[go: up one dir, main page]

CN106459316A - Photocurable resin composition - Google Patents

Photocurable resin composition Download PDF

Info

Publication number
CN106459316A
CN106459316A CN201580031176.6A CN201580031176A CN106459316A CN 106459316 A CN106459316 A CN 106459316A CN 201580031176 A CN201580031176 A CN 201580031176A CN 106459316 A CN106459316 A CN 106459316A
Authority
CN
China
Prior art keywords
acrylate
ester
acrylic acid
diacrylate
acrylic
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
CN201580031176.6A
Other languages
Chinese (zh)
Other versions
CN106459316B (en
Inventor
宋晙溶
申承协
崔美镜
智锡焕
崔俊浩
金龙宇
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Dongjin Semichem Co Ltd
Original Assignee
Dongjin Semichem Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Dongjin Semichem Co Ltd filed Critical Dongjin Semichem Co Ltd
Priority claimed from PCT/KR2015/005767 external-priority patent/WO2015190799A1/en
Publication of CN106459316A publication Critical patent/CN106459316A/en
Application granted granted Critical
Publication of CN106459316B publication Critical patent/CN106459316B/en
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Landscapes

  • Chemical & Material Sciences (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • Polymerisation Methods In General (AREA)
  • Addition Polymer Or Copolymer, Post-Treatments, Or Chemical Modifications (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Adhesives Or Adhesive Processes (AREA)

Abstract

The present invention relates to a photocurable resin composition, and more particularly, to a photocurable resin composition for forming a fine pattern, which can be rapidly cured by including an acrylamide monomer, has excellent coatability, adhesiveness, and acid resistance, and thus can be applied to a flexible display substrate.

