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CN106531745A - Thin film transistor array substrate and liquid crystal panel - Google Patents

Thin film transistor array substrate and liquid crystal panel Download PDF

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Publication number
CN106531745A
CN106531745A CN201611049222.8A CN201611049222A CN106531745A CN 106531745 A CN106531745 A CN 106531745A CN 201611049222 A CN201611049222 A CN 201611049222A CN 106531745 A CN106531745 A CN 106531745A
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thin film
film transistor
tft
thin
film transistors
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CN106531745B (en
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李曼
黄俊宏
左清成
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Wuhan China Star Optoelectronics Technology Co Ltd
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Wuhan China Star Optoelectronics Technology Co Ltd
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    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10DINORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D86/00Integrated devices formed in or on insulating or conducting substrates, e.g. formed in silicon-on-insulator [SOI] substrates or on stainless steel or glass substrates
    • H10D86/40Integrated devices formed in or on insulating or conducting substrates, e.g. formed in silicon-on-insulator [SOI] substrates or on stainless steel or glass substrates characterised by multiple TFTs
    • H10D86/421Integrated devices formed in or on insulating or conducting substrates, e.g. formed in silicon-on-insulator [SOI] substrates or on stainless steel or glass substrates characterised by multiple TFTs having a particular composition, shape or crystalline structure of the active layer
    • GPHYSICS
    • G02OPTICS
    • G02FOPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
    • G02F1/00Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
    • G02F1/01Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour 
    • G02F1/13Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour  based on liquid crystals, e.g. single liquid crystal display cells
    • G02F1/133Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
    • G02F1/136Liquid crystal cells structurally associated with a semi-conducting layer or substrate, e.g. cells forming part of an integrated circuit
    • G02F1/1362Active matrix addressed cells
    • G02F1/13624Active matrix addressed cells having more than one switching element per pixel
    • GPHYSICS
    • G02OPTICS
    • G02FOPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
    • G02F1/00Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
    • G02F1/01Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour 
    • G02F1/13Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour  based on liquid crystals, e.g. single liquid crystal display cells
    • G02F1/133Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
    • G02F1/136Liquid crystal cells structurally associated with a semi-conducting layer or substrate, e.g. cells forming part of an integrated circuit
    • G02F1/1362Active matrix addressed cells
    • G02F1/1368Active matrix addressed cells in which the switching element is a three-electrode device
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10DINORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D62/00Semiconductor bodies, or regions thereof, of devices having potential barriers
    • H10D62/10Shapes, relative sizes or dispositions of the regions of the semiconductor bodies; Shapes of the semiconductor bodies
    • H10D62/17Semiconductor regions connected to electrodes not carrying current to be rectified, amplified or switched, e.g. channel regions
    • H10D62/213Channel regions of field-effect devices
    • H10D62/221Channel regions of field-effect devices of FETs
    • H10D62/235Channel regions of field-effect devices of FETs of IGFETs
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10DINORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D86/00Integrated devices formed in or on insulating or conducting substrates, e.g. formed in silicon-on-insulator [SOI] substrates or on stainless steel or glass substrates
    • H10D86/40Integrated devices formed in or on insulating or conducting substrates, e.g. formed in silicon-on-insulator [SOI] substrates or on stainless steel or glass substrates characterised by multiple TFTs
    • H10D86/60Integrated devices formed in or on insulating or conducting substrates, e.g. formed in silicon-on-insulator [SOI] substrates or on stainless steel or glass substrates characterised by multiple TFTs wherein the TFTs are in active matrices

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  • Physics & Mathematics (AREA)
  • Nonlinear Science (AREA)
  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Mathematical Physics (AREA)
  • Chemical & Material Sciences (AREA)
  • Crystallography & Structural Chemistry (AREA)
  • General Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Liquid Crystal (AREA)

Abstract

一种薄膜晶体管阵列基板,包括多组薄膜晶体管及多个RGB像素单元,一组薄膜晶体管对应一个RGB像素单元,每一组薄膜晶体管包括分别位于第一至第三行的三个薄膜晶体管,三个薄膜晶体管分别对应相应RGB像素单元中的R子像素、G子像素及B子像素,每一行中所有的薄膜晶体管的导电沟道的长宽比不完全相同,且均在预设比例范围内,以使得该行的总的漏电流在预设电流范围内。由于漏电流只与该薄膜晶体管的导电沟道的宽长比相关,宽长比W/L越大则漏极电流越大,宽长比越小则漏极电流越小。因此,本发明避免驱动芯片输出的控制信号出现毛刺,提高了液晶面板的显示质量,避免了噪声,而且还降低了显示模组的功耗。本发明还提供一种液晶面板。

A thin film transistor array substrate, including multiple groups of thin film transistors and multiple RGB pixel units, one group of thin film transistors corresponds to one RGB pixel unit, each group of thin film transistors includes three thin film transistors respectively located in the first to third rows, three The thin film transistors respectively correspond to the R sub-pixel, G sub-pixel and B sub-pixel in the corresponding RGB pixel unit, and the aspect ratios of the conductive channels of all the thin film transistors in each row are not exactly the same, and are all within the preset ratio range , so that the total leakage current of the row is within the preset current range. Since the leakage current is only related to the width-to-length ratio of the conductive channel of the thin film transistor, the greater the width-to-length ratio W/L, the greater the drain current, and the smaller the width-to-length ratio, the smaller the drain current. Therefore, the present invention avoids burrs in the control signal output by the driving chip, improves the display quality of the liquid crystal panel, avoids noise, and reduces the power consumption of the display module. The invention also provides a liquid crystal panel.

