CN106700436A - High-plasticity heat-conducting composite material and preparation method thereof - Google Patents
High-plasticity heat-conducting composite material and preparation method thereof Download PDFInfo
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- CN106700436A CN106700436A CN201611106909.0A CN201611106909A CN106700436A CN 106700436 A CN106700436 A CN 106700436A CN 201611106909 A CN201611106909 A CN 201611106909A CN 106700436 A CN106700436 A CN 106700436A
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- 239000002131 composite material Substances 0.000 title claims abstract description 36
- 238000002360 preparation method Methods 0.000 title claims description 14
- 239000000945 filler Substances 0.000 claims abstract description 43
- 239000007822 coupling agent Substances 0.000 claims abstract description 29
- 239000002994 raw material Substances 0.000 claims abstract description 29
- -1 polybutylene terephthalate Polymers 0.000 claims abstract description 21
- 239000003963 antioxidant agent Substances 0.000 claims abstract description 18
- 230000003078 antioxidant effect Effects 0.000 claims abstract description 18
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 claims abstract description 16
- KUAUJXBLDYVELT-UHFFFAOYSA-N 2-[[2,2-dimethyl-3-(oxiran-2-ylmethoxy)propoxy]methyl]oxirane Chemical compound C1OC1COCC(C)(C)COCC1CO1 KUAUJXBLDYVELT-UHFFFAOYSA-N 0.000 claims abstract description 15
- 229910002804 graphite Inorganic materials 0.000 claims abstract description 14
- 239000010439 graphite Substances 0.000 claims abstract description 14
- 229920002037 poly(vinyl butyral) polymer Polymers 0.000 claims abstract description 11
- 229920001577 copolymer Polymers 0.000 claims abstract description 10
- 229920001897 terpolymer Polymers 0.000 claims abstract description 10
- 229920001479 Hydroxyethyl methyl cellulose Polymers 0.000 claims abstract description 8
- 229920001707 polybutylene terephthalate Polymers 0.000 claims abstract description 7
- XQSFXFQDJCDXDT-UHFFFAOYSA-N hydroxysilicon Chemical compound [Si]O XQSFXFQDJCDXDT-UHFFFAOYSA-N 0.000 claims description 15
- 239000003921 oil Substances 0.000 claims description 15
- 150000001875 compounds Chemical class 0.000 claims description 14
- 229920005989 resin Polymers 0.000 claims description 14
- 239000011347 resin Substances 0.000 claims description 14
- XBDQKXXYIPTUBI-UHFFFAOYSA-N dimethylselenoniopropionate Natural products CCC(O)=O XBDQKXXYIPTUBI-UHFFFAOYSA-N 0.000 claims description 10
- KUCOHFSKRZZVRO-UHFFFAOYSA-N terephthalaldehyde Chemical compound O=CC1=CC=C(C=O)C=C1 KUCOHFSKRZZVRO-UHFFFAOYSA-N 0.000 claims description 8
- 238000002156 mixing Methods 0.000 claims description 7
- GLDOVTGHNKAZLK-UHFFFAOYSA-N n-octadecyl alcohol Natural products CCCCCCCCCCCCCCCCCCO GLDOVTGHNKAZLK-UHFFFAOYSA-N 0.000 claims description 6
- 235000019260 propionic acid Nutrition 0.000 claims description 5
- IUVKMZGDUIUOCP-BTNSXGMBSA-N quinbolone Chemical compound O([C@H]1CC[C@H]2[C@H]3[C@@H]([C@]4(C=CC(=O)C=C4CC3)C)CC[C@@]21C)C1=CCCC1 IUVKMZGDUIUOCP-BTNSXGMBSA-N 0.000 claims description 5
- RTAQQCXQSZGOHL-UHFFFAOYSA-N Titanium Chemical compound [Ti] RTAQQCXQSZGOHL-UHFFFAOYSA-N 0.000 claims description 4
- 125000004423 acyloxy group Chemical group 0.000 claims description 4
- 125000001449 isopropyl group Chemical group [H]C([H])([H])C([H])(*)C([H])([H])[H] 0.000 claims description 4
- APSBXTVYXVQYAB-UHFFFAOYSA-M sodium docusate Chemical group [Na+].CCCCC(CC)COC(=O)CC(S([O-])(=O)=O)C(=O)OCC(CC)CCCC APSBXTVYXVQYAB-UHFFFAOYSA-M 0.000 claims description 4
- JZODKRWQWUWGCD-UHFFFAOYSA-N 2,5-di-tert-butylbenzene-1,4-diol Chemical class CC(C)(C)C1=CC(O)=C(C(C)(C)C)C=C1O JZODKRWQWUWGCD-UHFFFAOYSA-N 0.000 claims description 3
