CN106500886B - A kind of preparation method of flexible stress sensor based on nano conductive material - Google Patents
A kind of preparation method of flexible stress sensor based on nano conductive material Download PDFInfo
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- CN106500886B CN106500886B CN201610838176.3A CN201610838176A CN106500886B CN 106500886 B CN106500886 B CN 106500886B CN 201610838176 A CN201610838176 A CN 201610838176A CN 106500886 B CN106500886 B CN 106500886B
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- 238000002360 preparation method Methods 0.000 title claims abstract description 21
- 239000004020 conductor Substances 0.000 title claims abstract description 18
- 239000004205 dimethyl polysiloxane Substances 0.000 claims abstract description 95
- 235000013870 dimethyl polysiloxane Nutrition 0.000 claims abstract description 95
- CXQXSVUQTKDNFP-UHFFFAOYSA-N octamethyltrisiloxane Chemical compound C[Si](C)(C)O[Si](C)(C)O[Si](C)(C)C CXQXSVUQTKDNFP-UHFFFAOYSA-N 0.000 claims abstract description 95
- 238000004987 plasma desorption mass spectroscopy Methods 0.000 claims abstract description 95
- 229920000435 poly(dimethylsiloxane) Polymers 0.000 claims abstract description 95
- 239000000463 material Substances 0.000 claims abstract description 27
- 238000000034 method Methods 0.000 claims abstract description 15
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 claims abstract description 7
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 claims abstract description 6
- 239000002086 nanomaterial Substances 0.000 claims abstract description 6
- 238000009415 formwork Methods 0.000 claims description 21
- 238000001035 drying Methods 0.000 claims description 20
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 claims description 19
- 229910052710 silicon Inorganic materials 0.000 claims description 19
- 239000010703 silicon Substances 0.000 claims description 19
- 239000003795 chemical substances by application Substances 0.000 claims description 14
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 8
- 229910052802 copper Inorganic materials 0.000 claims description 8
- 239000010949 copper Substances 0.000 claims description 8
- 229910052709 silver Inorganic materials 0.000 claims description 6
- 239000004332 silver Substances 0.000 claims description 6
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 claims description 4
- 229910052799 carbon Inorganic materials 0.000 claims description 4
- 229910052686 Californium Inorganic materials 0.000 claims description 2
- 239000004411 aluminium Substances 0.000 claims description 2
- 229910052782 aluminium Inorganic materials 0.000 claims description 2
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 claims description 2
- HGLDOAKPQXAFKI-UHFFFAOYSA-N californium atom Chemical compound [Cf] HGLDOAKPQXAFKI-UHFFFAOYSA-N 0.000 claims description 2
- 150000001875 compounds Chemical class 0.000 claims description 2
- 239000005357 flat glass Substances 0.000 claims description 2
- 239000011521 glass Substances 0.000 claims description 2
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 claims description 2
- 229910052737 gold Inorganic materials 0.000 claims description 2
- 239000010931 gold Substances 0.000 claims description 2
- 229910052742 iron Inorganic materials 0.000 claims description 2
- 239000002985 plastic film Substances 0.000 claims description 2
- 235000008227 Illicium verum Nutrition 0.000 claims 1
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- 238000004519 manufacturing process Methods 0.000 abstract description 4
- 230000008569 process Effects 0.000 abstract description 3
- 239000002042 Silver nanowire Substances 0.000 abstract description 2
- 229910021393 carbon nanotube Inorganic materials 0.000 abstract description 2
- 239000002041 carbon nanotube Substances 0.000 abstract description 2
- 230000002708 enhancing effect Effects 0.000 abstract description 2
- 229920005570 flexible polymer Polymers 0.000 abstract description 2
- 239000002861 polymer material Substances 0.000 abstract description 2
- 239000002994 raw material Substances 0.000 abstract description 2
- 239000010409 thin film Substances 0.000 abstract 1
- 230000008901 benefit Effects 0.000 description 5
- 239000002390 adhesive tape Substances 0.000 description 4
- 239000002131 composite material Substances 0.000 description 3
- 238000012544 monitoring process Methods 0.000 description 3
- 230000036541 health Effects 0.000 description 2
- 241000707825 Argyrosomus regius Species 0.000 description 1
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 1
- 230000009471 action Effects 0.000 description 1
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- 238000005253 cladding Methods 0.000 description 1
- UBEWDCMIDFGDOO-UHFFFAOYSA-N cobalt(II,III) oxide Inorganic materials [O-2].[O-2].[O-2].[O-2].[Co+2].[Co+3].[Co+3] UBEWDCMIDFGDOO-UHFFFAOYSA-N 0.000 description 1
