CN106526995B - A kind of array substrate and display panel - Google Patents
A kind of array substrate and display panel Download PDFInfo
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- CN106526995B CN106526995B CN201610930738.7A CN201610930738A CN106526995B CN 106526995 B CN106526995 B CN 106526995B CN 201610930738 A CN201610930738 A CN 201610930738A CN 106526995 B CN106526995 B CN 106526995B
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- metal routing
- connecting lead
- lead wire
- metal
- array substrate
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- G—PHYSICS
- G02—OPTICS
- G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
- G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
- G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour
- G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour based on liquid crystals, e.g. single liquid crystal display cells
- G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
- G02F1/1333—Constructional arrangements; Manufacturing methods
- G02F1/1345—Conductors connecting electrodes to cell terminals
- G02F1/13452—Conductors connecting driver circuitry and terminals of panels
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- Nonlinear Science (AREA)
- Mathematical Physics (AREA)
- Chemical & Material Sciences (AREA)
- Crystallography & Structural Chemistry (AREA)
- General Physics & Mathematics (AREA)
- Optics & Photonics (AREA)
- Devices For Indicating Variable Information By Combining Individual Elements (AREA)
Abstract
The embodiment of the invention discloses a kind of array substrate and display panels.Wherein, the array substrate includes viewing area and non-display area, the non-display area is provided with a plurality of connecting lead wire, the connecting lead wire includes a plurality of first connecting lead wire, first connecting lead wire includes the first metal routing, the second metal routing and third metal routing, first metal routing, second metal routing, at least two in the third metal routing be located at different film layers.Technical solution provided in an embodiment of the present invention improves the homogeneity that signal transmits on different connecting lead wires, shows that display panel uniformly.
Description
Technical field
The present embodiments relate to field of display technology more particularly to a kind of array substrate and display panels.
Background technique
Liquid crystal display panel has effective display area domain and non-display area.Multiple pictures are configured in effective display area domain
For element to form pixel array, non-display area is then equipped with perimeter circuit.Each pixel generally comprise at least one thin film transistor (TFT) with
And the pixel electrode being connect with the thin film transistor (TFT), and each pixel is by two adjacent scan lines and two adjacent numbers
It is surrounded according to line.These scan lines and data line extend to non-display area from effective display area domain, and pass through non-display area
Perimeter circuit be electrically connected with driving chip.Perimeter circuit is from one end of connection scan line and data line to driving chip location
It concentrates and constitutes and be fanned out to cabling in domain.
Biggish resistance difference, general two sides can be had by being fanned out to the cabling of two side areas and the cabling of intermediate region in cabling
The impedance of the cabling in region is greater than the impedance of the cabling of intermediate region.Cabling due to being fanned out to cabling two side areas is usually aobvious
Show that area two sides provide signal, and the cabling of intermediate region is to provide display signal for viewing area intermediate region.When display panel is aobvious
Diagram as when, due to being fanned out to the cabling of two sides and the cabling of intermediate region in cabling, there are biggish resistance differences, will cause aobvious
Showing in Display panel image process, there is display difference in the color of image of the centre and two sides that will cause display panel viewing area,
There is mura (display uneven), such as color displays occur uneven.
Summary of the invention
The present invention provides a kind of array substrate and display panel, to solve impedance contrast between the different cablings being fanned out in cabling
It is different larger, occur showing non-uniform problem.
In a first aspect, the embodiment of the invention provides a kind of array substrate, including viewing area and non-display area, it is described non-aobvious
Show that area is provided with a plurality of connecting lead wire；
The connecting lead wire includes a plurality of first connecting lead wire, and first connecting lead wire includes the first metal routing, the
Two metal routings and third metal routing, first metal routing, second metal routing, in the third metal routing
At least two be located at different film layers.
Second aspect, the embodiment of the invention also provides a kind of display panel, which includes that the present invention is any real
The array substrate of example offer is provided.
