CN106548951A - A kind of method for packing of fingerprint recognition module chip - Google Patents
A kind of method for packing of fingerprint recognition module chip Download PDFInfo
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- CN106548951A CN106548951A CN201611054347.XA CN201611054347A CN106548951A CN 106548951 A CN106548951 A CN 106548951A CN 201611054347 A CN201611054347 A CN 201611054347A CN 106548951 A CN106548951 A CN 106548951A
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- 238000000034 method Methods 0.000 title claims abstract description 36
- 238000012856 packing Methods 0.000 title 1
- 239000003292 glue Substances 0.000 claims abstract description 143
- 238000004806 packaging method and process Methods 0.000 claims abstract description 30
- 229910000679 solder Inorganic materials 0.000 claims abstract description 13
- 238000003825 pressing Methods 0.000 claims description 6
- 238000007872 degassing Methods 0.000 claims description 5
- 238000000465 moulding Methods 0.000 claims 1
- 239000012466 permeate Substances 0.000 abstract description 3
- 230000035515 penetration Effects 0.000 description 6
- 230000035699 permeability Effects 0.000 description 6
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 description 3
- 238000005336 cracking Methods 0.000 description 3
- 238000010586 diagram Methods 0.000 description 3
- 230000000694 effects Effects 0.000 description 3
- 238000010438 heat treatment Methods 0.000 description 3
- 238000003466 welding Methods 0.000 description 3
- 230000009286 beneficial effect Effects 0.000 description 2
- 238000011161 development Methods 0.000 description 2
- 238000012545 processing Methods 0.000 description 2
- 238000013459 approach Methods 0.000 description 1
- 238000011982 device technology Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 238000012536 packaging technology Methods 0.000 description 1
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the groups H01L21/18 - H01L21/326 or H10D48/04 - H10D48/07 e.g. sealing of a cap to a base of a container
- H01L21/56—Encapsulations, e.g. encapsulation layers, coatings
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- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06V—IMAGE OR VIDEO RECOGNITION OR UNDERSTANDING
- G06V40/00—Recognition of biometric, human-related or animal-related patterns in image or video data
- G06V40/10—Human or animal bodies, e.g. vehicle occupants or pedestrians; Body parts, e.g. hands
- G06V40/12—Fingerprints or palmprints
- G06V40/13—Sensors therefor
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the groups H01L21/18 - H01L21/326 or H10D48/04 - H10D48/07 e.g. sealing of a cap to a base of a container
- H01L21/56—Encapsulations, e.g. encapsulation layers, coatings
- H01L21/563—Encapsulation of active face of flip-chip device, e.g. underfilling or underencapsulation of flip-chip, encapsulation preform on chip or mounting substrate
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/10—Bump connectors; Manufacturing methods related thereto
- H01L2224/15—Structure, shape, material or disposition of the bump connectors after the connecting process
- H01L2224/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
- H01L2224/161—Disposition
- H01L2224/16151—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/16221—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/16225—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
- H01L2224/732—Location after the connecting process
- H01L2224/73201—Location after the connecting process on the same surface
- H01L2224/73203—Bump and layer connectors
- H01L2224/73204—Bump and layer connectors the bump connector being embedded into the layer connector
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/91—Methods for connecting semiconductor or solid state bodies including different methods provided for in two or more of groups H01L2224/80 - H01L2224/90
- H01L2224/92—Specific sequence of method steps
- H01L2224/921—Connecting a surface with connectors of different types
- H01L2224/9212—Sequential connecting processes
- H01L2224/92122—Sequential connecting processes the first connecting process involving a bump connector
- H01L2224/92125—Sequential connecting processes the first connecting process involving a bump connector the second connecting process involving a layer connector
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- Engineering & Computer Science (AREA)
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- General Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Human Computer Interaction (AREA)
