CN106493474A - A kind of laser double-surface score device - Google Patents
A kind of laser double-surface score device Download PDFInfo
- Publication number
- CN106493474A CN106493474A CN201611173667.7A CN201611173667A CN106493474A CN 106493474 A CN106493474 A CN 106493474A CN 201611173667 A CN201611173667 A CN 201611173667A CN 106493474 A CN106493474 A CN 106493474A
- Authority
- CN
- China
- Prior art keywords
- laser
- workpiece
- score device
- double
- focus
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 230000003287 optical effect Effects 0.000 claims abstract description 20
- 238000003698 laser cutting Methods 0.000 claims abstract description 16
- 238000005520 cutting process Methods 0.000 claims abstract description 11
- 239000000463 material Substances 0.000 claims description 17
- 239000011248 coating agent Substances 0.000 claims description 13
- 238000000576 coating method Methods 0.000 claims description 13
- 230000006978 adaptation Effects 0.000 claims description 3
- 238000002493 microarray Methods 0.000 claims description 3
- 239000005304 optical glass Substances 0.000 claims description 2
- 238000010586 diagram Methods 0.000 description 8
- 238000000034 method Methods 0.000 description 8
- 239000002893 slag Substances 0.000 description 5
- 238000012545 processing Methods 0.000 description 4
- 241000931526 Acer campestre Species 0.000 description 3
- 230000000694 effects Effects 0.000 description 3
- 238000002679 ablation Methods 0.000 description 2
- 238000010521 absorption reaction Methods 0.000 description 2
- 230000009471 action Effects 0.000 description 2
- 230000006378 damage Effects 0.000 description 2
- 238000011161 development Methods 0.000 description 2
- 238000004299 exfoliation Methods 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 238000007747 plating Methods 0.000 description 2
- 230000008901 benefit Effects 0.000 description 1
- 238000006243 chemical reaction Methods 0.000 description 1
- 230000007423 decrease Effects 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 230000002950 deficient Effects 0.000 description 1
- 238000013461 design Methods 0.000 description 1
- 238000009826 distribution Methods 0.000 description 1
- 239000012634 fragment Substances 0.000 description 1
- 230000003993 interaction Effects 0.000 description 1
- 238000002372 labelling Methods 0.000 description 1
- 239000000203 mixture Substances 0.000 description 1
- 230000000149 penetrating effect Effects 0.000 description 1
- 230000008569 process Effects 0.000 description 1
- 229910052594 sapphire Inorganic materials 0.000 description 1
- 239000010980 sapphire Substances 0.000 description 1
- 229910052710 silicon Inorganic materials 0.000 description 1
- 239000010703 silicon Substances 0.000 description 1
- 238000003892 spreading Methods 0.000 description 1
- 230000007480 spreading Effects 0.000 description 1
- 239000000758 substrate Substances 0.000 description 1
- 238000012360 testing method Methods 0.000 description 1
- 239000012780 transparent material Substances 0.000 description 1
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/36—Removing material
- B23K26/38—Removing material by boring or cutting
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
- B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
- B23K26/064—Shaping the laser beam, e.g. by masks or multi-focusing by means of optical elements, e.g. lenses, mirrors or prisms
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
- B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
- B23K26/064—Shaping the laser beam, e.g. by masks or multi-focusing by means of optical elements, e.g. lenses, mirrors or prisms
- B23K26/0643—Shaping the laser beam, e.g. by masks or multi-focusing by means of optical elements, e.g. lenses, mirrors or prisms comprising mirrors
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
- B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
- B23K26/067—Dividing the beam into multiple beams, e.g. multifocusing
Landscapes
- Physics & Mathematics (AREA)
- Optics & Photonics (AREA)
- Engineering & Computer Science (AREA)
- Plasma & Fusion (AREA)
- Mechanical Engineering (AREA)
- Laser Beam Processing (AREA)
Abstract
A kind of laser double-surface score device, the device include a laser instrument；One precision laser cutting head, the laser beam that laser instrument sends is by optic path in precision laser cutting head；, in precision laser cutting head, laser beam respectively forms a focus on the upper and lower surface of workpiece, while carrying out score work to upper and lower surface after diffraction optical lens and focus lamp for one diffraction optical lens and a focus lamp；One CCD camera, coaxially connected with precision laser cutting head, automatic identification positioning is carried out to cutting position.
