CN106684262A - Organic light emitting display apparatus and packaging method therefor - Google Patents
Organic light emitting display apparatus and packaging method therefor Download PDFInfo
- Publication number
- CN106684262A CN106684262A CN201710208629.9A CN201710208629A CN106684262A CN 106684262 A CN106684262 A CN 106684262A CN 201710208629 A CN201710208629 A CN 201710208629A CN 106684262 A CN106684262 A CN 106684262A
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- coating
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- organic light
- emitting display
- water blocking
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K50/00—Organic light-emitting devices
- H10K50/80—Constructional details
- H10K50/84—Passivation; Containers; Encapsulations
- H10K50/844—Encapsulations
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
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- Manufacturing & Machinery (AREA)
- Physics & Mathematics (AREA)
- Optics & Photonics (AREA)
- Electroluminescent Light Sources (AREA)
- Devices For Indicating Variable Information By Combining Individual Elements (AREA)
Abstract
The invention provides an organic light emitting display apparatus and a packaging method therefor. The organic light emitting display apparatus comprises a glass substrate and a flexible display substrate, a thin film packaging layer and a protective film layer which are arranged on the glass substrate; the thin film packaging layer comprises a first covering layer and a second covering layer; the first covering layer and the second covering layer are flush with the opposite surface of the protective film layer, wherein the first covering layer covers a display region of the flexible display substrate; and the second covering layer covers a film pasting region, positioned outside the flexible display substrate, of the glass substrate, and a region, positioned outside the first covering layer, of the flexible display substrate. By adoption of the organic light emitting display apparatus and the packaging method therefor provided by the invention, adverse influences to a film pasting process caused by section difference formed between the flexible display substrate and the glass substrate can be eliminated and the laminating width can be reduced, thereby improving the utilization rate of the flexible display substrate.
Description
Technical field
The present invention relates to display technology field, in particular it relates to a kind of organic light-emitting display device and its method for packing.
Background technology
Organic Light Emitting Diode (OLED) is prepared on a flexible substrate, realizes that Flexible Displays are following display skills with this
One important directions of art development.But, flexible substrates are weaker to the blocking capability of water, oxygen for substrate of glass.
Future extends the life-span of flexible OLED devices, it is necessary to OLED is effectively encapsulated using packaging film.Also, in envelope
After installing into, diaphragm can be attached on packaging film, not affected by particle with protection packaging film.
Fig. 1 is a kind of structure chart of existing organic light-emitting display device.As shown in figure 1, organic light-emitting display device bag
Glass substrate 1 is included, and is arranged on the flexible display substrates 2 on the glass substrate 1, thin-film encapsulation layer 3 and protection film layer 4.Its
In, protection film layer 4 is attached in thin-film encapsulation layer 3 by diaphragm glue material 5, and the length of side of protection film layer 4 is aobvious more than flexible
Show the length of side of substrate 2, i.e. the edge of protection film layer 4 is stretched out relative to the edge of flexible display substrates 2, and this stretches out
Partial length as laminating width D, the laminating width D is needed more than certain numerical value, to ensure the stability of subsequent technique.
But, due to being formed with segment difference between flexible display substrates 2 and glass substrate 1, the segment difference may result in
State protection film layer 4 bad in its extension generation bubble etc., this not only brings harmful effect to film coating process, and needs more
Big laminating width D just can guarantee that the stability of subsequent technique, so as to cause the utilization rate of flexible display substrates 2 relatively low.
The content of the invention
It is contemplated that at least solving one of technical problem present in prior art, it is proposed that a kind of organic light emitting display
Device and its method for packing, it not only can eliminate the harmful effect brought to film coating process, but also it is wide to reduce laminating
Degree, such that it is able to improve the utilization rate of flexible display substrates.
A kind of organic light-emitting display device is provided to realize the purpose of the present invention, including glass substrate, and be arranged on
Flexible display substrates, thin-film encapsulation layer and protection film layer on the glass substrate, the thin-film encapsulation layer is covered including first
The surface flush relative with the protection film layer of layer and the second coating, first coating and the second coating, its
In,
First coating covers the viewing area of the flexible display substrates；
Second coating covers the pad pasting region on the outside of the flexible display substrates of the glass substrate, with
And the region on the outside of first coating of the flexible display substrates.
Preferably, the surface relative with the protection film layer of second coating is provided with hollow-out parts.
