CN106493939B - 3D printing method and 3D printer of embedded electronic product - Google Patents
3D printing method and 3D printer of embedded electronic product Download PDFInfo
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- CN106493939B CN106493939B CN201611197075.9A CN201611197075A CN106493939B CN 106493939 B CN106493939 B CN 106493939B CN 201611197075 A CN201611197075 A CN 201611197075A CN 106493939 B CN106493939 B CN 106493939B
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Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B33—ADDITIVE MANUFACTURING TECHNOLOGY
- B33Y—ADDITIVE MANUFACTURING, i.e. MANUFACTURING OF THREE-DIMENSIONAL [3-D] OBJECTS BY ADDITIVE DEPOSITION, ADDITIVE AGGLOMERATION OR ADDITIVE LAYERING, e.g. BY 3-D PRINTING, STEREOLITHOGRAPHY OR SELECTIVE LASER SINTERING
- B33Y10/00—Processes of additive manufacturing
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B33—ADDITIVE MANUFACTURING TECHNOLOGY
- B33Y—ADDITIVE MANUFACTURING, i.e. MANUFACTURING OF THREE-DIMENSIONAL [3-D] OBJECTS BY ADDITIVE DEPOSITION, ADDITIVE AGGLOMERATION OR ADDITIVE LAYERING, e.g. BY 3-D PRINTING, STEREOLITHOGRAPHY OR SELECTIVE LASER SINTERING
- B33Y30/00—Apparatus for additive manufacturing; Details thereof or accessories therefor
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B33—ADDITIVE MANUFACTURING TECHNOLOGY
- B33Y—ADDITIVE MANUFACTURING, i.e. MANUFACTURING OF THREE-DIMENSIONAL [3-D] OBJECTS BY ADDITIVE DEPOSITION, ADDITIVE AGGLOMERATION OR ADDITIVE LAYERING, e.g. BY 3-D PRINTING, STEREOLITHOGRAPHY OR SELECTIVE LASER SINTERING
- B33Y80/00—Products made by additive manufacturing
Landscapes
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Materials Engineering (AREA)
Abstract
本发明公开了一种嵌入式电子产品的3D打印方法及3D打印机，本发明在打印每层结构材料层完毕后在支撑预留位周围喷印一层离型材料，再打印支撑，当本组结构层打印完成，去除预留孔和槽的支撑，嵌入电子元器件，依次打印该组导电层结构、喷印导电线路和在导电线路之间喷印介电材料，重复直至打印完成最后一组导电层结构，打印结构材料将电子产品封装。本发明在结构材料和支撑材料之间引入离型材料，支撑材料易于去除，一方面避免使用超声碱溶液去除支撑(嵌入式电子产品不允许采用传统的支撑去除工艺)，另一方面避免支撑去除对于已经打印导电电路的影响。有效的解决了嵌入式电子产品制造过程中的支撑去除的难题。
The invention discloses a 3D printing method and a 3D printer for embedded electronic products. After printing each structural material layer, the invention prints a layer of release material around the support reserved position, and then prints the support. After the printing of the structural layer is completed, the support of the reserved holes and grooves is removed, the electronic components are embedded, and the conductive layer structure of the group, the conductive lines are printed in sequence, and the dielectric material is printed between the conductive lines, and repeat until the last group of printing is completed. Conductive layer structure, printing structural materials to encapsulate electronic products. The present invention introduces a release material between the structural material and the support material, and the support material is easy to remove. On the one hand, it avoids the use of ultrasonic alkali solution to remove the support (the traditional support removal process is not allowed for embedded electronic products), and on the other hand, the support removal is avoided. Effects on already printed conductive circuits. It effectively solves the problem of support removal in the manufacturing process of embedded electronic products.
Description
Technical field
The invention belongs to increasing material manufacturings and technical field of electronic products, and in particular to a kind of 3D of embedded electronic product is beaten
Impression method and 3D printer.
