metal level is molybdenum.
Above-mentioned at least one technical scheme that the embodiment of the present application is used can reach following beneficial effect：
By the area for reducing the metal level above encapsulated layer so that face of the area of metal level less than transparency conducting layer
Product, is reduced as far as metal level and solder laser energy is blocked, then carrying out panel attachment using laser package technology
When, the laser for being irradiated to encapsulated layer solder can be increased so that the solder of encapsulated layer is heated evenly, it is to avoid encapsulated layer can be present
The problem in more gap, improves the packaging effect of panel.
Brief description of the drawings
Accompanying drawing described herein is used for providing further understanding of the present application, constitutes the part of the application, this Shen
Schematic description and description please does not constitute the improper restriction to the application for explaining the application.In the accompanying drawings：
Fig. 1 is the schematic diagram for carrying out panel encapsulation using laser package technology in the prior art；
Fig. 2 is the schematic diagram of the position of metal level and insulating barrier in contact panel in the prior art；
A kind of structural representation of contact panel that Fig. 3 a are provided for the embodiment of the present application；
The structural representation of another contact panel that Fig. 3 b are provided for the embodiment of the present application；
The structural representation of another contact panel that Fig. 3 c are provided for the embodiment of the present application；
The structural representation of another contact panel that Fig. 4 is provided for the embodiment of the present application；
The structural representation of the via of the insulating barrier that Fig. 5 is provided for the embodiment of the present application.
Specific embodiment
To make the purpose, technical scheme and advantage of the application clearer, below in conjunction with the application specific embodiment and
Corresponding accompanying drawing is clearly and completely described to technical scheme.Obviously, described embodiment is only the application one
Section Example, rather than whole embodiments.Based on the embodiment in the application, those of ordinary skill in the art are not doing
Go out the every other embodiment obtained under the premise of creative work, belong to the scope of the application protection.
Below in conjunction with accompanying drawing, the technical scheme that each embodiment of the application is provided is described in detail.
Embodiment 1
Blocked for the existing metal level of solution can carry out large area to the solder of encapsulated layer, cause plate over there to carry out laser
During encapsulation, can there is more gap in encapsulated layer so that the poor problem of panel packaging effect, the embodiment of the present application 1 provides one kind
Contact panel, the contact panel, including encapsulated layer, the metal level above the encapsulated layer, positioned at the metal layer
Insulating barrier and the transparency conducting layer above the insulating barrier：Described metal level is connected with transparency conducting layer；It is described
Area of the area of metal level less than the transparency conducting layer.
The area of metal level described here can be metal level to being irradiated to the shielded area of the laser of solder.If swashed
The direction of illumination of light is perpendicular to plane where display panel, then the area of metal level, as metal level are flat with display panel
The area in the section in capable plane.And the area of metal level is similarly metal level in the plane parallel with display panel of edge
The area in section.
In the prior art, above encapsulated layer, there is the metal level above transparency conducting layer and metal level, and encapsulated layer
Area it is identical with the area of transparency conducting layer, and in the embodiment of the present application, can be by reducing the metal level above encapsulated layer
Area so that the area of metal level less than transparency conducting layer area, be reduced as far as metal level to solder laser energy
Block, then when panel attachment is carried out using laser package technology, the laser for being irradiated to encapsulated layer solder can be increased, made
The solder of encapsulated layer is heated evenly, it is to avoid can there is more gap in encapsulated layer, improve the packaging effect of panel.
Wherein, the occurrence of metal level area, can be incremented by experiment and obtain by the area gradient of metal level, work as metal level
Area be incremented to laser package packaging effect cannot just meet developer be expected when, that is, cause packaging effect poor
When, then the area of metal level now is the maximum area of non-transparent metals layer.
Because when metal level area is certain, the resistivity of metal level can reduce with the increase of film thickness.Meanwhile, when
When the area of contact panel is larger, contact panel when working required power it is also larger, this be accomplished by the resistivity of metal level compared with
It is small, that is, need the thickness of metal level larger.So, in order to ensure power required during contact panel work, in the face of metal level
The timing of product one, the thickness of metal level should be greater than default thickness threshold value.The occurrence of the thickness threshold value depends on contact panel work
The power that required power, the impedance of metal level conductive material, the area of metal level and transparency conducting layer can be carried when making
Etc. factor.
