CN106684212A - Automatic detection dual-silicon-wafer apparatus - Google Patents
Automatic detection dual-silicon-wafer apparatus Download PDFInfo
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- 238000001514 detection method Methods 0.000 title claims abstract description 13
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 claims abstract description 27
- 229910052710 silicon Inorganic materials 0.000 claims abstract description 27
- 239000010703 silicon Substances 0.000 claims abstract description 27
- 239000013078 crystal Substances 0.000 claims description 10
- 235000012431 wafers Nutrition 0.000 abstract description 40
- 238000000034 method Methods 0.000 abstract description 6
- 229910021419 crystalline silicon Inorganic materials 0.000 description 14
- 238000004519 manufacturing process Methods 0.000 description 5
- 230000005540 biological transmission Effects 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- 238000007689 inspection Methods 0.000 description 2
- 239000000523 sample Substances 0.000 description 2
- 230000002159 abnormal effect Effects 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 238000003384 imaging method Methods 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000001179 sorption measurement Methods 0.000 description 1
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10F—INORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
- H10F71/00—Manufacture or treatment of devices covered by this subclass
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L22/00—Testing or measuring during manufacture or treatment; Reliability measurements, i.e. testing of parts without further processing to modify the parts as such; Structural arrangements therefor
- H01L22/10—Measuring as part of the manufacturing process
- H01L22/12—Measuring as part of the manufacturing process for structural parameters, e.g. thickness, line width, refractive index, temperature, warp, bond strength, defects, optical inspection, electrical measurement of structural dimensions, metallurgic measurement of diffusions
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L22/00—Testing or measuring during manufacture or treatment; Reliability measurements, i.e. testing of parts without further processing to modify the parts as such; Structural arrangements therefor
- H01L22/20—Sequence of activities consisting of a plurality of measurements, corrections, marking or sorting steps
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
- Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
- Y02P70/50—Manufacturing or production processes characterised by the final manufactured product
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Abstract
本发明提供一种自动检测双片装置，包括两条平行设置的输送带、红外感应器、激光扫描器、上机械手、下机械手和控制器，所述输送带一侧设有用于扫描晶硅片侧面影像的激光扫描器，所述上机械手设于两输送带之间位置的上方，所述下机械手设于两输送带之间位置的下方，所述输送带、红外感应器、激光扫描器、上机械手和下机械手均与所述控制器电路连接。本发明提供的一种自动检测双片装置，采用激光扫描器对晶硅片侧边扫描成像，并与预设像进行对比，并将多余的晶硅片取走，整个过程采用自动化，节约人力，同时也避免人工疲劳而产生漏检的问题，避免了产品损坏。
The invention provides an automatic double-chip detection device, which includes two conveyor belts arranged in parallel, an infrared sensor, a laser scanner, an upper manipulator, a lower manipulator and a controller. The laser scanner of the profile image, the upper manipulator is set above the position between the two conveyor belts, the lower manipulator is set below the position between the two conveyor belts, the conveyor belt, infrared sensor, laser scanner, Both the upper manipulator and the lower manipulator are connected with the controller circuit. The invention provides an automatic double-chip detection device, which uses a laser scanner to scan and image the side of the silicon wafer, compares it with the preset image, and removes the redundant silicon wafers. The whole process is automated to save manpower , At the same time, it also avoids the problem of missed detection caused by manual fatigue, and avoids product damage.
Description
技术领域technical field
本发明涉及太阳能电池技术领域，特别是涉及一种自动检测双片装置。The invention relates to the technical field of solar cells, in particular to an automatic double-sheet detection device.
