CN106711721A - Mobile phone data line - Google Patents
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- CN106711721A CN106711721A CN201611244843.1A CN201611244843A CN106711721A CN 106711721 A CN106711721 A CN 106711721A CN 201611244843 A CN201611244843 A CN 201611244843A CN 106711721 A CN106711721 A CN 106711721A
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R31/00—Coupling parts supported only by co-operation with counterpart
- H01R31/06—Intermediate parts for linking two coupling parts, e.g. adapter
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K13/00—Use of mixtures of ingredients not covered by one single of the preceding main groups, each of these compounds being essential
- C08K13/02—Organic and inorganic ingredients
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
- C08K3/16—Halogen-containing compounds
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- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
- C08K3/18—Oxygen-containing compounds, e.g. metal carbonyls
- C08K3/20—Oxides; Hydroxides
- C08K3/22—Oxides; Hydroxides of metals
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- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
- C08K3/34—Silicon-containing compounds
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K5/00—Use of organic ingredients
- C08K5/02—Halogenated hydrocarbons
- C08K5/03—Halogenated hydrocarbons aromatic, e.g. C6H5-CH2-Cl
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K5/00—Use of organic ingredients
- C08K5/04—Oxygen-containing compounds
- C08K5/10—Esters; Ether-esters
- C08K5/11—Esters; Ether-esters of acyclic polycarboxylic acids
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K5/00—Use of organic ingredients
- C08K5/04—Oxygen-containing compounds
- C08K5/10—Esters; Ether-esters
- C08K5/12—Esters; Ether-esters of cyclic polycarboxylic acids
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K5/00—Use of organic ingredients
- C08K5/49—Phosphorus-containing compounds
- C08K5/51—Phosphorus bound to oxygen
- C08K5/52—Phosphorus bound to oxygen only
- C08K5/521—Esters of phosphoric acids, e.g. of H3PO4
- C08K5/523—Esters of phosphoric acids, e.g. of H3PO4 with hydroxyaryl compounds
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L23/00—Compositions of homopolymers or copolymers of unsaturated aliphatic hydrocarbons having only one carbon-to-carbon double bond; Compositions of derivatives of such polymers
- C08L23/02—Compositions of homopolymers or copolymers of unsaturated aliphatic hydrocarbons having only one carbon-to-carbon double bond; Compositions of derivatives of such polymers not modified by chemical after-treatment
- C08L23/04—Homopolymers or copolymers of ethene
- C08L23/08—Copolymers of ethene
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L27/00—Compositions of homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by a halogen; Compositions of derivatives of such polymers
- C08L27/02—Compositions of homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by a halogen; Compositions of derivatives of such polymers not modified by chemical after-treatment
- C08L27/04—Compositions of homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by a halogen; Compositions of derivatives of such polymers not modified by chemical after-treatment containing chlorine atoms
- C08L27/06—Homopolymers or copolymers of vinyl chloride
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L51/00—Compositions of graft polymers in which the grafted component is obtained by reactions only involving carbon-to-carbon unsaturated bonds; Compositions of derivatives of such polymers
- C08L51/06—Compositions of graft polymers in which the grafted component is obtained by reactions only involving carbon-to-carbon unsaturated bonds; Compositions of derivatives of such polymers grafted on to homopolymers or copolymers of aliphatic hydrocarbons containing only one carbon-to-carbon double bond
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L75/00—Compositions of polyureas or polyurethanes; Compositions of derivatives of such polymers
- C08L75/04—Polyurethanes
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R13/00—Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00
- H01R13/46—Bases; Cases
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K2201/00—Specific properties of additives
- C08K2201/014—Additives containing two or more different additives of the same subgroup in C08K
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- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
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- C08L2201/00—Properties
- C08L2201/02—Flame or fire retardant/resistant
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- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L2203/00—Applications
- C08L2203/20—Applications use in electrical or conductive gadgets
- C08L2203/202—Applications use in electrical or conductive gadgets use in electrical wires or wirecoating
