CN106642709A - High-speed heating electronic boiler - Google Patents
High-speed heating electronic boiler Download PDFInfo
- Publication number
- CN106642709A CN106642709A CN201610962168.XA CN201610962168A CN106642709A CN 106642709 A CN106642709 A CN 106642709A CN 201610962168 A CN201610962168 A CN 201610962168A CN 106642709 A CN106642709 A CN 106642709A
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- China
- Prior art keywords
- water
- boiler
- heater
- water tank
- valve
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
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- 238000010438 heat treatment Methods 0.000 title claims abstract description 44
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims abstract description 132
- 239000000919 ceramic Substances 0.000 claims abstract description 49
- 239000004065 semiconductor Substances 0.000 claims abstract description 30
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 claims abstract description 11
- 238000001179 sorption measurement Methods 0.000 claims abstract description 9
- 229910052782 aluminium Inorganic materials 0.000 claims abstract description 8
- 238000004321 preservation Methods 0.000 claims description 15
- 239000000470 constituent Substances 0.000 claims description 3
- 239000002245 particle Substances 0.000 claims description 3
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 claims 2
- 150000001875 compounds Chemical class 0.000 claims 1
- 239000004020 conductor Substances 0.000 claims 1
- 229910052757 nitrogen Inorganic materials 0.000 claims 1
- 230000005611 electricity Effects 0.000 abstract description 8
- 238000009413 insulation Methods 0.000 abstract description 7
- 238000000926 separation method Methods 0.000 abstract description 3
- 229910052751 metal Inorganic materials 0.000 description 7
- 239000002184 metal Substances 0.000 description 7
- 238000005485 electric heating Methods 0.000 description 3
- 230000000694 effects Effects 0.000 description 2
- 239000002360 explosive Substances 0.000 description 2
- 239000011810 insulating material Substances 0.000 description 2
- 150000004767 nitrides Chemical class 0.000 description 2
- 230000001105 regulatory effect Effects 0.000 description 2
- 238000010521 absorption reaction Methods 0.000 description 1
- 238000005273 aeration Methods 0.000 description 1
- 230000032683 aging Effects 0.000 description 1
- 239000004411 aluminium Substances 0.000 description 1
- 230000004888 barrier function Effects 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 238000009835 boiling Methods 0.000 description 1
- 230000007812 deficiency Effects 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 239000008236 heating water Substances 0.000 description 1
- 238000005286 illumination Methods 0.000 description 1
- 239000007788 liquid Substances 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 229910052573 porcelain Inorganic materials 0.000 description 1
- 230000011218 segmentation Effects 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
Classifications
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F24—HEATING; RANGES; VENTILATING
- F24H—FLUID HEATERS, e.g. WATER OR AIR HEATERS, HAVING HEAT-GENERATING MEANS, e.g. HEAT PUMPS, IN GENERAL
- F24H9/00—Details
- F24H9/18—Arrangement or mounting of grates or heating means
- F24H9/1809—Arrangement or mounting of grates or heating means for water heaters
- F24H9/1818—Arrangement or mounting of electric heating means
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Thermal Sciences (AREA)
- Chemical & Material Sciences (AREA)
- Combustion & Propulsion (AREA)
- Mechanical Engineering (AREA)
- General Engineering & Computer Science (AREA)
- Resistance Heating (AREA)
Abstract
The invention provides a high-speed heating electronic boiler. A return water pump of the high-speed heating electronic boiler is connected with a double-layer insulation water tank. The upper portion of the double-layer insulation water tank is opened to be connected with a boiler water outlet pipe, and a water returning opening and a water replenishing opening are formed in the bottom of the double-layer insulation water tank. The middle of the double-layer insulation water tank is connected with a boiler water inlet pipe. A plurality of ceramic semiconductor heaters are placed inside the boiler. An aluminum heater shell is arranged outside the ceramic semiconductor heaters. A resistor heating element, a carrying wafer, a power supply terminal and an adsorption electrode are sequentially arrayed inside the aluminum heater shell. The power supply terminal is connected with AC/DC inverters. The ceramic semiconductor heaters are connected with one another through water pipelines, and water pipelines are also arranged inside the ceramic semiconductor heaters. The high-speed heating electronic boiler has the advantages and characteristics of being capable of truly achieving water and electricity separation, safe and explosionproof, durable in use, free of scaling, capable of reducing costs, high in heat efficiency, self-adjustable in power, long in service life, small in power attenuation and the like.
