CN106683988B - Target device - Google Patents
Target device Download PDFInfo
- Publication number
- CN106683988B CN106683988B CN201611237980.2A CN201611237980A CN106683988B CN 106683988 B CN106683988 B CN 106683988B CN 201611237980 A CN201611237980 A CN 201611237980A CN 106683988 B CN106683988 B CN 106683988B
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- Prior art keywords
- connector
- target device
- fixed ring
- target
- component
- Prior art date
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- 239000000919 ceramic Substances 0.000 claims abstract description 5
- 230000001681 protective effect Effects 0.000 claims description 43
- 238000009434 installation Methods 0.000 claims description 15
- 229910010293 ceramic material Inorganic materials 0.000 claims description 7
- 230000002093 peripheral effect Effects 0.000 claims description 7
- 239000007787 solid Substances 0.000 claims description 3
- 230000015572 biosynthetic process Effects 0.000 claims 1
- 230000000694 effects Effects 0.000 abstract description 13
- 239000000126 substance Substances 0.000 abstract description 12
- 238000004519 manufacturing process Methods 0.000 abstract description 7
- 238000000576 coating method Methods 0.000 abstract description 2
- 238000004544 sputter deposition Methods 0.000 abstract description 2
- 230000002035 prolonged effect Effects 0.000 abstract 1
- 239000013077 target material Substances 0.000 abstract 1
- 238000001771 vacuum deposition Methods 0.000 description 17
- 238000000034 method Methods 0.000 description 14
- 239000000463 material Substances 0.000 description 13
- 238000010586 diagram Methods 0.000 description 10
- 239000010408 film Substances 0.000 description 10
- 239000004696 Poly ether ether ketone Substances 0.000 description 9
- 229920002530 polyetherether ketone Polymers 0.000 description 9
- 239000000758 substrate Substances 0.000 description 9
- 239000010409 thin film Substances 0.000 description 6
- 238000007747 plating Methods 0.000 description 5
- 239000002699 waste material Substances 0.000 description 4
- 238000001755 magnetron sputter deposition Methods 0.000 description 3
- 230000005611 electricity Effects 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 238000002360 preparation method Methods 0.000 description 2
- -1 Ether ketone Chemical class 0.000 description 1
- 238000004140 cleaning Methods 0.000 description 1
- 239000011248 coating agent Substances 0.000 description 1
- 230000005672 electromagnetic field Effects 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- RTZKZFJDLAIYFH-UHFFFAOYSA-N ether Substances CCOCC RTZKZFJDLAIYFH-UHFFFAOYSA-N 0.000 description 1
- 230000008020 evaporation Effects 0.000 description 1
- 238000001704 evaporation Methods 0.000 description 1
- AMGQUBHHOARCQH-UHFFFAOYSA-N indium;oxotin Chemical compound [In].[Sn]=O AMGQUBHHOARCQH-UHFFFAOYSA-N 0.000 description 1
- 238000009413 insulation Methods 0.000 description 1
- 239000004973 liquid crystal related substance Substances 0.000 description 1
- 239000002245 particle Substances 0.000 description 1
- 229920000570 polyether Polymers 0.000 description 1
- 229910052573 porcelain Inorganic materials 0.000 description 1
- 239000011214 refractory ceramic Substances 0.000 description 1
- 238000006467 substitution reaction Methods 0.000 description 1
- 238000002834 transmittance Methods 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/26—Bombardment with radiation
- H01L21/263—Bombardment with radiation with high-energy radiation
- H01L21/2633—Bombardment with radiation with high-energy radiation for etching, e.g. sputteretching
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67017—Apparatus for fluid treatment
- H01L21/67063—Apparatus for fluid treatment for etching
Landscapes
- Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- High Energy & Nuclear Physics (AREA)
- Health & Medical Sciences (AREA)
- Toxicology (AREA)
- Physical Vapour Deposition (AREA)
Abstract
The embodiment of the invention discloses a target device, which is provided with a connecting piece and a protection plate, wherein the connecting piece comprises a support ring and a fixing ring, and a plurality of ceramic connecting piece accessories are arranged on the fixing ring at intervals; the protection plate comprises a bottom and a top extending from the bottom, the top is hollow, the bottom is supported by the connecting piece fitting and covers one end face of the fixing ring, and an inner circumferential face of the top extending from the bottom surrounds the outside of one end face, far away from the fixing ring, of the support ring. The embodiment of the invention has the technical effects that the protection plate is added in the exposed connecting piece structure for protection, and can protect the exposed connecting piece structure from being splashed by substances formed in the sputtering coating process of the target material, so that the connecting piece is prevented from being damaged, and the service life of the connecting piece is prolonged. Meanwhile, substances splashed on the protection plate are easily cleaned, so that the utilization rate of the connecting piece and the protection plate is improved, and the production cost is greatly reduced.
