CN106658996A - Method for achieving circuit on-off switching and printed circuit board - Google Patents
Method for achieving circuit on-off switching and printed circuit board Download PDFInfo
- Publication number
- CN106658996A CN106658996A CN201611179583.4A CN201611179583A CN106658996A CN 106658996 A CN106658996 A CN 106658996A CN 201611179583 A CN201611179583 A CN 201611179583A CN 106658996 A CN106658996 A CN 106658996A
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- Prior art keywords
- pad
- break
- pcb
- switching construction
- solder
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Classifications
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
- H05K3/4007—Surface contacts, e.g. bumps
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/11—Printed elements for providing electric connections to or between printed circuits
- H05K1/111—Pads for surface mounting, e.g. lay-out
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09209—Shape and layout details of conductors
- H05K2201/09372—Pads and lands
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- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Electric Connection Of Electric Components To Printed Circuits (AREA)
Abstract
The invention discloses a method for achieving circuit on-off switching and a printed circuit board. The method is applied to the printed circuit board. The printed circuit board comprises a substrate and a solder mask layer. The method comprises the steps as follows: at least one on-off switching structure is arranged on the substrate and comprises a first bonding pad and a second bonding pad which are connected with different PCB traces respectively; the second bonding pad is annular; at least one part of the first bonding pad is located in an annular space of the second bonding pad and a gap is formed between the part of the first bonding pad and the second boning pad; a gap through which the PCB trace connected with the first bonding pad penetrates is formed in the second bonding pad; the solder mask layer covers the substrate and a window is formed in the area, corresponding to the on-off switching structure, of the solder mask layer; the first bonding pad and the second bonding pad are connected by adopting soldering to achieve on of a circuit; the first bonding pad and the second bonding pad are kept in a disconnected state to achieve off of the circuit. Therefore, circuit on-off switching is achieved in a convenient and flexible manner at various stages of manufacturing the printed circuit board and the product cost is reduced.
Description
Technical field
The present invention relates to electronic technology field, especially relates to a kind of method for realizing that connecting and disconnecting of the circuit switches electric with printing
Road plate.
Background technology
With the lightening and high densification development trend of smart electronicses product, smart electronicses product is particularly in smart mobile phone
Components' placement density it is increasing.Meanwhile, the development and maturation with technical scheme, smart electronicses product is particularly intelligence
Mobile phone is more and more sensitive to cost.
Smart electronicses product needs the mechanism of reserved substantial amounts of achievable connecting and disconnecting of the circuit switching, to ensure in the design phase
In follow-up hardware debugging process, verifying and debugging of the signal in circuit under various break-make assembled states.Set in current circuit
In meter, mainly realize that connecting and disconnecting of the circuit switches using 0 Europe resistance, specially：In printed circuit board (PCB) (Printed Circuit
Board, PCB) on reserve and conventional, electric-resistance identical pad structure, mount 0 Europe resistance and realize the conducting of circuit, remove 0 Europe electricity
The cut-out of circuit is realized in resistance.
It is above-mentioned to utilize 0 Europe resistance to realize the method that connecting and disconnecting of the circuit switches, there is problems with：
1st, intelligent electronic device circuit is complicated, needs the network of debugging numerous, and this results in needs on a printed circuit
Substantial amounts of 0 Europe resistance is mounted, BOM (Bill ofMaterials, BOM) cost is improve；
2nd, after the completion of circuit debugging, after the break-make situation that interlock circuit needs determines, 0 Europe resistance has lost the meaning of presence
Justice；Now, if modification printed circuit board (PCB), needs the pad for removing 0 Europe resistance, it would be desirable to which the circuit of connection is connected with cabling,
Deletion needs the cabling of dead circuit.This mode increased workload, cause product development cycle to lengthen, and increased research and development
Cost；
3rd, in current intelligent electronic device, 0 Europe resistance great majority are encapsulated as 0201 encapsulation, in product test and debugging
Stage, after 0 Europe resistance attachment, can be relatively difficult with various measuring instrument measurement signals on the leg of 0 Europe resistance.
In sum, the scheme that connecting and disconnecting of the circuit switches is realized in the production phase of printed circuit board (PCB) in prior art, not enough
It is convenient, flexible, it is unfavorable for the reduction of product cost.
The content of the invention
The main object of the present invention is to provide a kind of printed circuit board (PCB) for realizing the method that connecting and disconnecting of the circuit switches, it is intended to side
Just flexible mode realizes that connecting and disconnecting of the circuit switches in the production phase of printed circuit board (PCB), reduces product cost.
To achieve these objectives, the present invention proposes a kind of method for realizing connecting and disconnecting of the circuit switching, is applied to printed circuit board (PCB), institute
Printed circuit board (PCB) is stated including substrate and solder mask, be the method comprising the steps of：
At least one break-make switching construction is set on the substrate；The break-make switching construction includes connecting different respectively
PCB trace the first pad and the second pad, in a ring, first pad is at least partially disposed at described second pad
There is a gap, second pad is provided with for connection institute in the annular space of the second pad and between second pad
State the breach that the PCB trace of the first pad is passed through；
The solder mask is covered on the substrate, and the region of the break-make switching construction is corresponded on the solder mask
Open up window；
Connect first pad and second pad using scolding tin, to realize circuit communication；Keep first weldering
Disk and second pad are in notconnect state, to realize that circuit disconnects.
