CN106562774A - Wearable equipment of intelligence - Google Patents

Abstract

A smart wearable device, the device comprising: the flexible sensor system comprises a flexible circuit board, and a sensor module, a microprocessor module and a wireless communication module which are arranged on the flexible circuit board; a chip carrier detachably connected to the flexible sensor system. The functional module is arranged on the flexible sensor system, so that the flexible sensor system has small volume and light weight, and the combination mode of the flexible sensor system and a chip bearing object is flexible and changeable. And through the detachable connection with the chip bearing object, the flexible sensor system of the device is separated from the chip bearing object, so that the intelligent wearable device can be disassembled, the flexible sensor system is taken out, the chip bearing object is cleaned, and the intelligent wearable device is recycled.

Description

A smart wearable device

technical field

This application relates to the field of electronic technology, in particular to a smart wearable device.

Background technique

With the development of science and technology, smart wearable devices are developing rapidly. A smart wearable device is an electronic device that combines electronic products with specific functional sensors with clothing, shoes and hats, etc. For example, electronic products used in sports and fitness, medical care and other fields can measure body temperature, heartbeat, step frequency, etc. through smart wearable devices, enabling users to obtain these data in a more direct way, and then enjoy the convenience brought by electronic products .

Existing smart wearable devices usually highly combine electronic products with clothing in order to ensure the stability of electronic products and the realization of the functions of electronic products. For example, a low-radiation wearable baby monitor with a publication number of CN103700215A embeds a microprocessor and a radio frequency transceiver in the waist position of the clothing to prevent the baby’s large movements from affecting its stability. A plurality of different types of sensors are respectively arranged at the positions to realize the monitoring of different state information of the baby.

However, due to the complex design of electronic products and the high degree of integration with clothing, the smart wearable device has poor flexibility and is not easy to disassemble and clean, which is not conducive to the reuse of smart wearable devices.

Contents of the invention

In order to solve the above technical problems, the present application provides a smart wearable device, which has good flexibility, is easy to disassemble and clean, and is beneficial to the reuse of the wearable device.

A smart wearable device, comprising: a flexible sensor system, the flexible sensor system includes a flexible circuit board, and a sensor module, a microprocessor module and a wireless communication module arranged on the flexible circuit board, the sensor module, The microprocessor module and the wireless communication module are electrically connected in turn; the chip carrier is detachably connected to the flexible sensor system.

Preferably, the smart wearable device further includes: a flexible plastic film wrapping the flexible sensor system.

Preferably, the smart wearable device further includes: a flexible fabric bag wrapping the flexible plastic film.

Preferably, the sensor module includes a sensing area.

Preferably, the flexible plastic packaging film includes: a first hollow area corresponding to the sensing area.

Preferably, the flexible fabric bag includes: a second hollow area corresponding to the first hollow area.

Preferably, the chip carrier includes: a third hollowed out area corresponding to the second hollowed out area.

Preferably, the chip carrier is detachably connected to the flexible sensor system, and the detachable connection is:

Snap, Velcro, Lace, Button, Snap, Pin, or Snap-in connections.

Preferably, the sensor module includes one or more of the following sensors:

Stride sensor, body temperature sensor, pulse sensor or ECG sensor.

Preferably, the chip carrier is a textile made of pure cotton, chemical fiber or blended materials.

Compared with prior art, the beneficial effect of the present invention is:

Since the flexible sensor system in the present invention adopts a flexible circuit board, the degree of fit between the flexible sensor system and the measured object can be made high, ensuring the realization of the functions of the smart wearable device. The sensor module, the microprocessor module and the wireless communication module are all arranged on the flexible sensor system, so that the flexible sensor system is small in size and light in weight, and the combination with the chip carrier is flexible and changeable. And through the detachable connection with the chip carrier, the flexible sensor system of the device can be separated from the chip carrier, so that the smart wearable device can be disassembled, the flexible sensor system can be taken out, and the chip carrier can be removed. Cleaning is beneficial to the reuse of smart wearable devices.

Description of drawings

In order to more clearly illustrate the technical solutions in the embodiments of the present application, the drawings that need to be used in the description of the embodiments will be briefly introduced below. Obviously, the drawings in the following description are only some embodiments of the present application. For those skilled in the art, other drawings can also be obtained based on these drawings without any creative effort.