Description
Technical field
The present invention relates to Electronic boiler field, more particularly, to a kind of high-speed heating Electronic boiler.
Background technology
For many years, the electricity of numerous unit lives such as each area of China and school, hotel, hospital, factory, army adds
Heated filament is the electric heating boiler of thermal source.Electrical heating wire is that the electric heating boiler of thermal source is：Heater strip is mounted in metal tube, with absolutely
Edge material isolates heating wire and metallic walls insulate, prevent electric leakage, powered metal is inserted and is heated in water.Heating wire has light
Consumption, power consumption.Burn during heating it is red want 500 DEG C～more than 1000 DEG C heating, heating wire is red, has light to consume, as long as heating heat consumption（Such as electricity
Lamp, is illumination, and the bright back light of the lamp heat that is soaked is heat loss）, the light consumption of heating wire wrapped up with insulating materials metal tube, to liquid plus
Heat slatterns about more than 30% electric energy without effect.Heating wire is isolated in metal tube by insulating materials, is transmitted to metal
Pipe outer wall consumes heat energy.Metal tube insulation encases electric-heating-wire-heating, makees storage-type heating, and heating wire is easily aging, come off, and blows
Afterwards, insulating barrier can be punctured and links electric leakage with metal, there is electricity in water, security incident can be caused.Electric-heating-wire-heating not only takes electricity, and
There is noise（Boiling water sound）, electrothermal tube inserted in water, high-temperature heating water, and tube wall produces a large amount of bubbles, aeration heat transfer.Storage
Water heating is heat transfer sensing heating, and many reasons cause strip heater effect low.High-velocity electrons boiler then really does
To electricity separation, safety anti-explosive, durable in use, non-scaling, cost-saving, thermal efficiency height, power self-regulated, long service life, power
The features such as decay is few.It is the optimal selection for substituting electrical heating wire for the electric heating boiler of thermal source.
The content of the invention
It is an object of the invention to solve the deficiencies in the prior art, and a kind of high-speed heating Electronic boiler is provided.
The new technical scheme of the present invention is：A kind of high-speed heating Electronic boiler, including back water pump, double-layer heat preservation water tank, give
Water pump and boiler, described back water pump includes back water pump outlet valve, back water pump imported valve, back water pump, double-layer heat preservation water tank
Including water container backwater mouth, water tank water supply valve and water outlet pipeline, feed pump includes feed pump, inlet valve and blowdown apparatus overflow
Valve, boiler include cabinet, inlet valve, flowing water Valve, control circuit, power switch, flow sensor, water pipe line loop and
Alternating current-direct current inverter, temperature element and ceramic semiconductors heater；Wherein back water pump is connected with double-layer heat preservation water tank, double-layer heat insulation
The upper opening of water tank is connected with boiler flowing water Valve, and bottom is respectively equipped with water container backwater mouth and water tank water supply valve, middle part with
Boiler feed water valve connects, and multiple ceramic semiconductors heaters are laid in boiler, and outside ceramic semiconductors heater aluminium is provided with
Heater housings processed, are furnished with successively resistance heater, load wafer, power supply terminal and absorption electricity inside aluminum heater housings
Pole, wherein power supply terminal are connected with alternating current-direct current inverter；Multiple ceramic semiconductors heaters are connected with each other by water pipeline, and are made pottery
The inside of porcelain semiconductor heat booster is water pipeline.
Described double-layer heat preservation water tank bottom water tank passes through a controllable feed pump phase with boiler bottom inlet valve
Connection, is equipped with blowdown apparatus flow spill valve between feed pump and double-layer heat preservation water tank, feed pump is parallel with flow spill valve.
Described boiler internal is provided with water pipe, and least one set ceramic semiconductors heater is connected with water pipe, interior logical boiler
Water.
Described ceramic semiconductors heater includes load wafer, tabular ceramic body, resistance heater, adsorption electrode, confession
There are electric terminal and aluminum metal shell, resistance heater the more several electroconductive particles being made up of conductive composition to surround
Insulating properties constituent.
