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CN106737655A - A kind of configurable manipulator wafer centring means - Google Patents

A kind of configurable manipulator wafer centring means Download PDF

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Publication number
CN106737655A
CN106737655A CN201510811888.1A CN201510811888A CN106737655A CN 106737655 A CN106737655 A CN 106737655A CN 201510811888 A CN201510811888 A CN 201510811888A CN 106737655 A CN106737655 A CN 106737655A
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CN
China
Prior art keywords
module
awc
fpga module
centring means
fpga
Prior art date
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Pending
Application number
CN201510811888.1A
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Chinese (zh)
Inventor
褚明杰
徐方
曲道奎
花鹏
张锋
张鹏
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Shenyang Siasun Robot and Automation Co Ltd
Original Assignee
Shenyang Siasun Robot and Automation Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Shenyang Siasun Robot and Automation Co Ltd filed Critical Shenyang Siasun Robot and Automation Co Ltd
Priority to CN201510811888.1A priority Critical patent/CN106737655A/en
Publication of CN106737655A publication Critical patent/CN106737655A/en
Pending legal-status Critical Current

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Classifications

    • BPERFORMING OPERATIONS; TRANSPORTING
    • B25HAND TOOLS; PORTABLE POWER-DRIVEN TOOLS; MANIPULATORS
    • B25JMANIPULATORS; CHAMBERS PROVIDED WITH MANIPULATION DEVICES
    • B25J9/00Programme-controlled manipulators
    • B25J9/16Programme controls
    • B25J9/1602Programme controls characterised by the control system, structure, architecture
    • B25J9/161Hardware, e.g. neural networks, fuzzy logic, interfaces, processor
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/68Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for positioning, orientation or alignment

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Automation & Control Theory (AREA)
  • Artificial Intelligence (AREA)
  • Evolutionary Computation (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • General Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Manufacturing & Machinery (AREA)
  • Fuzzy Systems (AREA)
  • Mathematical Physics (AREA)
  • Software Systems (AREA)
  • Robotics (AREA)
  • Mechanical Engineering (AREA)
  • Numerical Control (AREA)

Abstract

The invention provides a kind of configurable manipulator wafer centring means, embedded CPU module is connected with FPGA module, and embedded CPU module reads the configuration information of AWC stations and IO interlockings from FPGA module;Input Acquisition Circuit is connected with FPGA module at a high speed, and the input signal in collection AWC sensor signals and IO interlock functions is simultaneously sent to FPGA module;IO output circuits are connected with FPGA module, receive FPGA module control signal output IO interlocking signals;User's I/O interface is input into Acquisition Circuit with the high speed and IO output circuits are connected, and realizes AWC functions and IO interlock functions.Configurable manipulator wafer centring means of the invention, will all access the present apparatus for the high-rate input signals of AWC functions with IO interlocking signals, omit IO capture cards;By the importation Acquisition Circuit in IO interlocking signals all by the circuit realiration as AWC high speed input circuits, and the Acquisition Circuit of the two is all accessed into FPGA, indefinite differentiation AWC circuits and IO input circuits, give tacit consent to all high speed input circuits.