Fig. 1 is the structural diagram of the flexible sensor system in the first embodiment;

Fig. 2 is a schematic structural diagram of a smart wearable device in Embodiment 1;

Fig. 3 is a schematic structural diagram of a flexible sensor system with a sensing area in Embodiment 2;

Fig. 4 is a schematic structural diagram of a smart wearable device with a sensing area in Embodiment 2;

Fig. 5 is a manufacturing method of the smart wearable device in the third embodiment.

detailed description

The following will clearly and completely describe the technical solutions in the embodiments of the application with reference to the drawings in the embodiments of the application. Apparently, the described embodiments are only some of the embodiments of the application, not all of them. Based on the embodiments in this application, all other embodiments obtained by persons of ordinary skill in the art without making creative efforts belong to the scope of protection of this application.

As mentioned in the background technology, due to the complex design of electronic products and the high degree of integration with clothing, the existing smart wearable devices have poor flexibility, are not easy to disassemble and clean, and are not conducive to the repeated use of smart wearable devices. use.

In view of this, the present invention proposes a smart wearable device, which includes: a flexible sensor system, the flexible sensor system includes a flexible circuit board, and a sensor module, a microprocessor module and a sensor module arranged on the flexible circuit board A wireless communication module; a chip carrier, the chip carrier can be detachably connected to the flexible sensor system.

Since the flexible sensor system in the present invention adopts a flexible circuit board, the degree of fit between the flexible sensor system and the measured object can be made high, ensuring the realization of the functions of the smart wearable device. The chip is integrated, and the sensor module, microprocessor module and wireless communication module are all arranged on the flexible sensor system, which can make the flexible sensor system small in size, light in weight, and flexible in combination with the chip carrier. And through the detachable connection with the chip carrier, the flexible sensor system of the device can be separated from the chip carrier, so that the smart wearable device can be disassembled, the flexible sensor system can be taken out, and the chip carrier can be removed. Cleaning is beneficial to the reuse of smart wearable devices.

The above is the central idea of the present invention. The technical solutions in the embodiments of the present invention will be clearly and completely described below in conjunction with the accompanying drawings in the embodiments of the present invention. Obviously, the described embodiments are only part of the embodiments of the present invention. rather than all examples. Based on the embodiments of the present invention, all other embodiments obtained by persons of ordinary skill in the art without making creative efforts belong to the protection scope of the present invention.

Embodiment one

This embodiment provides a smart wearable device, including: a flexible sensor system 100, as shown in Figure 1, the flexible sensor system includes a flexible circuit board 140, and a sensor module 110, micro The processor module 120 and the wireless communication module 130; and, the chip carrier 200, the chip carrier is detachably connected to the flexible sensor system.

Specifically, in this embodiment, the sensor module 110, the microprocessor module 120 and the wireless communication module 130 are electrically connected in sequence.

Wherein, the flexible circuit board may be a polyimide film, and a circuit is formed by printing metal lines with a preset pattern on the polyimide film. Specifically, the metal wire may be a copper wire.

The sensor module 110 is used to contact the measured object and generate a corresponding signal; and, the sensor module may be a temperature sensor, a stride frequency sensor, an electrocardiogram sensor, a pulse sensor, and the like. Wherein, in this embodiment, the body temperature sensor module may specifically be a thermal resistance type or a thermocouple type sensor.

The microprocessor module 120 includes an analog-to-digital (A/D) conversion module and a DSP module. Wherein, the A/D conversion module is electrically connected to the sensor module, and is used to convert the analog signal generated by the sensor module into a digital signal; the DSP module is electrically connected to the A/D conversion module, and is used to convert the A/D The converted digital signal is processed and saved.

The wireless communication module 130 includes a radio frequency circuit module and an antenna.

Wherein, the radio frequency circuit module is electrically connected to the microprocessor module, and is used for wirelessly transmitting the digital signal processed by the microprocessor 120, and the wireless transmission mode may adopt a Bluetooth low energy (Bluetoothlow energy) mode, or a near-field Communication (NFC) mode. Specifically, in this embodiment, the wireless communication module 130 is a Bluetooth low energy wireless communication module, and uses Bluetooth low energy for transmission.

The antenna is electrically connected to the radio frequency circuit module and used for transmitting corresponding signals.

In this embodiment, the sensor module, the microprocessor module and the wireless communication module are arranged on the flexible circuit board by welding.

Specifically, the sensor module, the microprocessor module, and the wireless communication module are assembled on the flexible circuit board with low-temperature solder paste by using surface mounting technology (SMT), so as to realize the integration of electronic product chips.

In this embodiment, the sensor module collects signals, the microprocessor module performs analog and digital signal processing, and the wireless communication module performs wireless communication, and the corresponding data is sent from the flexible sensor system to the corresponding receiving device. Specifically, in this embodiment In an example, the receiving device is a smart phone, and the corresponding data is received and displayed through the smart phone. Moreover, in this embodiment, the smart phone can also simultaneously store all measured data in the cloud through the 3G/4G network to perform cloud computing.

