CN106774743B - Virtual reality equipment - Google Patents

Abstract

The invention discloses virtual reality equipment. The virtual reality device includes: the device comprises a shell, a processing chip and a control module, wherein a closed accommodating space is surrounded by the shell, and the accommodating space is internally provided with the processing chip; the heat dissipation pipes are adjacent to one side surface of the processing chip, the heat dissipation pipes penetrate through two opposite surfaces of the shell, through holes of the heat dissipation pipes are communicated with outside air, the through holes are isolated from the accommodating space, the cross sectional area of each through hole is gradually increased from one end part to the other end part of the heat dissipation pipe, a heat absorption layer is arranged on the local outer surface of each heat dissipation pipe and is used for conducting heat generated by the processing chip into the through holes, and temperature difference is generated in the through holes.

Description

a virtual reality device

technical field

The present invention relates to a virtual reality device, in particular, the present invention relates to a virtual reality device with a cooling function.

Background technique

With the rapid development of virtual reality (VR) technology, virtual reality devices have come to consumers. At present, mainstream virtual reality devices such as VR all-in-one machines with high-power processing chips need to process a large amount of data. Therefore, a large amount of heat is generated within the VR device. If the heat cannot be discharged, it will accumulate inside the VR device, eventually causing the temperature inside the VR device to rise, thereby reducing the performance of the VR device and affecting the user's product experience. Therefore, the heat dissipation performance of VR equipment is very important, and it has also attracted more and more attention from users.

At present, an effective heat dissipation method is to add a heat dissipation fan in the VR device. Although this method can solve the heat dissipation problem to a certain extent, it also brings incidental problems: it increases the weight of the VR; the operation of the fan brings noise problems; it is easy to accumulate dust and affect the dustproof problem.

Therefore, it is necessary to improve the existing virtual reality equipment to avoid the above problems.

Contents of the invention

An object of the present invention is to provide a new technical solution for virtual reality equipment.

According to a first aspect of the present invention, a virtual reality device is provided. The virtual reality device includes: a casing, the casing is surrounded by a closed accommodation space, and a processing chip is arranged in the accommodation space; a plurality of heat dissipation conduits, the heat dissipation conduits are adjacent to one side surface of the processing chip, and the The heat dissipation conduit runs through two opposite surfaces of the housing, the through hole of the heat dissipation conduit communicates with the outside air, the through hole is isolated from the accommodation space, and the cross-sectional area of the through hole is smaller than that of the heat dissipation one end of the conduit gradually becomes larger to the other end, and a heat absorbing layer is provided on a partial outer surface of each heat dissipation conduit, and the heat absorbing layer is configured to conduct heat generated by the processing chip to the through hole, and a temperature difference is generated in the through hole.

Optionally, the heat dissipation conduit has a first end with the largest cross-sectional area of the through hole and a second end with the smallest cross-sectional area of the through hole, and the heat absorption layer is directed from the first end toward the second end. The end portion is extended, and the length of the heat absorbing layer is less than the length of the heat dissipation pipe.

Optionally, the length of the heat absorbing layer is 3/4 to 4/5 of the length of the heat dissipation pipe.

Optionally, each of the heat dissipation conduits has a heat-absorbing outer surface, the shape of the heat-absorbing outer surface matches the shape of the surface of the processing chip, and the heat-absorbing layer is disposed on the heat-absorbing outer surface.

Optionally, the heat absorption layer is graphite material sprayed on the outer surface of the heat dissipation pipe.

Optionally, a heat conduction layer is disposed on the surface of the processing chip, and the heat conduction layer is in contact with the heat absorbing layer.

Optionally, the heat conduction layer is made of silicone grease material or aluminum foil material.

Optionally, the heat conducting layer is in contact with the heat absorbing layer through finned heat sinks or graphite sheets.

Optionally, the distance between two adjacent heat dissipation pipes is 1-3 cm.

Optionally, the heat dissipation conduit is integrally formed on the housing.