Description
Technical field
The invention belongs to high-precision laser cutting technique field, is related to a kind of high-precision laser score device, especially fits
For the material transparent to applied optical maser wavelength, workpiece is thicker, and requires without heat affected area, the laser score without chipping.
Background technology
With the progress and development of science and technology, laser is applied in all trades and professions as a kind of instrument.Due to laser
High brightness high intensity characteristic, and the size of laser facula can focus on micron dimension by focus lamp, and therefore laser adds
Work technology enjoys favor in the industry for having high accuracy processing request, especially for pottery, monocrystal silicon and sapphire contour,
Firmly, in crisp unmanageable cutting technique, laser processing technology is particularly welcome.
The first step by taking semicon industry as an example, in the slice process Shi Hou roads assembly technology of wafer.The technique is by wafer
It is divided into single chip, for subsequent chip bonding, wire bonding and test technology.When chip size less and less, integrated
Degree more and more higher, traditional mechanical microtomy production capacity decline, and fragment rate rises, and the percent defective of generation increases.In such case
Under, laser cutting technique is able to manifest advantage.As laser belongs to non-contact type processing, the work of mechanical stress is not produced to wafer
With, to wafer damage less.Therefore laser wafer microtomy obtains development energetically.
Although, laser cutting technique alleviates drawbacks described above to a great extent, but when laser technology is used, its heat
The zone of influence is excessive and the problem of slag splash pollution is properly settled not yet, and these shortcomings be enough to the performance for affecting or destroying chip,
Particularly transparent material, particularly evident to slag pollution problem.Particularly the hard high crisp material of height is carried out after conventional laser processing,
Sliver chipping problem is particularly evident.
Content of the invention
In order to solve the base material transparent for optical maser wavelength, the heat of appearance in conventional cut dicing technique
The zone of influence is excessive and the problem of slag splash pollution, and chipping problem during sliver, back side plating exfoliation ablation problem, the present invention are proposed
A kind of laser double-surface score device.
The purpose of the present invention is achieved through the following technical solutions：
A kind of laser double-surface score device, the device include a laser instrument；One precision laser cutting head, laser instrument send
Laser beam is by optic path in precision laser cutting head；One diffraction optical lens and a focus lamp are arranged on laser accurate
In cutting head, laser beam respectively forms a focus on the upper and lower surface of workpiece after diffraction optical lens and focus lamp, while
Score work is carried out to upper and lower surface.
In the laser bilayer score device of the present invention, the laser beam that laser instrument sends is by diffraction optical lens and focusing
After mirror, respectively a focus is formed on the upper and lower surface of workpiece, while carrying out score work to upper and lower surface, adjust the energy of laser beam
Amount so as to form neat smooth cut simultaneously in workpiece surface and lower surface, it is to avoid the appearance of heat affected area and slag.
In the laser bilayer score device of the present invention, the selection of laser instrument is relevant with the material of workpiece, it is desirable to which workpiece is to institute
Select the wavelength of laser instrument transparent, can enable the laser beam of the wavelength while workpiece surface forms focus, can also pass through
Workpiece, forms focus in workpiece lower surface.
In the laser bilayer score device of the present invention, the energy of laser instrument is had required, it is desirable to formed on upper and lower surface
Focal point, the energy density of laser beam can destroy workpiece material just, after considering through workpiece, lower surface focus on
Light beam, it is to avoid occur heat absorption in inside workpiece transmitting procedure, destroy characteristic, affect cutting effect.
In the laser bilayer score device of the present invention, according to the thickness of practical work piece, two focuses are made to be located at workpiece upper table
Face and lower surface.The position of focus point and energy are corresponding to different diffraction optical lens and focus lamp.
In the laser bilayer score device of the present invention, according to the frequency of the laser instrument, the workpiece level direction is adjusted
The speed of motion, has certain Duplication to make adjacent spots on the same face, thus on the upper and lower surface of workpiece while shape
Into paddle-tumble.
In the laser bilayer score device of the present invention, also include a CCD camera, coaxially connected with precision laser cutting head,
Automatic identification positioning is carried out to cutting position.So as to real-time adjustment precision laser cutting head.
In the laser bilayer score device of the present invention, diffraction optical lens can be microarray lens or self adaptation eyeglass.
In the laser bilayer score device of the present invention, the hot spot of described focus point is ellipse, the length of oval hot spot
Axle is on the thickness of workpiece direction.