Description

A kind of configurable manipulator wafer centring means
【Technical field】
The present invention relates to semiconductor processing equipment technical field, more particularly to a kind of configurable manipulator wafer Centring means.
【Background technology】
In semicon industry, the transmission of wafer is completed between each chamber or between station usually using manipulator. In wafer transmission system, to avoid taking the generation of the objective factor such as off normal or wafer breakage during piece, improve brilliant The degree of accuracy that circle is picked and placeed is, it is necessary to design and use AWC (Active Wafer Centering) functions to be examined Survey and correction.AWC function wafer self-centering functions, for practical center during robotic transfer wafer With the off normal situation at teaching center, corrected automatically in the motion process of manipulator, it is ensured that wafer is by just Often it is transported to specified location.
AWC functions include two sensors using one group, are positioned over the station direction for needing detection, such as move Radial alignment and crystal round fringes between, and ensure two sensor lines and station vertical, the machine of radial direction as far as possible Tool hand, when sensor has detected wafer to come in and go out, can be watched in collection at once during GOTO instructions are performed Take shaft position data and preserve, in calculating the wafer center of circle and manipulator finger according to 4 secondary datas for collecting The deviation of the heart.While manipulator stretches in place, R axles and T axles can be compensated to the bias vector automatically Treatment, realizes automatic deviation correction, until GOTO order fulfillments after deviation elimination, it is ensured that wafer is accurately transmitted To aiming station.
At present, the manipulator applied in semicon industry be all by motion control card or servo-driver in itself The high speed having is input into Acquisition Circuit to complete the high speed acquisition function of AWC sensor signals.The function needs Using motion control card or the high-rate input signals Acquisition Circuit of servo-driver, when sensor sweeps to wafer The positional value of current robot axis servomotor is latched during edge by high speed input circuit.Manipulator reaches work Position and complete wafer centering operation after, also need with semiconductor manufacturing equipment carry out IO (Input/Output, it is defeated Enter/export) interlocked operation, to ensure to transmit security wafer.
Due to the complicated variety of production process of semiconductor, different semiconductor manufacturers are to manipulator AWC functions And the demand of IO interlock functions is different, even same semiconductor manufacturers are for device upgrade or carry Demand from the aspect of high yield etc. to AWC functions and IO interlock functions is likely to that change can be produced.This will Ask manipulator AWC functional interfaces and the mutual lock interfaces of IO should have height flexible configurability.
Semiconductor manufacturers are even more more to 8 stations from 1 station to the station number demand that AWC functions are supported. And AWC needs 2 road high-rate input signals using each station, to meet the demand of whole semiconductor manufacturers, The AWC signal acquisition circuits of manipulator will at least meet 8 station demands, i.e. 16 tunnels are input at a high speed Acquisition Circuit. Therefore to meet application demand, current the best way is separately to locate AWC Acquisition Circuits and IO interlock circuits Reason.Design one and at least meet 8 station AWC applications, the special of Acquisition Circuit is input at a high speed with 16 tunnels Wafer centering control device, AWC signals are linked into FPGA, are configured AWC by configuring FPGA and are adopted Enable and the interrelated logic operation of collector, and the IO of manipulator is realized additionally by conventional IO capture cards Interlock function.
In actual applications, most semiconductor life manufacturer takes less than 8 station AWC functions, and this will make Into the waste of robot hardware resource, and increase the cost of manipulator.When production technology changes, If AWC functions and IO interlock functions need adjustment, it is necessary to change between manipulator and semiconductor manufacturing equipment Interconnection cable, and need substantial amounts of time to debug change in design, cause the wave in manpower and materials Take.
【The content of the invention】
Based on this, it is an object of the invention to provide a kind of configurable manipulator wafer centring means.
It is in order to realize the purpose of the present invention, there is provided a kind of configurable manipulator wafer centring means including embedding Enter formula CPU module, FPGA module, at a high speed IO output circuits, input Acquisition Circuit, user's I/O interface; The embedded CPU module is connected with the FPGA module, and the embedded CPU module is from the FPGA Module reads the configuration information of AWC stations and IO interlockings;The high speed is input into Acquisition Circuit and the FPGA Module is connected, and the input signal in collection AWC sensor signals and IO interlock functions is simultaneously sent to the FPGA Module;The IO output circuits are connected with the FPGA module, receive the FPGA module control signal defeated Go out IO interlocking signals;User's I/O interface is input into Acquisition Circuit with the high speed and IO output circuits are connected, AWC functions and IO interlock functions are realized for being connected with external equipment.
Preferably, described device also includes EEPROM module, the EEPROM module and the embedded type CPU Module is connected, and the EEPROM module is used for the configuration information for storing AWC stations and IO interlockings.
Preferably, the EEPROM module is connected by universal serial bus with the embedded CPU module.
Preferably, described device also includes driver interface circuit, the driver interface circuit and the FPGA Module is connected, and the driver interface circuit is used to connect peripheral driver.
Preferably, the driver interface circuit receives the code device signal of peripheral driver and sends described The position command of FPGA module, speed command or torque instruction are to peripheral driver.