Preferably, the hollow-out parts are multiple, and are spaced apart around the flexible display substrates.
Preferably, second coating includes second organic water blocking layer.
Preferably, first coating includes that the first inorganic water blocking layer, first organic water blocking layer and second inorganic block water
Layer.
Preferably, first coating is identical with the material of described first organic water blocking layer.
Preferably, the flexible display substrates include flexible base board, and are arranged on the crystalline substance of the film on the flexible base board
Body pipe functional layer and Organic Light Emitting Diode.
Used as another technical scheme, the present invention also provides a kind of method for packing of organic light-emitting display device, and it includes：
Flexible display substrates are formed on the glass substrate；
Thin-film encapsulation layer is formed on the flexible display substrates；The thin-film encapsulation layer includes the first coating and second
The surface flush relative with the protection film layer of coating, first coating and the second coating, wherein, described
One coating covers the viewing area of the flexible display substrates；Second coating cover the glass substrate positioned at institute
State the pad pasting region on the outside of flexible display substrates, and the area on the outside of first coating of the flexible display substrates
Domain
Protection film layer is formed in the thin-film encapsulation layer.
Preferably, second coating is formed by the way of inkjet printing.
Preferably, first coating includes that the first inorganic water blocking layer, first organic water blocking layer and second inorganic block water
Layer；
Described first organic water blocking layer is formed by the way of inkjet printing.
The invention has the advantages that：
In organic light-emitting display device that the present invention is provided and its technical scheme of method for packing, thin-film encapsulation layer includes the
One coating and the second coating, the surface flush relative with protection film layer of the two, wherein, the first coating covers flexible
The viewing area of display base plate, to protect the OLED on flexible display substrates.Second coating cover glass substrate
Pad pasting region on the outside of flexible display substrates, and the region on the outside of the first coating of flexible display substrates, use
With the part that the edge for supporting protection film layer is stretched out relative to the edge of flexible display substrates, such that it is able to eliminate
The harmful effect that the segment difference formed between flexible display substrates and glass substrate is brought to film coating process, but also patch can be reduced
Width is closed, such that it is able to improve the utilization rate of flexible display substrates.
Description of the drawings
Fig. 1 is a kind of structure chart of existing organic light-emitting display device；
Fig. 2 is the structure chart of organic light-emitting display device provided in an embodiment of the present invention；
Fig. 3 is the top view of the thin-film encapsulation layer of organic light-emitting display device provided in an embodiment of the present invention；And
The vertical view of the thin-film encapsulation layer of the organic light-emitting display device that Fig. 4 is provided for the preferred version of the embodiment of the present invention
Figure.
Specific embodiment
To make those skilled in the art more fully understand technical scheme, come below in conjunction with the accompanying drawings to the present invention
The organic light-emitting display device and its method for packing of offer is described in detail.
Fig. 2 is the structure chart of organic light-emitting display device provided in an embodiment of the present invention.Fig. 3 is provided for the embodiment of the present invention
Organic light-emitting display device thin-film encapsulation layer top view.See also Fig. 2 and Fig. 3, organic light-emitting display device bag
Glass substrate 10 is included, and is arranged on the flexible display substrates on the glass substrate 10, thin-film encapsulation layer 15 and protection film layer 14.
Wherein, flexible display substrates include flexible base board 11, and the luminescent layer 12 being arranged on the flexible base board 11, the luminescent layer position
In the viewing area A of flexible base board 11, can specifically include the OLED of thin film transistor (TFT) functional layer and Organic Light Emitting Diode etc.
Device.In addition, protection film layer 14 is attached in thin-film encapsulation layer 15 by diaphragm glue material 13.
Thin-film encapsulation layer 15 includes the first coating and the second coating 154, wherein, the first coating covers Flexible Displays
The viewing area of substrate, i.e. the luminescent layer 12 in cladding viewing area, to protect OLED.Further, this first covers
Cap rock includes the first inorganic water blocking layer 151, first organic water blocking layer 152 and the second inorganic water blocking layer 153.Due to inorganic thin film tool
There is higher steam isolating power, it can serve as water blocking layer, but, can be inevitably during inorganic thin film is generated
The defects such as pin hole, crackle are produced, causing the obstructing capacity of inorganic water blocking layer reduces.Additionally, blocked up inorganic water blocking layer is also
Larger internal stress can be produced, so as to have a strong impact on package quality.For this purpose, by arranging organic between two inorganic water blocking layers
Water blocking layer, it is possible to reduce the defect and internal stress of inorganic water blocking layer, such that it is able to improve package quality.