Alternatively, the step of utilization scolding tin connects first pad and second pad includes：
Printing net is covered on the printed circuit board, and by break-make described in default through-hole alignment on the printing net
Switching construction；
The brush solder(ing) paste on the printing net, so that the solder(ing) paste flows into the through hole and is covered in the break-make switching
In structure；
Solder(ing) paste to being covered on the break-make switching construction is heated, and connection described first is formed after cooled and solidified
The scolding tin of pad and second pad.
Alternatively, the step of utilization scolding tin connects first pad and second pad includes：
Solder(ing) paste is placed on the break-make switching construction；
The solder(ing) paste is heated, the weldering for connecting first pad and second pad is formed after cooled and solidified
Tin.
Alternatively, it is described to include the step of heat to the solder(ing) paste：
The solder(ing) paste is heated using heat gun.
Alternatively, the step of utilization scolding tin connects first pad and second pad includes：
Solder stick is melted on the break-make switching construction by electric iron, connection first weldering is formed after cooled and solidified
The scolding tin of disk and second pad.
Alternatively, the holding first pad and second pad include the step of being in notconnect state：
The position of the correspondence break-make switching construction not opens up through hole on printing net, or, block the printing net
Above the through hole of the default correspondence break-make switching construction, disconnected to keep first pad and second pad to be in
State.
Alternatively, the holding first pad and second pad include the step of being in notconnect state：
When first pad and second pad are linked together by scolding tin, the company of the scolding tin is disconnected
Connect, to keep first pad and second pad to be in notconnect state.
Alternatively, the step of connection of the disconnection scolding tin includes：
Scolding tin described in heating and melting, and siphon away the scolding tin of thawing.
Alternatively, include the step of scolding tin described in the heating and melting：
Using heat gun or scolding tin described in electric iron heating and melting.
Alternatively, it is described siphon away thawing scolding tin the step of include：
The scolding tin of thawing is siphoned away using tin sucking gun or suction tin band.
Alternatively, the gap between first pad and second pad is equal to second pad and described first
/ 2nd of the difference of the appearance and size of pad.
Alternatively, the gap between first pad and second pad is 0.05mm-0.1mm.
Alternatively, appearance and size of the size of the window more than second pad.
Alternatively, the size of window 0.2mm-1mm bigger than the appearance and size of second pad.
Alternatively, the size for being smaller in size than the welding resistance window of the through hole.
Alternatively, appearance and size of the size of the through hole more than second pad.
Alternatively, the size of through hole 0.1mm-0.5mm bigger than the appearance and size of second pad.
Alternatively, first pad and second pad is generally circular in shape.
The present invention proposes a kind of printed circuit board (PCB) simultaneously, and the printed circuit board (PCB) includes substrate and the resistance being covered on substrate
Layer, the substrate is provided with least one break-make switching construction, the area of the correspondence break-make switching construction on the solder mask
Domain offers window, and the break-make switching construction includes connecting first pad and the second pad of different PCB traces, institute respectively
State the second pad in a ring, first pad is at least partially disposed in the annular space of second pad and with described second
There is a gap, second pad is provided with the breach passed through for the PCB trace of connection first pad between pad.
Alternatively, also there is the scolding tin for connecting first pad and second pad on the substrate.
A kind of method for realizing connecting and disconnecting of the circuit switching that the embodiment of the present invention is provided, is cut by arranging break-make on substrate
Structure is changed, the break-make switching construction includes connecting different PCB traces respectively and the first non-touching pad and the second weldering
Disk, connects the first pad and the second pad to realize circuit communication using scolding tin, keeps the first pad and the second pad in non-
Connection status is disconnected realizing circuit, is realized and is realized electricity in each for making printed circuit board (PCB) in stage in convenient, flexible mode
Road break-make switching, reduces product cost.Using the technical scheme of the embodiment of the present invention, have the advantage that：
1) the SMT paster works in the break-make switching construction on printed circuit board (PCB) and existing PCB design, processing and later stage
Skill is completely compatible, will not increase extra processing procedure cost；
2) the break-make switching construction can completely replace 0 Europe resistance, reduce BOM costs；
3) after the completion of circuit debugging, for the debug circuit for needing to change break-make relation in debugging, without the need for changing circuit
PCB design, need to only change printing net or only change printing net perforate, realize that process is convenient, flexible, save the research and development time and open
Send out cost；
4) no matter the break-make switching construction can serve as circuit test access point use in connection and off-state, semaphore
Survey simple and convenient reliability.
Description of the drawings
Fig. 1 is the partial structural diagram of the printed circuit board (PCB) of first embodiment of the invention；
Fig. 2 is the flow chart that second embodiment of the invention realizes the method that connecting and disconnecting of the circuit switches；
Fig. 3 is the partial structural diagram of the printing net in the embodiment of the present invention；
Fig. 4 is the tool of the step of connecting the first pad and the second pad using scolding tin by printing net in the embodiment of the present invention
Body flow chart.
The realization of the object of the invention, functional characteristics and advantage will be described further referring to the drawings in conjunction with the embodiments.
Specific embodiment
It should be appreciated that specific embodiment described herein is not intended to limit the present invention only to explain the present invention.