Description
Technical field
The present invention relates to display processing technique field more particularly to a kind of target devices.
Background technique
Thin film transistor liquid crystal display screen (TFT-LCD) is by thin film transistor (TFT) (TFT) array substrate and color film (CF) substrate
Box is formed.Wherein, it during CF substrate manufacture, needs to sink on CF substrate by the methods of magnetron sputtering or evaporation coating
One layer of indium tin oxide (ITO) film of product.Ito thin film has excellent electric conductivity and visible light transmittance, is a kind of important
Magnetron sputtering technique is usually used at present to prepare the ito thin film on CF substrate in transparent conductive film.Magnetron sputtering technique preparation
The principle of ito thin film is to realize plasma discharge under vacuum conditions, utilizes the movement of electromagnetic field control charged particle, bombardment
ITO target, ITO target atom are knocked away, and are attached on CF substrate, thus film required for being formed on CF substrate.So
And during magnetic control spattering target coated basal plate, the substance formed in sputtering process is easy to splash down the connection in target bottom
On part, the structure of connector is destroyed, the service life of connector is reduced, sharp rises so as to cause production cost.ITO target simultaneously
Polyether-ether-ketone (peek) accessory exposure on the connector of material bottom end is easy to be shocked by electricity and be burned out in air, is burned out
Connector accessory is easy to cause production equipment cancel closedown, and work can just be restarted by needing replacing new connector accessory, makes
At the waste of capacity loss and time, manpower, material etc., the shipment yield of product has been greatly affected.
Summary of the invention
The embodiment of the present invention provides a kind of target device that can extend service life of equipment.
The embodiment of the invention provides a kind of target device, which is provided with connector and protective plate, the connector
Including support ring and fixed ring, the support ring is placed within the fixed ring, and multiple potteries are equipped at intervals in the fixed ring
The connector accessory of porcelain；The protective plate includes bottom and the top extended from the bottom, and the top is in hollow
Shape, the bottom is by the connector fitting supports and is covered in an end face of the fixed ring, and the top is from the bottom
The inner peripheral surface of extension be surrounded on the support ring far from an end face of the fixed ring outside.
The embodiment of the present invention has technical effect that, be added in the exposed connecting-piece structure in target bottom protective plate into
Row protection, protective plate can protect exposed connecting-piece structure, and the substance formed when avoiding it by target as sputter plated film splashes
It falls on, connector is prevented to be destroyed, to extend the service life of connector.The substance splashed down on protective plate is easy cleaned
Fall, the protective plate cleaned up can come into operation again, to improve the utilization rate of connector and protective plate, substantially reduce life
Produce cost.The protective plate can also surround connector accessory, the exposure of connector accessory be avoided in air, to avoid target
It is directly contacted when target device discharges during vacuum coating with the aerial connector accessory of exposure and generates arcing,
Cause product to generate ill effect, reduces product turnout yield.Meanwhile by the connector accessory polyether-ether-ketone material of target device
It is changed to refractory ceramics material, the connector accessory after replacement will not be because of the point discharge that generates when target device vacuum coating
And arcing is generated, it prevents the connector accessory to be electrically shocked and burns, reduce the connector being burned out in production process by replacement
Accessory and the waste for causing time, manpower, material etc., improve product turnout yield.