Background technique
Embedded electronic product (functional structure electronics) is that occur in recent years along with the development of increases material manufacturing technology
A kind of novel electronic product, printing objects structure simultaneously, by electronics such as sensor, controller, driver, antenna, batteries
Element is embedded into the structure printed simultaneously, and some simple circuits, connection circuit etc. are directly printed, really real
Existing functional structure electronic product is integrated, and material-structure-device is integrated.Compared with traditional electronic product,
Embedded electronic product has some unique advantages and outstanding feature；(1) assembling, reliability are exempted from compact-sized, lightweight
Height, the manufacturing cycle is short, production cost is low；(2) multi-functional, there is multiple functions characteristic；(3) in certain special dimensions and extremely
(the entire shell of embedded electronic product is a seamless entirety, is had fine for environment such as aerospace, high airtightness product
Dust-proof, waterproof function) etc. show some distinctive advantages.In addition, embedded electronic product has also overturned traditional electro-mechanical
The theory of product and electronic product exploitation provides a kind of completely new thinking and solution party for the exploitation of many creative products
Case.Electronic product 3D printing has become one of the research hotspot in current 3D printing field in the world.
Embedded electronic product 3D printing is a kind of typical more material 3D printing techniques, and printed material includes structural material
The multiple materials such as (plastics, polymer, ceramics, metal etc.), conductive material, dielectric material (insulating materials) relate in print procedure
And multiple material is frequently converted, in addition, also need frequently to suspend in print procedure, realizes the insertion of component and some
The removal of support and necessary auxiliary process (such as the post-processing of conducting wire, heat treatment are allowed to conducting etc.).
But existing 3D printing technique is unable to satisfy the multiple functions demand of embedded electronic product 3D printing.It has seriously affected
With constrain embedded electronic product development and extensive use (such as soft robot, wearable device, RFID of Internet-of-things,
3D structure electrical etc.), there is an urgent need to develop novel embedded electronic product 3D printing technique, equipment and materials.
Summary of the invention
The present invention to solve the above-mentioned problems, proposes the 3D printing method and 3D printing of a kind of embedded electronic product
Machine, present invention combination fusion sediment (FDM) and electronic auxiliary injection deposition technique, introduce between structural material and backing material
A kind of separated type material provides the novel more Material cladding 3D printing techniques of one kind and equipment, realizes structural material and functional material one
Bodyization printing, effectively solves the problems, such as to support removal in embedded electronic product manufacturing process, realizes embedded electronic product " material
Material-structure-device " is integrated, and especially realizes that the electronic product with multilayer circuit structure is integrated, solves
Existing 3D printing technique cannot achieve the problem of embedded electronic product is integrated.
It is an object of the present invention to provide a kind of 3D printing methods of embedded electronic product, in conjunction with fusion sediment
(FDM) and electronic auxiliary injection deposition technique a kind of separated type material, is introduced between structural material and backing material, is effectively solved
The problem of removal is supported in embedded electronic product manufacturing process.
Another object of the present invention is then to provide a kind of printing device for realizing the 3D printing method, which can be
In one equipment simultaneously sequence print structure material, separated type material, backing material, conductive material and insulating materials, realize structure
Material and functional material integration printing especially realize that the electronic product with multilayer circuit structure is integrated.
Another object of the present invention is then to provide a kind of working method of above-mentioned printing device, has with specific implementation more
The electronic product of layer circuit structure is integrated.By utilizing the Method of printing or using the embedded electronic of the device fabrication
Product can use to multiple product manufacturings such as soft robot, wearable electronic product, RFID of Internet-of-things, 3D structure electricals
Field has a wide range of applications, and is within the scope of protection of the invention.
To achieve the goals above, the present invention adopts the following technical scheme:
A kind of 3D printing method of embedded electronic product, in support reserved place after printing every layer of structural material
One layer of separated type material of surrounding spray printing, then support is printed, when this group of structure sheaf printing is completed, the support of removal preformed hole and slot is embedding
Enter electronic component, successively print this group of conductive coating structure, spray printing conducting wire and the spray printing dielectric material between conducting wire,
It is repeated up to printing and completes last group of conductive coating structure, print structure material is by electronic product packaging.
The present invention introduces separated type material between structural material and backing material, and backing material is easily removed, on the one hand keeps away
Exempt to remove support (embedded electronic product does not allow using traditional support removal technique) using ultrasonic aqueous slkali, on the other hand
Support is avoided to remove the influence for having printed conducting channel.In effective solution embedded electronic product manufacturing process
Support the problem of removal.
