CN106626378A - Dynamic adjustment method for process parameters in selective laser sintering sub regions - Google Patents
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- 238000000034 method Methods 0.000 title claims abstract description 63
- 238000000110 selective laser sintering Methods 0.000 title claims description 19
- 239000000843 powder Substances 0.000 claims abstract description 55
- 238000005245 sintering Methods 0.000 claims abstract description 11
- 239000011159 matrix material Substances 0.000 claims description 4
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- PCTMTFRHKVHKIS-BMFZQQSSSA-N (1s,3r,4e,6e,8e,10e,12e,14e,16e,18s,19r,20r,21s,25r,27r,30r,31r,33s,35r,37s,38r)-3-[(2r,3s,4s,5s,6r)-4-amino-3,5-dihydroxy-6-methyloxan-2-yl]oxy-19,25,27,30,31,33,35,37-octahydroxy-18,20,21-trimethyl-23-oxo-22,39-dioxabicyclo[33.3.1]nonatriaconta-4,6,8,10 Chemical compound C1C=C2C[C@@H](OS(O)(=O)=O)CC[C@]2(C)[C@@H]2[C@@H]1[C@@H]1CC[C@H]([C@H](C)CCCC(C)C)[C@@]1(C)CC2.O[C@H]1[C@@H](N)[C@H](O)[C@@H](C)O[C@H]1O[C@H]1/C=C/C=C/C=C/C=C/C=C/C=C/C=C/[C@H](C)[C@@H](O)[C@@H](C)[C@H](C)OC(=O)C[C@H](O)C[C@H](O)CC[C@@H](O)[C@H](O)C[C@H](O)C[C@](O)(C[C@H](O)[C@H]2C(O)=O)O[C@H]2C1 PCTMTFRHKVHKIS-BMFZQQSSSA-N 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 238000011217 control strategy Methods 0.000 description 1
- 238000005336 cracking Methods 0.000 description 1
- 238000004093 laser heating Methods 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 239000000203 mixture Substances 0.000 description 1
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Abstract
一种激光选区烧结分区域工艺参数动态调整方法，在SLS加工过程中通过热成像仪检测粉床加工平面温度场信息，利用检测到的温度场信息将粉床按温度划分为不同的区域，再结合切片轮廓信息对待加工区域进一步划分为属于不同温度区间的区域，有针对性地调整加工这些区域时用到的加工工艺参数如激光功率、扫描速度、扫描路径等，在加工过程中可多次进行检测，及时根据温度场变化调整工艺参数，本发明可以更为全面地利用粉床温度场信息，结合相应的控制操作，实现更为直接精准的温度控制，从而提高粉床温度场均匀性，进而提高SLS制件质量。
A dynamic adjustment method for process parameters of laser selective sintering and sub-regions. During SLS processing, the thermal imager is used to detect the temperature field information of the powder bed processing plane, and the powder bed is divided into different regions according to the temperature by using the detected temperature field information. Combined with slice profile information, the area to be processed is further divided into areas belonging to different temperature ranges, and the processing parameters used in processing these areas, such as laser power, scanning speed, scanning path, etc., can be adjusted multiple times during the processing process. By performing detection and adjusting process parameters in time according to changes in the temperature field, the present invention can make more comprehensive use of powder bed temperature field information, combined with corresponding control operations, to achieve more direct and precise temperature control, thereby improving the uniformity of the powder bed temperature field, And then improve the quality of SLS parts.
Description
技术领域technical field
本发明涉及选择性激光烧结技术领域，尤其涉及一种激光选区烧结分区域工艺参数动态调整方法。The invention relates to the technical field of selective laser sintering, in particular to a method for dynamically adjusting process parameters of laser selective sintering and sub-area.