Detailed description of the invention
Technical solution in order to illustrate the embodiments of the present invention more clearly, below will be to needed in embodiment description
Attached drawing is briefly described, it should be apparent that, drawings in the following description are some embodiments of the invention, general for this field
For logical technical staff, without creative efforts, it is also possible to obtain other drawings based on these drawings.
Fig. 1 is a kind of stereoscopic schematic diagram of the first embodiment of target device.
Fig. 2 is a kind of stereoscopic schematic diagram of the second embodiment of target device.
Fig. 3 is that label schematic diagram is guided in a kind of installation of the second embodiment protective plate of target device.
Fig. 4 is a kind of connector stereoscopic schematic diagram of the second embodiment of target device.
Fig. 5 is a kind of protective plate stereoscopic schematic diagram of target device.
Specific embodiment
Following will be combined with the drawings in the embodiments of the present invention, and technical solution in the embodiment of the present invention carries out clear, complete
Site preparation description, it is clear that described embodiments are some of the embodiments of the present invention, instead of all the embodiments.Based on this hair
Embodiment in bright, every other implementation obtained by those of ordinary skill in the art without making creative efforts
Example, shall fall within the protection scope of the present invention.
It should be appreciated that ought use in this specification and in the appended claims, term " includes " and "comprising" instruction
Described feature, entirety, step, operation, the presence of element and/or component, but one or more of the other feature, whole is not precluded
Body, step, operation, the presence or addition of element, component and/or its set.
It is also understood that mesh of the term used in this description of the invention merely for the sake of description specific embodiment
And be not intended to limit the present invention.As description of the invention and it is used in the attached claims, unless on
Other situations are hereafter clearly indicated, otherwise " one " of singular, "one" and "the" are intended to include plural form.
Fig. 1 is please referred to, is a kind of stereoscopic schematic diagram of the first embodiment of target device.Target device 100 is provided with
Connector 12, protective plate 13 and target 11.
Connector 12 includes motor layer 121, support ring 122 and fixed ring 123.Connector 12 is method in the present embodiment
It is blue.One end of connector 12 is fixedly connected with one end of target 11 and supports target 11.Fixed ring 123 is sheathed on support ring 122
Except, motor layer 121 is placed in 122 top of support ring.Motor layer 121 is provided with a motor, control support when which works
Ring 122 rotates, and the fixed ring 123 is fixed.The connector accessory 1231 of multiple ceramics is equipped at intervals in fixed ring 123.Even
A variety of connection types can be used with being fixedly connected for fixed ring in fitting accessory 1231, such as can be used and be screwed, be welded and fixed,
It is pivotally connected fixed etc..In the present embodiment, connector accessory 1231 is fixed using threaded connection.In some possible embodiment, even
Fitting accessory 1231 is in hollow cylinder shape, and in some other feasible embodiments, connector accessory 1231 can be hollow rib
Column, hollow, rectangular shape etc..Connector accessory uses polyether-ether-ketone material in the prior art, since polyether-ether-ketone connector is matched
Part is easy point discharge under high voltage condition in target vacuum coating Shi Yinqi good insulation properties and generates arcing, thus
Cause polyether-ether-ketone accessory to be electrically shocked to burn.In the present embodiment, which uses ceramic material resistant to high temperature, should
Ceramic fitting generates arcing due to will not be under high voltage condition when target vacuum coating, will not due to electric shock effect by
It burns.