Description

Photocurable resin composition
Technical field
The present invention relates to a kind of Photocurable resin composition, more specifically, it is related to by comprising acrylamide monomer, It is capable of fast setting and coating, cementability and the excellent Photocurable resin composition of acid resistance.
Background technology
Use to realize fine pattern with regard in the conventional LCD operation for manufacturing display or semiconductor process Photoetching process for, due to circuit line width (or pattern line-width) depend on exposure process used in light wavelength, therefore root According to material and facility technology, fine pattern forms and is much limited.Additionally, often when the patterning is performed, need to implement exposure, expose After light, therefore there is cost time length and operation be extremely complex in baking, development, postdevelopment bake, etching and washing procedure etc. Problem.Additionally, use exposure instrument of high price etc. to improve performance, therefore expense aspect also becomes problem.
Then, as the countermeasure solving such problem, the fine pattern formation technology on printed electronic basis, example are occurred in that As attempted the various methods using printing (Printing) technology.In such technology, using rolling step (Roll There is energy because producing cost is low and can manufacture based on flexible substrate as film (film) in technology process) The advantage being enough applied to flexible display (Flexible display), therefore suffers from very big concern and expects, thus, also actively Ground carries out forming the research of material with regard to the fine pattern being suitable to printing technology.
Utilize for equipment and the quick productivity of low price with purple in the fine pattern formation technology on printed electronic basis UV lamp based on outside line (UV, Ultra Violet) light source or UV-LED lamp, the resin combination for this should be fundamentally Based on photocuring, and form the fast curing rate it is therefore desirable to using light by series-operation.Additionally, with conventional Photoetching is different with photosensitive material, due to not using solvent, it is thus determined that during the composition of compositionss, viscosity is also important factor One of.That is, the compositionss of fine pattern can be formed in printed electronic operation as the solvent-free materials being capable of photocuring, in order to Realize fine pattern, need to maintain low viscosity of material it is desirable to excellent curing rate, bonding force and acid resistance characteristic.
Then, in order to can be used in forming fine pattern while maintaining the advantage of operation it is desirable to develop quickly solid The Photocurable resin composition of change, low viscosity and bonding force, acid resistance excellent.
Content of the invention
Technical task
In order to solve problem as described above, it is an object of the invention to provide being suitable to the fine pattern shape of printed electronic operation One-tenth Photocurable resin composition, this Photocurable resin composition is capable of quickly based on acrylamide monomer Photocuring and there is the peel property in excellent bonding force, acid resistance and basic solvent.
Solve problem method
To achieve these goals, the present invention provides a kind of Photocurable resin composition it is characterised in that comprising:a) Acrylamide monomer 1 to 50 weight %, b) acrylic copolymer resin 1 to 40 weight %, c) vinyl monomer 10 to 60 weight Amount %, cross-linkable monomer 1 to 60 weight % d) with least two ethylene system double bond and e) Photoepolymerizationinitiater initiater 0.01 To 10 weight %.
Additionally, the present invention provides a kind of fine pattern forming method it is characterised in that combining above-mentioned light-cured resin Thing prints to substrate and exposes.
Additionally, the present invention provides a kind of display, it is manufactured using above-mentioned fine pattern forming method.
Invention effect
The Photocurable resin composition of the present invention is by comprising acrylamide monomer so as to be applied to printed electronic Basic operation, it is not necessary to toast (Bake), development (Develop) operation used in conventional photoetching, exposes by using non-high price The UV curing of the low price of ray machine is so as to the expense of reducing investment outlay, and due to can utilize rolling step, therefore there are Beneficial to the advantage making flexible display.
Additionally, the Photocurable composition of the present invention is capable of by the excellent curing degree for UV photocuring soon Fast photocuring, so that the maximum advantage of printing process, and excellent coating, bonding are shown for multiple base substrate Power and acid resistance, therefore additionally it is possible to be applied to flexible display in addition to conventional LCD, OLED glass.
Specific embodiment
It is characterised by according to the Photocurable resin composition of the present invention, comprise:A) acrylamide monomer, b) acrylic acid Acrylic copolymer resin, c) vinyl monomer, cross-linkable monomer d) with least two ethylene system double bond and e) photopolymerization Initiator.
Hereinafter, each composition is illustrated.
A) acrylamide monomer