- KUDUQBURMYMBIJ-UHFFFAOYSA-N 2-prop-2-enoyloxyethyl prop-2-enoate Chemical compound C=CC(=O)OCCOC(=O)C=C KUDUQBURMYMBIJ-UHFFFAOYSA-N 0.000 claims description 2
- 229920002678 cellulose Polymers 0.000 claims description 2
- 239000001913 cellulose Substances 0.000 claims description 2
- LFQSCWFLJHTTHZ-UHFFFAOYSA-N Ethanol Chemical compound CCO LFQSCWFLJHTTHZ-UHFFFAOYSA-N 0.000 claims 1
- 150000001336 alkenes Chemical class 0.000 claims 1
- GYZLOYUZLJXAJU-UHFFFAOYSA-N diglycidyl ether Chemical compound C1OC1COCC1CO1 GYZLOYUZLJXAJU-UHFFFAOYSA-N 0.000 claims 1
- 239000008187 granular material Substances 0.000 claims 1
- RPQRDASANLAFCM-UHFFFAOYSA-N oxiran-2-ylmethyl prop-2-enoate Chemical compound C=CC(=O)OCC1CO1 RPQRDASANLAFCM-UHFFFAOYSA-N 0.000 claims 1
- 229910052710 silicon Inorganic materials 0.000 claims 1
- 239000010703 silicon Substances 0.000 claims 1
- 239000002041 carbon nanotube Substances 0.000 abstract 1
- 229910021393 carbon nanotube Inorganic materials 0.000 abstract 1
- 230000002349 favourable effect Effects 0.000 abstract 1
- 125000002887 hydroxy group Chemical group [H]O* 0.000 abstract 1
- 229920002545 silicone oil Polymers 0.000 abstract 1
- 239000000463 material Substances 0.000 description 19
- 238000001125 extrusion Methods 0.000 description 7
- 239000011231 conductive filler Substances 0.000 description 6
- 150000002148 esters Chemical class 0.000 description 6
- 238000005469 granulation Methods 0.000 description 6
- 230000003179 granulation Effects 0.000 description 6
- 238000002844 melting Methods 0.000 description 6
- 230000008018 melting Effects 0.000 description 6
- NIXOWILDQLNWCW-UHFFFAOYSA-N 2-Propenoic acid Natural products OC(=O)C=C NIXOWILDQLNWCW-UHFFFAOYSA-N 0.000 description 5
- 230000000052 comparative effect Effects 0.000 description 5
- BPSIOYPQMFLKFR-UHFFFAOYSA-N trimethoxy-[3-(oxiran-2-ylmethoxy)propyl]silane Chemical group CO[Si](OC)(OC)CCCOCC1CO1 BPSIOYPQMFLKFR-UHFFFAOYSA-N 0.000 description 5
- 125000001997 phenyl group Chemical group [H]C1=C([H])C([H])=C(*)C([H])=C1[H] 0.000 description 4
- UHOVQNZJYSORNB-UHFFFAOYSA-N Benzene Chemical compound C1=CC=CC=C1 UHOVQNZJYSORNB-UHFFFAOYSA-N 0.000 description 3
- 239000011230 binding agent Substances 0.000 description 3
- 238000009833 condensation Methods 0.000 description 3
- 230000005494 condensation Effects 0.000 description 3
- 238000005260 corrosion Methods 0.000 description 2
- 230000007797 corrosion Effects 0.000 description 2
- 238000011049 filling Methods 0.000 description 2
- 238000004898 kneading Methods 0.000 description 2
- 239000000203 mixture Substances 0.000 description 2
- OYUMYJKDVNCXAX-UHFFFAOYSA-N 2-(3,5-ditert-butyl-2-hydroxyphenyl)propanoic acid Chemical compound OC(=O)C(C)C1=CC(C(C)(C)C)=CC(C(C)(C)C)=C1O OYUMYJKDVNCXAX-UHFFFAOYSA-N 0.000 description 1
- ZTQSAGDEMFDKMZ-UHFFFAOYSA-N Butyraldehyde Chemical compound CCCC=O ZTQSAGDEMFDKMZ-UHFFFAOYSA-N 0.000 description 1
- VGGSQFUCUMXWEO-UHFFFAOYSA-N Ethene Chemical compound C=C VGGSQFUCUMXWEO-UHFFFAOYSA-N 0.000 description 1
- 239000005977 Ethylene Substances 0.000 description 1
- AFCARXCZXQIEQB-UHFFFAOYSA-N N-[3-oxo-3-(2,4,6,7-tetrahydrotriazolo[4,5-c]pyridin-5-yl)propyl]-2-[[3-(trifluoromethoxy)phenyl]methylamino]pyrimidine-5-carboxamide Chemical compound O=C(CCNC(=O)C=1C=NC(=NC=1)NCC1=CC(=CC=C1)OC(F)(F)F)N1CC2=C(CC1)NN=N2 AFCARXCZXQIEQB-UHFFFAOYSA-N 0.000 description 1
- ISWSIDIOOBJBQZ-UHFFFAOYSA-N Phenol Chemical compound OC1=CC=CC=C1 ISWSIDIOOBJBQZ-UHFFFAOYSA-N 0.000 description 1
- 239000004372 Polyvinyl alcohol Substances 0.000 description 1