Description

一种薄膜晶体管阵列基板及液晶面板A kind of thin film transistor array substrate and liquid crystal panel

技术领域technical field

本发明涉及一种显示技术领域,尤其是涉及一种电压输出控制电路及液晶显示器。The invention relates to the field of display technology, in particular to a voltage output control circuit and a liquid crystal display.

背景技术Background technique

随着中小尺寸电子显示行业日新月异的发展,人们对中小尺寸LCD液晶显示屏的分辨率等品质要求也越来高。显示品质的提高与显示数据的传输速率和信号的完整性都有着密不可分的联系。对于目前中小尺寸LCD显示屏,在栅极开启的时间周期内,分别同时开启所有的多路复用器,以完成RGB子像素的充电。但当所有的多路复用器开启的同时,会导致显示模组瞬间对液晶面板驱动芯片形成一个较大的抽载,从而会导致驱动芯片输出的控制信号出现毛刺,不仅会影响显示质量,产生噪声,而且也会增加显示模组的功耗。With the rapid development of the small and medium-sized electronic display industry, people have higher and higher requirements for the resolution and other quality of small and medium-sized LCD liquid crystal displays. The improvement of the display quality is closely related to the transmission rate of the display data and the integrity of the signal. For the current small and medium-sized LCD display screens, all the multiplexers are simultaneously turned on during the time period when the gates are turned on, so as to complete the charging of the RGB sub-pixels. But when all the multiplexers are turned on, it will cause the display module to instantly form a large pumping load on the LCD panel driver chip, which will cause glitches in the control signal output by the driver chip, which will not only affect the display quality, Noise is generated, and power consumption of the display module is also increased.

发明内容Contents of the invention

本发明的目的在于提供一种薄膜晶体管阵列基板,以提高显示质量,避免产生噪声,且降低显示模组的功耗。The object of the present invention is to provide a thin film transistor array substrate to improve display quality, avoid noise generation, and reduce power consumption of a display module.

本发明的另一目的在于提供一种液晶面板。Another object of the present invention is to provide a liquid crystal panel.

为了实现上述目的,本发明实施方式提供如下技术方案:In order to achieve the above object, the embodiment of the present invention provides the following technical solutions:

本发明提供一种薄膜晶体管阵列基板,包括多组薄膜晶体管及多个RGB像素单元,一组薄膜晶体管对应一个RGB像素单元,每一组薄膜晶体管包括分别位于第一至第三行的三个薄膜晶体管,三个薄膜晶体管分别对应相应RGB像素单元中的R子像素、G子像素及B子像素,每一行中所有的薄膜晶体管的导电沟道的长宽比不完全相同,且均在预设比例范围内,以使得该行的总的漏电流在预设电流范围内。The present invention provides a thin-film transistor array substrate, including multiple sets of thin-film transistors and multiple RGB pixel units, one set of thin-film transistors corresponds to one RGB pixel unit, and each set of thin-film transistors includes three thin-film transistors respectively located in the first to third rows Transistors, the three thin film transistors correspond to the R sub-pixels, G sub-pixels and B sub-pixels in the corresponding RGB pixel units. within the proportional range, so that the total leakage current of this line is within the preset current range.

其中,在第一行薄膜晶体管中,相邻两个薄膜晶体管的导电沟道的长宽比不同。Wherein, in the first row of thin film transistors, the aspect ratios of the conduction channels of two adjacent thin film transistors are different.

其中,第一行薄膜晶体管包括2N个薄膜晶体管,N为自然数,第2N个薄膜晶体管的导电沟通的长宽比相同。Wherein, the first row of thin film transistors includes 2N thin film transistors, N is a natural number, and the length-to-width ratios of the 2Nth thin film transistors are the same.

其中,第2N-1个薄膜晶体管的导电沟通的长宽比相同,且与第2N个薄膜晶体管的导电沟通的长宽比不同。Wherein, the aspect ratio of the conductive communication of the 2N-1th thin film transistor is the same, and is different from the aspect ratio of the conductive communication of the 2Nth thin film transistor.

其中,在第二行薄膜晶体管中,相邻两个薄膜晶体管的导电沟道的长宽比不同。Wherein, in the second row of thin film transistors, the aspect ratios of the conduction channels of two adjacent thin film transistors are different.

其中,第二行薄膜晶体管包括2N个薄膜晶体管,N为自然数,第2N个薄膜晶体管的导电沟通的长宽比相同。Wherein, the second row of thin film transistors includes 2N thin film transistors, N is a natural number, and the aspect ratio of the conductive communication of the 2Nth thin film transistors is the same.

其中,第2N-1个薄膜晶体管的导电沟通的长宽比相同。Wherein, the aspect ratios of the conduction communication of the 2N-1th thin film transistors are the same.