背景技术Background technique
选择性激光烧结(Selective Laser Sintering，简称SLS)是一种利用激光加热粉末烧结成型的快速成型技术。在SLS技术中，激光束在计算机的控制下根据分层截面信息有选择地对粉床进行烧结，局部的输入热源造成了烧结过程中粉床温度场分布不均衡且不稳定，这就使得对温度场的控制极为困难。然而，温度场分布又是决定SLS加工质量的重要因素，如果温度场梯度过大，导致材料体系收缩不一致，易使烧结件出现变形、翘曲和开裂现象，严重影响烧结件的成型质量。因此，研究一种能实现有效控制粉床温度场分布的方法有着重要的意义。Selective Laser Sintering (SLS) is a rapid prototyping technology that uses laser heating powder sintering. In SLS technology, the laser beam selectively sinters the powder bed according to the layered cross-section information under the control of the computer. The local input heat source causes the distribution of the temperature field of the powder bed during the sintering process to be uneven and unstable, which makes the The control of the temperature field is extremely difficult. However, the temperature field distribution is an important factor determining the quality of SLS processing. If the temperature field gradient is too large, the material system will shrink inconsistently, which will easily cause deformation, warping and cracking of the sintered parts, which will seriously affect the molding quality of the sintered parts. Therefore, it is of great significance to study a method that can effectively control the distribution of the powder bed temperature field.
由于粉床温度场分布是不均衡和不稳定的，要想有效控制粉床的温度场，就要求控制系统能实时并且准确地采集当前的温度场信息，并将这些信息尽可能全面地利用起来，用于指导具体的温度控制操作。在目前已有的SLS温度控制技术中，温度采集方法有点温度采集和面温度采集两种方法。点温度采集如用热电偶采集粉床多点温度，这种用多个点来近似表示温度场的方法难以准确反映出所有的有效信息。面温度采集法如用红外摄像机进行温度采集，这种检测方法能够直接测出粉床温度分布，满足实时准确采集的要求。Since the temperature field distribution of the powder bed is unbalanced and unstable, in order to effectively control the temperature field of the powder bed, it is required that the control system can collect the current temperature field information in real time and accurately, and use this information as comprehensively as possible. , used to guide specific temperature control operations. In the current existing SLS temperature control technology, there are two methods of temperature collection: temperature collection and surface temperature collection. Point temperature collection, such as using thermocouples to collect multi-point temperature of the powder bed, this method of using multiple points to approximate the temperature field is difficult to accurately reflect all effective information. The surface temperature collection method, such as using an infrared camera for temperature collection, can directly measure the temperature distribution of the powder bed, meeting the requirements for real-time and accurate collection.
然而目前已有的使用了红外摄像机的SLS温度控制技术在温度场信息的有效利用上却有点不尽人意。已有的技术在获得粉床温度分布信息后，或者只将粉床划分为加工区域和非加工区域，然后取这些区域的平均温度作为控制依据；或者简单地将粉床按固定的物理位置划分区域，取每块区域的平均温度作为该区域的控制依据。用平均温度作为控制依据，极大地削减了原有的温度场所包含的信息量，不能准确地反映出粉床温度分布情况，从而难以获得理想的温度场控制效果。However, the existing SLS temperature control technology using infrared cameras is somewhat unsatisfactory in the effective use of temperature field information. After obtaining the powder bed temperature distribution information, the existing technology either only divides the powder bed into processing area and non-processing area, and then takes the average temperature of these areas as the control basis; or simply divides the powder bed according to fixed physical positions Area, take the average temperature of each area as the control basis of this area. Using the average temperature as the control basis greatly reduces the amount of information contained in the original temperature field, and cannot accurately reflect the temperature distribution of the powder bed, making it difficult to obtain an ideal temperature field control effect.
另外，现有的SLS温度场控制技术大多是进行预热系统的控制，未涉及到零件的断面信息和动态的工艺参数调控。不考虑零件的断面信息使得控制的针对性减少，而因为温度场随着时间是不断变化的，若不对工艺参数进行动态调控，及时对温度场的变化做出调整，而采用单一的工艺参数对粉床进行烧结，必将影响温度场的控制效果。In addition, most of the existing SLS temperature field control technologies are for the control of the preheating system, which does not involve the section information of the parts and the dynamic process parameter regulation. Regardless of the section information of the part, the pertinence of the control is reduced, and because the temperature field is constantly changing with time, if the process parameters are not dynamically adjusted, the changes in the temperature field are adjusted in time, and a single process parameter is used to control the temperature field. The sintering of the powder bed will definitely affect the control effect of the temperature field.