Embodiments of the invention are described below in detail, the example of the embodiment is shown in the drawings, wherein from start to finish
Same or similar label represents same or similar element or the element with same or like function.Below with reference to attached
The embodiment of figure description is exemplary, is only used for explaining the present invention, and is not construed as limiting the claims.
Those skilled in the art of the present technique are appreciated that unless expressly stated, singulative " " used herein, "
It is individual ", " described " and " being somebody's turn to do " may also comprise plural form.It is to be further understood that arranging used in the specification of the present invention
Diction " including " refers to there is the feature, integer, step, operation, element and/or component, but it is not excluded that existing or adding
One or more other features, integer, step, operation, element, component and/or their group.It should be understood that when we claim unit
Part is " connected " or during " coupled " to another element, and it can be directly connected or coupled to other elements, or can also exist
Intermediary element.Additionally, " connection " used herein or " coupling " can include wireless connection or wireless coupling.It is used herein to arrange
Diction "and/or" includes the one or more associated wholes or any cell of listing item and all combination.
Those skilled in the art of the present technique are appreciated that unless otherwise defined all terms used herein are (including technology art
Language and scientific terminology), with art of the present invention in those of ordinary skill general understanding identical meaning.Should also
It is understood by, those terms defined in such as general dictionary, it should be understood that with the context with prior art
The consistent meaning of meaning, and unless by specific definitions as here, will not otherwise use idealization or excessively formal implication
To explain.
Embodiment one
With reference to Fig. 1, the printed circuit board (PCB) of first embodiment of the invention is proposed, including substrate 10 and be covered on substrate 10
Solder mask 20, substrate 10 is provided with least one break-make switching construction 30, such as can arrange according to actual needs one, two or
The multiple break-make switching constructions 30 of person, and as needed layout is in place.Each break-make switching knot of correspondence on solder mask 20
The region of structure 30 offers a window 21, to expose at least part of break-make switching construction 30, preferably exposes whole break-make switching
Structure 30.
As shown in figure 1, break-make switching construction 30 includes connecting the first pad 31 of different PCB traces and the second weldering respectively
Disk 32, for example, the first pad 31 connects the PCB trace 41 of network 1, and the second pad 31 connects the PCB trace 42 of network 2.Second
In a ring, the first pad 31 is at least partially disposed in the annular space of the second pad 32 and has between the second pad 32 pad 32
There is a gap, the second pad 32 is provided with the breach passed through for the PCB trace 41 of the first pad 31 of connection, and described here lacks
Mouthful, it is thus understood that the insulated channel of the second pad 32 and the electric connection of PCB trace 41 for being connected the first pad 31 is prevented, it can be with
The physics breach of a reality being provided on the second pad 32, or the subregion on the second pad 32 cover
One layer insulating and the insulating gaps that formed.Now, the first pad 31 and the second pad 32 are in notconnect state, it is possible to achieve
The disconnection of interlock circuit.
In other embodiments, also have the scolding tin of the first pad 31 of connection and the second pad 32 (not shown on substrate 10
Go out), now, the first pad 31 and the second pad 31 are at connection status, it is possible to achieve the connection of interlock circuit.
In the present embodiment, the first pad 31 and the second pad 32 it is generally circular in shape, i.e., the first pad 31 is for a diameter of d's
Circular pad, the second pad 32 is the annular pad that external diameter is D, and the annulus that the first pad 31 is entirely located in the second pad 32 is empty
Interior, accordingly, the window 21 of correspondence break-make switching construction 30 is also rounded on solder mask 20.In fact, the first pad 31,
The shape of two pads 32 and window 21 can also be the regular geometric shapes such as ellipse, triangle, rectangle, polygon or other
Irregular geometry shape, and the first pad 31 can be with identical or different, the weldering of window 21 and first from the shape of the second pad 32
The shape of disk 31 and the second pad 32 can also identical or difference, the present invention do not limited this.
Gap between first pad 31 and the second pad 32 can set according to actual needs, preferably equal to the second pad
31 and first pad 32 appearance and size difference 1/2nd.In specific to the present embodiment, the first pad 31 and the second pad
The size of the gap c between 32 is defined by relational expression D-d=2c, wherein, according to surface mounting technology (Surface Mount
Technology, SMT) technique and printing net (being commonly called as steel mesh) thickness difference, c values can make corresponding adjustment.Existing
Under conditions of the printing net of process conditions and 1.0mm thickness, c takes 0.05mm-0.1mm, i.e. the first pad 31 and the second pad 32
Between gap be preferably 0.05mm-0.1mm.It should be appreciated that the size of gap c can also be according to other relational expression definition, this
Invention is not construed as limiting to this.
In the present embodiment, the size of the window 21 of correspondence break-make switching construction 30 is at least above the second pad on solder mask 20
32 interior ring size is preferably big as between the interior ring size (such as internal diameter) and appearance and size (such as external diameter) of the second pad 32
In the appearance and size of the second pad 32.Specific in the present embodiment, intended diameter is the circular window 21 of D+2a, melts for limiting
The scolding tin of change, prevents its stream to outside break-make switching construction 30, wherein, according to SMT techniques, the thickness of printing net and gap c
Difference, a values can make corresponding adjustment.Under conditions of the printing net of existing process condition and 1.0mm thickness, a takes
0.1mm-0.5mm, the i.e. size of preferred window 21 0.2mm-1mm bigger than the appearance and size of the second pad 31.