其中,在第三行薄膜晶体管中,相邻两个薄膜晶体管的导电沟道的长宽比不同。Wherein, in the third row of thin film transistors, the aspect ratios of the conduction channels of two adjacent thin film transistors are different.

其中,第三行薄膜晶体管包括2N个薄膜晶体管,N为自然数,第2N个薄膜晶体管的导电沟通的长宽比相同。Wherein, the third row of thin film transistors includes 2N thin film transistors, N is a natural number, and the aspect ratios of the 2Nth thin film transistors are the same.

其中,第2N-1个薄膜晶体管的导电沟通的长宽比相同。Wherein, the aspect ratios of the conduction communication of the 2N-1th thin film transistors are the same.

本发明还提供一种液晶面板,包括上述的薄膜晶体管阵列基板、液晶及彩膜基板。The present invention also provides a liquid crystal panel, including the above thin film transistor array substrate, liquid crystal and color filter substrate.

本发明实施例具有如下优点或有益效果:Embodiments of the present invention have the following advantages or beneficial effects:

本发明的薄膜晶体管阵列基板,包括多组薄膜晶体管及多个RGB像素单元,一组薄膜晶体管对应一个RGB像素单元,每一组薄膜晶体管包括分别位于第一至第三行的三个薄膜晶体管,三个薄膜晶体管分别对应相应RGB像素单元中的R子像素、G子像素及B子像素,每一行中所有的薄膜晶体管的导电沟道的长宽比不完全相同,且均在预设比例范围内,以使得该行的总的漏电流在预设电流范围内。由于漏电流只与该薄膜晶体管的导电沟道的宽长比相关,宽长比W/L越大则漏极电流越大,宽长比越小则漏极电流越小。因此,本实施例通过改变对应R子像素、G子像素及B子像素的相应行的薄膜晶体管的长宽比,可以调节该行的总的漏电流在预设电流范围(即为减小该行的总的漏电流的大小,但还大于一个电流阈值),这样可以在不影响显示效果的前提下,使驱动芯片不再形成一个较大的抽载,避免驱动芯片输出的控制信号出现毛刺,从而提高了液晶面板的显示质量,避免了噪声,而且还降低了显示模组的功耗。The thin film transistor array substrate of the present invention includes multiple groups of thin film transistors and multiple RGB pixel units, one group of thin film transistors corresponds to one RGB pixel unit, and each group of thin film transistors includes three thin film transistors respectively located in the first to third rows, The three thin film transistors correspond to the R sub-pixels, G sub-pixels and B sub-pixels in the corresponding RGB pixel units, and the aspect ratios of the conductive channels of all the thin film transistors in each row are not exactly the same, and are all within the preset ratio range within, so that the total leakage current of the row is within the preset current range. Since the leakage current is only related to the width-to-length ratio of the conductive channel of the thin film transistor, the greater the width-to-length ratio W/L, the greater the drain current, and the smaller the width-to-length ratio, the smaller the drain current. Therefore, in this embodiment, by changing the aspect ratio of the thin film transistors in the corresponding row corresponding to the R sub-pixel, the G sub-pixel and the B sub-pixel, the total leakage current of the row can be adjusted within the preset current range (that is, to reduce the The size of the total leakage current of the row, but still greater than a current threshold), so that the driver chip will no longer form a large pumping load without affecting the display effect, and avoid glitches in the control signal output by the driver chip , thereby improving the display quality of the liquid crystal panel, avoiding noise, and reducing the power consumption of the display module.

附图说明Description of drawings

为了更清楚地说明本发明实施例或现有技术中的技术方案,下面将对实施例或现有技术描述中所需要使用的附图作简单地介绍,显而易见地,下面描述中的附图仅仅是本发明的一些实施例,对于本领域普通技术人员来讲,在不付出创造性劳动的前提下,还可以根据这些附图获得其他的附图。In order to more clearly illustrate the technical solutions in the embodiments of the present invention or the prior art, the following will briefly introduce the drawings that need to be used in the description of the embodiments or the prior art. Obviously, the accompanying drawings in the following description are only These are some embodiments of the present invention. Those skilled in the art can also obtain other drawings based on these drawings without creative work.

图1是本发明第一方案实施例提供的一种薄膜晶体管阵列基板的电路图。FIG. 1 is a circuit diagram of a thin film transistor array substrate provided by a first solution embodiment of the present invention.

图2是图1中薄膜晶体管的剖面俯视图。FIG. 2 is a cross-sectional top view of the thin film transistor in FIG. 1 .

图3是图1中薄膜晶体管的剖面排布俯视图。FIG. 3 is a top view of the cross-sectional arrangement of the thin film transistor in FIG. 1 .

具体实施方式detailed description

下面将结合本发明实施例中的附图,对本发明实施例中的技术方案进行清楚、完整地描述,显然,所描述的实施例仅仅是本发明的一部分实施例,而不是全部的实施例。基于本发明中的实施例,本领域普通技术人员在没有做出创造性劳动的前提下所获得的所有其它实施例,都属于本发明保护的范围。The following will clearly and completely describe the technical solutions in the embodiments of the present invention with reference to the accompanying drawings in the embodiments of the present invention. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of them. Based on the embodiments of the present invention, all other embodiments obtained by persons of ordinary skill in the art without making creative efforts belong to the protection scope of the present invention.

