CN106658939A

CN106658939A - PCB welding plate and method for selecting and mounting chips

Info

Publication number: CN106658939A
Application number: CN201610894539.5A
Authority: CN
Inventors: 申远; 杜培军; 邹素瑞; 林旺城; 董明; 韩浦江; 赵艳雯
Original assignee: United Automotive Electronic Systems Co Ltd
Current assignee: United Automotive Electronic Systems Co Ltd
Priority date: 2016-10-13
Filing date: 2016-10-13
Publication date: 2017-05-10

Abstract

The invention reveals a PCB welding plate and a method for selecting and mounting a chip, which are designed to select and mount chips. One of the chips comprises a plurality of chip tube pins. The welding plate comprises a chip placing region for the chip to be placed on, and a plurality of fixing tube pin circuits and peripheral circuits. Each branch circuit comprises at least one circuit component; and each branch circuit is connected with one of the fixing tube pins. When one of the chips is placed in the chip placing region, the chip tube pins are electrically connected at least in part with the fixing tube pins in a selective manner. When different chips are placed in the chip placing region respectively, at least some parts of the circuit components in the branch circuits can be reused. The PCB welding plate and the method for selecting and mounting chips of the invention are of high expansion dependant on the chips, save the time for development and the cost for manufacturing.

Description

PCB (printed circuit board) bonding pad and chip selecting and pasting method

Technical Field

The invention relates to the technical field of automobile electronic communication, in particular to a PCB (printed circuit board) pad and a chip selecting and pasting method.

Background

A Controller Area Network (CAN) bus is a serial communication protocol bus for real-time applications, which CAN use twisted pair wires to transmit signals, and is one of the most widely used field buses in the world. The CAN belongs to the field bus category and is a serial communication network for effectively supporting a distributed control system. Is a serial communication bus developed by the company bosch in germany in the 80 s of the 20 th century specially for the automobile industry. Due to its high performance, high reliability and unique design, it is becoming more and more important, widely used in many fields, and able to detect any errors that occur. When the signal transmission distance reaches 10km, the CAN CAN still provide a data transmission rate of up to 50 kbit/s. Because the CAN bus has high real-time performance and application range, the CAN bus CAN be matched with a high-speed network with the bit rate of up to 1Mbps to a low-cost multi-line 50Kbps network at will.

In use, the CAN chip is generally required to be soldered on a pad of a PCB (Printed Circuit Board), and different CAN chips are required to be soldered on different pads. However, this has the following disadvantages:

1) the PCB pad area is large, the utilization rate is low, and the cost is increased;

2) the expansibility of the pad is weak;

3) frequently changing pad response development cycles;

4) the repeated work is more, and the labor cost is high.

Disclosure of Invention

The invention aims to provide a PCB (printed circuit board) bonding pad which can be used for welding different chips according to needs, has strong expansibility, saves development time and reduces cost.

In order to solve the technical problem, the invention provides a PCB pad for selecting and pasting a chip, wherein the chip comprises a plurality of chip pins, the PCB pad comprises a chip placing area for placing the chip, a plurality of fixed pins and a peripheral circuit, the peripheral circuit comprises a plurality of branches, each branch comprises at least one circuit element, and each branch is connected with one fixed pin; wherein,

when one chip is placed on the chip placing area, the chip pins are selectively and electrically connected with at least part of the fixing pins;

when different chips are respectively placed on the chip placing areas, at least part of the circuit elements in at least part of the branches are multiplexed.

Further, in the PCB pad, when different chips are placed on the chip placement area, at least a part of the branches are multiplexed.

Further, in the PCB pad, when different chips are respectively placed on the chip placement regions, at least one of the branches accommodates the different chips.

Further, in the PCB pad, when different chips are respectively placed on the chip placement regions, a combination of circuit elements of at least one of the branches is different.

Furthermore, in the PCB pad, at least one branch comprises a first sub-branch and a second sub-branch, and when a chip is placed on the chip placement area, the fixed pin connected with at least one branch is connected with the first sub-branch; when another chip is placed on the chip placing area, the fixed pin connected with at least one branch is connected with the second sub-branch.

Furthermore, in the PCB pad, the plurality of fixing pins are respectively located at two opposite sides of the chip placement area.

Further, in the PCB pad, combinations of circuit elements of at least two of the branches are different.