- Multimedia (AREA)
- Theoretical Computer Science (AREA)
- Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
Abstract
本发明实施例提供了一种指纹识别模组芯片的封装方法，包括提供指纹识别模组芯片以及底板，芯片与底板之间形成填充腔，填充腔内设置有连接芯片与底板的连接焊点；于填充腔的边缘填充胶水；对胶水施加压力，使胶水向填充腔的中心处渗透；对胶水进行高温处理，使胶水固化成型。通过上述的方法步骤，对胶水进行加压填充，将空气完全挤压出填充腔，确保填充腔内不会残留有空气，避免了胶水在高温固化的过程中，出现空气受热膨胀等问题，即避免了芯片的封装结构遭受影响、破坏，确保芯片封装结构的防水性能以及可靠性。并且，有效地提升芯片的抗冲击能力以及提升芯片与底板的结合强度。
An embodiment of the present invention provides a method for packaging a fingerprint recognition module chip, including providing a fingerprint recognition module chip and a base plate, a filling cavity is formed between the chip and the base plate, and connection solder joints for connecting the chip and the base plate are provided in the filling cavity; Fill the edge of the filling cavity with glue; apply pressure to the glue to make the glue permeate to the center of the filling cavity; perform high temperature treatment on the glue to make the glue solidify and form. Through the above method steps, the glue is pressurized and filled, and the air is completely squeezed out of the filling cavity to ensure that there will be no air left in the filling cavity, and avoid problems such as air expansion when the glue is cured at high temperature, that is The package structure of the chip is prevented from being affected and destroyed, and the waterproof performance and reliability of the package structure of the chip are ensured. Moreover, the impact resistance of the chip and the bonding strength between the chip and the bottom plate are effectively improved.
Description
技术领域technical field
本发明涉及电子设备领域，尤其涉及一种指纹识别模组芯片的封装方法。The invention relates to the field of electronic equipment, in particular to a packaging method for a fingerprint identification module chip.
背景技术Background technique
随着电子设备技术的发展，消费者对移动终端的体验要求越来越高。指纹识别技术由于具有保密功能，且使用操作方便，深受各类消费者的喜爱。现有技术中，指纹识别模组芯片一般都是焊接固定在移动终端的底板上，并在芯片与底板之间填充胶水。参照图1，在传统的BGA(Ball Grid Array)封装方式中，由于芯片101与底板102之间的间隙较大(0.2mm以上)，胶水通过毛细渗透的方式即可渗透至芯片底部的中心处。但随着封装技术以及移动终端薄型化的发展，出现了LGA(Land Grid Array)的封装方式。参照图2，在该封装方式中，由于芯片201与底板202之间的间隙小(0.03mm以下)，且芯片的尺寸较大(6*10mm)，胶水通过毛细渗透的方式难以渗透至芯片底部的中心处，即芯片与底板之间无法饱满填充。因此，LGA的封装方式具有如下的技术问题：1、由于芯片底部的中心处残留有空气，在胶水高温固化的过程中，空气受热膨胀，容易将胶水撑开，使封装结构出现缺口，大大地降低了芯片的防水性能。并且，在空气膨胀的过程中，会对焊点施以应力，对封装的可靠性造成影响；严重时，甚至还会对芯片的正常使用造成影响。2、不饱满的填充导致各焊点的受力不均匀，降低了芯片的抗冲击能力。3、不饱满的填充还会造成胶水的粘接能力下降，导致存在芯片与底板脱离的隐患。With the development of electronic device technology, consumers have higher and higher requirements for mobile terminal experience. Fingerprint identification technology is deeply loved by all kinds of consumers because of its security function and convenient operation. In the prior art, the chip of the fingerprint recognition module is generally welded and fixed on the bottom plate of the mobile terminal, and glue is filled between the chip and the bottom plate. Referring to Fig. 1, in the traditional BGA (Ball Grid Array) packaging method, since the gap between the chip 101 and the bottom plate 102 is relatively large (more than 0.2mm), the glue can penetrate to the center of the bottom of the chip through capillary penetration. . However, with the development of packaging technology and the thinning of mobile terminals, the packaging method of LGA (Land Grid Array) has emerged. Referring to FIG. 2 , in this packaging method, since the gap between the chip 201 and the bottom plate 202 is small (less than 0.03mm) and the size of the chip is large (6*10mm), it is difficult for the glue to penetrate to the bottom of the chip through capillary penetration. The center of the chip, that is, the gap between the chip and the bottom plate cannot be fully filled. Therefore, the packaging method of LGA has the following technical problems: 1. Since there is air remaining in the center of the bottom of the chip, during the process of curing the glue at high temperature, the air is heated and expands, which easily spreads the glue, causing gaps in the packaging structure, greatly The waterproof performance of the chip is reduced. Moreover, in the process of air expansion, stress will be imposed on the solder joints, which will affect the reliability of the package; in severe cases, it will even affect the normal use of the chip. 2. Insufficient filling leads to uneven stress on each solder joint, which reduces the impact resistance of the chip. 3. Insufficient filling will also reduce the bonding ability of the glue, resulting in the hidden danger of the chip and the bottom plate being separated.
