CN106531671A - Wafer transmission mechanism arm of prober - Google Patents
Wafer transmission mechanism arm of prober Download PDFInfo
- Publication number
- CN106531671A CN106531671A CN201510697234.0A CN201510697234A CN106531671A CN 106531671 A CN106531671 A CN 106531671A CN 201510697234 A CN201510697234 A CN 201510697234A CN 106531671 A CN106531671 A CN 106531671A
- Authority
- CN
- China
- Prior art keywords
- mechanical
- mechanical hand
- wafer
- fingers
- finger
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Withdrawn
Links
- 230000005540 biological transmission Effects 0.000 title abstract description 10
- 210000004247 hand Anatomy 0.000 claims description 15
- 238000012546 transfer Methods 0.000 claims description 14
- 239000000919 ceramic Substances 0.000 claims description 9
- 239000002184 metal Substances 0.000 claims description 3
- 238000007789 sealing Methods 0.000 claims description 3
- 238000013461 design Methods 0.000 abstract description 7
- 238000004519 manufacturing process Methods 0.000 abstract description 7
- 238000006243 chemical reaction Methods 0.000 abstract description 3
- 239000004065 semiconductor Substances 0.000 abstract description 3
- 238000012360 testing method Methods 0.000 description 7
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 3
- 229910052710 silicon Inorganic materials 0.000 description 3
- 239000010703 silicon Substances 0.000 description 3
- 239000000126 substance Substances 0.000 description 3
- 239000013078 crystal Substances 0.000 description 2
- 238000000034 method Methods 0.000 description 2
- 230000009286 beneficial effect Effects 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000005538 encapsulation Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 230000007849 functional defect Effects 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 239000000523 sample Substances 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/6838—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping with gripping and holding devices using a vacuum; Bernoulli devices
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Testing Or Measuring Of Semiconductors Or The Like (AREA)
Abstract
The invention discloses a wafer transmission mechanism arm of a prober and relates to the technical field of semiconductor manufacturing equipment. The wafer transmission mechanism arm comprises a bracket and a mechanical hand, wherein the mechanical hand is fixedly connected with the bracket and comprises a mechanical palm and mechanical fingers; the mechanical fingers include two mechanical hand inner fingers and two mechanical hand outer fingers; the distance between the two mechanical hand inner fingers is greater than that between the adjacent mechanical hand inner finger and mechanical hand outer finger; and vacuum holes are formed in the mechanical palm, the mechanical hand inner fingers and the mechanical hand outer fingers. According to the transmission mechanism arm disclosed by the invention, the mechanical hand is designed into the mechanical palm and the mechanical fingers; the contact area of the arm and a wafer is increased through the arranged mechanical fingers; the suction force of the arm and the wafer is increased through the vacuum holes formed in the upper surfaces of the mechanical palm and the mechanical fingers and the internal vacuum design; the wafer is prevented from falling during wafer conversion; and the risk of product scrap is effectively reduced.
Description
Technical field
A kind of the present invention relates to semiconductor manufacturing facility technical field, more particularly to prober wafer
Transmission mechanism arm.
Background technology
Wafer refers to the silicon used by silicon semiconductor production of integrated circuits, as which is shaped as circle
Shape, therefore referred to as wafer.Various circuit component configurations can be manufactured on the silicon die, formed
For the IC products for having specific electrical functionality.The production and manufacture of quasiconductor is in constantly developing
Define perfect production procedure.The usually survey of the manufacture-wafer of chip circuit design-wafer
The test of the encapsulation-finished chip of the cutting and grinding-chip of examination-wafer.The test of wafer is to this
The cost control of chip is even more important, and the chip of functional defect can be found out by the test of wafer,
Do not enter in the encapsulation of later stage larger cost, saved the cost of entirety.Simultaneously also to a upper work
The manufacture of sequence-wafer provides the direction of improvement.The test of wafer is from workbench by wafer
On be transplanted on below prober measuring head, and the stitch in probe card is pressed on crystal grain, is formed
Good electrical contact.Full-automatic prober will also be according to the test result of test system, to not
Qualified crystal grain stamps ink.The groundwork of wafer transfer mechanism is by wafer transfer in cassette
It is used to carrier as test.But in the transmitting procedure of wafer, transmission mechanism arm is in crystalline substance
Wafer is susceptible to during circle conversion to drop, so as to cause the risk of product rejection.
