CN106645971B - A method for testing UHF RFID chip band package impedance using resonance method - Google Patents
A method for testing UHF RFID chip band package impedance using resonance method Download PDFInfo
- Publication number
- CN106645971B CN106645971B CN201710059811.2A CN201710059811A CN106645971B CN 106645971 B CN106645971 B CN 106645971B CN 201710059811 A CN201710059811 A CN 201710059811A CN 106645971 B CN106645971 B CN 106645971B
- Authority
- CN
- China
- Prior art keywords
- coil
- rfid chip
- testing
- impedance
- frequency rfid
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
- 238000012360 testing method Methods 0.000 title claims abstract description 40
- 238000000034 method Methods 0.000 title claims abstract description 14
- 238000009774 resonance method Methods 0.000 title claims abstract description 12
- 238000012545 processing Methods 0.000 claims abstract description 5
- 238000004519 manufacturing process Methods 0.000 claims abstract 4
- 238000010998 test method Methods 0.000 claims description 5
- 238000005516 engineering process Methods 0.000 description 5
- 238000013461 design Methods 0.000 description 4
- 238000004806 packaging method and process Methods 0.000 description 4
- 230000009286 beneficial effect Effects 0.000 description 3
- 238000010586 diagram Methods 0.000 description 3
- 230000008878 coupling Effects 0.000 description 2
- 238000010168 coupling process Methods 0.000 description 2
- 238000005859 coupling reaction Methods 0.000 description 2
- 230000003071 parasitic effect Effects 0.000 description 2
- 238000004088 simulation Methods 0.000 description 2
- 238000012935 Averaging Methods 0.000 description 1
- 238000004364 calculation method Methods 0.000 description 1
- 239000003990 capacitor Substances 0.000 description 1
- 238000006243 chemical reaction Methods 0.000 description 1
- 230000007812 deficiency Effects 0.000 description 1
- 230000001939 inductive effect Effects 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000012805 post-processing Methods 0.000 description 1
- 230000035945 sensitivity Effects 0.000 description 1
Images
Classifications
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R27/00—Arrangements for measuring resistance, reactance, impedance, or electric characteristics derived therefrom
- G01R27/02—Measuring real or complex resistance, reactance, impedance, or other two-pole characteristics derived therefrom, e.g. time constant
- G01R27/04—Measuring real or complex resistance, reactance, impedance, or other two-pole characteristics derived therefrom, e.g. time constant in circuits having distributed constants, e.g. having very long conductors or involving high frequencies
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R27/00—Arrangements for measuring resistance, reactance, impedance, or electric characteristics derived therefrom
- G01R27/02—Measuring real or complex resistance, reactance, impedance, or other two-pole characteristics derived therefrom, e.g. time constant
- G01R27/26—Measuring inductance or capacitance; Measuring quality factor, e.g. by using the resonance method; Measuring loss factor; Measuring dielectric constants ; Measuring impedance or related variables
- G01R27/2688—Measuring quality factor or dielectric loss, e.g. loss angle, or power factor
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02D—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN INFORMATION AND COMMUNICATION TECHNOLOGIES [ICT], I.E. INFORMATION AND COMMUNICATION TECHNOLOGIES AIMING AT THE REDUCTION OF THEIR OWN ENERGY USE
- Y02D30/00—Reducing energy consumption in communication networks
- Y02D30/70—Reducing energy consumption in communication networks in wireless communication networks
Landscapes
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- Power Engineering (AREA)
- Measurement Of Resistance Or Impedance (AREA)
- Investigating Or Analyzing Materials By The Use Of Electric Means (AREA)
Abstract
Description
技术领域technical field
本发明属于电子技术领域，涉及一种测试超高频RFID芯片带封装阻抗的方法，尤其涉及一种使用谐振法测试超高频RFID芯片带封装阻抗的方法。The invention belongs to the field of electronic technology, and relates to a method for testing the package impedance of an ultra-high frequency RFID chip, in particular to a method for testing the package impedance of an ultra-high frequency RFID chip by using a resonance method.
