CN106544705A - The manufacture method of the micro- replica metal micro structure of precise electrotyping - Google Patents
The manufacture method of the micro- replica metal micro structure of precise electrotyping Download PDFInfo
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- CN106544705A CN106544705A CN201610927889.7A CN201610927889A CN106544705A CN 106544705 A CN106544705 A CN 106544705A CN 201610927889 A CN201610927889 A CN 201610927889A CN 106544705 A CN106544705 A CN 106544705A
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- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D1/00—Electroforming
- C25D1/10—Moulds; Masks; Masterforms
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- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D1/00—Electroforming
- C25D1/20—Separation of the formed objects from the electrodes with no destruction of said electrodes
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Abstract
The invention discloses a kind of manufacture method of the micro- replica metal micro structure of precise electrotyping, comprises the following steps：Master tooling pre-treatment；PDMS Mold Makings；PU Mold Makings；It is prepared by conductive layer：Under vacuum conditions on PU moulds deposit one layer of conductive metal film；The micro- replica of electroforming：The PU moulds for having conductive layer are placed in the electroforming solution of electrotyping bath carries out the precise electrotyping deposition replica of metal micro structure；The demoulding of metal micro structure：Precise electrotyping post-depositional hard backing PU Mold Metal micro structures are put in the container equipped with solvent carries out heating ultrasound；After PU softens dissolving in a solvent, metal micro structure is separated by mechanical stripping with PU moulds, obtains final replica metal micro structure.The present invention had both protected master tooling repeatedly can utilize, and easy mold release, low cost in turn ensure that the precision and integrity of replica metal micro structure.
Description
Technical field
The present invention relates to metal micro structure manufacturing technology field, the micro- knot of the micro- replica metal of more particularly to a kind of precise electrotyping
The manufacture method of structure.
Background technology
With the development that society makes rapid progress, the miniaturization of product, the development trend of a certainty is miniaturizated to, because
The demand of this metal micro structure product is huge, and wherein Film Optics components and parts play more and more important in development in science and technology
Effect.As used in the remotely sensed image equipment used in deep space satellite earth observation, the infrared night vision mirror in military equipment, nuclear fusion
To significantly concave grating, high-precision measuring grating, optical spectroscopic element and the curved surface microstructure used in accurate displacement detection
Device etc..
In various fine machining methods, the micro- replica manufacturing technology of precise electrotyping is to reduce manufacturing cost and improve yield
An effective way.The maximum advantage of the micro- replication method of precise electrotyping is can to produce device in enormous quantities using same master mold
Part parameter identical replicate sample, so replicating the low cost of device, is capable of achieving the batch micro operations of components and parts.
What the precision of the micro- replica of precise electrotyping was ensured by the precision of master tooling, therefore the precision manufactureing of master tooling is primary
In view of problem.At present the master tooling of conventional precise electrotyping is for example wet, dry etching silicon substrate mould, high precision but low intensity is easy
It is broken, often just destroyed using a precision；The most frequently used metal die, needs specific releasing agent, if the thickness of replica
Larger, the edge wrap of master tooling when the demoulding micro structure can be able to deform by deposited metal.
The content of the invention
The invention mainly solves the technical problem of the manufacture method that a kind of micro- replica metal micro structure of precise electrotyping is provided,
Both master tooling had been protected repeatedly to utilize, easy mold release, low cost in turn ensure that the precision and integrity of replica metal micro structure.