The content of the invention
The purpose of the present invention is directed to above-mentioned problem of the prior art, there is provided a kind of prober wafer is passed
Transfer mechanism arm, manipulator design into mechanical palms and mechanical finger, by arranging multiple machineries
Finger is opened in mechanical palms and mechanical finger upper surface increasing the contact area of arm and wafer
If vacuum hole and inner vacuum design, increase the suction of arm and wafer, it is to avoid transmission mechanism handss
There is wafer and drop in arm, effectively reduce the risk of product rejection when wafer is changed.
For achieving the above object, the technical solution used in the present invention is：
A kind of prober wafer transfer mechanism arm, including support, mechanical hand, the mechanical hand
It is fixedly connected with support, the mechanical hand includes mechanical palms and mechanical finger, the mechanical hand
Finger includes referring to outside finger and two mechanical hands in two mechanical hands, between referring in described two mechanical hands
Away from more than refer in adjacent machine handss and mechanical hand outside refer between spacing, the mechanical palms, machine
Refer to outside finger, mechanical hand in tool handss that upper surface offers vacuum hole.
Further, the support is metal rack.
Further, the support is bolted to connection with mechanical hand.
Further, the mechanical hand is ceramic manipulator.
Further, the ceramic manipulator is hollow sealing ceramic manipulator.
Beneficial effects of the present invention：A kind of prober wafer transfer mechanism arm, manipulator design
Into mechanical palms and mechanical finger, increase arm with wafer by arranging multiple mechanical fingers
Contact area, opens up vacuum hole in mechanical palms and mechanical finger upper surface and inner vacuum sets
Meter, increases the suction of arm and wafer, it is to avoid transmission mechanism arm occurs crystalline substance when wafer is changed
Circle drops, and effectively reduces the risk of product rejection.
Description of the drawings
Fig. 1 is transmission mechanism arm structure figure of the present invention；
Related elements symbol description：
1st, support；2nd, mechanical hand；3rd, mechanical palms vacuum hole；4th, refer in mechanical hand；5、
Refer to vacuum hole in mechanical hand；6th, refer to vacuum hole outside mechanical hand；7th, refer to outside mechanical hand.
Specific embodiment
In order that technological means, creation characteristic, reached purpose and effect that the present invention is realized are easy to
Understand and understand, with reference to being specifically illustrating, the present invention is expanded on further.
When being embodied as, with reference to Fig. 1, a kind of prober wafer transfer mechanism arm, including
Frame 1, mechanical hand 2, mechanical hand 2 are fixedly connected with support 1, and mechanical hand 2 includes mechanical hand
The palm and mechanical finger, mechanical finger include that interior finger of two mechanical hands refer to 7 outside 4 and two mechanical hands,
The spacing referred in two mechanical hands more than refer in adjacent machine handss and mechanical hand outside refer between
Away from mechanical palms, mechanical hand, outside finger, mechanical hand, finger upper surface offers mechanical palms respectively
Refer in vacuum hole 3, mechanical hand and outside vacuum hole 5 and mechanical hand, refer to vacuum hole 6.
Support can be metal rack, and support can be bolted to connection with mechanical hand.For
The mechanical hand is enable to have more preferable suction to wafer, manipulator design is into vacuum structure.Machinery
Handss are designed to ceramic manipulator, and ceramic manipulator can be hollow sealing ceramic manipulator.
Prober wafer transfer mechanism arm, prober wafer transfer mechanism arm lifting surface area and
Respective design has been done in inner vacuum structure, mechanical arm lifting surface area increases 2 times, carried brilliant
Circle ability will double, and increase the suction of arm and wafer, it is to avoid transmission mechanism arm is in crystalline substance
There is wafer during circle conversion to drop, effectively reduce the risk of product rejection.
Embodiment described above is only that the preferred embodiment of the present invention is described, and
It is non-that the spirit and scope of the present invention are defined.In the premise without departing from design concept of the present invention
Under, various modifications and improvement that this area ordinary person is made to technical scheme,
Protection scope of the present invention should be dropped into.