此外,以下各实施例的说明是参考附加的图示,用以例示本发明可用以实施的特定实施例。本发明中所提到的方向用语,例如,“上”、“下”、“前”、“后”、“左”、“右”、“内”、“外”、“侧面”等,仅是参考附加图式的方向,因此,使用的方向用语是为了更好、更清楚地说明及理解本发明,而不是指示或暗指所指的装置或元件必须具有特定的方位、以特定的方位构造和操作,因此不能理解为对本发明的限制。In addition, the following descriptions of the various embodiments refer to the attached drawings to illustrate specific embodiments in which the present invention can be implemented. The directional terms mentioned in the present invention, for example, "upper", "lower", "front", "rear", "left", "right", "inner", "outer", "side", etc., only is to refer to the direction of the attached drawings. Therefore, the direction terms used are for better and more clearly explaining and understanding the present invention, rather than indicating or implying that the device or element referred to must have a specific orientation, use a specific orientation construction and operation, therefore, should not be construed as limiting the invention.

在本发明的描述中,需要说明的是,除非另有明确的规定和限定,术语“安装”、“相连”、“连接”应做广义理解,例如,可以是固定连接,也可以是可拆卸地连接,或者一体地连接;可以是机械连接;可以是直接相连,也可以通过中间媒介间接相连,可以是两个元件内部的连通。对于本领域的普通技术人员而言,可以具体情况理解上述术语在本发明中的具体含义。In the description of the present invention, it should be noted that unless otherwise specified and limited, the terms "installation", "connection" and "connection" should be understood in a broad sense, for example, it can be a fixed connection or a detachable connection. Ground connection, or integral connection; can be mechanical connection; can be directly connected, can also be indirectly connected through an intermediary, and can be internal communication between two components. Those of ordinary skill in the art can understand the specific meanings of the above terms in the present invention in specific situations.

此外,在本发明的描述中,除非另有说明,“多个”的含义是两个或两个以上。若本说明书中出现“工序”的用语,其不仅是指独立的工序,在与其它工序无法明确区别时,只要能实现该工序所预期的作用则也包括在本用语中。另外,本说明书中用“~”表示的数值范围是指将“~”前后记载的数值分别作为最小值及最大值包括在内的范围。在附图中,结构相似或相同的用相同的标号表示。In addition, in the description of the present invention, unless otherwise specified, "plurality" means two or more. If the term "process" appears in this specification, it not only refers to an independent process, but also includes in this term as long as it can realize the expected function of the process when it cannot be clearly distinguished from other processes. In addition, the numerical range represented by "-" in this specification means the range which includes the numerical value described before and after "-" as a minimum value and a maximum value, respectively. In the drawings, those with similar or identical structures are denoted by the same reference numerals.

请参阅图1-图2,本发明第一方案实施例提供一种薄膜晶体管阵列基板100。所述薄膜晶体管阵列基板100包括多组薄膜晶体管10及多个RGB像素单元20,一组薄膜晶体管10对应一个RGB像素单元20,每一组薄膜晶体管包括分别位于第一至第三行的三个薄膜晶体管11、12及13,三个薄膜晶体管11、12及13分别对应相应RGB像素单元中的R子像素、G子像素及B子像素,每一行中所有的薄膜晶体管的导电沟道的长宽比W/L不完全相同,且均在预设比例范围内,以使得该行的总的漏电流在预设电流范围内。Please refer to FIG. 1-FIG. 2 , the embodiment of the first solution of the present invention provides a thin film transistor array substrate 100 . The thin film transistor array substrate 100 includes multiple sets of thin film transistors 10 and multiple RGB pixel units 20, one set of thin film transistors 10 corresponds to one RGB pixel unit 20, and each set of thin film transistors includes three transistors respectively located in the first to third rows. Thin film transistors 11, 12 and 13, the three thin film transistors 11, 12 and 13 respectively correspond to the R sub-pixel, G sub-pixel and B sub-pixel in the corresponding RGB pixel unit, the length of the conductive channel of all the thin film transistors in each row The width ratios W/L are not all the same, and are all within a preset ratio range, so that the total leakage current of the row is within a preset current range.