Equally, the occurrence of thickness threshold value can be obtained by thickness gradient experiment of successively decreasing, certain in metal level area
Under the conditions of, when the thickness of metal level is decreased to metal level cannot just provide required power when touch panel works, now
Thickness value just can be as thickness threshold value.When the thickness of metal level is more than or equal to the thickness threshold value, touch-control just can be provided
Panel power required when working.In a preferred embodiment, the thickness of metal level is
Several preferred embodiments of the contact panel in specific implementation that the embodiment of the present application is provided are done in detail below
Introduce.
Fig. 3 a, Fig. 3 b, Fig. 3 c are referred to, a kind of structure of implementation method of the contact panel provided for the embodiment of the present application
Schematic diagram, wherein, Fig. 3 a are the top views of the subregion in contact panel encapsulated layer region, and Fig. 3 b are contact panels shown in Fig. 3 a
Profile in the horizontal direction, Fig. 3 c are contact panel profiles vertically shown in Fig. 3 a, wherein, the contact panel bag
Include display panel 101, encapsulated layer 102, the contact panel 103 positioned at the top of encapsulated layer 102, positioned at the top of contact panel 103
Metal level 104, insulating barrier 105 and the transparency conducting layer 106 positioned at the top of insulating barrier 105 positioned at the top of metal level 104：Gold
Category layer 104 is connected with transparency conducting layer 106, is set up so as to metal level 104 and transparency conducting layer 106 and is electrically connected with, metal level 104
Area less than transparency conducting layer 106 area.
In the embodiment of the present application, the material for constituting metal level is made up of metal material, constitutes the material of transparency conducting layer
Material is made up of transparent conductive material.The electrical conductivity of most of metal material is higher than the electrical conductivity of transparent conductive material, should
Metal material such as can be the good conductors such as molybdenum, silver.Meanwhile, in order to avoid blocking encapsulated layer due to metal level, cause laser to seal
Packaging effect during dress is poor, and the area that metal level should as few as possible block encapsulated layer, i.e. metal level can lead less than transparent
The area of electric layer.
In actual applications, metal level can include the metal wire of at least one line segment shape, and metal level can be with encapsulated layer
Inside and outside foundation be electrically connected with.
In order to some region of area of the encapsulated layer for preventing metal level from blocking is excessive, can be in the constant base of metal level area
On plinth, metal level is disperseed to arrange, the region large area packaging effect blocked when just can so avoid metal level together is poor
Problem.When disperseing to arrange metal level, metal level can arrange in line strip, it is preferred that the width of lines can be 3 μ
M, such metal level just hardly causes to block to laser, in laser package, the packaging effect that can be encapsulated with improving laser.
In the embodiment of the present application, the figure of the lines composition of metal level can be closed figures, and envelope is located in closed figures
Lines above dress layer are in the bar shaped arrangement being parallel to each other.As shown in Figure 3 a, the rectangular arrangement of metal level 104, certainly, in rectangle
Relative side is in the bar shaped arrangement being parallel to each other.
In actual applications, the figure of the lines composition of metal level can also be non-closed figure.Because metal level can lead
The encapsulated layer sealing effect that cause is blocked by it is poor, and such air and water may enter envelope along the poor region of sealing effect
The interior zone of dress layer encapsulation, then, the part being located above encapsulated layer in the non-closed figure that can be constituted metal level sets
Be calculated as shaped form or fold-line-shaped, curved concrete shape here can be the line of bending, that is, have certain bending curvature and
The line that bending curvature is not zero.The concrete shape of fold-line-shaped, the complications for constituting that can successively be connected by a plurality of line segment head and the tail are even
Line.