Break-make switching construction 30 on the printed circuit board (PCB) of the embodiment of the present invention, with existing PCB design, processing and
The SMT paster techniques in later stage are completely compatible, can pass through control scolding tin distribution on the substrate 10, that is, control scolding tin distribution or not
It is distributed in the region of break-make switching construction 30 to realize the selection of interlock circuit break-make, it is convenient to operation.
For example, when SMT pasters are carried out in the stage that designs and produces and volume production stage, can be logical by correspondence on control printing net
The opening of the through hole of disconnected switching construction 30 and closure realize the control of interlock circuit break-make realizing the distributed controll of scolding tin
System；And in the volume production stage, can also be by the determination information of final connecting and disconnecting of the circuit, it is final to match to reset printing net
Circuit arrange.Meanwhile, in the debugging stage, break-make switching construction 30 can function as signal testing point and use.
The printed circuit board (PCB) of the embodiment of the present invention, with advantages below：
1) the SMT pasters in the break-make switching construction 30 on printed circuit board (PCB) and existing PCB design, processing and later stage
Technique is completely compatible, will not increase extra processing procedure cost；
2) the break-make switching construction 30 can completely replace 0 Europe resistance, reduce BOM costs；
3) after the completion of circuit debugging, for the debug circuit for needing to change break-make relation in debugging, without the need for changing circuit
PCB design, need to only change printing net or only change printing net perforate, realize that process is convenient, flexible, save the research and development time and open
Send out cost；
4) no matter the break-make switching construction 30 can serve as circuit test access point use in connection and off-state, signal
Measure simple and convenient reliability.
Embodiment two
With reference to Fig. 2, the method that connecting and disconnecting of the circuit switches of realizing of second embodiment of the invention is proposed, methods described is applied to print
Printed circuit board, the printed circuit board (PCB) includes substrate and solder mask, the method comprising the steps of：
S11, at least one break-make switching construction is set on substrate, the break-make switching construction includes connecting different respectively
There is gap between first pad and the second pad, and the first pad and the second pad of PCB trace.
This step S11, arranges first at least one break-make switching construction on substrate, such as can arrange according to actual needs
One, two or more break-make switching constructions, and as needed layout is in place.
As shown in figure 1, break-make switching construction 30 includes connecting the first pad 31 of different PCB traces and the second weldering respectively
Disk 32, for example, the first pad 31 connects the PCB trace 41 of network 1, and the second pad 32 connects the PCB trace 42 of network 2.Second
In a ring, the first pad 31 is at least partially disposed in the annular space of the second pad 32 and has between the second pad 32 pad 32
There is a gap, the second pad 32 is provided with the breach passed through for the PCB trace 41 of the first pad 32 of connection, and described here lacks
Mouthful, it is thus understood that the insulated channel of the second pad 32 and the electric connection of PCB trace 41 for being connected the first pad 31 is prevented, it can be with
The physics breach of a reality being provided on the second pad 32, or the subregion on the second pad 32 cover
One layer insulating and the insulating gaps that formed.
In the present embodiment, the first pad 31 and the second pad 32 it is generally circular in shape, i.e., the first pad 31 is for a diameter of d's
Circular pad, the second pad 32 is the annular pad that external diameter is D, and the annulus that the first pad 31 is entirely located in the second pad 32 is empty
It is interior.In fact, the shape of the first pad 31, the second pad 32 and window 21 can also be ellipse, triangle, rectangle, many
The regular geometric shapes such as side shape or other irregular geometry shapes, and the first pad 31 can phase with the shape of the second pad 32
Same or different, the present invention is not limited this.
Gap between first pad 31 and the second pad 32 can set according to actual needs, preferably equal to the second pad
32 and first pad 31 appearance and size difference 1/2nd.I.e. in the present embodiment, the first pad 31 and the second pad 32 it
Between the size of gap c defined by relational expression D-d=2c, wherein, according to SMT techniques and printing net (being commonly called as steel mesh) thickness not
Together, c values can make corresponding adjustment.Under conditions of the printing net of existing process condition and 1.0mm thickness, c takes 0.05mm-
Gap between 0.1mm, i.e. the first pad 31 and the second pad 32 is preferably 0.05mm-0.1mm.It should be appreciated that gap c's is big
It is little this to be not construed as limiting according to other relational expression definition, the present invention.
S12, solder mask is covered on substrate, and the region of correspondence break-make switching construction opens up window on solder mask.