背景技术Background technique
超高频RFID技术可应用于物流、交通、防伪、服装等各种行业。相比于传统的高频技术，超高频RFID技术具有读距离远，防碰撞功能强的优点。UHF RFID technology can be applied to various industries such as logistics, transportation, anti-counterfeiting, and clothing. Compared with traditional high-frequency technology, UHF RFID technology has the advantages of long reading distance and strong anti-collision function.
为了发挥RFID技术读距离远的优点，通常超高频天线的阻抗需要设计为芯片阻抗的共轭。尽管芯片厂商给出了芯片的阻抗值，但是因为超高频的特点，封装对芯片的阻抗值影响很大。各种不同的封装形式，甚至同一种封装形式不同的生产厂商，都会导致带封装芯片的阻抗不同，不等于芯片厂商提供的设计参考值。所以，需要找到测试带封装芯片阻抗的方法。In order to take advantage of the long reading distance of RFID technology, usually the impedance of the UHF antenna needs to be designed as the conjugate of the chip impedance. Although the chip manufacturer gives the impedance value of the chip, because of the characteristics of ultra-high frequency, the package has a great influence on the impedance value of the chip. Various packaging forms, even different manufacturers of the same packaging form, will result in different impedances of the packaged chip, which is not equal to the design reference value provided by the chip manufacturer. Therefore, it is necessary to find a way to test the impedance of the packaged chip.
现有技术中，通常采用射频端口连接到带封装芯片两端的形式测试阻抗，但是这样做会导致至少两个问题。首先，芯片的封装通常尺寸非常小(面积1mm*1mm以内)，连接线通常尺寸会相当大(1cm*1cm级别)，这样会导致连接线的影响比封装寄生的影响还大，导致测试失败。其次，测试超高频阻抗的设备，比如网络分析仪，通常只适合测试50欧姆阻抗，偏离50欧姆的阻抗测试不准确，而超高频RFID芯片的阻抗值通常为20+j200欧姆左右的复阻抗，导致测试失败。In the prior art, the impedance is usually tested in the form of connecting the radio frequency port to both ends of the packaged chip, but doing so will cause at least two problems. First of all, the package size of the chip is usually very small (within the area of 1mm*1mm), and the size of the connecting wire is usually quite large (1cm*1cm level), which will cause the influence of the connecting wire to be greater than the influence of package parasitics, resulting in test failure. Secondly, equipment for testing UHF impedance, such as network analyzers, is usually only suitable for testing 50 ohms impedance, and the impedance test deviated from 50 ohms is inaccurate, while the impedance value of UHF RFID chips is usually a complex of about 20+j200 ohms impedance, causing the test to fail.
发明内容Contents of the invention
针对现有技术的不足，本发明特提出一种使用谐振法测试超高频RFID芯片带封装阻抗的方法，它不仅能解决现有技术中存在的问题，还具有其它许多有益效果。Aiming at the deficiencies of the prior art, the present invention proposes a method for testing the package impedance of UHF RFID chips by using the resonance method, which not only solves the problems existing in the prior art, but also has many other beneficial effects.
为达到上述目的，本发明采取了以下的技术方案，一种使用谐振法测试超高频RFID芯片带封装阻抗的方法，包含下述步骤：In order to achieve the above object, the present invention has taken following technical scheme, a kind of method that uses resonance method to test ultra-high frequency RFID chip band package impedance, comprises the following steps:
第一步，制作第一线圈、第二线圈，所述第一线圈、第二线圈可以分别封装同样的超高频The first step is to make the first coil and the second coil, and the first coil and the second coil can respectively package the same UHF
RFID芯片；RFID chip;
第二步，制作第三线圈，所述第三线圈为高自身谐振值线圈，所述第三线圈电连接网络分The second step is to make a third coil, the third coil is a coil with a high self-resonance value, and the third coil is electrically connected to the network branch
析仪；Analyzer;
第三步，分别利用封装同样的超高频RFID芯片的第一线圈和第二线圈和所述第三线圈互In the third step, use the first coil and the second coil of the same ultra-high frequency RFID chip of the package to interact with the third coil respectively.