A kind of 3D printer for realizing above-mentioned Method of printing, including printing bed, three-dimensional motion mechanism, nozzle group and control
Device, controller control the relative motion that three-dimensional motion mechanism drives nozzle group to carry out X, Y, Z axis direction relative to printing bed, simultaneously
Control the corresponding spray head of nozzle group setting position to be placed on printing bed by printing objects successively blasting materials；
The nozzle group includes the multiple of print structure material, backing material, separated type material, conductive material and insulating materials
Spray head.
Preferably, the printing bed includes support plate, hott bed aluminum substrate and magnetic printing platform, magnetic printing platform and heat
Bed aluminum substrate is detachably connected.
Preferably, the magnetic printing platform and hott bed aluminum substrate pass through magnetic fixed block and magnetic fixing groove is realized and dismantled
With installation.
Certainly, magnetic printing platform is connect by other means with hott bed aluminum substrate, such as utilizes other bindiny mechanisms, such as magnetic
Iron, cutting ferrule, taper pin etc., belonging to those skilled in the art's design progress simple transformation according to the present invention and combination can be obtained
Scheme, without paying any creative work i.e. it is contemplated that.
Structural material includes ABS, PLA, PVA, PEEK, nylon, electric wire etc., and backing material is water-soluble material, such as
PVA etc..Separated type material includes ptfe emulsion, dimethyl silicone polymer etc..Conductive material is electrically conductive ink, electrically conductive ink
Including conductive silver paste, nano silver conductive ink, nano-copper conductive ink, liquid metal, carbon nanotube conducting ink etc., insulation
(dielectric) material includes mineral insulating oil, liquid silica gel, insulation UV resin etc..
Certainly, those skilled in the art are fully able under the inspiration of the present invention, according to known in those skilled in the art
Common sense searches out replacement material, this to replace with simple replacement, without paying any creative work i.e. it is contemplated that.
Preferably, the nozzle group includes at least two fusion sediment spray heads, one of fusion sediment nozzle printing knot
Structure material, another fusion sediment nozzle printing backing material.
Preferably, the nozzle group further includes several microinjection type electric sprays.
Preferably, the electric spray includes motor, shaft coupling, transmission mechanism, storage vat and syringe needle, the motor and is passed
Motivation structure is connected by shaft coupling, and transmission mechanism is placed in storage vat, and syringe needle is placed in storage vat bottom.
Preferably, the three-dimensional motion mechanism includes X-axis workbench, Y-axis workbench and Z axis workbench, the X-axis work
Platform, Y-axis workbench and Z axis workbench are electronic slide unit, and support is provided on the Y-axis workbench by the printing of printing objects
Bed, the X-axis workbench are slidably fixed on Z axis workbench.
Certainly, other three-dimensional motion mechanisms, such as multi-degree-of-freemechanical mechanical arm, three-dimensional rotation workbench, digital control three-dimensional workbench
Etc. forms, can be used to this 3D printer, belong to those skilled in the art's design according to the present invention and simply become
Change and combine the scheme that can be obtained, without paying any creative work i.e. it is contemplated that.
The working method of above-mentioned 3D printer, comprising the following steps:
(1) spray head and printing bed start to be preheated to assigned temperature, and three-dimensional motion mechanism drives printing bed to move to working position,
Control spray head drops to the position of distance printing one thickness of bed；
(2) according to slice information, start to print first group of structure sheaf, in print procedure, if desired printing support, then every
Before layer printing support, in support reserved place periphery spray printing separated type material, then nozzle printing support is switched back into, when first group of structure sheaf
After the completion of printing, the magnetic printing platform on printing bed is removed, the support to the structure sheaf removal preformed hole and slot that are printed is embedding
Enter electronic component, magnetic printing stage+module is returned into print bed after the completion, prints first group of conductive coating structure, spray printing conductor wire
Road, the spray printing dielectric material between conducting wire complete the printing of the first set product；
(3) the above movement is repeated, until printing last group of conductive coating structure of completion, structure sheaf and conductive layer are encapsulated.
After printing, three-dimensional motion mechanism and printing bed is set to restore initial position, and carry out conductive material, such as nano silver
The subsequent handling of ink etc..
The invention has the benefit that
(1) present invention realizes efficient, inexpensive embedded electronic product and is integrated, material, structure and device
It is integrated.
(2) more file printings, the present invention realize structural material, backing material, separated type material, conductive material, dielectric material
Integration printing, Seamless integration-.
