CN106599980A - Radio IC device - Google Patents

Abstract

The present invention obtains a wireless IC device and parts for the wireless IC device having stable frequency characteristics. The wireless IC device includes: a wireless IC chip; a power supply circuit connected to the wireless IC chip and including a resonant circuit with a predetermined resonance frequency; transmitting a signaling signal provided by the power supply circuit, and/or receiving receiving a signal to supply to the radiation plate of the power supply circuit including an inductance element constituted by a coil-shaped electrode pattern whose winding axis is formed in a direction perpendicular to the radiation plate , the power supply circuit is magnetically coupled to the radiation plate.

Description

Wireless IC Devices

This application is a divisional case of the invention patent application with the application date of January 12, 2007, the application number "200780001074.5 (PCT/JP2007/050308)", and the invention title "wireless IC device and parts for wireless IC device" Application.

technical field

The present invention relates to a power supply circuit, in particular to a power supply circuit that can be suitably mounted on a wireless IC device used in an RFID (Radio Frequency Identification, radio frequency identification) system.

Background technique

In recent years, as a management system for articles, a reader-writer that generates an induced electromagnetic field and an IC tag (hereinafter referred to as a wireless IC device) attached to an article and storing specified information have been researched to communicate in a non-contact manner, thereby RFID system for information transfer. As a wireless IC device used in an RFID system, for example, devices described in Patent Documents 1 and 2 are known.

That is, as shown in FIG. 59, an antenna pattern 301 is provided on a plastic film 300, and a wireless IC chip 310 is mounted on one end of the antenna pattern 301. As shown in FIG. 60, an antenna pattern is provided on a plastic film 320. pattern 321 and radiation electrodes 322 , and components of the wireless IC chip 310 are mounted at predetermined positions on the antenna pattern 321 .

However, since the wireless IC chip 310 is mounted on an existing wireless IC device by connecting the wireless IC chip 310 and the antenna patterns 301 and 321 with gold bumps, it is necessary to position the tiny wireless IC chip 310 on a large-area film 300, 320 on. However, it is extremely difficult to mount the tiny wireless IC chip 310 on the large-area films 300 and 320, and if a positional deviation occurs during mounting, the resonant frequency characteristics of the antenna will change. Moreover, the resonant frequency characteristics of the antenna will also change due to the antenna patterns 301, 321 being rolled up or sandwiched by a dielectric (for example, sandwiched between books).

Patent Document 1: JP-A-2005-136528

Patent Document 2: JP-A-2005-244778

Contents of the invention

Therefore, an object of the present invention is to provide a wireless IC device having stable frequency characteristics and components that can be suitably used for the wireless IC device.

In order to achieve the object of the present invention, the wireless IC device of the first invention is characterized in that it includes: a wireless IC chip; and a power supply circuit connected to the wireless IC chip and provided with a power supply circuit including a resonant circuit having a predetermined resonant frequency a substrate; and a radiating plate that is attached to or placed close to the substrate of the power supply circuit, and radiates a transmission signal supplied from the power supply circuit, and/or receives a signal reception signal and provides it to the power supply circuit.

In the wireless IC device of the first invention, the wireless IC chip and the power supply circuit board may be arranged side by side on the wiring board, and may be connected via conductors provided on the wiring board.

The wireless IC device of the second invention is characterized by comprising: a wireless IC chip; a power supply circuit board on which the wireless IC chip is mounted and a power supply circuit including a resonance circuit having a predetermined resonance frequency; The power supply circuit substrate radiates the transmission signal supplied from the power supply circuit, and/or receives the reception signal and supplies it to the radiation plate of the power supply circuit.

In the wireless IC devices of the first and second inventions, the frequency of the transmitting signal radiated from the radiation plate and the frequency of the receiving signal supplied to the wireless IC chip are substantially determined by the resonance frequency of the resonance circuit of the power supply circuit board . The term "substantially determined" means that the frequency is slightly shifted due to the positional relationship between the power supply circuit board and the radiation plate, etc. That is, since the frequency of transmission and reception signals is fixed in the power supply circuit board, regardless of the shape, size, positional arrangement, etc. of the radiation plate, even if the wireless IC device is wound or sandwiched by a dielectric, for example, the frequency characteristic will be the same. does not change, so that stable frequency characteristics can be obtained.

In the wireless IC device of the second invention, the wireless IC chip is mounted on the power supply circuit board, and the power supply circuit board is provided on the radiation plate. The power supply circuit board has a considerably smaller area than the radiation plate, so the wireless IC chip can be mounted on the power supply circuit board with extremely high precision.

In the wireless IC devices of the first and second inventions, the radiation plates may be arranged on the front and back surfaces of the feeder circuit board. By sandwiching the power supply circuit substrate between two radiating plates, the energy radiated from the power supply circuit can be transferred to the front and back radiating plates respectively, thereby increasing the gain.

The resonant circuit described above may be a distributed constant type resonant circuit, or may be a lumped constant type resonant circuit composed of a capacitance pattern and an inductance pattern. A distributed constant type resonant circuit forms an inductance with a strip line or the like, and is useful especially when transmitting and receiving signals are in a high-frequency band of 5 GHz or higher, because the design of the resonant circuit is easy.

The lumped constant type resonant circuit may be an LC series resonant circuit or an LC parallel resonant circuit, or may have a structure including a plurality of LC series resonant circuits or a plurality of LC parallel resonant circuits. If the configuration of a lumped constant type resonant circuit that can form a resonant circuit with a capacitance pattern and an inductance pattern is adopted, the resonant circuit can be easily designed especially when the transmission and reception signals are in the low frequency band below 5 GHz, and it is not easily affected by radiation from the radiation plate. effects of other components. Furthermore, if the resonant circuit is constituted by a plurality of resonant circuits, the bandwidth of the transmission signal can be widened by coupling the resonant circuits.

Also, the capacitor pattern is a subsequent stage of the wireless IC chip, and if it is arranged between the wireless IC chip and the inductor pattern, surge withstand performance can be improved. Since the surge is a low-frequency current below 200MHz, it can be cut off by a capacitor, and the wireless IC chip can be prevented from being damaged by the surge.

In addition, the capacitor pattern and the inductor pattern may be arranged parallel to the radiation plate. That is, the capacitance pattern and the inductance pattern are arranged so that they are not aligned in a straight line with respect to the radiation plate, and the electric field due to the capacitance pattern and the magnetic field due to the inductance pattern directly act on the radiation plate, respectively. In this way, the magnetic field formed by the inductance pattern will not be shielded by the capacitance pattern, and the radiation efficiency radiated from the inductance pattern can be improved. In addition, reflectors and/or directors may be arranged at the portion where the magnetic field is formed by the inductance pattern. In this way, the radiation characteristics and directivity of the power supply circuit to the radiation plate can be easily adjusted, and the influence of the electromagnetic field from the outside can be eliminated as much as possible to stabilize the resonance characteristics.

The power supply circuit substrate may be a multilayer substrate formed by laminating multiple dielectric layers or magnetic layers. In this case, capacitor patterns and inductor patterns are formed on the surface and/or inside of the multilayer substrate. By constituting a resonant circuit with a multilayer substrate, elements (electrode patterns, etc.) constituting the resonant circuit can be formed not only on the surface of the substrate but also inside, and the size of the substrate can be reduced. Furthermore, it is also possible to improve the degree of freedom in arrangement of the resonant circuit elements, and to achieve high performance of the resonant circuit. The multilayer substrate may be a multilayer resin substrate formed by laminating a plurality of resin layers, or a ceramic multilayer substrate formed by laminating a plurality of ceramic layers. In addition, a thin-film multilayer substrate using thin-film forming technology may also be used. In the case of a ceramic multilayer substrate, the ceramic layer is preferably formed of a low-temperature sintered ceramic material. This is because silver and copper, which have low resistance values, can be used as resonant circuit members.

On the other hand, the power supply circuit substrate may also be a dielectric or magnetic single-layer substrate. In this case, the capacitance pattern and/or the inductance pattern are formed on the surface of the single-layer substrate. The material of the single-layer substrate can be resin or ceramics. The capacitance obtained by the capacitance pattern may be formed between planar electrodes formed on the front and back surfaces of the single-layer substrate, or may be formed between electrodes arranged side by side on one surface of the single-layer substrate.

The power supply circuit substrate is preferably a rigid substrate. If the substrate is a rigid substrate, the frequency of the transmission signal will be stable no matter what shape the wireless IC device is attached to. Furthermore, the wireless IC chip can be stably mounted on the rigid substrate. In contrast to this point, the radiation plate is preferably formed of a flexible metal film. If the radiation plate is flexible, it is possible to stick the wireless IC device on an object of any shape.

Furthermore, if the flexible metal film is held on the flexible resin film, handling of the wireless IC device itself becomes easy. In particular, if the wireless IC chip, the power supply circuit substrate, and the entire radiation plate are covered with a thin film, they can be protected from the external environment.

However, the electrical length of the radiating plate is preferably an integer multiple of the half-wavelength of the resonant frequency, so that the gain can be maximized. However, since the frequency is essentially determined by the resonant circuit, the length of the radiating plate does not necessarily have to be an integer multiple of the half-wavelength of the resonant frequency. This compares very favorably with the case where the radiating plate is an antenna element with a specific resonance frequency.

Also, various forms can be employed for the connection between the wireless IC chip and the power supply circuit board. For example, a chip-side electrode pattern may be provided on a wireless IC chip, and a first substrate-side electrode pattern may be provided on a power supply circuit substrate, so that the chip-side electrode pattern and the first substrate-side electrode pattern are DC-connected. In this case, solder, conductive resin, gold bumps, etc. can be used for connection.

Alternatively, the chip-side electrode pattern and the first substrate-side electrode pattern may be connected by capacitive coupling or magnetic coupling. In the case of connection by capacitive coupling or magnetic coupling, it is not necessary to use solder or conductive resin, and it is only necessary to stick it with an adhesive such as resin. In this case, it is not necessary to form the chip-side electrode pattern and the first substrate-side electrode pattern on the surface of the wireless IC chip or the surface of the feeding circuit board. For example, a resin film may be formed on the surface of the chip-side electrode pattern, or the first substrate-side electrode pattern may be formed on the inner layer of the multilayer substrate.

In the case of capacitive coupling, the area of the first substrate-side electrode pattern is preferably larger than the area of the chip-side electrode pattern. Even if there is some variation in positional accuracy when the wireless IC chip is mounted on the power supply circuit board, the variation in capacitance formed between the two electrode patterns can be alleviated. Furthermore, although it is difficult to form a large-area electrode pattern on a small wireless IC chip, there is no obstacle to forming a large-area electrode pattern because the power supply circuit board is relatively large.

In the case of magnetic coupling, compared with capacitive coupling, since the mounting accuracy of the wireless IC chip on the power supply circuit board is not so high, it is easier to mount. Furthermore, the chip-side electrode pattern and the first substrate-side electrode pattern are preferably coil-shaped patterns, respectively. If it is a coil-shaped electrode pattern such as a spiral or a helical, design is easy. When the frequency becomes high, it is effective to employ miander.

On the other hand, various forms may be adopted for the connection between the power supply circuit board and the radiation plate. For example, the second substrate-side electrode pattern may be provided on the power supply circuit substrate, so that the second substrate-side electrode pattern and the radiation plate are DC-connected. In this case, solder, conductive resin, gold bumps, etc. can be used for connection.

Alternatively, the second substrate-side electrode pattern and the radiation plate may be connected by capacitive coupling or magnetic coupling. If the connection is made by capacitive coupling or magnetic coupling, it is not necessary to use solder or conductive resin, and it is only necessary to stick it with an adhesive such as resin. In this case, the second substrate-side electrode pattern need not be formed on the surface of the power supply circuit substrate. For example, the second substrate-side electrode pattern may be formed on the inner layer of the multilayer substrate.