At least a portion of described resistance heater forms groove portion, so as to form resistance adjustment portion, adjusts resistance heating
Amount, is connected with power supply terminal, can be from outside supply electric power, while determining the temperature of ceramic tile body, one side with temperature element
Plus thermal bimorph resistance heater when being divided into plurality of regions, the temperature in each region of independent control, adjustment is applied to feeder ear
The electric power of son, making the temperature of each temperature element becomes each setting value so that be loaded in the surface temperature of the chip of loading surface into
For homogeneous.
The tabular ceramic body that described ceramic tile body is made up of nitride ceramics or carbide ceramics is constituted and is advisable.
Pair of lamina water tank is set up at described boiler rear portion, and the water in water tank is connected with boiler water, and water tank upper strata is boiler
Through ceramic semiconductors heater hot water out, lower floor is backwater.
One face heating surface of described ceramic semiconductors heater, another side has resistance heater, resistance heater segmentation
For plurality of regions when, the temperature in each region of independent control, so as to supply electric power in the power supply terminal of each adsorption electrode, adjustment applies
The electric power of power supply terminal is added in, making the temperature of each temperature element becomes each setting value, makes to be loaded in the chip of loading surface from face
Surface temperature becomes homogeneous.
The invention has the beneficial effects as follows：High-velocity electrons boiler is truly realized electricity separation, safety anti-explosive, durable in use, no
The features such as fouling, cost-saving, thermal efficiency height, power self-regulated, long service life, few power attenuation.
Description of the drawings
Fig. 1 is the structural representation of the present invention.
Wherein：1 is back water pump, 2 is double-layer heat preservation water tank, 3 is feed pump, 4 is flow spill valve, 5 is flowing water Valve, 6 are
Flow sensor, 7 be power switch, 8 be water outlet pipeline, 9 be cabinet, 10 be ceramic semiconductors heater, 11 be alternating current-direct current it is inverse
Become device, 12 be control circuit, 13 be water pipe line loop, 14 be temperature element, 15 be back water pump outlet valve, 16 be water intaking valve
Door, 17 be blowdown apparatus flow spill valve, 18 be water tank water supply valve, 19 be water container backwater mouth, 20 be back water pump imported valve.
Specific embodiment
Below in conjunction with the accompanying drawings the present invention will be further described.
A kind of high-speed heating Electronic boiler, including back water pump 1, double-layer heat preservation water tank 2, feed pump 3 and boiler, described returns
Water pump 1 includes back water pump outlet valve 15, back water pump imported valve 20, back water pump 1, and double-layer heat preservation water tank 2 includes water container backwater
Mouth 19, water tank water supply valve 18 and water outlet pipeline 8, feed pump 3 includes feed pump 3, inlet valve 16 and blowdown apparatus overflow valve
Door 17, boiler includes cabinet 9, inlet valve 16, flowing water Valve 5, control circuit 12, power switch 7, flow sensor 6, water pipe
Line loop 13 and alternating current-direct current inverter 11, temperature element 14 and ceramic semiconductors heater 10；Wherein back water pump 1 and double-layer heat insulation
Water tank 2 connects, and the upper opening of double-layer heat preservation water tank 2 is connected with boiler flowing water Valve 5, and bottom is respectively equipped with water container backwater mouth 19
And water tank water supply valve 18, middle part is connected with boiler feed water valve 16, and multiple ceramic semiconductors heaters 10 are laid in boiler,
Aluminum heater housings are provided with outside ceramic semiconductors heater 10, resistance heating is furnished with inside aluminum heater housings successively
Body, load wafer, power supply terminal and adsorption electrode, wherein power supply terminal are connected with alternating current-direct current inverter 11；Multiple ceramics are partly led
Body heater 10 is connected with each other by water pipeline, and the inside of ceramic semiconductors heater 10 is water pipeline.
The described bottom water tank of double-layer heat preservation water tank 2 passes through a controllable feed pump with boiler bottom inlet valve 16
3 are connected, and blowdown apparatus flow spill valve 17 is housed between feed pump 3 and double-layer heat preservation water tank 2, and feed pump 3 is parallel with overflow valve
Door 4.
Described boiler internal is provided with water pipe, and least one set ceramic semiconductors heater 10 is connected with water pipe, interior logical pot
Stove water.
