CN106503690A - Layer-stepping fingerprint recognition module - Google Patents
Layer-stepping fingerprint recognition module Download PDFInfo
- Publication number
- CN106503690A CN106503690A CN201611036669.1A CN201611036669A CN106503690A CN 106503690 A CN106503690 A CN 106503690A CN 201611036669 A CN201611036669 A CN 201611036669A CN 106503690 A CN106503690 A CN 106503690A
- Authority
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- China
- Prior art keywords
- layer
- fingerprint recognition
- circuit substrate
- connector
- recognition chip
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Links
- 239000000758 substrate Substances 0.000 claims abstract description 110
- 238000005452 bending Methods 0.000 claims abstract description 40
- 239000010410 layer Substances 0.000 claims description 53
- 239000011241 protective layer Substances 0.000 claims description 10
- 239000012790 adhesive layer Substances 0.000 claims description 7
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 claims description 5
- 239000012530 fluid Substances 0.000 claims description 4
- 239000000565 sealant Substances 0.000 claims description 4
- 230000005611 electricity Effects 0.000 claims description 2
- 239000000919 ceramic Substances 0.000 claims 1
- 239000011521 glass Substances 0.000 claims 1
- 229910052594 sapphire Inorganic materials 0.000 claims 1
- 239000010980 sapphire Substances 0.000 claims 1
- 238000004519 manufacturing process Methods 0.000 description 4
- 238000005516 engineering process Methods 0.000 description 2
- 239000002184 metal Substances 0.000 description 2
- 229910052751 metal Inorganic materials 0.000 description 2
- 238000007493 shaping process Methods 0.000 description 2
- 238000004026 adhesive bonding Methods 0.000 description 1
- 239000004020 conductor Substances 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000005538 encapsulation Methods 0.000 description 1
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 1
- 239000010931 gold Substances 0.000 description 1
- 229910052737 gold Inorganic materials 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 238000007789 sealing Methods 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
Classifications
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06V—IMAGE OR VIDEO RECOGNITION OR UNDERSTANDING
- G06V40/00—Recognition of biometric, human-related or animal-related patterns in image or video data
- G06V40/10—Human or animal bodies, e.g. vehicle occupants or pedestrians; Body parts, e.g. hands
- G06V40/12—Fingerprints or palmprints
- G06V40/13—Sensors therefor
- G06V40/1306—Sensors therefor non-optical, e.g. ultrasonic or capacitive sensing
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
- H01L23/31—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
- H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Human Computer Interaction (AREA)
- Multimedia (AREA)
- Theoretical Computer Science (AREA)
- Credit Cards Or The Like (AREA)
- Measurement Of Length, Angles, Or The Like Using Electric Or Magnetic Means (AREA)
Abstract
The present invention discloses a kind of layer-stepping fingerprint recognition module, its connector is installed on circuit substrate rear end, this connector and fingerprint recognition chip are located at circuit substrate both sides respectively, the left end of the becket, right-hand member and lower surface bottom are respectively provided with outside outward flange, and the upper surface bottom of the becket has inside inward flange；The rear end of circuit substrate has one second bending part, a connector for being used for being connected with mainboard to be installed on the second bending part and be connected with the rear end of circuit substrate by gum layer；It is located at the central region of circuit substrate between connector and fingerprint recognition chip and further includes upper substrate layer and lower substrate layer, there is between the upper substrate layer surface relative with lower substrate layer gap.Layer-stepping fingerprint recognition module group substrates thickness of the present invention is thinning, improves flexibility, increases purpose resistant to bending to reach, also effectively increasing the accounting of screen effective display area domain.
Description
Technical field
The present invention relates to a kind of layer-stepping fingerprint recognition module, belongs to technical field of semiconductor encapsulation.
Background technology
Fingerprint recognition module is widely used to the electronic product industry such as mobile phone, flat board, notebook, conventional fingerprint mould at present
Group encapsulating structure includes：Sealer, fingerprint chip, components and parts, connector and substrate, fingerprint chip by conductive material with
Substrate connection, components and parts are connected with mainboard by connector by scolding tin and substrate connection, substrate.
The assembling process of fingerprint recognition module is：Step one, by module group assembling to mobile phone battery cover or TP；Step 2, again
Insert the connector into mainboard；Step 3, finally back cover and fore shell are fixed, to determine position of the module in whole machine.Existing at present
There is in module substrate for double-deck or multilayer line layer, and each layer be bonded together, and reduces the flexibility of substrate to a certain extent,
Increasing bending causes the risk of rupture of line.