In the case of magnetic coupling, the second substrate-side electrode pattern is preferably a coil-shaped electrode pattern. Since a coil-shaped electrode pattern such as a spiral or a helical is easy to control the magnetic flux, it is easy to design. When the frequency becomes higher, miander can also be used. In addition, in the case of magnetic coupling, it is preferable that the change of the magnetic flux generated by the second substrate-side electrode pattern (coil-shaped electrode pattern) is not hindered. For example, it is preferable to form an opening on the radiation plate. department. By means of this, the transmission efficiency of signal energy can be improved, and at the same time, the frequency offset caused by the bonding of the power supply circuit substrate and the radiation plate can be reduced.

When the second substrate-side electrode pattern is a coiled electrode pattern, the second substrate-side electrode pattern may be formed so that its winding axis is parallel to the radiation plate or perpendicular to the radiation plate. In the latter case, it is preferable to form the coiled electrode pattern so that its winding width gradually increases toward the radiation plate.

In the wireless IC devices of the first and second inventions, if the radiating plate has both sides of a radiation part for exchanging transmission and reception signals with the outside and a power supply part for exchanging transmission and reception signals with a power supply circuit (resonant circuit) ( Both ends) open type, the radiation part can be used to increase the antenna gain, even a small power supply circuit pattern can get enough gain, the wireless IC device can work with a sufficient distance from the reader, and Even frequency bands above the UHF band can be fully utilized. Furthermore, the resonant frequency can be roughly determined by the power supply circuit pattern, the shape of the radiation portion can be freely set, the gain can be adjusted by the size of the radiation portion, and the center frequency can be adjusted by the shape of the radiation portion.

In addition, at least a part of the power supply part where the radiation part is arranged is located within the projection plane of the power supply circuit pattern, and the area of the power supply part may be smaller than that of the projection plane of the power supply circuit pattern. Here, the projected surface means the surface surrounded by the outline of the feeding circuit pattern, and the area of the feeding part means the area of the metal part of the radiation plate. In the case where the feeding portion of the radiation plate and the feeding circuit pattern are coupled by a magnetic field, if the area of the feeding portion is smaller than the area of the projected surface of the feeding circuit pattern, since the portion that interferes with the magnetic flux of the feeding circuit pattern becomes smaller, it is possible to Improve signal transmission efficiency.

In addition, the feeding portion may be formed, for example, in a linear shape such that the length in the longitudinal direction spans the projection surface of the feeding circuit pattern. In addition, the radiating parts of the radiating plate may be provided on both ends of the feeding part, or may be provided only on one end of the feeding part. If the radiation part is provided on both ends of the power feeding part, the capacitive coupling with the power feeding circuit pattern becomes stronger. If the radiation part is provided only at one end side of the power feeding part, the magnetic coupling with the power feeding circuit pattern will be strong, and the gain will increase.

Furthermore, a plurality of feeding circuit patterns may be formed on the feeding circuit substrate. In this case, it is preferable to arrange the feeding part of the radiation part at a position between the respective projection surfaces of the plurality of feeding circuit patterns. The feeding portion may be formed, for example, in a linear shape such that the length in the longitudinal direction spans between the respective projection surfaces of the plurality of feeding circuit patterns. If the power feeding part is arranged between a plurality of power feeding circuit patterns, the amount of power supplied between the power feeding part and the power feeding circuit patterns increases.

Also, the radiation plate may be formed in the xy plane and have radiation portions extending in the x-axis direction and the y-axis direction. Can receive circularly polarized waves to increase the gain of the antenna. On the other hand, in the y-x-z space, there may be radiation portions extending in the x-axis direction, the y-axis direction, and the z-axis direction. If the radiation part extends three-dimensionally, transmission and reception can be efficiently performed in any direction.

In addition, the radiating portion of the radiating plate may extend in a direction perpendicular to the surface on which the feeding circuit pattern is formed. A power supply part may be provided at the front end of the needle-shaped radiation part, that is, in a plane perpendicular to the radiation part, and the power supply part is connected to the power supply circuit pattern through an electric field or a magnetic field. The wireless IC device can be mounted in the article in such a manner that the needle-shaped radiating portion is inserted into the article.

In addition, the feeding part and the feeding circuit pattern may be covered with a magnetic body. In this way, the leakage of electromagnetic energy can be prevented, the degree of coupling between the power supply part and the power supply circuit pattern can be enhanced, and the gain of the antenna can be improved.

A component for a wireless IC device according to a third invention is characterized by comprising: a wireless IC chip; and a power supply circuit board connected to the wireless IC chip and provided with a power supply circuit including a resonance circuit having a predetermined resonance frequency.

A component for a wireless IC device according to a fourth invention is characterized by comprising: a wireless IC chip; and a power supply circuit board on which the wireless IC chip is mounted and a power supply circuit including a resonant circuit having a predetermined resonant frequency is provided.

According to the first and second inventions, the wireless IC chip can be mounted on the wiring board or the power supply circuit board with extremely high precision, and since the frequency of the transmission signal and the reception signal is determined by the power supply provided on the power supply circuit board It is determined by the circuit, so even if the wireless IC device is wound or sandwiched by a dielectric, the frequency characteristics will not change, and stable frequency characteristics can be obtained.

According to the third and fourth inventions, the wireless IC devices of the first and second inventions can be suitably configured.

Description of drawings

FIG. 1 is a perspective view showing a first embodiment of the wireless IC device of the present invention.

Fig. 2 is a sectional view of the first embodiment described above.

Fig. 3 is an equivalent circuit diagram of the first embodiment described above.

Fig. 4 is an exploded perspective view showing the power supply circuit board of the first embodiment.

5(A) and (B) are perspective views showing the connection form of the wireless IC chip and the power supply circuit board.

FIG. 6 is a perspective view showing Modification 1 of the radiation plate.

FIG. 7 is a perspective view showing Modification 2 of the radiation plate.

Fig. 8 is a plan view showing a second embodiment of the wireless IC device of the present invention.

Fig. 9 shows a third embodiment of the wireless IC device of the present invention, where (A) is a plan view in an unfolded state, and (B) is a perspective view when in use.

Fig. 10 is a perspective view showing a fourth embodiment of the wireless IC device of the present invention.

Fig. 11 is a perspective view showing a fifth embodiment of the wireless IC device of the present invention.

Fig. 12 is a sectional view showing a sixth embodiment of the wireless IC device of the present invention.

Fig. 13 is an equivalent circuit diagram showing a seventh embodiment of the wireless IC device of the present invention.

Fig. 14 is an equivalent circuit diagram showing an eighth embodiment of the wireless IC device of the present invention.

Fig. 15 is an equivalent circuit diagram showing a ninth embodiment of the wireless IC device of the present invention.

Fig. 16 is a sectional view showing a tenth embodiment of the wireless IC device of the present invention.

Fig. 17 is an equivalent circuit diagram of the tenth embodiment described above.

Fig. 18 is an exploded perspective view showing the power supply circuit board of the tenth embodiment.

Fig. 19 is an equivalent circuit diagram showing an eleventh embodiment of the wireless IC device of the present invention.

Fig. 20 is an equivalent circuit diagram showing a twelfth embodiment of the wireless IC device of the present invention.

Fig. 21 is an exploded perspective view showing the power supply circuit board of the twelfth embodiment.

Fig. 22 is a perspective view showing a thirteenth embodiment of the wireless IC device of the present invention.

Fig. 23 is a sectional view showing a fourteenth embodiment of the wireless IC device of the present invention.

Fig. 24 is an exploded perspective view showing the power supply circuit board of the fourteenth embodiment.

Fig. 25 is an equivalent circuit diagram showing a fifteenth embodiment of the wireless IC device of the present invention.

Fig. 26 is an exploded perspective view showing the power supply circuit board of the fifteenth embodiment.

Fig. 27 is an equivalent circuit diagram showing a sixteenth embodiment of the wireless IC device of the present invention.

Fig. 28 is an exploded perspective view showing the power supply circuit board of the sixteenth embodiment.

Fig. 29 is an equivalent circuit diagram showing a seventeenth embodiment of the wireless IC device of the present invention.

Fig. 30 is an exploded perspective view showing the power supply circuit board of the seventeenth embodiment.

Fig. 31 is a graph showing the reflection characteristics of the above seventeenth embodiment.

Fig. 32 is an equivalent circuit diagram showing an eighteenth embodiment of the wireless IC device of the present invention.

Fig. 33 is an exploded perspective view showing the power supply circuit board of the eighteenth embodiment.

Fig. 34 shows the wireless IC device of the eighteenth embodiment above, in which (A) is a bottom view and (B) is an enlarged sectional view.

Fig. 35 is an equivalent circuit diagram showing a nineteenth embodiment of the wireless IC device of the present invention.

Fig. 36 is an exploded perspective view showing the power supply circuit board of the nineteenth embodiment.

Fig. 37 is an exploded perspective view showing a twentieth embodiment of the wireless IC device of the present invention.

Fig. 38 is a bottom view of a power supply circuit board on which a wireless IC device is mounted in the above-mentioned twentieth embodiment.

Fig. 39 is a side view of the above-mentioned twentieth embodiment.

Fig. 40 is a side view of a modified example of the above-mentioned twentieth embodiment.

Fig. 41 is a perspective view showing a first form of the modified example shown in Fig. 40 .

Fig. 42 is a perspective view showing a second form of the modified example shown in Fig. 40 .

Fig. 43 is an exploded perspective view showing a twenty-first embodiment of the wireless IC device of the present invention.

Fig. 44 is an equivalent circuit diagram showing a twenty-second embodiment of the wireless IC device of the present invention.

Fig. 45 is an exploded perspective view showing the power supply circuit board of the twenty-second embodiment.

Fig. 46 is an exploded perspective view showing a power supply circuit board of a twenty-third embodiment of the wireless IC device of the present invention.

Fig. 47 is an equivalent circuit diagram showing a twenty-fourth embodiment of the wireless IC device of the present invention.

Fig. 48 is a perspective view showing the power supply circuit board of the twenty-fourth embodiment described above.

Fig. 49 is an equivalent circuit diagram showing a twenty-fifth embodiment of the present invention.

Fig. 50 is a perspective view showing the power supply circuit board of the twenty-fifth embodiment.

Fig. 51 is an equivalent circuit diagram showing a twenty-sixth embodiment of the wireless IC device of the present invention.

Fig. 52 is a perspective view showing the power supply circuit board of the twenty-sixth embodiment described above.

Fig. 53 is an equivalent circuit diagram showing a twenty-seventh embodiment of the wireless IC device of the present invention.

Fig. 54 is a perspective view showing the power supply circuit board of the twenty-seventh embodiment described above.

Fig. 55 is a sectional view showing a twenty-eighth embodiment of the wireless IC device of the present invention.

Fig. 56 is a sectional view showing a twenty-ninth embodiment of the wireless IC device of the present invention.

Fig. 57 is a perspective view showing a 30th embodiment of the wireless IC device of the present invention.

Fig. 58 is a perspective view showing a thirty-first embodiment of the wireless IC device of the present invention.

Fig. 59 is a plan view showing a first example of a conventional wireless IC device.

Fig. 60 is a plan view showing a second example of a conventional wireless IC device.

detailed description

Embodiments of the wireless IC device and components for the wireless IC device according to the present invention will be described below with reference to the drawings. In addition, in each embodiment described below, the same code|symbol is attached|subjected to the common component and part, and repeated description is abbreviate|omitted.

(Refer to Figures 1 to 7 for the first embodiment)

The wireless IC device 1a of the first embodiment is a unipolar type. As shown in FIGS. The radiation plate 20 of the circuit board 10 is constituted. The wireless IC chip includes a clock circuit, a logic circuit, and a storage circuit, stores necessary information, and is directly DC-connected to the power supply circuit 16 mounted inside the power supply circuit board 10 .