Further, in the PCB pad, at least two of the branches share the same circuit element.

Further, in the PCB pad, the chip is a CAN transceiver.

According to another aspect of the present invention, there is also provided a chip selecting and pasting method for selecting and pasting a chip, where the chip includes a plurality of chip pins, the chip selecting and pasting method includes:

providing a chip placing area for placing the chip, a plurality of fixed pins and a peripheral circuit, wherein the peripheral circuit comprises a plurality of branches, each branch comprises at least one circuit element, and each branch is connected with one fixed pin;

placing different ones of said chips on said chip placement areas, respectively, said chip pins being selectively electrically connected to at least some of said anchor pins when one of said chips is placed on said chip placement area; when different chips are respectively placed on the chip placing areas, at least part of the circuit elements in at least part of the branches are multiplexed.

Further, in the chip selecting and pasting method, when different chips are respectively placed on the chip placing areas, at least part of the branches are multiplexed.

Further, in the chip selecting and pasting method, when different chips are respectively placed on the chip placing area, at least one branch circuit is adapted to the different chips.

Further, in the chip selecting and pasting method, at least part of the circuit elements of at least one branch circuit is replaced when different chips are respectively placed on the chip placing areas.

Further, in the chip selecting and pasting method, at least one of the branches includes a first sub-branch and a second sub-branch, and when a chip is placed on the chip placement area, the fixed pin connected with at least one of the branches is connected with the first sub-branch; when another chip is placed on the chip placing area, the fixed pin connected with at least one branch is connected with the second sub-branch.

Further, in the chip selecting and pasting method, the plurality of fixing pins are respectively located on two opposite sides of the chip placing area.

Further, in the chip selecting and pasting method, combinations of circuit elements of at least two branches are different.

Further, in the chip selecting and pasting method, at least two branches share the same circuit element.

Further, in the chip selecting and pasting method, the chip is a CAN transceiver.

Compared with the prior art, the PCB bonding pad and the chip selecting and pasting method provided by the invention have the following advantages:

in the PCB pad and the chip selecting and pasting method provided by the invention, the compatibility of the same pad with chips of different models (such as CAN chips TJA1042/TJA1043/TJA1044/TJA1048) is realized through parameter configuration of different pins (Pin pins) of the chip, parameter configuration of peripheral circuits and reservation of the pad. Different chips are freely combined, and the requirements of different clients and multiple gateways on different performances are met.

Drawings

FIG. 1 is a schematic diagram of a PCB pad in one embodiment of the invention;

FIG. 2 is a schematic diagram of a PCB pad using a CAN chip TJA1042 according to an embodiment of the present invention;

FIG. 3 is a schematic diagram illustrating a PCB pad using a CAN chip TJA1044 according to an embodiment of the present invention;

FIG. 4 is a schematic diagram of a PCB pad using a CAN chip TJA1043 according to an embodiment of the present invention;

fig. 5 is a schematic diagram of a PCB pad using a CAN chip TJA1048 in an embodiment of the invention.

Detailed Description

The PCB pad of the present invention will be described in more detail with reference to the schematic drawings, in which preferred embodiments of the present invention are shown, it being understood that a person skilled in the art may modify the invention described herein while still achieving the advantageous effects of the invention. Accordingly, the following description should be construed as broadly as possible to those skilled in the art and not as limiting the invention.

In the interest of clarity, not all features of an actual implementation are described. In the following description, well-known functions or constructions are not described in detail since they would obscure the invention in unnecessary detail. It will of course be appreciated that in the development of any such actual embodiment, numerous implementation-specific details must be set forth in order to achieve the developer's specific goals, such as compliance with system-related and business-related constraints, which will vary from one implementation to another. Moreover, it will be appreciated that such a development effort might be complex and time-consuming, but would nevertheless be a routine undertaking for those of ordinary skill in the art.

The invention is described in more detail in the following paragraphs by way of example with reference to the accompanying drawings. Advantages and features of the present invention will become apparent from the following description and from the claims. It is to be noted that the drawings are in a very simplified form and are not to precise scale, which is merely for the purpose of facilitating and distinctly claiming the embodiments of the present invention.

