CN106711313B - A kind of packaging method of flourescent sheet and a kind of LED packaging - Google Patents
A kind of packaging method of flourescent sheet and a kind of LED packaging Download PDFInfo
- Publication number
- CN106711313B CN106711313B CN201611245949.3A CN201611245949A CN106711313B CN 106711313 B CN106711313 B CN 106711313B CN 201611245949 A CN201611245949 A CN 201611245949A CN 106711313 B CN106711313 B CN 106711313B
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- CN
- China
- Prior art keywords
- flourescent sheet
- led chip
- packaging method
- substrate
- led
- Prior art date
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Links
- 238000004806 packaging method and process Methods 0.000 title claims abstract description 25
- 238000000034 method Methods 0.000 title claims abstract description 22
- 239000000758 substrate Substances 0.000 claims abstract description 24
- 239000011521 glass Substances 0.000 claims description 7
- 239000000919 ceramic Substances 0.000 claims description 5
- 238000010438 heat treatment Methods 0.000 claims description 4
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 claims description 3
- 229910052710 silicon Inorganic materials 0.000 claims description 3
- 239000010703 silicon Substances 0.000 claims description 3
- HBMJWWWQQXIZIP-UHFFFAOYSA-N silicon carbide Chemical compound [Si+]#[C-] HBMJWWWQQXIZIP-UHFFFAOYSA-N 0.000 claims description 3
- 229910010271 silicon carbide Inorganic materials 0.000 claims description 3
- 238000005266 casting Methods 0.000 claims 1
- 239000004575 stone Substances 0.000 claims 1
- 239000003292 glue Substances 0.000 abstract description 6
- 238000002845 discoloration Methods 0.000 abstract description 2
- OAICVXFJPJFONN-UHFFFAOYSA-N Phosphorus Chemical compound [P] OAICVXFJPJFONN-UHFFFAOYSA-N 0.000 abstract 2
- 238000005336 cracking Methods 0.000 abstract 1
- 239000000463 material Substances 0.000 description 5
- 239000000853 adhesive Substances 0.000 description 4
- 230000001070 adhesive effect Effects 0.000 description 4
- 229910001413 alkali metal ion Inorganic materials 0.000 description 4
- 238000005538 encapsulation Methods 0.000 description 4
- 230000005686 electrostatic field Effects 0.000 description 3
- 239000000499 gel Substances 0.000 description 3
- 239000000843 powder Substances 0.000 description 3
- 230000005855 radiation Effects 0.000 description 3
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- 238000005286 illumination Methods 0.000 description 2
- 229910052594 sapphire Inorganic materials 0.000 description 2
- 239000010980 sapphire Substances 0.000 description 2
- 239000000741 silica gel Substances 0.000 description 2
- 229910002027 silica gel Inorganic materials 0.000 description 2
- 206010020843 Hyperthermia Diseases 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 239000011248 coating agent Substances 0.000 description 1
- 238000000576 coating method Methods 0.000 description 1
- 230000005684 electric field Effects 0.000 description 1
- 230000005284 excitation Effects 0.000 description 1
- 208000021760 high fever Diseases 0.000 description 1
- 230000036031 hyperthermia Effects 0.000 description 1
- 229910010272 inorganic material Inorganic materials 0.000 description 1
- 239000011147 inorganic material Substances 0.000 description 1
- 150000002500 ions Chemical class 0.000 description 1
- 230000000704 physical effect Effects 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
- H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
- H10H20/80—Constructional details
- H10H20/85—Packages
- H10H20/851—Wavelength conversion means
- H10H20/8514—Wavelength conversion means characterised by their shape, e.g. plate or foil
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
- H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
- H10H20/01—Manufacture or treatment
- H10H20/036—Manufacture or treatment of packages
- H10H20/0361—Manufacture or treatment of packages of wavelength conversion means
Landscapes
- Led Device Packages (AREA)
Abstract
本发明公开了一种荧光片的封装方法及一种LED封装器件，封装方法是利用电压产生静电力将荧光片和LED芯片的衬底无介质地直接牢固贴合在一起，贴合紧密牢固，不会掉落，且因为荧光片和LED芯片之间不存在常规的有机胶，也避免了因为有机胶变色、胶裂而产生的问题，将牢固贴合的荧光片和LED芯片倒装在基板上，即可得到LED封装结构。
The invention discloses a packaging method for a fluorescent sheet and an LED packaging device. The packaging method uses a voltage to generate electrostatic force to directly and firmly bond the fluorescent sheet and the substrate of the LED chip together without a medium, and the bonding is tight and firm. It will not fall, and because there is no conventional organic glue between the phosphor sheet and the LED chip, it also avoids the problems caused by the discoloration and glue cracking of the organic glue, and the firmly attached phosphor sheet and the LED chip are flip-chipped on the substrate , the LED package structure can be obtained.