The inventor of the present invention found that in the existing virtual reality equipment, the processing chip will generate a lot of heat. Although the method of adding a cooling fan in the prior art has a certain cooling effect, it also brings a side problem: the increase of VR The weight; the operation of the fan brings noise problems; it is easy to accumulate dust and affect the dustproof problem. The inventors of the present invention further found that, according to aerodynamics, using air convection can effectively solve the problem of heat emission in virtual reality equipment. In the present invention, a heat dissipation conduit whose cross-sectional area changes from small to large is arranged in the casing of the virtual reality device, and the heat generated by the processing chip in the sealed casing can be effectively discharged by using the principle of convection. Dust is not easy to be generated in the sealed casing, and has a good dust-proof effect. The overall weight of the device is reduced and the noise is reduced. Therefore, the technical tasks to be achieved or the technical problems to be solved by the present invention are never thought of or expected by those skilled in the art, so the present invention is a new technical solution.

Other features of the present invention and advantages thereof will become apparent from the following detailed description of exemplary embodiments of the present invention with reference to the accompanying drawings.

Description of drawings

The accompanying drawings, which are incorporated in and constitute a part of this specification, illustrate embodiments of the invention and together with the description serve to explain the principles of the invention.

FIG. 1 is a front view of a virtual reality device provided in an embodiment of the present invention;

Fig. 2 is a top view of a virtual reality device provided in an embodiment of the present invention.

Detailed ways

Various exemplary embodiments of the present invention will now be described in detail with reference to the accompanying drawings. It should be noted that the relative arrangements of components and steps, numerical expressions and numerical values set forth in these embodiments do not limit the scope of the present invention unless specifically stated otherwise.

The following description of at least one exemplary embodiment is merely illustrative in nature and in no way taken as limiting the invention, its application or uses.

Techniques, methods and devices known to those of ordinary skill in the relevant art may not be discussed in detail, but where appropriate, such techniques, methods and devices should be considered part of the description.

In all examples shown and discussed herein, any specific values should be construed as exemplary only, and not as limitations. Therefore, other instances of the exemplary embodiment may have different values.

It should be noted that like numerals and letters denote like items in the following figures, therefore, once an item is defined in one figure, it does not require further discussion in subsequent figures.

The invention provides a virtual reality device, which comprises a shell and several heat dissipation conduits, the heat dissipation conduits are used to discharge the heat generated by the processing chip in the shell. In the present invention, a heat dissipation conduit whose cross-sectional area changes from small to large is arranged in the casing of the virtual reality device, and the heat generated by the processing chip in the sealed casing can be effectively discharged by using the principle of convection. Dust is not easy to be generated in the sealed casing, and has a good dust-proof effect. At the same time, the overall weight of the device is reduced and the noise is reduced.

The casing 2 is surrounded by an accommodating space, and the virtual reality device includes a processing chip, and the processing chip is arranged in the accommodating space. Based on the powerful data processing capability of the built-in processing chip, the virtual reality device can run large-scale VR applications. However, due to the large amount of heat generated by the processing chip, the heat is easy to accumulate in the accommodation space and cause the temperature to rise. In order to solve the problem of heat generation, several heat dissipation pipes 1 are arranged on one side surface adjacent to the processing chip. The heat dissipation pipe 1 passes through two opposite surfaces of the housing 2 . The through hole of the heat dissipation conduit 1 communicates with the outside air, and the through hole of the heat dissipation conduit 1 is isolated from the containing space. For example, as shown in Fig. 1 and Fig. 2, the housing 2 may include a front shell and a rear shell that are detachably connected. The two opposite surfaces on the front shell.

The cross-sectional area of the through hole gradually increases from one end to the other end of the heat dissipation pipe 1 . A heat absorbing layer is provided on a part of the outer surface of each heat dissipation pipe 1 , and the heat absorbing layer is used to absorb the heat generated by the processing chip and conduct the heat to the inside of the through hole. It should be noted that the present invention does not specifically limit the position and connection relationship between the heat absorbing layer and the processing chip, as long as several of the heat dissipation pipes 1 are arranged on one side surface adjacent to the processing chip, it can It only needs to absorb the heat generated by the processing chip. For example, the heat absorbing layer may be in direct contact with the processing chip or may be in indirect contact through other components, and there may be a certain distance between the heat absorbing layer and the processing chip.