Technical solution provided in an embodiment of the present invention, since the first connecting lead wire includes the first metal routing, the second metal
Cabling and third metal routing, at least two in the first metal routing, the second metal routing and third metal routing are located at not
Same film layer.And other connecting lead wires generally only include single metal layer cabling or including the first metal routings and the second metal
Cabling.Different metal cabling in first connecting lead wire can have different in different connection types, such as the first connecting lead wire
Metal routing be connected in series or in parallel, can reduce the resistance difference of the first connecting lead wire He other connecting lead wires in this way,
Signal decaying and time delay of the signal when transmitting on different connecting lead wires are almost the same, improve signal on different connecting lead wires
The homogeneity of transmission shows that display panel uniformly, such as keeps color displays uniform.
Detailed description of the invention
Fig. 1 is a kind of structural schematic diagram of array substrate provided in an embodiment of the present invention；
Fig. 2A is a kind of structural schematic diagram of connecting lead wire provided in an embodiment of the present invention；
Fig. 2 B is the structural schematic diagram of another connecting lead wire provided in an embodiment of the present invention；
Fig. 2 C is the structural schematic diagram of another array substrate provided in an embodiment of the present invention；
Fig. 3 A is the structural schematic diagram of another connecting lead wire provided in an embodiment of the present invention；
Fig. 3 B is the structural schematic diagram of another array substrate provided in an embodiment of the present invention；
Fig. 3 C is the structural schematic diagram of another connecting lead wire provided in an embodiment of the present invention；
Fig. 3 D is in Fig. 3 C along the sectional view in the direction A-A；
Fig. 3 E is in Fig. 3 C along the sectional view in the direction B-B；
Fig. 4 is a kind of structural schematic diagram of display panel provided in an embodiment of the present invention.
Specific embodiment
The present invention is described in further detail with reference to the accompanying drawings and examples.It is understood that this place is retouched
The specific embodiment stated is used only for explaining the present invention rather than limiting the invention.It also should be noted that in order to just
Only the parts related to the present invention are shown in description, attached drawing rather than entire infrastructure.
The embodiment of the present invention provides a kind of array substrate, which includes viewing area and non-display area, non-display area
It is provided with a plurality of connecting lead wire；
Connecting lead wire includes a plurality of first connecting lead wire, and the first connecting lead wire is walked including the first metal routing, the second metal
Line and third metal routing, at least two in the first metal routing, the second metal routing and third metal routing are located at difference
Film layer.
It illustratively, is a kind of structural schematic diagram of array substrate provided in an embodiment of the present invention referring to Fig. 1, Fig. 1.The battle array
Column substrate includes viewing area 11 and non-display area 12, and non-display area is provided with a plurality of connecting lead wire 120, a plurality of connecting lead wire 120
Including a plurality of first connecting lead wire, the first connecting lead wire includes the first metal routing, the second metal routing and third metal routing,
At least two in first metal routing, the second metal routing and third metal routing are located at different film layers.
Since the first connecting lead wire includes the first metal routing, the second metal routing and third metal routing, the first metal
At least two in cabling, the second metal routing and third metal routing are located at different film layers.And other connecting lead wires are general
Only include single metal layer cabling or including the first metal routing and the second metal routing.Difference gold in first connecting lead wire
Belonging to cabling can have metal routing different in different connection types, such as the first connecting lead wire to be connected in series or in parallel,
It can reduce the resistance difference of the first connecting lead wire He other connecting lead wires in this way, signal on different connecting lead wires when transmitting
Signal decaying and time delay are almost the same, improve the homogeneity that signal transmits on different connecting lead wires, show display panel
Uniformly.
