CN106711319A - Chip isolating slot of surface acoustic wave filter with CSP (Chip Scale Package) - Google Patents
Chip isolating slot of surface acoustic wave filter with CSP (Chip Scale Package) Download PDFInfo
- Publication number
- CN106711319A CN106711319A CN201611203388.0A CN201611203388A CN106711319A CN 106711319 A CN106711319 A CN 106711319A CN 201611203388 A CN201611203388 A CN 201611203388A CN 106711319 A CN106711319 A CN 106711319A
- Authority
- CN
- China
- Prior art keywords
- chip
- lines
- surface acoustic
- inclines
- acoustic wave
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000010897 surface acoustic wave method Methods 0.000 title abstract description 13
- 230000001154 acute effect Effects 0.000 claims abstract description 4
- 238000002955 isolation Methods 0.000 claims description 20
- 239000000463 material Substances 0.000 abstract description 8
- 239000003822 epoxy resin Substances 0.000 abstract description 5
- 229920000647 polyepoxide Polymers 0.000 abstract description 5
- 230000000694 effects Effects 0.000 abstract description 2
- 230000004888 barrier function Effects 0.000 abstract 1
- 238000005538 encapsulation Methods 0.000 description 10
- 238000010586 diagram Methods 0.000 description 4
- 230000008901 benefit Effects 0.000 description 2
- 230000005540 biological transmission Effects 0.000 description 2
- 238000005516 engineering process Methods 0.000 description 2
- 230000002159 abnormal effect Effects 0.000 description 1
- 230000010358 mechanical oscillation Effects 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 238000000465 moulding Methods 0.000 description 1
- 230000000644 propagated effect Effects 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
- 239000000758 substrate Substances 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N30/00—Piezoelectric or electrostrictive devices
- H10N30/80—Constructional details
- H10N30/88—Mounts; Supports; Enclosures; Casings
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/16—Fillings or auxiliary members in containers or encapsulations, e.g. centering rings
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
- H01L23/31—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape
Landscapes
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Surface Acoustic Wave Elements And Circuit Networks Thereof (AREA)
Abstract
The invention discloses a chip isolating slot of a surface acoustic wave filter with a CSP (Chip Scale Package). The chip isolating slot comprises first inclined lines and second incline lines, which are not parallel to a chip edge of the surface acoustic wave filter, wherein an obtuse angle is formed between each first inclined line and the chip edge of the surface acoustic wave filter; an acute angle is formed between each second inclined line and the chip edge of the surface acoustic wave filter; the first inclined lines and the second inclined lines are staggered in position, and are not arranged in a superposed mode; and on one side close to the chip of the surface acoustic wave filter, the first inclined lines are connected with the second inclined lines. Under a high-temperature condition, most of epoxy resin materials which are likely to flow into the chip originally enter the isolating slot; and as a result of a capillary effect, most of the epoxy resin materials stay in the isolating slot and do no overflow to the surface of the chip, so that surface acoustic waves can be transmitted on the surface of the chip without barriers, and therefore, a performance anomaly phenomenon of the filter is avoided.
Description
Technical field
The present invention relates to the SAW filter of CSP encapsulation, and in particular to a kind of SAW filter of CSP encapsulation
Chip isolation channel.
Background technology
The basic structure of SAW filter is to pass through semiconductor technology shape on the substrate material with piezoelectric property
Into paired comb metal structure is intersected, referred to as interdigital transducer applies electric signal, piezoelectric table on interdigital transducer
Face produces surface acoustic wave, this surface acoustic wave to be propagated in piezoelectric material surface while producing mechanical oscillation.
CSP (Chip Scale Package) is encapsulated, and is the meaning of wafer-level package, the encapsulation of this kind of form, with body
Product small, performance it is good, it is lightweight the advantages of.Fig. 1 is the schematic diagram of the SAW filter chip of CSP encapsulation., CSP molding bags
The epoxide resin material of envelope has an acoustically effective, but as shown in figure 1, has certain probability can be along Fig. 1 under this material at high temperature
In the direction of arrow flow to chip surface, it will have a strong impact on surface acoustic wave transmission on the chip surface.
The content of the invention
In view of the shortcomings of the prior art, the invention discloses a kind of SAW filter chip isolation channel of CSP encapsulation.
Technical scheme is as follows：
A kind of SAW filter chip isolation channel of CSP encapsulation, the isolation channel is arranged at the surface acoustic wave filter
The surrounding of ripple device chip；The isolation channel include be not parallel to SAW filter chip edge the first kind incline lines and
Equations of The Second Kind inclines lines；The first kind inclines lines with SAW filter chip edge into obtuse angle；The Equations of The Second Kind inclines
Oblique line bar is at an acute angle with SAW filter chip edge；The first kind inclines lines and inclines lines position with the Equations of The Second Kind
Put staggeredly and nonoverlapping arrangement；Near the side of SAW filter chip, the first kind inclines lines and described
Equations of The Second Kind inclines lines and is connected.
