CN106554746A - A kind of wavy metal pipe binder being modified based on sodium silicate and preparation method thereof - Google Patents
A kind of wavy metal pipe binder being modified based on sodium silicate and preparation method thereof Download PDFInfo
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- CN106554746A CN106554746A CN201610959826.XA CN201610959826A CN106554746A CN 106554746 A CN106554746 A CN 106554746A CN 201610959826 A CN201610959826 A CN 201610959826A CN 106554746 A CN106554746 A CN 106554746A
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- parts
- modified
- sodium silicate
- added
- metal pipe
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- 239000004115 Sodium Silicate Substances 0.000 title claims abstract description 39
- NTHWMYGWWRZVTN-UHFFFAOYSA-N sodium silicate Chemical compound [Na+].[Na+].[O-][Si]([O-])=O NTHWMYGWWRZVTN-UHFFFAOYSA-N 0.000 title claims abstract description 39
- 229910052911 sodium silicate Inorganic materials 0.000 title claims abstract description 39
- 229910052751 metal Inorganic materials 0.000 title claims abstract description 28
- 239000002184 metal Substances 0.000 title claims abstract description 28
- 239000011230 binding agent Substances 0.000 title claims abstract description 27
- 238000002360 preparation method Methods 0.000 title claims abstract description 16
- PNEYBMLMFCGWSK-UHFFFAOYSA-N Alumina Chemical compound [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 claims abstract description 38
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 claims abstract description 31
- KXGFMDJXCMQABM-UHFFFAOYSA-N 2-methoxy-6-methylphenol Chemical compound [CH]OC1=CC=CC([CH])=C1O KXGFMDJXCMQABM-UHFFFAOYSA-N 0.000 claims abstract description 22
- 229920001568 phenolic resin Polymers 0.000 claims abstract description 21
- 239000005011 phenolic resin Substances 0.000 claims abstract description 21
- 239000003822 epoxy resin Substances 0.000 claims abstract description 18
- 229920000647 polyepoxide Polymers 0.000 claims abstract description 18
- 239000004372 Polyvinyl alcohol Substances 0.000 claims abstract description 15
- 229910000358 iron sulfate Inorganic materials 0.000 claims abstract description 15
- BAUYGSIQEAFULO-UHFFFAOYSA-L iron(2+) sulfate (anhydrous) Chemical compound [Fe+2].[O-]S([O-])(=O)=O BAUYGSIQEAFULO-UHFFFAOYSA-L 0.000 claims abstract description 15
- 229920002451 polyvinyl alcohol Polymers 0.000 claims abstract description 15
- 239000000377 silicon dioxide Substances 0.000 claims abstract description 15
- 229910021538 borax Inorganic materials 0.000 claims abstract description 14
- 239000004328 sodium tetraborate Substances 0.000 claims abstract description 14
- 235000010339 sodium tetraborate Nutrition 0.000 claims abstract description 14
- 239000000395 magnesium oxide Substances 0.000 claims abstract description 13
- CPLXHLVBOLITMK-UHFFFAOYSA-N magnesium oxide Inorganic materials [Mg]=O CPLXHLVBOLITMK-UHFFFAOYSA-N 0.000 claims abstract description 13
- AXZKOIWUVFPNLO-UHFFFAOYSA-N magnesium;oxygen(2-) Chemical compound [O-2].[Mg+2] AXZKOIWUVFPNLO-UHFFFAOYSA-N 0.000 claims abstract description 13
- 239000004814 polyurethane Substances 0.000 claims abstract description 13
- 235000012239 silicon dioxide Nutrition 0.000 claims abstract description 13
- 229920002635 polyurethane Polymers 0.000 claims abstract description 6
- 238000002156 mixing Methods 0.000 claims description 40
- 239000003795 chemical substances by application Substances 0.000 claims description 36
- 239000000853 adhesive Substances 0.000 claims description 32
- 230000001070 adhesive effect Effects 0.000 claims description 32