Optionally, present invention implementation provides a kind of array substrate, and the first connecting lead wire in the array substrate includes first
Metal routing, the second metal routing and third metal routing, the first metal routing, the second metal routing and third metal routing position
In different film layers, i.e. the first metal routing, the second metal routing and third metal routing are located at along array substrate thickness direction
Different height.In every first connecting lead wire, in the first metal routing, the second metal routing and third metal routing two
Item is connected in parallel.Illustratively, A and Fig. 2 B, Fig. 2A are a kind of structures of connecting lead wire provided in an embodiment of the present invention referring to fig. 2
Schematic diagram, Fig. 2 B are the structural schematic diagrams of another connecting lead wire provided in an embodiment of the present invention.First connection shown in figure
Lead includes the first metal routing 101, the second metal routing 102 and third metal routing 103, the first metal routing 101, second
Metal routing 102 and third metal routing 103 are located at different film layers, the first metal routing 101,102 and of the second metal routing
It is dielectrically separated between third metal routing 103 by insulating layer 142 and insulating layer 143, the first metal routing 101 and array substrate
Film layer is dielectrically separated from by insulating layer 141 where upper other elements, for example, the first metal routing 101 by insulating layer 141 with it is thin
Film transistor is dielectrically separated from.In addition third metal routing 103 can also be insulated by insulating layer (not shown) and other film layers
Isolation.The first metal routing 101 in first connecting lead wire is connected with the second metal routing 102,103 He of third metal routing
First metal routing 101 is connected in parallel.That is the first connecting lead wire includes two sections, and first segment is the first metal routing 101 and third
The parallel connection of metal routing 103, second segment are the second metal routing 102.In the first connecting lead wire, due in the first metal routing
A third metal routing 103 in parallel on 101, the impedance of the first segment of connecting lead wire becomes smaller, due to the first connecting lead wire
First segment and second segment are a series relationship on the whole, then the impedance of whole first connecting lead wire can become smaller.Implement in the present invention
In example, in every first connecting lead wire, third metal routing can also be arranged side by side with the second metal routing.That is the one of the first connecting lead wire
Section is made of the first connecting lead wire, and another section has the second connecting lead wire and third connecting lead wire to compose in parallel, and equally may be implemented
Reduce the effect of the first connecting lead wire impedance.Since the impedance of the first connecting lead wire reduces, the first connecting lead wire is connect with other
The resistance difference of lead is smaller, by design, the first connecting lead wire can be made equal with the impedance of other connecting lead wires.It improves
The homogeneity that signal transmits on different connecting lead wires shows that display panel uniformly.
Further, in embodiments of the present invention, the impedance of the first metal routing in the first connecting lead wire is greater than second
The impedance of metal routing.Wherein, generally there are two parts to form for the impedance of every metal routing, is the resistance of metal routing respectively
With the capacitor of metal routing.Also there are two parts to form for the impedance of every connecting lead wire, is resistance and the company of connecting lead wire respectively
Connect the capacitor of lead.Since the impedance of the first metal routing is greater than the second metal routing, third metal routing is parallel to the first company
It connects on the first metal routing in lead, connects compared to the other parts that third connecting lead wire is parallel to the first connecting lead wire, first
Connect lead impedance can reduce it is most.
Array substrate provided in an embodiment of the present invention may also include positioned at a plurality of signal lead of viewing area and positioned at non-aobvious
Show the driving chip in area.Such as a plurality of signal lead may include for providing the multi-strip scanning line of gate drive signal, for mentioning
Multiple data lines for display data signal and the touch drive signal line etc. for providing touching signals, each connecting lead wire
One end connect with signal lead, the other end of each connecting lead wire is connect with driving chip, specifically can be with driving chip
Pad electrical connection.Illustratively, C, Fig. 2 C are that the structure of another array substrate provided in an embodiment of the present invention is shown referring to fig. 2
It is intended to.On the basis of array substrate shown in Fig. 1, which further includes being set to the multiple data lines 110 of viewing area 11
With the driving chip for being set to non-display area 12；One end of each connecting lead wire 120 is connect with data line 110, and each connects
The other end for connecing lead 120 is connect with driving chip, can be specifically electrically connected with the pad 130 of driving chip.With continued reference to figure
2C, a plurality of connecting lead wire in array substrate provided in an embodiment of the present invention includes a plurality of first connecting lead wire 121 and a plurality of
Two connecting lead wires 122 (using 3 article of first connecting lead wire and the 3rd article of the second connecting lead wire as example in figure).General first connection is drawn
Line 121 is located at the two side areas of entire connecting lead wire wiring area, and the second connecting lead wire 122 is located at entire connecting lead wire wiring region
The intermediate region in domain.The length of first connecting lead wire 121 is greater than the length of the second connecting lead wire 122.In the prior art, due to
The length of one connecting lead wire 121 is greater than the length of the second connecting lead wire 122, and the impedance of the first connecting lead wire 121 is generally higher than the
The impedance of two connecting lead wires 122.In embodiments of the present invention, since the first connecting lead wire 121 is using the institute in Fig. 2 B and Fig. 2 C
The structure shown, i.e. the first metal routing in the first connecting lead wire 121 are also parallel with third metal routing, the first connecting lead wire
121 impedance can become smaller, and the resistance difference of the first connecting lead wire 121 and the second connecting lead wire 122 is reduced.It, can be with by design
Keep the impedance of the first connecting lead wire 121 and the second connecting lead wire 122 equal.It can make the first connecting lead wire 121 and the second connection
The impedance of lead 122 is equal.The resistance difference that can solve the first connecting lead wire and the second connecting lead wire it is larger and caused by show
Show uneven problem.The homogeneity that signal transmits on different connecting lead wires is improved, shows that display panel uniformly.