In the laser bilayer score device of the present invention, centre position on the thickness of workpiece direction of the workpiece, also shape
Into a focus point.
In the laser bilayer score device of the present invention, described workpiece is multiple structure, and described laser instrument can send
Multiwavelength laser, carries out multilamellar score to the workpiece.
In the laser bilayer score device of the present invention, described multiple structure includes coating.
A kind of influence area of present invention offer is little, and low laser bilayer score device is polluted in slag splash, and high yield rate is raw
Produce efficiency hinge structure to greatly improve.Paddle-tumble, or its thickness of upper and lower surface in workpiece are formed on the upper and lower surface of workpiece
The centre position in direction carries out score, good cutting effect, and during sliver, chipping defect is little, and back side plating exfoliation ablation problem is obtained very
Good solution.
Description of the drawings
Fig. 1 is the laser bilayer score schematic device of the present invention；
After the completion of Fig. 2 is laser action movement locus, inside workpiece schematic diagram；
Fig. 3 has after certain Duplication for focal beam spot, the paddle-tumble schematic diagram that the upper and lower surface of workpiece is formed；
Fig. 4 is the schematic diagram of stress direction when oval focal beam spot is acted on workpiece；
Fig. 5 is the schematic diagram for increasing focus point when workpiece is thicker；
Fig. 6 is the schematic diagram for producing cut after focal beam spot is acted on coating；
Schematic diagrams of the Fig. 7 for multilayer workpiece；
Schematic diagrams of the Fig. 8 for multiwavelength laser score device.
In figure, the implication of each labelling is as follows：
1：Laser instrument；
1a：First laser machine
1b：Second laser
1c：3rd laser instrument
2：Light path；
3：Precision laser cutting head；
4：Laser beam；
5：Diffraction optical lens；
6：Focus lamp；
7：Workpiece；
8：Focus point；
9：CCD；
10：Paddle-tumble；
11：Coating；
12：Coating paddle-tumble；
13：Workpiece ground floor；
14：The workpiece second layer；
S1：Light combination mirror；
S2：Light combination mirror；
S3：Reflecting mirror；
M：The motion of workpiece；
D：Horizontal range between focus point；
Y：Stress direction；
H：Thickness of workpiece.
Specific embodiment
Below in conjunction with the accompanying drawings the present invention is described in detail：
Fig. 1 represents laser double-surface score schematic device of the present invention, and its composition is as follows：By light path 2 by laser
The laser beam 4 that device 1 sends is transferred in precision laser cutting head 3；By the laser after diffraction optical lens 5 and focus lamp 6
Light beam forms a focus point 8 respectively in the upper and lower surface of workpiece 7；When workpiece 7 moves M relative to laser beam 4,
Laser is acted on simultaneously on the upper and lower surface of workpiece；When the speed of the motion M of adjustment workpiece makes focus point have certain laser beam overlap ratio
When, paddle-tumble 10 is formed on 7 upper and lower surface of workpiece；CCD9 carries out automatic identification positioning to the cutting scribing position on workpiece 7.
Fig. 2 show the schematic diagram of the focus point formed by laser action on the upper and lower surface of workpiece, adjacent in horizontal direction
The distance between focus point D is determined by the speed of relative motion.
After Fig. 3 show the speed of adjustment motion M, when laser focusing point hot spot has certain Duplication, in workpiece 7
Upper and lower surface forms one layer of paddle-tumble respectively.
In the laser double-surface score device of the present invention, after workpiece 7 is placed, CCD9 is carried out to the cutting position on workpiece 7
After automatic identification positioning, sending signal makes laser instrument 1 go out light；The laser beam 4 that laser instrument 1 sends is through the guiding of light path 2 by spreading out
After penetrating optical glass 5 and focus lamp 6, in each self-forming focused spot 8 in 7 upper and lower surface of workpiece；7 relative laser light beam 4 of workpiece enters
Row horizontal motion M, horizontal range D between adjacent focus point are determined by the speed of horizontal motion M, according to laser instrument
1 frequency, adjusts the speed of horizontal motion M, after making laser focusing hot spot have certain Duplication on the same face, works as fortune
After the completion of dynamic M, paddle-tumble 10 is formed on 7 upper and lower surface of workpiece；As the laser energy only at the focus point 8 just be enough to destroy work
Part material, the position away from focus point 8 will not be subject to the destruction of laser；As the upper and lower surface of workpiece forms paddle-tumble 10, only
Extraneous slightly stress (for example vibrating) is wanted, workpiece material will split along upper and lower surface paddle-tumble 10, that is, complete laser double-surface and draw
Piece.Conventional laser scribing only forms paddle-tumble in workpiece surface, and thickness of workpiece is slightly larger, and follow-up sliver difficulty can also increase.