To solve above-mentioned technical problem, one aspect of the present invention is：There is provided a kind of precise electrotyping micro- replica
The manufacture method of metal micro structure, comprises the following steps：
（1）Master tooling pre-treatment：Master tooling is cleaned, cleaning is dried up after finishing, and dried on hot plate, be cooled to room
Temperature, one layer of mold release film of spin coating on the master tooling of drying；
（2）PDMS Mold Makings：Master tooling is placed in horizontal marble platform, PDMS and firming agent are mixed according to mass ratio
Close, after stirring, carry out vacuum pumping, take out after evacuation and pour on master tooling, and apply hard backing, will be hard
Matter backing-PDMS- master toolings carry out vacuum pumping together, eliminate the bubble in PDMS, are placed after the completion of vacuumizing
It is heating and curing on hot plate, PDMS can be taken off from master tooling by mechanical stripping, obtain PDMS moulds；
（3）PU Mold Makings：One layer of demoulding agent film of spin coating on PDMS moulds, will be organic polyisocyanates and polyether-type more
First alcohol is mixed to get PU according to mass ratio, and carries out vacuumizing, and PU is poured on PDMS moulds, applies hard backing, by hard
Backing-PU-PDMS moulds carry out vacuum pumping together, place it in after the completion of vacuumizing, and machinery is de-
PU can be taken off from PDMS moulds and obtain PU moulds by mould；
（4）It is prepared by conductive layer：Under vacuum conditions on PU moulds deposit one layer of conductive metal film；
（5）The micro- replica of electroforming：The PU moulds for having conductive layer are placed in the electroforming solution of electrotyping bath carries out the precision of metal micro structure
Electroformed deposit replica；
（6）The demoulding of metal micro structure：Precise electrotyping post-depositional hard backing-PU mold metal micro structures are put into and are equipped with
Heating ultrasound is carried out in the container of solvent；After PU softens dissolving in a solvent, mechanical stripping is by metal micro structure and PU moulds
Separate, obtain final replica metal micro structure.
In a preferred embodiment of the present invention, the step（1）Master tooling pre-treatment is concretely comprised the following steps：Use successively
Detergent, acetone, ethanol are cleaned by ultrasonic to master tooling, and cleaning is dried up using gas after finishing, and dry on hot plate, cold
But to room temperature, one layer of mold release film of spin coating on the master tooling of drying.
In a preferred embodiment of the present invention, step（2）Middle solidification temperature be 60 ~ 80 DEG C, hardening time 60 ~ 90min；
Step（3）60 ~ 80 DEG C of middle solidification temperature, hardening time 60 ~ 90min.
In a preferred embodiment of the present invention, the demoulding agent film described in step (1) is oils thin film or C4F8It is thin
Film, the demoulding agent film described in step (3) are oils thin film or C4F8Thin film.
In a preferred embodiment of the present invention, step (2) and（3）Described in hard backing be it is empty through plasma
The substrate of glass of gas disposal, step（6）Described in solvent be acetone.
In a preferred embodiment of the present invention, step（4）Used in magnetron sputter under vacuum conditions in PU moulds
Upper evaporation or one layer of conductive metal film of sputtering sedimentation.
In a preferred embodiment of the present invention, step（4）Used in magnetron sputter≤1.5e-5T vacuum environment
Conductive metal film of the lower sputtering sedimentation a layer thickness for 150 ~ 200nm；Sputtering parameter：0.4 ~ 0.6A of electric current, argon flow amount 20 ~
The sedimentation rate of 25sccm, Cu is 22 ~ 27nm/min, and the sedimentation rate of Ag is 30 ~ 35nm/min.
In a preferred embodiment of the present invention, described conductive layer metallic film is Cu thin film or Ag thin film.
In a preferred embodiment of the present invention, step（5）Described in electroforming solution be electroforming nickel solution or acid electroforming
Copper solution.
In a preferred embodiment of the present invention, electroformed nickel process conditions are：400 ~ 500g/L of nickel sulfamic acid, boric acid 30
~ 50g/L, wetting agent N-500 3ml/L, pH value be 3.5 ~ 4.5, temperature maintain 40 ~ 60 DEG C, forced convertion mode for filter follow
Ring, electric current density 1A/dm2；Acid copper electroforming process conditions are：200 ~ 300g/L of copper sulfate, 60 ~ 70g/L of sulphuric acid, chloride ion
0.1 ~ 0.2g/L, addition of C X910A1ml/L, additive MU4ml/L, temperature are room temperature, magnetic agitation, electric current density 3A/
dm2；The pulse power used during above-mentioned electroformed nickel process and acid copper electroforming, frequency 10kHz, electroformed nickel sedimentation rate 8 ~
10 μm/h, acid 30 ~ 35 μm/h of copper electroforming sedimentation rate.