Preferably, described device also includes bus communication circuit, and the bus communication circuit is embedded with described CPU module is connected, and the bus communication circuit is used to connect outside host computer.
Preferably, the bus communication circuit receive outside host computer AWC stations and IO interlockings with confidence Breath.
Preferably, the external equipment includes AWC sensors and process equipment.
Preferably, the embedded CPU module is connected by address date line with the FPGA module.
It is different from prior art, above-mentioned configurable manipulator wafer centring means, by for AWC functions High-rate input signals all access the present apparatus with IO interlocking signals, omit IO capture cards;By IO interlocking signals In importation Acquisition Circuit all by the circuit realiration as AWC high speed input circuits, and by two The Acquisition Circuit of person all accesses FPGA, indefinite differentiation AWC circuits and IO input circuits, gives tacit consent to all High speed input circuit.
【Brief description of the drawings】
Fig. 1 is the structural representation of manipulator wafer centring means configurable in one embodiment of the invention.
Description of reference numerals:
1st, embedded CPU module;
2nd, FPGA module;
3rd, bus communication circuit;
4th, EEPROM module;
5th, driver interface circuit;
6th, IO output circuits;
7th, Acquisition Circuit is input at a high speed;
8th, user's I/O interface;
9th, host computer;
10th, AWC sensors;
11st, process equipment.
【Specific embodiment】
To describe technology contents of the invention, structural feature, the objects and the effects in detail, below in conjunction with Implementation method simultaneously coordinates accompanying drawing to be explained in detail.It should be appreciated that specific embodiment described herein is only used to solve The present invention is released, is not used to limit the present invention.
The present invention provides a kind of configurable manipulator wafer centring means, including embedded CPU module, FPGA Module, at a high speed IO output circuits, input Acquisition Circuit and user's I/O interface.
The embedded CPU module is connected with the FPGA module, and the embedded CPU module is from the FPGA Module reads the configuration information of AWC stations and IO interlockings.
The high speed input Acquisition Circuit is connected with the FPGA module, gathers AWC sensor signals and IO Input signal in interlock function is simultaneously sent to the FPGA module;The IO output circuits and the FPGA Module is connected, and receives the FPGA module control signal output IO interlocking signals;User's I/O interface with The high speed input Acquisition Circuit and the connection of IO output circuits, AWC functions are realized for being connected with external equipment With IO interlock functions.
Specifically, as shown in figure 1, in an embodiment of the present invention, a kind of configurable manipulator wafer is determined Center device, including embedded CPU module 1, FPGA module 2, at a high speed IO output circuits 6, input collection electricity Road 7 and user's I/O interface 8.
The embedded CPU module 1 is core controller, gathers high-rate input signals and latches servo shaft position Value, and control IO interlock functions are realized.Embedded CPU module 1 is connected with FPGA module 2, embedded Formula CPU module 1 reads the configuration information of AWC stations and IO interlockings from FPGA module 2.
High speed input Acquisition Circuit 7 is connected with FPGA module 2, gathers the signal of AWC sensors 10 and IO Input signal in interlock function is simultaneously sent to FPGA module 2.
The IO output circuits 6 are connected with FPGA module 2, receive the control signal of FPGA module 2 output IO Interlocking signal.
User's I/O interface 8 be the special external I/O interface of manipulator, user's I/O interface 8 respectively with a high speed Input Acquisition Circuit 7 and IO output circuits 6 are connected, and AWC functions and IO are realized for being connected with external equipment Interlock function.
Described device also includes EEPROM module 4, and EEPROM module 4 is connected with embedded CPU module 1, EEPROM module 4 is used for the configuration information for storing AWC stations and IO interlockings.Embedded type CPU after each upper electricity Module 1 reads the configuration information of AWC stations and IO interlockings from EEPROM module 4, and writes FPGA moulds Block 2.FPGA module 22 is configured according to above-mentioned configuration information to high speed input Acquisition Circuit 7.
Preferable, EEPROM module 4 is connected by universal serial bus with embedded CPU module 1.
As shown in figure 1, in an alternative embodiment of the invention, a kind of configurable manipulator wafer centring means, Including embedded CPU module 1, FPGA module 2, at a high speed IO output circuits 6, input Acquisition Circuit 7 and use Family I/O interface 8.
The embedded CPU module 1 is core controller, gathers high-rate input signals and latches servo shaft position Value, and control IO interlock functions are realized.Embedded CPU module 1 is connected with FPGA module 2, embedded Formula CPU module 1 reads the configuration information of AWC stations and IO interlockings from FPGA module 2.Preferable, The embedded CPU module 1 is connected by address date line with the FPGA module 2.
High speed input Acquisition Circuit 7 is connected with FPGA module 2, gathers the signal of AWC sensors 10 and IO Input signal in interlock function is simultaneously sent to FPGA module 2.
The IO output circuits 6 are connected with FPGA module 2, receive the control signal of FPGA module 2 output IO Interlocking signal.
User's I/O interface 8 be the special external I/O interface of manipulator, user's I/O interface 8 respectively with a high speed Input Acquisition Circuit 7 and IO output circuits 6 are connected, and AWC functions and IO are realized for being connected with external equipment Interlock function.
Described device also includes driver interface circuit 5, and driver interface circuit 5 is connected with FPGA module 2, Driver interface circuit 5 is used to connect peripheral driver.
Preferable, driver interface circuit 5 receives the code device signal of peripheral driver and sends the FPGA The position command of module 2, speed command or torque instruction are to peripheral driver.Will be by inside FPGA module 2 IO configuration registers are configured to the high-rate input signals " line with " of AWC functions into serial interrupt signal, output To embedded CPU module 1, embedded CPU module 1 is set to latch current servo shaft position value after responding interruption.