Claims (5)
1. a kind of prober wafer transfer mechanism arm, including support, mechanical hand, the machine
Tool handss are fixedly connected with support, and the mechanical hand includes mechanical palms and mechanical finger, its feature
It is：The mechanical finger includes that interior finger of two mechanical hands refers to outside two mechanical hands, described two
The spacing referred in individual mechanical hand is more than outside the interior finger of adjacent machine handss and mechanical hand the spacing between referring to,
Refer to outside finger, mechanical hand in the mechanical palms, mechanical hand that upper surface offers vacuum hole.
2., according to a kind of prober wafer transfer mechanism arm described in claim 1, which is special
Levy and be：The support is metal rack.
3., according to a kind of prober wafer transfer mechanism arm described in claim 2, which is special
Levy and be：The support is bolted to connection with mechanical hand.
4., according to a kind of prober wafer transfer mechanism arm described in claim 1, which is special
Levy and be：The mechanical hand is ceramic manipulator.
5., according to a kind of prober wafer transfer mechanism arm described in claim 4, which is special
Levy and be：The ceramic manipulator is hollow sealing ceramic manipulator.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201510697234.0A CN106531671A (en) | 2015-10-22 | 2015-10-22 | Wafer transmission mechanism arm of prober |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201510697234.0A CN106531671A (en) | 2015-10-22 | 2015-10-22 | Wafer transmission mechanism arm of prober |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN106531671A true CN106531671A (en) | 2017-03-22 |
Family
ID=58349402
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201510697234.0A Withdrawn CN106531671A (en) | 2015-10-22 | 2015-10-22 | Wafer transmission mechanism arm of prober |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN106531671A (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN114131621A (en) * | 2021-10-29 | 2022-03-04 | 赛莱克斯微系统科技（北京）有限公司 | Wafer transportation manipulator |
| CN115706034A (en) * | 2021-08-06 | 2023-02-17 | 沈阳富创精密设备股份有限公司 | A wafer handling mechanism with adjustable finger spacing |
Citations (10)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TWI237590B (en) * | 2004-03-11 | 2005-08-11 | Advanced Semiconductor Eng | Wafer transport robot arm |
| KR20070047494A (en) * | 2005-11-02 | 2007-05-07 | 삼성전자주식회사 | Wafer transfer device with three suction fingers |
| CN101383319A (en) * | 2007-09-06 | 2009-03-11 | 细美事有限公司 | End effector and robot for transferring a substrate having the same |
| JP2009059864A (en) * | 2007-08-31 | 2009-03-19 | Ulvac Japan Ltd | Substrate lift device |
| KR20090112160A (en) * | 2008-04-23 | 2009-10-28 | 로체 시스템즈(주) | Glass substrate transfer robot |
| CN201455993U (en) * | 2009-07-16 | 2010-05-12 | 中芯国际集成电路制造(上海)有限公司 | Robot arm and wafer transferring disk using same |
| KR20100063369A (en) * | 2008-12-03 | 2010-06-11 | 현대중공업 주식회사 | Hands position inspection apparatus and method of articulated robot |
| US20140265394A1 (en) * | 2013-03-13 | 2014-09-18 | Varian Semiconductor Equipment Associates, Inc. | Composite end effectors |
| US20150251323A1 (en) * | 2014-03-10 | 2015-09-10 | Samsung Electronics Co., Ltd. | Robot and substrate handling apparatus including the same |
| KR20150104440A (en) * | 2014-03-05 | 2015-09-15 | 주식회사 에스에프에이 | Substrate transfer robot |
-
2015
- 2015-10-22 CN CN201510697234.0A patent/CN106531671A/en not_active Withdrawn
Patent Citations (10)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TWI237590B (en) * | 2004-03-11 | 2005-08-11 | Advanced Semiconductor Eng | Wafer transport robot arm |
| KR20070047494A (en) * | 2005-11-02 | 2007-05-07 | 삼성전자주식회사 | Wafer transfer device with three suction fingers |
| JP2009059864A (en) * | 2007-08-31 | 2009-03-19 | Ulvac Japan Ltd | Substrate lift device |
| CN101383319A (en) * | 2007-09-06 | 2009-03-11 | 细美事有限公司 | End effector and robot for transferring a substrate having the same |