Its further technical scheme is：The first kind inclines lines and the height of Equations of The Second Kind inclination lines is
1.5~3.5 μm.
Its further technical scheme is：It is 1 that the first kind inclines lines and the width of Equations of The Second Kind inclination lines
~3 μm.
The method have the benefit that：
It is most of to be possible to flow into originally under conditions of high temperature after plus isolation moat structure of the present invention
The epoxide resin material of chip can enter isolation channel, and due to capillary effect, the overwhelming majority of epoxide resin material can be stayed
Without spilling into chip surface in isolation channel so that surface acoustic wave can in the accessible transmission of chip surface, without
Have the abnormal phenomenon of performance of filter.
Brief description of the drawings
Fig. 1 is the schematic diagram of the SAW filter chip of CSP encapsulation.
Fig. 2 is the schematic diagram of the SAW filter chip isolation channel of CSP encapsulation.
Fig. 3 is the partial enlarged drawing of Fig. 2.
Specific embodiment
Fig. 2 is the schematic diagram of the SAW filter chip isolation channel of CSP encapsulation.Fig. 3 is the partial enlarged drawing of Fig. 2.
As shown in Figure 2 and Figure 3, isolation channel is arranged at the surrounding of SAW filter chip.Isolation channel includes being not parallel to surface acoustic wave
The first kind at filter chip edge inclines lines 1 and Equations of The Second Kind inclines lines 2.The first kind inclines lines 1 and Equations of The Second Kind is inclined
Angle type formed by the SAW filter chip edge of lines 2 is opposite.In angle direction as shown in Figure 3, the first kind
Lines 1 and SAW filter chip edge into obtuse angle are inclined, Equations of The Second Kind inclines lines 2 and SAW filter chip side
Edge is at an acute angle.The first kind inclines lines 1 and the direction of Equations of The Second Kind inclination lines 2 is also interchangeable.
The first kind inclines lines 1 and interlocks and nonoverlapping arrangement mutually with Equations of The Second Kind inclination lines 2 position.Near sound table
The side of face wave filter chip, that is, isolation channel inner side, the first kind inclines lines 1 and Equations of The Second Kind and inclines lines 2 and be connected
Connect, in the side away from SAW filter chip, that is, isolation channel interior outside, the first kind inclines lines 1 and second
Class inclines lines 2 and is separated, and is not connected to.
Understood through test of many times, the first kind inclines lines and Equations of The Second Kind inclines the height of lines at 1.5~3.5 μm, wherein
2.5 μm is optimum height.It is 1~3 μm that the first kind inclines lines and the width of Equations of The Second Kind inclination lines, wherein 2 μm is optimal wide
Degree.
Above-described is only the preferred embodiment of the present invention, the invention is not restricted to above example.It is appreciated that this
Other improvement and change that art personnel directly derive or associate without departing from the spirit and concept in the present invention
Change, be considered as being included within protection scope of the present invention.
Claims (3)
1. the SAW filter chip isolation channel that a kind of CSP is encapsulated, it is characterised in that：The isolation channel is arranged at the sound
The surrounding of SAWF chip；The isolation channel includes that the first kind for being not parallel to SAW filter chip edge is inclined
Oblique line bar and Equations of The Second Kind incline lines；The first kind inclines lines with SAW filter chip edge into obtuse angle；It is described
It is at an acute angle with SAW filter chip edge that Equations of The Second Kind inclines lines；The first kind inclines lines and inclines with the Equations of The Second Kind
Oblique lines location interlocks and nonoverlapping arrangement；Near the side of SAW filter chip, the first kind parallax
Bar inclines lines and is connected with the Equations of The Second Kind.
2. the SAW filter chip isolation channel that CSP as claimed in claim 1 is encapsulated, it is characterised in that：Described first
It is 1.5~3.5 μm that class inclines lines and the height of Equations of The Second Kind inclination lines.