感，测试两个带超高频RFID芯片的线圈谐振值；Sensitivity, test the resonance value of two coils with UHF RFID chips;
第四步，利用数据处理，可以得到超高频RFID芯片带封装阻抗的实部和虚部。The fourth step is to use data processing to obtain the real part and imaginary part of the package impedance of the UHF RFID chip.
上述第一线圈的电感值是L1，所述第二线圈的电感值是L2，且满足：L1>L2。The inductance value of the first coil is L 1 , the inductance value of the second coil is L 2 , and the following is satisfied: L 1 >L 2 .
上述的第三线圈的电感值是L3的，且满足：L1*5>L3>L2/5。The above-mentioned inductance value of the third coil is L 3 and satisfies: L 1 *5>L 3 >L 2 /5.
上述的第三线圈的自身谐振值为ω3＝2πf3，且满足：f3>1.2GHz。The self-resonant value of the above-mentioned third coil is ω 3 =2πf 3 , and satisfies: f 3 >1.2GHz.
上述的第三线圈接所述网络分析仪的一个端口，所述网络分析仪设置为测试s参数绝对值的模式；所述封装同样的超高频RFID芯片的第一线圈、第二线圈先后分别靠近所述第三线圈互感时，所述网络分析仪的s参数绝对值随之发生改变。The above-mentioned third coil is connected to a port of the network analyzer, and the network analyzer is set to the mode of testing the absolute value of the s parameter; the first coil and the second coil of the same ultra-high frequency RFID chip of the package are successively respectively When approaching the mutual inductance of the third coil, the absolute value of the s parameter of the network analyzer changes accordingly.
以下对本发明的原理进行说明：Principle of the present invention is described below:
制作两种线圈，即第一线圈L1和第二线圈L2，这两个线圈的电感值分别为L1和L2,有L1>L2。这两个线圈的电感值可以使用测试或者仿真方法得到，因为线圈的直径通常为几个厘米，所以无论是测试还是仿真，都容易得到正确值。然后使用同样的封装，将超高频RFID芯片封装到上述两个线圈上。芯片阻抗值为电容性，所以和电感性的线圈形成了LC谐振。Two kinds of coils are produced, namely the first coil L 1 and the second coil L 2 , the inductance values of these two coils are L 1 and L 2 respectively, and L 1 >L 2 . The inductance values of these two coils can be obtained by testing or simulation methods, because the diameter of the coils is usually several centimeters, so it is easy to obtain the correct value whether it is testing or simulation. Then use the same package to package the UHF RFID chip on the above two coils. The impedance value of the chip is capacitive, so it forms an LC resonance with the inductive coil.
至于第三线圈L3，其尺寸大小和第一线圈L1、第二线圈L2相似，但通常为空绕，这里定义第三线圈L3的自身谐振值为网络分析仪测得s参数虚部为0的频率值，将第三线圈L3接网络分析仪的一个端口，网络分析仪设置为测试s参数绝对值的模式。再将第一线圈L1和第三线圈L3正对，并使第一线圈L1靠近第三线圈L3，可以在网络分析仪上，观察到s参数绝对值曲线，出现一个明显的峰值，这个峰值的频率就是线圈L1的谐振值ω1＝2πf1，同样操作方式可测得第二线圈L2的谐振值ω2＝2πf2。As for the third coil L 3 , its size is similar to that of the first coil L 1 and the second coil L 2 , but it is usually air-wound. Here, the self-resonant value of the third coil L 3 is defined as the virtual value of the s parameter measured by the network analyzer. If the frequency value is 0, the third coil L 3 is connected to a port of the network analyzer, and the network analyzer is set to the mode of testing the absolute value of the s parameter. Then put the first coil L 1 and the third coil L 3 facing each other, and make the first coil L 1 close to the third coil L 3 , you can observe the absolute value curve of the s parameter on the network analyzer, and an obvious peak appears , the frequency of this peak is the resonance value ω 1 =2πf 1 of the coil L 1 , and the resonance value ω 2 =2πf 2 of the second coil L 2 can be measured in the same operation.