背景技术Background technique
太阳能晶硅片一般是5英寸、6英寸见方的薄片，厚度在120微米—200微米之间，他们具有易碎的特点，而大量的晶硅片层叠放置时，把他们分开成一片片并不容易。现有太阳能晶硅片的生产检测设备涉及到晶硅片的上料、传输、下料，一般采用机械手把层叠放置的样品从上料盒中抓取出来放置于传送带上，然后经过一系列生产工序或者检测程序，再由机械手或者其他机械方式把样品分送到不同下料盒中，在此类设备中，由于样品初始是层叠放置，机械手(一般是真空吸盘或者伯努利吸盘)抓取的时候本应只抓取一片放置在传送带上，但是时常会出现两片甚至三片样品由于吸附而相互粘在一起，导致机械手一次抓取超过一片的样品。而粘在一起的样品会导致生产、检测流程失败，更糟糕的是，粘在一起的样品在传送过程中可能会逐渐分离，如果不及时发现并从生产线上清理，会导致堵住流水线甚至大量碎片。Solar crystalline silicon wafers are generally thin slices of 5 inches and 6 inches square, with a thickness between 120 microns and 200 microns. They are fragile, and when a large number of crystalline silicon wafers are stacked, it is not easy to separate them into pieces. easy. The existing production and testing equipment for solar crystal silicon wafers involves the loading, transmission, and unloading of silicon wafers. Generally, a manipulator is used to grab the stacked samples from the loading box and place them on the conveyor belt, and then go through a series of production processes. In this type of equipment, since the samples are initially stacked, the manipulator (usually a vacuum suction cup or a Bernoulli suction cup) grabs At the time, only one piece should be grabbed and placed on the conveyor belt, but often two or even three pieces of samples would stick to each other due to adsorption, causing the manipulator to grab more than one piece of sample at a time. The sticky samples will lead to the failure of the production and testing process. What's worse, the sticky samples may gradually separate during the transmission process. If they are not found in time and cleaned from the production line, it will lead to blockage of the pipeline or even a large number of samples. debris.
发明内容Contents of the invention
本发明所要解决的技术问题是：为了克服现有技术中易出现吸双片导致产品生产异常的不足，本发明提供一种自动检测双片装置。The technical problem to be solved by the present invention is: in order to overcome the shortcoming in the prior art that the production of the product is prone to be abnormal due to double-sheet suction, the present invention provides an automatic double-sheet detection device.
本发明解决其技术问题所要采用的技术方案是：一种自动检测双片装置，包括两条平行设置的输送带、红外感应器、激光扫描器、上机械手、下机械手和控制器，所述输送带一侧设有用于扫描晶硅片侧面影像的激光扫描器，所述上机械手设于两输送带之间位置的上方，所述下机械手设于两输送带之间位置的下方，所述输送带、红外感应器、激光扫描器、上机械手和下机械手均与所述控制器电路连接。The technical solution adopted by the present invention to solve the technical problem is: an automatic double-sheet detection device, including two conveyor belts arranged in parallel, an infrared sensor, a laser scanner, an upper manipulator, a lower manipulator, and a controller. One side of the belt is provided with a laser scanner for scanning the side image of the silicon wafer, the upper manipulator is set above the position between the two conveyor belts, the lower manipulator is set below the position between the two conveyor belts, and the conveyer The belt, the infrared sensor, the laser scanner, the upper manipulator and the lower manipulator are all connected with the controller circuit.