- WYURNTSHIVDZCO-UHFFFAOYSA-N Tetrahydrofuran Chemical compound C1CCOC1 WYURNTSHIVDZCO-UHFFFAOYSA-N 0.000 claims description 26
- QAOWNCQODCNURD-UHFFFAOYSA-N Sulfuric acid Chemical compound OS(O)(=O)=O QAOWNCQODCNURD-UHFFFAOYSA-N 0.000 claims description 25
- HEMHJVSKTPXQMS-UHFFFAOYSA-M Sodium hydroxide Chemical compound [OH-].[Na+] HEMHJVSKTPXQMS-UHFFFAOYSA-M 0.000 claims description 21
- 239000011159 matrix material Substances 0.000 claims description 21
- 239000000047 product Substances 0.000 claims description 21
- 238000003756 stirring Methods 0.000 claims description 20
- YLQBMQCUIZJEEH-UHFFFAOYSA-N tetrahydrofuran Natural products C=1C=COC=1 YLQBMQCUIZJEEH-UHFFFAOYSA-N 0.000 claims description 15
- 239000012467 final product Substances 0.000 claims description 14
- 239000000203 mixture Substances 0.000 claims description 14
- 238000006243 chemical reaction Methods 0.000 claims description 10
- 238000001816 cooling Methods 0.000 claims description 7
- 238000010438 heat treatment Methods 0.000 claims description 7
- 229910000836 magnesium aluminium oxide Inorganic materials 0.000 claims description 7
- 229920005749 polyurethane resin Polymers 0.000 claims description 7
- DGAQECJNVWCQMB-PUAWFVPOSA-M Ilexoside XXIX Chemical compound C[C@@H]1CC[C@@]2(CC[C@@]3(C(=CC[C@H]4[C@]3(CC[C@@H]5[C@@]4(CC[C@@H](C5(C)C)OS(=O)(=O)[O-])C)C)[C@@H]2[C@]1(C)O)C)C(=O)O[C@H]6[C@@H]([C@H]([C@@H]([C@H](O6)CO)O)O)O.[Na+] DGAQECJNVWCQMB-PUAWFVPOSA-M 0.000 claims description 3
- 239000011734 sodium Substances 0.000 claims description 3
- 229910052708 sodium Inorganic materials 0.000 claims description 3
- 238000007599 discharging Methods 0.000 claims description 2
- RMAQACBXLXPBSY-UHFFFAOYSA-N silicic acid Chemical compound O[Si](O)(O)O RMAQACBXLXPBSY-UHFFFAOYSA-N 0.000 claims description 2
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 claims 1
- NINIDFKCEFEMDL-UHFFFAOYSA-N Sulfur Chemical compound [S] NINIDFKCEFEMDL-UHFFFAOYSA-N 0.000 claims 1
- 239000002253 acid Substances 0.000 claims 1
- 229910052710 silicon Inorganic materials 0.000 claims 1
- 239000010703 silicon Substances 0.000 claims 1
- 239000011593 sulfur Substances 0.000 claims 1
- 229910052717 sulfur Inorganic materials 0.000 claims 1
- 239000001117 sulphuric acid Substances 0.000 claims 1
- 235000011149 sulphuric acid Nutrition 0.000 claims 1
- 238000005516 engineering process Methods 0.000 abstract description 3
- 238000000034 method Methods 0.000 description 5
- 239000011812 mixed powder Substances 0.000 description 4
- JOYRKODLDBILNP-UHFFFAOYSA-N Ethyl urethane Chemical compound CCOC(N)=O JOYRKODLDBILNP-UHFFFAOYSA-N 0.000 description 3
- 239000000463 material Substances 0.000 description 3
- FYYHWMGAXLPEAU-UHFFFAOYSA-N Magnesium Chemical compound [Mg] FYYHWMGAXLPEAU-UHFFFAOYSA-N 0.000 description 2
- 238000004026 adhesive bonding Methods 0.000 description 2
- 230000007547 defect Effects 0.000 description 2
- 239000003292 glue Substances 0.000 description 2
- 229910052749 magnesium Inorganic materials 0.000 description 2
- 239000011777 magnesium Substances 0.000 description 2
- 230000003647 oxidation Effects 0.000 description 2
- 238000007254 oxidation reaction Methods 0.000 description 2
- 239000002994 raw material Substances 0.000 description 2
- 229920005989 resin Polymers 0.000 description 2
- 239000011347 resin Substances 0.000 description 2
- -1 timber Substances 0.000 description 2
- 239000004593 Epoxy Substances 0.000 description 1
- AZFKQCNGMSSWDS-UHFFFAOYSA-N MCPA-thioethyl Chemical compound CCSC(=O)COC1=CC=C(Cl)C=C1C AZFKQCNGMSSWDS-UHFFFAOYSA-N 0.000 description 1
- ISWSIDIOOBJBQZ-UHFFFAOYSA-N Phenol Chemical compound OC1=CC=CC=C1 ISWSIDIOOBJBQZ-UHFFFAOYSA-N 0.000 description 1