发明内容Contents of the invention
本发明的目的是提供一种指纹识别模组芯片的封装方法，以解决现有技术中芯片与底板之间无法实现饱满填充的问题。The purpose of the present invention is to provide a packaging method for fingerprint identification module chips, so as to solve the problem in the prior art that full filling cannot be achieved between the chip and the bottom plate.
本发明提供一种指纹识别模组芯片的封装方法，包括：The invention provides a packaging method for a fingerprint identification module chip, comprising:
提供指纹识别模组芯片以及底板，所述芯片与所述底板之间形成填充腔，所述填充腔内设置有连接所述芯片与所述底板的连接焊点；Provide a fingerprint identification module chip and a base plate, a filling cavity is formed between the chip and the base plate, and a connection solder point connecting the chip and the base plate is provided in the filling cavity;
于所述填充腔的边缘填充胶水；filling the edge of the filling cavity with glue;
对所述胶水施加压力，使所述胶水向所述填充腔的中心处渗透；applying pressure to the glue so that the glue penetrates toward the center of the filling cavity;
对所述胶水进行高温处理，使所述胶水固化成型。The glue is subjected to high temperature treatment to make the glue solidify and form.
在本发明实施例中，于填充腔的边缘填充胶水；并对胶水施加压力，实现胶水的加压填充，使胶水具有更佳的渗透性能，确保胶水可以从填充腔的边缘向填充腔的中心处渗透；在胶水完成渗透之后，对胶水进行高温处理，使胶水固化成型。因此，通过上述的方法步骤，实现了胶水于芯片与底板之间的饱满填充。1、由于对胶水进行加压填充，将空气完全挤压出填充腔，确保填充腔内不会残留有空气(可以针对尺寸更小的填充腔实现饱满填充)，避免了胶水在高温固化的过程中，出现空气受热膨胀等问题，即避免了芯片的封装结构遭受影响、破坏，确保芯片封装结构的防水性能以及可靠性。2、胶水饱满地填充于填充腔，可以分散各焊点的受力，使各焊点受力更为均匀，有效地提升芯片的抗冲击能力。3、胶水饱满地填充于填充腔，能够提升芯片与底板的结合强度，可以弥补因焊接强度不足而引起的锡裂、结构稳定性较差等问题。In the embodiment of the present invention, the edge of the filling cavity is filled with glue; and pressure is applied to the glue to realize the pressurized filling of the glue, so that the glue has better permeability and ensures that the glue can flow from the edge of the filling cavity to the center of the filling cavity After the glue has penetrated, the glue is treated with high temperature to make the glue solidify and form. Therefore, through the above method steps, full filling of the glue between the chip and the base plate is realized. 1. Due to the pressure filling of the glue, the air is completely squeezed out of the filling cavity, ensuring that there will be no air left in the filling cavity (full filling can be achieved for smaller filling cavities), avoiding the process of curing the glue at high temperature In the process, problems such as thermal expansion of the air occur, that is, the chip packaging structure is avoided from being affected and damaged, and the waterproof performance and reliability of the chip packaging structure are ensured. 2. The glue is fully filled in the filling cavity, which can disperse the force of each solder joint, make the force of each solder joint more uniform, and effectively improve the impact resistance of the chip. 3. The glue is fully filled in the filling cavity, which can improve the bonding strength between the chip and the bottom plate, and can make up for problems such as tin cracking and poor structural stability caused by insufficient welding strength.