输送带用于输送晶硅片，红外感应器用于感应到晶硅片进入激光扫描器的扫描范围后向控制器传输信号，控制器控制输送带停止，激光扫描器用于对晶硅片薄侧面扫描成像，将扫描出来的像与预扫描的像进行对比，预扫描的像为单个晶硅片的薄侧面，如果扫描出的单个晶硅片的薄侧面的像与预扫描的像相同或相似，则控制器给输送带通电使输送带继续运行，扫描出的两个或两个以上晶硅片的侧面的像与预扫描的像不相似，则控制器控制下机械手抓住最下面的晶硅片不动，控制器控制上机械手将上面的多余的晶硅片取走，激光扫描器继续扫描，当扫描出的像与预设像相似后，输送带继续向下流动。采用激光扫描器对晶硅片侧边扫描成像，并与预设像进行对比，并将多余的晶硅片取走，整个过程采用自动化，节约人力，同时也避免人工疲劳而产生漏检的问题，避免了产品损坏。The conveyor belt is used to transport the silicon wafer, and the infrared sensor is used to sense that the silicon wafer enters the scanning range of the laser scanner and then transmits a signal to the controller. The controller controls the conveyor belt to stop, and the laser scanner is used to scan the thin side of the silicon wafer Imaging, compare the scanned image with the pre-scanned image, the pre-scanned image is the thin side of a single silicon wafer, if the scanned image of the thin side of a single silicon wafer is the same or similar to the pre-scanned image, Then the controller energizes the conveyor belt to keep the conveyor belt running, and the scanned side images of two or more crystalline silicon wafers are not similar to the pre-scanned images, then the manipulator under the control of the controller grabs the bottom crystalline silicon wafer. The wafer does not move, the controller controls the upper manipulator to remove the excess silicon wafer above, the laser scanner continues to scan, and when the scanned image is similar to the preset image, the conveyor belt continues to flow down. The laser scanner is used to scan and image the side of the silicon wafer, and compare it with the preset image, and remove the excess silicon wafer. The whole process is automated to save manpower, and at the same time avoid the problem of missed inspection caused by manual fatigue. , to avoid product damage.
进一步，为了回收因吸双片而多出的晶硅片，所述输送带远离所述激光扫描器的一侧设有用于回收晶硅片的料盒。Further, in order to recycle extra crystalline silicon wafers due to double-sheet suction, a magazine for reclaiming crystalline silicon wafers is provided on the side of the conveyor belt away from the laser scanner.
进一步，为了取片方便，所述上机械手包括第一真空吸盘以及用于控制所述第一真空吸盘于所述输送带和所述料盒之间往复运动的三维移动机构，所述第一真空吸盘与所述三维移动机构输出端固定连接。Further, for the convenience of taking the sheet, the upper manipulator includes a first vacuum suction cup and a three-dimensional movement mechanism for controlling the reciprocating movement of the first vacuum suction cup between the conveyor belt and the magazine, the first vacuum suction cup The suction cup is fixedly connected with the output end of the three-dimensional moving mechanism.
进一步，为了防止最下一层的晶硅片因晶硅片相互之间的吸力被第一真空吸盘吸走，所述下机械手包括第二真空吸盘以及用于驱动所述第二真空吸盘靠近或远离所述输送带的气缸，所述第二真空吸盘与所述气缸输出端固定连接。Further, in order to prevent the crystal silicon wafers on the bottom layer from being sucked away by the first vacuum chuck due to the suction force between the crystal silicon wafers, the lower manipulator includes a second vacuum chuck and is used to drive the second vacuum chuck close to or The air cylinder away from the conveyor belt, the second vacuum suction cup is fixedly connected with the output end of the air cylinder.
本发明的有益效果是：本发明提供的一种自动检测双片装置，采用激光扫描器对晶硅片侧边扫描成像，并与预设像进行对比，并将多余的晶硅片取走，整个过程采用自动化，节约人力，同时也避免人工疲劳而产生漏检的问题，避免了产品损坏。The beneficial effects of the present invention are: an automatic double-chip detection device provided by the present invention uses a laser scanner to scan and image the side of the silicon wafer, compares it with the preset image, and removes the redundant silicon wafer. The whole process is automated to save manpower, and at the same time avoid the problem of missed inspection caused by manual fatigue, and avoid product damage.
附图说明Description of drawings
下面结合附图和实施例对本发明作进一步说明。The present invention will be further described below in conjunction with drawings and embodiments.
图1是本发明最佳实施例的结构示意图；Fig. 1 is the structural representation of preferred embodiment of the present invention;
图2是吸双片时的结构示意图。Fig. 2 is a schematic diagram of the structure when sucking double sheets.