The invention has the beneficial effects as follows：The present invention obtains flexible PDMS mold by overmolded of master tooling, then through the
Secondary overmolded obtains the larger PU moulds of intensity, PU moulds as final micro- replica mould, as which easily dissolves in acetone
So as to ensure the integrity of replica metal micro structure, both protected master tooling repeatedly can utilize, easy mold release, low cost ensure again
The precision and integrity of replica metal micro structure.
Description of the drawings
For the technical scheme being illustrated more clearly that in the embodiment of the present invention, below will be to making needed for embodiment description
Accompanying drawing is briefly described, it should be apparent that, drawings in the following description are only some embodiments of the present invention, for
For those of ordinary skill in the art, on the premise of not paying creative work, can be obtaining other according to these accompanying drawings
Accompanying drawing, wherein：
Fig. 1 is the manufacturing process flow diagram of the micro- replica mould of precise electrotyping；
Fig. 2 is the micro- replica process chart of precise electrotyping；
Fig. 3 is metal micro structure knockout course schematic diagram；
Fig. 4 is micro- replica metal micro structure schematic diagram；
In accompanying drawing, the labelling of each part is as follows：1st, master tooling, 2, PDMS moulds, 3, glass backing, 4, PU moulds, 5, conductive gold
Category thin film, 6, metal micro structure, 7, acetone, 8, beaker, 9, supersonic cleaning machine, 10, deionized water, 11, replica metal micro structure.
Specific embodiment
Technical scheme in the embodiment of the present invention will be clearly and completely described below, it is clear that described enforcement
Example is only a part of embodiment of the present invention, rather than the embodiment of whole.Based on the embodiment in the present invention, this area is common
All other embodiment that technical staff is obtained under the premise of creative work is not made, belongs to the model of present invention protection
Enclose.
Embodiment 1
A kind of manufacture method of the micro- replica metal micro structure of precise electrotyping：
As shown in figure 1, being the preparation technology flow chart of the micro- replica PU mould of precise electrotyping, comprise the following steps that：
（1）Master tooling pre-treatment：Master tooling 1 is cleaned by ultrasonic using detergent, acetone, ethanol successively, three road in experiment
Operation is each cleaned by ultrasonic 10min, and every time cleaning is completed to reuse deionized water and carries out ultrasonic cleaning 5min, finally carry out etc. from
Sub- oxygen cleaning；The moisture on 1 surface of master tooling is dried up after finishing by cleaning with clean nitrogen, and is dried on hot plate, and temperature sets
Fixed 120 DEG C, time 120min is cooled to room temperature, one layer of oils thin film of spin coating or deposition C on the master tooling 1 of drying4F8It is thin
Film；
（2）PDMS Mold Makings：Master tooling 1 is placed in horizontal marble platform, PDMS and firming agent according to mass ratio
10:1 mixing, after stirring, carries out vacuum pumping, takes out and pour on master tooling 1 after evacuation 7min, treats PDMS certainly
After so trickling is covered with master tooling 1, gently it is pressed on PDMS through the clean glass substrate 3 of Air plasma process, and slowly
Firmly, glass backing-PDMS- master toolings are carried out into vacuumizing 7min together then, is placed it in after the completion of vacuumizing