最后利用数据后处理，可以得到超高频RFID芯片的实部和虚部。Finally, the real part and the imaginary part of the UHF RFID chip can be obtained by post-processing the data.
具体为，芯片电容值Cp Specifically, the chip capacitance C p
以及芯片电阻值Rp and chip resistance R p
上述数据处理的演算过程为：The calculation process of the above data processing is:
设芯片的并联虚部负值为Xp Let the negative value of the parallel imaginary part of the chip be X p
其中Cp是芯片并联等效电容。Where C p is the chip parallel equivalent capacitance.
芯片的串联虚部负值为XL The negative value of the series imaginary part of the chip is X L
其中CL是芯片串联等效电容。Among them, C L is the chip series equivalent capacitance.
根据串并联转换关系有According to the series-parallel conversion relationship, there are
得：have to:
测试可以得到的四个值为：L1，L2，ω1，ω2其中XL1＝ω1L1，XL2＝ω2L2 The four values that can be obtained from the test are: L 1 , L 2 , ω 1 , ω 2 where X L1 ＝ω 1 L 1 , X L2 ＝ω 2 L 2
则有then there is
这里有两个未知数，两个方程There are two unknowns here, two equations
可以解得：can be solved:
由于上述技术方案，本发明的有益效果是:测试是无线测试，线圈L1和线圈L2没有引入任何其他封装，所以避免了直接测试导致的连线干扰。并且，测试只用到了网络分析仪的s参数的峰值对应的频率，而不使用s参数的准确数值，避免了非50欧姆测试不准确问题；另外本发明的四个测试步骤简单易用，解决了实际测试困难。Due to the above-mentioned technical solution, the beneficial effect of the present invention is: the test is a wireless test, and the coil L 1 and the coil L 2 do not introduce any other packaging, so the connection interference caused by the direct test is avoided. And, the test only used the frequency corresponding to the peak value of the s parameter of the network analyzer, without using the accurate numerical value of the s parameter, which avoided the inaccurate problem of the non-50 ohm test; in addition, four test steps of the present invention are simple and easy to use, solve Difficult to actually test.
由于上述有益效果，本发明广泛适用于使用谐振法测试超高频RFID芯片带封装阻抗的方法中。Due to the above beneficial effects, the present invention is widely applicable to the method of testing the impedance of the ultra-high frequency RFID chip tape package by using the resonance method.
附图说明Description of drawings
图1是本发明的第三线圈L3和第一线圈L1测试的示意图；Fig. 1 is the schematic diagram that the third coil L 3 and the first coil L 1 test of the present invention;
图2是发明的第三线圈L3和第二线圈L2测试的示意图；Fig. 2 is the schematic diagram of the test of the third coil L 3 and the second coil L 2 of the invention;
图3是本发明实施例中的第三线圈L3和第一线圈L1耦合测得的s参数绝对值曲线图；Fig. 3 is the curve diagram of the absolute value of the s parameter measured by the coupling of the third coil L3 and the first coil L1 in the embodiment of the present invention;
图4是本发明实施例中的第三线圈L3和第二线圈L2耦合测得的s参数绝对值曲线图。Fig. 4 is a graph of the absolute value of the s parameter measured by the coupling of the third coil L3 and the second coil L2 in the embodiment of the present invention.