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L2205/00—Polymer mixtures characterised by other features
- C08L2205/03—Polymer mixtures characterised by other features containing three or more polymers in a blend
- C08L2205/035—Polymer mixtures characterised by other features containing three or more polymers in a blend containing four or more polymers in a blend
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L2207/00—Properties characterising the ingredient of the composition
- C08L2207/04—Thermoplastic elastomer
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Abstract
The invention relates to a mobile phone data line, and belongs to the technical field of electronics. The mobile phone data line comprises a USB interface, a main line and a connector connected with a mobile phone, and is characterized in that the main line comprises a wire and a sheath coated outside the wire, the sheath is made of a composite material, the composite material comprises the following compositions in parts by weight: 100 parts of polyvinyl chloride, 10-30 parts of thermoplastic polyurethane elastomers 90A, 20-40 parts of ethylene-vinyl acetate copolymer, 5-20 parts of a plasticizer, 10-30 parts of a fire retardant, 1-6 parts of metal chlorate, 5-20 parts of a compatilizer, 1-3 parts of a modifier and 3-10 parts of a processing agent, the USB and the connector are made of a copper alloy, and the copper alloy is 0.06-0.35% of Mn, 0.8-1.5% of Zn, 0.30-0.45% of Ni, 0.12-0.20% of Si, 0.52-0.58% of Sn, 0.18-0.25% of Al and 0.01-0.025% of Ag, and the remaining is Cu. The mobile phone data line is excellent in comprehensive performance.
Description
Technical field
The present invention relates to a kind of data wire, more particularly to a kind of cellular phone data line, belong to technical field of electronic materials.
Background technology
Data wire (data cable), its effect reaches data transfer or logical to connect mobile device and computer
Letter purpose.Popular point says, exactly connects computer and mobile device for transmitting the path instrument of the files such as video, the tinkle of bells, picture.
Now, with the development that electron trade is maked rapid progress, data wire has become part indispensable during we live.It is existing
Cellular phone data line sheath in use on the one hand because not easy heat radiation cause heating produce empyreumatic taste, or even burning, it is another
Aspect often blocks abrasion because of friction or by tables and chairs in use, leads to not use.And the interface of cellular phone data line, joint because
Be use can frequently cause joint, interface friction impaired, and then cause connection to have some setbacks, it is insensitive, influence is used.
The content of the invention
The purpose of the present invention is directed to existing technology and there is above mentioned problem, it is proposed that one kind conducts electricity very well, intensity is high,
The good cellular phone data line of wearability.
The purpose of the present invention can be realized by following technical proposal：A kind of cellular phone data line, including USB interface, main line
And the joint being connected with mobile phone, main line include wire and the sheath being coated on outside wire, described sheath is by composite system
Into, described USB interface and joint is made by copper alloy, described copper alloy is Mn0.06-0.35%, Zn0.8-1.5%,
Ni0.30-0.45%, Si0.12-0.20%, Sn0.52-0.58%, Al0.18-0.25%, Ag0.01-0.025%, surplus
Cu。
Without common elements such as Cr, Ti, Bi in the copper alloy of data in mobile phone line interface of the present invention, by reducing containing for Ni
Amount, improves the content of Si, Sn, and adds appropriate Ag, by the collaboration produced between each element, increases substantially leading for copper alloy
Electrically, the performance such as intensity, stampability, resistance to stress, wear-resisting, makes it particularly suited for the joint in charger for mobile phone.Wherein, Zn exists
For 39.9%, Sn, the solid solubility in Cu is 15.8% to solid solubility in Cu, and Ni can be with Cu infinitely dissolves, and they are formed with copper
Continuous solid solution, with broad monophase field, they can significantly improve the mechanical performance of copper.Sn in existing copper alloy contains
Amount is typically all controlled within 0.5%, but is found by constantly experiment, and containing for Sn has been properly increased in copper alloy of the present invention
Amount, improves to 0.52-0.58%, can more effectively promote crystal grain refinement and increase intensity.Appropriate Mn can improve copper
The intensity of alloy, but because copper-manganese resistance temperature system seldom, due to there is allotropic transformation, makes phase transformation ten under cupromanganese solid-state
Divide complexity, there is the processes such as spinodal decomposition, metacrystal transformation, further the impact resistance of raising copper alloy of the present invention under solid phase.