As shown in figure 1, in this step S12, can on the substrate 10 cover one layer of solder mask using techniques such as printing, sprayings
20, and the region of aforementioned each the break-make switching construction 30 of correspondence opens up a window 21 on solder mask 20, to expose at least
Part break-make switching construction 30, preferably exposes whole break-make switching construction 30.In the embodiment of the present invention, the pad of window 21 and first
31 as the second pad 32, also rounded, in fact, the shape of window 21 can also be ellipse, triangle, rectangle, many
The regular geometric shapes such as side shape or other irregular geometry shapes, and the shape of the pad 31 of window 21 and first and the second pad 32
Shape can be with identical or difference, and the present invention is not limited this
In the present embodiment, the size of the window 21 of correspondence break-make switching construction 30 is at least above the second pad on solder mask 20
32 interior ring size, as between the interior ring size and appearance and size of the second pad 32, preferably greater than the second pad 32 it is outer
Shape size.Specific in the present embodiment, intended diameter is the circular window 21 of D+2a, for limiting the scolding tin for melting, prevents it
Flow outside break-make switching construction 30, wherein, according to the difference of SMT techniques, the thickness of printing net and gap c, a values can be done
Go out corresponding adjustment.Under conditions of the printing net of existing process condition and 1.0mm thickness, a takes 0.1mm-0.5mm, i.e., preferably
The size of window 21 0.2mm-1mm bigger than the appearance and size of the second pad 32.
So far, printed circuit board (PCB) Preliminary design is completed.
S13, connect the first pad and the second pad using scolding tin, to realize circuit communication；Keep the first pad and second
Pad is in notconnect state, to realize that circuit disconnects.
In this step S13, the distribution on the substrate 10 of control scolding tin can be passed through, that is, control scolding tin distribution or be not distributed in
The region of break-make switching construction 30 is convenient to operation realizing the selection of interlock circuit break-make.
When SMT pasters are carried out in the stage that designs and produces and volume production stage, can be cut by controlling correspondence break-make on printing net
Change the opening of the through hole of structure 30 and close to realize the distributed controll of scolding tin, and then realize the control of interlock circuit break-make.
When being embodied as, the region of correspondence break-make switching construction arranges through hole 101 (such as Fig. 3 institutes first on printing net
Show), the printing net is typically made up of metal material such as stainless steel, naturally it is also possible to is other materials, is not limited thereto.It is optional
Ground, the size for being smaller in size than window 21 on solder mask 20 of through hole 101 to prevent scolding tin cross flow to solder mask 20, and is led to
The size in hole 101 is preferably greater than the appearance and size of the second pad 32.
In the present embodiment, a diameter of D+b is dug out in the region of correspondence break-make switching construction 30 on certain thickness stalloy
Through hole 101, the printing net of brush solder(ing) paste when carrying out SMT pasters as the printed circuit board (PCB).Wherein, b values by printing net thickness
Appearance and size D of degree, the gap c between the first pad 31 and the second pad 32 and the second pad 32 is determined, typically taken
0.1mm-0.5mm, the i.e. size of through hole 101 0.1mm-0.5mm preferably big than the appearance and size of the second pad 32.
When SMT pasters are carried out, realize that interlock circuit is connected if desired, then keep correspondence break-make switching knot on printing net
The through hole 101 of structure 30 is unimpeded；Realize that interlock circuit disconnects if desired, then block correspondence break-make switching construction 30 on printing net
Through hole 101, such as paste tight through hole with gummed paper.
As shown in figure 4, next, in SMT paster techniques, the first pad 31 and the are connected using scolding tin by printing net
Two pads 32 come realize interlock circuit connect, specifically include following steps：
S131, printing net is covered on a printed circuit, and by default through-hole alignment break-make switching knot on printing net
Structure.
Specifically, the printing net net shown in Fig. 3 is covered on the printed circuit board (PCB) shown in Fig. 1, and by through hole 101 and is led to
The position alignment of disconnected switching construction 30.
S132, on printing net brush solder(ing) paste, so as to solder(ing) paste is flowed into through hole and be covered on break-make switching construction.
Specifically, the brush solder(ing) paste on printing net, the scolding tin of paste will transmit through the stream of through hole 101 of printing net to printed circuit
On the corresponding pad of plate.When the corresponding circuit of break-make switching construction 30 needs connection, then break-make switching construction 30 is corresponding logical
Hole 101 keeps unimpeded, after brushing tin cream, the first pad 31 of break-make switching construction 30, the pad of the second pad 32 and the two it
Between gap, be all the solder(ing) paste for printing thickness of net by cladding thickness, and in the present embodiment, because the size of through hole 101 is D+
B, therefore solder(ing) paste has extended out the distance of b/2 to the second pad 32.After removing printing net, solder(ing) paste is retained on pad, according to normal
SMT chip mounter pasters in rule technique.
S133, the solder(ing) paste to being covered on break-make switching construction are heated, and connection first is formed after cooled and solidified and is welded
The scolding tin of disk and the second pad.
Specifically, after according to old process paster, the printed circuit board (PCB) after paster is put into reflow soldering stove heat, temperature
To after certain value, it is liquid solder that paste scolding tin will melt, because the restriction of solder mask 20 and the surface tension of liquid solder are made
With, and scolding tin and bonding pad material infiltration, therefore liquid solder is maintained at bond pad surface for tin sweat(ing) shape.Cut specific to the break-make of the present invention
Structure 30 is changed, because the first pad 31 and the second pad 32 are circular configuration, therefore is easy to holding tin sweat(ing) shape, two pads (31,
32) gap very little between and without solder mask isolation, adds the distance that the through hole on printing net has extended out b/2, causes tin amount to increase
Plus, therefore tin sweat(ing) will as entirety cover two pads (31, the gap 32) and between two pads, tin sweat(ing) diameter is between D and D
Between+2a.