The power supply circuit 16 is a circuit for supplying a transmission signal with a predetermined frequency to the radiation board 20, and/or selects a reception signal with a predetermined frequency from signals received by the radiation board 20, and supplies it to the wireless IC chip. A circuit for use with a resonant circuit that resonates at the frequency of the transceiving signal.

In the power supply circuit board 10, as shown in FIGS. 2 and 3, a power supply circuit 16 composed of a lumped constant type LC series resonant circuit composed of a spiral inductance element L and capacitance elements C1 and C2 is mounted therein. Specifically, as shown in FIG. 4 , the power supply circuit board 10 is obtained by laminating, crimping, and sintering ceramic sheets 11A to 11G made of dielectric materials, and includes: Sheet 11A, sheet 11B formed with capacitive electrode 14a, sheet 11C formed with capacitor electrode 14b and through-hole conductor 13b, sheet 11D formed with through-hole conductor 13c, conductive pattern 15a and through-hole conductor 13d formed The sheet 11E, the sheet 11F (one or more) formed with the through-hole conductor 13e, and the sheet 11G formed with the conductor pattern 15b. In addition, each of the ceramic sheets 11A to 11G may be a sheet made of a magnetic ceramic material, and the power supply circuit board 10 can be easily obtained by using a conventionally used multilayer substrate manufacturing process such as a sheet lamination method and a thick film printing method. .

By stacking the aforementioned 11A to 11G, a spiral inductance element L whose winding axis is parallel to the radiation plate 20 is formed, and the capacitance electrode 14b is connected to both ends of the inductance element L, and the capacitance electrode 14a is connected to the connecting electrode through the through-hole conductor 13a. 12 Connected capacitive elements C1, C2. Furthermore, the connection electrodes 12 serving as the substrate-side electrode patterns are DC-connected to the chip-side electrode patterns (not shown) of the wireless IC chip 5 via the solder bumps 6 .

That is, among the elements constituting the power supply circuit 16, a transmission signal is supplied from the inductance element L which is a coil-shaped electrode pattern to the radiation plate 20 through a magnetic field, and a reception signal from the radiation plate 20 is supplied to the inductance element L through a magnetic field. . Therefore, it is preferable to arrange in the feeding circuit board 10 so that the inductance element L among the inductance element L and the capacitance elements C1 and C2 constituting the resonant circuit is close to the radiation plate 20 .

The radiation plate 20 is a cuboid made of a nonmagnetic material such as aluminum foil or copper foil, that is, a metal body with open ends, and is formed on an insulating flexible resin film 21 such as PET. The lower surface of the feed circuit board 10 is bonded to the radiation plate 20 through an insulating adhesive layer formed of an adhesive 18 .

An example of dimensions is as follows. The thickness of the wireless IC chip 5 is 50 to 100 μm, the thickness of the solder bump 6 is about 20 μm, the thickness of the power supply circuit board 10 is 200 to 500 μm, and the thickness of the adhesive 18 is 0.1 to 10 μm. The plate 20 has a thickness of 1 to 50 μm, and the film 21 has a thickness of 10 to 100 μm. Also, the size (area) of the wireless IC chip 5 is various, such as 0.4 mm×0.4 mm, 0.9 mm×0.8 mm, and the like. The size (area) of the feeding circuit board 10 can range from the same size as the wireless IC chip to about 3 mm×3 mm.

FIG. 5 shows a connection form between the wireless IC chip 5 and the power supply circuit board 10 . FIG. 5(A) shows a case where a pair of antenna (balanced) terminals 7a, 17a are respectively provided on the back surface of the wireless IC device 5 and the front surface of the power supply circuit board 10. As shown in FIG. FIG. 5(B) shows another connection form, which is a case where a ground terminal 17b is provided in addition to a pair of antenna (balanced) terminals 7a and 17a respectively provided on the back surface of the wireless IC chip 5 and the front surface of the power supply circuit board 10. . However, the ground terminal 17 b of the power supply circuit board 10 forms a terminal, and is not connected to other elements of the power supply circuit board 10 .

Also, as shown in FIGS. 6 and 7, the radiating plate 20 is preferably elongated, and the area of the position 20' where the power supply circuit substrate 10 is pasted is preferably larger than the substrate 10. There are no strict requirements on the positional accuracy when sticking, and stable electrical characteristics can be obtained.

FIG. 3 shows an equivalent circuit of the wireless IC device 1a. The wireless IC device 1a uses a radiation plate 20 to receive a high-frequency signal (for example, UHF frequency band) radiated by a reader/writer not shown, so that the power supply circuit 16 mainly magnetically coupled with the radiation plate 20 (by the inductance element L and the capacitor) An LC series resonance circuit composed of elements C1 and C2) resonates and supplies only reception signals of a predetermined frequency band to the wireless IC chip 5 . On the other hand, a predetermined energy is extracted from the received signal, and the information stored in the wireless IC chip 5 is matched to a predetermined frequency by the power supply circuit 16 using the energy as a driving source. Then, from the inductance element L of the power supply circuit 16, The signaling signal is transmitted to the radiation plate 20 by magnetic field coupling, and is sent and transmitted from the radiation plate 20 to the reader/writer.

In addition, although the coupling between the feeding circuit 16 and the radiation plate 20 is mainly coupling by a magnetic field, there may be coupling by an electric field (electromagnetic field coupling).

In the wireless IC device 1a of the first embodiment, the wireless IC chip 5 is directly DC-connected to the power supply circuit board 10 on which the power supply circuit 16 is mounted. The power supply circuit board 10 has almost the same area as the wireless IC chip 5, and is Since it is rigid, it is possible to position and mount the wireless IC chip 5 on the film with extremely high accuracy, compared to conventional mounting on a large-area flexible film. Furthermore, since the power supply circuit board 10 is made of a ceramic material and has heat resistance, the wireless IC chip 5 can be soldered to the power supply circuit board 10 . In short, since the ultrasonic welding method is not used as in the past, it can be welded at low cost, and it is also possible to avoid damage to the wireless IC chip due to the pressure applied during ultrasonic welding, and it is possible to use the automatic adjustment obtained by reflow soldering. Standard (self-alignment) effect.

In addition, in the power supply circuit 16, the resonant frequency characteristic is determined by a resonant circuit composed of the inductance element L and the capacitance elements C1, C2. The resonant frequency of the signal radiated from the radiating plate 20 is substantially equivalent to the natural resonant frequency of the resonant circuit 16, and the maximum gain of the signal depends substantially on the size and shape of the power supply circuit 16, the distance between the power supply circuit 16 and the radiating plate 20, and the medium at least one of the . Specifically, in the first embodiment, the electrical length of the radiation plate 20 is 1/2 of the resonance frequency λ. However, the electrical length of the radiation plate 20 may not be an integer multiple of λ/2. That is to say, in the present invention, the frequency of the signal radiated from the radiation board 20 is substantially determined by the resonant frequency of the resonant circuit (power supply circuit 16), so the frequency characteristic does not depend on the electrical characteristics of the radiation board 20 substantially. length. If the electrical length of the radiating plate 20 is an integer multiple of λ/2, the gain is the largest, so it is most ideal.

As described above, since the resonance frequency characteristic of the power supply circuit 16 depends on the resonance circuit composed of the inductance element L and the capacitance elements C1 and C2 mounted inside the power supply circuit board 10, even if the wireless IC device 1a is sandwiched between books, , the resonant frequency characteristics will not change. Furthermore, even if the shape of the radiation plate 20 is changed by winding the wireless IC device 1a, or the size of the radiation plate 20 is changed, the resonance frequency characteristic does not change. Furthermore, since the coiled electrode pattern constituting the inductance element L is formed so that the winding axis thereof is parallel to the radiation plate 20, there is an advantage that the center frequency does not change. Furthermore, since the capacitive elements C1 and C2 are inserted in the subsequent stage of the wireless IC chip 5, low-frequency surges can be cut off by the elements C1 and C2, and the wireless IC chip 5 can be protected from the surge.

Furthermore, since the power supply circuit board 10 is a rigid multilayer board, handling at the time of soldering the wireless IC chip is facilitated. Furthermore, since the radiant plate 20 is formed of a flexible metal film held on the flexible film 21, it can be attached to a flexible bag made of plastic film or a cylindrical body such as a PET bottle without difficulty.

In addition, in the present invention, the resonant circuit may also serve as a matching circuit for matching the impedance of the wireless IC chip with the impedance of the radiation plate. Alternatively, the power supply circuit board may include a matching circuit composed of an inductance element and a capacitance element and provided separately from the resonance circuit. If it is desired to add the function of a matching circuit to the resonant circuit, the design of the resonant circuit tends to become complicated. If a matching circuit is provided separately from the resonance circuit, the resonance circuit and the matching circuit can be independently designed.

(Refer to Figure 8 for the second embodiment)

As shown in FIG. 8, the wireless IC device 1b of the second embodiment is a device in which a radiation plate 20 is branched by 90°. That is to say, in the xy plane, the radiation plate 20 is constituted by the radiation part 20a extending in the x-axis direction and the radiation part 20b extending in the y-axis direction, and the extension line of the radiation part 20a is used as the power supply part 20d, Then, the power supply circuit board 10 on which the wireless IC chip 5 is mounted is bonded to the power supply portion 20d.

In addition, the internal structure of the power supply circuit board 10 is the same as that of the first embodiment, and the effect of the second embodiment is the same as that of the first embodiment. Furthermore, since the radiation parts 20a and 20b extend in the x-axis direction and the y-axis direction, circularly polarized waves can be received, thereby improving the gain of the antenna.

(Refer to FIG. 9 for the third embodiment)

As the wireless IC device 1c of the third embodiment, as shown in FIG. 20b and 20c constitute the radiation plate 20, the extension of the radiation part 20a is used as the power supply part 20d, and the power supply circuit board 10 on which the wireless IC chip 5 is mounted is bonded to the power supply part 20d.

This wireless IC device 1c can be attached to the corner of a box-like object, for example, and since the radiation parts 20a, 20b, and 20c extend in a three-dimensional space, there is no directivity in the antenna, and efficient transmission and reception can be performed in any direction. letter. Further, other functions and effects of the wireless IC device 1c are the same as those of the first embodiment described above.

(See Figure 10 for the fourth embodiment)

As shown in FIG. 10, the wireless IC device 1d of the fourth embodiment is obtained by forming a large-area radiation plate 20 on a large-area flexible insulating plastic film 21 using aluminum foil or the like. Furthermore, the power supply circuit board 10 on which the wireless IC chip 5 is mounted is bonded to an arbitrary position of the radiation plate 20 .

In addition, other configurations of the wireless IC device 1d, that is, the internal configuration of the power supply circuit board 10 are the same as those of the above-mentioned first embodiment. Therefore, the operation and effect of the fourth embodiment are basically the same as those of the first embodiment, and there is an advantage that high accuracy is not required for the bonding position of the power supply circuit board 10 .

(See Figure 11 for the fifth embodiment)

As a wireless IC device 1e of the fifth embodiment, as shown in FIG. 11, a large-area radiating plate 20 formed of aluminum foil or the like is formed into a mesh shape. The grid may be formed on the entire surface of the radiation plate 20, or may be formed on a part thereof.

Other structures are the same as the above-mentioned fourth embodiment, except that there is no high precision requirement for the bonding position of the power supply circuit substrate 10, since the magnetic flux of the coil-shaped electrode pattern passes through the mesh opening, the power supply circuit substrate 10 The change (decrease) of the generated magnetic flux becomes smaller, enabling more magnetic flux to pass through the radiation plate 20 . Therefore, the transfer efficiency of signal energy can be improved, and at the same time, the frequency offset due to sticking can be reduced.

(See Figure 12 for the sixth embodiment)

As the wireless IC device 1f of the sixth embodiment, as shown in FIG. 20 Apply adhesive 18. Using the adhesive 18, the wireless IC device 1f can be attached to any part of the article.