As shown in figure 1, in another preferred embodiment of the invention, a kind of configurable manipulator wafer centering Device, including embedded CPU module 1, FPGA module 2, at a high speed IO output circuits 6, input Acquisition Circuit 7 and user's I/O interface 8, bus communication circuit 3.
The bus communication circuit 3 is connected with embedded CPU module 1, and bus communication circuit 3 is used to connect outer Portion's host computer 9, the bus that the bus communication circuit 3 is used has an open architecture, such as Canopen or EhterCAT etc..
Bus communication circuit 3 receives the configuration information of AWC stations and the IO interlocking of outside host computer 9.Specifically Ground, is communicated by bus communication circuit 3 (controlling bus) and host computer 9 and interlocks AWC stations and IO Configuration information write-in EEPROM module 4 and read-write FPGA module 2.
The embedded CPU module 1 is core controller, gathers high-rate input signals and latches servo shaft position Value, and control IO interlock functions are realized.Embedded CPU module 1 is connected with FPGA module 2, embedded Formula CPU module 1 reads the configuration information of AWC stations and IO interlockings from FPGA module 2.Preferable, The embedded CPU module 1 is connected by address date line with the FPGA module 2.
High speed input Acquisition Circuit 7 is connected with FPGA module 2, gathers the signal of AWC sensors 10 and IO Input signal in interlock function is simultaneously sent to FPGA module 2.
The IO output circuits 6 are connected with FPGA module 2, receive the control signal of FPGA module 2 output IO Interlocking signal.
User's I/O interface 8 be the special external I/O interface of manipulator, user's I/O interface 8 respectively with a high speed Input Acquisition Circuit 7 and IO output circuits 6 are connected, and AWC functions and IO are realized for being connected with external equipment Interlock function.
Embedded CPU module 1 first reads the configuration information stored in EEPROM module 4 after each system electrification, IO configuration registers in FPGA module 2 are configured.Embedded CPU module 1 is also total by communication Line reads the configuration file that host computer 9 is issued, and configuration file is write into EEPROM module 4.
Preferable, the external equipment includes AWC sensors 10 and process equipment 11, wherein, AWC is passed Sensor 10AWC function detection sensors;Process equipment 11 is semiconductor production equipment, is passed through with manipulator IO interlockings ensure wafer transmission safety.
The configurable manipulator wafer centring means of the embodiment of the present invention, will be defeated for the high speed of AWC functions Enter signal and all access the present apparatus with IO interlocking signals, omit IO capture cards.Will be defeated in IO interlocking signals Enter part Acquisition Circuit all by the circuit realiration as AWC high speed input circuits, and adopting the two Collector all accesses FPGA, indefinite differentiation AWC circuits and IO input circuits, gives tacit consent to all high speeds defeated Enter circuit.
User generates configuration file by the AWC stations application message and IO interlock informations that host computer will need, And the present apparatus is handed down to by communication bus.Embedded CPU module in the present apparatus reads configuration file and deposits Storage is in the nonvolatile memory.After system electrification, the present apparatus can automatically carry out initialization operation, at this Configuration file reads during embedded CPU module can will be stored in nonvolatile memory in operating process, and root The management input inside FPGA and the register of output signal are configured according to configuration file, with postponing deposit All high-rate input signals flexibly can be configured to AWC functions or IO interlock functions by device.
When needing the situation of change AWC functions or IO interlock functions if any technique upgrading or device upgrade etc., only AWC and IO interlock functions need to be completed again through host computer generation configuration file and by being handed down to the present apparatus It is reconfigured at, greatly uses manpower and material resources sparingly.I/O interface function of the manipulator to user is unified, comprising AWC Function and IO interlock functions, versatility are stronger, and make the hardware production maintenance cost of the manipulator part significantly Reduce.
It should be noted that in the present invention, such as first and second or the like relational terms are used merely to One entity or operation are made a distinction with another entity or operation, and is not necessarily required or is implied this There is any this actual relation or order between a little entities or operation.And, term " including ", " bag Containing " or any other variant thereof is intended to cover non-exclusive inclusion, so that including a series of key elements Process, method, article or terminal device not only include those key elements, but also including not arranging clearly Other key elements for going out, or also include intrinsic for this process, method, article or terminal device Key element.In the absence of more restrictions, limited by sentence " including ... " or " including ... " Key element, it is not excluded that also exist in the process including above-mentioned key element, method, article or terminal device another Outer key element.Additionally, herein, " being more than ", " being less than ", " exceeding " etc. are interpreted as not including this number; " more than ", " below ", " within " etc. be interpreted as including this number.
Although being described to the various embodiments described above, those skilled in the art once know Basic creative concept, then can make other change and modification to these embodiments, so the above is above-mentioned only It is the embodiment of type of the present invention, not thereby limits scope of patent protection of the invention, it is every using the present invention Equivalent structure or equivalent flow conversion that specification and accompanying drawing content are made, or directly or indirectly it is used in other Related technical field, is similarly included within scope of patent protection of the invention.