Described ceramic semiconductors heater 10 include load wafer, tabular ceramic body, resistance heater, adsorption electrode,
There are power supply terminal and aluminum metal shell, resistance heater the more several electroconductive particles being made up of conductive composition to enclose
Around insulating properties constituent.
At least a portion of described resistance heater forms groove portion, so as to form resistance adjustment portion, adjusts resistance heating
Amount, is connected with power supply terminal, can from outside supply electric power, while determine the temperature of ceramic tile body with temperature element 14, one
While when adding thermal bimorph that resistance heater is divided into plurality of regions, the temperature in each region of independent control, adjustment is applied to power supply
The electric power of terminal, making the temperature of each temperature element 14 becomes each setting value, so that being loaded in the surface temperature of the chip of loading surface
Degree becomes homogeneous.
The tabular ceramic body that described ceramic tile body is made up of nitride ceramics or carbide ceramics is constituted and is advisable.
Pair of lamina water tank is set up at described boiler rear portion, and the water in water tank is connected with boiler water, and water tank upper strata is boiler
Through the hot water out of ceramic semiconductors heater 10, lower floor is backwater.
One face heating surface of described ceramic semiconductors heater 10, another side has resistance heater, resistance heater point
When being segmented into plurality of regions, the temperature in each region of independent control, so as to supply electric power, adjustment in the power supply terminal of each adsorption electrode
The electric power of power supply terminal is applied to, making the temperature of each temperature element 14 becomes each setting value, makes to be loaded in the crystalline substance of loading surface from face
The surface temperature of piece becomes homogeneous.
Claims (8)
1. a kind of high-speed heating Electronic boiler, including back water pump（1）, double-layer heat preservation water tank（2）, feed pump（3）And boiler, it is special
Levy and be：Described back water pump（1）Including back water pump outlet valve（15）, back water pump imported valve（20）, back water pump（1）, it is double
Layer attemperater（2）Including water container backwater mouth（19）, water tank water supply valve（18）And water outlet pipeline（8）, feed pump（3）Including to
Water pump（3）, inlet valve（16）And blowdown apparatus flow spill valve（17）, boiler include cabinet（9）, inlet valve（16）, water outlet
Valve（5）, control circuit（12）, power switch（7）, flow sensor（6）, water pipe line loop（13）And alternating current-direct current inverter
（11）, temperature element（14）And ceramic semiconductors heater（10）；Wherein back water pump（1）With double-layer heat preservation water tank（2）Connection, it is double
Layer attemperater（2）Upper opening and boiler flowing water Valve（5）Connection, bottom is respectively equipped with water container backwater mouth（19）And water tank
Water supply valve（18）, middle part and boiler feed water valve（16）Connection, lays multiple ceramic semiconductors heaters in boiler（10）,
Ceramic semiconductors heater（10）Outside is provided with aluminum heater housings, is furnished with resistance heating inside aluminum heater housings successively
Body, load wafer, power supply terminal and adsorption electrode, wherein power supply terminal and alternating current-direct current inverter（11）Connection；Multiple ceramics half
Conductor heater（10）It is connected with each other by water pipeline, and ceramic semiconductors heater（10）Inside be water pipeline.
2. a kind of high-speed heating Electronic boiler according to claim 1, it is characterised in that：Described double-layer heat preservation water tank
（2）Bottom water tank and boiler bottom inlet valve（16）By a controllable feed pump（3）It is connected, feed pump（3）With
Double-layer heat preservation water tank（2）Between be equipped with blowdown apparatus flow spill valve（17）, feed pump（3）It is parallel with flow spill valve（4）.
3. a kind of high-speed heating Electronic boiler according to claim 1, it is characterised in that：Described boiler internal is provided with
Water pipe, least one set ceramic semiconductors heater（10）, it is connected with water pipe, interior logical boiler water.
4. a kind of high-speed heating Electronic boiler according to claim 1, it is characterised in that：Described ceramic semiconductors heating
Device（10）Include load wafer, tabular ceramic body, resistance heater, adsorption electrode, power supply terminal and aluminum metal shell, resistance
Heater has the insulating properties constituent that the more several electroconductive particles being made up of conductive composition are surrounded.