Finally, printed circuit board (PCB) is taken out from reflow soldering furnace, liquid solder solidification, realizes the He of the first pad 31 after cooling
The electrical connection of the second pad 32, and then realize the connection of interlock circuit.
In the volume production stage, can also reset printing net to match most by the determination information of final connecting and disconnecting of the circuit
Whole circuit is arranged.For example, when needing the corresponding circuit of break-make switching construction to disconnect, then printing net is reset, in printing
The position of online correspondence break-make switching construction not opens up through hole 101, to keep the first pad 31 and the second pad 32 in non-
Connection status.
In the debugging stage, when no tin sweat(ing) on break-make switching construction 30, but need to connect break-make switching knot in the stage
During 30 corresponding circuit of structure, then connect first pad 31 and the second pad 32 of break-make switching construction 30 using scolding tin.Tool
Body can arrange scolding tin on break-make switching construction 30 in the following manner：
Alternatively, solder(ing) paste is placed on break-make switching construction 30, solder(ing) paste is heated, the company of being formed after cooled and solidified
Connect the scolding tin of the first pad 31 and the second pad 32.When heating to solder(ing) paste, can be by heat gun or other heaters
Have to heat solder(ing) paste, melt solder(ing) paste.
Alternatively, solder stick is melted on break-make switching construction 30 by electric iron, connection first is formed after cooled and solidified
The scolding tin of the pad 32 of pad 31 and second.
In the debugging stage, when having tin sweat(ing), i.e. the first pad 31 and the second pad 32 on break-make switching construction 30 weldering is passed through
Tin links together, but when needing to disconnect the break-make 30 corresponding circuit of switching construction in the stage, then disconnects the connection of scolding tin,
To keep the first pad 31 and the second pad 32 to be in notconnect state.Specifically, the heating tool such as wind blowing gun, electric iron first
Scolding tin on heating and melting break-make switching construction 30, then siphons away the scolding tin of thawing using instruments such as tin sucking gun, suction tin bands.Example
Such as, using the scolding tin for siphoning away thawing after the tin sweat(ing) on heat gun blowing break-make switching construction 30 with tin sucking gun, or, first in break-make
Cover on the tin sweat(ing) of switching construction 30 and inhale tin band, then inhale tin band with heat gun or electric iron heating, inhale tin band and then siphon away thawing
Scolding tin.
Below by way of instantiation, how detailed description designs and produces stage, debugging stage and amount in printed circuit board (PCB)
The product stage realizes the method that connecting and disconnecting of the circuit switches using the embodiment of the present invention：
Design and produce the stage：
(1) break-make switching construction is designed on a printed circuit：It is (minimum according to the technological parameter of designed printed circuit board (PCB)
Live width line-spacing), break-make switching construction 30 as shown in Figure 1 is designed, the break-make switching construction 30 includes first weldering of a diameter of d
Second pad 32 of disk 31 and a diameter of D, opens up a diameter of D+2a's in the region of the corresponding break-make switching construction 30 of solder mask 20
Window 21.A, d and D value is determined according to technological parameter.
(2) design and printing net：As shown in figure 3, the region of correspondence break-make switching construction opens up a diameter of D+b on printing net
For through hole 101, thickness, c values, the D values decision b value sizes according to printing net, the corresponding through hole of remaining pad on printed circuit board (PCB)
Size is routinely designed
(3) according to conventional design printed circuit board (PCB).
(4) printing net calibration：Needs are designed according to circuit debugging, when the corresponding circuit of break-make switching construction 30 needs to disconnect
When, block on printing net to should break-make switching construction 30 through hole 101 (such as pasting tight through hole with gummed paper)；When break-make switching is tied
The corresponding circuit of structure 30 need connection when, keep printing net on to should break-make switching construction 30 through hole 101 it is unimpeded.
(5) brush solder(ing) paste：Printing net shown in Fig. 3 is covered on the printed circuit board (PCB) shown in Fig. 1, after position alignment,
The brush solder(ing) paste on printing net, the stream of through hole 101 that the scolding tin of paste will transmit through on printing net arrives the corresponding pad of printed circuit board (PCB)
On.As the corresponding circuit of break-make switching construction 30 needs connection, then corresponding through hole 101 keeps unimpeded on printing net, brushes into weldering
After tin cream, cladding thickness is all the weldering for printing thickness of net by the first pad 31 and the second pad 32 and gap therebetween
Tin cream, and solder(ing) paste has extended out the distance of b/2 to the second pad 32.After removing printing net, solder(ing) paste is stayed on pad, according to normal
SMT chip mounter pasters in rule technique.
(6) reflow soldering：After according to old process paster, put the printed circuit board (PCB) after paster into reflow soldering furnace and add
Heat, after temperature to certain value, paste scolding tin will melt as liquid solder, the restriction and the surface of liquid solder due to solder mask 20
Tension force effect, and scolding tin and bonding pad material infiltration, therefore liquid solder is maintained at bond pad surface for tin sweat(ing) shape.Specific to the present invention's
Break-make switching construction, because the first pad 31 and the second pad 32 are circular configuration, it is easy to keep tin sweat(ing) shape, two pads (31,
32) gap very little between and isolate without solder mask 20, add the distance that the through hole 101 on printing net has extended out b/2, cause tin
Amount increases, therefore tin sweat(ing) will cover the first pad 31 and the second two pads 32 and gap therebetween, tin as entirety
Pearl diameter is between D and D+2a.