| KR20090112160A (en) * | 2008-04-23 | 2009-10-28 | 로체 시스템즈(주) | Glass substrate transfer robot |
| KR20100063369A (en) * | 2008-12-03 | 2010-06-11 | 현대중공업 주식회사 | Hands position inspection apparatus and method of articulated robot |
| CN201455993U (en) * | 2009-07-16 | 2010-05-12 | 中芯国际集成电路制造(上海)有限公司 | Robot arm and wafer transferring disk using same |
| US20140265394A1 (en) * | 2013-03-13 | 2014-09-18 | Varian Semiconductor Equipment Associates, Inc. | Composite end effectors |
| KR20150104440A (en) * | 2014-03-05 | 2015-09-15 | 주식회사 에스에프에이 | Substrate transfer robot |
| US20150251323A1 (en) * | 2014-03-10 | 2015-09-10 | Samsung Electronics Co., Ltd. | Robot and substrate handling apparatus including the same |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN115706034A (en) * | 2021-08-06 | 2023-02-17 | 沈阳富创精密设备股份有限公司 | A wafer handling mechanism with adjustable finger spacing |
| CN114131621A (en) * | 2021-10-29 | 2022-03-04 | 赛莱克斯微系统科技（北京）有限公司 | Wafer transportation manipulator |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| US9466550B2 (en) | Electronic device with redistribution layer and stiffeners and related methods | |
| SG133571A1 (en) | Semiconductor device, method of manufacturing the same, and camera module | |
| EP2610904A3 (en) | Packaging method for electronic components using a thin substrate | |
| CN106531671A (en) | Wafer transmission mechanism arm of prober | |
| EP2610905A3 (en) | Packaging method for electronic components using a thin substrate | |
| US8624376B1 (en) | Package-on-package structure without through assembly vias | |
| US7842550B2 (en) | Method of fabricating quad flat non-leaded package | |
| CN103187326B (en) | Packaging method of ultrathin substrate | |
| CN208157371U (en) | A kind of flip-chip sealed in unit | |
| CN205194674U (en) | Quick -witted wafer transmission device arm is surveyed to needle | |
| US11908843B2 (en) | Semiconductor package, method of bonding workpieces and method of manufacturing semiconductor package | |
| CN105655309A (en) | Method for manufacturing interposer without chip substrate | |
| KR930007541B1 (en) | Gripping devices for articles such as integrated circuit leadframes | |
| TWI624900B (en) | Flip device handler | |
| CN103730375B (en) | OSP surface processes base plate for packaging molding milling method | |
| CN104760920B (en) | There is compact electronics packaging body and the correlation technique of MEMS IC | |
| US8664039B2 (en) | Methods and apparatus for alignment in flip chip bonding | |
| CN204473795U (en) | Chip detects feeding device automatically | |
| WO2009007929A3 (en) | Integrated circuits on a wafer and methods for manufacturing integrated circuits | |
| WO2014014418A1 (en) | Method and apparatus for the engagement of ic units | |
| CN107492534A (en) | Pitch list IC chip packaging part and preparation method thereof | |
| CN206340531U (en) | The high-speed turret prepared towards flexible electronic is arranged symmetrically mounting system | |
| CN103474373B (en) | Electroplating machine material collecting device | |
| KR20120127719A (en) | Method and apparatus for transferring die from a wafer | |
| US20170084490A1 (en) | Method for making ic with stepped sidewall and related ic devices |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C06 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| TA01 | Transfer of patent application right | ||
| TA01 | Transfer of patent application right |
Effective date of registration: 20211108 Address after: 226100 room 108, building 310, worker's new village, Sanchang street, Haimen City, Nantong City, Jiangsu Province Applicant after: Yin Guwei Address before: 247100 No.17 workshop, electronic information industrial park, Chizhou economic and Technological Development Zone, Anhui Province Applicant before: ANHUI CHAOYUAN SEMICONDUCTOR Co.,Ltd. |
|
| WW01 | Invention patent application withdrawn after publication | ||
| WW01 | Invention patent application withdrawn after publication |
Application publication date: 20170322 |