3. the SAW filter chip isolation channel that CSP as claimed in claim 1 is encapsulated, it is characterised in that：Described first
It is 1~3 μm that class inclines lines and the width of Equations of The Second Kind inclination lines.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201611203388.0A CN106711319A (en) | 2016-12-23 | 2016-12-23 | Chip isolating slot of surface acoustic wave filter with CSP (Chip Scale Package) |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201611203388.0A CN106711319A (en) | 2016-12-23 | 2016-12-23 | Chip isolating slot of surface acoustic wave filter with CSP (Chip Scale Package) |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN106711319A true CN106711319A (en) | 2017-05-24 |
Family
ID=58903193
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201611203388.0A Pending CN106711319A (en) | 2016-12-23 | 2016-12-23 | Chip isolating slot of surface acoustic wave filter with CSP (Chip Scale Package) |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN106711319A (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109037424A (en) * | 2017-06-08 | 2018-12-18 | 天津威盛电子有限公司 | Wafer-class encapsulation and its manufacturing method |
| CN110957992A (en) * | 2019-10-31 | 2020-04-03 | 厦门市三安集成电路有限公司 | Surface acoustic wave filter packaging structure and manufacturing method thereof |
| CN112532203A (en) * | 2020-12-25 | 2021-03-19 | 中国电子科技集团公司第二十六研究所 | Tin-gold barrier structure of surface acoustic wave device packaged at chip level and processing method thereof |
Citations (10)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1572057A (en) * | 2002-06-03 | 2005-01-26 | 株式会社村田制作所 | Surface acoustic wave device |
| CN1901173A (en) * | 2005-07-18 | 2007-01-24 | 台达电子工业股份有限公司 | Chip package structure |
| US20070222041A1 (en) * | 2006-03-24 | 2007-09-27 | Advanced Semiconductor Engineering, Inc. | Chip package |
| CN201054348Y (en) * | 2007-07-06 | 2008-04-30 | 威宇科技测试封装有限公司 | A chip framework encapsulated chip carrying table |
| CN101221930A (en) * | 2007-01-10 | 2008-07-16 | 日月光半导体制造股份有限公司 | Chip packaging structure and packaging method thereof |
| CN103456697A (en) * | 2012-05-31 | 2013-12-18 | 台湾积体电路制造股份有限公司 | Isolation rings for packages and the method of forming the same |
| CN103985645A (en) * | 2014-05-27 | 2014-08-13 | 无锡必创传感科技有限公司 | Semiconductor packaging piece and manufacturing method thereof |
| CN203932043U (en) * | 2014-05-30 | 2014-11-05 | 四川立泰电子有限公司 | A kind of power device of paster encapsulation |
| CN205647459U (en) * | 2016-05-10 | 2016-10-12 | 江苏长电科技股份有限公司 | Surface acoustic wave filter chips's packaging structure |
| CN206312939U (en) * | 2016-12-23 | 2017-07-07 | 无锡市好达电子有限公司 | The SAW filter chip isolation channel of CSP encapsulation |
-
2016
- 2016-12-23 CN CN201611203388.0A patent/CN106711319A/en active Pending
Patent Citations (10)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1572057A (en) * | 2002-06-03 | 2005-01-26 | 株式会社村田制作所 | Surface acoustic wave device |
| CN1901173A (en) * | 2005-07-18 | 2007-01-24 | 台达电子工业股份有限公司 | Chip package structure |
| US20070222041A1 (en) * | 2006-03-24 | 2007-09-27 | Advanced Semiconductor Engineering, Inc. | Chip package |
| CN101221930A (en) * | 2007-01-10 | 2008-07-16 | 日月光半导体制造股份有限公司 | Chip packaging structure and packaging method thereof |
| CN201054348Y (en) * | 2007-07-06 | 2008-04-30 | 威宇科技测试封装有限公司 | A chip framework encapsulated chip carrying table |
| CN103456697A (en) * | 2012-05-31 | 2013-12-18 | 台湾积体电路制造股份有限公司 | Isolation rings for packages and the method of forming the same |
| CN103985645A (en) * | 2014-05-27 | 2014-08-13 | 无锡必创传感科技有限公司 | Semiconductor packaging piece and manufacturing method thereof |
| CN203932043U (en) * | 2014-05-30 | 2014-11-05 | 四川立泰电子有限公司 | A kind of power device of paster encapsulation |
| CN205647459U (en) * | 2016-05-10 | 2016-10-12 | 江苏长电科技股份有限公司 | Surface acoustic wave filter chips's packaging structure |
| CN206312939U (en) * | 2016-12-23 | 2017-07-07 | 无锡市好达电子有限公司 | The SAW filter chip isolation channel of CSP encapsulation |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109037424A (en) * | 2017-06-08 | 2018-12-18 | 天津威盛电子有限公司 | Wafer-class encapsulation and its manufacturing method |
| CN110957992A (en) * | 2019-10-31 | 2020-04-03 | 厦门市三安集成电路有限公司 | Surface acoustic wave filter packaging structure and manufacturing method thereof |
| CN110957992B (en) * | 2019-10-31 | 2022-08-16 | 厦门市三安集成电路有限公司 | Surface acoustic wave filter packaging structure and manufacturing method thereof |
| CN112532203A (en) * | 2020-12-25 | 2021-03-19 | 中国电子科技集团公司第二十六研究所 | Tin-gold barrier structure of surface acoustic wave device packaged at chip level and processing method thereof |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| RJ01 | Rejection of invention patent application after publication | ||
| RJ01 | Rejection of invention patent application after publication |
Application publication date: 20170524 |