- 230000002929 anti-fatigue Effects 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 229910052799 carbon Inorganic materials 0.000 description 1
- 238000003486 chemical etching Methods 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 230000007123 defense Effects 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 238000009413 insulation Methods 0.000 description 1
- 229920002521 macromolecule Polymers 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 229910052751 metal Inorganic materials 0.000 description 1
- 239000007769 metal material Substances 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 239000002071 nanotube Substances 0.000 description 1
- 239000000615 nonconductor Substances 0.000 description 1
- 238000011056 performance test Methods 0.000 description 1
- 229920002451 polyvinyl alcohol Polymers 0.000 description 1
- 125000000999 tert-butyl group Chemical group [H]C([H])([H])C(*)(C([H])([H])[H])C([H])([H])[H] 0.000 description 1
- 230000009466 transformation Effects 0.000 description 1
Classifications
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L67/00—Compositions of polyesters obtained by reactions forming a carboxylic ester link in the main chain; Compositions of derivatives of such polymers
- C08L67/02—Polyesters derived from dicarboxylic acids and dihydroxy compounds
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
- C09K5/00—Heat-transfer, heat-exchange or heat-storage materials, e.g. refrigerants; Materials for the production of heat or cold by chemical reactions other than by combustion
- C09K5/08—Materials not undergoing a change of physical state when used
- C09K5/14—Solid materials, e.g. powdery or granular
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K2201/00—Specific properties of additives
- C08K2201/011—Nanostructured additives
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K2201/00—Specific properties of additives
- C08K2201/014—Additives containing two or more different additives of the same subgroup in C08K
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L2205/00—Polymer mixtures characterised by other features
- C08L2205/03—Polymer mixtures characterised by other features containing three or more polymers in a blend
- C08L2205/035—Polymer mixtures characterised by other features containing three or more polymers in a blend containing four or more polymers in a blend
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- Chemical & Material Sciences (AREA)
- Organic Chemistry (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Polymers & Plastics (AREA)
- Health & Medical Sciences (AREA)
- Medicinal Chemistry (AREA)
- Combustion & Propulsion (AREA)
- Thermal Sciences (AREA)
- Materials Engineering (AREA)
- Compositions Of Macromolecular Compounds (AREA)
- Adhesives Or Adhesive Processes (AREA)
Abstract
The invention relates to a high-plasticity heat-conducting composite material which is prepared from the following raw materials in parts by weight: 100 parts of polybutylene terephthalate, 10-20 parts of polyvinyl butyral, 45-75 parts of heat-conducting filler and 10-30 parts of modified filler. The heat-conducting filler is composed of expanded graphite and carbon nanotubes in a mass ratio of (1-3):1. The modified filler comprises the following raw materials in parts by weight: 1-3 parts of neopentyl glycol diglycidyl ether, 2-6 parts of methyl hydroxyethyl cellulose, 1-4 parts of ethylene-acrylate-glycidyl methacrylate terpolymer, 2-7 parts of ethylene-octylene copolymer, 0.5-1 part of hydroxy silicone oil, 3-8 parts of coupling agent and 0.5-1 part of antioxidant. The heat-conducting composite material has favorable heat conductivity and plasticity.