- 239000011258 core-shell material Substances 0.000 description 1
- 238000001514 detection method Methods 0.000 description 1
- 230000002500 effect on skin Effects 0.000 description 1
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- 238000005538 encapsulation Methods 0.000 description 1
- 229910002804 graphite Inorganic materials 0.000 description 1
- 239000010439 graphite Substances 0.000 description 1
- -1 graphite alkene Chemical class 0.000 description 1
- 229920002521 macromolecule Polymers 0.000 description 1
- 230000005291 magnetic effect Effects 0.000 description 1
- 238000005259 measurement Methods 0.000 description 1
- 239000012528 membrane Substances 0.000 description 1
- 239000002105 nanoparticle Substances 0.000 description 1
- 239000002071 nanotube Substances 0.000 description 1
- 231100000252 nontoxic Toxicity 0.000 description 1
- 230000003000 nontoxic effect Effects 0.000 description 1
- 239000002245 particle Substances 0.000 description 1
- 229920000767 polyaniline Polymers 0.000 description 1
- 239000000843 powder Substances 0.000 description 1
- 238000011896 sensitive detection Methods 0.000 description 1
- 239000000741 silica gel Substances 0.000 description 1
- 229910002027 silica gel Inorganic materials 0.000 description 1
- 150000003377 silicon compounds Chemical class 0.000 description 1
- 230000005476 size effect Effects 0.000 description 1
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Classifications
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01L—MEASURING FORCE, STRESS, TORQUE, WORK, MECHANICAL POWER, MECHANICAL EFFICIENCY, OR FLUID PRESSURE
- G01L1/00—Measuring force or stress, in general
- G01L1/20—Measuring force or stress, in general by measuring variations in ohmic resistance of solid materials or of electrically-conductive fluids; by making use of electrokinetic cells, i.e. liquid-containing cells wherein an electrical potential is produced or varied upon the application of stress
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- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Investigating Or Analysing Biological Materials (AREA)
- Measurement Of Length, Angles, Or The Like Using Electric Or Magnetic Means (AREA)
Abstract
The present invention discloses a kind of preparation method of flexible mems thin film surface stress biosensor based on electrical-conductive nanometer material.Electrical-conductive nanometer material is combined in a simple way in flexible base specifically, further increases sensitivity and the telescopicing performance of strain gauge, is first that raw material makes the reeded flexible template of tool with flexible material (such as PDMS);Then it is filled into the groove of above-mentioned template with electrical-conductive nanometer material (such as carbon nanotube, silver nanowires);In the nanometer conductive material both ends extraction electrode of filling;Finally with flexible polymer material (such as PDMS) in the fixed nano material in upper layer and electrode, enhancing structure stability (this step can be omitted according to current demand).The method of the present invention simple process, low in cost, controllability is strong, and high sensitivity, the stability for the flexibility stress sensor based on electrical-conductive nanometer material being prepared are strong, retractility is good, to realize that micromation, low cost, mass production provide possibility.
Description
Technical field
The present invention relates to field of biosensors, specifically a kind of meagre membrane stress of flexibility based on electrical-conductive nanometer material is passed
The preparation method of sensor.
Background technique
Flexible wearable electronic device is more and more paid attention to due to interacting convenient with human body.Flexibly, scalable
Wearable sensor can be easily mounted at clothes or be directly connected on body, with high flexible and sensitive realization human body
Movement and temperature change detection.
PDMS is also known as organosilicon, is a kind of the macromolecule organic silicon compound.PDMS after solidification is a kind of silica gel, is had
Multifrequency nature, for example transparent, nontoxic, hydrophobicity, low flammability, easily engage with various material room temperature, and due to its Young
Modulus is low and has good elasticity.Simultaneously PDMS have extraordinary heat resistance, highest can bearing temperature be 200oC。
Due to by it have many advantages, such as it is at low cost, using it is simple, there is good chemical inertness and be widely used in micro-fluidic, chip
The fields such as encapsulation have the characteristics that high transparency, strong elasticity and the substrate for being used as flexible strain transducer additionally, due to PDMS.