And Si can be with limited solid solution in copper, the change of solid solubility fierceness with temperature change, after temperature is completed from alloy crystallization
When beginning to decline, their solid solubility in copper also begin to reduce, and are separated out from solid phase with metallic compound or elemental form, when
These element solid solutions can significantly improve its intensity in copper, with solution strengthening effect, when they are separated out from solid phase
When, dispersion-strengthened effect is generated again, conductive and heat conductivility is recovered, and adds Si both to have improved the intensity of copper alloy
And resistance to stress, the conductance of alloy can be improved again.If but cannot play Si's if the present invention is less than 0.1% if the content of Si
Effect, and if Si more than 0.20%, the conductance of alloy can be largely effected on.It is added with copper alloy more of the present invention appropriate
Ag can promote stampability, resistance to stress and the intensity of alloy, especially when alloy is in aged, the above-mentioned copper that with the addition of Ag is closed
Gold can further improve the performance of resistance high temperature stress.Compared with other alloying elements, aluminium can not only increase the mobility of copper water,
Improve the casting character of the alloy material, moreover it is possible to most significantly increase the intensity of copper alloy.Because aluminium normal potential is relative to zinc
It is more negative, thus there is bigger ionization to tend to, combined prior to the oxygen in environment, preferentially form micro- close and hard aluminum oxide
Film, can prevent the further oxidation of alloy, the Al of formation2O3Film plays the role of to block matrix corrosion.Add in the present invention
Aluminium, can make alpha phase zone significantly shift to copper angle.Occur hard and crisp γ phases when aluminium content is high, improve the intensity of alloy and hard
Degree.Its plasticity is greatly lowered simultaneously.But the aluminium element of excess can produce substantial amounts of alumite in copper water liquid level on the contrary, make
Slag inclusion also forms interlayer in follow-up casting copper casting in copper liquid, causes the generation of casting defect.When in copper alloy containing Sn,
When the elements such as Ti, Ni, Bi one work, play to effect maximizings of the Al in copper alloy.
Preferably, the mass ratio of Ni and Si is 2-3 in copper alloy:1.The main work of Ni in copper alloy alloy of the present invention
With to make structure refinement, impact flexibility is improved, particularly coordinate Si to add, the wear-resisting particles of NiSi can be formed, improve the resistance to of material
Polishing machine, while nickel can within the specific limits expand alpha phase zone, increases α Phase Proportions, and wear-resisting particle is played a protective role, and prevents
The phenomenons that only wear-resisting particle largely comes off in friction process, but too high nickel content can cause α phases excessive, cause the machine of material
Tool hydraulic performance decline, therefore nickel and silicon are added in copper alloy alloy of the present invention, and when the content of Ni and Si is than controlling in 2-3：When 1
Both is better.
Preferably, described composite includes following constituent：Polyvinyl chloride：100 parts, thermoplastic polyurethane bullet
Gonosome 90A：10-30 parts, ethylene-vinyl acetate copolymer：20-40 parts, plasticizer：5-20 parts, fire retardant：10-30 parts, metal
Chlorate：1-6 parts, compatilizer：5-20 parts, anti-impact modifier：1-3 parts, processing aid：3-10 parts.
Wearability for the covering material of data wire in the prior art is relatively poor, and high-temperature behavior is poor, anti-flammability compared with
It is low, so influence data wire service life, the present invention selected the present invention added in matrix resin polyvinyl chloride it is appropriate
TPUE 90A, ethylene-vinyl acetate copolymer, while adding plasticizer, fire retardant, compatilizer, shock resistance
The addition of modifying agent, metal chlorination salt etc., especially metal chlorination salt can be with the hydrogen bond action in resin, mainly metal ion
Addition can reduce crystallinity, increase viscosity, make material that there is more preferable toughness, the presence of slaine makes the amorphous area in resin
Formation is rigidly connected, and greatly strengthen the mechanical property of covering material.Covering material hardness is made by the synergy of each component
Moderate, better softness, rebound performance is excellent, and further improves wearability, the anti-flammability of data wire covering material.