Description
Technical field
The present invention relates to lighting technical fields, and in particular to a kind of packaging method of flourescent sheet and a kind of LED packaging.
Background technique
In LED high-end applications, for example, automobile front, daytime running lamps, projector, stage lighting etc., the function of LED chip
Rate density and heat flow density are very high, and the requirement to chip perimeter material is also very high, it is necessary to can bear high fever and height for a long time
Energy radiation changes without physical property.Current commercialized white light LEDs, the excitation of producing method, mainly blue chip are glimmering
Light powder, and before fluorescent powder coating, need the Organic adhesives such as elder generation and silica gel to mix, the Organic adhesives such as silica gel are high for a long time
Under temperature radiation and low band illumination, easy discoloration, glue are split etc., it in turn results in the photochromic of LED component and changes, or even is dead
Lamp.It, generally can be preforming by the inorganic material such as fluorescent powder and glass, ceramics to avoid these problems in above-mentioned high-end applications
Together, it is made into glass flourescent sheet or ceramic fluorescent piece, flourescent sheet is then bonded in LED chip surface.How by fluorescence
Piece is encapsulated in LED chip, currently, only a kind of packaged type, i.e., be bonded in LED chip for flourescent sheet using Organic adhesive
On, because still having used Organic adhesive, however it remains under long-time hyperthermia radiation and low band illumination, organic gel becomes
The problem of color, glue are split.
Summary of the invention
Technical problem to be solved by the invention is to provide a kind of packaging method of flourescent sheet and a kind of LED packagings.
The technical solution used in the present invention is:
A kind of packaging method of flourescent sheet, including the use of voltage generate electrostatic force by flourescent sheet and the substrate of LED chip without
Medium directly secure fit together the step of.
In some preferred embodiments, described to be fitted closely the substrate of flourescent sheet and LED chip using electrostatic force
Specific steps together include:
S1: LED chip is upside down on a conductive carrier, flourescent sheet is placed in LED chip, one is placed on flourescent sheet
Conducting pad；
S2: the conductive carrier is connected with positive pole, and the conducting pad is connected with power cathode, is powered one section
Time；
S3: removing the conductive carrier and the conducting pad, obtains the flourescent sheet and LED chip of secure fit.
In the preferred embodiment of above scheme, galvanization described in the S2 is to realize in a heated condition
's.
In the further preferred embodiment of above scheme, galvanization described in the S2 is at 200-800 DEG C
Under conditions of realize.
In the preferred embodiment of above scheme, the substrate of the LED chip is Sapphire Substrate, silicon carbide lining
Any one of bottom, silicon substrate.
In the preferred embodiment of above scheme, voltage >=200V of the power supply.
In the preferred embodiment of above scheme, conduction time is≤5 minutes.
In the preferred embodiment of above scheme, the flourescent sheet is glass flourescent sheet or ceramic fluorescent piece.
The present invention also provides a kind of LED packagings, including substrate, further include the packaging method of flourescent sheet as described above
The flourescent sheet and LED chip for the secure fit being prepared, the LED chip upside-down mounting is on the substrate.
The beneficial effects of the present invention are:
The present invention provides a kind of packaging method of flourescent sheet and a kind of LED packagings, generate electrostatic force using voltage
By flourescent sheet together with the substrate of LED chip without medium direct secure fit, it is bonded close and firm, is not fallen out, and because
There is no conventional organic gel between flourescent sheet and LED chip, also avoid because organic gel changes colour, glue is split and what is generated asks
Topic, the flourescent sheet of secure fit and LED chip are inverted on substrate, LED encapsulation structure can be obtained.