Protective plate 13 includes bottom 132 and the top 131 extended from the bottom 132, which is in hollow circle
Bar shape, the bottom 132 are supported by the connector accessory 1231 and are covered in an end face of fixed ring 123, which certainly should
Bottom 132 extend inner peripheral surface be surrounded on the support ring 122 far from an end face of fixed ring 123 outside.The connector accessory
1231 are used to support the bottom 132, so that preventing protective plate 13 from directly contacting with fixed ring 123 generates electrostatic, while avoiding preventing
Backplate 13 is driven when rotating situations such as with frictional force is generated when 123 relative motion of fixed ring by target 11.Preferably, the bottom
132 are covered in the size of an end face of fixed ring 123 and the size of an end face of fixed ring 123 matches.Certainly should at the top 131
The size and the size phase of the outer circumference surface of the support ring 122 far from the fixed ring 122 for the inner peripheral surface that bottom 132 extends
Match.The protective plate 13 is used for for preventing the substance sputtered when 100 vacuum coating of target device from splashing down in the connector 12
Outside and fixed ring 123 of the ballistic support ring 122 far from fixed ring 123 are close to an end face of target.
Target 11 is in hollow cylinder shape, is set in except connector motor layer 121, one end of the target 11 is placed on company
In fitting support ring 122, the material which uses specifically needs the film classification of plated film to determine according to substrate.For example,
It in the present embodiment, needs to plate ito thin film on CF substrate, which uses ITO target.In the present embodiment, which has
2.5 meters of height, 21 millimeters thicks.Motor layer 121 on connector is equipped with a motor, and control support ring 122 rotates when which works,
One end of the target 11, which is fixed in support ring 122 and is driven by support ring 122, to rotate.Therefore, the target 11 and support ring 122
Coaxial rotating, and keep opposing stationary, which remain stationary state.
In the above-described embodiments, protective plate is added in the exposed connecting-piece structure in target bottom to be protected, prevents
Backplate can protect exposed connecting-piece structure, and the substance formed when avoiding it by target as sputter plated film splashes to, and prevent
Connector is destroyed, to extend the service life of connector.The substance splashed down on protective plate is easy to be cleaned out, and cleaning is dry
Net protective plate can come into operation again, to improve the utilization rate of connector and protective plate, substantially reduce production cost.It should
Protective plate can also surround connector accessory, the exposure of connector accessory be avoided in air, to avoid target vacuum coating
It is directly contacted when target device discharges in the process with the aerial connector accessory of exposure and generates arcing, lead to product
Ill effect is generated, product turnout yield is reduced.Meanwhile by the 1231 polyether-ether-ketone material of connector accessory in target device 100
Matter is replaced with ceramic material resistant to high temperature, and replacement rear connectors accessory will not be burnt in target vacuum coating by electric shock effect
It ruins, to cause time, manpower, material etc. because of the connector accessory that replacement is burned out during reducing target vacuum coating
Waste improves product turnout yield.
Fig. 2 is please referred to, is a kind of stereoscopic schematic diagram of the second embodiment of target device.The present embodiment two and embodiment
One difference is that multiple installations are additionally provided in the fixed ring 123 of connector 12 guides label 1232, which guides label
1232 are set between two neighboring connector accessory 1231.The first component a and second component b of the protective plate 13 are in any peace
Dress guides at label 1232 and is connected through a screw thread fixation, and two will form between first component a and second component b are inevitable
Corresponding gap c, gap c do not influence the film-plating process of target device in 5-10 millimeters of range.Referred to by installation
1232 installation protective plate 13 of tendering note can ensure that gap c not at connector accessory 1231, so that it is guaranteed that the connector accessory
1231 are covered by the bottom 132, which is not exposed in air, to avoid target vacuum coating process
It is directly contacted when middle device discharges with the aerial connector accessory 1231 of exposure and generates arcing, product is caused to generate
Ill effect reduces product turnout yield.
Please refer to Fig. 3, a kind of installation guide label schematic diagram of the protective plate of the second embodiment of target device.