- 239000004642 Polyimide Substances 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- ZOXJGFHDIHLPTG-OUBTZVSYSA-N boron-12 Chemical group [12B] ZOXJGFHDIHLPTG-OUBTZVSYSA-N 0.000 description 1
- 239000000919 ceramic Substances 0.000 description 1
- XLJMAIOERFSOGZ-UHFFFAOYSA-M cyanate Chemical compound [O-]C#N XLJMAIOERFSOGZ-UHFFFAOYSA-M 0.000 description 1
- 238000010292 electrical insulation Methods 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 1
- 239000010931 gold Substances 0.000 description 1
- 229910052737 gold Inorganic materials 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 150000002989 phenols Chemical class 0.000 description 1
- 229920003023 plastic Polymers 0.000 description 1
- 239000004033 plastic Substances 0.000 description 1
- 238000006068 polycondensation reaction Methods 0.000 description 1
- 229920001721 polyimide Polymers 0.000 description 1
- 239000004576 sand Substances 0.000 description 1
- 238000007789 sealing Methods 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
- 238000003786 synthesis reaction Methods 0.000 description 1
- 229920001187 thermosetting polymer Polymers 0.000 description 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J175/00—Adhesives based on polyureas or polyurethanes; Adhesives based on derivatives of such polymers
- C09J175/04—Polyurethanes
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
- C09J11/02—Non-macromolecular additives
- C09J11/04—Non-macromolecular additives inorganic
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
- C09J11/08—Macromolecular additives
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J163/00—Adhesives based on epoxy resins; Adhesives based on derivatives of epoxy resins
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L2201/00—Properties
- C08L2201/08—Stabilised against heat, light or radiation or oxydation
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L2203/00—Applications
- C08L2203/18—Applications used for pipes
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L2205/00—Polymer mixtures characterised by other features
- C08L2205/03—Polymer mixtures characterised by other features containing three or more polymers in a blend
- C08L2205/035—Polymer mixtures characterised by other features containing three or more polymers in a blend containing four or more polymers in a blend
Landscapes
- Chemical & Material Sciences (AREA)
- Organic Chemistry (AREA)
- Inorganic Chemistry (AREA)
- Adhesives Or Adhesive Processes (AREA)
Abstract
The invention discloses a kind of wavy metal pipe binder being modified based on sodium silicate and preparation method thereof, is made up of following components proportioning by weight：17～38 parts of polyurethane, 12～28 parts of polyvinyl alcohol, 18～31 parts of epoxy resin, 8～19 parts of phenolic resin, 8～19 parts of sodium silicate, 6～17 parts of silicon dioxide, 6～19 parts of magnesium oxide, 7～21 parts of aluminium oxide, 3～9 parts of iron sulfate, 7～16 parts of Borax.(1) the wavy metal pipe binder being modified based on sodium silicate of the present invention has good resistance to elevated temperatures, and can keep preferable mechanical property and durability；(2) the modified wavy metal pipe binder applied range of the sodium silicate, can meet the needs of the high-technology fields such as electronics, automobile and energy development.
Description
Technical field
The invention belongs to technical field of material chemistry, is related to a kind of adhesive, more particularly to a kind of gold being modified based on sodium silicate
Category ripple pipe binder and preparation method thereof.