图中：1、输送带，2、红外感应器，3、激光扫描器，4、控制器，5、料盒，6、第一真空吸盘，7、第二真空吸盘，8、气缸，9、三维移动机构，10、晶硅片。In the figure: 1. Conveyor belt, 2. Infrared sensor, 3. Laser scanner, 4. Controller, 5. Material box, 6. First vacuum sucker, 7. Second vacuum sucker, 8. Cylinder, 9. Three-dimensional moving mechanism, 10. Crystalline silicon wafer.
具体实施方式detailed description
现在结合附图对本发明作详细的说明。此图为简化的示意图，仅以示意方式说明本发明的基本结构，因此其仅显示与本发明有关的构成。The present invention will be described in detail in conjunction with accompanying drawing now. This figure is a simplified schematic diagram only illustrating the basic structure of the present invention in a schematic manner, so it only shows the components relevant to the present invention.
如图1-2所示，本发明的一种自动检测双片装置，包括两条平行设置的输送带1、红外感应器2、激光扫描器3、上机械手、下机械手和控制器4，所述输送带1一侧设有用于扫描晶硅片10侧面影像的激光扫描器3，所述上机械手设于两输送带1之间位置的上方，所述下机械手设于两输送带1之间位置的下方，所述输送带1、红外感应器2、激光扫描器3、上机械手和下机械手均与所述控制器4电路连接。As shown in Fig. 1-2, a kind of automatic detection double sheet device of the present invention, comprises two conveyer belts 1 that are arranged in parallel, infrared sensor 2, laser scanner 3, upper manipulator, lower manipulator and controller 4, so One side of the conveyer belt 1 is provided with a laser scanner 3 for scanning the side image of the crystal silicon wafer 10, the upper manipulator is arranged above the position between the two conveyer belts 1, and the lower manipulator is arranged between the two conveyer belts 1 Below the position, the conveyor belt 1, the infrared sensor 2, the laser scanner 3, the upper manipulator and the lower manipulator are all connected with the controller 4 circuit.
所述输送带1远离所述激光扫描器3的一侧设有用于回收晶硅片10的料盒5。The side of the conveyor belt 1 away from the laser scanner 3 is provided with a magazine 5 for recovering the silicon wafer 10 .
所述上机械手包括第一真空吸盘6以及用于控制所述第一真空吸盘6于所述输送带1和所述料盒5之间往复运动的三维移动机构9，所述第一真空吸盘6与所述三维移动机构9输出端固定连接，所述三维移动机构9将所述第一真空吸盘6移至晶硅片10上表面，第一真空吸盘6吸气将多余晶硅片10吸住移送至所述料盒5内。The upper manipulator includes a first vacuum chuck 6 and a three-dimensional moving mechanism 9 for controlling the reciprocating movement of the first vacuum chuck 6 between the conveyor belt 1 and the magazine 5, the first vacuum chuck 6 It is fixedly connected with the output end of the three-dimensional moving mechanism 9, and the three-dimensional moving mechanism 9 moves the first vacuum chuck 6 to the upper surface of the silicon wafer 10, and the first vacuum chuck 6 sucks the excess silicon wafer 10 Transfer to the magazine 5.
所述下机械手包括第二真空吸盘7以及用于驱动所述第二真空吸盘7靠近或远离所述输送带1的气缸8，所述第二真空吸盘7与所述气缸8输出端固定连接，当所述气缸8输出端伸出时，所述第二真空吸盘7抵设在晶硅片10下底面，所述第二真空吸盘7吸气将晶硅片10吸住保持晶硅片10位置不动。The lower manipulator includes a second vacuum chuck 7 and a cylinder 8 for driving the second vacuum chuck 7 close to or away from the conveyor belt 1, the second vacuum chuck 7 is fixedly connected to the output end of the cylinder 8, When the output end of the cylinder 8 stretches out, the second vacuum chuck 7 abuts against the bottom surface of the crystal silicon wafer 10, and the second vacuum chuck 7 absorbs the crystal silicon wafer 10 to hold the crystal silicon wafer 10 in position. Do not move.