In this embodiment, a flexible plastic sealing film is further included on the outside of the flexible sensor system. The flexible plastic film wraps the flexible sensor system. Specifically, the flexible plastic sealing film can be polyethylene, polypropylene, polystyrene and other film materials, and the flexible sensor system can be wrapped in the flexible plastic sealing film through vacuum plastic sealing technology, so that the waterproof and waterproof of the flexible sensor system can be realized. oxidation function.

In this embodiment, the outer side of the flexible plastic sealing film further includes a flexible fabric bag. The flexible fabric bag wraps the flexible plastic film. Specifically, the flexible fabric bag is a flexible fabric, and by wrapping the flexible plastic film with the flexible fabric bag, the flexible sensor system can have skin-friendly properties, so that the flexible sensor system can directly contact the skin.

In other embodiments of the present application, the outside of the flexible sensor system may only include a flexible fabric bag. The flexible fabric bag wraps the flexible sensor system.

In this embodiment, the smart wearable device also includes a chip carrier 200, the chip carrier is pure cotton, chemical fiber or textiles of blended materials, as shown in Figure 2, the chip carrier is specifically elastic ribbon fabric.

Wherein, the chip carrier is detachably connected to the flexible sensor system, and in this embodiment, the flexible sensor system is detachably connected to the chip carrier in an embedded manner.

Specifically, a bag-shaped opening is provided on the chip carrier 200, and the flexible sensor system is put into the strip-shaped opening to realize the detachable connection between the chip carrier and the flexible sensor system.

Specifically, in this embodiment, when the sensor module is a pulse sensor or a stride frequency sensor, the chip carrier can be used as a wristband to measure the pulse. When the sensor module is an electrocardiogram sensor, the chip carrier can be used as a chest strap or a shoulder strap to measure chest electrocardiogram signals.

The flexible sensor system in this embodiment adopts a flexible circuit board, which can make the bonding between the flexible sensor system and the measured object high, and ensure the realization of the function of the smart wearable device. The chip is integrated, and the sensor module, microprocessor module and wireless communication module are all arranged on the flexible sensor system, which can make the flexible sensor system small in size, light in weight, and flexible in combination with the chip carrier. And through the detachable connection with the chip carrier, the flexible sensor system of the device can be separated from the chip carrier, so that the smart wearable device can be disassembled, the flexible sensor system can be taken out, and the chip carrier can be removed. Cleaning is beneficial to the reuse of smart wearable devices.

Embodiment two

Different from the previous embodiment, in this embodiment, the sensor module includes a sensing area. Specifically, as shown in FIG. 3 , in this embodiment, the sensor module of the flexible sensor system 100 may be a body temperature sensor, a pulse sensor and/or an electrocardiogram sensor, and the sensor has a sensing area 101 that needs to be in contact with the measured object. .

Correspondingly, the flexible plastic packaging film 300 includes a first hollow area 301 corresponding to the sensing area. And, the flexible fabric bag 400 includes: a second hollow area 401 corresponding to the first hollow area, so as to expose the sensing area 101 .

Correspondingly, as shown in FIG. 4 , there is a third hollow area 201 corresponding to the second hollow area 401 on the chip carrier.

In this embodiment, the chip carrier may be specific clothing, and by detachably connecting the flexible sensor system to the corresponding position of the clothing, the flexible sensor system is closely attached to the measured part of the human body, Thereby realizing the function of the flexible sensor system.

Moreover, in this embodiment, the sensor module may include a plurality of different types of sensors, so as to realize the integration of various functions.

In this embodiment, the chip carrier is detachably connected to the flexible sensor system, and the detachable connection method includes one or more of the following connection methods:

Snap connections, adhesive tape connections, tie connections, button connections, snap-fit connections, pin connections, and snap-in connections.

Specifically, one side of the flexible sensor system having a sensing area is the front side, and the other corresponding side is the back side.

Wherein, the buckle connection specifically includes setting a double-port falcon head on the back of the flexible sensor system, and setting buckles at both ends of the chip carrier, so as to connect the flexible sensor system to both ends of the chip carrier.

Specifically, the Velcro connection is that the two sides of the Velcro are respectively arranged on the back of the flexible sensor system and the corresponding positions of the chip carrier, so as to connect the flexible sensor system to the chip carrier.

The tether connection specifically includes setting tethers on the flexible sensor system and the chip carrier respectively, so as to connect the flexible sensor system and the chip carrier through the tether.