Background technology
In recent years, Organic adhesive has and is increasingly widely applied, and adhesive bonding technique also has evolved into ripe, and becomes glue
Connect, weld, being mechanically connected one of contemporary three big interconnection techniques.High temperature resistant Organic adhesive is prepare some spacecrafts zero
One of part, necessary raw material of sealing ring and wearing piece of automobile, tank and panzer.With regard to the definition of high-temperature Resistance Adhesives,
So far there is no unified view both at home and abroad.
The principal item of high temperature resistant Organic adhesive has epoxy resin, phenolic resin, polyurethane, polyimides, organosilicon
With cyanate etc..Epoxy resin is a kind of thermosetting resin containing 2 or more than 2 epoxy radicals.Epoxy resin be it is a kind of very
Good adhesive, can be used to bonded metal, ceramics, glass, timber, concrete and most of plastics, be widely used to aircraft,
The industries such as satellite, rocket, ship, automobile, electronic machine, light industry and building.
The general resin by phenolic compound with aldehyde compound polycondensation is referred to as phenolic resin, wherein with phenol and first
Phenolic resin obtained from al is poly- is mostly important.Phenolic resin is easy to get due to its raw material, cheap, synthesis technique and production
Equipment is simple, and with good heat-resisting, resistance to chemical attack and electrical insulation capability, thus it is widely used in many of national economy
Industry.But, as pure phenolic resin has the shortcomings of fragility is big, hardness is high, toughness is low and easily decomposes at high temperature, affect material
The performance of material；Additionally, the technique for sticking of pure phenolic resin adhesive is more complicated.Need after gluing baking, then it is heated, plus
Could bond after pressure, be restricted the application of adhesive.With high-tech areas such as Aeronautics and Astronautics, weapons, automobile and electronics
Continuous development, modified phenolic resin adhesive receives the extensive concern of people.
It is for the adhesive used in metal hose need to have stronger shear strength, acidproof, anti-hydrolytic performance, resistance in addition
High-temperature behavior is also increasingly taken seriously.Although high-temperature Resistance Adhesives are constantly reported, it is limited to itself intrinsic defect, its
Performance is difficult breakthrough fundamentally, which greatly limits its application in more areas.
The content of the invention
Present invention solves the technical problem that：In order to overcome the defect of prior art, a kind of resistance to elevated temperatures of acquisition is good, and power
The adhesive of better performances is learned, the invention provides a kind of wavy metal pipe binder being modified based on sodium silicate and its preparation side
Method.
Technical scheme：A kind of wavy metal pipe binder being modified based on sodium silicate, is matched somebody with somebody by weight by following components
Than making：17～38 parts of polyurethane, 12～28 parts of polyvinyl alcohol, 18～31 parts of epoxy resin, 8～19 parts of phenolic resin, silicic acid
8～19 parts of sodium, 6～17 parts of silicon dioxide, 6～19 parts of magnesium oxide, 7～21 parts of aluminium oxide, 3～9 parts of iron sulfate, Borax 7～16
Part.
Preferably, it is made up of following components proportioning by weight：32 parts of polyurethane, 23 parts of polyvinyl alcohol, epoxy resin
25 parts, 14 parts of phenolic resin, 13 parts of sodium silicate, 4 parts of silica 1,15 parts of magnesium oxide, 17 parts of aluminium oxide, 6 parts of iron sulfate, boron
12 parts of sand.