Since the heat absorbing layer is partially disposed on the outer surface of the heat dissipation conduit 1 , a temperature difference will be generated in the through hole of the heat dissipation conduit 1 . In addition, a special structural design in which the cross-sectional area of the through hole gradually becomes larger. Therefore, the hot air in the through hole rises, and the cold air sinks, forming air convection to quickly take away the heat in the through hole, so as to achieve the effect of heat dissipation. Moreover, the through hole is isolated from the accommodation space, so as to prevent air from flowing between the through hole and the accommodation space to form dust.

It should be noted that the present invention does not specifically limit the shape of the through hole, and the cross-sectional shape of the through hole may be circular, rectangular or other irregular shapes. In a preferred embodiment of the present invention, each of the heat dissipation conduits 1 has a heat-absorbing outer surface. The shape of the heat-absorbing outer surface matches the shape of one side surface of the processing chip, so that the heat dissipation pipe 1 is matched with the processing chip. For example, when one side surface of the processing chip is a planar structure, the heat-absorbing outer surface of the heat dissipation pipe 1 may be a planar structure matching the shape of the processing chip. The heat absorbing layer is disposed on the heat absorbing outer surface. In order to make the heat dissipation pipe 1 closely cooperate with the processing chip, the heat absorption layer may be uniformly arranged on the heat absorption outer surface of the heat dissipation pipe 1 .

The cross-sectional area of the through hole gradually increases from one end of the heat dissipation conduit 1 to the other end, and the heat dissipation conduit 1 has a first end with the largest cross-sectional area of the through hole and a cross-sectional area of the through hole The smallest second end. After a temperature difference is generated in the through holes of this structure, air convection can be generated to take away heat. In order to obtain a better convection effect and quickly remove heat, preferably, the heat absorbing layer extends from the first end toward the second end, and the length of the heat absorbing layer is shorter than that of the heat dissipation pipe 1 length. In this way, the temperature adjacent to the first end portion is higher and the temperature adjacent to the second end portion is lower, creating a temperature difference to form air convection. The hot air flow rises and is directly discharged from the opening of the first end to achieve rapid heat dissipation.

Further, the length of the heat absorbing layer is between 3/4 and 4/5 of the length of the heat dissipation pipe 1 . It has been verified that when the length of the heat-absorbing layer is between three-quarters and four-fifths of the length of the heat-dissipating duct 1, the convection effect is the best, and the hot air flow can quickly flow from the first end discharge from the opening.

It should be noted that the present invention does not limit the material of the heat absorbing layer, as long as it can absorb the heat generated by the processing chip and conduct the heat into the through hole. In a preferred embodiment of the present invention, the heat absorbing layer is a graphite material sprayed on the outer surface of the heat dissipation pipe, such as nano-carbon or the like. Graphite material is a good conductor of heat, and its heat transfer performance is excellent. It also dissipates heat while absorbing, and its own temperature will not be too high during heat conduction. In this way, the heat absorbing layer made of graphite material can quickly absorb the heat generated by the processing chip and quickly conduct the heat into the through hole.

Preferably, a heat conduction layer is provided on the surface of the processing chip. The heat conducting layer is in contact with the heat absorbing layer on the heat dissipation pipe 1 . For example, the heat conduction layer may be a silicone grease material or an aluminum foil material with good heat conduction properties. In this way, the processing chip and the heat dissipation pipe 1 are in contact with the heat conducting layer and the heat absorbing layer thereon to conduct heat conduction more rapidly.

Further, the heat conducting layer is in contact with the heat absorbing layer through finned heat sinks or graphite sheets. For example, the finned heat sink or the graphite sheet may be respectively connected to the heat absorbing layer and the heat conducting layer through a heat conducting gel. In this way, through the arrangement of the finned heat sink or the graphite sheet, the heat generated by the processing chip can be quickly and concentratedly conducted from the heat conducting layer to the heat absorbing layer, and then to the heat dissipation pipe 1. In the through hole, and finally discharged by convection.