In addition, the other configurations of the wireless IC device 1f, that is, the internal configuration of the power supply circuit board 10 are the same as those of the above-mentioned first embodiment. Therefore, the operations and effects of the sixth embodiment are basically the same as those of the first embodiment.

(See Figure 13 for the seventh embodiment)

A wireless IC device 1g according to the seventh embodiment is obtained by mounting an inductance element L as a feeder circuit 16 inside a feeder circuit substrate 10 as shown in the equivalent circuit of FIG. 13 . The capacitive element C constituting the LC parallel resonance circuit is formed by a parasitic capacitance (distributed constant type capacitance) between conductor patterns serving as the inductive element L.

That is, even if one coiled electrode pattern has natural resonance, the L component of the coiled electrode pattern itself and the C component of the parasitic capacitance between lines function as an LC parallel resonant circuit, thereby constituting the power supply circuit 16 . Therefore, this wireless IC device 1g can use the radiation plate 20 to receive a high-frequency signal (for example, UHF frequency band) radiated from a reader/writer not shown in the figure, so that the power supply circuit 16 mainly magnetically coupled with the radiation plate 20 (by the inductance element An LC parallel resonant circuit constituted by L and capacitive element C) resonates, and supplies only reception signals of a predetermined frequency band to the wireless IC chip 5 . On the other hand, a predetermined energy is extracted from the received signal, and the information stored in the wireless IC chip 5 is matched to a predetermined frequency by the power supply circuit 16 using the energy as a driving source, and then the inductance element L of the power supply circuit 16 The signaling signal is transmitted to the radiation plate 20 through magnetic field coupling, and is sent and transmitted from the radiation plate 20 to the reader/writer.

(Refer to Figure 14 for the eighth embodiment)

As the wireless IC device 1h of the eighth embodiment, as shown in the equivalent circuit of FIG. 14, it is a device provided with a dipole-type power supply circuit 16 and a radiation plate 20, and two LCs connected in parallel are installed inside the power supply circuit board. The resonant circuit constitutes the power supply circuit 16. The inductance element L1 and the capacitance element C1 are connected to the first port side of the wireless IC chip 5 , and the inductance element L2 and the capacitive power supply C2 are connected to the second port side of the wireless IC chip 5 and face the radiation plates 20 , 20 , respectively. Ends of the inductance element L1 and the capacitance element C1 are open ends. In addition, the first port and the second port constitute I/O of the differential circuit.

The operation and effect of the eighth embodiment are basically the same as those of the above-mentioned first embodiment. That is to say, the wireless IC device 1h uses the radiation plate 20 to receive a high-frequency signal (such as a UHF frequency band) radiated from a reader/writer not shown in the figure, so that the power supply circuit 16 mainly magnetically coupled with the radiation plate 20 (by an inductor) The LC parallel resonant circuit composed of element L1 and capacitive element C1 and the LC parallel resonant circuit composed of inductive element L2 and capacitive element C2 resonate, and supply only reception signals of a predetermined frequency band to wireless IC chip 5 . On the other hand, a predetermined energy is extracted from the received signal, and the information stored in the wireless IC chip 5 is matched to a predetermined frequency by the power supply circuit 16 using the energy as a driving source, and then the inductance element L1 of the power supply circuit 16 , L2 transmits the signaling signal to the radiation board 20 through magnetic field coupling, and sends and transmits the signal from the radiation board 20 to the reader/writer.

(Refer to Figure 15 for the ninth embodiment)

As the wireless IC device 1i of the ninth embodiment, as shown in the equivalent circuit of FIG. 15, it is a device provided with a dipole-type power supply circuit 16 and a radiation plate 20, and a circuit board consisting of two LCs connected in series is installed inside the power supply circuit substrate. The resonant circuit constitutes the power supply circuit 16. The respective inductance elements L1, L2 face the radiation plates 20, 20, and the respective capacitive elements C1, C2 are grounded.

The functions and effects of the ninth embodiment are basically the same as those of the above-mentioned first embodiment. That is to say, the wireless IC device 1i uses the radiation plate 20 to receive a high-frequency signal (for example, UHF frequency band) radiated from a reader/writer not shown in the figure, so that the power supply circuit 16 mainly magnetically coupled with the radiation plate 20 (by an inductor) The LC series resonant circuit composed of element L1 and capacitive element C1 and the LC series resonant circuit composed of inductive element L2 and capacitive element C2 resonate, and supply only reception signals of a predetermined frequency band to wireless IC chip 5 . On the other hand, a predetermined energy is extracted from the received signal, and the information stored in the wireless IC chip 5 is matched to a predetermined frequency by the power supply circuit 16 using the energy as a driving source, and then the inductance element L1 of the power supply circuit 16 , L2 transmits the signaling signal to the radiation board 20 through magnetic field coupling, and sends and transmits the signal from the radiation board 20 to the reader/writer.

(Refer to Figures 16 to 18 for the tenth embodiment)

The wireless IC device 1j according to the tenth embodiment is a unipolar device as shown in FIG. device. As shown in FIG. 17 , the coil-shaped electrode pattern constituting the inductance element L is formed so that its winding axis is perpendicular to the radiation plate 20 , and the power supply circuit 16 and the radiation plate 20 are mainly magnetically coupled.

As shown in FIG. 18 in detail, the power supply circuit substrate is a substrate formed by laminating, crimping, and sintering ceramic sheets 31A to 31F made of dielectric materials. , the sheet 31B formed with the capacitive electrode 34a and the through-hole conductor 33b, the sheet 31C formed with the capacitive electrode 34b and the through-hole conductor 33c, 33b, the sheet 31D formed with the conductor pattern 35a and the through-hole conductor 33d, 33b ( One or more pieces), the sheet 31E (one or more pieces) on which the conductor pattern 35b and the through-hole conductors 33e, 33b are formed, and the sheet 31F on which the conductor pattern 35c is formed.

By laminating the above-mentioned sheets 31A to 31F, the power supply circuit 16 composed of an LC series resonant circuit in which an inductance element L and a capacitance element C are connected in series with a helical winding axis perpendicular to the radiation plate 20 is obtained. Capacitance electrode 34a is connected with electrode 32 for connection through through-hole conductor 33a, and then connected with wireless IC chip 5 through solder bump 6, and one end of inductance element L is connected with electrode 32 for connection through through-hole conductor 33b, and then through solder bump 6 is connected with the wireless IC chip 5 .

The functions and effects of the tenth embodiment are basically the same as those of the above-mentioned first embodiment. That is to say, the wireless IC device 1j uses the radiation plate 20 to receive a high-frequency signal (for example, UHG frequency band) radiated from a reader/writer not shown in the figure, so that the power supply circuit 16 mainly magnetically coupled with the radiation plate 20 (by an inductor) An LC series resonant circuit constituted by the element L and the capacitive element C) resonates, and supplies only a reception signal of a predetermined frequency band to the wireless IC chip 5 . On the other hand, a predetermined energy is extracted from the received signal, and the information stored in the wireless IC chip 5 is matched to a predetermined frequency by the power supply circuit 16 using the predetermined energy as a driving source, and then the inductance element L of the power supply circuit 16 The signaling signal is transmitted to the radiation plate 20 through magnetic field coupling, and is sent and transmitted from the radiation plate 20 to the reader/writer.

Especially in the tenth embodiment, since the coil-shaped electrode pattern is formed so that its winding axis is perpendicular to the radiation plate 20, the magnetic flux component passing through the radiation plate 20 is increased, and the transmission efficiency of signal energy is improved, which has a gain variation. Big plus.

(Refer to Figure 19 for the eleventh embodiment)

As the wireless IC device 1k of the eleventh embodiment, as shown in the equivalent circuit of FIG. The direction of the radiation plate 20 gradually becomes larger. Other structures are the same as those of the tenth embodiment described above.

The eleventh embodiment can obtain the same effects as those of the above-mentioned tenth embodiment. In addition, since the coiled electrode pattern of the inductance element L is formed such that its winding width (coil diameter) is slow toward the radiation plate 20, Slowly becomes larger, so the signaling efficiency is improved.

(Refer to Figure 20 and Figure 21 for the twelfth embodiment)

The wireless IC device 11 of the twelfth embodiment is a dipole type device as shown in the equivalent circuit of FIG. obtained device.

In detail, as shown in FIG. 21 , the power supply circuit substrate 10 is a substrate formed by laminating, crimping, and sintering ceramic sheets 41A to 41F made of dielectric materials, and includes connection electrodes 42 and through holes formed therein. The sheet 41A of the conductor 43a, the sheet 41B formed with the capacitive electrode 44a, the sheet 41C formed with the capacitive electrode 44b and the through-hole conductor 43b, the sheet 41D formed with the conductor pattern 45a and the through-hole conductor 43c (one or more block), the sheet 41E (one or more pieces) on which the conductor pattern 45b and the through-hole conductor 43d are formed, and the sheet 41F on which the conductor pattern 45c is formed.

By stacking the above sheets 41A to 41F, two LC series resonant circuits are obtained in which the inductance elements L1 and L2 and the capacitance elements C1 and C2 are connected in series with the helical winding axis perpendicular to the radiation plate 20 The power supply circuit 16. The capacitor electrode 44a is connected to the connection electrode 42 through the through-hole conductor 43a, and then connected to the wireless IC chip 5 through the solder bump.

The functions and effects of the twelfth embodiment are basically the same as those of the above-mentioned first embodiment. That is to say, the wireless IC device 11 uses the radiation plate 20 to receive a high-frequency signal (for example, UHF frequency band) radiated from a reader/writer not shown in the figure, so that the power supply circuit 16 that is mainly magnetically coupled with the radiation plate 20 (by an inductor) The LC series resonant circuit composed of element L1 and capacitive element C1 and the LC series resonant circuit composed of inductive element L2 and capacitive element C2 resonate, and supply only reception signals of a predetermined frequency band to wireless IC chip 5 . On the other hand, a predetermined energy is extracted from the received signal, and the information stored in the wireless IC chip 5 is matched to a predetermined frequency by the power supply circuit 16 using the energy as a driving source, and then the inductance elements L1, L2 of the power supply circuit 16 The signaling signal is transmitted to the radiation plate 20 through magnetic field coupling, and is sent and transmitted from the radiation plate 20 to the reader/writer.

In addition, since the capacitive elements C1 and C2 are placed between the wireless IC chip 5 and the inductance elements L1 and L2 as a subsequent stage of the wireless IC chip 5, surge resistance is improved. Since the surge is a low-frequency current below 200 MHz, it can be intercepted by the capacitive elements C1 and C2, thereby preventing the wireless IC chip 5 from being damaged by the surge.

In addition, in the second embodiment, the resonant circuit composed of the capacitive element C1 and the inductive element L1 and the resonant circuit composed of the capacitive element C2 and the inductive element L2 are not coupled to each other.

(Refer to FIG. 22 for the thirteenth embodiment)

As a wireless IC device 1m according to the thirteenth embodiment, as shown in FIG. 22, a coil-shaped electrode pattern, that is, a spiral type (spiral) is provided on the surface of a rigid single-layer power supply circuit board 50 made of ceramics or heat-resistant resin. The inductance element constitutes the power supply circuit 56 and obtains the device. Both ends of the power supply circuit 56 are directly connected to the wireless IC chip 5 through solder bumps, and the power supply circuit substrate 50 is bonded to the film 21 holding the radiation plate 20 with an adhesive. In addition, the conductor pattern 56a and the conductor patterns 56b, 56c that cross each other constituting the power supply circuit 56 are separated from each other by an insulating film (not shown).

The power supply circuit 56 of the thirteenth embodiment constitutes an LC parallel resonant circuit using parasitic capacitance formed between conductive patterns wound in a spiral shape as a capacitance component. In addition, the power supply circuit board 50 is a single-layer board made of a dielectric or a magnetic body.