A kind of preparation method of the wavy metal pipe binder being modified based on sodium silicate, is comprised the steps of：
(1) prepared by adhesive matrix：Polyurethane and epoxy resin are mixed, tetrahydrofuran is added thereto to, mixture is total
Quality:Tetrahydrofuran volume is 1:3～5, after stirring and evenly mixing, 98～115 DEG C are heated to, are heated while stirring, obtain final product adhesive
Matrix；
It is prepared by (2) first modifying agent：Grind to form after sodium silicate, silicon dioxide, magnesium oxide, aluminium oxide and iron sulfate are mixed
Powder, is added thereto to the sodium hydroxide that mass fraction is 12～21%, stirs to being completely dissolved, obtain final product the first modifying agent；
It is prepared by (3) second modifying agent：By polyvinyl alcohol and phenolic resin mixing post-heating, temperature is 108～126 DEG C, complete
The sulfuric acid solution that mass fraction is 35～48% is added thereto to after full gelatinizing, is stirred to mixing completely, wherein the total matter of mixture
Amount:Sulfuric acid solution volume is 1:1～3；
(4) it is modified for the first time：The first modifying agent is added in adhesive matrix, it is anti-under the conditions of temperature is for 106～118 DEG C
Should, mixing speed is 200～300r/min, to after mixing completely, is cooled to 75～98 DEG C, is incubated 25～50 minutes；
(5) it is modified for second：The second modifying agent is added in Jing modified for the first time product, is 86～105 in temperature
React under the conditions of DEG C, mixing speed is 150～250r/min, to react and 78 DEG C are cooled to after terminating, be incubated 25～50 minutes；
(6) discharge：Add Borax in second modified product of Jing, temperature control is 85～105 DEG C, reaction 15～
30 minutes, you can be obtained, cooling discharge, collect product.
Preferably, prepared by step (1) adhesive matrix：Polyurethane and epoxy resin are mixed, tetrahydrochysene furan is added thereto to
Mutter, mixture gross mass:Tetrahydrofuran volume is 1:5, after stirring and evenly mixing, 107 DEG C are heated to, are heated while stirring, obtain final product glue
Glutinous agent matrix.
Preferably, prepared by (2) first modifying agent of step：By sodium silicate, silicon dioxide, magnesium oxide, aluminium oxide and iron sulfate
Pulverize after mixing, be added thereto to the sodium hydroxide that mass fraction is 17%, stir to being completely dissolved, obtain final product first and be modified
Agent.
Preferably, prepared by (3) second modifying agent of step：By polyvinyl alcohol and phenolic resin mixing post-heating, temperature is 119
DEG C, the sulfuric acid solution that mass fraction is 42% is added thereto to after complete gelatinizing, is stirred to mixing completely, wherein the total matter of mixture
Amount:Sulfuric acid solution volume is 1:3.
Preferably, step (4) is modified for the first time：The first modifying agent is added in adhesive matrix, is 113 DEG C of bars in temperature
React under part, mixing speed is 250r/min, to after mixing completely, be cooled to 92 DEG C, be incubated 40 minutes.
Preferably, step (5) is modified for second：The second modifying agent is added in Jing modified for the first time product, in temperature
Spend to react under the conditions of 96 DEG C, mixing speed is 220r/min, reaction is cooled to 78 DEG C after terminating, be incubated 38 minutes.
Preferably, step (6) discharging：Borax is added in second modified product of Jing, temperature control is 96 DEG C, instead
Answer 23 minutes, you can be obtained, cooling discharge, collect product.
Beneficial effect：(1) the wavy metal pipe binder being modified based on sodium silicate of the present invention has good resistance to height
Warm nature energy, and preferable mechanical property and durability can be kept；(2) the modified wavy metal pipe binder of the sodium silicate should
It is wide with scope, the needs of the high-technology fields such as electronics, automobile and energy development can be met.
Specific embodiment
Embodiment 1
A kind of wavy metal pipe binder being modified based on sodium silicate, is made up of following components proportioning by weight：It is poly-
17 parts of urethane, 12 parts of polyvinyl alcohol, 18 parts of epoxy resin, 8 parts of phenolic resin, 8 parts of sodium silicate, 6 parts of silicon dioxide, magnesium oxide 6
Part, 7 parts of aluminium oxide, 3 parts of iron sulfate, 7 parts of Borax.