需要说明的是,第一行的薄膜晶体管11对应所有的R子像素,第二行的薄膜晶体管12对应所有的G子像素,第三行的薄膜晶体管13对应所有的R子像素。其中,每一行的总的漏电流为该行中的每一个薄膜晶体管的漏电流之和。每一个薄膜晶体管的漏电流为Id=0.5*K*W/L*(Vgs-Vth)^2(其中K、Vth都是只与薄膜晶体管的材料相关的常数)可知,当给薄膜晶体管的Vgs一定时,其漏极电流Id只与该薄膜晶体管的导电沟道的宽长比W/L相关,宽长比W/L越大则漏极电流Id越大,宽长比W/L越小则漏极电流Id越小。因此,本实施例通过改变对应R子像素、G子像素及B子像素的相应行的薄膜晶体管的长宽比,可以调节该行的总的漏电流在预设电流范围(即为减小该行的总的漏电流的大小,但还大于一个电流阈值),这样可以在不影响显示效果的前提下,使驱动芯片不再形成一个较大的抽载,避免驱动芯片输出的控制信号出现毛刺,从而提高了液晶面板的显示质量,避免了噪声,而且还降低了显示模组的功耗。It should be noted that the TFTs 11 in the first row correspond to all R sub-pixels, the TFTs 12 in the second row correspond to all G sub-pixels, and the TFTs 13 in the third row correspond to all R sub-pixels. Wherein, the total leakage current of each row is the sum of the leakage currents of each thin film transistor in the row. The leakage current of each thin film transistor is Id=0.5*K*W/L*(Vgs-Vth)^2 (wherein K and Vth are constants only related to the material of the thin film transistor), it can be seen that when the Vgs of the thin film transistor At a certain time, the drain current Id is only related to the width-to-length ratio W/L of the conductive channel of the thin film transistor. The larger the width-to-length ratio W/L, the greater the drain current Id, and the smaller the width-to-length ratio W/L Then the drain current Id is smaller. Therefore, in this embodiment, by changing the aspect ratio of the thin film transistors in the corresponding row corresponding to the R sub-pixel, the G sub-pixel and the B sub-pixel, the total leakage current of the row can be adjusted within the preset current range (that is, to reduce the The size of the total leakage current of the row, but still greater than a current threshold), so that the driver chip will no longer form a large pumping load without affecting the display effect, and avoid glitches in the control signal output by the driver chip , thereby improving the display quality of the liquid crystal panel, avoiding noise, and reducing the power consumption of the display module.

请参阅图3,在本实施例中,在第一行薄膜晶体管11中,相邻两个薄膜晶体管11的导电沟道的长宽比W/L不同。Referring to FIG. 3 , in this embodiment, in the first row of thin film transistors 11 , the aspect ratio W/L of the conductive channels of two adjacent thin film transistors 11 is different.

具体地,第一行薄膜晶体管11包括2N个薄膜晶体管,N为自然数,第2N个薄膜晶体管11的导电沟通的长宽比W/L相同。Specifically, the first row of thin film transistors 11 includes 2N thin film transistors, where N is a natural number, and the aspect ratio W/L of the conductive communication of the 2Nth thin film transistors 11 is the same.

需要说明的是,在第一行的薄膜晶体管11中,第二、四、六等偶数位置上的薄膜晶体管11的导电沟道的长宽比W/L相同。It should be noted that, among the thin film transistors 11 in the first row, the aspect ratio W/L of the conduction channels of the thin film transistors 11 at the second, fourth, sixth and other even-numbered positions is the same.

第2N-1个薄膜晶体管11的导电沟通的长宽比相同,且与第2N个薄膜晶体管11的导电沟通的长宽比不同。The aspect ratio of the conductive communication of the 2N−1th thin film transistor 11 is the same, and different from the aspect ratio of the conductive communication of the 2Nth thin film transistor 11 .

需要说明的是,在第一行的薄膜晶体管11中,第一、三、五等奇数位置上的薄膜晶体管11的导电沟道的长宽比W/L相同,且与偶数位置上的薄膜晶体管11的导电沟道的长宽比不同。这样,在第一行薄膜晶体管11中,薄膜晶体管11的导电沟道的长宽比呈现大、小、大、小依次重复上述状态的排列状况,或呈现小、大、小、大依次重复上述状态的排列状况。在本实施例中,所述第2N个薄膜晶体管11的导电沟通的长宽大于第2N-1个薄膜晶体管11的导电沟通的长宽比。It should be noted that, among the thin film transistors 11 in the first row, the aspect ratio W/L of the conduction channel of the thin film transistors 11 at the first, third, fifth, etc. odd-numbered positions is the same as that of the thin film transistors at the even-numbered positions. The aspect ratios of the conductive channels of 11 are different. In this way, in the first row of thin film transistors 11, the aspect ratio of the conductive channel of the thin film transistors 11 presents the arrangement state of large, small, large, small and repeats the above states in sequence, or presents small, large, small, large and repeats the above states in sequence. The order of the states. In this embodiment, the aspect ratio of the conductive communication of the 2Nth thin film transistor 11 is greater than the aspect ratio of the conductive communication of the 2N−1th thin film transistor 11 .

在本实施例中,所述第二行的薄膜晶体管12也与第一行的薄膜晶体管11结构及呈现的排列状况相同。具体为:In this embodiment, the thin film transistors 12 in the second row are also the same in structure and arrangement as the thin film transistors 11 in the first row. Specifically:

在第二的行薄膜晶体管12中,相邻两个薄膜晶体管12的导电沟道的长宽比W/L不同。In the second row of thin film transistors 12 , the aspect ratio W/L of the conduction channels of two adjacent thin film transistors 12 is different.

具体地,第二行薄膜晶体管12包括2N个薄膜晶体管,N为自然数,第2N个薄膜晶体管12的导电沟通的长宽比W/L相同。Specifically, the second row of thin film transistors 12 includes 2N thin film transistors, where N is a natural number, and the aspect ratio W/L of the conductive communication of the 2Nth thin film transistors 12 is the same.

需要说明的是,在第二行的薄膜晶体管12中,第二、四、六等偶数位置上的薄膜晶体管12的导电沟道的长宽比W/L相同。It should be noted that, among the thin film transistors 12 in the second row, the aspect ratio W/L of the conduction channels of the thin film transistors 12 at the second, fourth, sixth and other even-numbered positions is the same.