Content of the invention
It is an object of the present invention to provide a kind of layer-stepping fingerprint recognition module, the layer-stepping fingerprint recognition module group substrates thickness subtracts
Thin, improve flexibility, increase purpose resistant to bending to reach, also effectively increasing the accounting of screen effective display area domain.
For reaching above-mentioned purpose, the technical solution used in the present invention is：A kind of layer-stepping fingerprint recognition module, including fingerprint
Identification chip, circuit substrate, becket and button key, the fingerprint recognition chip be located at in the middle part of circuit substrate and by scolding tin
Electrical connection, the fingerprint recognition chip surface opposite with circuit substrate is covered with a protective layer, outside the fingerprint recognition chip
Side and fluid sealant is provided between becket medial surface；
The connector is installed on circuit substrate rear end, and this connector and fingerprint recognition chip are located at circuit substrate both sides respectively,
The left end of the becket, right-hand member and lower surface bottom are respectively provided with outside outward flange, the upper surface bottom tool of the becket
There are inside inward flange, the fingerprint recognition chip to be installed in becket and horizontally disposed with inward flange, the protective layer covers
It is placed on above fingerprint recognition chip and inward flange；
There is one first bending part, the button key to be installed on the lower surface of the first bending part for the rear end of the circuit substrate, this
The upper surface of the first bending part is connected with the lower surface for being located at circuit substrate immediately below fingerprint recognition chip by an adhesive layer；
The rear end of the circuit substrate has one second bending part, a connector for being used for being connected with mainboard to be installed on second
It is connected with the rear end of circuit substrate on bending part and by gum layer, the connector and fingerprint recognition chip are located at circuit substrate
The same side；
It is located at the central region of circuit substrate between connector and fingerprint recognition chip and further includes upper substrate layer and infrabasal plate
The lower surface of layer, the upper surface of this upper substrate layer and lower substrate layer is covered with circuitous pattern layer, the upper substrate layer and infrabasal plate
Layer has gap between relative surface.
In above-mentioned technical proposal, further improved scheme is as follows：
1. in such scheme, the fingerprint recognition chip form be four sides have the square of rounding, rounded rectangular
Shape, track type or rhombus.
2. in such scheme, on the inside of the left end of the becket, right-hand member and lower end base, place is provided with chamfered section, described interior
On the inside of flange bottom, place is provided with chamfered section.
3., in such scheme, becket lower surface bottom has outside outward flange, the inward flange bottom inside
Place is provided with chamfered section.
As above-mentioned technical proposal is used, the present invention has following advantages and effect compared with prior art：
1. layer-stepping fingerprint recognition module of the present invention, which is located at the middle part of circuit substrate between connector and fingerprint recognition chip
Region further includes that the lower surface of upper substrate layer and lower substrate layer, the upper surface of this upper substrate layer and lower substrate layer is covered with electricity
Road graph layer, has gap between the upper substrate layer surface relative with lower substrate layer, and which is ensureing that performance, profile are constant
In the case of, between connector and fingerprint recognition chip, the central region of circuit substrate adopts layered shaping, to reach circuit
The characteristics of middle part relatively small thickness of substrate, raising flexibility, increase bending resistance.
2. layer-stepping fingerprint recognition module of the present invention, the left end of its becket, right-hand member and lower surface bottom are respectively provided with outwards
Outward flange, there is inside inward flange, the fingerprint recognition chip to be installed on becket for the upper surface bottom of the becket
Interior and horizontally disposed with inward flange, the space that fingerprint module takes equipment is reduced, allows the parts such as the TP of equipment more abundant
Utilization space, effectively increase the accounting of screen effective display area domain, meanwhile, quoit is toward the long boss in inner side, it is ensured that metal
Circle is bonding with FPC firm；Secondly, there is a bending part, the button key to be installed under bending part for the rear end of its circuit substrate
Surface, the upper surface of this bending part are connected with the lower surface for being located at circuit substrate immediately below fingerprint recognition chip by an adhesive layer
Connect, be conducive to the volume for reducing module, improve production efficiency.