The embodiment of the invention also provides another array substrates.In the array substrate, the first connecting lead wire includes string
At least one the first metal routings of connection connection, at least one the second metal routing and at least one third metal routings.Wherein,
Two in first metal routing, the second metal routing and third metal routing are located at different film layers.
It illustratively, is the structural schematic diagram of another connecting lead wire provided in an embodiment of the present invention referring to Fig. 3 A, Fig. 3 A.
The connecting lead wire is the first connecting lead wire, and the first connecting lead wire includes 101, second gold medals of concatenated first metal routing
Belong to cabling 102 and a third metal routing 103.Wherein, the second metal routing 102 and third metal routing 103 are located at same
Film layer, the second metal routing 102 and the first metal routing 101 are located at different film layers, pass through insulation between different metal cabling
Layer 142 is dielectrically separated from, the first metal routing 101 and film layer where other elements in array substrate by insulating layer 141 insulate every
From.Other second metal routing 102 and third metal routing 103 can also be dielectrically separated from by insulating layer and other film layers.Due to
First metal routing 101 is located at different film layers, every first company from the second metal routing 102 and third metal routing 103
The first metal routing 101 connect in lead is connect by via hole 104 with the second metal routing 102, and the first metal routing 101 passes through
Via hole 104 is connect with third metal routing 103.After being connected by via hole 104, at via hole 104 between different metal cabling
Contact area reduces, and impedance increases, and the impedance of whole first connecting lead wire increases.Since the impedance of the first connecting lead wire increases,
The resistance difference of first connecting lead wire and other connecting lead wires reduces, and by design, can make the first connecting lead wire and other companies
The impedance for connecing lead is equal.The homogeneity that signal transmits on different connecting lead wires is improved, shows that display panel uniformly.It needs
It is noted that the material of the second metal routing 102 and third metal routing 103 can be identical, and the second metal routing 102
It is arranged with 102 same layer of third metal routing, in the production process, the second metal routing 102 and third metal routing 103 can be by
One of technique is formed.
Referring to Fig. 3 B, Fig. 3 B is the structural schematic diagram of another array substrate provided in an embodiment of the present invention.The array base
Plate includes a plurality of first connecting lead wire 121 and a plurality of third connecting lead wire 123 (with 3 the first connecting lead wires and 3 thirds in figure
Connecting lead wire is example), the length of third connecting lead wire 123 is greater than the length of the first connecting lead wire 121.General first connection is drawn
Line 121 is located at the intermediate region of entire connecting lead wire wiring area, and 123 second connecting lead wire of third connecting lead wire is located at whole connect
Connect the two side areas of lead wiring area.Draw conventionally, as the length of the first connecting lead wire 121 is less than third connection
The length of line 123, the impedance of the first connecting lead wire 121 are less than the impedance of third connecting lead wire 123.And in the embodiment of the present invention
In, the structure of the first connecting lead wire shown in Fig. 3 A can be used in the structure of the first connecting lead wire 121, the first connecting lead wire 121
Impedance increases, and the resistance difference of the first connecting lead wire 121 and third connecting lead wire 123 reduces.By design, the first company can be made
The impedance of the impedance and the second connecting lead wire 123 that connect lead 121 is equal.It can solve the first connecting lead wire and third connecting lead wire
Resistance difference it is larger and caused by show uneven problem.The homogeneity that signal transmits on different connecting lead wires is improved, is made
Display panel is shown uniformly.