In the wireless IC device 1m as the thirteenth embodiment, the power supply circuit 56 and the radiation plate 20 are mainly magnetically coupled. Therefore, similar to the above-described embodiments, the radiation plate 20 receives the high-frequency signal radiated from the reader/writer, resonates the power supply circuit 56, and supplies only a reception signal of a predetermined frequency band to the wireless IC chip 5 . On the other hand, a predetermined energy is extracted from the received signal, and the information stored in the wireless IC chip 5 is matched to a predetermined frequency by the power supply circuit 56 using the energy as a driving source, and then passed through the inductance element of the power supply circuit 56. The magnetic field coupling transmits the signaling signal to the radiation plate 20 , and transmits and transmits it from the radiation plate 20 to the reader/writer.

Furthermore, as for the point of providing the wireless IC chip 5 on the rigid and small-area power supply circuit board 50, positioning accuracy is good as in the above-mentioned first embodiment, and it can be connected to the power supply circuit board 50 by soldering.

(Refer to Figure 23 and Figure 24 for the 14th embodiment)

A wireless IC device 1n according to the fourteenth embodiment is obtained by mounting a coil-shaped electrode pattern of a power supply circuit 56 inside a power supply circuit board 50 as shown in FIG. 23 . As shown in FIG. 24 , the power supply circuit substrate 50 is a substrate obtained by laminating, crimping, and sintering ceramic sheets 51A to 51D made of dielectric materials, and includes a sheet on which connection electrodes 52 and through-hole conductors 53a are formed. 51A, sheet 51B formed with conductive pattern 54a and through-hole conductors 53b, 53c, sheet 51C formed with conductive pattern 54b, and sheet 51D without pattern (multiple pieces).

By laminating the above-mentioned sheets 51A to 51D, in the coil-shaped electrode pattern, there is obtained a coil-shaped electrode pattern that is mounted inside and includes a parasitic capacitance formed between an inductance element wound in a spiral shape and a wire of a spiral conductor. The power supply circuit substrate 50 of the power supply circuit 56 of the resonant circuit constituted by the capacitive component. Furthermore, the connection electrodes 52 located at both ends of the power supply circuit 56 are connected to the wireless IC chip 5 through the solder bumps 6 . The functions and effects of the fourteenth embodiment are the same as those of the above-mentioned thirteenth embodiment.

(Refer to Figure 25 and Figure 26 for the fifteenth embodiment)

The wireless IC device 1o of the fifteenth embodiment is a device obtained by capacitively coupling the wireless IC chip 5 and the power supply circuit board 10 as shown in the equivalent circuit of FIG. Connect to connect. A power supply circuit 16 composed of two LC series resonant circuits is mounted inside the power supply circuit substrate 10 . The respective winding axes of the inductance elements L1, L2 are positioned perpendicular to the radiation plate 20, one end is connected to the capacitive electrodes 65a, 65b (see FIG. 26 ) constituting the capacitive elements C1, C2, and the other end is connected to The connecting electrodes 62 on the bottom side surface are directly coupled to each other. Also, capacitive electrodes 66 a and 66 b (see FIG. 26 ) constituting the capacitive elements C1 and C2 are formed on the reverse side of the wireless IC chip 5 .

In detail, as shown in FIG. 26 , the power supply circuit substrate 10 is a substrate formed by laminating, crimping, and sintering ceramic sheets 61A to 61G made of dielectric materials, and includes connection electrodes 62 and through holes formed therein. Sheet 61A of conductors 63 a and 63 b , sheets 61B to 61F on which conductor patterns 64 a and 64 b and via-hole conductors 63 c and 63 d are formed, and sheet 61G on which capacitive electrodes 65 a and 65 b are formed.

By laminating the above-mentioned sheets 61A to 61G, the power supply circuit 16 constituted by two LC series resonant circuits in which the inductance elements L1 and L2 and the capacitance elements C1 and C2 are respectively connected in series is obtained.

That is, the capacitive element C1 is formed between mutually parallel planar electrode patterns of the electrode 66 a serving as the chip-side electrode pattern and the electrode 65 a serving as the substrate-side electrode pattern. The capacitive element C2 is formed between the electrode 66b as the chip-side electrode pattern and the electrode 65b as the substrate-side electrode pattern, which are planar electrode patterns parallel to each other. The wireless IC chip 5 is bonded to the power supply circuit board 10 with an insulating adhesive layer, and bonded via the insulating adhesive layer. In addition, the power feeding circuit board 10 is DC-connected to the radiation plate 20 through the connection electrode 62 which is a second board-side electrode pattern. Here, the connection electrodes 62 of the power feeding circuit board 10 and the radiation plate 20 may be bonded with solder, a conductive adhesive, or the like.

The functions and effects of the fifteenth embodiment are basically the same as those of the above-mentioned first embodiment. That is, the wireless IC device 1o uses the radiation plate 20 to receive a high-frequency signal (for example, UHF frequency band) radiated from a reader/writer not shown in the figure, so that the power supply circuit 16 that is DC-connected to the radiation plate 20 (by the inductance element L1 and the capacitance element The LC series resonant circuit composed of C1 and the LC series resonant circuit composed of the inductance element L2 and the capacitive element C2) resonate, and supply only reception signals of a predetermined frequency band to the wireless IC chip 5 . On the other hand, a predetermined energy is extracted from the received signal, and the information stored in the wireless IC chip 5 is matched to a predetermined frequency by the power supply circuit 16 using the energy as a driving source, and then radiated to the power supply circuit 16 to achieve a DC connection. The board 20 transmits the signaling signal, and is sent and transmitted from the radiation board 20 to the reader/writer. The power supply circuit 16 and the wireless IC chip 5 realize capacitive coupling through the capacitive elements C1 and C2, so as to transmit power and send and receive signals.

However, the capacitive electrodes 65 a and 65 b formed on the power supply circuit 10 have a larger area than the capacitive electrodes 66 a and 66 b formed on the wireless IC chip 5 . Even if there is some variation in positional accuracy when the wireless IC chip 5 is mounted on the feeder circuit board 10, the variation in capacitance formed between the capacitance electrodes 65a, 66a and 65b, 66b can be alleviated. Furthermore, since the capacitive elements C1 and C2 are inserted in the subsequent stage of the wireless IC chip 5, the surge resistance performance can be improved.

(Refer to Figure 27 and Figure 28 for the sixteenth embodiment)

A wireless IC device 1p according to the sixteenth embodiment is a device obtained by capacitively coupling a power supply circuit board 10 and a radiation plate 20 as shown in the equivalent circuit of FIG. 27 . A power supply circuit 16 composed of two LC series resonant circuits is mounted inside the power supply circuit board 10 . One end of the inductance elements L1, L2 is connected to the wireless IC chip 5, and the other end is connected to capacitive electrodes 72a, 72b (see FIG. 28 ) forming the capacitive elements C1, C2 provided on the surface of the substrate 10. In addition, one more capacitive electrode constituting the capacitive elements C1 , C2 functions as the end portions 20 a , 20 b of the radiation plate 20 .

In detail, as shown in FIG. 28 , the power supply circuit substrate 10 is a substrate formed by laminating, crimping, and sintering ceramic sheets 71A to 71G made of dielectric materials, and includes capacitor electrodes 72a, 72b and through holes formed therein. Sheet 71A of hole conductors 73a, 73b, sheets 71B to 71E formed with conductor patterns 74a, 74b and through-hole conductors 73c, 73d, conductor patterns 74a, 74b formed on one surface, and connection holes formed on the other surface. The sheet 71F is connected by the electrodes 75a, 75b and by the through-hole conductors 73e, 73f.

By laminating the above-mentioned sheets 71A to 71F, the power supply circuit 16 constituted by two LC series resonant circuits in which the inductance elements L1, L2 and the capacitance elements C1, C2 are connected in series is obtained. By bonding the power supply circuit board 10 to the radiation plate 20 with an adhesive, the capacitive electrodes 72a and 72b, which are planar electrode patterns arranged in parallel with the radiation plate 20, are connected to the ends of the radiation plate 20 through the insulating adhesive layer. The portions 20a, 20b face each other to form capacitive elements C1, C2. In addition, by connecting the connection electrodes 75a, 75b to the wireless IC chip 5 with solder bumps, one end of the inductance elements L1, L2 is connected to the wireless IC chip 5, and the wireless IC chip 5 and the power supply circuit board 10 realize DC. connect.

In addition, if the adhesive contains, for example, dielectric powder, the adhesive layer has properties as a dielectric, and the capacitance of the capacitive elements C1 and C2 can be increased. In addition, although the capacitive electrodes 72a and 72b as the electrode patterns on the second substrate side are formed on the reverse side surface of the power supply circuit substrate 10 in the sixteenth embodiment, they may also be formed inside the power supply circuit substrate 10 (but close to the power supply circuit substrate 10). one side of the radiation plate 20). In addition, the capacitive electrodes 72 a and 72 b may also be provided on the inner layer of the substrate 10 .

The functions and effects of the sixteenth embodiment are basically the same as those of the above-mentioned first embodiment. That is, the wireless IC device 1p uses the radiation plate 20 to receive a high-frequency signal (such as a UHF frequency band) radiated from a reader/writer not shown in the figure, so that the power supply circuit 16 that is capacitively coupled with the radiation plate 20 (by the inductance element L1 and the capacitance The LC series resonant circuit composed of the element C1 and the LC series resonant circuit composed of the inductance element L2 and the capacitive element C2) resonate, and supply only a reception signal of a predetermined frequency band to the wireless IC chip 5 . On the other hand, a predetermined energy is extracted from the received signal, and the information stored in the wireless IC chip 5 is matched to a predetermined frequency by the power supply circuit 16 using the energy as a driving source, and then the capacitive coupling of the capacitive elements C1 and C2 to the The radiation plate 20 transmits the signaling signal, and is sent and transmitted from the radiation plate 20 to the reader/writer.

(Refer to Figure 29 to Figure 31 for the 17th embodiment)

As the wireless IC device 1q of the seventeenth embodiment, as shown in the equivalent circuit of FIG. 29, the power supply circuit 16 includes inductance elements L1, L2 magnetically coupled to each other, and the inductance element L1 is connected to the wireless IC chip 5 through the capacitance elements C1a, C1b. , Moreover, it is connected in parallel with the inductance element L2 through the capacitance elements C2a, C2b. In other words, the power supply circuit 16 includes an LC series resonant circuit composed of the inductance element L1 and the capacitive elements C1a, C1b, and an LC series resonant circuit composed of the inductance element L2 and the capacitive elements C2a, C2b. The M indicates the magnetic field coupling to be connected. Also, both the inductance elements L1 and L2 are magnetically coupled to the radiation plate 20 .

Specifically, the power supply circuit substrate 10 is a substrate formed by laminating, crimping, and sintering ceramic sheets 81A to 81H made of dielectric materials, as shown in FIG. Sheet 81B of patterns 82a, 82b and through-hole conductors 83a, 83b, 84a, 84b, sheet 81C formed with conductor patterns 82a, 82b and through-hole conductors 83c, 84c, 83e, 84e, formed with conductor patterns 82a, 82b and the sheet 81D of the through-hole conductors 83d, 84d, 83e, 84e, the sheet 81E formed with the capacitive electrodes 85a, 85b and the through-hole conductor 83e, the sheet 81F formed with the capacitive electrodes 86a, 86b, and the non-patterned sheet 81G, a sheet 81H having capacitive electrodes 87a and 87b formed on the reverse side.

By laminating the above sheets 81A to 81H, the conductive pattern 82a is connected by via-hole conductors 83b, 83c to form an inductance element L1, and the conductive pattern 82b is connected by via-hole conductors 84b, 84c to form an inductance element L2. The capacitance element C1a is formed by the capacitance electrodes 86a and 87a, and the capacitance electrode 86a is connected to one end of the inductance element L1 through the through-hole conductor 83e. The capacitance element C1b is formed by the capacitance electrodes 86b and 87b, and the capacitance electrode 86b is connected to the other end of the inductance element L1 through the through-hole conductor 83d. Furthermore, the capacitive element C2a is formed by the capacitive electrodes 85a and 86a, and the capacitive electrode 85a is connected to one end of the inductance element L2 through the through-hole conductor 84e. The capacitive element C2b is formed by capacitive electrodes 85b and 86b, and the capacitive electrode 85b is connected to the other end of the inductance element L2 through the through-hole conductor 84d.