When the size of particle is nanoscale, will have quantum size effect, skin effect, bulk effect, maroscopic quantity
Sub- tunnel-effect etc., mechanics, calorifics, magnetics and in terms of will also have other special properties.Due to conduction material
Expect all the advantages showed on nanoscale, having had research to be based at present, nanometer conductive material exploitation is flexible, can stretch
Contracting and sensitive strain transducer further study the sensor as rehabilitation and personal health monitoring, body based on this
Monitoring structural health conditions, movenent performance monitoring and amusement human motion capture system are (for example, capturing game action and moving
Draw) etc..But the preparation method for the stress composite and flexible strain gauge reported at present is often all more complex, and be difficult to towards
Mass production.
Summary of the invention
The simple preparation method of the object of the present invention is to provide a kind of flexibility stress sensor based on nanometer conductive material,
It is expected to realize mass production while improving sensor stability, flexibility, sensitivity.In the preparation method, with one
The thin slice of scale cun prepares PDMS film with groove as template, solves the existing flexibility stress based on nanometer conductive material
Problems present in sensor preparation process.
The present invention adopts the following technical solutions realizes: a kind of flexibility stress sensor based on electrical-conductive nanometer material
Preparation method includes the following steps:
1) Flat bottom container is taken, puts a thin slice at Flat bottom container center;
2) PDMS solution is configured, takes host agent and curing agent mass ratio to be placed in culture dish for 10:1 and is uniformly mixed, using true
Empty drying box vacuumizes 10min, and the bubbles burst in mixed liquor is made to obtain the PDMS solution of surface bubble-free;
3) it takes PDMS solution made from step 2 to be added in step 1) in ready Flat bottom container, makes PDMS solution will
Thin slice covering;
4) Flat bottom container for filling PDMS and thin slice is put into 70 after standing levellingo1.5h, PDMS are heated in the drying box of C
Solution forms PDMS film;
5) PDMS film in Flat bottom container is taken out, removes thin slice, has just obtained the reeded PDMS Flexible formwork assembly of tool;
6) after two opposite side of PDMS Flexible formwork assembly groove draw an electrode respectively, conductive nano is filled in a groove
Material;
7) after the PDMS Flexible formwork assembly after nanometer conductive material to be filled is thoroughly dried, PDMS solution is configured, method is as walked
It is rapid that one layer of PDMS 2) is dripped in that layer surface of the PDMS film filled with nanometer conductive material, it is taken out using vacuum oven true
Empty 10min will be put into 70 equipped with the container of PDMS Flexible formwork assembly after standing levellingo1h is heated in the drying box of C, obtains THIN COMPOSITE
Film flexibility stress sensor.
The present invention prepares PDMS film with groove using the silicon wafer of certain size as template, and electrical-conductive nanometer is added wherein
Material and extraction electrode, upper layer fixes nano material and electrode with PDMS layer again, prepares flexibility stress sensor, preparation process
As shown in Figure 1.Be in step 5) by film in turn, it is bottom-up, thin slice is taken out, formed groove;It is electrode in step 6)
It is drawn outward by two opposite edges of groove;One layer of PDMS solution is dripped in reeded film surface in step 7), it will
Nanometer conductive material seals, while electrode being fixed on to the surface of PDMS film.
The present invention in a simple way combines electrical-conductive nanometer material with flexible base, further increases stress biography
The sensitivity of sensor and telescopicing performance are first that raw material is made with the groove (shape of groove with flexible material (such as PDMS)
Shape, size, variable thickness) flexible template;Then it is filled into electrical-conductive nanometer material (carbon nanotube, silver nanowires etc.) above-mentioned
In the groove of template;In the nanometer conductive material both ends extraction electrode of filling;Finally use flexible polymer material (such as PDMS)
Fixed nano material and electrode, enhancing structure stability on upper layer (this step can be omitted according to current demand).