标识说明：1-第一线圈；2-第二线圈；3-第三线圈；4-网络分析仪。Identification instructions: 1-first coil; 2-second coil; 3-third coil; 4-network analyzer.
具体实施方式Detailed ways
下面结合附图，以实施例的方式对本发明作进一步说明。The present invention will be further described in the form of embodiments in conjunction with the accompanying drawings.
参考附图1-4，以超高频RFID的代表商用芯片之一为Alien H3芯片为例,datesheet给出的阻抗设计参考值为1500欧姆||0.85pF。Alien H3芯片在某厂商进行封装，然后按照四个步骤测试带封装的芯片阻抗值。Referring to attached drawings 1-4, taking the Alien H3 chip, one of the representative commercial chips of UHF RFID as an example, the impedance design reference value given by the datesheet is 1500 ohms||0.85pF. The Alien H3 chip is packaged in a certain manufacturer, and then the impedance value of the packaged chip is tested in four steps.
第一步：制作大小两种线圈，即线圈L1和线圈L2，L1＝45nH，L2＝35nH，这两个值可以通过测试得到，因为线圈L1和线圈L2的尺寸在厘米级，所以测试准确。Step 1: Make coils of two sizes, namely coil L 1 and coil L 2 , L 1 = 45nH, L 2 = 35nH, these two values can be obtained through testing, because the size of coil L 1 and coil L 2 is in centimeters level, so the test is accurate.
第二步：制作网络分析仪用第三线圈L3。经测试得到L3＝50nHThe second step: making the third coil L 3 for the network analyzer. L 3 ＝50nH is obtained through testing
这个线圈L3和它自身的寄生电容谐振，产生自身谐振频率值。这个谐振值应当大于1.2GHz。这里定义L3线圈的自身谐振值为网络分析仪测得虚部为0的频率值。对900MHz超高频RFID芯片来说，线圈L3的自身谐振值为ω3＝2πf3，f3应大于1.2GHz。This coil L3 resonates with its own parasitic capacitance, resulting in a self-resonant frequency value. This resonance value should be greater than 1.2GHz. The self-resonant value of L3 coil is defined here as the frequency value whose imaginary part is 0 as measured by the network analyzer. For a 900MHz UHF RFID chip, the self-resonant value of the coil L 3 is ω 3 =2πf 3 , and f 3 should be greater than 1.2GHz.
第三步：利用线圈互感，测试两个带芯片的线圈L1和L2的谐振值。Step 3: Use the coil mutual inductance to test the resonance value of the two coils L 1 and L 2 with chips.
将线圈L3接网络分析仪的一个端口，网络分析仪设置为测试s参数绝对值的模式。这时候，将第一线圈L1(或第二线圈L2)靠近第三线圈L3，如图1、图2所示。需要说明的是，超高频RFID芯片被分别封装到线圈线圈L1(或线圈L2)上，当线圈L1(或线圈L2)靠近第三线圈L3时，在网络分析仪上，可以观察到s参数绝对值曲线变化，即图3、图4所示曲线。Connect the coil L 3 to a port of the network analyzer, and set the network analyzer to the mode of testing the absolute value of the s parameter. At this time, the first coil L 1 (or the second coil L 2 ) is placed close to the third coil L 3 , as shown in FIG. 1 and FIG. 2 . It should be noted that the UHF RFID chip is respectively packaged on the coil coil L 1 (or coil L 2 ), when the coil L 1 (or coil L 2 ) is close to the third coil L 3 , on the network analyzer, It can be observed that the absolute value curve of the s parameter changes, that is, the curves shown in Figure 3 and Figure 4 .
图3中，横轴为扫描频率，从0.7GHz到1GHz，纵轴为s参数绝对值，可以看到s参数绝对值有一个极小值d1，极小值的数据为0.7498GHz。这就是测得的线圈L1谐振值。In Figure 3, the horizontal axis is the scanning frequency, from 0.7GHz to 1GHz, and the vertical axis is the absolute value of the s parameter. It can be seen that the absolute value of the s parameter has a minimum value d1, and the data of the minimum value is 0.7498GHz. This is the measured coil L1 resonance value.