5. a kind of high-speed heating Electronic boiler according to claim 1, it is characterised in that：Described resistance heater is extremely
A few part forms groove portion, so as to form resistance adjustment portion, adjusts resistance heating amount, is connected with power supply terminal, can be from outside
Supply electric power, while using temperature element（14）The temperature of ceramic tile body is determined, while adding thermal bimorph that resistance heater is split
For plurality of regions when, the temperature in each region of independent control, adjustment is applied to the electric power of power supply terminal, makes each temperature element（14）
Temperature become each setting value so that the surface temperature for being loaded in the chip of loading surface becomes homogeneous.
6. a kind of high-speed heating Electronic boiler according to claim 1, it is characterised in that：Described ceramic tile body is by nitrogen
The tabular ceramic body that compound ceramics or carbide ceramics are constituted is constituted and is advisable.
7. a kind of high-speed heating Electronic boiler according to claim 1, it is characterised in that：Described boiler rear portion sets up one
Double-layer tank, the water in water tank is connected with boiler water, and water tank upper strata is boiler through ceramic semiconductors heater（10）Out
Hot water, lower floor is backwater.
8. a kind of high-speed heating Electronic boiler according to claim 1, it is characterised in that：Described ceramic semiconductors heating
Device（10）A face heating surface, another side has resistance heater, and when resistance heater is divided into plurality of regions, independent control is each
The temperature in region, so as to supply electric power in the power supply terminal of each adsorption electrode, adjustment is applied to the electric power of power supply terminal, makes each survey
Warm element（14）Temperature become each setting value, the surface temperature of the chip for being loaded in loading surface is made from face becomes homogeneous.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201610962168.XA CN106642709A (en) | 2016-10-28 | 2016-10-28 | High-speed heating electronic boiler |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201610962168.XA CN106642709A (en) | 2016-10-28 | 2016-10-28 | High-speed heating electronic boiler |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN106642709A true CN106642709A (en) | 2017-05-10 |
Family
ID=58821781
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201610962168.XA Pending CN106642709A (en) | 2016-10-28 | 2016-10-28 | High-speed heating electronic boiler |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN106642709A (en) |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2001041196A1 (en) * | 1999-11-30 | 2001-06-07 | Wafermasters, Incorporated | Resistively heated single wafer furnace |
| CN1708190A (en) * | 2004-05-26 | 2005-12-14 | 京瓷株式会社 | Heater, wafer heating device, and method for manufacturing heater |
| CN201396902Y (en) * | 2009-05-22 | 2010-02-03 | 丛林 | Quick heat semiconductor electric heater |
| CN105890149A (en) * | 2016-06-07 | 2016-08-24 | 上海尼晶电子科技有限公司 | Novel semiconductor instant liquid electric heater |
-
2016
- 2016-10-28 CN CN201610962168.XA patent/CN106642709A/en active Pending
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2001041196A1 (en) * | 1999-11-30 | 2001-06-07 | Wafermasters, Incorporated | Resistively heated single wafer furnace |
| CN1708190A (en) * | 2004-05-26 | 2005-12-14 | 京瓷株式会社 | Heater, wafer heating device, and method for manufacturing heater |
| CN201396902Y (en) * | 2009-05-22 | 2010-02-03 | 丛林 | Quick heat semiconductor electric heater |
| CN105890149A (en) * | 2016-06-07 | 2016-08-24 | 上海尼晶电子科技有限公司 | Novel semiconductor instant liquid electric heater |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| TA01 | Transfer of patent application right |
Effective date of registration: 20170531 Address after: 101102, Beijing Zhongguancun Tongzhou District science and Technology Park, Tongzhou Park Jinqiao technology industry base, King Sheng, two south 25 street, building 23, building five, 501 Applicant after: BEIJING JIANENG GAOKE TECHNOLOGY CO.,LTD. Address before: 257000, room 2, unit 14, building 779, 502 the Yellow River Road, Dongying District, Shandong, Dongying Applicant before: Lv Chuanyu Applicant before: Wang Yanjin Applicant before: Yu Wenxing Applicant before: Zhang Suozhi |
|
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| RJ01 | Rejection of invention patent application after publication | ||
| RJ01 | Rejection of invention patent application after publication |
Application publication date: 20170510 |