(7) paster is completed：Printed circuit board (PCB) is taken out from reflow soldering furnace, liquid solder solidification, realizes first after cooling
The electrical connection of the pad 32 of pad 31 and second, so as to realize the connection of interlock circuit.
The debugging stage：
If A, the corresponding circuit of break-make switching construction 30 are designing and producing stage design to disconnect, correspondence is logical on printing net
The through hole 101 of disconnected switching construction 30 will be blocked sternly, solder(ing) paste not had on break-make switching construction 30 and be covered, therefore the He of the first pad 31
Second pad 32 will not be connected by scolding tin.Two pads (31,32) can use as test point.
Now, if need to be by the corresponding circuit communication of break-make switching construction 30, in the first pad 31 and second liang of pad 32
It is upper to place after a certain amount of solder(ing) paste with blowing of heat gun, or with a certain amount of solder stick of electric iron thawing.Liquid solder solidifies
Afterwards, the electrical connection of the first pad 31 and the second pad 32 is realized, so as to realize the connection of interlock circuit.
If B, the corresponding circuit of break-make switching construction 30 are designing and producing stage design for connection, break-make switching construction 30
On the first pad 31 and the second pad 32 will be linked together by tin sweat(ing).The tin sweat(ing) can be used as test point.
Now, if need to be by the corresponding circuit communication of break-make switching construction 30, with blowing of the heat gun break-make switching construction
The scolding tin of thawing is siphoned away after tin sweat(ing) on 30 with tin sucking gun, or, cover on tin sweat(ing) and inhale tin band, added with heat gun or electric iron
Heat inhales tin band, inhales the scolding tin that tin band then siphons away thawing.So as to realize the electric cut-out of the first pad 31 and the second pad 32, finally
Realize the disconnection of interlock circuit.
The volume production stage：
After circuit determines, the break-make of the corresponding circuit of break-make switching construction 30 also determines.When connection is needed, to printing net
The through hole 101 of upper correspondence break-make switching construction 30 keeps unimpeded；When needing to disconnect, correspondence break-make switching knot on closure printing net
The through hole 101 (such as tight with gummed paper patch) of structure 30.This is, it is also possible to remake printing net to match the circuit after determining.
The method for realizing connecting and disconnecting of the circuit switching of the embodiment of the present invention is above in each rank for making printed circuit board (PCB)
The concrete application process of section.
The embodiment of the present invention realizes the method that connecting and disconnecting of the circuit switches, by arranging break-make switching construction 30 on the substrate 10,
The break-make switching construction 30 includes connecting different PCB traces and the first non-touching pad 31 and the second pad respectively
32, connect the first pad 31 and the second pad 32 to realize circuit communication using scolding tin, keep the first pad 31 and the second pad
32 realize that circuit disconnects in notconnect state, realize in convenient, flexible mode in each rank for making printed circuit board (PCB)
Duan Shixian connecting and disconnecting of the circuit switches, and reduces product cost.Using the technical scheme of the embodiment of the present invention, have the advantage that：
1) the SMT paster works in the break-make switching construction on printed circuit board (PCB) and existing PCB design, processing and later stage
Skill is completely compatible, will not increase extra processing procedure cost；
2) the break-make switching construction can completely replace 0 Europe resistance, reduce BOM costs；
3) after the completion of circuit debugging, for the debug circuit for needing to change break-make relation in debugging, without the need for changing circuit
PCB design, need to only change printing net or only change printing net perforate, realize that process is convenient, flexible, save the research and development time and open
Send out cost；
4) no matter the break-make switching construction can serve as circuit test access point use in connection and off-state, semaphore
Survey simple and convenient reliability.
The preferred embodiments of the present invention are the foregoing is only, the scope of the claims of the present invention, every utilization is not thereby limited
Equivalent structure or equivalent flow conversion that description of the invention and accompanying drawing content are made, or directly or indirectly it is used in other correlations
Technical field, be included within the scope of the present invention.
Claims (10)
1. it is a kind of to realize the method that connecting and disconnecting of the circuit switches, printed circuit board (PCB) is applied to, the printed circuit board (PCB) includes substrate and resistance
Layer, it is characterised in that comprise the following steps：
At least one break-make switching construction is set on the substrate；The break-make switching construction includes connecting different respectively
First pad and the second pad of PCB trace, in a ring, first pad is at least partially disposed at described to second pad
There is a gap, second pad is provided with described for connection in the annular space of two pads and between second pad
The breach that the PCB trace of the first pad is passed through；
The solder mask is covered on the substrate, and the region of the correspondence break-make switching construction opens up on the solder mask
Window；
Connect first pad and second pad using scolding tin, to realize circuit communication；Keep first pad and
Second pad is in notconnect state, to realize that circuit disconnects.
2. it is according to claim 1 to realize the method that connecting and disconnecting of the circuit switches, it is characterised in that the utilization scolding tin connects institute
The step of stating the first pad and second pad includes：
Printing net is covered on the printed circuit board, and break-make described in default through-hole alignment on the printing net is switched
Structure；
The brush solder(ing) paste on the printing net, so that the solder(ing) paste flows into the through hole and is covered in the break-make switching construction
On；
Solder(ing) paste to being covered on the break-make switching construction is heated, and connection first pad is formed after cooled and solidified
With the scolding tin of second pad.