The button connection specifically includes setting buttons on the back of the flexible sensor system, and setting buttonholes on the chip carrier, so as to connect the flexible sensor system to the chip carrier.

The concealed buckle connection specifically includes setting a sub-button of the concealed buckle on the back of the flexible sensor system, and setting a female buckle of the concealed buckle on the chip carrier, thereby connecting the flexible sensor system to the chip carrier.

Specifically, the pin connection is to set safety pins on the back of the flexible sensor system, so as to connect the flexible sensor system to the chip carrier.

In this embodiment, the flexible sensor system adopts a flexible circuit board, which can make the flexible sensor system and the measured object have a high degree of fit, ensuring the realization of the functions of the smart wearable device. The chip is integrated, and the sensor module, microprocessor module and wireless communication module are all arranged on the flexible sensor system, which can make the flexible sensor system small in size, light in weight, and flexible in combination with the chip carrier. And through the detachable connection with the chip carrier, the flexible sensor system of the device can be separated from the chip carrier, so that the smart wearable device can be disassembled, the flexible sensor system can be taken out, and the chip carrier can be removed. Cleaning is beneficial to the reuse of smart wearable devices.

Moreover, in this embodiment, the connection mode between the flexible sensor system and the chip carrier is flexible and changeable, so that ordinary clothes can be used as the chip carrier only after simple modification, so that the flexible sensor system can be used with different It is not necessary to be limited to a chip carrier with a fixed structure, so it can adapt to different seasons and different groups of people, and has better flexibility.

Embodiment Three

Different from the previous embodiment, this embodiment provides a manufacturing method of a smart wearable device, which includes:

Step S1: providing a flexible circuit board;

Specifically, the flexible circuit board may be a polyimide film.

Step S2: printing a preset circuit on the flexible circuit board;

Specifically, the circuit is formed by printing metal lines with a preset pattern on the flexible circuit board.

In this embodiment, metal lines with a predetermined pattern are printed on the polyimide film to form a circuit. Specifically, the metal wire may be a copper wire.

Step S3: electrically connecting the sensor module, the microprocessor module and the wireless communication module to the flexible circuit board to form a flexible sensor system;

Specifically, the sensor module, the microprocessor module, and the wireless communication module are electrically connected to the flexible circuit board by welding to form a flexible sensor system.

In this embodiment, the sensor module, the microprocessor module, and the wireless communication module can be assembled on the flexible circuit board with low-temperature solder paste using surface mounting technology (SMT), so as to realize the integration of electronic product chips.

Step S4: providing a chip carrier, the chip carrier is detachably connected to the flexible sensor system;

Wherein, the sensor module, the microprocessor module and the wireless communication module are electrically connected sequentially through the preset circuit.

In addition, in this embodiment, after forming the flexible sensor system in step S3, it may also include:

Step S31: wrapping the flexible sensor system with a flexible plastic film.

Specifically, in this embodiment, step S31 includes:

The flexible sensor system is vacuum-molded by using a high-temperature-resistant and waterproof plastic film, and the temperature of the vacuum-molded seal is lower than 150°C.

Specifically, the flexible plastic sealing film can be polyethylene, polypropylene, polystyrene and other film materials, and the flexible sensor system can be wrapped in the flexible plastic sealing film through vacuum plastic sealing technology, so that the waterproof and waterproof of the flexible sensor system can be realized. oxidation function.

Step S32, wrapping the flexible plastic film with a flexible fabric bag.

Specifically, step S32 includes:

Using pure cotton, chemical fiber or blended materials to form the flexible fabric bag;

Wrapping the flexible plastic film in the flexible fabric bag;

Seal the flexible fabric bag.

The flexible fabric bag is a flexible fabric, and by wrapping the flexible plastic film with the flexible fabric bag, the flexible sensor system can have skin-friendly performance, which facilitates the direct contact of the flexible sensor system with the skin.

In this embodiment, the flexible sensor system formed by the method adopts a flexible circuit board, which can make the flexible sensor system and the measured object have a high degree of fit, ensuring the realization of the function of the smart wearable device. The chip is integrated, and the sensor module, microprocessor module and wireless communication module are all arranged on the flexible sensor system, which can make the flexible sensor system small in size, light in weight, and flexible in combination with the chip carrier. And through the detachable connection with the chip carrier, the flexible sensor system of the device can be separated from the chip carrier, so that the smart wearable device can be disassembled, the flexible sensor system can be taken out, and the chip carrier can be removed. Cleaning is beneficial to the reuse of smart wearable devices.

Embodiment four

Different from the previous embodiment, in this embodiment, the sensor module may include a sensing area.