In the present invention, spendable acrylamide monomer is as acrylamide, can be selected from comprising following chemical formula 1 Acryloyl morpholine (Acrylol morpholine), DMAA (N, the N-dimethyl of chemical formula 2 Acrylamide), the acrylamide (N, N-diethyl acrylamide) of chemical formula 3 and the dimethyl of chemical formula 4 The monomer of aminoethylacrylate (N, N-dimethylamino ethylacrylate), comprise to be usually used in this area The monomer of acrylamide and/or comprise amino acrylate composition one or more of group it may be preferred to from comprising Select in the monomer of the acrylamide stating chemical formula 1 to 4.In the case of being somebody's turn to do, there is more superior rapid photocuring, excellent bonding Peel property in power, acid resistance and basic solvent.
[chemical formula 1]
[chemical formula 2]
[chemical formula 3]
[chemical formula 4]
As the example of the above-mentioned monomer comprising acrylamide usually used in this field, N, N- dimethyl can be enumerated Aminopropyl acrylamide, NIPA, N-[2-(2-methyl-4-oxopentyl), isobutoxymethyl acrylamide, t-octyl Acrylamide etc., as the example of the above-mentioned acrylate comprising amino, can enumerate N, N- diethylamino ethylacrylic acid Ester, 7- amino -3,7- dimethyl octyl acrylate etc..
In the present invention, aforesaid propylene amide monomer can be used with the amount of 1 to 50 weight % with respect to composition total weight, Preferably with 1 to 50 weight %, more preferably used with the amount of 5 to 30 weight %.It is less than 1 weight % in the usage amount of above-mentioned monomer In the case of it is impossible to obtain curing rate, bonding force and other effects, it is possible to lead to compositionss in the case of more than 50 weight % Stability problem.
B) acrylic copolymer resin
In the present invention, spendable acrylic copolymer resin can be selected from Epocryl, polyurethane Acrylate, polyester acrylate resin, organic silicon acrylic ester resin, curable amino acrylate resin, epoxy methyl-prop Alkene acid ester resin, urethane methacylate resins, polyester methacrylate resin, organosilicon methacrylate tree One or more of groups of composition such as fat, amino methacrylate resin, its usage amount with respect to composition total weight be 1 to 40 weight %, more preferably 3 to 20 weight %.It is impossible to show in the case that the usage amount of above-mentioned resin is less than 1 weight % The intrinsic physical property of resin such as bonding force that resin has, curing degree, in the case of more than 40 weight %, viscosity uprises and flows Property reduce it is possible to not play the effect as printed electronic coating material.
C) vinyl monomer
In the present invention, spendable vinyl monomer selected from acrylic acid methyl ester., ethyl acrylate, acrylic acid just can be Butyl ester, sec-butyl acrylate, tert-butyl acrylate, amyl acrylate, isoamyl acrylate, Hexyl 2-propenoate, heptylacrylate, 1-Octyl acrylate, Isooctyl acrylate monomer, 2-EHA, acrylic acid nonyl ester, decyl acrylate, acrylic acid undecyl Ester, dodecylacrylate, tetrahydrofurfuryl acrylate, erythritol acrylate, acrylate, butoxy ethyl, ethyoxyl two EDIA, pentaerythritol acrylate, two erythritol acrylate, polyethylene glycol monoacrylate, poly- the third two Alcohol mono acrylic ester, methoxyl group EDIA, methoxyl group polypropylene glycol acrylate, phenoxy group -2- Methylethyl third Olefin(e) acid ester, 2- phenylphenoxy acrylate, 4- phenylphenoxy ethyl propylene acid esters, 3- (2- phenyl) -2- hydroxypropyl Acrylate, tricyclodecyl acrylate, phenoxy group ethyl propylene acid esters, isopropyl acrylate, cyclohexyl acrylate, Acrylic acid 2- methyl cyclohexyl, dipentaerythritol acrylate, acrylic acid bicyclopentyl ester, acrylic acid bicyclopentyl epoxide second Ester, isobornyl acrylate, cyclohexyl acrylate, acrylic acid 2- methyl cyclohexyl, phenyl acrylate, acrylic acid 2- hydroxyl ethyl ester, Isobutyl 2-propenoate, caprolactone, o-phenyl phenol acrylate, isodecyl acrylate, lauryl acrylate, acrylic acid Arrcostab, stearyl acrylate base ester, benzyl acrylate, acrylic acid 2- hydroxy ester, acrylic acid trimethoxy butyl ester, acrylic acid ethyl Carbitol ester, acrylate, acrylic acid 4- hydroxy butyl ester, phenoxy group polyethylene glycol acrylate, acrylic acid tetrahydrochysene furan Mutter ester, acrylic acid 2- hydroxyl ethyl ester, acrylic acid 2- hydroxypropyl acrylate, 2- acrylyl oxy-ethyl -2- hydroxypropylphthalate, 2- hydroxyl Base -3- phenoxypropylacrylate and their methyl acrylic ester;3- fluoro ethyl acrylate, 4- fluoropropyl propylene Acid esters etc. comprises acrylate and their methyl acrylic ester of halogen compounds;Triethyl group siloxy group ethyl propylene Acid esters etc. comprises acrylate and their methyl acrylic ester of siloxy group;Polystyrene, vinyl acetate system, second Thiazolinyl pyridine system etc. has one or more of groups of composition such as the olefines of aromatic functional groups.
Above-mentioned vinyl monomer is 10 to 60 weight % with respect to composition total weight, preferably with the amount of 20 to 40 weight % Use.Above-mentioned vinyl monomer usage amount be less than 10 weight % in the case of, the viscosity of compositionss low and cannot act as print Brush electronics coating fluid, it is possible to lead to contrary with the material behavior requiring fast setting degree in the case of more than 60 weight % Result.
D) there is the cross-linkable monomer of at least two ethylene system double bond