3. it is according to claim 1 to realize the method that connecting and disconnecting of the circuit switches, it is characterised in that the utilization scolding tin connects institute
The step of stating the first pad and second pad includes：
Solder(ing) paste is placed on the break-make switching construction；
The solder(ing) paste is heated, the scolding tin for connecting first pad and second pad is formed after cooled and solidified.
4. it is according to claim 3 to realize the method that connecting and disconnecting of the circuit switches, it is characterised in that described that the solder(ing) paste is entered
The step of row heating, includes：
The solder(ing) paste is heated using heat gun.
5. it is according to claim 1 to realize the method that connecting and disconnecting of the circuit switches, it is characterised in that the utilization scolding tin connects institute
The step of stating the first pad and second pad includes：
Solder stick is melted on the break-make switching construction by electric iron, formed after cooled and solidified connection first pad and
The scolding tin of second pad.
6. a kind of printed circuit board (PCB), including substrate and the solder mask being covered on substrate, it is characterised in that the substrate is provided with
At least one break-make switching construction, the region of the correspondence break-make switching construction offers window on the solder mask, described logical
Disconnected switching construction includes connecting first pad and the second pad of different PCB traces respectively, second pad in a ring, institute
State the first pad and be at least partially disposed in the annular space of second pad and have between second pad gap,
Second pad is provided with the breach passed through for the PCB trace of connection first pad.
7. printed circuit board (PCB) according to claim 6, it is characterised in that also there is connection first weldering on the substrate
The scolding tin of disk and second pad.
8. the printed circuit board (PCB) according to claim 6 or 7, it is characterised in that first pad and second pad
Between gap be equal to second pad and first pad appearance and size difference 1/2nd.
9. the printed circuit board (PCB) according to claim 6 or 7, it is characterised in that first pad and second pad
Between gap be 0.05mm-0.1mm.
10. the printed circuit board (PCB) according to claim 6 or 7, it is characterised in that the size of the window is more than described second
The appearance and size of pad.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201611179583.4A CN106658996A (en) | 2016-12-19 | 2016-12-19 | Method for achieving circuit on-off switching and printed circuit board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201611179583.4A CN106658996A (en) | 2016-12-19 | 2016-12-19 | Method for achieving circuit on-off switching and printed circuit board |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN106658996A true CN106658996A (en) | 2017-05-10 |
Family
ID=58834907
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201611179583.4A Pending CN106658996A (en) | 2016-12-19 | 2016-12-19 | Method for achieving circuit on-off switching and printed circuit board |
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| Country | Link |
|---|---|
| CN (1) | CN106658996A (en) |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107509315A (en) * | 2017-08-02 | 2017-12-22 | 江门荣信电路板有限公司 | A kind of oily wire jumper preparation method of PCB silver |
| CN111698825A (en) * | 2020-06-12 | 2020-09-22 | 浪潮电子信息产业股份有限公司 | PCB and PCB routing structure manufacturing method |
| CN113687211A (en) * | 2021-07-21 | 2021-11-23 | 桂林研创半导体科技有限责任公司 | Printed circuit board pad drawing method |
| CN114501789A (en) * | 2020-11-24 | 2022-05-13 | 合肥联宝信息技术有限公司 | A kind of printed circuit board, printing method and debugging method of circuit board |
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| US4982892A (en) * | 1989-11-09 | 1991-01-08 | International Business Machines Corporation | Solder interconnects for selective line coupling |
| CN102958274A (en) * | 2011-08-24 | 2013-03-06 | 鸿富锦精密工业（深圳）有限公司 | Circuit board |
| EP3200568A1 (en) * | 2016-01-29 | 2017-08-02 | BIOTRONIK SE & Co. KG | Battery bridge and method for activating an electronic device |
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4982892A (en) * | 1989-11-09 | 1991-01-08 | International Business Machines Corporation | Solder interconnects for selective line coupling |
| CN102958274A (en) * | 2011-08-24 | 2013-03-06 | 鸿富锦精密工业（深圳）有限公司 | Circuit board |
| EP3200568A1 (en) * | 2016-01-29 | 2017-08-02 | BIOTRONIK SE & Co. KG | Battery bridge and method for activating an electronic device |
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107509315A (en) * | 2017-08-02 | 2017-12-22 | 江门荣信电路板有限公司 | A kind of oily wire jumper preparation method of PCB silver |
| CN111698825A (en) * | 2020-06-12 | 2020-09-22 | 浪潮电子信息产业股份有限公司 | PCB and PCB routing structure manufacturing method |
| CN111698825B (en) * | 2020-06-12 | 2023-03-31 | 浪潮电子信息产业股份有限公司 | PCB and PCB routing structure manufacturing method |
| CN114501789A (en) * | 2020-11-24 | 2022-05-13 | 合肥联宝信息技术有限公司 | A kind of printed circuit board, printing method and debugging method of circuit board |
| CN113687211A (en) * | 2021-07-21 | 2021-11-23 | 桂林研创半导体科技有限责任公司 | Printed circuit board pad drawing method |
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