3. layer-stepping fingerprint recognition module of the present invention, the rear end of its circuit substrate have a bending part, and one is used for and mainboard
The connector of connection is installed on bending part and is connected with the rear end of circuit substrate by gum layer, and the connector and fingerprint are known
Other chip is located at the same side of circuit substrate, and its module need to only carry out a SMT operation, and input tool quantity is fewer,
The utilization of SMT device resources is higher, and the SMT working times are reduced, and production efficiency is improved, and cost is relatively low；Secondly, after its circuit substrate
There is a bending part, the button key to be installed on the lower surface of bending part at end, the upper surface of this bending part by an adhesive layer with
The lower surface connection of circuit substrate immediately below fingerprint recognition chip is located at, is conducive to the volume for reducing module, improve production efficiency.
Description of the drawings
Structural representation of the accompanying drawing 1 for layer-stepping fingerprint recognition module of the present invention；
Partial structural diagram of the accompanying drawing 2 for layer-stepping fingerprint recognition module of the present invention.
In the figures above：1st, fingerprint recognition chip；2nd, circuit substrate；3rd, connector；4th, becket；5th, protective layer；6th, close
Sealing；7th, outward flange；8th, inward flange；9th, electronic devices and components；10th, chamfered section；11st, button key；12nd, the first bending part；13rd, gluing
Layer；14th, the second bending part；15th, gum layer；16th, upper substrate layer；17th, lower substrate layer；18th, circuitous pattern layer；19th, gap.
Specific embodiment
With reference to embodiment, the invention will be further described：
Embodiment 1：A kind of layer-stepping fingerprint recognition module, including fingerprint recognition chip 1, circuit substrate 2, connector 3, becket
4 and button key 11, the fingerprint recognition chip 1 is located at and electrically connects with the middle part of circuit substrate 2 and by scolding tin, the fingerprint recognition
The surface opposite with circuit substrate 2 of chip 1 is covered with a protective layer 5,1 lateral surface of fingerprint recognition chip with becket 4
Fluid sealant 6 is provided between medial surface；
The connector 3 is installed on 2 rear end of circuit substrate, and this connector 3 and fingerprint recognition chip 1 are located at circuit substrate 2 respectively
Both sides, the left end of the becket 4, right-hand member and lower surface bottom are respectively provided with outside outward flange 7, the upper end of the becket 4
There is inside inward flange 8, the fingerprint recognition chip 1 to be installed in becket 4 and horizontally disposed with inward flange 8 for face bottom,
The protective layer 5 is covered in above fingerprint recognition chip 1 and inward flange 8；
There is one first bending part 12, the button key 11 to be installed under the first bending part 12 for the rear end of the circuit substrate 2
Surface, the upper surface of this first bending part 12 by an adhesive layer 13 and are located at 1 underface circuit substrate 2 of fingerprint recognition chip
Lower surface connects；
The rear end of the circuit substrate 2 has one second bending part 14, a connector 3 for being used for being connected with mainboard to be installed on
It is connected with the rear end of circuit substrate 2 on second bending part 14 and by gum layer 15, the connector 3 and fingerprint recognition chip 1
It is located at the same side of circuit substrate 2；
Being located at the central region of circuit substrate 2 between connector 3 and fingerprint recognition chip 1 further includes upper substrate layer 16 with
The lower surface of substrate layer 17, the upper surface of this upper substrate layer 16 and lower substrate layer 17 is covered with circuitous pattern layer 18, the upper base
There is between the surface relative with lower substrate layer 17 of flaggy 16 gap 19.
Above-mentioned fingerprint recognition chip 1 is shaped as the square that four sides have rounding.
On the inside of the left end of above-mentioned becket 4, right-hand member and lower end base, place is provided with chamfered section 10, the inward flange bottom inside
Place is provided with chamfered section.
Embodiment 2：A kind of layer-stepping fingerprint recognition module, including fingerprint recognition chip 1, circuit substrate 2, connector 3, gold
Category ring 4 and button key 11, the fingerprint recognition chip 1 are located at and electrically connect with the middle part of circuit substrate 2 and by scolding tin, the fingerprint
The surface opposite with circuit substrate 2 of identification chip 1 is covered with a protective layer 5,1 lateral surface of fingerprint recognition chip and and metal
Fluid sealant 6 is provided between 4 medial surface of ring；
The connector 3 is installed on 2 rear end of circuit substrate, and this connector 3 and fingerprint recognition chip 1 are located at circuit substrate 2 respectively
Both sides, the left end of the becket 4, right-hand member and lower surface bottom are respectively provided with outside outward flange 7, the upper end of the becket 4
There is inside inward flange 8, the fingerprint recognition chip 1 to be installed in becket 4 and horizontally disposed with inward flange 8 for face bottom,
The protective layer 5 is covered in above fingerprint recognition chip 1 and inward flange 8；
There is one first bending part 12, the button key 11 to be installed under the first bending part 12 for the rear end of the circuit substrate 2
Surface, the upper surface of this first bending part 12 by an adhesive layer 13 and are located at 1 underface circuit substrate 2 of fingerprint recognition chip
Lower surface connects；
The rear end of the circuit substrate 2 has one second bending part 14, a connector 3 for being used for being connected with mainboard to be installed on
It is connected with the rear end of circuit substrate 2 on second bending part 14 and by gum layer 15, the connector 3 and fingerprint recognition chip 1
It is located at the same side of circuit substrate 2；
Being located at the central region of circuit substrate 2 between connector 3 and fingerprint recognition chip 1 further includes upper substrate layer 16 with
The lower surface of substrate layer 17, the upper surface of this upper substrate layer 16 and lower substrate layer 17 is covered with circuitous pattern layer 18, the upper base
There is between the surface relative with lower substrate layer 17 of flaggy 16 gap 19.