图4中，横轴为扫描频率，从0.7GHz到1GHz，纵轴为s参数绝对值，可以看到s参数绝对值有一个极小值e1，极小值的数据为0.8521GHz。这就是测得的线圈L2谐振值。In Figure 4, the horizontal axis is the scanning frequency, from 0.7GHz to 1GHz, and the vertical axis is the absolute value of the s parameter. It can be seen that the absolute value of the s parameter has a minimum value e1, and the data of the minimum value is 0.8521GHz. This is the measured coil L2 resonance value.
第四步：利用数据处理，得到超高频RFID芯片带封装阻抗的实部和虚部。The fourth step: use data processing to obtain the real part and imaginary part of the package impedance of the UHF RFID chip.
芯片电容值
以及芯片电阻值
其中，L1＝45nH，L2＝35nH,ω1＝2π*0.7498GHz,ω1＝2π*0.8521GHzAmong them, L 1 =45nH, L 2 =35nH, ω 1 =2π*0.7498GHz, ω 1 =2π*0.8521GHz
代入公式可以得到Cp＝0.981pF，Rp＝1521.52ohmSubstituting into the formula can get C p ＝0.981pF, R p ＝1521.52ohm
对比Alien H3芯片,datesheet给出的阻抗设计参考值为1500欧姆||0.85pF，可以看到封装后的芯片阻抗确实和datesheet给出的阻抗设计参考值有区别。封装引入了21.52ohm电阻和0.131pF电容。Compared with the Alien H3 chip, the impedance design reference value given by the datesheet is 1500 ohms||0.85pF. It can be seen that the chip impedance after packaging is indeed different from the impedance design reference value given by the datesheet. The package introduces a 21.52ohm resistor and a 0.131pF capacitor.
本实施例，仅给出了一种特定的情况，本技术领域人员都可以很容易的理解，对本实施例做出的局部修改，但采用了本发明的技术方案和思路，应当在本发明的保护范围内。比如线圈形状从圆形改为方形、三角形或其他形状，或者增加多个测试线圈，组成多个数据求平均等，均在本发明的保护范围内。This embodiment only provides a specific situation, and those skilled in the art can easily understand that the partial modifications made to this embodiment, but adopt the technical scheme and ideas of the present invention, should be included in the scope of the present invention within the scope of protection. For example, changing the shape of the coil from a circle to a square, triangle or other shapes, or adding multiple test coils to form multiple data for averaging, etc., are all within the protection scope of the present invention.
Claims (5)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201710059811.2A CN106645971B (en) | 2017-01-24 | 2017-01-24 | A method for testing UHF RFID chip band package impedance using resonance method |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201710059811.2A CN106645971B (en) | 2017-01-24 | 2017-01-24 | A method for testing UHF RFID chip band package impedance using resonance method |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN106645971A CN106645971A (en) | 2017-05-10 |
| CN106645971B true CN106645971B (en) | 2023-05-09 |
Family
ID=58842338
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201710059811.2A Active CN106645971B (en) | 2017-01-24 | 2017-01-24 | A method for testing UHF RFID chip band package impedance using resonance method |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN106645971B (en) |
Citations (12)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN202013379U (en) * | 2010-12-08 | 2011-10-19 | 中山达华智能科技股份有限公司 | Passive RFID electronic tag card resonant frequency point test device |
| CN102236069A (en) * | 2010-04-27 | 2011-11-09 | 中芯国际集成电路制造(上海)有限公司 | Test system and test method |
| CN102680781A (en) * | 2012-04-28 | 2012-09-19 | 深圳光启创新技术有限公司 | Calibration device and metamaterial resonant frequency testing platform |
| CN102735943A (en) * | 2012-07-10 | 2012-10-17 | 杭州电子科技大学 | Sensor for detecting resonance frequency and Q-value of passive electronic tag |