On hot plate, temperature 70 C, time 75min, after the completion of solidification, PDMS moulds 2 can be taken off from original mould 1 by mechanical stripping,
Obtain PDMS moulds 2；
（3）PU Mold Makings：One layer of oils thin film of spin coating or deposition C on PDMS moulds 24F8Thin film, organic many isocyanides
Sour fat is with polyether polyol according to mass ratio 1:0.55 is mixed to get PU, and vacuumizing is carried out after stirring, and takes out true
Take out after sky about 10min, PDMS moulds 2 are placed in horizontal marble platform, PU is poured on PDMS moulds 2, treats PU natures
After trickling is covered with PDMS moulds 2, the clean glass substrate 3 processed through Air plasma is gently pressed on PU, and slowly
Firmly, glass backing-PU-PDMS moulds are carried out into vacuumizing 5min together then, due to PU normal temperature cures also comparatively fast, Ying Bao
Card completes the work of evacuation in 20min, and 60 DEG C of solidification temperature, time 90min, after the completion of solidification, are incited somebody to action by mechanical stripping
PU moulds 4 are taken off from PDMS moulds 2, obtain PU moulds 4；
As shown in Fig. 2 being the micro- replica process chart of precise electrotyping, comprise the following steps that：
（1）It is prepared by conductive layer：Using magnetron sputter under the vacuum environment of≤1.5e-5T, sputtering sedimentation a layer thickness is
150nm conductive metal films 5, conductive metal film 5 are Ag thin film；Sputtering parameter：Electric current 0.5A, argon flow amount 20sccm, Cu
Sedimentation rate be 24nm/min, the sedimentation rate of Ag is 33nm/min；
（2）The micro- replica of electroforming：The PU moulds 4 for having conductive layer are placed in the electroforming solution of electrotyping bath, according to different material properties
Require, electroforming electroforming solution selects electroforming nickel solution or acid electroforming copper solution；Electroformed nickel process conditions are：Nickel sulfamic acid
400g/L, boric acid 30g/L, wetting agent N-500 3ml/L, pH value be 4, temperature maintain 50 DEG C, forced convertion mode for filter
Circulation, electric current density 1A/dm2；Acid copper electroforming process conditions are：Copper sulfate 250g/L, sulphuric acid 65g/L, chloride ion 0.10g/
L, addition of C X910A 1ml/L, additive MU 4ml/L, temperature are room temperature, magnetic agitation, electric current density 3A/dm2；Above-mentioned electricity
Using the pulse power, frequency 10kHz during casting nickel electroforming process or acid copper electroforming electroforming, the electroforming time is according to required thickness
Degree determines that 9 μm/h of electroformed nickel sedimentation rate, acid 30 μm/h of copper electroforming sedimentation rate obtain electroformed deposit metal micro structure 6；
As shown in figure 3, being metal micro structure knockout course schematic diagram, comprise the following steps that：
After precise electrotyping is deposited, the glass backing-PU mold metal micro structures of one are put in the beaker 8 equipped with acetone 7, should
The purity of analysis pure acetone is more than 99%；Beaker is put in supersonic cleaning machine 9, the inside is deionized water 10, and operating frequency is
53KHz, power are 180W, and temperature setting is 40 ~ 45 DEG C, and ultrasonic time is determined according to PU dissolution degrees；
As shown in figure 4, being micro- replica metal micro structure schematic diagram, comprise the following steps that：
After PU softens dissolving in acetone, metal micro structure 6 is separated by mechanical stripping with PU moulds 4, through cleaning again, blowing
Final replica metal micro structure 11 is obtained after dry, drying.