The core idea of the invention is to provide a PCB (printed circuit board) pad, which is used for selecting and pasting a chip, wherein the chip comprises a plurality of chip pins, the PCB pad comprises a chip placing area for placing the chip, a plurality of fixed pins and a peripheral circuit, the peripheral circuit comprises a plurality of branches, each branch comprises at least one circuit element, and each branch is connected with one fixed pin; wherein when one of said chips is placed on said chip placement region, said chip pins are selectively electrically connected to at least a portion of said fixing pins; when different chips are respectively placed on the chip placing areas, at least part of the circuit elements in at least part of the branches are multiplexed.

The chip package that the same bonding pad is compatible with different models is realized by parameter configuration of different pins (Pin pins) of the chip, parameter matching of peripheral circuits and reservation of the bonding pad (for example, the CAN chip TJA1042/TJA1043/TJA1044/TJA 1048). Different chips are freely combined, and the requirements of different clients and multiple gateways on different performances are met. Wherein, some said circuit components and even some branch circuits can be reused, save development time, reduce cost, expansibility is strong.

The PCB pad in this embodiment will be specifically described below with reference to a paste selecting method. In this embodiment, the chip is described by taking a CAN chip as an example, and the PCB pad is used for placing the CAN chips TJA1042/TJA1043/TJA1044/TJA1048, respectively. In other embodiments, the chip may be other types of chips, which is not limited herein.

First, a chip placement area for placing the chip, a plurality of fixed pins, and a peripheral circuit are provided, in this embodiment, a PCB pad 1 shown in fig. 1 is provided, where the PCB pad 1 includes a chip placement area 11 for placing the chip, a plurality of fixed pins, and a peripheral circuit, the peripheral circuit includes a plurality of branches, each branch includes at least one circuit element, and each branch is connected to one fixed pin.

In this embodiment, the PCB pad 1 includes 14 pins, which are respectively: 101Pin, 102Pin, 103Pin, 104Pin, 105Pin, 106Pin, 107Pin, 108Pin, 109Pin, 110Pin, 111Pin, 112Pin, 113Pin, 114Pin, 14 pins are evenly distributed on two opposite sides of the chip placement region 11. The peripheral circuit comprises 14 branches, which are respectively: 1201, 1202, 1203, 1204, 1205, 1206, 1207, 1208, 1209, 1210, 1211, 1212, 1213, 1214. In fig. 1, fig. l clearly shows the corresponding relationship between 14 branches and 14 pins, and the circuit components in each branch are specifically drawn, and include, but are not limited to, one or more of connecting lines, resistors, capacitors, inductors, input terminals, and output terminals.

As shown in fig. 2, the CAN chip TJA1042 is first placed in the chip placement area 11, where the CAN chip TJA1042 includes 8 chip pins, which are respectively: TXD pin, GND pin, VCC pin, RXD pin, SPLIT pin, CANL pin, CANH pin, STB pin. The TXD Pin, the GND Pin, the VCC Pin, the RXD Pin, the SPLIT Pin, the CANL Pin, the CANH Pin and the STB Pin are sequentially connected with 101Pin, 102Pin, 103Pin, 104Pin, 111Pin, 112Pin, 113Pin and 114 Pin.

The 1201 branch comprises a resistor R508 and a TXD output end, the 1202 branch comprises a ground end, the 1203 branch comprises a capacitor C505 and a power end VCC, the 1204 branch comprises a resistor R507 and an output end RXD, the 1211 branch comprises a resistor R568, the 1212 branch and the 1213 branch comprise an inductor L500, a resistor R550, a resistor R552 and a capacitor C503, the diode D500, the capacitor C502, the capacitor C550, the 1212 branch and the 1213 branch form a CAN _ BUS, and the 1214 branch comprises a resistor R506. The other branches, namely, the branch 1205, the branch 1206, the branch 1207, the branch 1208, the branch 1209 and the branch 1210 are also located on the PCB pad 1, but for clarity, the other branches are not shown.

Therefore, during configuration of the CAN chip TJA1042, the TXD pin attachment resistor R508, the GND pin attachment ground terminal, the VCC pin attachment capacitor C505, the power supply terminal VCC, the RXD pin attachment resistor R507, the SPLIT pin attachment resistor R568, the CANL pin attachment and CANH pin attachment inductor L500, the resistor R550, the resistor R552, the capacitor C503, the diode D500, the capacitor C502, the capacitor C550, and the STB pin attachment resistor R506.