A kind of preparation method of the wavy metal pipe binder being modified based on sodium silicate, is comprised the steps of：
(1) prepared by adhesive matrix：Polyurethane and epoxy resin are mixed, tetrahydrofuran is added thereto to, mixture is total
Quality:Tetrahydrofuran volume is 1:3, after stirring and evenly mixing, 98 DEG C are heated to, are heated while stirring, obtain final product adhesive matrix；
It is prepared by (2) first modifying agent：Grind to form after sodium silicate, silicon dioxide, magnesium oxide, aluminium oxide and iron sulfate are mixed
Powder, is added thereto to the sodium hydroxide that mass fraction is 12%, stirs to being completely dissolved, obtain final product the first modifying agent；
It is prepared by (3) second modifying agent：By polyvinyl alcohol and phenolic resin mixing post-heating, temperature is 108 DEG C, complete gelatinizing
The sulfuric acid solution that mass fraction is 35% is added thereto to afterwards, is stirred to mixing completely, wherein mixture gross mass:Sulfuric acid solution
Volume is 1:1；
(4) it is modified for the first time：The first modifying agent is added in adhesive matrix, is reacted under the conditions of temperature is for 106 DEG C, is stirred
It is 200r/min to mix speed, to after mixing completely, is cooled to 75 DEG C, is incubated 25 minutes；
(5) it is modified for second：The second modifying agent is added in Jing modified for the first time product, is 86 DEG C of conditions in temperature
Lower reaction, mixing speed is 150r/min, and reaction is cooled to 78 DEG C after terminating, and is incubated 25 minutes；
(6) discharge：Borax is added in second modified product of Jing, temperature control is 85 DEG C, reaction 15 minutes, i.e.,
Can be obtained, cooling discharge, collect product.
Embodiment 2
A kind of wavy metal pipe binder being modified based on sodium silicate, is made up of following components proportioning by weight：It is poly-
32 parts of urethane, 23 parts of polyvinyl alcohol, 25 parts of epoxy resin, 14 parts of phenolic resin, 13 parts of sodium silicate, 4 parts of silica 1, oxidation
15 parts of magnesium, 17 parts of aluminium oxide, 6 parts of iron sulfate, 12 parts of Borax.
A kind of preparation method of the wavy metal pipe binder being modified based on sodium silicate, is comprised the steps of：
(1) prepared by adhesive matrix：Polyurethane and epoxy resin are mixed, tetrahydrofuran is added thereto to, mixture is total
Quality:Tetrahydrofuran volume is 1:5, after stirring and evenly mixing, 107 DEG C are heated to, are heated while stirring, obtain final product adhesive matrix；
It is prepared by (2) first modifying agent：Grind to form after sodium silicate, silicon dioxide, magnesium oxide, aluminium oxide and iron sulfate are mixed
Powder, is added thereto to the sodium hydroxide that mass fraction is 17%, stirs to being completely dissolved, obtain final product the first modifying agent；
It is prepared by (3) second modifying agent：By polyvinyl alcohol and phenolic resin mixing post-heating, temperature is 119 DEG C, complete gelatinizing
The sulfuric acid solution that mass fraction is 42% is added thereto to afterwards, is stirred to mixing completely, wherein mixture gross mass:Sulfuric acid solution
Volume is 1:3；
(4) it is modified for the first time：The first modifying agent is added in adhesive matrix, is reacted under the conditions of temperature is for 113 DEG C, is stirred
It is 250r/min to mix speed, to after mixing completely, is cooled to 92 DEG C, is incubated 40 minutes；
(5) it is modified for second：The second modifying agent is added in Jing modified for the first time product, is 96 DEG C of conditions in temperature
Lower reaction, mixing speed is 220r/min, and reaction is cooled to 78 DEG C after terminating, and is incubated 38 minutes；
(6) discharge：Borax is added in second modified product of Jing, temperature control is 96 DEG C, reaction 23 minutes, i.e.,
Can be obtained, cooling discharge, collect product.
Embodiment 3
A kind of wavy metal pipe binder being modified based on sodium silicate, is made up of following components proportioning by weight：It is poly-
38 parts of urethane, 28 parts of polyvinyl alcohol, 31 parts of epoxy resin, 19 parts of phenolic resin, 19 parts of sodium silicate, 7 parts of silica 1, oxidation
19 parts of magnesium, 21 parts of aluminium oxide, 9 parts of iron sulfate, 16 parts of Borax.