The method of the present invention simple process, low in cost, controllability is strong, the flexibility based on electrical-conductive nanometer material being prepared
High sensitivity, the stability of strain gauge are strong, retractility is good, while being suitable for preparing various differences for different application
The flexibility stress sensor of shape size is expected to realize micromation, low cost, mass production.
Detailed description of the invention
Fig. 1 is the process schematic that the method for the present invention prepares flexibility stress sensor.
Specific embodiment
A kind of preparation method of the flexibility stress sensor based on electrical-conductive nanometer material, includes the following steps:
1) Flat bottom container is taken, puts a thin slice at Flat bottom container center;
2) PDMS solution is configured, takes host agent and curing agent mass ratio to be placed in culture dish for 10:1 and is uniformly mixed, using true
Empty drying box vacuumizes 10min, and the bubbles burst in mixed liquor is made to obtain the PDMS solution of surface bubble-free;
3) it takes PDMS solution made from step 2 to be added in step 1) in ready Flat bottom container, makes PDMS solution will
Thin slice covering;
4) Flat bottom container for filling PDMS and thin slice is put into 70 after standing levellingo1.5h, PDMS are heated in the drying box of C
Solution forms PDMS film;
5) PDMS film in Flat bottom container is taken out, removes thin slice, has just obtained the reeded PDMS Flexible formwork assembly of tool;
6) after two opposite side of PDMS Flexible formwork assembly groove draw an electrode respectively, conductive nano is filled in a groove
Material;
7) after the PDMS Flexible formwork assembly after nanometer conductive material to be filled is thoroughly dried, PDMS solution is configured, method is as walked
It is rapid that one layer of PDMS 2) is dripped in that layer surface of the PDMS film filled with nanometer conductive material, it is taken out using vacuum oven true
Empty 10min will be put into 70 equipped with the container of PDMS Flexible formwork assembly after standing levellingo1h is heated in the drying box of C, obtains THIN COMPOSITE
Film flexibility stress sensor.
The shape of the Flat bottom container and thin slice can be all adjusted according to application places, and shape can be used rectangular
Shape, circle, triangle, square, quadrangle, pentagon, five-pointed star, hexagon, hexagon, heptagon, hexagon, eight sides
Shape, octagonal, nonagon, nonagon, decagon, regular decagon, hendecagon, undecagon, dodecagon, dodecagon.
The thin slice uses silicon wafer, sheet glass, organic glass piece, plastic sheet.
The nanometer conductive material filled in the groove of PDMS Flexible formwork assembly can require to be adjusted according to different application,
With the physical quantity of measurement needed for more highly sensitive detection;The nanometer conductive material is using gold, silver, copper, californium, iron, aluminium, carbon
The one of which of various pattern nano materials or their one of oxides or in which two or more compound and mixed
Close object.
Two electrode structures prepared in step 6) are symmetric, and the electrode is from the edge of sensor base upper groove
It draws outward;The electrode is using one or more of silver, copper or ITO.
Embodiment 1
1) the short wall Flat bottom container of the rectangle of a 2*1cm is taken, puts the silicon wafer of a 0.8*0.3*0.05cm at center;
2) PDMS solution is configured, takes host agent and curing agent mass ratio to be placed in culture dish for 10:1 and is uniformly mixed, using true
Empty drying box vacuumizes 10min, and the bubbles burst in mixed liquor is made to obtain the PDMS solution of surface bubble-free;
3) PDMS solution made from step 2 is taken to be added in step 1) in ready container;
4) will multiply after standing levelling has the container of PDMS and silicon wafer to be put into 70o1.5h is heated in the drying box of C;
5) PDMS film in container is taken out, removes silicon wafer, has just obtained the reeded PDMS Flexible formwork assembly of tool;
6) after two narrow sides of groove conductive copper adhesive tape extraction electrode, nanometer conductive material silver nanoparticle is filled in a groove
Line;
7) after colloidal sol is thoroughly dried, PDMS solution is configured, method such as step 2 drips one layer of PDMS, benefit above groove
10min is vacuumized with vacuum oven, the container that PDMS Flexible formwork assembly and silicon wafer are housed will be put into 70 after standing levellingoC's
1h is heated in drying box, obtains the flexibility stress sensor with sandwich structure.