Preferably, described plasticizer is halogenation activity compound FR-V6, the just own fat of decanedioic acid two and adjacent benzene two
The mixture of formic acid dioctyl ester, its weight ratio is 3-5:2-3:1.
Preferably, the fire retardant is triphenyl phosphate, TDE, antimony oxide, the compounding of montmorillonite
Thing.
Further, in the fire retardant by mass percentage：Triphenyl phosphate 10%-20%, TDE
38%-50%, antimony oxide 5-8%, balance of montmorillonite.According to aromatic series in the covering material of data wire of the present invention
Fire retardant can cause covering material in combustion in material surface Cheng Shuan, have drip phenomenon, use meeting after montmorillonite
Drip phenomenon is substantially reduced, TDE is used alone can also produce black smoke, can greatly reduce after adding antimony oxide
The generation of black smoke, in combustion, first low-temperature burning when, triphenyl phosphate decompose, the then decomposition of TDE,
Reached close to after 400 DEG C in temperature, antimony oxide, montmorillonite have started fire retardation, therefore, the fire retardant of present invention compounding
Scope is tried out with broader temperature, more preferable fire retardation can be played, and due to being compounded using different materials, not only
Black smoke, drip phenomenon will not be produced during fire-retardant, and with limited oxygen index higher, fire resistance is more preferably.
Further preferably, described metal chlorination salt is the mixture of lithium chloride and gallium chloride.
Further preferably, the lithium chloride and the mass ratio of gallium chloride are 1:2-3.Although lithium chloride is used alone can be increased
The toughness of strong material, but if the internal organizational structure that can destroy in matrix resin of single use lithium chloride, on the contrary can be significantly
The performance of material is reduced, and uses the lithium chloride and gallium chloride lithium ion and potassium ion of the proportioning of present invention offer to act synergistically,
Toughness can be strengthened, the internal structure for not destroying matrix resin is can guarantee that again, cause performance to reduce.
Preferably, described compatilizer is maleic anhydride grafted ethene-acetate ethylene copolymer (EVA-g-MAH), horse
One or two in maleic anhydride grafted ethylene-octene copolymer (POE-g-MAH).To improve between matrix resin and fire retardant
Compatibility, the present invention also need add maleic anhydride stem grafting polyolefin copolymer as compatilizer.Research shows in various nothings
In the composite that machine filler is blended with polyolefin base material, the copolymer of maleic anhydride stem grafting polyolefin is that one kind can be obviously improved
The material of compatibility between the two.
Preferably, described anti-impact modifier is one or more in MBS, CPE, ABS, EVA, ACR, NBR.Enter
Preferably, described anti-impact modifier is CPE, ACR to one step.Loading with impact modifier increases, and impact (breach) is strong
Angle value is incremented by, and CPE, ACR are linear, and overall target preferably, and has critical value, meets the multiple crazing of increasing tougheness theoretical.It is i.e. outer
Under power effect, in having formed the resin of good combination and modifying agent two-phase (or multiphase) interface, resin produces fine crack and ripple
And rubbery state particle, make its compression, stress concentration is produced, a large amount of crazings and shear band are induced, absorb and consumption is most of
Energy；Again because rubber particles are present, crazing can be controlled to develop, prevent it from turning into destructive crackle, toughening effect becomes strong,
System impact strength is improved, more notable to improving the effect of non-notch impact strength.
Preferably, described processing aid includes heat stabilizer, light stabilizer, antioxidant, lubricant, toner.
Compared with prior art, the interface in data wire of the present invention is made of the rational copper alloy of compatibility, by each unit
The synergy produced between element, and casting technique by six stages is made, and further improves its conductance, wearability, power
Learn performance etc.；And the covering material of coated wire is made of the rational composite of compatibility in data wire of the present invention, by
Appropriate TPUE 90A, ethylene-vinyl acetate copolymer is added in matrix resin polyvinyl chloride, while closing
Reason compatibility other compositions, substantially increase the physical and mechanical property of covering material, especially make covering material hardness moderate, soft
Property preferably, rebound performance is excellent, substantially improves wearability, the anti-flammability of data wire covering material.Data wire of the invention is just
It is that the performance of data wire is further improved by the material of especially optimization various pieces, and then it is more suitable for for mobile phone number
According to line, and the cellular phone data line excellent combination property, long service life.