Above-mentioned fingerprint recognition chip 1 is shaped as the rectangle of rounded.
On the inside of the left end of above-mentioned becket 4, right-hand member and lower end base, place is provided with chamfered section 10, the inward flange bottom inside
Place is provided with chamfered section.
During using above-mentioned layer-stepping fingerprint recognition module, which is located at circuit substrate between connector and fingerprint recognition chip
Central region further includes that the lower surface of upper substrate layer and lower substrate layer, the upper surface of this upper substrate layer and lower substrate layer covers
There is circuitous pattern layer, there is gap between the upper substrate layer surface relative with lower substrate layer, which is ensureing performance, profile not
In the case of change, between connector and fingerprint recognition chip, the central region of circuit substrate adopts layered shaping, to reach
The characteristics of middle part relatively small thickness of circuit substrate, raising flexibility, increase bending resistance；Secondly, which reduce fingerprint module and account for
With the space of equipment, the parts such as the TP of equipment more fully utilization space is allow, screen effective display area domain is effectively increased
Accounting, meanwhile, quoit is toward the long boss in inner side, it is ensured that quoit is bonding with FPC firm；Again, the rear end of its circuit substrate
There is a bending part, the button key to be installed on the lower surface of bending part, the upper surface of this bending part is by an adhesive layer and position
The lower surface connection of circuit substrate immediately below the fingerprint recognition chip, is conducive to the volume for reducing module, improve production efficiency.
Above-described embodiment technology design only to illustrate the invention and feature, its object is to allow person skilled in the art
Scholar will appreciate that present disclosure and implement according to this, can not be limited the scope of the invention with this.All according to the present invention
Equivalence changes or modification that Spirit Essence is made, should all be included within the scope of the present invention.
Claims (5)
1. a kind of layer-stepping fingerprint recognition module, it is characterised in that：Including fingerprint recognition chip（1）, circuit substrate（2）, connection
Device（3）, becket（4）And button key（11）, the fingerprint recognition chip（1）It is located at and circuit substrate（2）Middle part simultaneously passes through weldering
Tin is electrically connected, the fingerprint recognition chip（1）With circuit substrate（2）Opposite surface is covered with a protective layer（5）, the fingerprint
Identification chip（1）Lateral surface and and becket（4）Fluid sealant is provided between medial surface（6）；
The connector（3）It is installed on circuit substrate（2）Rear end, this connector（3）With fingerprint recognition chip（1）Electricity is located at respectively
Base board（2）Both sides, the becket（4）Left end, right-hand member bottom be respectively provided with outside outward flange（7）, the becket（4）
Upper surface bottom there is inside inward flange（8）, the fingerprint recognition chip（1）It is installed on becket（4）Interior and and convex
Edge（8）Horizontally disposed, the protective layer（5）It is covered in fingerprint recognition chip（1）And inward flange（8）Top；
The circuit substrate（2）Rear end have one first bending part（12）, the button key（11）It is installed on the first bending part
（12）Lower surface, this first bending part（12）Upper surface pass through an adhesive layer（13）Be located at fingerprint recognition chip（1）Just
Underlying circuit substrate（2）Lower surface connection；
The circuit substrate（2）Rear end have one second bending part（14）, one is used for the connector that is connected with mainboard（3）
It is installed on the second bending part（14）Above and by gum layer（15）With circuit substrate（2）Rear end connection, the connector（3）With
Fingerprint recognition chip（1）It is located at circuit substrate（2）The same side；
It is located at connector（3）With fingerprint recognition chip（1）Between circuit substrate（2）Central region further include upper substrate layer
（16）And lower substrate layer（17）, this upper substrate layer（16）Upper surface and lower substrate layer（17）Lower surface be covered with circuitous pattern
Layer（18）, the upper substrate layer（16）With lower substrate layer（17）There is between relative surface gap（19）.