附图说明Description of drawings
为了更清楚地说明本发明实施例中的技术方案，下面将对实施例描述中所需要使用的附图作简单地介绍，下面描述中的附图仅仅是本发明的一些实施例，对于本领域普通技术人员来讲，在不付出创造性劳动的前提下，还可以根据这些附图获得其他的附图。In order to more clearly illustrate the technical solutions in the embodiments of the present invention, the following will briefly introduce the drawings that need to be used in the description of the embodiments. The drawings in the following description are only some embodiments of the present invention. Ordinary technicians can also obtain other drawings based on these drawings on the premise of not paying creative work.
图1为现有技术BGA封装方式中，芯片与底板的结构示意图；FIG. 1 is a schematic structural view of a chip and a bottom plate in a BGA packaging method in the prior art;
图2为现有技术LGA封装方式中，芯片与底板的结构示意图；FIG. 2 is a schematic structural diagram of a chip and a bottom plate in an LGA packaging method in the prior art;
图3为本发明第一实施例的封装方法的流程示意图；3 is a schematic flow chart of a packaging method according to a first embodiment of the present invention;
图4为本发明实施例步骤11的示意图；Fig. 4 is the schematic diagram of step 11 of the embodiment of the present invention;
图5为本发明实施例步骤12的示意图；Fig. 5 is the schematic diagram of step 12 of the embodiment of the present invention;
图6为本发明第二实施例的封装方法的流程示意图。FIG. 6 is a schematic flowchart of a packaging method according to a second embodiment of the present invention.
具体实施方式detailed description
为了使本发明所解决的技术问题、技术方案及有益效果更加清楚明白，以下结合附图及实施例，对本发明进行进一步详细说明。应当理解，此处所描述的具体实施例仅仅用以解释本发明，并不用于限定本发明。In order to make the technical problems, technical solutions and beneficial effects solved by the present invention clearer, the present invention will be further described in detail below in conjunction with the accompanying drawings and embodiments. It should be understood that the specific embodiments described here are only used to explain the present invention, not to limit the present invention.
实施例一：Embodiment one:
参照图3，一种指纹识别模组芯片的封装方法，包括：With reference to Fig. 3, a kind of packaging method of fingerprint recognition module chip comprises:
提供指纹识别模组芯片1以及底板2，所述芯片1与所述底板2之间形成填充腔3，所述填充腔3内设置有连接所述芯片1与所述底板2的连接焊点4。其中，所述底板2为电路板。A fingerprint recognition module chip 1 and a base plate 2 are provided, a filling cavity 3 is formed between the chip 1 and the base plate 2, and a connection solder point 4 connecting the chip 1 and the base plate 2 is arranged in the filling cavity 3 . Wherein, the base plate 2 is a circuit board.
步骤S11，于所述填充腔的边缘填充胶水。Step S11, filling the edge of the filling cavity with glue.
本步骤中，参照图4，可以利用点胶机5于填充腔的边缘填充胶水，使用十分方便。其中，胶水优先选用1000MPa.s以下的胶水，使胶水具有更佳的渗透性能，利于胶水于填充腔的边缘向填充腔的中心处渗透。In this step, referring to FIG. 4 , the glue dispenser 5 can be used to fill the edge of the filling cavity with glue, which is very convenient to use. Among them, the glue below 1000MPa.s is preferred, so that the glue has better permeability, which is conducive to the penetration of the glue from the edge of the filling cavity to the center of the filling cavity.
步骤S12，对所述胶水施加压力，使所述胶水向所述填充腔的中心处渗透。Step S12, applying pressure to the glue to make the glue permeate toward the center of the filling cavity.
本步骤中，参照图,5，可以利用脱泡机对胶水施加压力，实现胶水的加压填充，使胶水具有更佳的渗透性能，确保胶水可以从填充腔的边缘向填充腔的中心处渗透。在此过程中，由于对胶水进行加压填充，将空气完全挤压出填充腔，确保填充腔内不会残留有空气，避免了胶水在高温固化的过程中，出现空气受热膨胀等问题。In this step, referring to Figure 5, you can use the degassing machine to apply pressure to the glue to achieve pressurized filling of the glue, so that the glue has better permeability and ensures that the glue can penetrate from the edge of the filling cavity to the center of the filling cavity . During this process, due to the pressure filling of the glue, the air is completely squeezed out of the filling cavity, ensuring that no air remains in the filling cavity, and avoiding the problem of air heating and expansion during the high-temperature curing of the glue.