Claims (9)

1. a kind of configurable manipulator wafer centring means, it is characterised in that including embedded CPU module, FPGA module, at a high speed IO output circuits, input Acquisition Circuit, user's I/O interface;The embedded type CPU Module is connected with the FPGA module, and the embedded CPU module reads AWC works from the FPGA module Position and the configuration information of IO interlockings;The high speed input Acquisition Circuit is connected with the FPGA module, gathers Input signal in AWC sensor signals and IO interlock functions is simultaneously sent to the FPGA module;The IO Output circuit is connected with the FPGA module, receives the FPGA module control signal output IO interlocking signals; User's I/O interface is input into Acquisition Circuit with the high speed and IO output circuits are connected, for being set with outside AWC functions and IO interlock functions are realized in standby connection.
2. configurable manipulator wafer centring means according to claim 1, it is characterised in that institute Stating device also includes EEPROM module, and the EEPROM module is connected with the embedded CPU module, institute EEPROM module is stated for storing the configuration information of AWC stations and IO interlockings.
3. configurable manipulator wafer centring means according to claim 2, it is characterised in that institute EEPROM module is stated to be connected with the embedded CPU module by universal serial bus.
4. configurable manipulator wafer centring means according to claim 1, it is characterised in that institute Stating device also includes driver interface circuit, and the driver interface circuit is connected with the FPGA module, institute Driver interface circuit is stated for connecting peripheral driver.
5. configurable manipulator wafer centring means according to claim 4, it is characterised in that institute The position for stating code device signal and the transmission FPGA module that driver interface circuit receives peripheral driver refers to Make, speed command or torque instruction to peripheral driver.
6. configurable manipulator wafer centring means according to claim 1, it is characterised in that institute Stating device also includes bus communication circuit, and the bus communication circuit is connected with the embedded CPU module, The bus communication circuit is used to connect outside host computer.
7. configurable manipulator wafer centring means according to claim 6, it is characterised in that institute State bus communication circuit and receive the AWC stations of outside host computer and the configuration information of IO interlockings.
8. configurable manipulator wafer centring means according to claim 1, it is characterised in that institute Stating external equipment includes AWC sensors and process equipment.
9. configurable manipulator wafer centring means according to claim 1, it is characterised in that institute Embedded CPU module is stated to be connected with the FPGA module by address date line.
CN201510811888.1A 2015-11-20 2015-11-20 A kind of configurable manipulator wafer centring means Pending CN106737655A (en)

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Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN1464824A (en) * 2001-06-25 2003-12-31 林武秀 System for conveying and transferring semiconductor or liquid crystal wafer one by one
WO2009032204A1 (en) * 2007-08-30 2009-03-12 Applied Materials, Inc. Method and apparatus for robot calibrations with a calibrating device
CN103594406A (en) * 2013-11-05 2014-02-19 中国电子科技集团公司第四十五研究所 Self-centering positioning chuck and centering positioning method of semiconductor wafer
CN103930984A (en) * 2011-11-23 2014-07-16 日本电产三协株式会社 Work transfer system
CN104626151A (en) * 2013-11-13 2015-05-20 沈阳新松机器人自动化股份有限公司 Mechanical arm wafer centering device and method
US20150179488A1 (en) * 2013-12-23 2015-06-25 Lam Research Corporation Robot with integrated aligner

Patent Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN1464824A (en) * 2001-06-25 2003-12-31 林武秀 System for conveying and transferring semiconductor or liquid crystal wafer one by one
WO2009032204A1 (en) * 2007-08-30 2009-03-12 Applied Materials, Inc. Method and apparatus for robot calibrations with a calibrating device
CN103930984A (en) * 2011-11-23 2014-07-16 日本电产三协株式会社 Work transfer system
CN103594406A (en) * 2013-11-05 2014-02-19 中国电子科技集团公司第四十五研究所 Self-centering positioning chuck and centering positioning method of semiconductor wafer
CN104626151A (en) * 2013-11-13 2015-05-20 沈阳新松机器人自动化股份有限公司 Mechanical arm wafer centering device and method
US20150179488A1 (en) * 2013-12-23 2015-06-25 Lam Research Corporation Robot with integrated aligner

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