发明内容Contents of the invention
为了克服上述现有技术的缺点，本发明的目的在于提供一种激光选区烧结分区域工艺参数动态调整方法，可以更为全面地利用粉床温度场信息，结合相应的控制操作，实现更为直接精准的温度控制，从而提高粉床温度场均匀性，进而提高SLS制件质量。In order to overcome the shortcomings of the above-mentioned prior art, the purpose of the present invention is to provide a method for dynamic adjustment of process parameters of laser selective sintering and sub-area, which can make more comprehensive use of powder bed temperature field information, combined with corresponding control operations, to achieve more direct Precise temperature control improves the uniformity of powder bed temperature field and improves the quality of SLS parts.
为达到上述目的，本发明采取的技术方案如下：In order to achieve the above object, the technical scheme that the present invention takes is as follows:
一种激光选区烧结分区域工艺参数动态调整方法，包括以下步骤：A method for dynamically adjusting process parameters of laser selective sintering by region, comprising the following steps:
(1)在SLS加工平台上铺设一层粉末，开始一层粉末的加工；(1) lay a layer of powder on the SLS processing platform, and start the processing of a layer of powder;
(2)预热系统对粉床进行预热；(2) The preheating system preheats the powder bed;
(3)使用热成像仪实时检测粉床平面的温度场，拍摄成热成像图，并将热成像图中的温度场数据传入计算机；(3) Use a thermal imager to detect the temperature field of the powder bed plane in real time, take a thermal image, and transfer the temperature field data in the thermal image to the computer;
(4)利用粉床的温度场数据将粉床划分为分别属于不同温度区间的区域；(4) Using the temperature field data of the powder bed to divide the powder bed into regions belonging to different temperature intervals;
(5)利用当前层的切片轮廓信息，获得待加工区域的具体位置，将待加工区域与步骤(4)的温度区间的区域求交，将待加工区域进一步划分为属于新的不同温度区间的区域；(5) Utilize the slice contour information of the current layer to obtain the specific position of the area to be processed, intersect the area to be processed with the temperature range of step (4), and further divide the area to be processed into new different temperature ranges area;
(6)利用步骤(5)待加工区域内按温度区间划分的区域结果，按各区域所属的温度区间以及其相邻区域的相关信息，规划出各个区域加工的工艺参数的具体数值；(6) Utilize the regional results divided by temperature intervals in the area to be processed in step (5), according to the temperature intervals to which each region belongs and the relevant information of its adjacent regions, plan the specific numerical values of the process parameters processed in each region;
(7)启动激光器对待烧结区域进行加工；(7) Start the laser to process the area to be sintered;
(8)加工过程中每隔一段时间后，判断是否完成该层加工，如果是，则执行步骤(9)，如果未完成加工，则重复执行步骤(3)到步骤(7)，即加工过程中多次进行温度场的的检测，并用实时的温度场信息重新划分待加工部分的区域，实时对各个区域的工艺参数做出调整，并用调整后的工艺参数用于加工；(8) After a period of time during the processing, it is judged whether the processing of this layer is completed, if yes, then perform step (9), if the processing is not completed, then repeat step (3) to step (7), that is, the processing process The temperature field is detected multiple times in the process, and the area to be processed is re-divided with real-time temperature field information, and the process parameters of each area are adjusted in real time, and the adjusted process parameters are used for processing;
(9)判断是否已完成最后一层切片轮廓的加工，如果未完成，则返回步骤(1)，开始下一层切片轮廓加工；如果已完成，则结束加工。(9) Judging whether the processing of the last slice contour has been completed, if not, return to step (1) to start the processing of the next slice contour; if completed, end the processing.