Description
Technical field
The present invention relates to Heat Conduction Material technical field, and in particular to a kind of heat-conductive composite material of high plasticity and its preparation
Method.
Background technology
Heat Conduction Material suffers from extensive use in national defense industry and national economy every field, such as heat exchange engineering, heating work
Journey, Electronics and Information Engineering etc..And traditional Heat Conduction Material is generally metal material or metallic composite, such as Cu, Al and
Its composite etc., this kind of Heat Conduction Material has excellent heat conductivility.But due to metal group material corrosion resistance, insulation
Property and plasticity it is poor, processing and forming is difficult, and quality is larger, limits its application on heat conduction field.Macromolecule material
Material is all used widely in all trades and professions, and there is resistant to chemical etching, easy-formation to process for it, anti-fatigue performance is excellent, insulating properties
Good the features such as, but because macromolecular material is generally the non-conductor of heat, thermal conductivity is low as limiting it in Heat Conduction Material field
The main cause of application.
The content of the invention
In view of the shortcomings of the prior art, the invention provides the good heat-conductive composite material of a kind of corrosion resistance and plasticity and
Its preparation method.
The present invention solve the technical scheme that uses of above-mentioned technical problem for：A kind of heat-conductive composite material of high plasticity, bag
Include the raw material of following parts by weight：100 parts of polybutylene terephthalate (PBT), 10 ~ 20 parts of polyvinyl butyral resin, conductive filler
Material 45 ~ 75 parts, 10 ~ 30 parts of modified filler；
Described thermal conductivity filler is expanded graphite and CNT, and its mass parts ratio is 1 ~ 3:1；
Described modified filler includes the raw material of following parts by weight：1 ~ 3 part of neopentylglycol diglycidyl ether, dimethyl hydroxyethyl
2 ~ 6 parts of cellulose, ethylene-acrylate -1 ~ 4 part of GMA terpolymer, ethylene-octene copolymer
2 ~ 7 parts, 0.5 ~ 1 part of hydroxy silicon oil, 3 ~ 8 parts of coupling agent, 0.5 ~ 1 part of antioxidant.
Further, the coupling agent is silane coupler KH560 or tetra isopropyl two（Dioctyl phosphito acyloxy）
Titanate coupling agent.
Further, the antioxidant be β-positive octadecanol ester of (3,5- di-tert-butyl-hydroxy phenyl) propionic acid, 2,2,
One kind or its combination in 4- trimethyl -1,2- dihyaroquinolines condensate, 2,5- ditert-butylhydro quinones.
A kind of heat-conductive composite material of described high plasticity, its preparation method is comprised the following steps：1）By the weight
Number is on the waiting list raw material；2）Thermal conductivity filler and coupling agent, hydroxy silicon oil, neopentylglycol diglycidyl ether are placed in high mixer
It is sufficiently mixed uniform；3）The compound that step 2 is obtained is mixed with surplus stock, is placed in banbury in mixing at 90 ~ 110 DEG C
2~4min；4）Compound obtained by step 3 is obtained into heat conduction of the invention after double screw extruder melting, extrusion, granulation
Composite.