| CN103135138A (en) * | 2011-11-30 | 2013-06-05 | 索尼公司 | Detecting device, power receiving device, contactless power transmission system, and detecting method |
| CN103267911A (en) * | 2013-04-26 | 2013-08-28 | 苏州德诚物联科技有限公司 | Non-contact test system and method of RFID label antenna |
| CN103299325A (en) * | 2011-01-14 | 2013-09-11 | 株式会社村田制作所 | Rfid chip package and rfid tag |
| CN103675465A (en) * | 2013-12-09 | 2014-03-26 | 浙江大学 | Complex dielectric constant measuring device and method based on wireless energy transmission principle |
| CN103961106A (en) * | 2013-01-29 | 2014-08-06 | 杭州诺尔康神经电子科技有限公司 | Method for measuring thickness of skin flap and detecting receiving coil |
| CN104614595A (en) * | 2015-02-12 | 2015-05-13 | 哈尔滨工业大学 | Non-contact Measurement Method of Natural Frequency and Quality Factor of Resonant Coil |
| CN104682576A (en) * | 2015-03-01 | 2015-06-03 | 华南理工大学 | Resonance wireless power transmission system added with adaptive double-end impendence conversion networks |
| CN105653848A (en) * | 2015-12-25 | 2016-06-08 | 大连理工大学 | Method for measuring coupling coil parameters by single-port impendence and sensitivity |
Family Cites Families (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US9726721B2 (en) * | 2014-07-02 | 2017-08-08 | Avery Dennison Retail Information Services, Llc | Oscillation-based systems and methods for testing RFID straps |
-
2017
- 2017-01-24 CN CN201710059811.2A patent/CN106645971B/en active Active
Patent Citations (12)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102236069A (en) * | 2010-04-27 | 2011-11-09 | 中芯国际集成电路制造(上海)有限公司 | Test system and test method |
| CN202013379U (en) * | 2010-12-08 | 2011-10-19 | 中山达华智能科技股份有限公司 | Passive RFID electronic tag card resonant frequency point test device |
| CN103299325A (en) * | 2011-01-14 | 2013-09-11 | 株式会社村田制作所 | Rfid chip package and rfid tag |
| CN103135138A (en) * | 2011-11-30 | 2013-06-05 | 索尼公司 | Detecting device, power receiving device, contactless power transmission system, and detecting method |
| CN102680781A (en) * | 2012-04-28 | 2012-09-19 | 深圳光启创新技术有限公司 | Calibration device and metamaterial resonant frequency testing platform |
| CN102735943A (en) * | 2012-07-10 | 2012-10-17 | 杭州电子科技大学 | Sensor for detecting resonance frequency and Q-value of passive electronic tag |
| CN103961106A (en) * | 2013-01-29 | 2014-08-06 | 杭州诺尔康神经电子科技有限公司 | Method for measuring thickness of skin flap and detecting receiving coil |
| CN103267911A (en) * | 2013-04-26 | 2013-08-28 | 苏州德诚物联科技有限公司 | Non-contact test system and method of RFID label antenna |
| CN103675465A (en) * | 2013-12-09 | 2014-03-26 | 浙江大学 | Complex dielectric constant measuring device and method based on wireless energy transmission principle |
| CN104614595A (en) * | 2015-02-12 | 2015-05-13 | 哈尔滨工业大学 | Non-contact Measurement Method of Natural Frequency and Quality Factor of Resonant Coil |
| CN104682576A (en) * | 2015-03-01 | 2015-06-03 | 华南理工大学 | Resonance wireless power transmission system added with adaptive double-end impendence conversion networks |
| CN105653848A (en) * | 2015-12-25 | 2016-06-08 | 大连理工大学 | Method for measuring coupling coil parameters by single-port impendence and sensitivity |
Non-Patent Citations (4)
| Title |
|---|
| 康昊等.无线无源压力传感器前端特征参数提取方法研究.传感器与微系统.2013,第32卷(第10期),第13-15、20页. * |
| 杨伟钧等.公交IC卡互联互通下的谐振频率测试方法研究.电子测量技术.2016,第39卷(第2期),第18-24页. * |