Embodiment 2
A kind of core-shell structural conductive polyaniline/Co3O4The preparation method of powder, includes the following steps:
1) the short wall Flat bottom container of circle for taking a diameter 2cm, puts a diameter 0.8cm at center with a thickness of 0.05cm's
Silicon wafer;
2) PDMS solution is configured, takes host agent and curing agent mass ratio to be placed in culture dish for 10:1 and is uniformly mixed, using true
Empty drying box vacuumizes 10min, and the bubbles burst in mixed liquor is made to obtain the PDMS solution of surface bubble-free;
3) PDMS solution made from step 2 is taken to be added in step 1) in ready container;
4) will multiply after standing levelling has the container of PDMS and silicon wafer to be put into 70o1.5h is heated in the drying box of C;
5) PDMS film in container is taken out, removes silicon wafer, has just obtained the reeded PDMS Flexible formwork assembly of tool;
6) after two narrow sides of groove conductive copper adhesive tape extraction electrode, filling carbon nano-pipe in a groove;
7) after colloidal sol is thoroughly dried, PDMS solution is configured, method such as step 2 drips one layer of PDMS, benefit above groove
10min is vacuumized with vacuum oven, the container that PDMS Flexible formwork assembly and silicon wafer are housed will be put into 70 after standing levellingoC's
1h is heated in drying box, obtains the flexibility stress sensor with sandwich structure.
Embodiment 3
1) the short wall Flat bottom container of circle for taking a diameter 2, puts the silicon wafer of a 0.8*0.3*0.05cm at center;
2) PDMS solution is configured, takes host agent and curing agent mass ratio to be placed in culture dish for 10:1 and is uniformly mixed, using true
Empty drying box vacuumizes 10min, and the bubbles burst in mixed liquor is made to obtain the PDMS solution of surface bubble-free;
3) PDMS solution made from step 2 is taken to be added in step 1) in ready container;
4) will multiply after standing levelling has the container of PDMS and silicon wafer to be put into 70o1.5h is heated in the drying box of C;
5) PDMS film in container is taken out, removes silicon wafer, has just obtained the reeded PDMS Flexible formwork assembly of tool;
6) after two narrow sides of groove conductive copper adhesive tape extraction electrode, filled graphite alkene in a groove;
7) after colloidal sol is thoroughly dried, PDMS solution is configured, method such as step 2 drips one layer of PDMS, benefit above groove
10min is vacuumized with vacuum oven, the container that PDMS Flexible formwork assembly and silicon wafer are housed will be put into 70 after standing levellingoC's
1h is heated in drying box, obtains the flexibility stress sensor with sandwich structure.
Embodiment 4
1) the short wall Flat bottom container of the rectangle of a 2*1cm is taken, puts a diameter 0.8cm at center with a thickness of 0.05cm's
Silicon wafer;
2) PDMS solution is configured, takes host agent and curing agent mass ratio to be placed in culture dish for 10:1 and is uniformly mixed, using true
Empty drying box vacuumizes 10min, and the bubbles burst in mixed liquor is made to obtain the PDMS solution of surface bubble-free;
3) PDMS solution made from step 2 is taken to be added in step 1) in ready container;
4) will multiply after standing levelling has the container of PDMS and silicon wafer to be put into 70o1.5h is heated in the drying box of C;
5) PDMS film in container is taken out, removes silicon wafer, has just obtained the reeded PDMS Flexible formwork assembly of tool;
6) after two narrow sides of groove conductive copper adhesive tape extraction electrode, the carbon of silver nano-grain cladding is filled in a groove
Nanotube;
7) after colloidal sol is thoroughly dried, PDMS solution is configured, method such as step 2 covers one layer of PDMS above groove,
10min is vacuumized using vacuum oven, the container that PDMS Flexible formwork assembly and silicon wafer are housed will be put into 70 after standing levellingoC
Drying box in heat 1h, obtain the flexibility stress sensor with sandwich structure.