Compared with prior art, what the present invention possessed has the beneficial effect that：
A kind of heat-conductive composite material of high plasticity that the present invention is provided uses polybutylene terephthalate (PBT) and polyvinyl alcohol
Butyral as Heat Conduction Material resin binder, through simple work after filling thermal conductivity filler and heat conduction, the modified filler of plasticity
Being obtained after skill processing has superior thermal conductivity and fictile heat-conductive composite material；The filling of modified filler causes graphite and carbon
Distribution of the nanotube in Heat Conduction Material resin binder is more reasonable, and improves graphite and CNT and Heat Conduction Material resin base
Interface compatibility between material, increases the probability that graphite and CNT contact with each other, can be formed each other thermal conductive network or
Heat conduction chain, can form Mutual function between graphite, CNT and Heat Conduction Material resin binder, increase substantially material
Thermal conductivity.
Specific embodiment
With reference to specific embodiment, the present invention is described further.
Embodiment 1：A kind of heat-conductive composite material of high plasticity, including following parts by weight raw material：Poly- terephthaldehyde
100 parts of sour butanediol ester, 15 parts of polyvinyl butyral resin, 60 parts of thermal conductivity filler, 20 parts of modified filler；Described conductive filler
Expect to be expanded graphite and CNT, its mass parts ratio is 2:1；Described modified filler includes the raw material of following parts by weight：
2 parts of neopentylglycol diglycidyl ether, 4 parts of methyl hydroxyethylcellulose, ethylene-acrylate-methyl propenoic acid glycidyl
2 parts of ester terpolymer, 5 parts of ethylene-octene copolymer, 1 part of hydroxy silicon oil, 5 parts of coupling agent, 1 part of antioxidant.
Further, the coupling agent is silane coupler KH560, and the antioxidant is β-(3,5- di-t-butyl -4- hydroxyls
Base phenyl) the positive octadecanol ester of propionic acid and the 2,2,4- trimethyl polymeric mixtures of -1,2- dihyaroquinolines.
A kind of heat-conductive composite material of described high plasticity, its preparation method is comprised the following steps：1）By the weight
Number is on the waiting list raw material；2）Thermal conductivity filler and coupling agent, hydroxy silicon oil, neopentylglycol diglycidyl ether are placed in high mixer
It is sufficiently mixed uniform；3）The compound that step 2 is obtained is mixed with surplus stock, is placed in banbury in mixing at 100 DEG C
3min；4）The compound obtained by step 3 is obtained into heat conduction of the invention after double screw extruder melting, extrusion, granulation to answer
Condensation material.
Embodiment 2：A kind of heat-conductive composite material of high plasticity, including following parts by weight raw material：Poly- terephthaldehyde
100 parts of sour butanediol ester, 10 parts of polyvinyl butyral resin, 45 parts of thermal conductivity filler, 10 parts of modified filler；Described conductive filler
Expect to be expanded graphite and CNT, its mass parts ratio is 1:1；Described modified filler includes the raw material of following parts by weight：
1 part of neopentylglycol diglycidyl ether, 2 parts of methyl hydroxyethylcellulose, ethylene-acrylate-methyl propenoic acid glycidyl
1 part of ester terpolymer, 2 parts of ethylene-octene copolymer, 0.5 part of hydroxy silicon oil, 3 parts of coupling agent, 0.5 part of antioxidant.
Further, the coupling agent is tetra isopropyl two（Dioctyl phosphito acyloxy）Titanate coupling agent, it is described
Antioxidant is 2,5- ditert-butylhydro quinones.
A kind of heat-conductive composite material of described high plasticity, its preparation method is comprised the following steps：1）By the weight
Number is on the waiting list raw material；2）Thermal conductivity filler and coupling agent, hydroxy silicon oil, neopentylglycol diglycidyl ether are placed in high mixer
It is sufficiently mixed uniform；3）The compound that step 2 is obtained is mixed with surplus stock, is placed in banbury in mixing at 90 DEG C
4min；4）The compound obtained by step 3 is obtained into heat conduction of the invention after double screw extruder melting, extrusion, granulation to answer
Condensation material.