In the present embodiment two, the connector accessory 1231 in fixed ring 123 is replaced with by original polyether-ether-ketone material
Ceramic material resistant to high temperature, and be additionally provided with multiple installations in fixed ring 123 and guide label 1232, which guides label
1232 are set between two neighboring connector accessory 1231.The protective plate 13 includes bottom 132 and prolongs from the bottom 132
The top 131 of stretching, the top 131 are in hollow cylinder shape, which is used to be covered in an end face of fixed ring 123,
Therefore, the shape, size of the bottom 132 and an end face of fixed ring 123 match；The top 131 extends from the bottom 132
Inner peripheral surface is for surrounding the outer circumference surface of the support ring 122 far from the fixed ring 122, therefore, the shape at the top 131, greatly
It is small to match with support ring 122 far from the outer circumference surface of fixed ring 122.The protective plate 13 is for preventing 100 vacuum of target device
The substance sputtered when plated film splashes down on the connector 12, the outside for ballistic support ring 122 far from fixed ring 123 and solid
Determine an end face of the ring 123 close to target.
The protective plate 13 includes symmetrically arranged first component a and second component b, in the present embodiment, the protective plate 13
First component a and second component b is guided at label 1232 in any installation and is connected through a screw thread fixation, first component a and second
Two will form between component b inevitable corresponding gap c, gap c are not influenced in 5-10 millimeters of range
The film-plating process of target device.Guiding label 1232 to install protective plate 13 by installation can ensure that gap c does not match in connector
It at part 1231, is covered so that it is guaranteed that the connector accessory 1231 is surrounded by the bottom 132, which will not expose
In air, to avoid straight with the aerial connector accessory 1231 of exposure when device discharges during target vacuum coating
It contacts and generates arcing, product is caused to generate ill effect, reduce product turnout yield.
Please refer to Fig. 4, a kind of connector stereoscopic schematic diagram of the second embodiment of target device.The connector 12 includes electricity
Machine layer 121, support ring 122 and fixed ring 123.Fixed ring 123 is sheathed on except support ring 122, and motor layer 121 is placed in branch
122 top of pushing out ring.Motor layer 121 is provided with a motor, and the connector accessory of multiple ceramics is equipped at intervals in fixed ring 123
1231.The connector accessory 1231 uses ceramic material resistant to high temperature, height when which will not be because of target vacuum coating
Arcing is generated under voltage conditions, will not be burned out because of electric shock effect.The connector accessory 1231 is used to support this
Bottom 132 to prevent protective plate 13 and fixed ring 123 from generating electrostatic when directly contacting, while avoiding protective plate 13 by target
Situations such as when 11 drive rotation with frictional force is generated when 123 relative motion of fixed ring.The fixed ring 123 is additionally provided with multiple installations
Label 1232 is guided, which guides label 1232 to be set between two neighboring connector accessory 1231.The protective plate 13
First component a and second component b is guided at label 1232 in any installation to be started to install, therefore, first component a and second
The two corresponding gaps formed between part b are not at connector accessory 1231, so that it is guaranteed that 1231 quilt of connector accessory
The bottom 132 covering, which is not exposed in air, to avoid device during target vacuum coating
It is directly contacted when electric discharge with the aerial connector accessory 1231 of exposure and generates arcing, product is caused to generate bad effect
It answers, reduces product turnout yield.
Please refer to Fig. 5, a kind of protective plate stereoscopic schematic diagram of target device.The protective plate 13 includes symmetrically arranged first
Component a and second component b, first component a include the first bottom 1321 and the first top 1311, and second component b includes the
The bottom 132 is formed on two bottoms 1322 and the second top 1312, first bottom 1321 and the second bottom 1322, first top
1312 form the top 131 at the top of 1311 and second.The top 131 is in hollow cylinder shape, and the bottom 132 is solid for being covered in
Determine on an end face of ring 123, therefore, an end face of the shape of the bottom 132, size and fixed ring 123 matches；The top
131 are used to surround the outer circumference surface of the support ring 122 far from the fixed ring 122 from the inner peripheral surface that the bottom 132 extends, because
This, shape, size and the support ring 122 at the top 131 match far from the outer circumference surface of fixed ring 122.The protective plate 13 is used
In preventing the substance sputtered when 100 vacuum coating of target device from splashing down on the connector 12, far for ballistic support ring 122
Outside and fixed ring 123 from fixed ring 123 is close to an end face of target.The first component a and second component b of the protective plate 13
Between can be connected and fixed using various ways, in some possible embodiment, spiral shell can be used in first component a and second component b
Line is fixedly connected, and in some other feasible embodiments, be can be used and is welded and fixed, is pivotally connected fixation.In the present embodiment, first
Component a and second component b forms two inevitable corresponding gap c after being threadably secured connection.Gap c is in 5-10
The film-plating process of target device is not influenced when the range of millimeter.