And the laser double-surface score device of the present invention can all form paddle-tumble on the upper and lower surface of workpiece, facilitate sliver, improve production efficiency and
Yield rate.
In the laser double-surface score device of the present invention, laser beam 4 by after diffraction optical lens 5 and focus lamp 6 in work
7 upper and lower surface of part forms paddle-tumble 10 respectively so that sliver is in hgher efficiency, it is ensured that score quality.
As shown in figure 4, the focus point 8 of the present invention can be oval focus point 8, oval focus point 8 acts on workpiece 7
When upper, the hot spot major axis of oval focus point 8 is formed on thickness of workpiece direction, stress direction Y also on thickness of workpiece direction,
Thus workpiece is caused to be easier sliver.Improve the sliver effect of product.
In the laser double-surface score device of the present invention, the selection of laser instrument 1 is relevant with the material of workpiece 7, it is desirable to selected sharp
The wavelength of light device 1 is transmissive to workpiece 7, and laser beam 4 can be made through workpiece 7, focusing is also formed in the lower surface of workpiece 7
Point., in 200nm to 2000nm, pulse duration range is in 80fs to 30ns for the wave-length coverage of laser instrument 1.
In the laser double-surface score device of the present invention, the position of focus point 8 and energy correspond to different diffraction optics mirrors
Piece 5 and focus lamp 6.Different diffraction optical lens 5 and focus lamp 6 can be selected, two Jiao are made according to the thickness of practical work piece
Point is located at 7 upper and lower surface of workpiece.
As shown in figure 5, when workpiece 7 is thicker, such as the workpiece of SiC substrate, when thickness of workpiece H is more than 350um, being
It is more prone to sliver, improves score quality and efficiency, can with matching design diffraction optical lens and focus lamp, except in work
The upper and lower surface of part forms focus point and carries out beyond score, still forms one in the centre position in the thickness of workpiece direction of workpiece 7
Focus point 8.Focus point 8 in the embodiment can also be in the form of oval focus point.
As another embodiment of the present invention, as shown in fig. 6, the workpiece 7 of the present invention can also be on the surface of workpiece 7
There is the situation of coating 11, when cutting splitting being carried out to workpiece 7, chipping phenomenon easily occurs in overlay coating 11, for such feelings
Shape, on the coating 11 of the upper surface that the focal beam spot 8 of workpiece surface can be formed in workpiece 7, and after acting on coating 11
Form coating paddle-tumble 12, it is to avoid chipping phenomenon occurs in coating surface.
In the laser double-surface score device of the present invention, the energy of laser instrument 1 is had required, it is desirable to swashing at focus point 8
Optical energy density can destroy 7 material of workpiece just, then be not enough to destroy 7 material of workpiece away from the laser energy at focus point 8,
Consider the energy distribution of upper and lower surface laser focus point, the laser beam of workpiece lower surface is acted on when through workpiece,
Workpiece heat absorption is avoided, and destroys material property, while will be enough to neat smooth cut be formed on surface, improve follow-up splitting
Tablet quality and efficiency, those skilled in the art can determine the laser instrument 1 of appropriate energy according to the material of workpiece 7.
Used as another embodiment of the invention, as shown in Figure 7,8, the workpiece 7 of the present invention can also be multilayer material, by
Interaction between different material layer and different optical maser wavelengths is different, and therefore the laser score equipment of single wavelength has been difficult to
Into for this problem, the present invention provides multiwavelength laser score device as shown in Figure 8.Three kinds of laser instrument 1a in Fig. 8,
1b and 1c, sends the laser of different wave length respectively, is simultaneously suitable for the score of 7 different material layer of workpiece.There is coating in workpiece 7
In the case of 11, the laser that three kinds of laser instrument 1a, 1b and 1c send is drawn through light combination mirror s3, s2 and reflecting mirror s1 conversions respectively
It is directed on workpiece 7, the coating 11 of score workpiece 7, workpiece ground floor 13 and the workpiece second layer 14.