Embodiment 3：A kind of heat-conductive composite material of high plasticity, including following parts by weight raw material：Poly- terephthaldehyde
100 parts of sour butanediol ester, 20 parts of polyvinyl butyral resin, 75 parts of thermal conductivity filler, 30 parts of modified filler；Described conductive filler
Expect to be expanded graphite and CNT, its mass parts ratio is 3:1；Described modified filler includes the raw material of following parts by weight：
3 parts of neopentylglycol diglycidyl ether, 6 parts of methyl hydroxyethylcellulose, ethylene-acrylate-methyl propenoic acid glycidyl
4 parts of ester terpolymer, 7 parts of ethylene-octene copolymer, 1 part of hydroxy silicon oil, 8 parts of coupling agent, 1 part of antioxidant.
Further, the coupling agent is silane coupler KH560, and the antioxidant is β-(3,5- di-t-butyl -4- hydroxyls
Base phenyl) the positive octadecanol ester of propionic acid, 2,2,4- trimethyls -1,2- dihyaroquinolines condensate and 2,5- di-tert-butyls be to benzene two
The mixing of phenol.
A kind of heat-conductive composite material of described high plasticity, its preparation method is comprised the following steps：1）By the weight
Number is on the waiting list raw material；2）Thermal conductivity filler and coupling agent, hydroxy silicon oil, neopentylglycol diglycidyl ether are placed in high mixer
It is sufficiently mixed uniform；3）The compound that step 2 is obtained is mixed with surplus stock, is placed in banbury in mixing at 110 DEG C
2min；4）The compound obtained by step 3 is obtained into heat conduction of the invention after double screw extruder melting, extrusion, granulation to answer
Condensation material.
Embodiment 4：A kind of heat-conductive composite material of high plasticity, including following parts by weight raw material：Poly- terephthaldehyde
100 parts of sour butanediol ester, 20 parts of polyvinyl butyral resin, 45 parts of thermal conductivity filler, 30 parts of modified filler；Described conductive filler
Expect to be expanded graphite and CNT, its mass parts ratio is 3:2；Described modified filler includes the raw material of following parts by weight：
3 parts of neopentylglycol diglycidyl ether, 6 parts of methyl hydroxyethylcellulose, ethylene-acrylate-methyl propenoic acid glycidyl
4 parts of ester terpolymer, 7 parts of ethylene-octene copolymer, 1 part of hydroxy silicon oil, 8 parts of coupling agent, 1 part of antioxidant.
Further, the coupling agent is tetra isopropyl two（Dioctyl phosphito acyloxy）Titanate coupling agent, it is described
Antioxidant is 2,2,4- trimethyl -1,2- dihyaroquinoline condensates.
A kind of heat-conductive composite material of described high plasticity, its preparation method is with embodiment 1.
Embodiment 5：A kind of heat-conductive composite material of high plasticity, including following parts by weight raw material：Poly- terephthaldehyde
100 parts of sour butanediol ester, 12 parts of polyvinyl butyral resin, 70 parts of thermal conductivity filler, 23 parts of modified filler；Described conductive filler
Expect to be expanded graphite and CNT, its mass parts ratio is 5:2；Described modified filler includes the raw material of following parts by weight：
2 parts of neopentylglycol diglycidyl ether, 5 parts of methyl hydroxyethylcellulose, ethylene-acrylate-methyl propenoic acid glycidyl
3 parts of ester terpolymer, 6 parts of ethylene-octene copolymer, 0.5 part of hydroxy silicon oil, 6 parts of coupling agent, 0.5 part of antioxidant.
Further, the coupling agent is silane coupler KH560, and the antioxidant is β-(3,5- di-t-butyl -4- hydroxyls
Base phenyl) the positive octadecanol ester of propionic acid.
A kind of heat-conductive composite material of described high plasticity, its preparation method is with embodiment 1.