In the present invention, spendable above-mentioned cross-linkable monomer can be selected from glycol diacrylate, triethylene glycol two Acrylate, polyethyleneglycol diacrylate, 1,6 hexanediol diacrylate, 1,4 butanediol diacrylate, new penta 2 Alcohol diacrylate, 1,3 butyleneglycol diacrylate, three (2- ethoxy) isocyanuric acid ester diacrylate, erythritol two Acrylate, pentaerythritol diacrylate, two erythritol diacrylates, dipentaerythritol diacrylate, double (hydroxyl first Base) tristane diacrylate, bisphenol a diacrylate and its derivant, glycerol tri-acrylate, erythritol three propylene Acid esters, two erythritol triacrylates, pentaerythritol triacrylate, dipentaerythritol triacrylate, three (2- hydroxyl second Base) isocyanurate triacrylate, Sorbitol triacrylate, TMPTA, erythritol 4 third Olefin(e) acid ester, tetramethylol methane tetraacrylate, two erythritol tetraacrylate, dimethylpropane tetraacrylate, two seasons penta 4 Alcohol tetraacrylate, two erythritol five acrylate, Dipentaerythritol Pentaacrylate, two erythritol six acrylate, One or more of group of composition such as dipentaerythritol acrylate and their methyl acrylic ester.
Above-mentioned cross-linkable monomer is 1 to 60 weight % with respect to composition total weight, preferably uses 5 to 30 weight %.? In the case that above-mentioned usage amount is less than 1 weight %, because curing rate decline, cured density reduce and be possible to cause under enhancing Fall, it is possible to lead to high cure shrinkage and surface bonding force to decline in the case of more than 60 weight %.
E) Photoepolymerizationinitiater initiater
In the present invention, spendable Photoepolymerizationinitiater initiater can be selected from 2,2'- diethoxy acetophenone, 2,2'- bis- fourth Epoxide 1-Phenylethanone., 2- hydroxy-2-methyl propiophenone, to tert-butyl group trichloroacetophenone, to tert-butyl group dichloroacetophenone, hexichol first Ketone, 4- chloro-acetophenone, 4,4'- dimethylamino benzophenone, 4,4'- dichloro benzophenone, 3,3'- dimethyl -2- methoxyl group Benzophenone, the chloro- 4- metaphenoxy acetophenone of 2,2'- bis-, 2- methyl isophthalic acid-(4- (methyl thio) phenyl) -2- morpholino propane -1- The 1-Phenylethanone. based compounds such as ketone, 2- benzyl -2- dimethylamino -1- (4- morphlinophenyl)-butane -1- ketone;Benzophenone, benzene Carbamoyl benzoate, methyl benzoylbenzoate, 4- phenyl benzophenone, dihydroxy benaophenonel, acrylated benzophenone, 4, The benzophenone based compounds such as double (dimethylamino) benzophenone of 4'-, double (diethylamino) benzophenone of 4,4'-;Thioxanthene Ketone, CTX, 2- methyl thiaxanthone, isopropyl thioxanthone, 2,4- diethyl thioxanthone, 2,4- diisopropylthioxanthone, The thiaxanthone based compound such as CTX;Benzoin, benzoin methylether, benzoin ethyl ether, benzoin iso-propylether, benzoin are different The benzoin based compound such as butyl ether, benzil dimethyl ketal;2,4,6, double (three chloromethanes of-three chloro- s-triazine, 2- phenyl 4,6- Base)-s-triazine, 2- (3', 4'- dimethoxy-styryl) -4,6- double (trichloromethyl)-s-triazine, 2- (4'- methoxynaphthalene Base) double (the trichloromethyl)-s-triazine of -4,6-, 2- (p-methoxyphenyl) -4,6- double (trichloromethyl)-s-triazine, 2- be (to first Phenyl) -4,6- pair of (trichloromethyl)-s-triazine, 2- phenyl 4,6- double (trichloromethyl)-s-triazine, double (trichloromethyl) -6- benzene Vinyl s-triazine, 2- (naphthoyl 1- yl)-4,6- double (trichloromethyl)-s-triazine, 2- (4- methoxynaphthalene formyl chloride-1-yl)-4, 6- double (trichloromethyl)-s-triazine, 2-4- trichloromethyl (piperonyl) -6- triazine, 2-4- trichloromethyl (4'- methoxybenzene second Thiazolinyl) one or more of the group of composition such as the triazine based compound such as -6- triazine is it is preferable that 1-Phenylethanone. system is it is advantageously ensured that solid Change threshold value (curing margin).
Above-mentioned Photoepolymerizationinitiater initiater is 0.01 to 10 weight % with respect to composition total weight, preferably with 0.5 to 6 weight % Amount use.In the case that the usage amount of above-mentioned Photoepolymerizationinitiater initiater is less than 0.1 weight %, photocuring does not carry out or becomes Slowly it is impossible to obtain desired curing rate, in the case of more than 10 weight %, it is likely to result in because of inhibitory effect of reaction Coating characteristic declines or the permeability of material declines.
Additionally, according to the application target of material, for the patience for moisture, UV and heat, for the excellent painting of substrate Cloth and cementability etc., the compositionss of the present invention can comprise various additives, such as antioxidant further (antioxidant), UV absorbent (UV absorber), light stabilizer (Light stabilizer), hot polymerization inhibitor (Heat polymerization inhibitor), age resister (aging preventive), plasticizer (Plasticizer), live in silane coupler (Silane coupling agent), levelling agent (Leveling agent), surface Property agent (Surfactant) etc..
Additionally, the present invention provides a kind of fine pattern forming method it is characterised in that combining above-mentioned light-cured resin Thing prints to substrate post-exposure.
In the present invention, above-mentioned printing can apply multiple printing process usually used in this field, such as intaglio plate hectograph (Gravure off-set) printing, intaglio plate directly (Gravure direct) printing, web plate (Screen) printing, impressing etc., can The substrate using can use common any substrate, and for example, glass substrate or plastic base all can use.
As the light source for exposure, it is possible to use ultraviolet, luminous ray, infrared ray, X-ray, electron beam etc., can To preferably use the ultraviolet in 190 to 450nm region.Additionally, afterwards, in order to improve the purposes of film and characteristic it is also possible to implement High-temperature heat treatment operation.