第2N-1个薄膜晶体管12的导电沟通的长宽比相同,且与第2N个薄膜晶体管12的导电沟通的长宽比不同。The aspect ratio of the conductive communication of the 2N−1th thin film transistor 12 is the same, and different from the aspect ratio of the conductive communication of the 2Nth thin film transistor 12 .

需要说明的是,在第二行的薄膜晶体管12中,第一、三、五等奇数位置上的薄膜晶体管12的导电沟道的长宽比W/L相同,且与偶数位置上的薄膜晶体管12的导电沟道的长宽比不同。这样,在第二行薄膜晶体管12中,薄膜晶体管12的导电沟道的长宽比呈现大、小、大、小依次重复上述状态的排列状况,或呈现小、大、小、大依次重复上述状态的排列状况。It should be noted that, among the thin film transistors 12 in the second row, the aspect ratio W/L of the conduction channel of the thin film transistors 12 at the first, third, fifth, etc. odd-numbered positions is the same as that of the thin film transistors at the even-numbered positions. The aspect ratios of the conductive channels of 12 are different. In this way, in the second row of thin film transistors 12, the aspect ratio of the conductive channel of the thin film transistors 12 presents the arrangement state of large, small, large, small and repeats the above states in sequence, or presents small, large, small, large and repeats the above states in sequence. The order of the states.

在本实施例中,所述第三行薄膜晶体管13的结构及排布方式与所述第一及第二行的薄膜晶体管11及12相同。具体为:In this embodiment, the structure and arrangement of the thin film transistors 13 in the third row are the same as those of the thin film transistors 11 and 12 in the first and second rows. Specifically:

在第三行薄膜晶体管13中,相邻两个薄膜晶体管13的导电沟道的长宽比不同。In the third row of thin film transistors 13 , the aspect ratios of the conductive channels of two adjacent thin film transistors 13 are different.

需要说明的是,在第三行的薄膜晶体管13中,第二、四、六等偶数位置上的薄膜晶体管13的导电沟道的长宽比W/L相同。It should be noted that, among the thin film transistors 13 in the third row, the aspect ratio W/L of the conductive channels of the thin film transistors 13 at the second, fourth, sixth and other even-numbered positions is the same.

第2N-1个薄膜晶体管13的导电沟通的长宽比相同,且与第2N个薄膜晶体管13的导电沟通的长宽比不同。The aspect ratio of the conductive communication of the 2N−1th thin film transistor 13 is the same, and different from the aspect ratio of the conductive communication of the 2Nth thin film transistor 13 .

需要说明的是,在第三行的薄膜晶体管13中,第一、三、五等奇数位置上的薄膜晶体管13的导电沟道的长宽比W/L相同,且与偶数位置上的薄膜晶体管13的导电沟道的长宽比不同。这样,在第二行薄膜晶体管13中,薄膜晶体管13的导电沟道的长宽比呈现大、小、大、小依次重复上述状态的排列状况,或呈现小、大、小、大依次重复上述状态的排列状况。It should be noted that, among the thin film transistors 13 in the third row, the aspect ratio W/L of the conduction channel of the thin film transistors 13 at the first, third, fifth, etc. odd-numbered positions is the same as that of the thin film transistors at even-numbered positions The aspect ratios of the conductive channels of 13 are different. In this way, in the second row of thin film transistors 13, the aspect ratio of the conductive channel of the thin film transistors 13 presents the arrangement state of large, small, large, small and repeats the above states in sequence, or presents small, large, small, large and repeats the above states in sequence. The order of the states.

在其他实施例中,由于每一行的薄膜晶体管都是相互独立的,所述第一至第三行的薄膜晶体管11-13可以结构和排布方式上不同。只要满足,每一行中所有的薄膜晶体管的导电沟道的长宽比W/L不完全相同,且均在预设比例范围内,以使得该行的总的漏电流在预设电流范围内即可。In other embodiments, since the thin film transistors in each row are independent of each other, the thin film transistors 11 - 13 in the first to third rows may be different in structure and arrangement. As long as it is satisfied, the aspect ratio W/L of the conduction channel of all thin film transistors in each row is not exactly the same, and they are all within the preset ratio range, so that the total leakage current of the row is within the preset current range. Can.

本发明第二方案实施例提供一种液晶面板400。所述液晶面板400包括薄膜晶体管阵列基板、液晶410及彩膜基板420。其中,所述薄膜晶体管阵列基板为上述第一方案实施例中提供的薄膜晶体管阵列基板100。由于薄膜晶体管阵列基板100已在第一方案中进行了详细地描述,故在此不再赘述。The embodiment of the second solution of the present invention provides a liquid crystal panel 400 . The liquid crystal panel 400 includes a thin film transistor array substrate, a liquid crystal 410 and a color filter substrate 420 . Wherein, the thin film transistor array substrate is the thin film transistor array substrate 100 provided in the first solution embodiment above. Since the thin film transistor array substrate 100 has been described in detail in the first solution, it will not be repeated here.