The pad pasting region C on the outside of flexible display substrates of the cover glass substrate 10 of the second coating 154, and it is flexible
The region B on the outside of the first coating of display base plate.Region B does not include binding (bonding) circuit region,
That is, the second coating 154 does not cover binding circuit region.Also, the first coating and the second coating 154 with protection
The relative surface flush of film layer 14, so as to the second coating 154 has filled and led up flexible display substrates and the first coating in glass
The segment difference that the edge of substrate 10 is formed, such that it is able to eliminate the harmful effect that the segment difference is brought to film coating process, but also can be with
On the premise of the stability of subsequent technique is ensured, reduce laminating width (that is, length E of the extension of protection film layer 4), from
And the utilization rate of flexible display substrates can be improved.
The vertical view of the thin-film encapsulation layer of the organic light-emitting display device that Fig. 4 is provided for the preferred version of the embodiment of the present invention
Figure.Refer to Fig. 4, it is preferred that the surface relative with protection film layer 14 of the second coating 154 is provided with hollow-out parts 154a.Borrow
Hollow-out parts 154a are helped, the second coating 154 and the contact area of diaphragm glue material 13 can be increased, covered such that it is able to improve second
The bonding force of cap rock 154 and diaphragm glue material 13.Preferably, hollow-out parts 154a can be multiple, and around between flexible base board 11
Every distribution, such that it is able to improve the uniformity of bonding force.In actual applications, the shape of each hollow-out parts 154a can be square
Shape, circle or other arbitrary shapes.In addition, multiple hollow-out parts 154a can also adopt other Arbitrary distribution modes, the present invention
This is not particularly limited.
Preferably, above-mentioned second coating 154 includes second organic water blocking layer.Because organic water blocking layer can be in ensureing
Stress will not it is excessive on the premise of design larger thickness, therefore, can be met using organic water blocking layer and fill and lead up Flexible Displays base
The needs of the hierarchic structure that plate and the first coating are formed in the edge of glass substrate 10, while being not in that internal stress is excessive
Problem.Further, the first coating 154 is identical with the material of first organic water blocking layer 151, to simplify thin film encapsulation processes.
Used as another technical scheme, the embodiment of the present invention also provides a kind of method for packing of organic light-emitting display device,
Fig. 2 and Fig. 3 is seen also, it includes：
Step one, flexible display substrates are formed on the glass substrate 10.
The flexible display substrates include flexible base board 11, and the luminescent layer 12 being arranged on the flexible base board 11, this
Photosphere is located at the viewing area A of flexible base board 11, can specifically include thin film transistor (TFT) functional layer and Organic Light Emitting Diode etc.
OLED.
Step 2, on the flexible display substrates formed thin-film encapsulation layer 15.
The thin-film encapsulation layer 15 includes the first coating and the second coating 154, the two relative with protection film layer 14
Surface flush, wherein, the first coating covers the viewing area A of flexible display substrates；The cover glass base of second coating 154
The pad pasting region C on the outside of flexible display substrates of plate 10, and flexible display substrates on the outside of the first coating
Region B.
Preferably, the second coating 154 is formed by the way of inkjet printing.The mode of inkjet printing have without using
Masterplate (mask), the good leveling property of film layer, the advantage that the process time is short and thickness is controllable.It is of course also possible to use serigraphy
Mode form the second coating 154.
Additionally, it is preferred that, above-mentioned first coating includes the first inorganic water blocking layer 151, first organic water blocking layer 152 and the
Two inorganic water blocking layers 153.Because inorganic thin film has higher steam isolating power, it can serve as water blocking layer, but, giving birth to
Into the defects such as pin hole, crackle can be inevitably generated during inorganic thin film, cause the obstruct energy of inorganic water blocking layer
Power is reduced.Additionally, blocked up inorganic water blocking layer can also produce larger internal stress, so as to have a strong impact on package quality.For this purpose, logical
Cross and organic water blocking layer is set between two inorganic water blocking layers, it is possible to reduce the defect and internal stress of inorganic water blocking layer, so as to can
To improve package quality.