Specific embodiment
The following is specific embodiment of the invention, further is made to technical scheme
Description, but the present invention is not limited to these embodiments.
Table 1：The constituent of the copper alloy of cellular phone data line USB interface and joint in embodiment 1-4
Table 2：The constituent of cellular phone data line sheath composite in embodiment 1-4
Embodiment 1-4
A kind of cellular phone data line, including USB interface, main line and the joint that is connected with mobile phone, main line include wire with bag
Overlay on the sheath outside wire, the composite of described sheath described in the embodiment 1-4 of table 1 is made, described USB interface and
Joint is made by the copper alloy described in the embodiment 1-4 of table 2.
Comparative example 1
Common copper alloy in the prior art.
Comparative example 2
Common commercially available jacket for data lines material in the prior art.
Comparative example 3
The comparative example is differed only in composite in the embodiment 4 of table 2, and metal chlorination is not contained in the comparative example
Salt.
Comparative example 4
The comparative example is differed only in composite in the embodiment 4 of table 2, and the fire retardant in the comparative example is aromatic series
Fire retardant.
Comparative example 5
The comparative example is differed only in composite in the embodiment 4 of table 2, and the resin of the comparative example is single polychlorostyrene second
Alkene, i.e., without TPUE 90A and ethylene-vinyl acetate copolymer.
The copper alloy in the copper alloy in embodiment 1-4 in table 1 and comparative example 1 is carried out into Performance comparision respectively, compares knot
Fruit is as shown in table 3.
Table 3：The performance of the copper alloy in embodiment 1-4 and comparative example 1
The composite in the composite in embodiment 1-4 in table 2 and comparative example 2-5 is passed through into common process work respectively
Skill is made, and cuts water bar and carry out performance test, and test result is as shown in table 4.
Table 4：The performance of the composite of jacket for data lines in embodiment 1-4 and comparative example 2-5
In sum, the interface in data wire of the present invention is made of the rational copper alloy of compatibility, by between each element
The synergy of generation, and casting technique by six stages is made, and further improves its conductance, wearability, mechanical property
Deng；And the covering material of coated wire is made of the rational composite of compatibility in data wire of the present invention, by matrix tree
Appropriate TPUE 90A, ethylene-vinyl acetate copolymer is added in fat polyvinyl chloride, while reasonable compatibility
Other compositions, substantially increase the physical and mechanical property of covering material, especially make covering material hardness moderate, flexibility compared with
Good, rebound performance is excellent, substantially improves wearability, the anti-flammability of data wire covering material.Data wire of the invention exactly leads to
The material for crossing especially optimization various pieces further improves the performance of data wire, and then it is more suitable for for data in mobile phone
Line, and the cellular phone data line excellent combination property, long service life.
Specific embodiment described herein is only to the spiritual explanation for example of the present invention.Technology neck belonging to of the invention
The technical staff in domain can be made various modifications or supplement to described specific embodiment or be replaced using similar mode
Generation, but without departing from spirit of the invention or surmount scope defined in appended claims.
Claims (10)
1. a kind of cellular phone data line, including USB interface, main line and the joint being connected with mobile phone, main line include wire with cladding
Sheath outside wire, it is characterised in that described sheath is made up of composite, described USB interface and joint are by copper
Alloy is made, described copper alloy is Mn0.06-0.35%, Zn0.8-1.5%, Ni0.30-0.45%, Si0.12-0.20%,
Sn0.52-0.58%, Al0.18-0.25%, Ag0.01-0.025%, surplus Cu.
2. cellular phone data line according to claim 1, it is characterised in that the mass ratio of Ni and Si is 2- in the copper alloy
3:1。
3. cellular phone data line according to claim 1, it is characterised in that described composite includes constituting into as follows
Point：Polyvinyl chloride：100 parts, TPUE 90A：10-30 parts, ethylene-vinyl acetate copolymer：20-40 parts,
Plasticizer：5-20 parts, fire retardant：10-30 parts, metal chlorination salt：1-6 parts, compatilizer：5-20 parts, anti-impact modifier：1-3
Part, processing aid：3-10 parts.