Fig. 4 is referred to, the structural representation of another implementation method of the contact panel provided for the embodiment of the present application, its
In the metal level 204 position in vertical direction it is identical with the position of metal level 104 mentioned above, be all in touch surface
Between plate and insulating barrier, simply the arrangement shape of the cabling of metal level 204 is different from metal level 104, in present embodiment, metal
The non-closed figure that cabling is constituted is presented bow font arrangement, as shown in Figure 4.So, the poor region of the packaging effect of encapsulated layer
Figure will also tend to be bow font, then steam along bow font when entering in packaging area, it is necessary to by one section of complications
Path, and because whole section of path is more long, subregion packaging effect has been will also tend in path preferably, such steam may be just
Cannot be introduced into packaging area.
It should be noted that in order to realize more preferable conductive effect, in the embodiment of the present application, metal level and transparency conducting layer
Between insulating barrier in can have one or more holes, the material of insulating barrier can be silica (SiO2), silicon nitride
(SiNx), silicon oxynitride (SiOxNy), metal level is connected by the hole on insulating barrier with transparency conducting layer, as shown in figure 5, metal
Layer 304 is connected with transparency conducting layer 106 by the via on insulating barrier 105.Equally, bowing shown in Fig. 3 c and Fig. 4 is referred to
In view, can there is blockage on metal wire, while by photoetching process shape on the insulating barrier above the blockage of metal wire
Into aperture, transparency conducting layer is then made on this basis again, so, metal level will pass through aperture and transparency conducting layer is realized
It is electrically connected with.
Required power when just ensure that contact panel works during if only using transparent metal layer, then, can be by
Non-transparent metals layer removes, i.e. the area of non-transparent metals layer can be zero, so just can completely avoid non-transparent metals layer
Laser is blocked, the packaging effect of panel is further improved.
In the embodiment of the present application, the material for constituting transparency conducting layer can include tin indium oxide (ITO), it is also possible to including aluminium
Doping zinc-oxide (AZO), the application is not limited this.Meanwhile, the material for constituting metal level can include molybdenum, it is also possible to including
Silver, the application is not also limited this.
The contact panel that the embodiment of the present application is provided, by the area for reducing the metal level above encapsulated layer so that metal
The area of layer is reduced as far as metal level and solder laser energy is blocked, then in profit less than the area of transparency conducting layer
When carrying out panel attachment with laser package technology, the laser for being irradiated to encapsulated layer solder can be increased so that the solder of encapsulated layer
It is heated evenly, it is to avoid encapsulated layer can have more gap, improve the packaging effect of panel.
In actual applications, above-mentioned technical characteristic listed in the embodiment of the present application can be carried out random combine, with
Just superior technique effect is reached, the application is not repeated more specific embodiments.
Embodiments of the invention are the foregoing is only, is not intended to limit the invention.For those skilled in the art
For, the present invention can have various modifications and variations.It is all any modifications made within spirit and principles of the present invention, equivalent
Replace, improve etc., should be included within scope of the presently claimed invention.
It should be noted that unless otherwise defined, all of technologies and scientific terms used here by the article with belong to this hair
The implication that bright those skilled in the art are generally understood that is identical.The term for being used in the description of the invention herein
It is intended merely to describe the purpose of specific embodiment, it is not intended that in the limitation present invention.Term as used herein "and/or" bag
Include the arbitrary and all of combination of one or more related Listed Items.Term as used herein " vertical ", " level
", " first ", " second " and similar statement for illustrative purposes only, it is unique implementation method to be not offered as.
Claims (10)
1. a kind of contact panel, including encapsulated layer, the metal level above the encapsulated layer, positioned at the metal layer
Insulating barrier and the transparency conducting layer above the insulating barrier, it is characterised in that：
Described metal level is connected with transparency conducting layer；
Area of the area of the metal level less than the transparency conducting layer.
2. contact panel according to claim 1, it is characterised in that the metal level is arranged in line strip, the metal
The figure of the lines composition of layer is non-closed figure.
3. contact panel according to claim 2, it is characterised in that described non-closed visuals is located on encapsulated layer
Side, described non-closed figure is curvilinear or fold-line-shaped is arranged.
4. contact panel according to claim 3, it is characterised in that described non-closed figure is presented bow font arrangement.
5. contact panel according to claim 1, it is characterised in that the metal level is arranged in line strip, the metal
The figure of the lines composition of layer is closed figures.