所述步骤(3)中的温度场数据以矩阵方式存储，矩阵中位置为i行j列的元素的值为热成像图中的对应像素坐标为(i,j)的像素点处的温度值，同时对传入的温度场数据要进行噪声点滤除的数据处理操作。The temperature field data in the step (3) is stored in a matrix, and the value of the element in the matrix where the position is i row j column is the temperature value at the pixel point where the corresponding pixel coordinates in the thermal imaging map are (i, j) At the same time, the data processing operation of noise point filtering is performed on the incoming temperature field data.
所述的步骤(4)中的温度区间的总范围是由实时检测到粉床温度场的最高与最低温度所限定的一个温度范围，或是加工前根据经验设定好的一个固定的范围；温度区间的划分是对总温度范围进行均匀划分，或是根据经验对总温度范围进行非均匀划分。The total range of the temperature interval in the step (4) is a temperature range defined by the highest and lowest temperatures detected in the powder bed temperature field in real time, or a fixed range set according to experience before processing; The division of the temperature range is to divide the total temperature range uniformly, or to divide the total temperature range non-uniformly according to experience.
所述的步骤(4)中粉床按温度区间划分区域的结果以各区域间分界处的轮廓线表示。In the step (4), the result of dividing the powder bed into regions according to the temperature intervals is represented by the contour lines at the boundaries between the regions.
所述的步骤(5)中的切片轮廓是本层所要加工的切片轮廓，或是本层的下一层或下几层切片轮廓，其中使用本层的切片轮廓进行判断用于决定加工本层轮廓内部各区域时使用的工艺参数，使用本层的下一层或下几层切片轮廓进行判断用于预测加工这些层时所需的工艺参数，两类判断能够同步进行。The slice outline in the described step (5) is the slice outline to be processed in this layer, or the next layer or layers of slice outline of this layer, wherein the slice outline of this layer is used to determine the processing of this layer The process parameters used in each area inside the contour are judged by using the slice contour of the next layer or the next few layers to predict the process parameters required for processing these layers, and the two types of judgments can be performed simultaneously.
所述的步骤(6)中的加工工艺参数包括激光功率、扫描速度和扫描路径。The processing parameters in the step (6) include laser power, scanning speed and scanning path.
本发明与现有技术相比，有益效果为：Compared with the prior art, the present invention has beneficial effects as follows:
本发明在通过热成像仪获取温度分布信息后，按照温度区间将粉床划分为不同的区域，一方面有效利用了热成像仪检测到的温度场信息，另一方面由于各个区域内温度值相近，则在一个区域内可采取同一种有针对性的温度控制策略，相比传统的以平均温度为控制依据的SLS温度场控制技术能实现更直接有效的温度控制。The present invention divides the powder bed into different regions according to the temperature range after the temperature distribution information is obtained by the thermal imager, on the one hand, the temperature field information detected by the thermal imager is effectively used, on the other hand, since the temperature values in each region are similar , then the same targeted temperature control strategy can be adopted in a region, which can achieve more direct and effective temperature control than the traditional SLS temperature field control technology based on the average temperature.
本发明将粉床温度场信息与待加工的切片层轮廓信息结合起来，用于指导该切片轮廓加工时的工艺参数调整，实现了加工过程中工艺参数有针对性的动态调整。同时，本发明在控制操作上，可以将预热控制与加工时工艺参数的动态调整结合起来，相比传统的单一地控制预热温度场或使用固定的工艺参数进行加工的SLS技术，能实现更为灵活有效的温度场控制，从而能获得质量更好的烧结制件。The invention combines the temperature field information of the powder bed with the contour information of the slice layer to be processed, and is used to guide the adjustment of the technological parameters during the contour processing of the slice, and realizes the targeted dynamic adjustment of the technological parameters in the processing process. At the same time, in terms of control operation, the present invention can combine preheating control with dynamic adjustment of process parameters during processing. Compared with the traditional SLS technology that only controls the preheating temperature field or uses fixed process parameters for processing, it can realize More flexible and effective temperature field control, so that better quality sintered parts can be obtained.
附图说明Description of drawings
图1是本发明实施例的工作系统示意图。Fig. 1 is a schematic diagram of a working system of an embodiment of the present invention.