Detailed description of the invention
Fig. 1 is the encapsulation process schematic diagram of embodiment 1.
Fig. 2 is the encapsulation process schematic diagram of embodiment 2.
Specific embodiment
Embodiment 1:
Referring to Fig.1, LED chip 1 is upside down on a conductive carrier 2, flourescent sheet 3 is placed in LED chip 1, in fluorescence
A conducting pad 4 is placed on piece 3；The conductive carrier 2 is connected with positive pole, by the conducting pad 4 and power cathode
It is connected, the voltage of power supply is 200V, is powered 1 minute, conduction time can also be appropriately extended, but no more than 5 minutes, not damage
LED chip；The conductive carrier 2 and the conducting pad 4 are removed, the flourescent sheet 3 and LED chip 1 of secure fit are obtained.
The flourescent sheet 3 is glass flourescent sheet, contains alkali metal ion, such as Na in glass substrate material+、K+Deng in high temperature and dispatch from foreign news agency
When field action, float to negative electrode, close to LED chip 1 side, formed alkali metal ion exhaust and containing only O2-Ion is born
Charge area, with O2-It is corresponding, image charge is generated on 1 surface of LED chip contacted, generates the electrostatic gradually increased
, last inside and outside potential reaches balance, disconnects extrinsic current.Charge O on flourescent sheet 32-With the mirror image of 1 Surface Creation of LED chip
Charge forms very strong electrostatic field, generates powerful electrostatic force.Electrostatic force generates flourescent sheet 3 and the contact surface of LED chip 1 all
Micro-strain makes the fitting of the surface of the two gradually tightly, forms seal interface, flourescent sheet 3 and LED chip 1 are bonded securely
Together.The flourescent sheet 3 of secure fit and LED chip 1 are inverted on substrate, LED encapsulation structure can be obtained.
Embodiment 2:
Referring to Fig. 2, LED chip 1 is upside down on a conductive carrier 2, flourescent sheet 3 is placed in LED chip 1, in fluorescence
A conducting pad 4 is placed on piece 3；The above-mentioned material being well placed is put into heating container 5, adjusting heating 5 temperature of container is 500
DEG C, otherwise temperature can damage LED chip 1 not above 800 DEG C, the conductive carrier 2 is connected with positive pole, will be described
Conducting pad 4 is connected with power cathode, and the voltage of power supply is 200V, is powered half a minute；It removes the conductive carrier 2 and described leads
Voltage part 4 obtains the flourescent sheet 3 and LED chip 1 of secure fit.The flourescent sheet 3 is ceramic fluorescent piece, substrate of glass material
Contain alkali metal ion, such as Na in material+、K+Deng in high temperature and External Electrical Field, negative electrode being floated to, close to LED chip 1
Side, formed alkali metal ion exhaust and containing only O2-The negative electrical charge region of ion, with O2-It is corresponding, in the LED contacted
Chip generates image charge on 1 surface, generates the electrostatic field gradually increased, and last inside and outside potential reaches balance, disconnects extrinsic current.
Charge O on flourescent sheet 32-Very strong electrostatic field is formed with the image charge of 1 Surface Creation of LED chip, generates powerful electrostatic
Power.Electrostatic force makes flourescent sheet 3 and the contact surface of LED chip 1 all generate micro-strain, makes the patch of the surface of the two gradually tightly
It closes, forms seal interface, flourescent sheet 3 and LED chip 1 fit together securely.The substrate of the LED chip 1 is to contain Si
Sill, such as any one of Sapphire Substrate, silicon carbide substrates, silicon substrate, under high temperature environment, O2-With 1 surface of LED chip
Si chemically react, generate firm chemical bond, can further reinforce the fitting of flourescent sheet 3 and LED chip 1.Entirely
Bonding process is completed in moment, and on-load voltage and temperature be not it is very high, to too macrolesion will not be caused to LED chip 1.
Embodiment 3:
The present embodiment is substantially the same manner as Example 2, the difference is that, temperature is 200 DEG C in the heating container 5, is led to
The electric time is 10 seconds.