A kind of preparation method of the wavy metal pipe binder being modified based on sodium silicate, is comprised the steps of：
(1) prepared by adhesive matrix：Polyurethane and epoxy resin are mixed, tetrahydrofuran is added thereto to, mixture is total
Quality:Tetrahydrofuran volume is 1:5, after stirring and evenly mixing, 115 DEG C are heated to, are heated while stirring, obtain final product adhesive matrix；
It is prepared by (2) first modifying agent：Grind to form after sodium silicate, silicon dioxide, magnesium oxide, aluminium oxide and iron sulfate are mixed
Powder, is added thereto to the sodium hydroxide that mass fraction is 21%, stirs to being completely dissolved, obtain final product the first modifying agent；
It is prepared by (3) second modifying agent：By polyvinyl alcohol and phenolic resin mixing post-heating, temperature is 126 DEG C, complete gelatinizing
The sulfuric acid solution that mass fraction is 48% is added thereto to afterwards, is stirred to mixing completely, wherein mixture gross mass:Sulfuric acid solution
Volume is 1:3；
(4) it is modified for the first time：The first modifying agent is added in adhesive matrix, is reacted under the conditions of temperature is for 118 DEG C, is stirred
It is 300r/min to mix speed, to after mixing completely, is cooled to 98 DEG C, is incubated 50 minutes；
(5) it is modified for second：The second modifying agent is added in Jing modified for the first time product, is 105 DEG C of bars in temperature
React under part, mixing speed is 250r/min, reaction is cooled to 78 DEG C after terminating, be incubated 50 minutes；
(6) discharge：Borax is added in second modified product of Jing, temperature control is 105 DEG C, is reacted 30 minutes,
Can be prepared by, cooling discharge, collect product.
Embodiment 1～3 is prepared based on sodium silicate be modified wavy metal pipe binder detect, as a result such as
Shown in following table：
Claims (9)
1. it is a kind of based on sodium silicate be modified wavy metal pipe binder, it is characterised in that matched somebody with somebody by following components by weight
Than making：17～38 parts of polyurethane, 12～28 parts of polyvinyl alcohol, 18～31 parts of epoxy resin, 8～19 parts of phenolic resin, silicic acid
8～19 parts of sodium, 6～17 parts of silicon dioxide, 6～19 parts of magnesium oxide, 7～21 parts of aluminium oxide, 3～9 parts of iron sulfate, Borax 7～16
Part.
2. it is according to claim 1 it is a kind of based on sodium silicate be modified wavy metal pipe binder, it is characterised in that by with
Lower component proportioning by weight is made：32 parts of polyurethane, 23 parts of polyvinyl alcohol, 25 parts of epoxy resin, 14 parts of phenolic resin, silicon
13 parts of sour sodium, 4 parts of silica 1,15 parts of magnesium oxide, 17 parts of aluminium oxide, 6 parts of iron sulfate, 12 parts of Borax.
3. the preparation method of a kind of wavy metal pipe binder being modified based on sodium silicate described in claim 1, its feature exists
In comprising the steps of：
(1) prepared by adhesive matrix：Polyurethane and epoxy resin are mixed, tetrahydrofuran, mixture gross mass is added thereto to:
Tetrahydrofuran volume is 1:3～5, after stirring and evenly mixing, 98～115 DEG C are heated to, are heated while stirring, obtain final product adhesive matrix；
It is prepared by (2) first modifying agent：Pulverize after sodium silicate, silicon dioxide, magnesium oxide, aluminium oxide and iron sulfate are mixed,
The sodium hydroxide that mass fraction is 12～21% is added thereto to, is stirred to being completely dissolved, obtain final product the first modifying agent；
It is prepared by (3) second modifying agent：It is 108～126 DEG C by polyvinyl alcohol and phenolic resin mixing post-heating, temperature, pastes completely
The sulfuric acid solution that mass fraction is 35～48% is added thereto to after change, is stirred to mixing completely, wherein mixture gross mass:Sulfur
Acid solution volume is 1:1～3；
(4) it is modified for the first time：The first modifying agent is added in adhesive matrix, is reacted under the conditions of temperature is for 106～118 DEG C,
Mixing speed is 200～300r/min, to after mixing completely, is cooled to 75～98 DEG C, is incubated 25～50 minutes；
(5) it is modified for second：The second modifying agent is added in Jing modified for the first time product, is 86～105 DEG C of bars in temperature
React under part, mixing speed is 150～250r/min, to react and 78 DEG C are cooled to after terminating, be incubated 25～50 minutes；
(6) discharge：Borax is added in second modified product of Jing, temperature control is 85～105 DEG C, reacts 15～30 points
Clock, you can be obtained, cooling discharge, collects product.