步骤S13，对所述胶水进行高温处理，使所述胶水固化成型。Step S13, performing a high-temperature treatment on the glue, so that the glue is cured and shaped.
本步骤中，在胶水完成渗透之后，可以利用脱泡机对胶水进行高温处理，使胶水固化成型，实现胶水粘接于芯片与底板之间。In this step, after the glue is infiltrated, the glue can be subjected to high-temperature treatment by using a defoaming machine, so that the glue can be solidified and formed, and the glue can be bonded between the chip and the bottom plate.
在本发明实施例中，于填充腔的边缘填充胶水；并对胶水施加压力，实现胶水的加压填充，使胶水具有更佳的渗透性能，确保胶水可以从填充腔的边缘向填充腔的中心处渗透；在胶水完成渗透之后，对胶水进行高温处理，使胶水固化成型。因此，通过上述的方法步骤，实现了胶水于芯片与底板之间的饱满填充。1、由于对胶水进行加压填充，将空气完全挤压出填充腔，确保填充腔内不会残留有空气，避免了胶水在高温固化的过程中，出现空气受热膨胀等问题，即避免了芯片的封装结构遭受影响、破坏，确保芯片封装结构的防水性能以及可靠性。2、胶水饱满地填充于填充腔，可以分散各焊点的受力，使各焊点受力更为均匀，有效地提升芯片的抗冲击能力。3、胶水饱满地填充于填充腔，能够提升芯片与底板的结合强度，可以弥补因焊接强度不足而引起的锡裂、结构稳定性较差等问题。In the embodiment of the present invention, the edge of the filling cavity is filled with glue; and pressure is applied to the glue to realize the pressurized filling of the glue, so that the glue has better permeability and ensures that the glue can flow from the edge of the filling cavity to the center of the filling cavity After the glue has penetrated, the glue is treated with high temperature to make the glue solidify and form. Therefore, through the above method steps, full filling of the glue between the chip and the base plate is realized. 1. Due to the pressure filling of the glue, the air is completely squeezed out of the filling cavity, ensuring that there will be no air left in the filling cavity, and avoiding the problem of air heating and expansion during the high-temperature curing of the glue, that is, avoiding the chip The packaging structure of the chip is affected and damaged, ensuring the waterproof performance and reliability of the chip packaging structure. 2. The glue is fully filled in the filling cavity, which can disperse the force of each solder joint, make the force of each solder joint more uniform, and effectively improve the impact resistance of the chip. 3. The glue is fully filled in the filling cavity, which can improve the bonding strength between the chip and the bottom plate, and can make up for problems such as tin cracking and poor structural stability caused by insufficient welding strength.
实施例二：Embodiment two:
参照图6，一种指纹识别模组芯片的封装方法，包括：With reference to Fig. 6, a kind of packaging method of fingerprint recognition module chip comprises:
提供指纹识别模组芯片以及底板，所述芯片与所述底板之间形成填充腔，所述填充腔内设置有连接所述芯片与所述底板的连接焊点。其中，所述底板为电路板。A fingerprint recognition module chip and a base plate are provided, a filling cavity is formed between the chip and the base plate, and connection solder points connecting the chip and the base plate are arranged in the filling cavity. Wherein, the base plate is a circuit board.
步骤S21，于所述填充腔的边缘填充胶水。Step S21, filling the edge of the filling cavity with glue.
本步骤具体为：环绕所述填充腔的边缘填充胶水，使所述填充腔封闭。进一步地，具体为：利用点胶机环绕所述填充腔的边缘填充胶水，使所述填充腔封闭。其中，胶水优先选用1000MPa.s以下的胶水，使胶水具有更佳的渗透性能，利于胶水于填充腔的边缘向填充腔的中心处渗透。This step specifically includes: filling glue around the edge of the filling cavity to seal the filling cavity. Further, it is specifically: using a glue dispenser to fill glue around the edge of the filling cavity to close the filling cavity. Among them, the glue below 1000MPa.s is preferred, so that the glue has better permeability, which is conducive to the penetration of the glue from the edge of the filling cavity to the center of the filling cavity.