(3) separated type material is introduced between structural material and backing material, backing material is easily removed, and on the one hand avoids making
With ultrasonic aqueous slkali removal support (embedded electronic product does not allow using traditional support removal technique), on the other hand avoid
Support removes the influence for having printed conducting channel.Support in effective solution embedded electronic product manufacturing process
The problem of removal.
(4) printing bed uses magnetic printing platform, is positioned by magnetic fixed block and magnetic fixing groove, positioning accuracy
Height, convenient for being supported removal to printout, electronic component is embedded in, and the pause in print procedure can be facilitated to remove and install fixed
Position.
(5) present invention solves the products such as soft robot, wearable electronic product, RFID of Internet-of-things, 3D structure electrical
The problem being integrated.
Detailed description of the invention
Fig. 1 is the principle schematic diagram for the 3D printer that the embodiment of the present invention 1 is used to manufacture embedded electronic product；
Fig. 2 is the structural principle perspective view for the 3D printer that the embodiment of the present invention 1 is used to manufacture embedded electronic product；
Fig. 3 is 1 magnetic printing bed explosion diagram of the embodiment of the present invention；
Fig. 4 is the structural schematic diagram of 1 microinjection type electric spray of the embodiment of the present invention；
Fig. 5-1 to Fig. 5-9 is the print procedure schematic diagram of embedded electronic product of the present invention；Wherein, Fig. 5-1 is product the
One group of structure sheaf, support and release layer schematic diagram；Fig. 5-2 is schematic diagram after removal support；Fig. 5-3 is first group of electronics member of insertion
Device schematic diagram；Fig. 5-4 is first group of conductive layer schematic diagram of printing；Fig. 5-5 is second group of structure sheaf of printing, support and release layer
Schematic diagram；Fig. 5-6 is removal support schematic diagram；Fig. 5-7 is second group of electronic component schematic diagram of insertion；Fig. 5-8 is printing the
Two groups of conductive layer schematic diagrames；Fig. 5-9 is product encapsulation schematic diagram；
Fig. 6 is process flow chart of the embodiment of the present invention 1 based on embedded electronic product 3D printing；
Fig. 7 is the principle schematic diagram for the 3D printer that the embodiment of the present invention 2 is used to manufacture embedded electronic product.
Wherein, 1 pedestal, 2 bracket I, 3 bracket II, 4Y are to workbench, 5 printing beds, 501 support plates, 502 hott bed aluminum substrates,
50201 magnetic fixing grooves, 503 magnetic printing platforms, 50301 magnetic fixed blocks, 6Z is to workbench I, and 7Z is to workbench II, and 8 the
One spray head, 9 second spray heads, 901 motors, 902 shaft couplings, 903 screw rods, 904 transmission nuts, 905 storage vats, 906 syringe needles, 10
Three spray heads, 11 the 4th spray heads, 12 spray head mounting plates, 13X is to workbench, 14 high voltage power supplies, 1501 structure sheafs, 1502 release layers,
1503 support constructions, 1504 electronic components, 1505 conductive layers, 1506 encapsulated layers, 15 two layers of embedded electronic product.
Specific embodiment:
The invention will be further described with embodiment with reference to the accompanying drawing.
Embodiment 1
Fig. 1 is the principle schematic diagram for the 3D printer that the embodiment of the present invention 1 is used to manufacture embedded electronic product, figure
2 be that the structural principle of 3D printer that the embodiment of the present invention 1 is used to manufacture embedded electronic product shows perspective view.Embodiment 1
3D printer for manufacturing embedded electronic product include: pedestal 1, bracket I2, bracket II3, Y-direction workbench 4, printing bed 5,
Z-direction workbench I6, Z-direction workbench II7, first spray head 8, second spray head 9, third spray head 10, the 4th spray head 11, spray head mounting plate
12, X is to workbench 13.Wherein Y-direction workbench 4 is fixed on pedestal 1, and is located at the center of pedestal 1；Bed 5 is printed by support plate
501, hott bed aluminum substrate 502 and the composition of magnetic printing platform 503 are placed on Y-direction workbench；Z-direction workbench I6 and Z-direction work
Platform II7 is fixed on pedestal 1 by bracket I2 and bracket II3, the equidistant two sides positioned at 4 direction of displacement of Y-direction workbench, and position
In the bottom end of Y-direction workbench 4；X is fixed on Z-direction workbench I6 and Z-direction workbench II7 to workbench 13；First spray head 8,
Two spray heads 9, third spray head 10 and the 4th spray head 11 are fixed on X on workbench 13 by spray head mounting plate 12.