The Photocurable composition comprising acrylamide monomer of the present invention can be applied to printed electronic basis operation and Do not need used in conventional photoetching, to toast (Bake), development (Develop) operation, and use the low price of non-high price exposure machine UV curing and expense of can reducing investment outlay, and due to rolling step can be utilized, therefore there are flexible aobvious beneficial to making The advantage showing device.
Additionally, the Photocurable composition of the present invention is capable of by the excellent curing degree for UV photocuring soon Fast photocuring, so that the maximum advantage of printing process, and in addition to conventional LCD, OLED glass, for can answer PET (polyethylene terephthalate) film for flexible display, PC (Merlon) film, PI (polyimides) film, steaming Plating Cu (copper) on metal foil, ITO (tin indium oxide), multiple base substrate such as Al (aluminum), Mo (molybdenum) show excellent painting Cloth, bonding force and acid resistance.
Hereinafter, in order to help understand the present invention, open preferred embodiment, but following embodiment simply illustrates the present invention, The scope of the present invention is not limited by following embodiments.
Embodiment 1 to 3 and comparative example 1
According to the composition of table 1 below, mix each composition, equably mix more than 6 hours in room temperature, manufacture resin combination (unit:Weight portion).
Now, each composition of use is as follows.
Acrylamide monomer:Acryloyl morpholine (ACMO, the Acryloyl morpholine, Japanese Kyojin of chemical formula 1 Company's product), DMAA (DMAA, N, N-Dimethyl acrylamide, the Japanese Kyojin company of chemical formula 2 Product);
Acrylic copolymer resin:(polyester acrylate (PS420, tetrafunctional polyester acrylate (Tetrafuntional Polyester acrylate), Miwon Specialty Chemical company of Korea S);
Vinyl monomer:(glycidyl methacrylate (GMA, Glycidyl metaacrylate, Sigma's Order Ritchie);
Cross-linkable monomer:Pentaerythritol triacrylate (PETA, Pentaerythritol triacrylate, Korea S Miwon Specialty Chemical company), BDO diacrylate (HDDA, Isosorbide-5-Nitrae-butandiol Diacrylate, Miwon Specialty Chemical company of Korea S);And
Photoepolymerizationinitiater initiater:Darocur TPO (diphenyl (2,4,6- trimethylbenzoyl) phosphine oxide, Diphenyl (2,4,6-trimethylbenzoyl)-phosphine oxide, Ciba Specialty Chemicals).
[table 1]
Test example 1
The following physical property measuring the Photocurable resin composition manufacturing in above-described embodiment 1 to 3 and comparative example 1, by it Result is shown in table 2.
1) curing rate
With 0.5 to 5 μm of thickness coating composition on the substrate being washed using detergent, engage with polymeric mold, Using the lamp with 365nm wavelength, implement, after solidification, to separate polymeric mold and implement to combine with being coated with different light quantities The demoulding of the substrate of thing.Now, the apparent condition of the compositionss being solidified by confirmation, evaluates the state of cure of compositionss.With table Surface state be completely dried after the viscosity degree of material on the basis of, according to following benchmark evaluation states of cure.
A:Surface does not have viscosity completely
B:Surface somewhat carries viscosity
C:Surface band viscosity
D:Uncured (liquid)
2) bonding force
With 0.5 to 5 μm of thickness coating composition on the substrate being washed using detergent, engage with polymeric mold, Implement, after solidification, to separate polymeric mold and implement de- with the substrate being coated with compositionss using the lamp with 365nm wavelength Mould.The compositionss of solidification are cut into 100 cells by cross-cut (Cross cut) method, carry out as benchmark Bonding force is evaluated.The substrate using utilizes evaporation on LCD naked glass (bare glass), PI (polyimides) film to have the base of Cu Plate, evaporation have the substrate of ITO, evaporation to have the substrate of Mo, are evaluated according to following benchmark, bonding evaluation adhesive tape utilizes 3M 610 adhesive tapes.
A:On substrate, the cell of remaining is more than 90%
B:On substrate, the cell of remaining is more than 75%
C:On substrate, the cell of remaining is more than 60%
D:On substrate, the cell of remaining is less than 45%
3) acid resistance
Have with 0.5 to 5 μm of thickness coating composition on PI (polyimides) film of ITO in evaporation, with polymeric mold Engage, implement, after solidification, to separate polymeric mold and implement and the substrate being coated with compositionss using the lamp with 365nm wavelength The demoulding.For the substrate after the demoulding, implement etching (Etching) operation using etchant (Etchant).Etching work procedure it Afterwards, acid resistance degree of evaluating on the basis of (Damage) degree is damaged by following ITO.
A:ITO damages less than 1 μm (etching skew (Etch skew))
B:ITO damages more than 1 μm (etching skew)
C:The compositionss of solidification tilt
D:ITO all damages
[table 2]
Confirm as shown in Table 2 above, not only curing rate is fast, acidproof for the Photocurable resin composition according to the present invention Property is excellent, and the bonding force for the multiple substrates that can also be applied to flexible display in addition to glass substrate is also excellent Different.
INDUSTRIAL APPLICABILITY
The Photocurable composition of the present invention, by comprising acrylamide monomer, can be applied to printed electronic basis operation Without baking (Bake), development (Develop) operation, and the low price using non-high price exposure machine used in conventional photoetching UV curing and expense of can reducing investment outlay, and due to rolling step can be utilized, therefore there are flexible beneficial to making The advantage of display.