本步骤中，通过环绕填充腔的边缘填充胶水，使胶水将填充腔封闭，利于后续对胶水施加压力时，压力可以更好地对胶水产生作用，确保胶水更好地于填充腔的边缘向填充腔的中心处渗透，实现胶水对填充腔的饱满填充。In this step, by filling the glue around the edge of the filling cavity, the glue will close the filling cavity, which is beneficial to the subsequent application of pressure on the glue, and the pressure can have a better effect on the glue, ensuring that the glue is better filled to the edge of the filling cavity. The center of the cavity is infiltrated to achieve full filling of the filling cavity with glue.
步骤S22，对所述胶水施加压力，使所述胶水向所述填充腔的中心处渗透。Step S22, applying pressure to the glue to make the glue permeate toward the center of the filling cavity.
本步骤具体为：对所述胶水施加0.4—0.6MPa的压力，使所述胶水向所述填充腔的中心处渗透。进一步地，具体为：将所述芯片以及所述底板置于脱泡机内，对所述胶水施加0.4—0.6MPa的压力，使所述胶水向所述填充腔的中心处渗透。This step specifically includes: applying a pressure of 0.4-0.6 MPa to the glue to make the glue penetrate into the center of the filling cavity. Further, specifically: placing the chip and the bottom plate in a degassing machine, applying a pressure of 0.4-0.6 MPa to the glue, so that the glue penetrates toward the center of the filling cavity.
本步骤中，通过对胶水施加压力，实现胶水的加压填充，使胶水具有更佳的渗透性能，确保胶水可以从填充腔的边缘向填充腔的中心处渗透。具体地，施加压力的范围为0.4—0.6MPa，使胶水的加压渗透效果更佳。并且，在此过程中，由于对胶水进行加压填充，将空气完全挤压出填充腔，确保填充腔内不会残留有空气，避免了胶水在高温固化的过程中，出现空气受热膨胀等问题。In this step, pressurized filling of the glue is realized by applying pressure to the glue, so that the glue has better penetration performance and ensures that the glue can penetrate from the edge of the filling cavity to the center of the filling cavity. Specifically, the range of applied pressure is 0.4-0.6 MPa, so that the pressure penetration effect of the glue is better. Moreover, during this process, due to the pressure filling of the glue, the air is completely squeezed out of the filling cavity, ensuring that there will be no air remaining in the filling cavity, and avoiding problems such as air thermal expansion during the high-temperature curing of the glue. .
步骤S23，对所述胶水进行高温处理，使所述胶水固化成型。Step S23, performing high-temperature treatment on the glue to make the glue solidify and form.
本步骤具体为：对所述胶水进行温度为85—130摄氏度的高温处理，且处理时长为10—20分钟，使所述胶水固化成型。进一步地，具体为：将所述芯片以及所述底板置于脱泡机内，对所述胶水进行温度为85—130摄氏度的高温处理，且处理时长为10—20分钟，使所述胶水固化成型。This step specifically includes: subjecting the glue to a high-temperature treatment at a temperature of 85-130 degrees Celsius for 10-20 minutes, so that the glue is cured and formed. Further, specifically: placing the chip and the bottom plate in a degassing machine, subjecting the glue to a high-temperature treatment at a temperature of 85-130 degrees Celsius, and the treatment time is 10-20 minutes, so that the glue is cured forming.
本步骤中，在胶水完成渗透之后，可以利用脱泡机对胶水进行高温处理，使胶水固化成型，实现胶水粘接于芯片与底板之间。并且，处理温度为85—130摄氏度，处理时长为10—20分钟，能够保证胶水的粘接效果。In this step, after the glue is infiltrated, the glue can be subjected to high-temperature treatment by using a defoaming machine, so that the glue can be solidified and formed, and the glue can be bonded between the chip and the bottom plate. Moreover, the processing temperature is 85-130 degrees Celsius, and the processing time is 10-20 minutes, which can ensure the bonding effect of the glue.