Comparative example 1：A kind of heat-conductive composite material of high plasticity, including following parts by weight raw material：Poly- terephthaldehyde
100 parts of sour butanediol ester, 15 parts of polyvinyl butyral resin, 20 parts of modified filler；Described modified filler includes following weight portion
Several raw materials：2 parts of neopentylglycol diglycidyl ether, 4 parts of methyl hydroxyethylcellulose, ethylene-acrylate-methacrylic acid
2 parts of ethylene oxidic ester terpolymer, 5 parts of ethylene-octene copolymer, 1 part of hydroxy silicon oil, 5 parts of coupling agent, 1 part of antioxidant.
Further, the coupling agent is silane coupler KH560, and the antioxidant is β-(3,5- di-t-butyl -4- hydroxyls
Base phenyl) the positive octadecanol ester of propionic acid and the 2,2,4- trimethyl polymeric mixtures of -1,2- dihyaroquinolines.
A kind of heat-conductive composite material of described high plasticity, its preparation method is comprised the following steps：1）By the weight
Number is on the waiting list raw material；2）Coupling agent, hydroxy silicon oil, neopentylglycol diglycidyl ether are placed in high mixer and are sufficiently mixed
It is even；3）The compound that step 2 is obtained is mixed with surplus stock, is placed in banbury in kneading 3min at 100 DEG C；4）By step
Compound obtained by 3 obtains heat-conductive composite material of the invention after double screw extruder melting, extrusion, granulation.
Comparative example 2：A kind of heat-conductive composite material of high plasticity, including following parts by weight raw material：Poly- terephthaldehyde
100 parts of sour butanediol ester, 15 parts of polyvinyl butyral resin, 60 parts of thermal conductivity filler；Described thermal conductivity filler is expanded graphite
With CNT, its mass parts ratio is 2:1.
A kind of heat-conductive composite material of described high plasticity, its preparation method is comprised the following steps：1）By the weight
Number is on the waiting list raw material；2）Thermal conductivity filler is placed in high mixer and is sufficiently mixed uniformly；3）The compound that step 2 is obtained with it is surplus
The mixing of remaining raw material, is placed in banbury in kneading 3min at 100 DEG C；4）By the compound obtained by step 3 through twin-screw extrusion
Heat-conductive composite material of the invention is obtained after machine melting, extrusion, granulation.
Heat-conductive composite material obtained by embodiment 1-5 and comparative example 1-2 is carried out into performance test, it is as a result as shown in the table：
| Tensile strength | Elongation at break | Impact strength (non-notch) | Thermal conductivity factor | |
| Unit | Mpa | % | 23℃ KJ/m2 | W.M-1.K-1 |
| Standard | ASTM D638 | ASTM D638 | ASTM D256 | ASTM E1461 |
| Embodiment 1 | 84.1 | 8.7 | 44.2 | 6.658 |
| Embodiment 2 | 86.3 | 7.5 | 45.7 | 5.863 |
| Embodiment 3 | 76.8 | 8.3 | 36.8 | 6.592 |
| Embodiment 4 | 80.5 | 7.8 | 34.6 | 5.995 |
| Embodiment 5 | 83.0 | 8.5 | 42.7 | 6.367 |
| Comparative example 1 | 51.2 | 6.7 | 42.9 | 0.518 |
| Comparative example 2 | 46.8 | 4.2 | 31.4 | 2.460 |
Above-described embodiment is only better embodiment of the invention, and its specific descriptions can not be interpreted as to the scope of the claims of the present invention
Limitation, as long as the technical scheme that those skilled in the art are obtained in the form of equivalent or equivalent transformation, all falls within this hair
Within bright protection domain.
Claims (5)
1. a kind of heat-conductive composite material of high plasticity, it is characterised in that the raw material including following parts by weight：Poly- terephthaldehyde
100 parts of sour butanediol ester, 10 ~ 20 parts of polyvinyl butyral resin, 45 ~ 75 parts of thermal conductivity filler, 10 ~ 30 parts of modified filler；
Described thermal conductivity filler is expanded graphite and CNT, and its mass parts ratio is 1 ~ 3:1；
Described modified filler includes the raw material of following parts by weight：1 ~ 3 part of neopentylglycol diglycidyl ether, dimethyl hydroxyethyl
2 ~ 6 parts of cellulose, ethylene-acrylate -1 ~ 4 part of GMA terpolymer, ethylene-octene copolymer
2 ~ 7 parts, 0.5 ~ 1 part of hydroxy silicon oil, 3 ~ 8 parts of coupling agent, 0.5 ~ 1 part of antioxidant.