4. cellular phone data line according to claim 3, it is characterised in that described plasticizer is halogenation activity chemical combination
The mixture of the just own fat of thing FR-V6, decanedioic acid two and dioctyl phthalate, its weight ratio is 3-5:2-3:1.
5. cellular phone data line according to claim 3, it is characterised in that the fire retardant is triphenyl phosphate, ten bromines two
Vinylbenzene, antimony oxide, the compound of montmorillonite.
6. cellular phone data line according to claim 5, it is characterised in that in the fire retardant by mass percentage：Phosphoric acid
Triphenylmethyl methacrylate 10%-20%, TDE 38%-50%, antimony oxide 5-8%, balance of montmorillonite.
7. cellular phone data line according to claim 3, it is characterised in that described metal chlorination salt is lithium chloride and chlorination
The mixture of gallium.
8. cellular phone data line according to claim 7, it is characterised in that the lithium chloride is 1 with the mass ratio of gallium chloride:
2-3。
9. cellular phone data line according to claim 3, it is characterised in that described compatilizer is that maleic anhydride is grafted second
One kind in alkene-acetate ethylene copolymer (EVA-g-MAH), maleic anhydride grafted ethene-octene copolymer (POE-g-MAH) or
Two kinds.
10. cellular phone data line according to claim 3, it is characterised in that described anti-impact modifier be MBS, CPE,
One or more in ABS, EVA, ACR, NBR.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201611244843.1A CN106711721A (en) | 2016-12-29 | 2016-12-29 | Mobile phone data line |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201611244843.1A CN106711721A (en) | 2016-12-29 | 2016-12-29 | Mobile phone data line |
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| Publication Number | Publication Date |
|---|---|
| CN106711721A true CN106711721A (en) | 2017-05-24 |
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ID=58903916
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201611244843.1A Pending CN106711721A (en) | 2016-12-29 | 2016-12-29 | Mobile phone data line |
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| CN (1) | CN106711721A (en) |
Citations (6)
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| CN86102885A (en) * | 1985-04-26 | 1986-11-19 | 奥林公司 | Multipurpose copper alloy with medium conductivity and high strength and production method thereof |
| JPH09263864A (en) * | 1996-03-26 | 1997-10-07 | Kobe Steel Ltd | Copper alloy excellent in electric-discharge wear resistance |
| CN1310454A (en) * | 2000-01-27 | 2001-08-29 | 日矿金属株式会社 | Copper alloy for electronic material |
| CN1930314A (en) * | 2004-03-12 | 2007-03-14 | 住友金属工业株式会社 | Copper alloy and process for producing the same |
| CN101982495A (en) * | 2010-11-03 | 2011-03-02 | 东莞市昊通电线电缆有限公司 | Preparation process, product and application of new plastic |
| CN204651607U (en) * | 2015-05-06 | 2015-09-16 | 东莞市凯昶德电子科技股份有限公司 | Data cable for fast charging |
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN86102885A (en) * | 1985-04-26 | 1986-11-19 | 奥林公司 | Multipurpose copper alloy with medium conductivity and high strength and production method thereof |
| JPH09263864A (en) * | 1996-03-26 | 1997-10-07 | Kobe Steel Ltd | Copper alloy excellent in electric-discharge wear resistance |
| CN1310454A (en) * | 2000-01-27 | 2001-08-29 | 日矿金属株式会社 | Copper alloy for electronic material |
| CN1930314A (en) * | 2004-03-12 | 2007-03-14 | 住友金属工业株式会社 | Copper alloy and process for producing the same |
| CN101982495A (en) * | 2010-11-03 | 2011-03-02 | 东莞市昊通电线电缆有限公司 | Preparation process, product and application of new plastic |
| CN204651607U (en) * | 2015-05-06 | 2015-09-16 | 东莞市凯昶德电子科技股份有限公司 | Data cable for fast charging |
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Application publication date: 20170524 |
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