在本发明实施例中，脱泡机可以对胶水实现加压，也可以对胶水实现加温。In the embodiment of the present invention, the defoaming machine can pressurize the glue, and can also heat the glue.
在本发明实施例中，于填充腔的边缘填充胶水；并对胶水施加压力，实现胶水的加压填充，使胶水具有更佳的渗透性能，确保胶水可以从填充腔的边缘向填充腔的中心处渗透；在胶水完成渗透之后，对胶水进行高温处理，使胶水固化成型。因此，通过上述的方法步骤，实现了胶水于芯片与底板之间的饱满填充。1、由于对胶水进行加压填充，将空气完全挤压出填充腔，确保填充腔内不会残留有空气，避免了胶水在高温固化的过程中，出现空气受热膨胀等问题，即避免了芯片的封装结构遭受影响、破坏，确保芯片封装结构的防水性能以及可靠性。2、胶水饱满地填充于填充腔，可以分散各焊点的受力，使各焊点受力更为均匀，有效地提升芯片的抗冲击能力。3、胶水饱满地填充于填充腔，能够提升芯片与底板的结合强度，可以弥补因焊接强度不足而引起的锡裂、结构稳定性较差等问题。In the embodiment of the present invention, the edge of the filling cavity is filled with glue; and pressure is applied to the glue to realize the pressurized filling of the glue, so that the glue has better permeability and ensures that the glue can flow from the edge of the filling cavity to the center of the filling cavity After the glue has penetrated, the glue is treated with high temperature to make the glue solidify and form. Therefore, through the above method steps, full filling of the glue between the chip and the base plate is realized. 1. Due to the pressure filling of the glue, the air is completely squeezed out of the filling cavity, ensuring that there will be no air left in the filling cavity, and avoiding the problem of air heating and expansion during the high-temperature curing of the glue, that is, avoiding the chip The packaging structure of the chip is affected and damaged, ensuring the waterproof performance and reliability of the chip packaging structure. 2. The glue is fully filled in the filling cavity, which can disperse the force of each solder joint, make the force of each solder joint more uniform, and effectively improve the impact resistance of the chip. 3. The glue is fully filled in the filling cavity, which can improve the bonding strength between the chip and the bottom plate, and can make up for problems such as tin cracking and poor structural stability caused by insufficient welding strength.
在本发明的描述中，需要理解的是，术语“上”、“下”、“内”、“外”等指示的方位或位置关系为基于附图所示的方位或位置关系，仅是为了便于描述本发明和简化描述，而不是指示或暗示所指的装置或元件必须具有特定的方位、以特定的方位构造和操作，因此不能理解为对本发明的限制。In the description of the present invention, it should be understood that the orientation or positional relationship indicated by the terms "upper", "lower", "inner", "outer" and the like are based on the orientation or positional relationship shown in the drawings, and are only for It is convenient to describe the present invention and simplify the description, but does not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operate in a specific orientation, and thus should not be construed as limiting the present invention.
如上所述是结合具体内容提供的一种或多种实施方式，并不认定本发明的具体实施只局限于这些说明。凡与本发明的方法、结构等近似、雷同，或是对于本发明构思前提下做出若干技术推演或替换，都应当视为本发明的保护范围。The foregoing is one or more implementation modes provided in conjunction with specific content, and it is not considered that the specific implementation of the present invention is limited to these descriptions. Any approach or similarity to the methods and structures of the present invention, or some technical deduction or replacement based on the concept of the present invention shall be regarded as the scope of protection of the present invention.
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| CN114640017A (en) * | 2022-03-02 | 2022-06-17 | 西安欧益光电科技有限公司 | Laser window sheet gluing structure and method |
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| WO2012136000A1 (en) * | 2011-04-06 | 2012-10-11 | 北京大学深圳研究生院 | Glue filling method and device in the semiconductor package |
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| US5203076A (en) * | 1991-12-23 | 1993-04-20 | Motorola, Inc. | Vacuum infiltration of underfill material for flip-chip devices |
| CN101056503A (en) * | 2006-04-10 | 2007-10-17 | 群光电子股份有限公司 | Electronic component bonding method and device using the method |
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