工作原理：working principle:
输送带1上输送若干晶硅片10，当晶硅片10移至红外感应器2上方时，红外感应器2向控制器4传输信号，控制器4控制输送带1停止，控制器4控制激光扫描器3对晶硅片10薄侧面扫描成像，将扫描出来的像与预扫描的单个晶硅片10的薄侧面进行对比，扫描出的单个晶硅片10的薄侧面的像与预扫描的像相似，则控制器4给输送带1通电使输送带1继续运行将晶硅片10流向下一道工序；扫描出的两个或两个以上晶硅片10的侧面的像时，因为与预扫描的像不相似，则控制器4控制下机械手抓住最下面的晶硅片10不动，控制器4控制上机械手将上面的多余的晶硅片10取走，激光扫描器3继续扫描，当扫描出的像与预设像相似后，输送带1通电继续向下流动。A number of crystalline silicon wafers 10 are conveyed on the conveyor belt 1. When the crystalline silicon wafers 10 move above the infrared sensor 2, the infrared sensor 2 transmits a signal to the controller 4. The controller 4 controls the conveyor belt 1 to stop, and the controller 4 controls the laser. The scanner 3 scans and images the thin side of the crystalline silicon wafer 10, compares the scanned image with the thin side of the pre-scanned single crystalline silicon wafer 10, and compares the scanned image of the thin side of the single crystalline silicon wafer 10 with the pre-scanned image. If the image is similar, then the controller 4 energizes the conveyor belt 1 to make the conveyor belt 1 continue to run and the crystal silicon wafer 10 will flow to the next process; If the scanned images are not similar, the controller 4 controls the manipulator to grab the lowermost crystalline silicon wafer 10, and the controller 4 controls the upper manipulator to take away the upper redundant crystalline silicon wafer 10, and the laser scanner 3 continues to scan. When the scanned image is similar to the preset image, the conveyor belt 1 is energized and continues to flow downward.
以上述依据本发明的理想实施例为启示，通过上述的说明内容，相关的工作人员完全可以在不偏离本发明的范围内，进行多样的变更以及修改。本项发明的技术范围并不局限于说明书上的内容，必须要根据权利要求范围来确定其技术性范围。Inspired by the ideal embodiment according to the present invention, through the above description, relevant workers can make various changes and modifications without departing from the scope of the present invention. The technical scope of the present invention is not limited to the content in the specification, and its technical scope must be determined according to the scope of the claims.
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Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108389935A (en) * | 2018-03-30 | 2018-08-10 | 广东启天自动化智能装备股份有限公司 | Automatic feeding and discharging machine for single crystal texturing, whole line inserting and dividing into two pieces |
| CN110531586A (en) * | 2018-05-23 | 2019-12-03 | 佳能株式会社 | Detection device, lithographic equipment and article manufacturing method |
| CN114114973A (en) * | 2020-09-01 | 2022-03-01 | 京东方科技集团股份有限公司 | Display panel double-piece production control method and related equipment |
| CN114192206A (en) * | 2021-12-10 | 2022-03-18 | 辽东学院 | Pathology placement analysis experiment table and working method |
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| CN114114973A (en) * | 2020-09-01 | 2022-03-01 | 京东方科技集团股份有限公司 | Display panel double-piece production control method and related equipment |
| CN114114973B (en) * | 2020-09-01 | 2024-01-23 | 京东方科技集团股份有限公司 | Display panel double-piece production control method and related equipment |
| CN114192206A (en) * | 2021-12-10 | 2022-03-18 | 辽东学院 | Pathology placement analysis experiment table and working method |
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Application publication date: 20170517 |