4. the preparation method of a kind of wavy metal pipe binder being modified based on sodium silicate according to claim 3, which is special
Levy and be, be prepared by step (1) adhesive matrix：Polyurethane and epoxy resin are mixed, tetrahydrofuran, mixture is added thereto to
Gross mass:Tetrahydrofuran volume is 1:5, after stirring and evenly mixing, 107 DEG C are heated to, are heated while stirring, obtain final product adhesive matrix.
5. the preparation method of a kind of wavy metal pipe binder being modified based on sodium silicate according to claim 3, which is special
Levy and be, be prepared by (2) first modifying agent of step：Grind after sodium silicate, silicon dioxide, magnesium oxide, aluminium oxide and iron sulfate are mixed
Grinds, are added thereto to the sodium hydroxide that mass fraction is 17%, stir to being completely dissolved, obtain final product the first modifying agent.
6. the preparation method of a kind of wavy metal pipe binder being modified based on sodium silicate according to claim 3, which is special
Levy and be, be prepared by (3) second modifying agent of step：By polyvinyl alcohol and phenolic resin mixing post-heating, temperature is 119 DEG C, completely
The sulfuric acid solution that mass fraction is 42% is added thereto to after gelatinizing, is stirred to mixing completely, wherein mixture gross mass:Sulphuric acid
Liquor capacity is 1:3.
7. the preparation method of a kind of wavy metal pipe binder being modified based on sodium silicate according to claim 3, which is special
Levy and be, step (4) is modified for the first time：The first modifying agent is added in adhesive matrix, it is anti-under the conditions of temperature is for 113 DEG C
Should, mixing speed is 250r/min, to after mixing completely, is cooled to 92 DEG C, is incubated 40 minutes.
8. the preparation method of a kind of wavy metal pipe binder being modified based on sodium silicate according to claim 3, which is special
Levy and be, step (5) is modified for second：The second modifying agent is added in Jing modified for the first time product, is 96 DEG C in temperature
Under the conditions of react, mixing speed is 220r/min, reaction terminate after be cooled to 78 DEG C, be incubated 38 minutes.
9. the preparation method of a kind of wavy metal pipe binder being modified based on sodium silicate according to claim 3, which is special
Levy and be, step (6) discharging：Borax is added in second modified product of Jing, temperature control is 96 DEG C, reacts 23 points
Clock, you can be obtained, cooling discharge, collects product.
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| CN107142045A (en) * | 2017-06-27 | 2017-09-08 | 安徽省鸿鑫生物科技有限公司 | A kind of heat-resisting glue and preparation method thereof |
| CN108003829A (en) * | 2017-12-13 | 2018-05-08 | 定远县嘉恒木业有限公司 | A kind of Wood plastic boards adhesive |
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| CN104945582A (en) * | 2014-03-27 | 2015-09-30 | 江苏奎泽机械工业有限公司 | Preparation method of composite modified environment-friendly metal corrugated pipe adhesive |
| CN105199656A (en) * | 2015-10-30 | 2015-12-30 | 桂林市和鑫防水装饰材料有限公司 | Double-component polyurethane sealant for construction |
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| CN1594481A (en) * | 2004-06-24 | 2005-03-16 | 淄博海特曼化工有限公司 | Solvent-free high-strength polyurethane cementing sealing glue and method for making same |
| CN104945582A (en) * | 2014-03-27 | 2015-09-30 | 江苏奎泽机械工业有限公司 | Preparation method of composite modified environment-friendly metal corrugated pipe adhesive |
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| CN107142045A (en) * | 2017-06-27 | 2017-09-08 | 安徽省鸿鑫生物科技有限公司 | A kind of heat-resisting glue and preparation method thereof |
| CN108003829A (en) * | 2017-12-13 | 2018-05-08 | 定远县嘉恒木业有限公司 | A kind of Wood plastic boards adhesive |
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