Claims (8)
1. a kind of packaging method of flourescent sheet, which is characterized in that generate electrostatic force for flourescent sheet and LED chip including the use of voltage
Substrate without medium directly secure fit together the step of, specific steps include:
S1: LED chip being upside down on a conductive carrier, flourescent sheet is placed in LED chip, and it is conductive that one is placed on flourescent sheet
Casting die；
S2: the conductive carrier is connected with positive pole, and the conducting pad is connected with power cathode, be powered one section when
Between；
S3: removing the conductive carrier and the conducting pad, obtains the flourescent sheet and LED chip of secure fit.
2. the packaging method of flourescent sheet according to claim 1, which is characterized in that galvanization described in the S2 be
It is realized under heating condition.
3. the packaging method of flourescent sheet according to claim 2, which is characterized in that galvanization described in the S2 be
It is realized under conditions of 200-800 DEG C.
4. the packaging method of flourescent sheet according to claim 1, which is characterized in that the substrate of the LED chip is blue precious
Any one of stone lining bottom, silicon carbide substrates, silicon substrate.
5. the packaging method of flourescent sheet according to claim 1, which is characterized in that voltage >=200V of the power supply.
6. the packaging method of flourescent sheet according to claim 1, which is characterized in that conduction time is≤5 minutes.
7. the packaging method of flourescent sheet according to claim 1, which is characterized in that the flourescent sheet be glass flourescent sheet or
Ceramic fluorescent piece.
8. a kind of LED packaging, including substrate, which is characterized in that further include by any one of the claim 1-7 flourescent sheet
The packaging method flourescent sheet and LED chip of the secure fit that are prepared, the LED chip upside-down mounting is on the substrate.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201611245949.3A CN106711313B (en) | 2016-12-29 | 2016-12-29 | A kind of packaging method of flourescent sheet and a kind of LED packaging |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201611245949.3A CN106711313B (en) | 2016-12-29 | 2016-12-29 | A kind of packaging method of flourescent sheet and a kind of LED packaging |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN106711313A CN106711313A (en) | 2017-05-24 |
| CN106711313B true CN106711313B (en) | 2019-05-14 |
Family
ID=58903900
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201611245949.3A Active CN106711313B (en) | 2016-12-29 | 2016-12-29 | A kind of packaging method of flourescent sheet and a kind of LED packaging |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN106711313B (en) |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103022322A (en) * | 2011-09-26 | 2013-04-03 | 东芝照明技术株式会社 | Manufacturing method of light-emitting device |
| CN105140376A (en) * | 2011-06-27 | 2015-12-09 | 深圳市绎立锐光科技开发有限公司 | Phosphor layer, device, corresponding light source and projection system, and corresponding manufacturing method |
Family Cites Families (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TWI608760B (en) * | 2008-11-13 | 2017-12-11 | 行家光電有限公司 | Method for forming phosphor powder conversion light-emitting element |
-
2016
- 2016-12-29 CN CN201611245949.3A patent/CN106711313B/en active Active
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105140376A (en) * | 2011-06-27 | 2015-12-09 | 深圳市绎立锐光科技开发有限公司 | Phosphor layer, device, corresponding light source and projection system, and corresponding manufacturing method |
| CN103022322A (en) * | 2011-09-26 | 2013-04-03 | 东芝照明技术株式会社 | Manufacturing method of light-emitting device |
Also Published As
| Publication number | Publication date |
|---|---|
| CN106711313A (en) | 2017-05-24 |
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| SE01 | Entry into force of request for substantive examination | ||
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| GR01 | Patent grant | ||
| PE01 | Entry into force of the registration of the contract for pledge of patent right | ||
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Denomination of invention: A packaging method of fluorescent sheet and an LED packaging device Effective date of registration: 20211206 Granted publication date: 20190514 Pledgee: China Merchants Bank Co.,Ltd. Jinhua Yiwu sub branch Pledgor: Shenzhen Refond Optoelectronics Co.,Ltd. Registration number: Y2021330002449 |
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| PC01 | Cancellation of the registration of the contract for pledge of patent right | ||
| PC01 | Cancellation of the registration of the contract for pledge of patent right |
Date of cancellation: 20230807 Granted publication date: 20190514 Pledgee: China Merchants Bank Co.,Ltd. Jinhua Yiwu sub branch Pledgor: Shenzhen Refond Optoelectronics Co.,Ltd. Registration number: Y2021330002449 |