在本实施例中,所述液晶面板400包括所述薄膜晶体管阵列基板100。所述薄膜晶体管阵列基板100包括多组薄膜晶体管10及多个RGB像素单元20,一组薄膜晶体管10对应一个RGB像素单元20,每一组薄膜晶体管包括分别位于第一至第三行的三个薄膜晶体管11、12及13,三个薄膜晶体管11、12及13分别对应相应RGB像素单元中的R子像素、G子像素及B子像素,每一行中所有的薄膜晶体管的导电沟道的长宽比W/L不完全相同,且均在预设比例范围内,以使得该行的总的漏电流在预设电流范围内。In this embodiment, the liquid crystal panel 400 includes the thin film transistor array substrate 100 . The thin film transistor array substrate 100 includes multiple sets of thin film transistors 10 and multiple RGB pixel units 20, one set of thin film transistors 10 corresponds to one RGB pixel unit 20, and each set of thin film transistors includes three transistors respectively located in the first to third rows. Thin film transistors 11, 12 and 13, the three thin film transistors 11, 12 and 13 respectively correspond to the R sub-pixel, G sub-pixel and B sub-pixel in the corresponding RGB pixel unit, the length of the conductive channel of all the thin film transistors in each row The width ratios W/L are not all the same, and are all within a preset ratio range, so that the total leakage current of the row is within a preset current range.

需要说明的是,第一行的薄膜晶体管11对应所有的R子像素,第二行的薄膜晶体管12对应所有的G子像素,第三行的薄膜晶体管13对应所有的R子像素。其中,每一行的总的漏电流为该行中的每一个薄膜晶体管的漏电流之和。每一个薄膜晶体管的漏电流为Id=0.5*K*W/L*(Vgs-Vth)^2(其中K、Vth都是只与薄膜晶体管的材料相关的常数)可知,当给薄膜晶体管的Vgs一定时,其漏极电流Id只与该薄膜晶体管的导电沟道的宽长比W/L相关,宽长比W/L越大则漏极电流Id越大,宽长比W/L越小则漏极电流Id越小。因此,本实施例通过改变对应R子像素、G子像素及B子像素的相应行的薄膜晶体管的长宽比,可以减小该行的总的漏电流的大小,但还大于一个电流阈值,这样可以在不影响显示效果的前提下,使驱动芯片不再形成一个较大的抽载,避免驱动芯片输出的控制信号出现毛刺,从而提高了液晶面板的显示质量,避免了噪声,而且还降低了显示模组的功耗。It should be noted that the TFTs 11 in the first row correspond to all R sub-pixels, the TFTs 12 in the second row correspond to all G sub-pixels, and the TFTs 13 in the third row correspond to all R sub-pixels. Wherein, the total leakage current of each row is the sum of the leakage currents of each thin film transistor in the row. The leakage current of each thin film transistor is Id=0.5*K*W/L*(Vgs-Vth)^2 (wherein K and Vth are constants only related to the material of the thin film transistor), it can be seen that when the Vgs of the thin film transistor At a certain time, the drain current Id is only related to the width-to-length ratio W/L of the conductive channel of the thin film transistor. The larger the width-to-length ratio W/L, the greater the drain current Id, and the smaller the width-to-length ratio W/L Then the drain current Id is smaller. Therefore, in this embodiment, by changing the aspect ratio of the thin film transistors in the row corresponding to the R sub-pixel, the G sub-pixel and the B sub-pixel, the total leakage current of the row can be reduced, but it is still greater than a current threshold. In this way, on the premise of not affecting the display effect, the driver chip no longer forms a large pumping load, and avoids glitches in the control signal output by the driver chip, thereby improving the display quality of the LCD panel, avoiding noise, and reducing Indicates the power consumption of the display module.

在本说明书的描述中,参考术语“一个实施例”、“一些实施例”、“示例”、“具体示例”或“一些示例”等的描述意指结合该实施例或示例描述的具体特征、结构、材料或者特点包含于本发明的至少一个实施例或示例中。在本说明书中,对上述术语的示意性表述不一定指的是相同的实施例或示例。而且,描述的具体特征、结构、材料或特点可以在任何的一个或多个实施例或示例中以合适的方式结合。In the description of this specification, descriptions referring to the terms "one embodiment", "some embodiments", "example", "specific examples" or "some examples" mean specific features described in connection with the embodiment or example, A structure, material or characteristic is included in at least one embodiment or example of the invention. In this specification, schematic representations of the above terms do not necessarily refer to the same embodiment or example. Furthermore, the specific features, structures, materials or characteristics described may be combined in any suitable manner in any one or more embodiments or examples.

以上所述的实施方式,并不构成对该技术方案保护范围的限定。任何在上述实施方式的精神和原则之内所作的修改、等同替换和改进等,均应包含在该技术方案的保护范围之内。The implementation methods described above do not constitute a limitation to the scope of protection of the technical solution. Any modifications, equivalent replacements and improvements made within the spirit and principles of the above implementation methods shall be included in the protection scope of the technical solution.