In above-described embodiment, protective plate is added in the exposed connecting-piece structure in target bottom and is protected, protects
Plate can protect exposed connecting-piece structure, and the substance formed when avoiding it by target as sputter plated film splashes to, the company of preventing
Fitting is destroyed, to extend the service life of connector.The substance splashed down on protective plate is easy to be cleaned out, and cleans up
Protective plate can come into operation again, to improve the utilization rate of connector and protective plate, substantially reduce production cost.This is anti-
Backplate can also surround connector accessory, the exposure of connector accessory be avoided in air, to avoid target vacuum coating
It is directly contacted when target device discharges in journey with the aerial connector accessory of exposure and generates arcing, product is caused to produce
Raw ill effect, reduces product turnout yield.Meanwhile by the connector accessory 1231 in target device 100 by original polyethers
Ether ketone material is replaced with ceramic material resistant to high temperature, since polyether-ether-ketone connector accessory is in target vacuum coating because its is good
Good insulating properties is easy point discharge under high voltage condition and generates arcing, is electrically shocked burning so as to cause polyether-ether-ketone accessory
It ruins.The connector accessory 1231 after replacement uses ceramic material resistant to high temperature, which will not be because of target
Arcing is generated under high voltage condition when material vacuum coating, will not be burned out because of electric shock effect.It is existing to solve
There is connector accessory exposure in technology to be easy to be electrically shocked the problem of burning in air, the connector being burned out by replacement is avoided to match
Part and the waste for causing in film-plating process time, manpower, material etc., improve product turnout yield.
In some possible embodiment, it can be provided with multiple installations in the fixed ring 123 of connector 12 and guide label
1232, which guides label 1232 to be set between two neighboring connector accessory 1231.The first component a of the protective plate 13
It is guided at label 1232 with second component b in any installation and is connected through a screw thread fixation, between first component a and second component b
Two for will form inevitable corresponding gap c, gap c do not influence target device in 5-10 millimeters of range
Film-plating process.By installation guide label 1232 install protective plate 13 can ensure that gap c not at connector accessory 1231, from
And ensure that the connector accessory 1231 is surrounded covering by the bottom 132 completely, which is not exposed to air
In, to avoid directly contacting when device discharges during target vacuum coating with the aerial connector accessory 1231 of exposure
And arcing is generated, cause product to generate ill effect, reduces product turnout yield.
The above description is merely a specific embodiment, but scope of protection of the present invention is not limited thereto, any
Those familiar with the art in the technical scope disclosed by the present invention, can readily occur in various equivalent modifications or replace
It changes, these modifications or substitutions should be covered by the protection scope of the present invention.Therefore, protection scope of the present invention should be with right
It is required that protection scope subject to.
Claims (10)
1. a kind of target device, which is characterized in that described device includes:
Connector, the connector include support ring and fixed ring, and the support ring is placed within the fixed ring, described solid
Determine the connector accessory that multiple ceramics are equipped at intervals on ring；
Protective plate, the protective plate include bottom and the top extended from the bottom, and the top is in hollow form, institute
Bottom is stated by the connector fitting supports and is covered in an end face of the fixed ring, the top extends from the bottom
Inner peripheral surface be surrounded on the support ring far from an end face of the fixed ring outside.