The Y-direction workbench 4 drives printing bed 5 to move in the Y direction using accurate straight line electric sliding platform.Working line
Journey: 200mm, repetitive positioning accuracy≤0.03mm.
The Z-direction workbench I6 and Z-direction workbench II7, using accurate straight line electric sliding platform, by driving X to workbench
13, drive first spray head 8, second spray head 9, third spray head 10 and the 4th spray head 11 to move in z-direction.Impulse stroke:
200mm, repetitive positioning accuracy≤0.03mm.
The X is to workbench 13, using accurate straight line electric sliding platform, by spray head mounting plate 12, drive first spray head 8,
Second spray head 9, third spray head 10 and the 4th spray head 11 are moved in X-direction.Impulse stroke: 300mm, repetitive positioning accuracy≤
0.03mm。
The printing bed 5 prints bed by support plate 501, hott bed aluminum substrate 502 using having magnetic removable print platform
It is formed with magnetic printing platform 503.Magnetic printing platform 503 and hott bed aluminum substrate 502 pass through magnetic fixed block 50301 and magnetism
The realization of fixing groove 50201 removes and installs.
The first spray head 8 is fusion sediment spray head, using the bis- spray heads of Ultimaker2UM2,1.75mmABS material.
The second spray head 9, third spray head 10 and the 4th spray head 11 are microinjection type electric spray, the microinjection type electricity
Dynamic spray head includes: motor 901, shaft coupling 902, screw rod 903, transmission nut 904, storage vat 905, syringe needle 906 etc..Micro- note
Emitting electric spray, fluid pressure 0-1.6MPa, specification 5ml.906 internal diameter of syringe needle is 0.1-1000 μm.
Fig. 3 is the explosive view that the embodiment of the present invention 1 prints bed 5, and the printing bed 5 is by support plate 501, hott bed aluminum substrate
502 and magnetic printing platform 503 form.The support plate 501, hott bed aluminum substrate 502 are provided with threaded hole up and down, pass through
It is bolted fastening.502 upper surface of hott bed aluminum substrate has magnetic fixing groove 50201,503 lower surface of magnetic printing platform
With magnetic fixed block 50301, the hott bed aluminum substrate 502 and magnetic printing platform 503 can pass through magnetic 50201 He of fixing groove
The magnetic realization of fixed block 50301 removes and installs positioning.
Fig. 4 is the structural schematic diagram of 1 second spray head 9 of the embodiment of the present invention, and the second spray head 9 is by motor 901, shaft coupling
902, screw rod 903, transmission nut 904, storage vat 905, syringe needle 906 form.The motor 901 passes through shaft coupling with screw rod 902
903 are connected, and screw rod 902 is placed in storage vat 905, and syringe needle 906 is placed in 905 bottom of storage vat.The motor 901 includes servo electricity
Machine, stepper motor etc..
1 for manufacturing the 3D printer of embedded electronic product based on the above embodiment, manufactures embedded electronic product
Working method includes the following steps:
Step 1: printing initial setting up, pretreatment.First spray head 8 and printing bed 5 start to be preheated to assigned temperature, Y-direction work
Making platform 4 drives printing bed 5 to be moved to working position, and Z-direction workbench I6 and Z-direction workbench II7 drive X to drop to the to workbench 13
Position of one spray head 8 apart from printing 5 one thickness of bed.
Step 2: printing shaping part.First spray head 8 starts to print first group of structure sheaf, print procedure according to slice information
In, if desired printing support has second spray head 9 supporting reserved place periphery spray printing separated type material then before every layer of printing supports,
First spray head printing support is switched back into again.After the completion of first group of structure sheaf prints, printer automatic pause is taken by operator
Magnetic print platform 503, the support to the structure sheaf removal preformed hole and slot that are printed, is embedded in electronic component.After the completion
Print bed 5 is returned into the installation of magnetic printing platform 503.At this point, clicking control panel " continuation " instruction in slave computer software, start
First group of conductive coating structure is printed, by 10 spray printing conducting wire of third spray head, by the 4th spray printing between conducting wire of spray head 11
Dielectric material, completion the first set product printing, and the above movement is repeated, last group of conductive coating structure is completed until printing, by
First spray head 8 encapsulates structure sheaf and conductive layer.