Embodiment of above is only technical scheme to illustrate the invention and illustrating for doing, and is not used to limit this
Bright concrete protection domain, the diffraction optical lens in the above embodiment of the present invention can also be microarray lens, or also may be used
Being self adaptation eyeglass, or other structures for realizing phase same-action known in the art.
It is emphasized that this laser double-surface score device does not do any pro forma restriction, every according to this
The simple modification that bright technical spirit is carried out, equivalent variations and modification, still fall within the range of technical solution of the present invention.
Claims (10)
1. a kind of laser double-surface score device, including
One laser instrument, for sending laser beam；
One precision laser cutting head, the Laser beam propagation that described laser instrument sends is in precision laser cutting head；
One diffraction optical lens and a focus lamp, in the precision laser cutting head, described laser beam passes through institute
After stating diffraction optical lens and focus lamp, focus point is formed respectively on the upper and lower surface of workpiece.
2. laser double-surface score device as claimed in claim 1, it is characterised in that：Described laser beam passes through the diffraction
After optical glass and focus lamp, on the workpiece, lower surface simultaneously form cut.
3. laser double-surface score device as claimed in claim 1, it is characterised in that：The selection of the laser instrument and the material of workpiece
Material is relevant, it is desirable to which the laser beam can pass through the workpiece, form focus point in the workpiece lower surface.
4. laser double-surface score device as claimed in claim 1, it is characterised in that：According to the frequency of the laser instrument, adjustment
The speed of the workpiece level direction motion, has certain Duplication to make adjacent spots on the same face.
5. laser double-surface score device as claimed in claim 1, it is characterised in that：Also include a CCD camera, with the laser
Accurate cutting is coaxially connected, carries out automatic identification positioning to cutting position.
6. laser double-surface score device as claimed in claim 1, it is characterised in that：Described diffraction optical lens can be micro-
Array lenses or self adaptation eyeglass.
7. laser double-surface score device as claimed in claim 1, it is characterised in that：The hot spot of described focus point is ellipse
Shape, the major axis of oval hot spot is on the thickness of workpiece direction.
8. laser double-surface score device as claimed in claim 1, it is characterised in that：On the thickness of workpiece direction of the workpiece
Centre position, also formed a focus point.
9. laser double-surface score device as claimed in claim 1, it is characterised in that：Described workpiece is multiple structure, described
Laser instrument can send multiwavelength laser, multilamellar score is carried out to the workpiece.
10. laser double-surface score device as claimed in claim 9, it is characterised in that：Described multiple structure includes coating.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201611173667.7A CN106493474B (en) | 2016-12-19 | 2016-12-19 | A kind of laser double-surface score device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201611173667.7A CN106493474B (en) | 2016-12-19 | 2016-12-19 | A kind of laser double-surface score device |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN106493474A true CN106493474A (en) | 2017-03-15 |
| CN106493474B CN106493474B (en) | 2019-06-18 |
Family
ID=58333202
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201611173667.7A Active CN106493474B (en) | 2016-12-19 | 2016-12-19 | A kind of laser double-surface score device |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN106493474B (en) |
Cited By (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109175729A (en) * | 2018-09-30 | 2019-01-11 | 大族激光科技产业集团股份有限公司 | A kind of laser cutting system and method for epoxy resin case chip |