2. the heat-conductive composite material of a kind of high plasticity according to claim 1, it is characterised in that：The coupling agent is silicon
Alkane coupling agent KH560 or tetra isopropyl two（Dioctyl phosphito acyloxy）Titanate coupling agent.
3. the heat-conductive composite material of a kind of high plasticity according to claim 1, it is characterised in that：The antioxidant be β-
The positive octadecanol ester of (3,5- di-tert-butyl-hydroxy phenyls) propionic acid, 2,2,4- trimethyl -1,2- dihyaroquinolines condensate,
One kind or its combination in 2,5- ditert-butylhydro quinones.
4. the preparation method of the heat-conductive composite material of a kind of high plasticity described in any one of claim 1-4, it is characterised in that
Comprise the following steps：1）Raw material is on the waiting list by the parts by weight；2）By thermal conductivity filler and coupling agent, hydroxy silicon oil, new penta 2
Alcohol diglycidyl ether is placed in high mixer and is sufficiently mixed uniformly；3）The compound that step 2 is obtained is mixed with surplus stock, is put
In 2 ~ 4min of mixing at 90 ~ 110 DEG C in banbury；4）Compound obtained by step 3 is melted through double screw extruder, is squeezed
Go out, granulate after obtain heat-conductive composite material of the invention.
5. the preparation method of the heat-conductive composite material of a kind of high plasticity according to claim 4, it is characterised in that：It is described
The raw material that step 1 is on the waiting list includes：100 parts of polybutylene terephthalate (PBT), 15 parts of polyvinyl butyral resin, thermal conductivity filler 60
Part, 20 parts of modified filler；Described thermal conductivity filler is expanded graphite and CNT, and its mass parts ratio is 2:1；Described changes
Property filler including following parts by weight raw material：2 parts of neopentylglycol diglycidyl ether, 4 parts of methyl hydroxyethylcellulose, second
Alkene -2 parts of acrylate-glycidyl ester terpolymer, 5 parts of ethylene-octene copolymer, 1 part of hydroxy silicon oil,
5 parts of coupling agent, 1 part of antioxidant.
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| CN107338026A (en) * | 2017-06-07 | 2017-11-10 | 常州苏达欧包装材料有限公司 | A kind of composite phase-change heat-storage material and preparation method thereof |
| CN107880359A (en) * | 2017-11-29 | 2018-04-06 | 苏州科茂电子材料科技有限公司 | The insulating heat-conductive high intensity assembling composite and preparation method of use for electronic products |
| CN107903525A (en) * | 2017-12-01 | 2018-04-13 | 苏州科茂电子材料科技有限公司 | High-strength ageing composite material and preparation method for electronic product casing |
| CN115197494A (en) * | 2022-08-24 | 2022-10-18 | 山东雪圣电器有限公司 | High-density polyethylene high-thermal-conductivity composite material and preparation method thereof |
| CN117050408A (en) * | 2023-08-09 | 2023-11-14 | 国网冀北电力有限公司唐山供电公司 | High-heat-conductivity composite material and preparation method thereof and high-efficiency radiating pipe prepared from high-heat-conductivity composite material |
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| Publication number | Priority date | Publication date | Assignee | Title |
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| CN107338026A (en) * | 2017-06-07 | 2017-11-10 | 常州苏达欧包装材料有限公司 | A kind of composite phase-change heat-storage material and preparation method thereof |
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| CN115197494A (en) * | 2022-08-24 | 2022-10-18 | 山东雪圣电器有限公司 | High-density polyethylene high-thermal-conductivity composite material and preparation method thereof |
| CN117050408A (en) * | 2023-08-09 | 2023-11-14 | 国网冀北电力有限公司唐山供电公司 | High-heat-conductivity composite material and preparation method thereof and high-efficiency radiating pipe prepared from high-heat-conductivity composite material |
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