Step 3: post-processing.After completing part printing, feed is closed, and Y-direction workbench 4 drives printing bed 5 and printing part
Return in situ, Z-direction workbench I6 and Z-direction workbench II7 drive X to rise to original position to workbench 13, and X drives the to workbench 13
One spray head 8, second spray head 9, third spray head 10 and the 4th spray head 11 return to original position.Remove magnetic printing platform 503 and printing zero
Part removes printing part from magnetic printing platform 503.
By taking two layers of embedded electronic product 15 as an example, printing technology process is specific to print as shown in Fig. 5-1 to Fig. 5-9
Manufacturing process is as follows:
The present embodiment embedded electronic product structure sheaf printed material and supporting layer are ABS plastic, release layer printed material
For ptfe emulsion, conductive layer printed material is nano silver conductive ink, and dielectric (insulation) layer printed material is liquid silicon
Glue.
Two layers of embedded electronic product 15 is selected, needs to be embedded in electronic component according to the circuit that functional requirement designs
1504, each electronic component is connected by conductive layer 1505.Except conductive layer 1505, the structure of product printing further includes structure sheaf
1501, release layer 1502, support construction 1503 and encapsulated layer 1506.
The detailed process being integrated based on the 3D printing embedded electronic product 15:
Step 1: printing initial setting up, pretreatment.First spray head 8 and printing bed 5 start to be preheated to assigned temperature, Y-direction work
Making platform 4 drives printing bed 5 to be moved to working position, and Z-direction workbench I6 and Z-direction workbench II7 drive X to drop to the to workbench 13
Position of one spray head 8 apart from printing 5 one thickness of bed.
Step 2: printing shaping part.First spray head 8 starts to print according to the slice information of two layers of embedded electronic product 15
First set product structure sheaf 1501, in print procedure, when needing to print support, then first by second spray head 9 in support reserved place
Periphery spray printing separated type material is set, then switches back into the printing support of first spray head 8, release layer 1502 and supporting course 1503 is formed, such as schemes
Shown in 5-1.After the completion of the printing of the first set product structure sheaf 1501, printer automatic pause removes magnetic beat by operator
Platform 503 is printed, the support construction 1503 of preformed hole is removed to the product structure layer 1501 printed, as shown in Fig. 5-2, insertion electricity
Sub- component 1504, as shown in Fig. 5-3.Print bed 5 is returned into the installation of magnetic printing platform 503 after the completion.At this point, clicking slave computer
Control panel " continuation " instruction in software, starts to print first group of conductive layer 1505, by 10 spray printing conducting wire of third spray head,
Spray printing dielectric material, completion the first set product printing, as shown in Fig. 5-4 between conducting wire by the 4th spray head 11.Repeat with
Upper movement, until second group of conductive layer is completed in printing, as viewed in figures 5-8, by the printing encapsulated layer 1506 of first spray head 8, by structure
Layer is encapsulated with conductive layer, as shown in figures 5-9.
Step 3: post-processing.After completing the printing of two layers of embedded electronic product 15, feed is closed, and the drive of Y-direction workbench 4 is beaten
It prints bed 5 and printing part returns to original position, Z-direction workbench I6 and Z-direction workbench II7 drive X to rise to original position, X to workbench 13
First spray head 8, second spray head 9, third spray head 10 and the 4th spray head 11 is driven to return to original position to workbench 13.Remove magnetic printing
Platform 503 and two layers of embedded electronic product 15, two layers of embedded electronic product 15 is removed from magnetic printing platform 503.
Fig. 6 is process flow chart of the embodiment of the present invention 1 based on embedded electronic product 3D printing.
Embodiment 2
2 printer arrangement schematic illustration of embodiment is as shown in fig. 7, print conducting wire using electric Printing techniques.By
Three spray heads 10 connect high voltage power supply 14, it can be achieved that the higher precision of conducting wire with printing bed 5.
Above-mentioned, although the foregoing specific embodiments of the present invention is described with reference to the accompanying drawings, not protects model to the present invention
The limitation enclosed, those skilled in the art should understand that, based on the technical solutions of the present invention, those skilled in the art are not
Need to make the creative labor the various modifications or changes that can be made still within protection scope of the present invention.