Fig. 3 C is the structural schematic diagram of another connecting lead wire provided in an embodiment of the present invention.Fig. 3 D is in Fig. 3 C along A-A
The sectional view in direction, Fig. 3 E are in Fig. 3 C along the sectional view in the direction B-B.Referring to Fig. 3 C-3D, third connecting lead wire 123 includes string
Join first metal routing 101 and second metal routing 102 of connection, i.e. a Duan Wei of third connecting lead wire 123
One metal routing 101, another section of third connecting lead wire 123 is the second metal routing 102, between two sections by via hole 104 into
The connection of row wire jumper, the resistance difference of such two adjacent third connecting lead wires 123 is smaller, can improve display picture.
Further, in embodiments of the present invention, the different metal cabling position that adjacent contact connects in the first connecting lead wire
In different film layers；The total number of the first metal routing, the second metal routing and third metal routing is big in first connecting lead wire
The total number of the first metal routing and the second metal routing in third connecting lead wire.The first metal is walked in first connecting lead wire
The total number of line, the second metal routing and third metal routing is greater than the total number of metal routing in third connecting lead wire, per more
One metal routing needs to increase a via hole.And the increase of number of vias will increase the impedance of entire connecting lead wire.It is exemplary
, referring to Fig. 3 E, the first metal routing in the first connecting lead wire, the second metal routing, third metal routing total number be 4
A, correspondingly, the quantity of via hole 104 is 3.Referring to Fig. 3 D, the first metal routing and the second metal are walked in third connecting lead wire
The total number of line is 2, and correspondingly, the quantity of via hole 104 is 1.
With continued reference to Fig. 3 C-3E, it can be seen that the first metal routing 101, the second metal routing 102 and third metal are walked
Arrangement mode of the line 102 in two adjacent first connecting lead wires 121 is different；First metal routing 101 and the second metal routing
102 arrangement mode in two adjacent third connecting lead wires 123 is opposite.Such wires design can make adjacent two article
The adjacent segment of one connecting lead wire uses different metal routings, can reduce the interference between adjacent two the first connecting lead wires.
It can also equally reduce and be interfered between adjacent two third connecting lead wires.
In addition, the embodiment of the present invention also provides a kind of display panel, referring to fig. 4, which includes that the present invention is any
The array substrate 20 that embodiment provides, and the color membrane substrates 30 that are oppositely arranged with array substrate 20 and be located at array substrate 20 with
Liquid crystal layer 40 between color 30 plate of film base.Wherein, the liquid crystal layer 40 includes multiple liquid crystal molecules 401.
Note that the above is only a better embodiment of the present invention and the applied technical principle.It will be appreciated by those skilled in the art that
The invention is not limited to the specific embodiments described herein, be able to carry out for a person skilled in the art it is various it is apparent variation,
It readjusts and substitutes without departing from protection scope of the present invention.Therefore, although being carried out by above embodiments to the present invention
It is described in further detail, but the present invention is not limited to the above embodiments only, without departing from the inventive concept, also
It may include more other equivalent embodiments, and the scope of the invention is determined by the scope of the appended claims.
Claims (9)
1. a kind of array substrate, which is characterized in that including viewing area and non-display area, the non-display area is provided with a plurality of connection
Lead；
The connecting lead wire includes a plurality of first connecting lead wire and a plurality of second connecting lead wire；The length of first connecting lead wire
Greater than the length of second connecting lead wire；
First connecting lead wire includes the first metal routing, the second metal routing and third metal routing, first metal
Cabling, second metal routing and the third metal routing are located at different film layers；
Every first connecting lead wire includes two sections, first segment be first metal routing and the third metal routing simultaneously
Connection, second segment are second metal routing, and first metal routing and second metal routing are connected in series；Described
Two connecting lead wires include first metal routing and second metal routing being connected in series；
The impedance of first metal routing is greater than the impedance of second metal routing.
2. array substrate according to claim 1, which is characterized in that between the different metal cabling in the connecting lead wire
It is connected by via hole.