In case the sensor module comprises a sensing area, step 31 comprises:

forming a first hollow area at a position of the flexible plastic film corresponding to the sensing area;

The flexible sensor system is wrapped with a flexible plastic film having the first hollow area.

Step S32 includes:

forming a second hollow area at the position of the flexible fabric bag corresponding to the first hollow area;

Wrapping the flexible plastic film with a flexible fabric bag having the second hollow area.

Step S4 includes:

forming a third hollowed out area at a position of the chip carrier corresponding to the second hollowed out area;

A chip carrier having the third hollowed-out area is provided.

In this embodiment, the flexible sensor system formed by the method adopts a flexible circuit board, which can make the flexible sensor system and the measured object have a high degree of fit, ensuring the realization of the function of the smart wearable device. The chip is integrated, and the sensor module, microprocessor module and wireless communication module are all arranged on the flexible sensor system, which can make the flexible sensor system small in size, light in weight, and flexible in combination with the chip carrier. And through the detachable connection with the chip carrier, the flexible sensor system of the device can be separated from the chip carrier, so that the smart wearable device can be disassembled, the flexible sensor system can be taken out, and the chip carrier can be removed. Cleaning is beneficial to the reuse of smart wearable devices.

Moreover, a hollow area is provided at the position corresponding to the sensing area of the sensor module, so that the sensing area can directly contact the skin, thereby improving the accuracy of the device.

It should be noted that each embodiment in this specification is described in a progressive manner, and each embodiment focuses on the differences from other embodiments. For the same and similar parts in each embodiment, refer to each other, that is, Can. As for the device-type embodiments, since they are basically similar to the method embodiments, the description is relatively simple, and for related parts, please refer to part of the description of the method embodiments.

Finally, it should also be noted that in this text, relational terms such as first and second etc. are only used to distinguish one entity or operation from another, and do not necessarily require or imply that these entities or operations, any such actual relationship or order exists. Furthermore, the term "comprises", "comprises" or any other variation thereof is intended to cover a non-exclusive inclusion such that a process, method, article, or apparatus comprising a set of elements includes not only those elements, but also includes elements not expressly listed. other elements of or also include elements inherent in such a process, method, article, or apparatus. Without further limitations, an element defined by the phrase "comprising a ..." does not exclude the presence of additional identical elements in the process, method, article or apparatus comprising said element.

For the convenience of description, when describing the above devices, functions are divided into various units and described separately. Of course, when implementing the present invention, the functions of each unit can be implemented in one or more pieces of software and/or hardware.

The above provides a detailed introduction to the antifuse memory provided by the application and its manufacturing method. In this paper, specific examples are used to illustrate the principle and implementation of the application. The descriptions of the above embodiments are only used to help understand this application. The method of application and its core idea; at the same time, for those of ordinary skill in the art, according to the idea of this application, there will be changes in the specific implementation and scope of application. In summary, the content of this specification should not be understood For the limitation of this application.

Claims (10)

1. A smart wearable device, characterized in that, comprising: A flexible sensor system, the flexible sensor system includes a flexible circuit board, and a sensor module, a microprocessor module and a wireless communication module arranged on the flexible circuit board, and the sensor module, the microprocessor module and the wireless communication module are in turn electrical connection; A chip carrier, the chip carrier is detachably connected to the flexible sensor system. 2. The smart wearable device according to claim 1, characterized in that, the smart wearable device further comprises: a flexible plastic film wrapping the flexible sensor system. 3. The smart wearable device according to claim 2, characterized in that, the smart wearable device further comprises: a flexible fabric bag wrapping the flexible plastic film. 4. The smart wearable device according to claim 1, wherein the sensor module comprises a sensing area. 5. The smart wearable device according to claim 4, wherein the flexible plastic film comprises: a first hollow area corresponding to the sensing area. 6. The smart wearable device according to claim 5, wherein the flexible fabric bag comprises: a second hollow area corresponding to the first hollow area. 7. The smart wearable device according to claim 1, wherein the chip carrier comprises: a third hollow area corresponding to the second hollow area. 8. The smart wearable device according to claim 1, wherein the chip carrier is detachably connected to the flexible sensor system, and the detachable connection is: Snap, Velcro, Lace, Button, Snap, Pin, or Snap-in connections. 9. The smart wearable device according to claim 1, wherein the sensor module includes one or more of the following sensors: Stride sensor, body temperature sensor, pulse sensor or ECG sensor. 10. The smart wearable device according to claim 1, characterized in that, the chip carrier is pure cotton, chemical fiber or textiles of blended materials.