The functions and effects of the seventeenth embodiment are basically the same as those of the above-mentioned first embodiment. That is, the wireless IC device 1q uses the radiation plate 20 to receive a high-frequency signal (for example, UHF frequency band) radiated from a reader/writer not shown in the figure, so that the power supply circuit 16 mainly magnetically coupled with the radiation plate 20 (by the inductance element L1 and The LC series resonant circuit composed of capacitive elements C1a, C1b and the LC series resonant circuit composed of inductive element L2 and capacitive elements C2a, C2b) resonate and supply only reception signals of a predetermined frequency band to the wireless IC chip 5. On the other hand, a predetermined energy is extracted from the received signal, and the information stored in the wireless IC chip 5 is matched to a predetermined frequency by the power supply circuit 16 using the energy as a driving source, and then the inductance element of the power supply circuit 16 is magnetically coupled. L1 and L2 transmit signaling signals to the radiation plate 20 , and are sent and transmitted from the radiation plate 20 to the reader/writer.

In particular, in the seventeenth embodiment, as shown in FIG. 31 , a very wide frequency band with a frequency bandwidth X (a frequency bandwidth of −5 dB) of 150 MHz or more is realized. This is because the power supply circuit 16 is constituted by a plurality of LC resonant circuits including inductance elements L1 and L2 magnetically coupled to each other at a high degree of coupling. In addition, since the capacitive elements C1a and C2a are inserted in the subsequent stage of the wireless IC chip 5, the surge resistance performance is improved.

(Refer to Figure 32 and Figure 34 for the eighteenth embodiment)

As the wireless IC device 1r according to the eighteenth embodiment, as shown in the equivalent circuit of FIG. 32, the power supply circuit 16 includes inductance elements L1 and L2 which are magnetically coupled to each other at a high degree of coupling. The inductance element L1 and the inductance element 5 disposed on the wireless IC chip 5 realize magnetic coupling, and the inductance element L2 and the capacitance element C2 form a series resonant circuit. In addition, the capacitive element C1 and the radiation plate 20 realize capacitive coupling, and one more capacitive element C3 is inserted between the capacitive elements C1 and C2.

Specifically, as shown in FIG. 33, the power supply circuit substrate 10 is a substrate formed by laminating, crimping, and sintering ceramic sheets 91A to 91E made of dielectric materials, and includes: forming conductive patterns 92a, 92b and through Sheet 91A of hole conductors 93a, 93b, 94a, 94b, sheet 91B formed with capacitive electrode 95 and through-hole conductors 93c, 93d, 94c, sheet 91C formed with capacitive electrode 96 and through-hole conductors 93c, 93d, Sheet 91D on which capacitive electrode 97 and through-hole conductor 93c are formed, and sheet 91E on which capacitive electrode 98 is formed.

By laminating the above-mentioned sheets 91A to 91E, the inductance element L1 is formed by the conductive pattern 92a, and the inductance element L2 is formed by the conductive pattern 92b. Capacitive element C1 is formed by capacitive electrodes 97 and 98, and one end of inductive element L1 is connected to capacitive electrode 98 through through-hole conductors 93a and 93c, and the other end is connected to capacitive electrode 97 through through-hole conductors 93b and 93d. The capacitive element C2 is formed by the capacitive electrodes 95 and 96, and one end of the inductive element L2 is connected to the capacitive electrode 96 through the through-hole conductors 94a and 94c, and the other end is connected to the capacitive electrode 95 through the through-hole conductor 94b. Furthermore, the capacitive element C3 is formed by the capacitive electrodes 96 and 97 .

Furthermore, as shown in FIG. 34, a coil-shaped electrode pattern 99 is provided as a chip-side electrode pattern on the reverse side of the wireless IC chip 5, and the coil-shaped electrode pattern 99 forms an inductance element L5. In addition, a protective film made of resin or the like is provided on the surface of the coiled electrode pattern 99 . With this, the inductance elements L1 and L2 formed using the coil-shaped electrode pattern as the substrate-side electrode pattern and the coil-shaped electrode pattern 99 are magnetically coupled.

The functions and effects of the eighteenth embodiment are basically the same as those of the above-mentioned first embodiment. That is, the wireless IC device 1r uses the radiation plate 20 to receive a high-frequency signal (such as a UHF frequency band) radiated from a reader/writer not shown in the figure, so that the power supply circuit 16 that realizes capacitive coupling and magnetic coupling with the radiation plate 20 (by an inductance element) An LC series resonant circuit formed by L2 and capacitive element C2 resonates, and supplies only a reception signal of a predetermined frequency band to the wireless IC chip 5 . On the other hand, a predetermined energy is extracted from the received signal, and the information stored in the wireless IC chip 5 is matched to a predetermined frequency by the power supply circuit 16 using the energy as a driving source, and then is coupled to the radiation plate 20 through capacitive coupling and magnetic field coupling. The transmission signal is transmitted, and is sent and transmitted from the radiation panel 20 to the reader/writer. The power supply circuit 16 and the wireless IC chip 5 are magnetically coupled through the inductance elements L1 and L5, thereby realizing the transmission of power and sending and receiving signals.

(Refer to Figure 35 and Figure 36 for the nineteenth embodiment)

As the wireless IC device 1s of the nineteenth embodiment, as shown in the equivalent circuit of FIG. 35, the power supply circuit 16 includes inductance elements L1, L2, and L3 that are magnetically coupled to each other at a high degree of coupling. The inductance element L1 is magnetically coupled with the inductance element L5 provided on the wireless IC chip 5, the inductance element L2 forms an LC series resonant circuit with the capacitance elements C1a, C1b, and the inductance element L3 forms an LC series resonance circuit with the capacitance elements C2a, C2b. In addition, the inductance elements L1 , L2 , and L3 are magnetically coupled to the radiation plate 20 , respectively.

Specifically, as shown in FIG. 36 , the power supply circuit board 10 is a board formed by laminating, crimping, and sintering ceramic sheets 101A to 101E made of dielectric materials, and includes a conductor pattern 102a and a through-hole conductor formed thereon. Sheet 101A of 103a, 103b, sheet 101B formed with capacitive electrodes 104a, 104b, sheet 101C formed with capacitive electrodes 105a, 105b and through-hole conductors 103c, 103d, formed with capacitive electrodes 106a, 106b and through-hole conductors Sheet 101D of 103c, 103d, 103e, 103f, and sheet 102E on which conductor patterns 102b, 102c are formed. That is, a space is reserved between the electrodes 104a, 105a, 106a and electrodes 104b, 105b, 106b constituting the capacitive element, so that the magnetic flux generated by the inductance element L1 reaches the inductance elements L2, L3, and then reaches the radiation plate 20.

By laminating the above sheets 101A to 101E, the inductance element L1 is formed by the conductive pattern 102a, the inductance element L2 is formed by the conductive pattern 102b, and the inductance element L3 is formed by the conductive pattern 102c. The capacitive element C1a is formed by the capacitive electrodes 104a and 105a, and the capacitive element C1b is formed by the capacitive electrodes 104b and 105b. Moreover, the capacitive element C2a is formed by the capacitive electrodes 105a and 106a, and the capacitive element C2b is formed by the capacitive electrodes 105b and 106b.

One end of the inductance element L1 is connected to the capacitor electrode 104a through the through-hole conductor 103a, and the other end is connected to the capacitor electrode 104b through the through-hole conductor 103b. One end of the inductance element L2 is connected to the capacitor electrode 105a through the through-hole conductor 103c, and the other end is connected to the capacitor electrode 106b through the through-hole conductor 103f. One end of the inductance element L3 is connected to the capacitor electrode 106a through the through-hole conductor 103e, and the other end is connected to the capacitor electrode 105b through the through-hole conductor 103d.

Further, as shown in FIG. 34 , a coil-shaped electrode pattern 99 is provided on the reverse side of the wireless IC chip 5 as a chip-side electrode pattern, and the coil-shaped electrode pattern 99 forms an inductance element L5 . In addition, a protective film made of resin or the like is provided on the surface of the coiled electrode pattern 99 . With this, the inductance element L1 formed using the coil-shaped electrode pattern as the substrate-side electrode pattern and the coil-shaped electrode pattern 99 are magnetically coupled. The functions and effects of the nineteenth embodiment are basically the same as those of the seventeenth embodiment described above. That is, this wireless IC device 1s receives a high-frequency signal (such as a UHF band) radiated from a reader/writer not shown through the radiation plate 20, and makes the power supply circuit 16 magnetically coupled to the radiation plate 20 (by the inductance element L2 and The LC series resonant circuit composed of capacitive elements C1a, C1b, and the LC series resonant circuit composed of inductive element L3 and capacitive elements C2a, C2b) resonate and supply only reception signals of a predetermined frequency band to the wireless IC chip 5. On the other hand, a predetermined energy is extracted from the received signal, the information stored in the wireless IC chip 5 is matched to a predetermined frequency by the power supply circuit 16 using the energy as a driving source, and then the inductance element of the power supply circuit 16 is coupled by a magnetic field. L1 , L2 , and L3 transmit signaling signals to the radiation plate 20 , and are sent and transmitted from the radiation plate 20 to the reader/writer. The power supply circuit 16 and the wireless IC chip 5 are magnetically coupled through the inductance elements L1 and L5, thereby realizing the transmission of electric power and sending and receiving signals.

In particular, in the nineteenth embodiment, since the power supply circuit 16 is constituted by a plurality of LC resonant circuits including mutually magnetically coupled inductance elements L2, L3, the frequency band is widened as in the seventeenth embodiment.

(The twentieth embodiment refers to Fig. 37 and Fig. 42)

The wireless IC device 1t of the twentieth embodiment is a device in which the feeder circuit board 110 is formed of a single-layer board, and its equivalent circuit is the same as that in FIG. 3 . That is, the power supply circuit 16 is constituted by a series resonant circuit composed of the inductance element L and the capacitance elements C1 and C2 connected to both ends thereof. The feed circuit substrate 110 is a ceramic substrate made of a dielectric. As shown in FIG. 37 , capacitor electrodes 111a and 111b are formed on the front surface, and capacitor electrodes 112a and 112b and a conductive pattern 113 are formed on the reverse surface. The capacitive element C1 is formed by the capacitive electrodes 111a and 112a, and the capacitive element C2 is formed by the capacitive electrodes 111b and 112b.

The functions and effects of the twentieth embodiment are basically the same as those of the above-mentioned first embodiment. That is, the wireless IC device 1t receives a high-frequency signal (such as a UHF band) radiated from a reader/writer not shown through the radiation plate 20, and magnetically couples the power supply circuit 16 with the radiation plate 20 (by the inductance element L and An LC series resonance circuit constituted by capacitive elements C1 and C2 resonates and supplies only reception signals of a predetermined frequency band to the wireless IC chip 5 . On the other hand, a predetermined energy is extracted from the received signal, the information stored in the wireless IC chip 5 is matched to a predetermined frequency by the power supply circuit 16 using the energy as a driving source, and then the inductance element of the power supply circuit 16 is coupled by a magnetic field. L transmits a signaling signal to the radiation plate 20 , and transmits and transmits it from the radiation plate 20 to the reader/writer.

In particular, in the twentieth embodiment, as shown in FIGS. 38 and 39 , the inductance element is arranged so as to partially overlap the wireless IC chip 5 in plan view. In this way, almost none of the magnetic flux generated by the inductance element L is blocked by the wireless IC chip, so that the rise of the magnetic flux is favorable.