As shown in FIG. 1 , there is a certain distance between two adjacent heat dissipation pipes 1 . Since the through holes of the heat dissipation pipes 1 have different cross-sectional areas, the distance between two adjacent heat dissipation pipes 1 is within a certain range. Preferably, the distance between two adjacent heat dissipation pipes 1 is 1-3 cm. In this way, it is avoided that the distance between two adjacent heat dissipation pipes 1 is too small, causing thermal interference between adjacent heat dissipation pipes 1 and affecting the effect of convective heat dissipation. It should be noted that the present invention does not specifically limit the number of the heat dissipation pipes 1 . According to the shape, size, calorific value of the processing chip, and the structural size of the heat dissipation conduit 1 , there may be a corresponding number of the heat dissipation conduits 1 .

It should be noted that, the present invention does not specifically limit the position of the heat dissipation pipe 1 in the housing 2 . According to the position of the processing chip in the accommodating space of the casing 2, the heat dissipation pipe 1 may have a corresponding structure and position, so as to dissipate the heat generated by the processing chip. In a preferred embodiment of the present invention, the heat dissipation pipe 1 is integrally formed on the housing 2 . For example, the casing 2 may have a casing wall of a certain thickness, and the through hole is directly provided on the casing wall of the casing 2 . In this case, the housing 2 should also be made of heat-conducting materials. The heat dissipation conduit 1 may also not be completely disposed on the shell wall of the housing 2 , and it may also be separately disposed in the accommodation space surrounded by the housing 2 . In this case, the housing 2 and the heat dissipation pipe 1 may be made of different materials.

Although some specific embodiments of the present invention have been described in detail through examples, those skilled in the art should understand that the above examples are for illustration only and not intended to limit the scope of the present invention. Those skilled in the art will appreciate that modifications can be made to the above embodiments without departing from the scope and spirit of the invention. The scope of the invention is defined by the appended claims.

Claims (7)

1. A virtual reality device, characterized in that, comprising: A housing (2), the housing (2) is surrounded by a closed accommodating space, and a processing chip is arranged in the accommodating space; A plurality of heat dissipation conduits (1), the heat dissipation conduits (1) are adjacent to one side surface of the processing chip, the heat dissipation conduits (1) pass through two opposite surfaces of the housing (2), the heat dissipation conduits The through hole in (1) communicates with the outside air, the through hole is isolated from the accommodation space, and the cross-sectional area of the through hole gradually increases from one end to the other end of the heat dissipation conduit (1) , a heat absorbing layer is provided on a partial outer surface of each heat dissipation pipe (1), and the heat absorbing layer is configured to conduct the heat generated by the processing chip into the through hole, and A temperature difference is generated in the through hole; Each of the heat dissipation conduits (1) has a heat-absorbing outer surface, the shape of the heat-absorbing outer surface matches the shape of the surface of the processing chip, and the heat-absorbing layer is arranged on the heat-absorbing outer surface; The length of the heat absorbing layer is three-quarters to four-fifths of the length of the heat dissipation conduit (1); The heat dissipation conduit (1) is integrally formed on the casing (2). 2. The virtual reality device according to claim 1, characterized in that the heat dissipation conduit (1) has a first end with the largest cross-sectional area of the through hole and a second end with the smallest cross-sectional area of the through hole, so The heat absorbing layer extends from the first end toward the second end, and the length of the heat absorbing layer is shorter than the length of the heat dissipation pipe (1). 3. The virtual reality device according to claim 1, wherein the heat absorbing layer is graphite material sprayed on the outer surface of the heat dissipation pipe. 4 . The virtual reality device according to claim 1 , wherein a heat conduction layer is arranged on the surface of the processing chip, and the heat conduction layer is in contact with the heat absorbing layer. 5. The virtual reality device according to claim 4, characterized in that, the heat conduction layer is made of silicone grease or aluminum foil. 6 . The virtual reality device according to claim 4 , wherein the heat conducting layer is in contact with the heat absorbing layer through finned heat sinks or graphite sheets. 7. The virtual reality device according to claim 1, characterized in that the distance between two adjacent heat dissipation ducts (1) is 1-3 cm.