2. target device as described in claim 1, which is characterized in that the protective plate include the symmetrically arranged first component and
Second component, the first component include the first bottom and the first top, and the second component includes the second bottom and the second top
The bottom is formed on portion, first bottom and second bottom, at the top of first top and described second described in formation
Top.
3. target device as claimed in claim 2, which is characterized in that formed between the first component and the second component
Two corresponding gaps.
4. target device as described in claim 1, which is characterized in that the bottom is covered in an end face of the fixed ring
Size and the size of an end face of the fixed ring match.
5. target device as described in claim 1, which is characterized in that the inner peripheral surface that the top extends from the bottom
The size of outer circumference surface of the size with the support ring far from the fixed ring matches.
6. target device as described in claim 1, which is characterized in that the fixed ring is equipped with multiple installations and guides label,
The installation guides label to be set between two neighboring connector accessory.
7. target device as described in claim 1, which is characterized in that the connector accessory is ceramic material resistant to high temperature.
8. target device as described in claim 1, which is characterized in that the connector further includes motor layer, the motor layer
Equipped with motor, the motor layer is placed on the support ring and the support ring is driven to rotate.
9. target device as claimed in claim 8, which is characterized in that target is placed in the support ring, the target set
Except the motor layer.
10. target device as claimed in claim 9, which is characterized in that the fixed ring is fixed.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201611237980.2A CN106683988B (en) | 2016-12-28 | 2016-12-28 | Target device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201611237980.2A CN106683988B (en) | 2016-12-28 | 2016-12-28 | Target device |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN106683988A CN106683988A (en) | 2017-05-17 |
| CN106683988B true CN106683988B (en) | 2019-05-24 |
Family
ID=58872911
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201611237980.2A Active CN106683988B (en) | 2016-12-28 | 2016-12-28 | Target device |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN106683988B (en) |
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| CN103361612A (en) * | 2012-04-05 | 2013-10-23 | 鸿富锦精密工业（深圳）有限公司 | Cylindrical magnetron sputtering target |
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| CN103602952A (en) * | 2013-11-13 | 2014-02-26 | 上海华力微电子有限公司 | Vacuum sputtering device |
| CN205046193U (en) * | 2015-10-15 | 2016-02-24 | 广东耐信镀膜科技有限公司 | Novel cyclic annular target mechanism |
| CN105755437A (en) * | 2014-12-16 | 2016-07-13 | 宁波江丰电子材料股份有限公司 | Target assembly structure and magnetron sputtering system |
Family Cites Families (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| MY180359A (en) * | 2014-01-21 | 2020-11-28 | Sumitomo Chemical Co | Sputtering target |
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2016
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN2280717Y (en) * | 1996-08-27 | 1998-05-06 | 深圳市创益科技发展有限公司 | Flat magnetic-control sputter target board of transparent conductive film |
| CN103422067A (en) * | 2007-06-18 | 2013-12-04 | 应用材料公司 | Sputtering target having increased life and sputtering uniformity |
| CN102265376A (en) * | 2008-10-24 | 2011-11-30 | 应用材料股份有限公司 | Rotatable sputtering target holder, rotatable sputtering target, coating device, method of manufacturing rotatable sputtering target, target holder connecting device, and rotatable sputtering target holder to be used in sputtering equipment Method of Attaching Device to Target Holder Support |
| CN103361612A (en) * | 2012-04-05 | 2013-10-23 | 鸿富锦精密工业（深圳）有限公司 | Cylindrical magnetron sputtering target |
| CN103602952A (en) * | 2013-11-13 | 2014-02-26 | 上海华力微电子有限公司 | Vacuum sputtering device |
| CN105755437A (en) * | 2014-12-16 | 2016-07-13 | 宁波江丰电子材料股份有限公司 | Target assembly structure and magnetron sputtering system |
| CN205046193U (en) * | 2015-10-15 | 2016-02-24 | 广东耐信镀膜科技有限公司 | Novel cyclic annular target mechanism |
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| CN106683988A (en) | 2017-05-17 |
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