Embodiment 2
A kind of manufacture method of the micro- replica metal micro structure of precise electrotyping：
As shown in figure 1, being the preparation technology flow chart of the micro- replica PU mould of precise electrotyping, comprise the following steps that：
（1）Master tooling pre-treatment：Master tooling 1 is cleaned by ultrasonic using detergent, acetone, ethanol successively, three road in experiment
Operation is each cleaned by ultrasonic 8min, and every time cleaning is completed to reuse deionized water and carries out ultrasonic cleaning 7min, finally carry out etc. from
Sub- oxygen cleaning；The moisture on 1 surface of master tooling is dried up after finishing by cleaning with clean nitrogen, and is dried on hot plate, and temperature sets
Fixed 110 DEG C, time 130min is cooled to room temperature, one layer of oils thin film of spin coating or deposition C on the master tooling 1 of drying4F8It is thin
Film；
（2）PDMS Mold Makings：Master tooling 1 is placed in horizontal marble platform, PDMS and firming agent according to mass ratio
10:1 mixing, after stirring, carries out vacuum pumping, takes out and pours on master tooling 1, treat PDMS after evacuation 10min
Naturally, after trickling is covered with master tooling 1, gently it is pressed on PDMS through the clean glass substrate 3 of Air plasma process, and delays
It is slow to exert oneself, glass backing-PDMS- master toolings are carried out into vacuumizing 5min together then, is placed after the completion of vacuumizing
On hot plate, temperature 60 C, time 90min, after the completion of solidification, PDMS moulds 2 can be taken off from original mould 1 by mechanical stripping
Under, obtain PDMS moulds 2；
（3）PU Mold Makings：One layer of oils thin film of spin coating or deposition C on PDMS moulds 24F8Thin film, organic many isocyanides
Sour fat is with polyether polyol according to mass ratio 1:0.55 is mixed to get PU, and vacuumizing is carried out after stirring, and takes out true
Take out after sky about 7min, PDMS moulds 2 are placed in horizontal marble platform, PU is poured on PDMS moulds 2, treats that PU flows naturally
Drop down after being covered with PDMS moulds 2, the clean glass substrate 3 processed through Air plasma is gently pressed on PU, and is slowly used
Then glass backing-PU-PDMS moulds are carried out vacuumizing 7min by power together, as PU normal temperature cures are also very fast, be should ensure that
The work of evacuation, 80 DEG C of solidification temperature, time 60min, after the completion of solidification, by PU by mechanical stripping are completed in 20min
Mould 4 is taken off from PDMS moulds 2, obtains PU moulds 4；
As shown in Fig. 2 being the micro- replica process chart of precise electrotyping, comprise the following steps that：
（1）It is prepared by conductive layer：Using magnetron sputter under the vacuum environment of≤1.5e-5T, sputtering sedimentation a layer thickness is
180nm conductive metal films 5, conductive metal film 5 are Cu thin film；Sputtering parameter：Electric current 0.5A, argon flow amount 24sccm, Cu
Sedimentation rate be 27nm/min, the sedimentation rate of Ag is 35nm/min；
（2）The micro- replica of electroforming：The PU moulds 4 for having conductive layer are placed in the electroforming solution of electrotyping bath, according to different material properties
Require, electroforming electroforming solution selects electroforming nickel solution or acid electroforming copper solution；Electroformed nickel process conditions are：Nickel sulfamic acid
500g/L, boric acid 50g/L, wetting agent N-500 3ml/L, pH value be 4.5, temperature maintain 60 DEG C, forced convertion mode be
Filter circulation, electric current density 1A/dm2；Acid copper electroforming process conditions are：Copper sulfate 300g/L, sulphuric acid 70g/L, chloride ion 0.2g/
L, addition of C X910A 1ml/L, additive MU 4ml/L, temperature are room temperature, magnetic agitation, electric current density 3A/dm2；Above-mentioned electricity
Using the pulse power, frequency 10kHz during casting nickel electroforming process or acid copper electroforming electroforming, the electroforming time is according to required thickness
Degree determines that 8 ~ 10 μm/h of electroformed nickel sedimentation rate, acid 35 μm/h of copper electroforming sedimentation rate obtain electroformed deposit metal micro structure
6；
As shown in figure 3, being metal micro structure knockout course schematic diagram, comprise the following steps that：
After precise electrotyping is deposited, the glass backing-PU mold metal micro structures of one are put in the beaker 8 equipped with acetone 7, should
The purity of analysis pure acetone is more than 99%；Beaker is put in supersonic cleaning machine 9, the inside is deionized water 10, and operating frequency is
53KHz, power are 180W, and temperature setting is 45 DEG C, and ultrasonic time is determined according to PU dissolution degrees；
As shown in figure 4, being micro- replica metal micro structure schematic diagram, comprise the following steps that：
After PU softens dissolving in acetone, metal micro structure 6 is separated by mechanical stripping with PU moulds 4, through cleaning again, blowing
Final replica metal micro structure 11 is obtained after dry, drying.