Claims (11)

1. a kind of Photocurable resin composition is it is characterised in that comprise:
A) acrylamide monomer,
B) acrylic copolymer resin,
C) vinyl monomer,
D) have at least two ethylene system double bond cross-linkable monomer and
E) Photoepolymerizationinitiater initiater.
2. Photocurable resin composition according to claim 1 is it is characterised in that comprise:
A) acrylamide monomer 1 to 50 weight %,
B) acrylic copolymer resin 1 to 40 weight %,
C) vinyl monomer 10 to 60 weight %,
D) have at least two ethylene system double bond cross-linkable monomer 1 to 50 weight % and
E) Photoepolymerizationinitiater initiater 0.01 to 10 weight %.
3. Photocurable resin composition according to claim 1 it is characterised in that described acrylamide be selected under State one or more of group of compound composition of chemical formula 1 to 4,
[chemical formula 1]
[chemical formula 2]
[chemical formula 3]
[chemical formula 4]
4. Photocurable resin composition according to claim 1 is it is characterised in that described acrylic copolymer resin It is selected from Epocryl, polyurethane acrylate resin, polyester acrylate resin, organic silicon acrylic ester tree Fat, curable amino acrylate resin, epoxy methacrylates resin, urethane methacylate resins, polyester metering system One or more of group of acid ester resin, organosilicon methacrylate resin and amino methacrylate resin composition.
5. Photocurable resin composition according to claim 1 it is characterised in that described vinyl monomer be selected from Acrylic acid methyl ester., ethyl acrylate, n-butyl acrylate, sec-butyl acrylate, tert-butyl acrylate, amyl acrylate, propylene Isoamyl valerate, Hexyl 2-propenoate, heptylacrylate, 1-Octyl acrylate, Isooctyl acrylate monomer, 2-EHA, propylene Sour nonyl ester, decyl acrylate, acrylic acid hendecane base ester, dodecylacrylate, tetrahydrofurfuryl acrylate, erythritol third Olefin(e) acid ester, acrylate, butoxy ethyl, ethoxydiglycol acrylate, pentaerythritol acrylate, two erythritols third Olefin(e) acid ester, polyethylene glycol monoacrylate, polypropylene glycol mono acrylic ester, methoxyl group EDIA, methoxyl group poly- third Butanediol acrylate, phenoxy group -2- methylethyl acrylate, 2- phenylphenoxy acrylate, 4- phenylphenoxy ethyl Acrylate, 3- (2- phenyl) -2- hydroxypropyl acrylate, tricyclodecyl acrylate, phenoxy group ethyl third Olefin(e) acid ester, isopropyl acrylate, cyclohexyl acrylate, acrylic acid 2- methyl cyclohexyl, dipentaerythritol acrylate, acrylic acid Bicyclopentyl ester, acrylic acid bicyclopentyl epoxide ethyl ester, isobornyl acrylate, cyclohexyl acrylate, acrylic acid 2- methyl ring Own ester, phenyl acrylate, acrylic acid 2- hydroxyl ethyl ester, Isobutyl 2-propenoate, caprolactone, o-phenyl phenol acrylate, Isodecyl acrylate, lauryl acrylate, alkyl acrylate, stearyl acrylate base ester, benzyl acrylate, acrylic acid 2- hydroxyl Ester, acrylic acid trimethoxy butyl ester, acrylic acid ethyl carbitol ester, acrylate, acrylic acid 4- hydroxy butyl ester, benzene oxygen Base polyethylene glycol acrylate, acrylic acid tetrahydrofuran ester, acrylic acid 2- hydroxyl ethyl ester, acrylic acid 2- hydroxypropyl acrylate, 2- acryloyl-oxy Ethyl -2- hydroxypropylphthalate, 2- hydroxyl -3- phenoxypropylacrylate and their methacrylate Class;Comprise acrylate and their methyl acrylic ester of halogen compounds;Comprise the acrylate of siloxy group with And their methyl acrylic ester;And there is one or more of group of olefines composition of aromatic functional groups.
6. Photocurable resin composition according to claim 1 is it is characterised in that described have at least two second The cross-linkable monomer of alkene system double bond is selected from glycol diacrylate, triethylene glycol diacrylate, Polyethylene Glycol dipropyl Olefin(e) acid ester, 1,6 hexanediol diacrylate, 1,4 butanediol diacrylate, neopentylglycol diacrylate, 1,3- fourth two Alcohol diacrylate, three (2- ethoxy) isocyanuric acid ester diacrylate, erythritol diacrylate, tetramethylolmethane dipropyl Olefin(e) acid ester, two erythritol diacrylates, dipentaerythritol diacrylate, double (methylol) tristane diacrylate Ester, bisphenol a diacrylate and its derivant, glycerol tri-acrylate, erythritol triacrylate, two erythritols 3 third Olefin(e) acid ester, pentaerythritol triacrylate, dipentaerythritol triacrylate, three (2- ethoxy) isocyanuric acid ester three acrylic acid Ester, Sorbitol triacrylate, TMPTA, erythritol tetraacrylate, tetramethylolmethane tetrapropylene Acid esters, two erythritol tetraacrylate, dimethylpropane tetraacrylate, dipentaerythritol tetraacrylate, two erythroses Alcohol five acrylate, Dipentaerythritol Pentaacrylate, two erythritol six acrylate, dipentaerythritol acrylate with One or more of and their group of methyl acrylic ester composition.
7. Photocurable resin composition according to claim 1 it is characterised in that described Photoepolymerizationinitiater initiater be selected from By 1-Phenylethanone. based compound, benzophenone based compound, thiaxanthone based compound, benzoin based compound and triazine based compound One or more of group of composition.
8. Photocurable resin composition according to claim 1 is it is characterised in that comprise further selected from antioxidation Agent, UV absorbent, light stabilizer, hot polymerization inhibitor, age resister, plasticizer, silane coupler, levelling agent and surface activity One or more of the group of agent composition additive.
9. a kind of fine pattern forming method is it is characterised in that by the photo-curable tree any one of claim 1 to 8 Oil/fat composition prints to substrate and exposes.
10. a kind of display, it is manufactured using the fine pattern forming method described in claim 9.
11. display according to claim 10 are it is characterised in that described display is flexible display.
CN201580031176.6A 2014-06-11 2015-06-09 Photocurable resin composition Active CN106459316B (en)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
KR20140070666 2014-06-11
KR10-2014-0070666 2014-06-11
PCT/KR2015/005767 WO2015190799A1 (en) 2014-06-11 2015-06-09 Photo-curable resin composition