| 王蕴达等.电容式射频微机械谐振器芯片级测试技术.测试技术学报.2008,第22卷(第4期),第307-312页. * |
| 靳钊等.基于源牵引的射频识别芯片的阻抗及灵敏度测量.仪器仪表学报.2010,第31卷(第12期),第2842-2847页. * |
Also Published As
| Publication number | Publication date |
|---|---|
| CN106645971A (en) | 2017-05-10 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN102236069B (en) | Test system and test method | |
| JP6253588B2 (en) | Antenna structure and RFID transponder system provided with antenna structure | |
| CN104518283B (en) | Multifrequency antenna for application to be miniaturized | |
| CN103278181B (en) | A kind of wireless sensing circuit of passive LC resonator sensor | |
| CN108008222B (en) | Coupled resonator parameter extraction device and extraction method thereof | |
| CN104297566B (en) | Method for measuring antenna impedance on ultrahigh frequency radio frequency identification electronic tag | |
| CN104297567B (en) | Fixture for measuring antenna impedance on UHF RFID tags | |
| CN205862353U (en) | A kind of double frequency RFID label tag | |
| CN104487985A (en) | Rfid tag inspection method, and inspection device | |
| CN108107339A (en) | For the chip impedance of ultra-high frequency RFID label and the test method of sensitivity | |
| CN203231758U (en) | A Wireless Readout Circuit of Passive LC Resonant Sensor | |
| CN106645971B (en) | A method for testing UHF RFID chip band package impedance using resonance method | |
| CN110426064A (en) | Wireless sourceless sensor and wireless and passive method for sensing | |
| CN206638734U (en) | A kind of device that the encapsulation impedance of ultrahigh frequency RFID chip belt is tested using the resonance method | |
| CN102375101B (en) | Passive device test de-embedding method by adopting different layers of metal lead to connect out | |
| CN107121444A (en) | A kind of passive and wireless humidity sensor detected based on RCS | |
| Gvozdenovic et al. | HF RFID spiral inductor synthesis and optimization | |
| Mourad et al. | System modeling of the RFID contactless inductive coupling using 13.56 MHz loop antennas | |
| CN110018351A (en) | A kind of contactless antenna impedance measurement method and its measuring system | |
| CN101241152A (en) | A device for detecting the resonant frequency of a passive RFID electronic tag | |
| Fischbacher et al. | EC model for WPT and NFC systems interoperability analysis | |
| CN109001500A (en) | A kind of radio-frequency devices test probe of embedded inductance | |
| CN209471158U (en) | A RF Device Test Probe with Embedded Inductance | |
| CN102999670B (en) | The method for designing of 13.56MHz RFID card reader near field antenna | |
| Ma et al. | Electrically small UHF RFID tag antenna based on inductively coupled resonant LC tank |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| GR01 | Patent grant | ||
| GR01 | Patent grant | ||
| CP03 | Change of name, title or address | ||
| CP03 | Change of name, title or address |
Address after: 528200 Fourth Floor, No. 8 Chuangzhi Road, Guicheng Street, Nanhai District, Foshan City, Guangdong Province Patentee after: Foshan ruilianfu Electronic Technology Co.,Ltd. Country or region after: China Address before: Unit B2, 5th floor, block B, 5 Pingzhou Nangang street, Guicheng Street, Nanhai District, Foshan City, Guangdong Province, 528200 Patentee before: FOSHAN RUIFU IOT TECHNOLOGY CO.,LTD. Country or region before: China |