3. array substrate according to claim 1, which is characterized in that further include a plurality of signal for being set to the viewing area
Cabling, and it is set to the driving chip of the non-display area；
One end of connecting lead wire described in each is connect with a signal lead, and the other end is connect with the driving chip.
4. a kind of array substrate, which is characterized in that including viewing area and non-display area, the non-display area is provided with a plurality of connection
Lead；
The connecting lead wire includes a plurality of first connecting lead wire and a plurality of third connecting lead wire；The length of the third connecting lead wire
Greater than the length of first connecting lead wire；
First connecting lead wire include at least one the first metal routings being connected in series, at least one the second metal routings and
At least one third metal routing, first metal routing and second metal routing are located at different layers, second gold medal
Belong to cabling and the third metal routing is located on the same floor；The third connecting lead wire includes one described first be connected in series
Metal routing and second metal routing；The different metal cabling position that adjacent contact connects in first connecting lead wire
In different film layers.
5. array substrate according to claim 4, which is characterized in that
First metal routing described in first connecting lead wire, second metal routing and the third metal routing it is total
Number is greater than the total number of the first metal routing and second metal routing described in the third connecting lead wire.
6. array substrate according to claim 4, which is characterized in that
First metal routing, second metal routing and the third metal routing are in two adjacent first connecting lead wires
In arrangement mode it is different；
The arrangement mode of first metal routing and second metal routing in two adjacent third connecting lead wires is opposite.
7. according to the described in any item array substrates of claim 4-6, which is characterized in that the different metal in the connecting lead wire
It is connected between cabling by via hole.
8. array substrate according to claim 4, which is characterized in that further include a plurality of signal for being set to the viewing area
Cabling, and it is set to the driving chip of the non-display area；
One end of connecting lead wire described in each is connect with a signal lead, and the other end is connect with the driving chip.
9. a kind of display panel, which is characterized in that including the described in any item array substrates of claim 1-8.
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| TWI610281B (en) * | 2017-03-09 | 2018-01-01 | 友達光電股份有限公司 | Display panel |
| CN107170366B (en) * | 2017-07-21 | 2020-04-17 | 厦门天马微电子有限公司 | Display panel and display device |
| CN107479282B (en) * | 2017-08-30 | 2020-03-31 | 京东方科技集团股份有限公司 | Array substrate, display panel and display device |
| CN109976047B (en) * | 2018-01-02 | 2021-03-16 | 京东方科技集团股份有限公司 | Touch electrode structure, touch substrate and preparation method, display panel and device |
| CN109270755B (en) * | 2018-09-30 | 2020-10-16 | 惠科股份有限公司 | Display panel and display device |
| CN110262148B (en) * | 2019-07-03 | 2022-06-03 | 昆山龙腾光电股份有限公司 | Array substrate, display panel and display device |
| CN110579917B (en) * | 2019-10-15 | 2022-03-01 | 上海中航光电子有限公司 | Display module and display device |
| CN113296624B (en) * | 2020-02-21 | 2022-12-27 | 华为技术有限公司 | Display panel and electronic equipment |
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| KR20070072127A (en) * | 2005-12-30 | 2007-07-04 | 엘지.필립스 엘시디 주식회사 | LCD display device |
| CN105518770A (en) * | 2013-09-09 | 2016-04-20 | 夏普株式会社 | Active matrix substrate and display device |
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| US7088323B2 (en) * | 2000-12-21 | 2006-08-08 | Lg.Philips Lcd Co., Ltd. | Liquid crystal display device and method for fabricating the same |
| KR101213878B1 (en) * | 2005-12-29 | 2012-12-18 | 엘지디스플레이 주식회사 | flat panel display device and fabricating method of the same |
| KR101888423B1 (en) * | 2011-06-10 | 2018-08-17 | 엘지디스플레이 주식회사 | Flat panel display |
| US9190421B2 (en) * | 2011-08-18 | 2015-11-17 | Lg Display Co., Ltd. | Display device and fabrication method thereof |
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| KR20070072127A (en) * | 2005-12-30 | 2007-07-04 | 엘지.필립스 엘시디 주식회사 | LCD display device |
| CN105518770A (en) * | 2013-09-09 | 2016-04-20 | 夏普株式会社 | Active matrix substrate and display device |
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