In addition, in the twentieth embodiment, as shown in FIG. 40 , the power supply circuit board 110 on which the wireless IC chip is mounted may be sandwiched between the front and back sides by radiation plates 20 , 20 . This can increase the magnetic coupling efficiency between the power supply circuit 16 and the radiation plates 20, 20, and improve the gain.

As an aspect in which the radiation plates 20 and 20 are arranged on the front and back surfaces of the power supply circuit board 110, as shown in FIG. 41, they may be arranged in line on the x-axis, or as shown in FIG. on the y-axis.

(The 21st embodiment refers to Fig. 43)

A wireless IC device 1u according to the twenty-first embodiment is formed with a serpentine wire electrode pattern, and its equivalent circuit is the same as that in FIG. 3 . That is to say, the power supply circuit 16 is composed of an LC series resonant circuit composed of the inductance element L and the capacitance elements C1 and C2 connected to both ends thereof. The power supply circuit substrate 110 is a ceramic single-layer substrate made of a dielectric. As shown in FIG. The capacitive element C1 is formed by the capacitive electrodes 121a and 122a, and the capacitive element C2 is formed by the capacitive electrodes 121b and 122b.

The functions and effects of the twenty-first embodiment are basically the same as those of the above-mentioned first embodiment. That is, this wireless IC device 1u receives a high-frequency signal (such as a UHF band) radiated from a reader/writer not shown through the radiation plate 20, and magnetically couples the power supply circuit 16 with the radiation plate 20 (by the inductance element L and An LC series resonance circuit constituted by capacitive elements C1 and C2 resonates and supplies only reception signals of a predetermined frequency band to the wireless IC chip 5 . On the other hand, a predetermined energy is extracted from the received signal, the information stored in the wireless IC chip 5 is matched to a predetermined frequency by the power supply circuit 16 using the energy as a driving source, and then the inductance element of the power supply circuit 16 is coupled by a magnetic field. L transmits a signaling signal to the radiation plate 20 , and transmits and transmits it from the radiation plate 20 to the reader/writer.

In particular, in the twenty-first embodiment, since the inductance element L is constituted by the meandering conductive pattern 123, it is possible to efficiently transmit and receive high-frequency signals.

In addition, in the above-mentioned 20th embodiment and the present 21st embodiment, the power supply circuit board 110 may be constituted by a multilayer board.

(Refer to Figure 44 and Figure 45 for the 22nd embodiment)

As the wireless IC device 1v of the twenty-second embodiment, as shown in the equivalent circuit of FIG. 44, the power supply circuit 16 includes inductance elements L1 and L2 that are electromagnetically coupled to each other (indicated by symbol M), and one end of the inductance element L1 passes through a capacitance element. C1 and the connection electrode 131a are connected to the wireless IC chip 5, and are also connected to one end of the inductance element L2 through the capacitance element C2. In addition, the other ends of the inductance elements L1 and L2 are respectively connected to the wireless IC chip 5 through the connection electrodes 131b. In other words, the power supply circuit 16 includes: an LC series resonant circuit composed of an inductive element L1 and a capacitive element C1, and an LC series resonant circuit composed of an inductive element L2 and a capacitive element C2, and both the inductive elements L1 and L2 Magnetic coupling is achieved with the radiation plate 20 .

The structure of the power supply circuit board 10 is shown in FIG. 45 . The connection electrode 131a is connected to the capacitance electrode 133 through the through-hole conductor 132a, and the capacitance electrode 133 and the capacitance electrode 134 are opposed to form a capacitance element C1. Furthermore, the capacitive electrode 134 is opposed to the capacitive electrode 135 to form a capacitive element C2. The connection electrode 131b is connected to the bifurcated conductor patterns 136a and 137a through the through-hole conductor 132b, the conductor pattern 136a is connected to the conductor pattern 136b through the through-hole conductor 132c, and is connected to the conductor pattern 136c through the through-hole conductor 132d, and It is also connected to the conductor pattern 136d through the through-hole conductor 132e, and the conductor pattern 136d is connected to the capacitor electrode 134 through the through-hole conductor 132f.

On the other hand, the conductor pattern 137a is connected to the conductor pattern 137b via the via-hole conductor 132g, is connected to the conductor pattern 137c via the via-hole conductor 132h, and is also connected to the capacitor electrode 135 via the via-hole conductor 132i. The conductor patterns 136a, 136b, and 136c constitute the inductance element L1, and the conductor patterns 137a, 137b, and 137c constitute the inductance element L2. In addition, in FIG. 45 , the illustration of the ceramic sheet made of a dielectric is omitted.

The functions and effects of the twenty-second embodiment are basically the same as those of the above-mentioned first embodiment. That is, the wireless IC device 1v receives a high-frequency signal (for example, a UHF band) radiated from a reader/writer not shown through the radiation plate 20, and makes the power supply circuit 16 mainly magnetically coupled with the radiation plate 20 (by the inductance element L1 The LC series resonant circuit composed of the capacitive element C1 and the LC series resonant circuit composed of the inductive element L2 and the capacitive element C2) resonate, and supply only a reception signal of a predetermined frequency band to the wireless IC chip 5 . On the other hand, a predetermined energy is extracted from the received signal, the information stored in the wireless IC chip 5 is matched to a predetermined frequency by the power supply circuit 16 using the energy as a driving source, and then the inductance element of the power supply circuit 16 is coupled by a magnetic field. L1 and L2 transmit signaling signals to the radiation plate 20 , and are sent and transmitted from the radiation plate 20 to the reader/writer.

In particular, in the twenty-second embodiment, the capacitance electrodes 133 , 134 , and 135 and the inductance conductor patterns 136 a to 136 c , 137 a to 137 c are arranged so as to be parallel to the radiation plate 20 . Therefore, the magnetic field formed by the inductor conductor patterns 136a-136c, 137a-137c is not shielded by the capacitor electrodes 133, 134, 135, and the radiation characteristics from the inductor conductor patterns 136a-136c, 137a-137c can be improved.

(The 23rd embodiment refers to Fig. 46)

As a wireless IC device of the twenty-third embodiment, it is constructed using a power supply circuit board 10 including a power supply circuit 16 having an equivalent circuit shown in FIG. 44 . As shown in FIG. 46, this power supply circuit board 10 has basically the same structure as that of the power supply circuit board 10 shown in FIG. (reflection pattern) 138 and director (waveguide pattern) 139 to obtain the substrate. The reflector 138 and the director 139 can easily adjust the radiation characteristics and directivity from the power supply circuit 16 to the radiation plate 20 , and can eliminate the influence of the external magnetic field as much as possible to stabilize the resonance characteristics. The effect of the twenty-third embodiment is the same as that of the above-mentioned twenty-second embodiment.

(Refer to Figure 47 and Figure 48 for the twenty-fourth embodiment)

A wireless IC device 1w according to the twenty-fourth embodiment is a device in which a power supply circuit 150 is formed by a distributed constant type resonant circuit having an inverted-F antenna structure, and has an equivalent circuit shown in FIG. 47 . Specifically, as shown in FIG. 48, the power supply circuit board 140 composed of a ceramic multilayer substrate includes: a high-side electrode 151 provided on the first surface 140a, a capacitor electrode 152 mounted inside, and a capacitor electrode 152 provided on the second surface 140b. low side electrode 153 . The high-side electrode 151 is electrically connected to the radiation plate 20 through magnetic field coupling and capacitive coupling, and is connected to the high-side terminal of the wireless IC chip through the power supply pin 154 . The low-side terminal 153 is connected to the low-side terminal of the wireless IC chip 5 and also connected to the high-side electrode 151 via the short-circuit pin 155 . The capacitor electrode 152 faces the high-side electrode 151 to form a capacitor, and is connected to the low-side electrode 153 through the short-circuit pin 156 .

This wireless IC device 1w receives a high-frequency signal radiated from a reader/writer (not shown) through the radiation plate 20, resonates the power supply circuit 150 that realizes magnetic coupling and capacitive coupling with the radiation plate 20, and transmits only signals of a predetermined frequency band. The signal is supplied to the wireless IC chip 5. On the other hand, a predetermined energy is extracted from the received signal, and the information stored in the wireless IC chip 5 is matched to a predetermined frequency by the power supply circuit 150 using the energy as a driving source, and then transmitted from the radiation plate 20 to the reader/writer. ,transmission.

(The 25th embodiment refers to Fig. 49 and Fig. 50)

A wireless IC device 1x according to the twenty-fifth embodiment is a device in which a power supply circuit 150 is formed by a distributed constant type resonant circuit having an inverted-F antenna structure, and has an equivalent circuit shown in FIG. 49 . Specifically, as shown in FIG. 50 , feeder circuit board 140 made of a ceramic multilayer substrate includes high-side electrodes 161 provided on first surface 140 a and low-side electrodes 162 provided on second surface 140 b. The high-side electrode 161 is electrically connected to the radiation plate 20 through magnetic field coupling and capacitive coupling, and is connected to the high-side terminal of the wireless IC chip 5 through the power supply pin 163 . The low-side terminal 162 is connected to the low-side terminal of the wireless IC chip 5 , and is also connected to the high-side electrode 161 via the short-circuit pin 164 .

The wireless IC device 1x uses the radiation plate 20 to receive a high-frequency signal radiated from a reader/writer not shown, and resonates the power supply circuit 160 that realizes magnetic coupling and capacitive coupling with the radiation plate 20, and transmits only signals of a predetermined frequency band. The signal is supplied to the wireless IC chip 5. On the other hand, a predetermined energy is extracted from the received signal, and the information stored in the wireless IC chip 5 is matched to a predetermined frequency by the power supply circuit 160 using the energy as a driving source, and then transmitted from the radiation plate 20 to the reader/writer. ,transmission.

(Refer to Figure 51 and Figure 52 for the twenty-sixth embodiment)

A wireless IC device 1y according to the twenty-sixth embodiment is a device in which a power supply circuit 170 is formed by a distributed constant type resonant circuit formed of an inverted L antenna structure, and has an equivalent circuit shown in FIG. 51 . Specifically, as shown in FIG. 52 , feeder circuit board 140 made of a ceramic multilayer substrate includes high-side electrodes 171 provided on first surface 140 a and low-side electrodes 172 provided on second surface 140 b. The high-side electrode 171 is electrically connected to the radiation plate 20 through magnetic field coupling and capacitive coupling, and is connected to the high-side terminal of the wireless IC chip 5 through the power supply pin 173 . The low-side electrode 172 is connected to a low-side terminal of the wireless IC chip 5 .

In this wireless IC device 1y, the radiation plate 20 receives a high-frequency signal radiated from a reader/writer (not shown), resonates the power supply circuit 170 for magnetic field coupling and capacitive coupling with the radiation plate 20, and transmits only signals of a predetermined frequency band. The signal is supplied to the wireless IC chip 5. On the other hand, a predetermined energy is extracted from the reception signal, and the information stored in the wireless IC chip 5 is matched to a predetermined frequency by the power supply circuit 170 using the energy as a driving source, and then transmitted from the radiation plate 20 to the reader/writer. ,transmission.

(Refer to Figure 53 and Figure 54 for the twenty-seventh embodiment)

A wireless IC device 1z according to the twenty-seventh embodiment is a device in which a power supply circuit 180 is formed by a distributed constant type resonant circuit formed by an inverted L antenna structure, and has an equivalent circuit shown in FIG. 53 . Specifically, as shown in FIG. 54, the power supply circuit board 140 composed of a ceramic multilayer substrate includes a high-side electrode 181 provided on the first surface 140a, a capacitor electrode 182 mounted inside, and a low-side electrode 182 provided on the second surface 140b. side electrodes 183 . The high-side electrode 181 is electrically connected to the radiation plate 20 by magnetic field coupling and capacitive coupling. The capacitor electrode 182 faces the high-side electrode 181 to form a capacitor, and is connected to the high-side terminal of the wireless IC chip 5 through the power supply pin 184 . The low-side terminal 183 is connected to the low-side terminal of the wireless IC chip 5 and also connected to the high-side electrode 181 via the short-circuit pin 185 .