As shown in fig. 3, the CAN chip TJA1044 is then placed in the chip placement area 11, where the CAN chip TJA1044 includes 8 chip pins, which are respectively: TXD pin, GND pin, VCC pin, RXD pin, N.C pin, CANL pin, CANH pin, STB pin. The TXD Pin, the GND Pin, the VCC Pin, the RXD Pin, the N.C Pin, the CANL Pin, the CANH Pin and the STB Pin are sequentially connected with 101Pin, 102Pin, 103Pin, 104Pin, 111Pin, 112Pin, 113Pin and 114 Pin.

The 1201 branch circuit comprises a resistor R508 and a TXD output end, the 1202 branch circuit comprises a grounding end, the 1203 branch circuit comprises a capacitor C505 and a power supply end VCC, the 1204 branch circuit comprises a resistor R507 and an output end RXD, the 1211 branch circuit is open circuit, the 1212 branch circuit and the 1213 branch circuit comprise an inductor L500, a resistor R550, a resistor R552 and a capacitor C503, the diode D500, the capacitor C502, the capacitor C550, the 1212 branch circuit and the 1213 branch circuit form a CAN _ BUS, and the 1214 branch circuit comprises a resistor R506. The other branches, namely, the branch 1205, the branch 1206, the branch 1207, the branch 1208, the branch 1209 and the branch 1210 are also located on the PCB pad 1, but for clarity, the other branches are not shown.

Most circuit elements connected with pins of the CAN chip TJA1044 and the CAN chip TJA1042 are the same, most branches are the same, and only the 1211 branch is different, so that only the 1211 branch is required to be changed. For example, if the resistor R568 in the 1211 branch is removed, the 1211 branch is opened.

Therefore, when the CAN chip TJA1044 is configured, the TXD pin is attached to the resistor R508, the GND pin is attached to the ground terminal, the VCC pin is attached to the capacitor C505, the power supply terminal VCC, the RXD pin is attached to the resistors R507, N.C, the CANL pin is attached to the CANH pin, the inductor L500, the resistor R550, the resistor R552, the capacitor C503, the diode D500, the capacitor C502, the capacitor C550, and the STB pin is attached to the resistor R506.

As shown in fig. 4, the CAN chip TJA1043 is then placed in the chip placement area 11, where the CAN chip TJA1043 includes 14 chip pins: TXD pin, GND pin, VCC pin, RXD pin, VI/O pin, EN pin, INH pin, ERR pin, WAK pin, BAT pin, SPLIT pin, CANL pin, CANH pin, STB pin. TXD Pin, GND Pin, VCC Pin, RXD Pin, VI/O Pin, EN Pin, INH Pin, ERR Pin, WAK Pin, BAT Pin, SPLIT Pin, CANL Pin, CANH Pin, STB Pin are connected with 101Pin, 102Pin, 103Pin, 104Pin, 105Pin, 106Pin, 107Pin, 108Pin, 109Pin, 110Pin, 111Pin, 112Pin, 113Pin, 114Pin in turn.

The 1201 branch comprises a resistor R508 and a TXD output end, the 1202 branch comprises a ground end, the 1203 branch comprises a capacitor C505 and a power end VCC, the 1204 branch comprises a resistor R507 and an output end RXD, the 1205 branch comprises a resistor R520, the 1206 branch comprises a resistor R524, a resistor R505 and a CAN _ EN output end, the 1207 branch comprises a resistor R572 and an INH output end, the 1208 branch comprises an MCU Port (ERR/STB2), the 1209 branch comprises a resistor R526, a resistor R504 and a triode Q800, the 1210 branch comprises a capacitor C504, a capacitor C506, a resistor R525 and a CAN3_ WAKE output end, the 1211 branch comprises a resistor R568, a 1212 branch and a 1213 branch comprising an inductor L500, a resistor R550, a resistor R552, a capacitor C503, a diode D500, a capacitor C502, a capacitor C550, a 1212 branch and a CAN _ BUS formed by the 1213 branch, and the 1214 branch comprises a resistor R.

Circuit elements connected to pins of the CAN chips TJA1043 and TJA1044 are mostly the same, and part of branches are the same, for example, the 1201 branch, 1202 branch, 1203 branch, 1204 branch, 1212 branch, 1213 branch, and 1214 branch are the same, so that the 1201 branch, 1202 branch, 1203 branch, 1204 branch, 1212 branch, 1213 branch, and 1214 branch may be multiplexed.