Claims (9)
1. a kind of preparation method of the flexibility stress sensor based on electrical-conductive nanometer material, which comprises the steps of:
1) Flat bottom container is taken, puts a thin slice at Flat bottom container center;
2) PDMS solution is configured, takes host agent to be placed in culture dish with curing agent mass ratio for 10:1 and is uniformly mixed, it is dry using vacuum
Dry case vacuumizes 10min, and the bubbles burst in mixed liquor is made to obtain the PDMS solution of surface bubble-free;
3) it takes PDMS solution made from step 2 to be added in step 1) in ready Flat bottom container, makes PDMS solution by thin slice
Covering;
4) Flat bottom container for filling PDMS and thin slice is put into 70 after standing levellingo1.5h, PDMS solution are heated in the drying box of C
Form PDMS film;
5) PDMS film in Flat bottom container is taken out, removes thin slice, has just obtained the reeded PDMS Flexible formwork assembly of tool;
6) after two opposite side of PDMS Flexible formwork assembly groove draw an electrode respectively, conductive nano material is filled in a groove
Material;
7) after the PDMS Flexible formwork assembly after nanometer conductive material to be filled is thoroughly dried, configuration PDMS solution, method such as step 2,
One layer of PDMS is dripped in that layer surface of the PDMS film filled with nanometer conductive material, is vacuumized using vacuum oven
10min will be put into 70 equipped with the container of PDMS Flexible formwork assembly after standing levellingo1h is heated in the drying box of C, obtains laminated film
Flexibility stress sensor.
2. a kind of preparation method of the flexibility stress sensor based on electrical-conductive nanometer material as described in claim 1, feature
It is, the shape of the Flat bottom container and thin slice can be all adjusted according to application places, and rectangle, circle can be used in shape
Shape, triangle, square, quadrangle, pentagon, five-pointed star, hexagon, hexagon, heptagon, hexagon, octagon, illiciumverum
Shape, nonagon, nonagon, decagon, regular decagon, hendecagon, undecagon, dodecagon, dodecagon.
3. a kind of preparation method of the flexibility stress sensor based on electrical-conductive nanometer material as described in claim 1, feature
It is, the Flat bottom container uses the short wall Flat bottom container of rectangle of 2*1cm, and placing a specification at center is 0.8*0.3*
The thin slice of 0.05cm.
4. a kind of preparation method of the flexibility stress sensor based on electrical-conductive nanometer material as described in claim 1, feature
It is, the Flat bottom container is using round short wall Flat bottom container, diameter 2cm;The thin slice is circle, and diameter 0.8cm is thick
Degree is 0.05cm.
5. a kind of preparation method of the flexibility stress sensor based on electrical-conductive nanometer material as described in claim 1, feature
It is, the short wall Flat bottom container of circle that the Flat bottom container is diameter 2cm puts the thin of a 0.8*0.3*0.05cm at center
Piece.
6. a kind of preparation method of the flexibility stress sensor based on electrical-conductive nanometer material as described in claim 1, feature
Be, the Flat bottom container use 2*1cm the short wall Flat bottom container of rectangle, center put a diameter 0.8cm, with a thickness of
The thin slice of 0.05cm.
7. a kind of preparation method of the flexibility stress sensor based on electrical-conductive nanometer material as described in claim 1, feature
It is, the thin slice uses silicon wafer, sheet glass, organic glass piece or plastic sheet.
8. a kind of preparation method of the flexibility stress sensor based on electrical-conductive nanometer material as described in claim 1, feature
Be, the nanometer conductive material using gold, silver, copper, californium, iron, aluminium, carbon various pattern nano materials one of which or it
One of oxide or in which two or more compound and mixture.
9. the preparation side of described in any item a kind of flexibility stress sensors based on electrical-conductive nanometer material according to claim 1 ~ 8
Method, it is characterised in that: two electrode structures prepared in step 6) are symmetric, and the electrode is from sensor base upper groove
Edge draw outward;The electrode is using silver or copper.
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CN104523231B (en) * | 2014-12-24 | 2017-07-21 | 上海集成电路研发中心有限公司 | Pliable pressure sensing part, sensor and its manufacture method |
CN105181185A (en) * | 2015-08-25 | 2015-12-23 | 中山大学 | Flexible conductive pressure sensor and manufacturing method therefor |
CN105136375A (en) * | 2015-09-09 | 2015-12-09 | 宁波绿凯节能科技有限公司 | Preparation method of flexible pressure sensor having high sensitivity |
CN105758562B (en) * | 2016-03-29 | 2018-10-16 | 电子科技大学 | A kind of pliable pressure sensor and preparation method thereof |
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