2. layer-stepping fingerprint recognition module according to claim 1, it is characterised in that：The fingerprint recognition chip（1）Shape
Shape is that four sides have the square of rounding, the rectangle of rounded, track type or rhombus.
3. layer-stepping fingerprint recognition module according to claim 1, it is characterised in that：The protective layer（5）For glass cover
Plate, sapphire cover plate, ceramic cover plate or ink layer.
4. layer-stepping fingerprint recognition module according to claim 1, it is characterised in that：The becket（4）Lower surface bottom
Portion has outside outward flange（7）, at the inward flange bottom inside, it is provided with chamfered section（10）.
5. layer-stepping fingerprint recognition module according to claim 1, it is characterised in that：The becket（4）Left end, the right side
On the inside of end and lower end base, place is provided with chamfered section.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201611036669.1A CN106503690B (en) | 2016-11-23 | 2016-11-23 | Layered fingerprint identification module |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201611036669.1A CN106503690B (en) | 2016-11-23 | 2016-11-23 | Layered fingerprint identification module |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN106503690A true CN106503690A (en) | 2017-03-15 |
| CN106503690B CN106503690B (en) | 2023-07-04 |
Family
ID=58327737
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201611036669.1A Active CN106503690B (en) | 2016-11-23 | 2016-11-23 | Layered fingerprint identification module |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN106503690B (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108898955A (en) * | 2018-07-31 | 2018-11-27 | 武汉天马微电子有限公司 | Display panel and display device |
| CN110674686A (en) * | 2019-08-19 | 2020-01-10 | 华为技术有限公司 | Fingerprint identification devices and electronic equipment |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN205621020U (en) * | 2016-03-25 | 2016-10-05 | 江苏凯尔生物识别科技有限公司 | A fingerprint module for display screen |
| CN205620973U (en) * | 2016-03-25 | 2016-10-05 | 江苏凯尔生物识别科技有限公司 | Touch -sensitive screen with lock screen function |
| CN205644576U (en) * | 2016-03-29 | 2016-10-12 | 深圳市德沃尔实业有限公司 | Take fingerprint identification module of button function |
| CN206312171U (en) * | 2016-11-23 | 2017-07-07 | 江苏凯尔生物识别科技有限公司 | Layer-stepping fingerprint recognition module |
-
2016
- 2016-11-23 CN CN201611036669.1A patent/CN106503690B/en active Active
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN205621020U (en) * | 2016-03-25 | 2016-10-05 | 江苏凯尔生物识别科技有限公司 | A fingerprint module for display screen |
| CN205620973U (en) * | 2016-03-25 | 2016-10-05 | 江苏凯尔生物识别科技有限公司 | Touch -sensitive screen with lock screen function |
| CN205644576U (en) * | 2016-03-29 | 2016-10-12 | 深圳市德沃尔实业有限公司 | Take fingerprint identification module of button function |
| CN206312171U (en) * | 2016-11-23 | 2017-07-07 | 江苏凯尔生物识别科技有限公司 | Layer-stepping fingerprint recognition module |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108898955A (en) * | 2018-07-31 | 2018-11-27 | 武汉天马微电子有限公司 | Display panel and display device |
| CN110674686A (en) * | 2019-08-19 | 2020-01-10 | 华为技术有限公司 | Fingerprint identification devices and electronic equipment |
| CN110674686B (en) * | 2019-08-19 | 2022-08-26 | 华为技术有限公司 | Fingerprint identification device and electronic equipment |
Also Published As
| Publication number | Publication date |
|---|---|
| CN106503690B (en) | 2023-07-04 |
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Effective date of registration: 20240130 Address after: No. 158 Chengxi Avenue, High tech Zone, Lujiang County, Hefei City, Anhui Province, 231501 Patentee after: Anhui Kaier Communication Technology Co.,Ltd. Country or region after: China Address before: No. 568 Fangqiao Road, Caohu Industrial Park, Xiangcheng Economic and Technological Development Zone, Suzhou City, Jiangsu Province, 215143 Patentee before: JIANGSU A-KERR BIO-IDENTIFICATION TECHNOLOGY Co.,Ltd. Country or region before: China |