图2是本发明的流程示意图。Fig. 2 is a schematic flow chart of the present invention.
图3是本发明实施例的粉床区域划分的示意图。Fig. 3 is a schematic diagram of the division of the powder bed area according to the embodiment of the present invention.
图4是本发明实施例的切片层轮廓的示意图。Fig. 4 is a schematic diagram of a slice layer profile according to an embodiment of the present invention.
图5是本发明实施例在切片轮廓内按温度区间划分区域的示意图。Fig. 5 is a schematic diagram of dividing regions according to temperature intervals within a slice outline according to an embodiment of the present invention.
具体实施方式detailed description
以下将结合附图和实施例对本发明内容做进一步说明，但发明的实际应用并不仅限于下述的实施例。The content of the present invention will be further described below in conjunction with the accompanying drawings and embodiments, but the practical application of the invention is not limited to the following embodiments.
本实施例工作系统的组成如图1所示，在一层的加工过程中，先由铺粉装置4铺设一层粉末到粉床平面6上，铺粉完成后红外热成像仪2检测粉床平面6的温度分布，然后将温度场分布信息传入到计算机7中，计算机7对传入的温度场数据进行分析处理后控制预热装置3或激光器1进行相应的操作，以完成一层切片轮廓5的烧结，如此反复，最终完成整个三维物体的烧结。The composition of the working system of this embodiment is shown in Figure 1. During the processing of one layer, a layer of powder is first laid on the powder bed plane 6 by the powder spreading device 4. After the powder spreading is completed, the infrared thermal imager 2 detects the powder bed. The temperature distribution of the plane 6, and then the temperature field distribution information is sent to the computer 7, and the computer 7 analyzes and processes the incoming temperature field data, and then controls the preheating device 3 or the laser 1 to perform corresponding operations to complete a slice The sintering of the profile 5 is repeated so that the sintering of the entire three-dimensional object is finally completed.
参照图2，一种激光选区烧结分区域工艺参数动态调整方法，包括以下步骤：Referring to Fig. 2, a method for dynamic adjustment of process parameters of laser selective sintering and sub-area, including the following steps:
(1)铺粉装置4先在在SLS加工平台上的粉床平面6上铺设一层粉末，开始一层粉末的加工；(1) The powder spreading device 4 first lays one deck of powder on the powder bed plane 6 on the SLS processing platform, and starts the processing of one deck of powder;
(2)预热系统启动预热装置3对粉床进行预热；(2) The preheating system starts the preheating device 3 to preheat the powder bed;
(3)热成像2仪检测粉床平面6的温度场分布，并将温度场数据传入计算机7中；(3) The thermal imager 2 detects the temperature field distribution of the powder bed plane 6, and the temperature field data is imported into the computer 7;
(4)根据测得的粉床温度场的最高温和最低温，将处于最高温和最低温之间的这段温度均匀地划分为9个温度区间，按区间温度从低到高依次将区间编号为1到9，将粉床平面6上属于同一个温度区间的点合并为一个区域后，粉床被划分为若干个属于不同温度区间的区域，如图3所示，图3为以某次检测时获得的温度场数据为例，依据温度场分布数据将粉床平面进行划分后得到的区域划分图，其中区域A为温度区间编号为9的最高温区域，区域I为温度区间编号为1的最低温区域，因为温度的变化是连续的，其他区域的温度区间编号均可根据其与区域A和区域I的相对位置推断出来；(4) According to the highest temperature and the lowest temperature of the measured powder bed temperature field, the temperature between the highest temperature and the lowest temperature is evenly divided into 9 temperature intervals, and the intervals are numbered according to the interval temperature from low to high. 1 to 9, after merging the points belonging to the same temperature range on the powder bed plane 6 into one area, the powder bed is divided into several areas belonging to different temperature ranges, as shown in Figure 3, which is based on a certain detection Taking the temperature field data obtained at the time as an example, the area division map obtained by dividing the powder bed plane according to the temperature field distribution data, in which area A is the highest temperature area with the temperature interval number 9, and area I is the area with the temperature interval number 1 The lowest temperature area, because the temperature change is continuous, the temperature interval numbers of other areas can be inferred based on their relative positions with area A and area I;