6. contact panel according to claim 5, it is characterised in that：
The closed figures part is located at encapsulated layer top, and the lines above encapsulated layer are located in described closed figures in mutual
Parallel bar shaped arrangement.
7. contact panel according to claim 4, it is characterised in that the width of the lines of described metal level is 3 μm.
8. the contact panel according to claim any one of 1-7, it is characterised in that described insulating barrier is silica,
There are one or more holes on described silica；
Described metal level is connected by the hole on silica with transparency conducting layer.
9. contact panel according to claim 8, it is characterised in that the material of the described transparency conducting layer of composition is oxidation
Indium tin.
10. contact panel according to claim 8, it is characterised in that the material of the described metal level of composition is molybdenum.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201611062977.1A CN106775065A (en) | 2016-11-28 | 2016-11-28 | A kind of contact panel |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201611062977.1A CN106775065A (en) | 2016-11-28 | 2016-11-28 | A kind of contact panel |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN106775065A true CN106775065A (en) | 2017-05-31 |
Family
ID=58901748
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201611062977.1A Pending CN106775065A (en) | 2016-11-28 | 2016-11-28 | A kind of contact panel |
Country Status (1)
| Country | Link |
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| CN (1) | CN106775065A (en) |
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| CN102446040A (en) * | 2010-10-11 | 2012-05-09 | 联建(中国)科技有限公司 | Resistance type touch control panel |
| TW201222105A (en) * | 2010-11-18 | 2012-06-01 | Samsung Mobile Display Co Ltd | Flat panel display integrated with a touch screen panel |
| CN203606592U (en) * | 2013-11-21 | 2014-05-21 | 上海天马微电子有限公司 | Liquid crystal display module and liquid crystal display device |
| CN103984451A (en) * | 2013-02-07 | 2014-08-13 | 义隆电子股份有限公司 | Capacitive touch module |
| CN105185810A (en) * | 2015-08-07 | 2015-12-23 | 京东方科技集团股份有限公司 | Display substrate and manufacturing method, display panel and display apparatus |
| CN105378612A (en) * | 2013-07-12 | 2016-03-02 | 富士胶片株式会社 | Wiring substrate |
| CN105549776A (en) * | 2015-11-19 | 2016-05-04 | 业成光电（深圳）有限公司 | Touch display apparatus |
| CN105807985A (en) * | 2015-01-21 | 2016-07-27 | 三星显示有限公司 | Touch panel and display apparatus having the same |
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2016
- 2016-11-28 CN CN201611062977.1A patent/CN106775065A/en active Pending
Patent Citations (10)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102087432A (en) * | 2009-12-03 | 2011-06-08 | 三星移动显示器株式会社 | Flat panel display integrated with touch screen panel |
| CN102446040A (en) * | 2010-10-11 | 2012-05-09 | 联建(中国)科技有限公司 | Resistance type touch control panel |
| CN102446040B (en) * | 2010-10-11 | 2015-02-18 | 联建(中国)科技有限公司 | Resistance type touch control panel |
| TW201222105A (en) * | 2010-11-18 | 2012-06-01 | Samsung Mobile Display Co Ltd | Flat panel display integrated with a touch screen panel |
| CN103984451A (en) * | 2013-02-07 | 2014-08-13 | 义隆电子股份有限公司 | Capacitive touch module |
| CN105378612A (en) * | 2013-07-12 | 2016-03-02 | 富士胶片株式会社 | Wiring substrate |
| CN203606592U (en) * | 2013-11-21 | 2014-05-21 | 上海天马微电子有限公司 | Liquid crystal display module and liquid crystal display device |
| CN105807985A (en) * | 2015-01-21 | 2016-07-27 | 三星显示有限公司 | Touch panel and display apparatus having the same |
| CN105185810A (en) * | 2015-08-07 | 2015-12-23 | 京东方科技集团股份有限公司 | Display substrate and manufacturing method, display panel and display apparatus |
| CN105549776A (en) * | 2015-11-19 | 2016-05-04 | 业成光电（深圳）有限公司 | Touch display apparatus |
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Application publication date: 20170531 |