Claims (11)

1. a kind of thin-film transistor array base-plate, it is characterised in that:The thin-film transistor array base-plate includes that many cluster films are brilliant Body pipe and multiple rgb pixel units, a cluster film transistor one rgb pixel unit of correspondence, each cluster film transistor include Respectively positioned at three thin film transistor (TFT)s of the first to the third line, three thin film transistor (TFT)s are corresponded in corresponding rgb pixel unit respectively R sub-pixels, G sub-pixel and B sub-pixels, per a line in all of thin film transistor (TFT) conducting channel the incomplete phase of length-width ratio Together, and in the range of preset ratio, so that total leakage current of the row is in the range of predetermined current.
2. thin-film transistor array base-plate as claimed in claim 1, it is characterised in that in the first row thin film transistor (TFT), phase The length-width ratio of the conducting channel of adjacent two thin film transistor (TFT)s is different.
3. thin-film transistor array base-plate as claimed in claim 2, it is characterised in that the first row thin film transistor (TFT) includes 2N Thin film transistor (TFT), N is natural number, and the length-width ratio of the conductive communication of 2N thin film transistor (TFT) is identical.
4. thin-film transistor array base-plate as claimed in claim 3, it is characterised in that the conduction of 2N-1 thin film transistor (TFT) The length-width ratio of communication is identical, and different from the length-width ratio of the conductive communication of 2N thin film transistor (TFT).
5. thin-film transistor array base-plate as claimed in claim 1, it is characterised in that in the second row thin film transistor (TFT), phase The length-width ratio of the conducting channel of adjacent two thin film transistor (TFT)s is different.
6. thin-film transistor array base-plate as claimed in claim 5, it is characterised in that the second row thin film transistor (TFT) includes 2N Thin film transistor (TFT), N is natural number, and the length-width ratio of the conductive communication of 2N thin film transistor (TFT) is identical.
7. thin-film transistor array base-plate as claimed in claim 6, it is characterised in that the conduction of 2N-1 thin film transistor (TFT) The length-width ratio of communication is identical.
8. thin-film transistor array base-plate as claimed in claim 1, it is characterised in that in the third line thin film transistor (TFT), phase The length-width ratio of the conducting channel of adjacent two thin film transistor (TFT)s is different.
9. thin-film transistor array base-plate as claimed in claim 8, it is characterised in that the third line thin film transistor (TFT) includes 2N Thin film transistor (TFT), N is natural number, and the length-width ratio of the conductive communication of 2N thin film transistor (TFT) is identical.
10. thin-film transistor array base-plate as claimed in claim 9, it is characterised in that 2N-1 thin film transistor (TFT) is led The length-width ratio that electricity is linked up is identical.
11. a kind of liquid crystal panels, including the thin-film transistor array base-plate as described in any one of claim 1-10, liquid crystal and coloured silk Ilm substrate.
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Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN107134258A (en) * 2017-06-26 2017-09-05 京东方科技集团股份有限公司 OLED compensation circuit and preparation method thereof, OLED compensation device and display device
CN109671407A (en) * 2019-01-14 2019-04-23 惠科股份有限公司 Array substrate, display panel and display device
WO2020062871A1 (en) * 2018-09-29 2020-04-02 Boe Technology Group Co., Ltd. Thin film transistor, gate driver circuit and display apparatus

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20030090603A1 (en) * 2001-10-29 2003-05-15 Lg.Philips Lcd Co., Ltd. Substrate structure of a liquid crystal display device
US20060290630A1 (en) * 2005-06-28 2006-12-28 Lg.Philips Lcd Co., Ltd. Liquid crystal display device
CN103969875A (en) * 2014-05-04 2014-08-06 京东方科技集团股份有限公司 Display substrate, manufacturing method of display substrate, mask plate and mask plate set
CN104465669A (en) * 2014-12-04 2015-03-25 京东方科技集团股份有限公司 Array substrate, manufacturing method of array substrate and display device
CN104656334A (en) * 2015-03-20 2015-05-27 京东方科技集团股份有限公司 Array substrate and display device

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20030090603A1 (en) * 2001-10-29 2003-05-15 Lg.Philips Lcd Co., Ltd. Substrate structure of a liquid crystal display device
US20060290630A1 (en) * 2005-06-28 2006-12-28 Lg.Philips Lcd Co., Ltd. Liquid crystal display device
CN103969875A (en) * 2014-05-04 2014-08-06 京东方科技集团股份有限公司 Display substrate, manufacturing method of display substrate, mask plate and mask plate set
CN104465669A (en) * 2014-12-04 2015-03-25 京东方科技集团股份有限公司 Array substrate, manufacturing method of array substrate and display device
CN104656334A (en) * 2015-03-20 2015-05-27 京东方科技集团股份有限公司 Array substrate and display device

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN107134258A (en) * 2017-06-26 2017-09-05 京东方科技集团股份有限公司 OLED compensation circuit and preparation method thereof, OLED compensation device and display device
WO2020062871A1 (en) * 2018-09-29 2020-04-02 Boe Technology Group Co., Ltd. Thin film transistor, gate driver circuit and display apparatus
US11183142B2 (en) 2018-09-29 2021-11-23 Boe Technology Group Co., Ltd. Thin film transistor, gate driver circuit and display apparatus
CN109671407A (en) * 2019-01-14 2019-04-23 惠科股份有限公司 Array substrate, display panel and display device
CN109671407B (en) * 2019-01-14 2020-12-29 惠科股份有限公司 Array substrate, display panel and display device

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