Therefore, during configuration of the CAN chip TJA1043, the TXD pin attachment resistor R508, the GND pin attachment ground terminal, the VCC pin attachment capacitor C505, the power supply terminal VCC, the RXD pin attachment resistor R507, the VI/O pin attachment resistor R520, the EN pin attachment resistor R524, the resistor R505, the CAN _ EN output terminal, the INH pin attachment resistor R572, the INH output terminal, and the ERR pin attachment include an MCU Port (ERR/STB2), a WAK pin attachment resistor R526, a resistor R504, a transistor Q800, a BAT pin attachment capacitor C504, a capacitor C506, a resistor R525, and a CAN3_ WAKE output terminal, an SPLIT pin attachment resistor R568, a CANL pin attachment and CANH pin attachment inductor L500, a resistor R550, a resistor R552, a capacitor C503, a diode D500, a capacitor C502, a capacitor C550, and an STB pin attachment resistor R506.

As shown in fig. 5, the CAN chip TJA1048 is then placed in the chip placement area 11, where the CAN chip TJA1048 includes 14 chip pins: TXD 1pin, GNDA pin, VCC pin, RXD 1pin, GNDB pin, TXD 2pin, RXD 2pin, STB 2pin, CANL 2pin, CANH 2pin, VI/O pin, CANL 1pin, CANH 1pin, and STB1 pin. TXD 1Pin, GNDA Pin, VCC Pin, RXD 1Pin, GNDB Pin, TXD 2Pin, RXD 2Pin, STB 2Pin, CANL 2Pin, CANH 2Pin, VI/O Pin, CANL 1Pin, CANH 1Pin and STB 1Pin are sequentially connected with 101Pin, 102Pin, 103Pin, 104Pin, 105Pin, 106Pin, 107Pin, 108Pin, 109Pin, 110Pin, 111Pin, 112Pin, 113Pin and 114 Pin.

The 1201 branch comprises a resistor R508 and a TXD output end, the 1202 branch comprises a grounding end, the 1203 branch comprises a capacitor C505 and a power supply end VCC, the 1204 branch comprises a resistor R507 and an output end RXD, the 1205 branch comprises a resistor R521, the 1206 branch comprises a resistor R522 and a TXD2 output end, the 1207 branch comprises a resistor R523 and an RXD2 output end, 1208 branch resistor R523 and an STB2 end, the 1209 branch and the 1210 branch form a CAN2_ BUS loop through CAN2_ H and CAN2_ L, the 1211 branch comprises a resistor R519, a 1212 branch and an 1213 branch comprises an inductor L500, a resistor R550, a resistor R552 and a capacitor C503, a diode D500, a capacitor C502, a capacitor C550, the 1212 branch and the 1213 branch form a CAN1_ BUS, and the 1214 branch comprises a resistor R506 and an STB1 end.

The circuit elements connected to the pins of the CAN chip TJA1043 and the CAN chip TJA1048 are mostly the same, and some branches are the same, for example, branch 1201, branch 1202, branch 1203, branch 1204, branch 1212, branch 1213, and branch 1214 are the same, so that branch 1201, branch 1202, branch 1203, branch 1204, branch 1212, branch 1213, and branch 1214 may be multiplexed.

For different branches, such as the branch 1205, the resistor R520 may be removed, and then the resistor R521 may be soldered; in addition, the 1205 branch may further include a first sub-branch and a second sub-branch, where the first sub-branch includes a resistor R520, the second sub-branch includes a resistor R521, and when the CAN chip TJA1043 is connected, the first sub-branch is turned on; and when the CAN chip TJA1048 is connected, the second sub-branch is conducted.

Therefore, when the CAN chip TJA1048 is configured, the TXD 1pin pad resistor R508, the GNDA pin pad ground terminal, the VCC pin pad capacitor C505, the power supply terminal VCC, the RXD 1pin pad resistor R507, the GNDB pin pad resistor R521, the TXD 2pin pad resistor R522, the RXD 2pin pad resistor R523, the STB 2pin pad resistor R523, the CANL2, and the CANH2 pins form a CAN2_ BUS loop, the VI/O pin pad resistor R519, the CANL 1pin pad, and the CANH 1pin pad inductor L500, the resistor R550, the resistor R552, the capacitor C503, the diode D500, the capacitor C502, the capacitor C550, and the STB 1pin pad resistor R506.