It is similar with the generation type of above-mentioned second coating 154, it would however also be possible to employ inkjet printing or serigraphy
Mode form above-mentioned first organic water blocking layer 152.Furthermore it is possible to be formed using the film plating process of PVD or CVD etc.
State the first inorganic water blocking layer 151 and the second inorganic water blocking layer 153.
Step 3, in thin-film encapsulation layer 15 formed protection film layer 14.
It is attached in thin-film encapsulation layer 15 especially by diaphragm glue material 13.
In sum, the method for packing of the organic light-emitting display device that the present invention is provided, it not only can be eliminated in flexibility
The harmful effect that the segment difference formed between display base plate and glass substrate is brought to film coating process, but also it is wide to reduce laminating
Degree, such that it is able to improve the utilization rate of flexible display substrates.
It is understood that the embodiment of above principle being intended to be merely illustrative of the present and the exemplary enforcement for adopting
Mode, but the invention is not limited in this.For those skilled in the art, in the essence without departing from the present invention
In the case of god and essence, various modifications and improvement can be made, these modifications and improvement are also considered as protection scope of the present invention.
Claims (10)
1. a kind of organic light-emitting display device, including glass substrate, and the Flexible Displays base being arranged on the glass substrate
Plate, thin-film encapsulation layer and protection film layer, it is characterised in that the thin-film encapsulation layer includes the first coating and the second coating,
The surface flush relative with the protection film layer of first coating and the second coating, wherein,
First coating covers the viewing area of the flexible display substrates；
Second coating covers the pad pasting region on the outside of the flexible display substrates of the glass substrate, Yi Jisuo
State the region on the outside of first coating of flexible display substrates.
2. organic light-emitting display device according to claim 1, it is characterised in that second coating with it is described
The relative surface of protection film layer is provided with hollow-out parts.
3. organic light-emitting display device according to claim 2, it is characterised in that the hollow-out parts are multiple, and are surrounded
The flexible display substrates are spaced apart.
4. the organic light-emitting display device according to claim 1-3 any one, it is characterised in that second coating
Including second organic water blocking layer.
5. the organic light-emitting display device according to claim 1-3 any one, it is characterised in that first coating
Including the first inorganic water blocking layer, first organic water blocking layer and the second inorganic water blocking layer.
6. organic light-emitting display device according to claim 5, it is characterised in that first coating and described first
The material of organic water blocking layer is identical.
7. the organic light-emitting display device according to claim 1-3 any one, it is characterised in that the Flexible Displays base
Plate includes flexible base board, and thin film transistor (TFT) functional layer and the Organic Light Emitting Diode being arranged on the flexible base board.
8. a kind of method for packing of organic light-emitting display device, it is characterised in that include：
Flexible display substrates are formed on the glass substrate；
Thin-film encapsulation layer is formed on the flexible display substrates；The thin-film encapsulation layer includes that the first coating and second is covered
The surface flush relative with the protection film layer of layer, first coating and the second coating, wherein, described first covers
Cap rock covers the viewing area of the flexible display substrates；Second coating cover the glass substrate positioned at described soft
Pad pasting region on the outside of property display base plate, and the region on the outside of first coating of the flexible display substrates
Protection film layer is formed in the thin-film encapsulation layer.
9. the method for packing of organic light-emitting display device according to claim 8, it is characterised in that using inkjet printing
Mode forms second coating.
10. the method for packing of organic light-emitting display device according to claim 8, it is characterised in that described first covers
Layer includes the first inorganic water blocking layer, first organic water blocking layer and the second inorganic water blocking layer；
Described first organic water blocking layer is formed by the way of inkjet printing.
Priority Applications (1)
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| CN201710208629.9A CN106684262B (en) | 2017-03-31 | 2017-03-31 | Organic light-emitting display device and its packaging method |
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| CN201710208629.9A CN106684262B (en) | 2017-03-31 | 2017-03-31 | Organic light-emitting display device and its packaging method |
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| CN106684262B CN106684262B (en) | 2018-10-19 |
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| CN109509402A (en) * | 2017-09-14 | 2019-03-22 | 昆山国显光电有限公司 | A kind of flexible display apparatus |
| CN110729335A (en) * | 2019-10-28 | 2020-01-24 | 武汉华星光电半导体显示技术有限公司 | Display panel and preparation method thereof |
| CN111180485A (en) * | 2018-11-09 | 2020-05-19 | 乐金显示有限公司 | Display device and method for manufacturing the same |
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