Embodiment 3
A kind of manufacture method of the micro- replica metal micro structure of precise electrotyping：
As shown in figure 1, being the preparation technology flow chart of the micro- replica PU mould of precise electrotyping, comprise the following steps that：
（1）Master tooling pre-treatment：Master tooling 1 is cleaned by ultrasonic using detergent, acetone, ethanol successively, three road in experiment
Operation is each cleaned by ultrasonic 12min, and every time cleaning is completed to reuse deionized water and carries out ultrasonic cleaning 4min, finally carry out etc. from
Sub- oxygen cleaning；The moisture on 1 surface of master tooling is dried up after finishing by cleaning with clean nitrogen, and is dried on hot plate, and temperature sets
Fixed 130 DEG C, time 100min is cooled to room temperature, one layer of oils thin film of spin coating or deposition C on the master tooling 1 of drying4F8It is thin
Film；
（2）PDMS Mold Makings：Master tooling 1 is placed in horizontal marble platform, PDMS and firming agent according to mass ratio
10:1 mixing, after stirring, carries out vacuum pumping, takes out and pour on master tooling 1 after evacuation 5min, treats PDMS certainly
After so trickling is covered with master tooling 1, gently it is pressed on PDMS through the clean glass substrate 3 of Air plasma process, and slowly
Firmly, glass backing-PDMS- master toolings are carried out into vacuumizing 10min together then, is placed it in after the completion of vacuumizing
On hot plate, 80 DEG C of temperature, time 60min, after the completion of solidification, PDMS moulds 2 can be taken off from original mould 1 by mechanical stripping,
Obtain PDMS moulds 2；
（3）PU Mold Makings：One layer of oils thin film of spin coating or deposition C on PDMS moulds 24F8Thin film, organic many isocyanides
Sour fat is with polyether polyol according to mass ratio 1:0.55 is mixed to get PU, and vacuumizing is carried out after stirring, and takes out true
Take out after sky about 5min, PDMS moulds 2 are placed in horizontal marble platform, PU is poured on PDMS moulds 2, treats that PU flows naturally
Drop down after being covered with PDMS moulds 2, the clean glass substrate 3 processed through Air plasma is gently pressed on PU, and is slowly used
Then glass backing-PU-PDMS moulds are carried out vacuumizing 10min by power together, due to PU normal temperature cures also comparatively fast, Ying Bao
Card completes the work of evacuation in 20min, and 70 DEG C of solidification temperature, time 75min, after the completion of solidification, are incited somebody to action by mechanical stripping
PU moulds 4 are taken off from PDMS moulds 2, obtain PU moulds 4；
As shown in Fig. 2 being the micro- replica process chart of precise electrotyping, comprise the following steps that：
（1）It is prepared by conductive layer：Using magnetron sputter under the vacuum environment of≤1.5e-5T, sputtering sedimentation a layer thickness is
200nm conductive metal films 5, conductive metal film 5 are Ag thin film；Sputtering parameter：Electric current 0.6A, argon flow amount 215sccm, Cu
Sedimentation rate be 27nm/min, the sedimentation rate of Ag is 31nm/min；
（2）The micro- replica of electroforming：The PU moulds 4 for having conductive layer are placed in the electroforming solution of electrotyping bath, according to different material properties
Require, electroforming electroforming solution selects electroforming nickel solution or acid electroforming copper solution；Electroformed nickel process conditions are：Nickel sulfamic acid
430g/L, boric acid 39g/L, wetting agent N-5003ml/L, pH value be 3.6, temperature maintain 57 DEG C, forced convertion mode for filter
Circulation, electric current density 1A/dm2；Acid copper electroforming process conditions are：Copper sulfate 209g/L, sulphuric acid 64g/L, chloride ion 0.1g/L,
Addition of C X910A 1ml/L, additive MU 4ml/L, temperature are room temperature, magnetic agitation, electric current density 3A/dm2；Above-mentioned electroforming
Using the pulse power, frequency 10kHz during nickel electroforming process or acid copper electroforming electroforming, the electroforming time is according to desired thickness