| CN109702326A (en) * | 2019-01-16 | 2019-05-03 | 江苏大学 | A device and method for increasing the depth of laser drilling |
| CN109848573A (en) * | 2017-11-30 | 2019-06-07 | 北京中科镭特电子有限公司 | A kind of laser cutting device |
| CN109909627A (en) * | 2019-03-20 | 2019-06-21 | 大族激光科技产业集团股份有限公司 | A kind of laser process equipment of SiC boule |
| CN112775539A (en) * | 2019-11-07 | 2021-05-11 | 大族激光科技产业集团股份有限公司 | Laser processing method and apparatus |
| CN113634878A (en) * | 2021-08-17 | 2021-11-12 | 南京魔迪多维数码科技有限公司 | Optical system and method for laser cutting multilayer materials |
| CN114346464A (en) * | 2021-12-29 | 2022-04-15 | 深圳泰德激光技术股份有限公司 | Laser cutting method of battery pole piece |
| CN115890024A (en) * | 2022-11-10 | 2023-04-04 | 大连理工大学 | A Method of Ultrafast Laser Machining Rectangular Inclined Hole |
Citations (13)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5537245A (en) * | 1987-07-28 | 1996-07-16 | Thomson-C.S.F. | Infra-red diffractive optics applicable to a laser target designation system |
| JP2000005892A (en) * | 1998-06-25 | 2000-01-11 | Advanced Materials Processing Inst Kinki Japan | Laser processing method |
| CN1575909A (en) * | 2003-07-11 | 2005-02-09 | 株式会社迪斯科 | Machining apparatus utilizing laser beam |
| CN1803372A (en) * | 2005-01-12 | 2006-07-19 | 液体空气乔治洛德方法利用和研究的具有监督和管理委员会的有限公司 | Laser cutting of thin metal parts with a dual-focus lens |
| CN1826206A (en) * | 2003-05-30 | 2006-08-30 | Xsil技术有限公司 | Focusing an optical beam to two foci |
| CN1967783A (en) * | 2005-11-16 | 2007-05-23 | 株式会社电装 | Laser processing apparatus and laser processing method |
| CN102528289A (en) * | 2010-11-04 | 2012-07-04 | 株式会社迪思科 | Laser processing apparatus |
| CN103111755A (en) * | 2013-02-01 | 2013-05-22 | 武汉帝尔激光科技有限公司 | Bifocus laser processing system |
| CN203076786U (en) * | 2013-02-01 | 2013-07-24 | 武汉帝尔激光科技有限公司 | Multiple-focus laser processing system |
| CN103692089A (en) * | 2013-12-05 | 2014-04-02 | 苏州德龙激光股份有限公司 | Laser cutting device and laser cutting method |
| CN103722290A (en) * | 2014-01-15 | 2014-04-16 | 无锡创科源激光装备股份有限公司 | Focusing device and laser cutting device with the same |
| CN104339084A (en) * | 2013-07-29 | 2015-02-11 | Ap系统股份有限公司 | Device for processing brittle substrate using aspherical lens having multi focuses |
| CN205684910U (en) * | 2016-04-28 | 2016-11-16 | 北京万恒镭特机电设备有限公司 | A kind of internal multilamellar laser score device |
-
2016
- 2016-12-19 CN CN201611173667.7A patent/CN106493474B/en active Active
Patent Citations (13)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5537245A (en) * | 1987-07-28 | 1996-07-16 | Thomson-C.S.F. | Infra-red diffractive optics applicable to a laser target designation system |
| JP2000005892A (en) * | 1998-06-25 | 2000-01-11 | Advanced Materials Processing Inst Kinki Japan | Laser processing method |
| CN1826206A (en) * | 2003-05-30 | 2006-08-30 | Xsil技术有限公司 | Focusing an optical beam to two foci |
| CN1575909A (en) * | 2003-07-11 | 2005-02-09 | 株式会社迪斯科 | Machining apparatus utilizing laser beam |
| CN1803372A (en) * | 2005-01-12 | 2006-07-19 | 液体空气乔治洛德方法利用和研究的具有监督和管理委员会的有限公司 | Laser cutting of thin metal parts with a dual-focus lens |
| CN1967783A (en) * | 2005-11-16 | 2007-05-23 | 株式会社电装 | Laser processing apparatus and laser processing method |
| CN102528289A (en) * | 2010-11-04 | 2012-07-04 | 株式会社迪思科 | Laser processing apparatus |
| CN103111755A (en) * | 2013-02-01 | 2013-05-22 | 武汉帝尔激光科技有限公司 | Bifocus laser processing system |
| CN203076786U (en) * | 2013-02-01 | 2013-07-24 | 武汉帝尔激光科技有限公司 | Multiple-focus laser processing system |
| CN104339084A (en) * | 2013-07-29 | 2015-02-11 | Ap系统股份有限公司 | Device for processing brittle substrate using aspherical lens having multi focuses |
| CN103692089A (en) * | 2013-12-05 | 2014-04-02 | 苏州德龙激光股份有限公司 | Laser cutting device and laser cutting method |
| CN103722290A (en) * | 2014-01-15 | 2014-04-16 | 无锡创科源激光装备股份有限公司 | Focusing device and laser cutting device with the same |
| CN205684910U (en) * | 2016-04-28 | 2016-11-16 | 北京万恒镭特机电设备有限公司 | A kind of internal multilamellar laser score device |