Claims (10)
1. a kind of 3D printing method of embedded electronic product, it is characterized in that: being propped up after printing every layer of structural material
One layer of separated type material of spray printing around reserved place is supportted, then prints support, when this group of structure sheaf printing is completed, removal preformed hole and slot
Support is embedded in electronic component, successively prints this group of conductive coating structure, spray printing conducting wire and spray printing is situated between conducting wire
Electric material is repeated up to printing and completes last group of conductive coating structure, and print structure material is by electronic product packaging.
2. a kind of 3D printing method of embedded electronic product as described in claim 1, it is characterized in that: this method uses more materials
Expect that compound 3D printer is printed, more Material cladding 3D printers include printing bed, three-dimensional motion mechanism, nozzle group and
Controller, controller control the relative motion that three-dimensional motion mechanism drives nozzle group to carry out X, Y, Z axis direction relative to printing bed,
Control simultaneously the corresponding spray head of nozzle group setting position to be placed on printing bed by printing objects successively blasting materials；
The nozzle group includes multiple sprays of print structure material, backing material, separated type material, conductive material and insulating materials
Head.
3. a kind of 3D printing method of embedded electronic product as claimed in claim 2, it is characterized in that: the printing bed includes
Support plate, hott bed aluminum substrate and magnetic printing platform, magnetic printing platform are detachably connected with hott bed aluminum substrate.
4. a kind of 3D printing method of embedded electronic product as claimed in claim 3, it is characterized in that: the magnetic printing is flat
Platform passes through magnetic fixed block with hott bed aluminum substrate and magnetic fixing groove realization removes and installs.
5. a kind of 3D printing method of embedded electronic product as claimed in claim 2, it is characterized in that: the nozzle group is at least
Including two fusion sediment spray heads, one of fusion sediment nozzle printing structural material, another fusion sediment nozzle printing
Backing material.
6. a kind of 3D printing method of embedded electronic product as claimed in claim 2, it is characterized in that: the nozzle group is also wrapped
Include several microinjection type electric sprays.
7. a kind of 3D printing method of embedded electronic product as claimed in claim 6, it is characterized in that: the electric spray packet
Motor, shaft coupling, transmission mechanism, storage vat and syringe needle are included, the motor is connected with transmission mechanism by shaft coupling, driver
It sets up in storage vat, syringe needle is placed in storage vat bottom.
8. a kind of 3D printing method of embedded electronic product as claimed in claim 2, it is characterized in that: the three-dimensional motion machine
Structure includes X-axis workbench, Y-axis workbench and Z axis workbench, and the X-axis workbench, Y-axis workbench and Z axis workbench are electricity
Slide unit is moved, support is provided on the Y-axis workbench by the printing bed of printing objects, the X-axis workbench is slidably fixed on Z axis
On workbench.
9. a kind of 3D printing method of embedded electronic product as claimed in claim 2, it is characterized in that: structural material includes
ABS, PLA, PVA, PEEK, nylon or electric wire；Or backing material is water-soluble material；Or separated type material includes polytetrafluoroethyl-ne
Alkene lotion or dimethyl silicone polymer；Or conductive material is electrically conductive ink；Or insulating materials includes mineral insulating oil, liquid silicon
Glue, insulation UV resin.
10. the 3D printing method as described in any one of claim 2-9, it is characterized in that: the following steps are included:
(1) spray head and printing bed start to be preheated to assigned temperature, and three-dimensional motion mechanism drives printing bed to move to working position, controls
Spray head drops to the position of distance printing one thickness of bed；
(2) according to slice information, start to print first group of structure sheaf, in print procedure, if desired printing support, then beat at every layer
Before print support, in support reserved place periphery spray printing separated type material, then nozzle printing support is switched back into, when first group of structure sheaf prints
After the completion, the magnetic printing platform on printing bed is removed, the support to the structure sheaf removal preformed hole and slot that are printed, insertion electricity
Magnetic printing stage+module is returned print bed after the completion by sub- component, prints first group of conductive coating structure, spray printing conducting wire,
The spray printing dielectric material between conducting wire completes the printing of the first set product；
(3) the above movement is repeated, until printing last group of conductive coating structure of completion, structure sheaf and conductive layer are encapsulated.
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