In the embodiment, the compatibility of the same PCB pad with chips of different models (such as CAN chips TJA1042/TJA1043/TJA1044/TJA1048) is realized through parameter configuration of different pins (Pin pins) of the chip, parameter matching of peripheral circuits and reservation of the pad. Different chips are freely combined, and the requirements of different clients and multiple gateways on different performances are met. Wherein, some said circuit components and even some branch circuits can be reused, save development time, reduce cost, expansibility is strong.

It will be apparent to those skilled in the art that various changes and modifications may be made in the present invention without departing from the spirit and scope of the invention. Thus, if such modifications and variations of the present invention fall within the scope of the claims of the present invention and their equivalents, the present invention is also intended to include such modifications and variations.

Claims

1. A PCB bonding pad is used for selecting and pasting a chip, wherein the chip comprises a plurality of chip pins, and the PCB bonding pad is characterized by comprising a chip placing area for placing the chip, a plurality of fixed pins and a peripheral circuit, wherein the peripheral circuit comprises a plurality of branches, each branch comprises at least one circuit element, and each branch is connected with one fixed pin; wherein,

when one of the chips is placed on the chip placing region, the chip pins are selectively electrically connected with at least part of the fixed pins;

2. The PCB pad of claim 1, wherein at least a portion of the branches are multiplexed when different ones of the chips are placed on the chip placement areas, respectively.

3. The PCB pad of claim 1 or 2, wherein at least one of the branches accommodates different ones of the chips when the different ones of the chips are placed on the chip placement areas, respectively.

4. The PCB pad of claim 3, wherein a combination of circuit elements of at least one of the branches is different when different ones of the chips are placed on the chip placement areas, respectively.

5. The PCB pad of claim 3, wherein at least one of the branches includes a first sub-branch and a second sub-branch, the fixed pin connected to at least one of the branches being connected to the first sub-branch when a chip is placed on the chip placement area; when another chip is placed on the chip placing area, the fixed pin connected with at least one branch is connected with the second sub-branch.

6. The PCB pad of claim 1, wherein a plurality of the securing pins are located on opposite sides of the chip placement area.

7. The PCB pad of claim 1, wherein the combination of circuit elements of at least two of the branches is different.

8. The PCB pad of claim 1, wherein at least two of the branches share a same circuit element.

9. The PCB pad of claim 1, wherein the chip is a CAN transceiver.

10. A chip selecting and pasting method is used for selecting and pasting a chip, the chip comprises a plurality of chip pins, and the chip selecting and pasting method is characterized by comprising the following steps:

placing different ones of said chips on said chip placement areas, respectively, said chip pins being selectively in electrical communication with at least some of said anchor pins when one of said chips is placed on said chip placement area; when different chips are respectively placed on the chip placing areas, at least part of the circuit elements in at least part of the branches are multiplexed.

11. The chip pick-and-place method according to claim 10, wherein at least a part of said branches are multiplexed when different ones of said chips are placed on said chip placement area, respectively.

12. The chip picking method according to claim 10 or 11, wherein at least one of the branches accommodates different ones of the chips when the different ones of the chips are placed on the chip placement regions, respectively.

13. The chip pick-and-place method according to claim 12, wherein at least a part of the circuit elements of at least one of the branches is replaced when different ones of the chips are placed on the chip placement regions, respectively.

14. The chip selecting and pasting method as claimed in claim 12, wherein at least one of said branches includes a first sub-branch and a second sub-branch, and when one of said chips is placed on said chip placement area, said fixed pin connected to at least one of said branches is connected to said first sub-branch; when another chip is placed on the chip placing area, the fixed pin connected with at least one branch is connected with the second sub-branch.

15. The chip selecting and pasting method as claimed in claim 10, wherein a plurality of said fixing pins are respectively located at two opposite sides of said chip placing region.

16. The chip pick and place method of claim 10 wherein the combination of circuit elements of at least two of said branches is different.

17. The chip pick and place method of claim 10 wherein at least two of said branches share a common circuit element.

18. The chip pick and place method of claim 10 wherein the chip is a CAN transceiver.