Cited By (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109848573A (en) * | 2017-11-30 | 2019-06-07 | 北京中科镭特电子有限公司 | A kind of laser cutting device |
| CN109175729A (en) * | 2018-09-30 | 2019-01-11 | 大族激光科技产业集团股份有限公司 | A kind of laser cutting system and method for epoxy resin case chip |
| CN109702326A (en) * | 2019-01-16 | 2019-05-03 | 江苏大学 | A device and method for increasing the depth of laser drilling |
| CN109909627A (en) * | 2019-03-20 | 2019-06-21 | 大族激光科技产业集团股份有限公司 | A kind of laser process equipment of SiC boule |
| CN112775539A (en) * | 2019-11-07 | 2021-05-11 | 大族激光科技产业集团股份有限公司 | Laser processing method and apparatus |
| CN113634878A (en) * | 2021-08-17 | 2021-11-12 | 南京魔迪多维数码科技有限公司 | Optical system and method for laser cutting multilayer materials |
| CN114346464A (en) * | 2021-12-29 | 2022-04-15 | 深圳泰德激光技术股份有限公司 | Laser cutting method of battery pole piece |
| CN115890024A (en) * | 2022-11-10 | 2023-04-04 | 大连理工大学 | A Method of Ultrafast Laser Machining Rectangular Inclined Hole |
| CN115890024B (en) * | 2022-11-10 | 2025-07-11 | 大连理工大学 | A method for ultrafast laser processing of rectangular inclined holes |
Also Published As
| Publication number | Publication date |
|---|---|
| CN106493474B (en) | 2019-06-18 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN106493474A (en) | A kind of laser double-surface score device | |
| KR100833339B1 (en) | Wafer and wafer cutting and dividing method | |
| CN205684910U (en) | A kind of internal multilamellar laser score device | |
| US9117895B2 (en) | Laser processing method | |
| CN106914697B (en) | Laser processing | |
| CN104174994B (en) | light-dividing device and method thereof | |
| CN103567630B (en) | Laminated-substrate processing method and processing apparatus | |
| KR101547806B1 (en) | Device for processing brittle substrate using aspherical lens having multi focus | |
| CN111986986B (en) | Wafer stripping method and stripping device | |
| KR20050116798A (en) | System and method for cutting using a variable astigmatic focal beam spot | |
| KR20140137437A (en) | Laser scribing with extended depth affectation into a workpiece | |
| KR20120098869A (en) | Laser machining and scribing systems and methods | |
| KR20170028426A (en) | Method and device for the laser-based working of two-dimensional, crystalline substrates, in particular semiconductor substrates | |
| CN106216856A (en) | Double focus laser system of processing and processing method thereof | |
| CN109676269A (en) | A kind of the laser pre-segmentation method and device of LED wafer | |
| CN109604838A (en) | Semiconductor laser processing unit (plant) | |
| CN102773612A (en) | Vibrating mirror type ultraviolet laser cutting wafer chip device and method thereof | |
| KR101217698B1 (en) | Laser processing method and laser processing apparatus using sequential multi-focusing | |
| CN112518141A (en) | Laser induced cutting method and device | |
| CN115229332A (en) | Laser invisible cutting method for wafer | |
| CN201881053U (en) | Light-emitting diode (LED) wafer laser internal cutting scribing device | |
| KR101271104B1 (en) | Laser scribing apparatus and method using intra-beam V-shaped micro-crack | |
| KR102046932B1 (en) | Lens optical system and laser processing apparatus | |
| CN116835886A (en) | Processing method of thick glass structural member | |
| CN109848573A (en) | A kind of laser cutting device |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C06 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| CB02 | Change of applicant information | ||
| CB02 | Change of applicant information |
Address after: 100176 Beijing Economic and Technological Development Zone, 1st Floor C, No. 14 Building, 156 Jinghai Fourth Road, Beijing Applicant after: Beijing Zhongke Radium Electronics Co., Ltd. Address before: 100176 Beijing Economic and Technological Development Zone, 1st Floor C, No. 14 Building, 156 Jinghai Fourth Road, Beijing Applicant before: BEIJING WANHENG LEITE MECHANICAL AND ELECTRICAL EQUIPMENT CO., LTD. |
|
| GR01 | Patent grant | ||
| GR01 | Patent grant |