(5)利用当前层的切片轮廓信息，获得待加工区域的具体位置，将粉床区域划分结果与待加工的切片层轮廓数据相结合，即将待烧结区域与步骤(4)的不同温度区间对应的区域求交集，将待烧结区域5划分为分别属于不同温度区间的区域。假设待烧结的切片层轮廓如图4所示，图4中外部的矩形框表示粉床边界，为了方便说明，假设图3为此时的粉床区域划分结果。对图3和图4求交集，即可得到如图5所示的待烧结区域内部区域划分结果，切片轮廓被划分为若干个分别属于不同温度区间的区域ABCD，其中区域A为温度区间编号为9的最高温区域，区域B、C、D分别属于温度区间8、7、6；(5) Use the slice profile information of the current layer to obtain the specific position of the area to be processed, and combine the powder bed area division result with the slice layer profile data to be processed, that is, the area to be sintered corresponds to the different temperature ranges of step (4) The intersection of the regions is calculated, and the region to be sintered 5 is divided into regions belonging to different temperature ranges. Assume that the outline of the sliced layer to be sintered is shown in Figure 4, and the outer rectangular frame in Figure 4 represents the boundary of the powder bed. Compute the intersection of Figure 3 and Figure 4, and the division result of the internal area of the area to be sintered can be obtained as shown in Figure 5. The slice contour is divided into several areas ABCD belonging to different temperature intervals, and the area A is the temperature interval numbered as The highest temperature area of 9, areas B, C, and D belong to temperature intervals 8, 7, and 6 respectively;
(6)利用步骤(5)中待加工区域内的区域划分，对属于不同温度区间的区域规划相应的加工工艺参数。以图5的区域划分结果为例，可分别对区域A、B、C、D采用不同的工艺参数进行加工。区域A由于温度最高，在加工该区域时可采取相应的措施降低该区域的温度上升量，如降低激光功率、提高扫描速度或采用能减少温度积累的扫描路径等方法来进行加工。对于区域D，由于其是加工区域内部温度最低的区域，则可采取措施适当提高该区域的温度上升量，如提高激光功率、降低扫描速度或采用能增加温度积累的扫描路径等方法来进行加工；(6) Using the area division in the area to be processed in step (5), plan corresponding processing parameters for areas belonging to different temperature ranges. Taking the region division results in Figure 5 as an example, regions A, B, C, and D can be processed with different process parameters. Because area A has the highest temperature, corresponding measures can be taken to reduce the temperature rise in this area when processing this area, such as reducing laser power, increasing scanning speed, or using scanning paths that can reduce temperature accumulation. For area D, since it is the area with the lowest temperature inside the processing area, measures can be taken to appropriately increase the temperature rise in this area, such as increasing the laser power, reducing the scanning speed, or using scanning paths that can increase temperature accumulation to process. ;
(7)启动激光器1对待烧结区域5进行加工；(7) Start the laser 1 to process the region 5 to be sintered;
(8)加工过程中每隔一段时间后，判断是否完成该层加工，如果是，则执行步骤(9)，如果未完成加工，则重复执行步骤(3)到步骤(7)，即加工过程中多次进行温度场的的检测，并用实时的温度场信息重新划分待加工部分的区域，实时对各个区域的工艺参数做出调整，并用调整后的工艺参数用于加工；(8) After a period of time during the processing, it is judged whether the processing of this layer is completed, if yes, then perform step (9), if the processing is not completed, then repeat step (3) to step (7), that is, the processing process The temperature field is detected multiple times in the process, and the area to be processed is re-divided with real-time temperature field information, and the process parameters of each area are adjusted in real time, and the adjusted process parameters are used for processing;
(9)判断是否已完成最后一层切片轮廓的加工，如果未完成，则返回步骤(1)，开始下一层切片轮廓加工；如果已完成，则结束加工。(9) Judging whether the processing of the last slice contour has been completed, if not, return to step (1) to start the processing of the next slice contour; if completed, end the processing.
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