Determine, 9 μm/h of electroformed nickel sedimentation rate, acid 33 μm/h of copper electroforming sedimentation rate obtain electroformed deposit metal micro structure 6；
As shown in figure 3, being metal micro structure knockout course schematic diagram, comprise the following steps that：
After precise electrotyping is deposited, the glass backing-PU mold metal micro structures of one are put in the beaker 8 equipped with acetone 7, should
The purity of analysis pure acetone is more than 99%；Beaker is put in supersonic cleaning machine 9, the inside is deionized water 10, and operating frequency is
53KHz, power are 180W, and temperature setting is 41 DEG C, and ultrasonic time is determined according to PU dissolution degrees；
As shown in figure 4, being micro- replica metal micro structure schematic diagram, comprise the following steps that：
After PU softens dissolving in acetone, metal micro structure 6 is separated by mechanical stripping with PU moulds 4, through cleaning again, blowing
Final replica metal micro structure 11 is obtained after dry, drying.
The present invention obtains flexible PDMS mold by overmolded of master tooling, then to obtain intensity through second overmolded larger
PU moulds, PU moulds as final micro- replica mould, as which is easily dissolved in acetone so as to ensure the micro- knot of replica metal
The integrity of structure, had both protected master tooling repeatedly can utilize, and easy mold release, low cost in turn ensure that the essence of replica metal micro structure
Degree and integrity.
Embodiments of the invention are the foregoing is only, the scope of the claims of the present invention is not thereby limited, it is every using this
Equivalent structure or equivalent flow conversion that bright description is made, or directly or indirectly it is used in other related technology necks
Domain, is included within the scope of the present invention.
Claims (10)
1. the manufacture method of the micro- replica metal micro structure of a kind of precise electrotyping, it is characterised in that comprise the following steps：
（1）Master tooling pre-treatment：Master tooling is cleaned, cleaning is dried up after finishing, and dried on hot plate, be cooled to room
Temperature, one layer of mold release film of spin coating on the master tooling of drying；
（2）PDMS Mold Makings：Master tooling is placed in horizontal marble platform, PDMS and firming agent are mixed according to mass ratio
Close, after stirring, carry out vacuum pumping, take out after evacuation and pour on master tooling, and apply hard backing, will be hard
Matter backing-PDMS- master toolings carry out vacuum pumping together, eliminate the bubble in PDMS, are placed after the completion of vacuumizing
It is heating and curing on hot plate, PDMS can be taken off from master tooling by mechanical stripping, obtain PDMS moulds；
（3）PU Mold Makings：One layer of demoulding agent film of spin coating on PDMS moulds, will be organic polyisocyanates and polyether-type more
First alcohol is mixed to get PU according to mass ratio, and carries out vacuumizing, and PU is poured on PDMS moulds, applies hard backing, by hard
Backing-PU-PDMS moulds carry out vacuum pumping together, place it in after the completion of vacuumizing, and machinery is de-
PU can be taken off from PDMS moulds and obtain PU moulds by mould；
（4）It is prepared by conductive layer：Under vacuum conditions on PU moulds deposit one layer of conductive metal film；
（5）The micro- replica of electroforming：The PU moulds for having conductive layer are placed in the electroforming solution of electrotyping bath carries out the precision of metal micro structure
Electroformed deposit replica；
（6）The demoulding of metal micro structure：Precise electrotyping post-depositional hard backing-PU mold metal micro structures are put into and are equipped with
Heating ultrasound is carried out in the container of solvent；After PU softens dissolving in a solvent, mechanical stripping is by metal micro structure and PU moulds
Separate, obtain final replica metal micro structure.