This wireless IC device 1z uses the radiation plate 20 to receive high-frequency signals radiated from a reader/writer (not shown), resonates the power supply circuit 180 that realizes magnetic coupling and capacitive coupling with the radiation plate 20, and transmits only signals of a predetermined frequency band. The signal is supplied to the wireless IC chip 5. On the other hand, a predetermined energy is extracted from the received signal, and the information stored in the wireless IC chip 5 is matched to a predetermined frequency by the power supply circuit 180 using the energy as a driving source, and then transmitted from the radiation plate 20 to the reader/writer. ,transmission.

(The twenty-eighth embodiment refers to Fig. 55)

As the wireless IC device 2a of the twenty-eighth embodiment, as shown in FIG. A device obtained by bonding to the radiation plate 20 . For example, the power supply circuit board 10 has a structure in which the power supply circuit 16 shown in FIG.

Also in this wireless IC device 2a, the power supply circuit 16 is mainly magnetically coupled to the radiation plate 20, plays the same role as in the above-mentioned first embodiment, and exchanges signals with the reader/writer. In addition, in this twenty-eighth embodiment, as the power supply circuit board 10, in addition to the board shown in the first embodiment, the boards shown in the above-mentioned respective embodiments may also be used. This point also applies to the twenty-ninth embodiment described below.

(For the twenty-ninth embodiment, refer to FIG. 56)

As the wireless IC device 2b of the twenty-ninth embodiment, as shown in FIG. 56, compared with the above-mentioned twenty-eighth embodiment, another radiation plate 20 is pasted on the wiring board 8, and a pair of radiation plates 20, 20 sandwich the wireless IC. A chip 5 , a power supply circuit board 10 , and a wiring board 8 are obtained. Its function is the same as that of the twenty-eighth embodiment, especially the magnetic coupling efficiency between the power supply circuit 16 and the radiation plates 20 and 20 can be improved.

(Refer to FIG. 57 for the 30th embodiment)

In the wireless IC device 2c according to the thirtieth embodiment, as shown in FIG. 57, a radiating plate 22 in the shape of a double closed loop is provided on the surface of a resin film 21 in bilateral symmetry, and at the center of the inner loop of the radiating plate 22, The case where the power supply circuit board 10 on which the wireless IC chip 5 is mounted is disposed on the inside.

In the thirtieth embodiment, the power supply circuit board 10 is not pasted on the radiation plate 22 , but is arranged at a position close to the radiation plate 22 . Furthermore, since the radiating plate 22 is formed in a loop shape, the linear length of the radiating plate 22 is reduced. Even in this configuration, the power supply circuit board 10 and the radiation plate 22 can be coupled electromagnetically, and signals can be transmitted and received as in the above-described embodiments, and signals can be exchanged with the reader/writer. In addition, the power supply circuit board 10 can be arranged in the approximate center of the radiation plate 22 , and there is no high requirement for positional accuracy.

(Refer to FIG. 58 for the 31st embodiment)

In the wireless IC device 2d of the thirty-first embodiment, as shown in FIG. 58, a radiation plate 23 in which a serpentine shape, a loop shape, and a spiral shape are combined is arranged symmetrically on the surface of a resin film 21. A device obtained by mounting the power supply circuit board 10 on which the wireless IC chip 5 is mounted is placed at the center of the inner loop at 23 .

Even in the thirty-first embodiment, the power supply circuit board 10 is not pasted on the radiation plate 23 but arranged near the radiation plate 23 . Furthermore, since the radiation plate 23 is formed in a combination of a meander shape, a loop shape, and a spiral shape, the linear length of the radiation plate 23 is reduced. Even in such a configuration, the power supply circuit board 10 and the radiation plate 23 can be electromagnetically coupled to transmit and receive signals as in the above-described embodiments, and to exchange signals with the reader/writer. Also, as in the above-mentioned thirtieth embodiment, the arrangement of the power supply circuit board 10 is not required to have such a high positional accuracy.

(other embodiments)

In addition, the wireless IC device of the present invention is not limited to the above-described embodiments, and various modifications can be made within the scope of the gist thereof.

For example, the details of the internal structure of the power supply circuit substrate, the detailed shapes of the radiation plate and the thin film are arbitrary. In addition, processes other than solder bumping may be used to connect the wireless IC chip to the power supply circuit board. Moreover, the power supply circuit substrate does not necessarily have to be a rigid substrate, and may also be made of an organic resin material (such as polyimide or liquid crystal polymer) as a flexible substrate.

Industrial Applicability

As described above, the present invention is useful for a power supply circuit, and is particularly outstanding in that it has stable frequency characteristics and realizes a wide frequency band.

Claims (30)

1. A wireless IC device for a frequency band above the UHF band, characterized in that, have: Wireless IC chip; a power supply circuit substrate connected to the wireless IC chip and provided with a power supply circuit including a resonance circuit having a predetermined resonance frequency; and adhering or close to the substrate of the power supply circuit, and transmitting the signal signal provided by the power supply circuit, and/or receiving the signal reception signal to provide to the radiation plate of the power supply circuit, The power supply circuit includes a resonant circuit that resonates at a frequency of transmitting and receiving signals, and is built in the power supply circuit substrate, The radiating plate is a rectangular parallelepiped made of a non-magnetic body, that is, a metal body with open ends, The frequency of the signal radiated from the radiation plate is determined by the resonant frequency of the power supply circuit. 2. The wireless IC device as claimed in claim 1, wherein, The wireless IC chip and the power supply circuit board are arranged side by side on the wiring board, and are connected via conductors provided on the wiring board. 3. A wireless IC device for a frequency band above the UHF band, characterized in that, have: Wireless IC chip; a power supply circuit substrate on which the wireless IC chip is mounted, and a power supply circuit including a resonance circuit having a predetermined resonance frequency is provided; and adhering or close to the substrate of the power supply circuit, and transmitting the signal signal provided by the power supply circuit, and/or receiving the signal reception signal to provide to the radiation plate of the power supply circuit, The power supply circuit includes a resonant circuit that resonates at a frequency of transmitting and receiving signals, and is built in the power supply circuit substrate, The radiating plate is a rectangular parallelepiped made of a non-magnetic body, that is, a metal body with open ends, The frequency of the signal radiated from the radiation plate is determined by the resonant frequency of the power supply circuit. 4. The wireless IC device according to claim 1 or 3, wherein The frequency of the transmitting signal and the frequency of the receiving signal are substantially determined by the resonance frequency of the resonance circuit of the power supply circuit board. 5. The wireless IC device according to claim 1 or 3, wherein The radiation plate is arranged on the front and back surfaces of the power supply circuit substrate. 6. The wireless IC device according to claim 1 or 3, wherein The resonant circuit is a distributed constant type resonant circuit. 7. The wireless IC device according to claim 1 or 3, wherein The resonant circuit is a concentrated constant type resonant circuit composed of capacitance patterns and inductance patterns. 8. The wireless IC device as claimed in claim 7, wherein The lumped constant type resonant circuit is an LC series resonant circuit or an LC parallel resonant circuit. 9. The wireless IC device as claimed in claim 8, wherein, The structure of the lumped constant resonant circuit includes a plurality of LC series resonant circuits or a plurality of LC parallel resonant circuits. 10. The wireless IC device according to claim 7, wherein The capacitor pattern is arranged at a subsequent stage of the wireless IC chip, and is arranged between the wireless IC chip and the inductor pattern. 11. The wireless IC device according to claim 7, wherein, The capacitor pattern and the inductor pattern are arranged to be parallel to the radiation plate. 12. The wireless IC device as claimed in claim 11, wherein, A reflector and/or a director is arranged at a portion where a magnetic field is formed by the inductor pattern. 13. The wireless IC device according to claim 7, wherein The power supply circuit substrate is a multilayer substrate formed by stacking multiple dielectric layers or magnetic layers; the capacitor pattern and the inductor pattern are formed on the surface and/or inside of the multilayer substrate. 14. The wireless IC device according to claim 7, wherein, The power supply circuit substrate is a dielectric or magnetic single-layer substrate; the capacitor pattern and/or the inductor pattern are formed on the surface of the single-layer substrate. 15. The wireless IC device according to claim 1 or 3, wherein, The power supply circuit substrate is a rigid substrate; the radiation plate is formed with a flexible metal film. 16. The wireless IC device as claimed in claim 15, wherein, The flexible metal film is supported on the flexible resin film. 17. The wireless IC device according to claim 1 or 3, wherein, The electrical length of the radiating plate is an integer multiple of the half-wavelength of the resonant frequency. 18. The wireless IC device according to claim 1 or 3, wherein The wireless IC chip is provided with a chip-side electrode pattern, and the power supply circuit substrate is provided with a first substrate-side electrode pattern, and the wireless IC chip and the power supply circuit substrate use the chip-side electrode pattern and the first The DC connection of the electrode pattern on the substrate side achieves the connection. 19. The wireless IC device according to claim 1 or 3, wherein, The wireless IC chip is provided with a chip-side electrode pattern, and the power supply circuit substrate is provided with a first substrate-side electrode pattern, and the wireless IC chip and the power supply circuit substrate use the chip-side electrode pattern and the first The capacitive coupling between the electrode patterns on the substrate side realizes the connection. 20. The wireless IC device as claimed in claim 19, wherein, The chip-side electrode pattern and the first substrate-side electrode pattern are planar electrode patterns parallel to each other, and the wireless IC chip and the power supply circuit substrate are bonded through an insulating adhesive layer. 21. The wireless IC device according to claim 1 or 3, wherein The wireless IC chip is provided with a chip-side electrode pattern, and the power supply circuit substrate is provided with a first substrate-side electrode pattern, and the wireless IC chip and the power supply circuit substrate use the chip-side electrode pattern and the The magnetic coupling between the electrode patterns on the first substrate side realizes connection. 22. The wireless IC device as claimed in claim 21, wherein The chip-side electrode pattern and the first substrate-side electrode pattern are respectively coil-shaped electrode patterns, and the wireless IC chip and the power supply circuit board are bonded via an insulating adhesive layer. 23. The wireless IC device according to claim 1 or 3, wherein, The power supply circuit substrate is provided with a second substrate-side electrode pattern, and the power supply circuit substrate and the radiation plate are connected by a DC connection between the second substrate-side electrode pattern and the radiation plate. 24. The wireless IC device according to claim 1 or 3, wherein, The power supply circuit substrate is provided with a second substrate-side electrode pattern, and the power supply circuit substrate and the radiation plate are connected by capacitive coupling between the second substrate-side electrode pattern and the radiation plate. 25. The wireless IC device as claimed in claim 24, wherein, The second substrate-side electrode pattern is a planar electrode pattern arranged parallel to the radiation plate, and the power supply circuit board and the radiation plate are bonded via an insulating adhesive layer. 26. The wireless IC device according to claim 1 or 3, wherein, The power supply circuit substrate is provided with a second substrate-side electrode pattern, and the power supply circuit substrate and the radiation plate are connected by magnetic coupling between the second substrate-side electrode pattern and the radiation plate. 27. The wireless IC device as claimed in claim 26, wherein, The second substrate-side electrode pattern is a coil-shaped electrode pattern, and the power supply circuit substrate and the radiation plate are bonded via an insulating adhesive layer. 28. The wireless IC device as claimed in claim 27, wherein, The coiled electrode pattern is formed such that its winding axis is parallel to the radiation plate. 29. The wireless IC device as claimed in claim 27, wherein, The coiled electrode pattern is formed so that its winding axis is perpendicular to the radiation plate. 30. The wireless IC device as claimed in claim 29, wherein, The coiled electrode pattern is formed such that its winding width becomes gradually larger toward the radiation plate.