Publications (2)

Publication Number Publication Date
CN106459316A true CN106459316A (en) 2017-02-22
CN106459316B CN106459316B (en) 2020-03-17

Family

ID=55081859

Family Applications (1)

Application Number Title Priority Date Filing Date
CN201580031176.6A Active CN106459316B (en) 2014-06-11 2015-06-09 Photocurable resin composition

Country Status (2)

Country Link
KR (1) KR102381307B1 (en)
CN (1) CN106459316B (en)

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2020073149A1 (en) * 2018-10-08 2020-04-16 Henkel Ag & Co. Kgaa Light curable composition
CN113993913A (en) * 2019-06-04 2022-01-28 株式会社东进世美肯 Photopolymerizable composition, and cured film and display device using same
US11667742B2 (en) 2019-05-03 2023-06-06 Johnson & Johnson Surgical Vision, Inc. Compositions with high refractive index and Abbe number
US11708440B2 (en) 2019-05-03 2023-07-25 Johnson & Johnson Surgical Vision, Inc. High refractive index, high Abbe compositions

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR102024977B1 (en) * 2016-03-31 2019-09-24 주식회사 엘지화학 Solventless photosensitive resin composition, cured film manufactured by the same, conducting film comprising the cured film and method for manufacturing the conducting film
KR102018061B1 (en) 2017-11-28 2019-09-04 주식회사 영우 Pressure sensitive adhesive tape comprising an ultraviolet curable adhesive composition having a low hardening shrinkage
US11795252B2 (en) 2020-10-29 2023-10-24 Johnson & Johnson Surgical Vision, Inc. Compositions with high refractive index and Abbe number
KR102627351B1 (en) * 2021-08-04 2024-01-18 박성원 Coating composition for automotive surface protection
KR102379084B1 (en) 2021-09-30 2022-03-24 윤미라 (Ultraviolet curable resin composition and manufacturing method of UV curable laminate sheet comprising same

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2010155889A (en) * 2008-12-26 2010-07-15 Jsr Corp Photocurable liquid resin composition and method for producing support by inkjet stereolithography
CN102276485A (en) * 2011-06-20 2011-12-14 安徽巨成精细化工有限公司 Method for producing dimethylaminoethylacrylate
CN102959679A (en) * 2010-07-02 2013-03-06 株式会社德山 Composition for photocurable imprint, and method for formation of pattern using the composition
JP2013245229A (en) * 2012-05-23 2013-12-09 Asahi Glass Co Ltd Photocurable composition for ink print, and method for manufacturing molding including fine pattern on surface
CN103513512A (en) * 2012-06-19 2014-01-15 奇美实业股份有限公司 Photosensitive resin composition and application thereof

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5608245A (en) * 1995-12-21 1997-03-04 Xerox Corporation Array on substrate with repair line crossing lines in the array
KR101652711B1 (en) * 2009-01-30 2016-08-31 주식회사 동진쎄미켐 Ink composition for forming organic insulator in roll printing method
KR101917156B1 (en) * 2010-12-20 2018-11-09 주식회사 동진쎄미켐 Photocurable resin composition for printing process