2. the manufacture method of the micro- replica metal micro structure of precise electrotyping according to claim 1, it is characterised in that the step
Suddenly（1）Master tooling pre-treatment is concretely comprised the following steps：Master tooling is cleaned by ultrasonic using detergent, acetone, ethanol successively, clearly
Wash and dried up using gas after finishing, and dry on hot plate, be cooled to room temperature, one layer of releasing agent of spin coating on the master tooling of drying
Thin film.
3. the manufacture method of the micro- replica metal micro structure of precise electrotyping according to claim 1, it is characterised in that step
（2）Middle solidification temperature be 60 ~ 80 DEG C, hardening time 60 ~ 90min；Step（3）60 ~ 80 DEG C of middle solidification temperature, hardening time 60 ~
90min。
4. the manufacture method of the micro- replica metal micro structure of precise electrotyping according to claim 1, it is characterised in that step
(1) the demoulding agent film described in is oils thin film or C4F8Thin film, the demoulding agent film described in step (3) are oils
Thin film or C4F8Thin film.
5. the manufacture method of the micro- replica metal micro structure of precise electrotyping according to claim 1, it is characterised in that step
(2) and（3）Described in hard backing be the substrate of glass processed through Air plasma, step（6）Described in it is molten
Agent is acetone.
6. the manufacture method of the micro- replica metal micro structure of precise electrotyping according to claim 1, it is characterised in that step
（4）Used in magnetron sputter under vacuum conditions on PU moulds evaporation or one layer of conductive metal film of sputtering sedimentation.
7. the manufacture method of the micro- replica metal micro structure of precise electrotyping according to claim 1, it is characterised in that step
（4）Used in magnetron sputter under the vacuum environment of≤1.5e-5T, conduction of the sputtering sedimentation a layer thickness for 150 ~ 200nm
Metallic film；Sputtering parameter：The sedimentation rate of 0.4 ~ 0.6A of electric current, 20 ~ 25sccm of argon flow amount, Cu is 22 ~ 27nm/min, Ag
Sedimentation rate be 30 ~ 35nm/min.
8. the manufacture method of the micro- replica metal micro structure of precise electrotyping according to claim 1,6 or 7, it is characterised in that
Described conductive layer metallic film is Cu thin film or Ag thin film.
9. the manufacture method of the micro- replica metal micro structure of precise electrotyping according to claim 1, it is characterised in that step
（5）Described in electroforming solution be electroforming nickel solution or acid electroforming copper solution.
10. the manufacture method of the micro- replica metal micro structure of precise electrotyping according to claim 9, it is characterised in that electroforming
Nickel process conditions are：400 ~ 500g/L of nickel sulfamic acid, 30 ~ 50g/L of boric acid, wetting agent N-500 3ml/L, pH value be 3.5 ~
4.5th, temperature maintain 40 ~ 60 DEG C, forced convertion mode be filtration cycle, electric current density 1A/dm2；Acid electroforming process for copper bar
Part is：200 ~ 300g/L of copper sulfate, 60 ~ 70g/L of sulphuric acid, 0.1 ~ 0.2g/L of chloride ion, addition of C X910A 1ml/L, additive
MU 4ml/L, temperature are room temperature, magnetic agitation, electric current density 3A/dm2；During above-mentioned electroformed nickel process and acid copper electroforming
The pulse power, frequency 10kHz, 8 ~ 10 μm/h of electroformed nickel sedimentation rate, acid 30 ~ 35 μm/h of copper electroforming sedimentation rate are used.
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