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2010155889A (en) * 2008-12-26 2010-07-15 Jsr Corp Photocurable liquid resin composition and method for producing support by inkjet stereolithography
CN102959679A (en) * 2010-07-02 2013-03-06 株式会社德山 Composition for photocurable imprint, and method for formation of pattern using the composition
CN102276485A (en) * 2011-06-20 2011-12-14 安徽巨成精细化工有限公司 Method for producing dimethylaminoethylacrylate
JP2013245229A (en) * 2012-05-23 2013-12-09 Asahi Glass Co Ltd Photocurable composition for ink print, and method for manufacturing molding including fine pattern on surface
CN103513512A (en) * 2012-06-19 2014-01-15 奇美实业股份有限公司 Photosensitive resin composition and application thereof

Cited By (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2020073149A1 (en) * 2018-10-08 2020-04-16 Henkel Ag & Co. Kgaa Light curable composition
CN112823171A (en) * 2018-10-08 2021-05-18 汉高股份有限及两合公司 Photocurable composition
EP3864058A4 (en) * 2018-10-08 2022-07-20 Henkel AG & Co. KGaA Light curable composition
US11597788B2 (en) 2018-10-08 2023-03-07 Henkel Ag & Co. Kgaa Light curable composition
CN112823171B (en) * 2018-10-08 2023-06-30 汉高股份有限及两合公司 Photocurable composition
US11667742B2 (en) 2019-05-03 2023-06-06 Johnson & Johnson Surgical Vision, Inc. Compositions with high refractive index and Abbe number
US11708440B2 (en) 2019-05-03 2023-07-25 Johnson & Johnson Surgical Vision, Inc. High refractive index, high Abbe compositions
US11958923B2 (en) 2019-05-03 2024-04-16 Johnson & Johnson Surgical Vision, Inc. Compositions with high refractive index and abbe number
US12071497B2 (en) 2019-05-03 2024-08-27 Johnson & Johnson Surgical Vision, Inc. High refractive index, high Abbe compositions
CN113993913A (en) * 2019-06-04 2022-01-28 株式会社东进世美肯 Photopolymerizable composition, and cured film and display device using same
CN113993913B (en) * 2019-06-04 2024-04-12 株式会社东进世美肯 Photopolymerizable composition and cured film using same

Also Published As

Publication number Publication date
CN106459316B (en) 2020-03-17
KR20150142617A (en) 2015-12-22
KR102381307B1 (en) 2022-03-31

Similar Documents

Publication Publication Date Title
CN106459316A (en) Photocurable resin composition
JP6209365B2 (en) Photocurable resin composition, solder resist and printed wiring board
KR102139035B1 (en) Photosensitive resin element
CN111596526A (en) Photosensitive resin composition and photosensitive resin laminate
TWI688610B (en) Curable resin composition, dry film, cured product and printed circuit board
CN106905759B (en) Photocuring printing ink resistant to gold-plating liquid medicine and application thereof
US8007983B2 (en) Photosensitive resin composition, photosensitive element using same, method for forming resist pattern, and method for producing printed wiring board
CN107924128B (en) Photosensitive resin composition
WO2015137504A1 (en) Photocurable composition for 3d modeling and method for producing 3d model
JP5731961B2 (en) Etching method
KR20170079445A (en) Photosensitive Resin Composition and Dry Film Photoresist Comprising the same
KR101133558B1 (en) Dry film photoresist
KR102609268B1 (en) Photoresist film and application thereof
JP2023509861A (en) Photosensitive resin layer, dry film photoresist using the same, and photosensitive element
JP6425259B1 (en) Photosensitive resin composition, etching method and plating method
JP2023103988A (en) Photosensitive resin composition, photosensitive resin laminate, and method for forming resist pattern
KR20070036816A (en) Photosensitive resin composition
TWI526780B (en) Photosensitive resin composition for dry film photoresist
CN114114842A (en) Dry film resist laminate, resin composition and preparation method thereof
JP4479450B2 (en) Photosensitive film and method for producing printed wiring board using the same
KR20080003948A (en) 4-layer dry film photoresist
JP2016197226A (en) Photosensitive resin composition and etching method
JP7620043B2 (en) Photosensitive resin composition and photosensitive element
WO2015190799A1 (en) Photo-curable resin composition
KR20100116844A (en) Negative photosensitive resin composition

Legal Events

Date Code Title Description
C06 Publication
PB01 Publication
SE01 Entry into force of request for substantive examination
SE01 Entry into force of request for substantive examination
GR01 Patent grant
GR01 Patent grant